Ceramic rock plate bottom surface grinding, chamfering and polishing equipment and edge grinding and polishing method

Through the cooperation of the limiting mechanism and the sliding lifting assembly, the problems of incomplete grinding and friction damage of the ceramic rock slab polishing equipment during transportation are solved, and efficient and precise grinding of the chamfers on the bottom surface of the ceramic rock slab is achieved, thereby improving product quality and yield.

CN119369267BActive Publication Date: 2025-09-26ZHAOQING LINGHANG CERAMIC CO LTD
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Patent Information

Application Number
CN202411840710.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-12-13
Publication Date
2025-09-26
Estimated Expiration
2044-12-13

AI Technical Summary

Technical Problem

Existing ceramic rock slab polishing equipment cannot achieve precise polishing during the conveying process, resulting in incomplete chamfering and wear caused by friction between the bright surface and the conveyor belt, affecting the yield rate.

Method used

A limiting mechanism and a sliding lifting assembly are used to ensure that the ceramic rock slab is stably centered during transportation. The polishing machine is used to accurately polish the edges and corners of the ceramic rock slab under the guidance of the limiting frame to avoid friction damage.

Benefits of technology

It achieves comprehensive and precise grinding of the bottom chamfer of the ceramic rock slab, improves product quality and appearance, reduces scratch damage caused by friction, and improves polishing efficiency and yield rate.

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Abstract

The present invention relates to the technical field of ceramic rock slab processing, and specifically to a ceramic rock slab bottom surface grinding, chamfering and polishing device and its grinding and polishing method, including a belt conveyor and a polishing machine, the belt conveyor having a frame and a conveyor belt, and also including a limiting mechanism, the limiting mechanism including limiting frames symmetrically arranged on both sides of the frame and a driving assembly, the area between the two limiting frames being a first limiting area and a second limiting area along the conveying direction of the conveyor belt, the polishing machine being located in the second limiting area, and a sliding lifting assembly for lifting the ceramic rock slab upward being provided in the first limiting area. After the ceramic rock slab is limited in position by two limiting frames in the present invention, the polishing machine is adjusted to the position where the edge of the ceramic rock slab passes under the guidance of the limiting frames, and can accurately and comprehensively grind the bottom chamfer of the ceramic rock slab, ensuring that the grinding effect is optimal.
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Description

Technical Field

[0001] The present invention relates to the technical field of ceramic rock slab processing, and in particular to a ceramic rock slab bottom surface edge grinding, chamfering and polishing device and an edge grinding and polishing method thereof. Background Art

[0002] Ceramic rock slabs are extruded and formed, and chamfers are created on the four corners of the bottom surface after forming. Unchamfered corners typically have a significant initial roughness. While polishing can improve surface smoothness, its effectiveness is limited. If the initial roughness is too great, polishing may not completely remove these irregularities. Unchamfered corners will still appear rough after polishing, affecting the quality and appearance of the final product. Vibrations may occur during polishing of ceramic rock slabs during transportation. These vibrations may originate from factors such as the movement of the conveying system and the high-speed rotation of the polishing wheel. Vibrations not only affect the quality of polishing but may also result in incomplete chamfering of the bottom surface of the ceramic rock slab.

[0003] The currently disclosed Chinese patent CN116690401B is a polishing device for ceramic equipment, comprising a fixed plate, a movable plate, a vertical plate, a rotating shaft, a movable barrel and a conveyor belt arranged at the top of the fixed plate for conveying ceramic tiles, the vertical plate being vertically arranged at the top of the fixed plate and located on one side of the conveyor belt, the movable plate being located above the conveyor belt and vertically slidingly connected to one side of the vertical plate through a movable member, the rotating shaft being rotatably connected to the bottom end of the movable plate, the barrel mouth of the movable barrel facing downward and being located below the movable plate, the top end of the movable barrel being provided with a groove for the bottom end of the rotating shaft to pass through, at this time, a compression spring is provided between the movable barrel and the movable plate, the bottom end of the rotating shaft is provided with a polishing grinding wheel located in the movable barrel, the movable plate is provided with a motor for driving the rotating shaft to rotate, and the movable barrel is provided with a clamping member for clamping the ceramic tiles.

[0004] According to the above patent, the above patent fixes the ceramic by clamping, and then uses the buffering effect of the compression spring to press the polishing wheel against the ceramic to reduce the shaking of the ceramic during the polishing process. However, this method fixes the ceramic in a specific position for polishing, and cannot accurately polish the ceramic during the transportation process, which limits the improvement of the polishing efficiency. Therefore, there is a need for a limiting frame that can adapt to the ceramic rock plate, so that the ceramic rock plate can maintain a stable grinding effect during the transportation process. The edge grinding and chamfering polishing equipment. In addition, in the process of limiting the ceramic rock plate in the existing technology, the bright surface of the ceramic rock plate and the conveyor belt generate friction, which easily causes wear on the bright surface of the ceramic rock plate, resulting in a reduction in the yield rate. Summary of the Invention

[0005] In response to the problems existing in the existing technology, a ceramic rock slab bottom surface grinding, chamfering and polishing equipment is provided. Through the precise control of the limiting mechanism, the ceramic rock slab is stably centered during the conveying process. During the limiting process, the sliding lifting assembly lifts the ceramic rock slab to prevent friction between the ceramic rock slab and the conveyor belt. After the ceramic rock slab is limited by the two limiting frames, the limiting rollers on the limiting frames are in contact with the ceramic rock slab instead of applying pressure, ensuring that the ceramic rock slab can still move with the conveyor belt, and the polishing machine is adjusted to the position where the edges and corners of the ceramic rock slab pass under the guidance of the limiting frames, and can perform comprehensive and precise grinding on the bottom chamfers of the ceramic rock slab, thereby ensuring that the grinding effect of the ceramic rock slab during the conveying process reaches the best state, effectively improving the quality and appearance of the product.

[0006] In order to solve the problems of the prior art, the present invention provides a device for grinding and chamfering the bottom surface of a ceramic rock slab, comprising a belt conveyor and polishing machines symmetrically arranged on both sides thereof, the belt conveyor having a frame and a conveyor belt, and also comprising a limiting mechanism for keeping the ceramic rock slab in a central position on the conveyor belt, the limiting mechanism comprising limiting frames symmetrically arranged on both sides of the frame and a driving assembly for driving the two limiting frames to move in a conveying direction perpendicular to the conveying belt, each limiting frame is fixed with a plurality of the polishing machines described above along the conveying direction of the conveyor belt, and when the driving assembly In the process of the components driving the two limiting frames to approach each other, the ceramic rock slab is gradually limited between the two limiting frames. At the same time, the polishing machine is accurately located at the position where the edge corners of the ceramic rock slab pass, so that the bottom chamfer of the ceramic rock slab is fully polished. A first limiting area and a second limiting area are successively provided between the two limiting frames along the conveying direction of the conveyor belt. The polishing machine is located in the second limiting area. The first limiting area is provided with a sliding lifting component for lifting the ceramic rock slab upward to prevent the ceramic rock slab from rubbing against the conveyor belt during the limiting process.

[0007] Preferably, the limiting frame is composed of a first limiting plate and a second limiting plate, and a movable side plate that is transmission-connected to the driving assembly is fixedly connected between the first limiting plate and the second limiting plate. When the ceramic rock slab is limited by the two first limiting plates, the first limiting area is formed between the two first limiting plates. At the same time, the second limiting area is formed between the two second limiting plates, so that the ceramic rock slab is immediately polished by the polishing machine the moment it enters the second limiting area.

[0008] Preferably, the first limiting plate and the second limiting plate are both provided with a plurality of limiting rollers that can contact the edge of the ceramic rock slab along the conveying direction of the conveyor belt, and the rotation direction of the limiting rollers is parallel to the conveying direction of the conveyor belt.

[0009] Preferably, a camera for observing the size of the ceramic rock slab is provided on the frame and located in the first limiting area. A signal transmitter is provided on one of the two movable side plates, and a signal receiver corresponding to the signal transmitter is provided on the other movable side plate. When the camera observes the size of the ceramic rock slab and senses the distance through the signal transmitter and the signal receiver, the two first limiting plates are in a state of limiting the ceramic rock slab instead of applying pressure, so that the ceramic rock slab can still move with the conveyor belt.

[0010] Preferably, a support for installing the polishing machine is fixed on each second limiting plate, and a slide rail for sliding connection of the support is fixed on the frame along the direction of movement of the second limiting plate, and the slide rail is provided with a positioning component for fixing the position of the polishing machine after the second limiting area is formed.

[0011] Preferably, a supporting ball is provided on each second limiting plate at a position corresponding to the polishing machine, and the second limiting plate has a ball seat for mounting the supporting ball.

[0012] Preferably, the polishing machine includes a grinding disc and a grinding driver fixedly arranged on a support, the grinding driver has a main shaft that can rotate and lift, the grinding disc has a rotating shaft coaxial with the main shaft, a shaft sleeve is fixedly provided on the main shaft, the rotating shaft is inserted in the shaft sleeve in the form of a sliding card, and a compression spring is fixed between the rotating shaft and the shaft sleeve.

[0013] Preferably, a cooling bin body fixedly connected to the support is provided on the shaft sleeve, the cooling bin body has a liquid inlet, a liquid outlet channel is provided between the cooling bin body and the shaft sleeve, and an inner ring and an outer ring for opening and closing the liquid outlet channel are also provided between the cooling bin body and the shaft sleeve. When the inner ring and the outer ring fit together, the liquid outlet channel is in a closed state, and when the outer ring gradually moves away from the inner ring, the liquid outlet channel is in a gradually open state.

[0014] Preferably, the sliding jacking assembly includes a jacking plate arranged below the conveyor belt, balls arranged in a matrix on the jacking plate, and a jacking cylinder fixedly arranged on the frame to drive the jacking plate to move up and down.

[0015] The present invention also provides a method for edge grinding and polishing the bottom surface of a ceramic rock slab, comprising the following steps:

[0016] S1, start the conveyor belt to transport ceramic rock slabs;

[0017] S2. Start the limiting mechanism to gradually center the ceramic rock plate. During this process, start the sliding lifting assembly to lift the ceramic rock plate upward to prevent friction between the ceramic rock plate and the conveyor belt;

[0018] S3. After the ceramic slab is limited, the polishing machine is at the position where the edge of the ceramic slab passes. The sliding lifting assembly is started again to lower the ceramic slab onto the conveyor belt and continue to be transported by the conveyor belt.

[0019] S4. Start the polishing machine and use the grinding disc to fully grind the bottom chamfer of the ceramic rock slab during transportation.

[0020] Compared with the prior art, the present invention has the following advantages:

[0021] 1. The present invention uses a limiting mechanism to precisely control the ceramic rock plate, ensuring that it is stably centered during transportation. At the same time, the sliding lifting assembly lifts the ceramic rock plate, effectively avoiding friction between the ceramic rock plate and the conveyor belt, thereby preventing scratches caused by friction.

[0022] After the ceramic slab is stabilized by the two limiting frames, the polishing machine is precisely adjusted to the position where the edge of the ceramic slab passes under the guidance of the limiting frames. This ensures that the polishing machine can accurately grind the bottom chamfer of the ceramic slab, avoiding incomplete chamfering caused by inaccurate positioning of the polishing machine, and thus ensuring the best grinding effect.

[0023] 2. The present invention also observes the size of the ceramic rock plate through a camera, and combines the precise distance measurement function of the signal transmitter and the signal receiver to dynamically adjust the position of the two limit frames. It ensures that the ceramic rock plate is stably centered and limited when entering the two first limit plates, and is not subject to excessive pressure. With the contact between the limit roller and the ceramic rock plate, it ensures that the ceramic rock plate can smoothly follow the movement of the conveyor belt, and avoids the situation where the movement of the ceramic rock plate is blocked due to direct contact between the first limit plate and the ceramic rock plate. While significantly improving the limit accuracy, it also ensures the efficient chamfering and grinding of the bottom surface of the ceramic rock plate.

[0024] 3. The present invention also fixes the polishing machine through a positioning assembly. This avoids uneven polishing caused by inaccurate positioning of the polishing machine, improves the comprehensiveness of the chamfer polishing of the bottom surface of the ceramic rock slab, and lays a good foundation for the subsequent polishing of the entire bottom surface of the ceramic rock slab. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the three-dimensional structure of the top surface of a ceramic rock slab bottom surface grinding, chamfering and polishing device of the present invention.

[0026] Figure 2 It is a three-dimensional structural schematic diagram of the bottom surface orientation of a ceramic rock slab bottom surface grinding, chamfering and polishing device of the present invention.

[0027] Figure 3It is a partial three-dimensional structural cross-sectional view of a ceramic rock slab bottom surface grinding, chamfering and polishing device of the present invention.

[0028] Figure 4 It is a partial plan view of a ceramic rock slab bottom surface grinding, chamfering and polishing device according to the present invention.

[0029] Figure 5 It is a top view of a ceramic rock slab bottom surface grinding, chamfering and polishing device of the present invention.

[0030] Figure 6 It is a three-dimensional structural schematic diagram of a polishing machine for grinding, chamfering and polishing the bottom surface of a ceramic rock slab according to the present invention.

[0031] Figure 7 It is a partial three-dimensional structural schematic diagram of a polishing machine of a ceramic rock slab bottom surface grinding, chamfering and polishing device of the present invention.

[0032] Figure 8 It is a top view of a polishing machine of a ceramic rock slab bottom surface grinding, chamfering and polishing device of the present invention.

[0033] Figure 9 The present invention Figure 8 Plane sectional view at AA.

[0034] Figure 10 The present invention Figure 9 A sectional view of the three-dimensional structure at BB.

[0035] The numbers in the figure are: 1. Ceramic rock plate; 2. Frame; 21. Support; 22. Slide rail; 23. Positioning assembly; 231. Magnetic rod; 232. Magnetic ring; 3. Conveyor belt; 31. First limiting area; 32. Second limiting area; 4. Polishing machine; 41. Grinding disc; 411. Cooling chamber; 4111. Liquid inlet; 4112. Liquid outlet channel; 42. Grinding drive; 421. Spindle; 422. Rotating shaft; 423. Bushing; 4231. Inner ring; 4232. Outer ring; 424. Compression spring; 5. Limiting mechanism; 51. Limiting frame Body; 511, first limit plate; 5111, limit roller; 512, second limit plate; 5121, support sphere; 5122, ball seat; 513, movable side plate; 5131, guide rod; 5132, guide sleeve; 5133, return spring; 52, drive assembly; 521, guide rail; 5211, slider; 522, connecting rod; 523, rotary drive; 6, sliding jacking assembly; 61, jacking plate; 611, baffle; 62, ball bearing; 63, jacking cylinder; 7, camera; 71, signal transmitter; 72, signal receiver. DETAILED DESCRIPTION

[0036] In order to further understand the features, technical means, specific objectives and functions achieved by the present invention, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0037] See also Figure 1-Figure 5 As shown, a ceramic rock slab bottom surface grinding, chamfering and polishing equipment includes a belt conveyor and polishing machines 4 symmetrically arranged on both sides thereof, the belt conveyor has a frame 2 and a conveyor belt 3, and also includes a limiting mechanism 5 for keeping the ceramic rock slab 1 in a central position on the conveyor belt 3, the limiting mechanism 5 includes a limiting frame 51 symmetrically arranged on both sides of the frame 2 and a driving assembly 52 for driving the two limiting frames 51 to move in a conveying direction perpendicular to the conveyor belt 3, each limiting frame 51 is fixed with a plurality of the polishing machines 4 along the conveying direction of the conveyor belt 3, when the driving assembly 52 drives the two limiting frames In the process of the bodies 51 approaching each other, the ceramic rock slab 1 is in a state of being gradually limited between the two limiting frames 51, and the polishing machine 4 is accurately located at the position where the corners of the ceramic rock slab 1 pass, so that the bottom chamfer of the ceramic rock slab 1 is fully polished. A first limiting area 31 and a second limiting area 32 are successively provided between the two limiting frames 51 along the conveying direction of the conveyor belt 3. The polishing machine 4 is located in the second limiting area 32. The first limiting area 31 is provided with a sliding lifting component 6 for lifting the ceramic rock slab 1 upward to prevent the ceramic rock slab 1 from generating friction with the conveyor belt 3 during the limiting process.

[0038] During the conveying process of the ceramic slab 1, the belt conveyor is first started, conveying the ceramic slab 1 with its bottom surface facing upward. When the ceramic slab 1 enters the first limiting area 31, its bottom surface has not yet been polished. At this time, the limiting mechanism 5 begins to operate, driving the two limiting frames 51 in a direction perpendicular to the conveying direction of the conveyor belt 3 through the drive assembly 52, gradually approaching the ceramic slab 1.

[0039] To ensure that the ceramic rock slab 1 does not generate friction with the conveyor belt 3 during the limiting process, the sliding jacking assembly 6 is started synchronously to lift the ceramic rock slab 1 upward to separate it from the conveyor belt 3. Scratches or other damage caused by friction are effectively avoided. As the limiting frame 51 gradually approaches, the ceramic rock slab 1 is gradually centered. When the ceramic rock slab 1 is completely centered, the limiting frame 51 stops moving, the sliding jacking assembly 6 also stops working, and the ceramic rock slab 1 slowly descends and re-contacts the conveyor belt 3. At this point, the ceramic rock slab 1 has been stably and centrally positioned, ready for the subsequent polishing process.

[0040] Subsequently, as the conveyor belt 3 continues to transport the ceramic rock slab 1, the ceramic rock slab 1 enters the second limiting area 32, which is the area where the polishing machine 4 is located. The polishing machine 4 is fixed on the limiting frame 51, and adjusts its position as the limiting frame 51 moves, ensuring that the polishing machine 4 can be accurately positioned at the position where the corners of the ceramic rock slab 1 pass. During the conveying process, the polishing machine 4 fully grinds the chamfers of the bottom surface of the ceramic rock slab 1, gradually removing the chamfered parts of the bottom surface of the ceramic rock slab 1 to achieve the best grinding effect. This step lays a good foundation for the subsequent polishing of the bottom surface of the ceramic rock slab 1 as a whole. After the ceramic rock slab 1 has been fully polished, it enters the next polishing process for overall bottom surface polishing.

[0041] See also Figures 1-8 As shown, the limiting frame 51 is composed of a first limiting plate 511 and a second limiting plate 512, and a movable side plate 513 is fixedly connected between the first limiting plate 511 and the second limiting plate 512, which is transmission-connected to the driving assembly 52. ​​When the ceramic rock slab 1 is limited by the two first limiting plates 511, the first limiting area 31 is formed between the two first limiting plates 511. At the same time, the second limiting area 32 is formed between the two second limiting plates 512, so that the ceramic rock slab 1 is immediately polished by the polishing machine 4 the moment it enters the second limiting area 32.

[0042] The movable side panels 513 each have a guide rod 5131 extending outward near each end thereof. A guide sleeve 5132, through which the guide rod 5131 passes, is fixedly mounted on the frame 2. A return spring 5133 is fixedly connected between the guide sleeve 5132 and the guide rod 5131. A guide rail 521 is fixedly mounted along the length of the outer side of each movable side panel 513. Two sliders 5211 are slidably mounted within the guide rail 521. The drive assembly 52 includes a connecting rod 522 hingedly mounted between each slider 5211 and the corresponding guide sleeve 5132, and a rotary actuator 523 fixedly mounted on the frame 2 to drive each connecting rod 522 to rotate about the hinge point of the guide sleeve 5132.

[0043] When the ceramic rock slab 1 enters the first limiting area 31, the driving assembly 52 starts working. The rotary driver 523 drives the connecting rod 522 to rotate, and the rotation of the connecting rod 522 drives the slider 5211 to slide along the guide rail 521. The sliding of the slider 5211 pushes the movable side plate 513, so that the limiting frame 51 moves along the conveying direction perpendicular to the conveyor belt 3. The movable side plate 513 moves smoothly under the guidance of the guide rod 5131 and the guide sleeve 5132, ensuring that the movement of the limiting frame 51 is accurate. After the first limiting area 31 in which the ceramic rock slab 1 is limited is formed between the two first limiting plates 511, the second limiting area 32 is also formed between the two second limiting plates 512. The range of the first limiting area 31 and the second limiting area 32 are consistent. Therefore, after being centered by the two first limiting plates 511, the ceramic rock slab 1 can directly enter the second limiting area 32 and be immediately polished by the polishing machine 4, avoiding the step of limiting again in the second limiting area 32, and improving the efficiency of chamfering and polishing of the ceramic rock slab 1.

[0044] After a ceramic slab 1 is polished, the driving assembly 52 works in the reverse direction, the rotary driver 523 drives the connecting rod 522 to rotate in the reverse direction, the slider 5211 slides back to its original position along the guide rail 521, and the movable side plate 513 returns to its initial position under the action of the return spring 5133. The first limit plate 511 and the second limit plate 512 then move outward to prepare for the entry of the next ceramic slab 1, so as to facilitate the limit adjustment according to the size of the ceramic slab 1.

[0045] See also Figure 3 、 Figure 4 and Figure 9 As shown, the first limiting plate 511 and the second limiting plate 512 are provided with a plurality of limiting rollers 5111 that can contact the edge of the ceramic rock slab 1 along the conveying direction of the conveyor belt 3, and the rotation direction of the limiting rollers 5111 is parallel to the conveying direction of the conveyor belt 3.

[0046] During the positioning process, the positioning roller 5111 enhances the positioning effect of the ceramic slab 1 during transportation. The rotation direction of the positioning roller 5111 is parallel to the conveying direction of the conveyor belt 3. Therefore, when the ceramic slab 1 follows the conveyor belt 3, the positioning roller 5111 can smoothly contact and roll with the edge of the ceramic slab 1, thereby reducing friction. This effectively avoids scratches on the side of the ceramic slab 1 due to excessive friction, ensures the quality of the ceramic slab 1, and maintains its stable transportation.

[0047] See also Figure 1 、 Figure 3 and Figure 5As shown, a camera 7 for observing the size of the ceramic rock slab 1 is provided on the frame 2 and located in the first limiting area 31. A signal transmitter 71 is provided on one of the two movable side plates 513, and a signal receiver 72 corresponding to the signal transmitter 71 is provided on the other movable side plate 513. When the camera 7 observes the size of the ceramic rock slab 1 and senses the distance through the signal transmitter 71 and the signal receiver 72, the two first limiting plates 511 are in a state of limiting the ceramic rock slab 1 therein rather than applying pressure, so that the ceramic rock slab 1 can still move with the conveyor belt 3.

[0048] Before the driving component 52 drives the two limiting frames 51 to limit the ceramic rock slab 1, the size of the ceramic rock slab 1 is observed by the camera 7 on the frame 2 to accurately obtain the specific size information of the ceramic rock slab 1. Subsequently, through the cooperation of the signal transmitter 71 and the signal receiver 72, that is, the signal transmitter 71 sends a signal and the signal receiver 72 receives the reflected signal, these signals are transmitted to the controller for calculation, thereby accurately measuring the distance between the two limiting frames 51.

[0049] The drive assembly 52 dynamically adjusts the positions of the two first limiting plates 511 based on the measurement results, ensuring that the ceramic slab 1 is stably centered and restrained when entering the first limiting area 31, avoiding excessive pressure. This ensures that the ceramic slab 1 will not be unable to follow the conveyor belt 3 due to excessive compression during the limiting process, and can continue to move smoothly with the conveyor belt 3. This not only improves the accuracy and stability of the limiting, but also ensures efficient chamfering of the bottom surface of the ceramic slab 1.

[0050] See also Figure 3-10 As shown, each second limiting plate 512 is fixed with a support 21 for installing the polishing machine 4, and a slide rail 22 for sliding connection of the support 21 is fixed on the frame 2 along the direction of movement of the second limiting plate 512, and the slide rail 22 is provided with a positioning component 23 for fixing the position of the polishing machine 4 after the second limiting area 32 is formed.

[0051] The positioning assembly 23 includes a magnetic rod 231 fixedly mounted on the frame 2 along the track direction of the slide rail 22, and a magnetic ring 232 slidably mounted on the magnetic rod 231 and fixedly connected to the support 21. The magnetic rod 231 and the magnetic ring 232 are both electromagnets. By controlling the power supply state of the magnetic rod 231 and the magnetic ring 232, a magnetic attraction is generated between the magnetic rod 231 and the magnetic ring 232, thereby fixing the support 21 at a predetermined position on the slide rail 22.

[0052] The positioning assembly 23 may further include an electric screw that rotates along the track direction of the slide rail 22 and a threaded sleeve that is threadedly mounted on the electric screw and fixedly connected to the support 21. The electric screw and the threaded sleeve are not shown in the figure. The electric screw controls the movement of the threaded sleeve to fix the support 21 at a predetermined position on the slide rail 22.

[0053] The positioning assembly 23 can also include a slot provided on the slide rail 22 and a buckle provided on the support 21, which are not shown in the figure. The support 21 can be locked by the cooperation of the buckle and the slot, thereby fixing the support 21 to a predetermined position on the slide rail 22.

[0054] When the ceramic rock slab 1 is limited by the two first limiting plates 511, the second limiting plate 512 moves following the first limiting plate 511. At this time, the support 21 fixed to the second limiting plate 512 drives the polishing machine 4 to move along the slide rail 22. After the ceramic rock slab 1 is stably limited, the support 21 is fixed to the predetermined position on the slide rail 22 by activating the positioning assembly 23. This ensures that the polishing machine 4 remains stable and motionless during operation, so that the chamfered portion of the bottom surface of the ceramic rock slab 1 can be fully polished.

[0055] See also Figure 4 and Figure 9 As shown, a supporting ball 5121 is provided on each second limiting plate 512 at a position corresponding to the polishing machine 4 , and a ball seat 5122 for mounting the supporting ball 5121 is provided on the second limiting plate 512 .

[0056] During the transportation of the ceramic rock slab 1, the polishing machine 4 polishes it. Since the supporting spheres 5121 are arranged corresponding to the polishing machine 4, the polished portion of the ceramic rock slab 1 is effectively supported to prevent it from being deformed due to the polishing pressure, thereby improving the polishing accuracy and stability.

[0057] In addition, the supporting sphere 5121 can rotate freely on the ball seat 5122, thereby reducing the friction between the ceramic rock slab 1 and the supporting point during the transportation of the ceramic rock slab 1, avoiding surface scratches and damage caused by friction, and protecting the surface quality of the ceramic rock slab 1.

[0058] See also Figure 3-10 As shown, the polishing machine 4 includes a grinding disc 41 and a grinding driver 42 fixedly arranged on the support 21, the grinding driver 42 has a main shaft 421 that can rotate and lift, the grinding disc 41 has a rotating shaft 422 coaxial with the main shaft 421, a shaft sleeve 423 is fixedly provided on the main shaft 421, the rotating shaft 422 is inserted in the shaft sleeve 423 in the form of a sliding card, and a compression spring 424 is fixedly provided between the rotating shaft 422 and the shaft sleeve 423.

[0059] A clamping strip is provided inside the shaft sleeve 423 along its axial direction, and a clamping groove for slidingly engaging with the clamping strip is provided on the rotating shaft 422 along its axial direction.

[0060] When the ceramic slab 1 is conveyed to the bottom of the polishing machine 4, the main shaft 421 of the grinding driver 42 descends and drives the grinding disc 41 to contact the bottom surface of the ceramic slab 1. The position of the grinding disc 41 can be adjusted according to the thickness of the ceramic slab 1. The specific structure that drives the main shaft 421 to rise and fall is not shown in the figure. The rotational motion of the main shaft 421 is transmitted to the rotating shaft 422 through the shaft sleeve 423, causing the grinding disc 41 to rotate at high speed for grinding.

[0061] In order to ensure that the grinding disc 41 can grind the chamfer of the bottom surface of the ceramic rock slab 1 stably and effectively, the compression spring 424 is compressed as the main shaft 421 continues to descend, so that the grinding disc 41 is stably and appropriately pressed against the bottom surface of the ceramic rock slab 1. This ensures that the grinding disc 41 always maintains good contact with the surface of the ceramic rock slab 1, thereby achieving effective grinding of the chamfer of the bottom surface of the ceramic rock slab 1.

[0062] See also Figure 3-10 As shown, a cooling chamber body 411 fixedly connected to the support 21 is sleeved on the sleeve 423, and the cooling chamber body 411 has a liquid inlet 4111. A liquid outlet channel 4112 is provided between the cooling chamber body 411 and the sleeve 423. An inner ring 4231 and an outer ring 4232 for opening and closing the liquid outlet channel 4112 are also provided between the cooling chamber body 411 and the sleeve 423. When the inner ring 4231 and the outer ring 4232 fit together, the liquid outlet channel 4112 is in a closed state, and when the outer ring 4232 gradually moves away from the inner ring 4231, the liquid outlet channel 4112 is in a gradually open state.

[0063] During the grinding process of the grinding disc 41 being pressed against the bottom surface of the ceramic rock slab 1 by the compression spring 424, the coolant enters from the liquid inlet 4111 of the cooling chamber 411 and is stored in the cooling chamber 411. As the main shaft 421 descends, the outer ring 4232 gradually moves away from the inner ring 4231, and the liquid outlet channel 4112 gradually opens, allowing the coolant to flow out through the liquid outlet channel 4112 and be evenly sprinkled on the grinding disc 41. This effectively reduces the high temperature generated by the grinding disc 41 during the grinding process, reduces the heat accumulation of the grinding disc 41, and further improves the grinding effect.

[0064] See also Figure 2-Figure 4 As shown, the sliding jacking assembly 6 includes a jacking plate 61 arranged below the conveyor belt 3, balls 62 arranged in a matrix on the jacking plate 61, and a jacking cylinder 63 fixed on the frame 2 to drive the jacking plate 61 to move up and down.

[0065] The end of the lifting plate 61 near the second limiting area 32 is provided with a baffle 611 that can prevent the ceramic rock slab 1 from following the conveyor belt 3. Before the ceramic rock slab 1 is limited by the two first limiting plates 511, as the ceramic rock slab 1 is conveyed by the conveyor belt 3 to contact the baffle 611, the ceramic rock slab 1 stops moving relative to the conveyor belt 3. The lifting cylinder 63 then drives the lifting plate 61 to rise, and the balls 62 on the lifting plate 61 contact the bottom of the ceramic rock slab 1 and provide smooth support. As the lifting plate 61 continues to rise, the ceramic rock slab 1 is smoothly lifted up, causing it to detach from the conveyor belt 3.

[0066] The lifted position of the ceramic slab 1 is still between the two first limiting plates 511, which not only ensures the precise positioning of the ceramic slab 1, but also avoids the situation where the ceramic slab 1 generates a large friction force relative to the movement of the conveyor belt 3 during the limiting process. After the ceramic slab 1 completes the limiting in the lifted state, the lifting plate 61 is reset, and the ceramic slab 1 is placed back on the conveyor belt 3. At this time, the baffle 611 is located below the ceramic slab 1 and does not affect the movement of the ceramic slab 1 following the conveyor belt 3.

[0067] A method for grinding and polishing the bottom surface of a ceramic rock plate is applied to a device for grinding, chamfering and polishing the bottom surface of a ceramic rock plate, comprising the following steps:

[0068] S1, start the conveyor belt 3 to transport the ceramic rock slab 1;

[0069] S2, start the limiting mechanism 5 to gradually center the ceramic rock plate 1. During this process, start the sliding lifting component 6 to lift the ceramic rock plate 1 upward to prevent friction between the ceramic rock plate 1 and the conveyor belt 3;

[0070] S3, after the ceramic rock plate 1 is limited, the polishing machine 4 is at the position where the edge of the ceramic rock plate 1 passes, and the sliding jacking assembly 6 is started again to lower the ceramic rock plate 1 onto the conveyor belt 3, and continue to be transported by the conveyor belt 3;

[0071] S4. Start the polishing machine 4 and use the grinding disc 41 to comprehensively grind the bottom chamfer of the ceramic rock slab 1 during transportation.

[0072] The present invention uses precise control of the limiting mechanism 5 to ensure that the ceramic rock slab 1 is stably centered during the transportation process. After the ceramic rock slab 1 is limited by the two limiting frames 51, the polishing machine 4 is adjusted to the position where the corners of the ceramic rock slab 1 pass under the guidance of the limiting frame 51. It can accurately polish the bottom chamfer of the ceramic rock slab 1, ensuring the best polishing effect and avoiding vibration of the ceramic rock slab 1 during the polishing process, so that the bottom chamfer of the ceramic rock slab 1 becomes smooth and flat, laying a good foundation for the subsequent overall polishing process.

[0073] In addition, the size of the ceramic rock slab 1 is observed by the camera 7, and the signal is transmitted to the controller for precise distance measurement in combination with the signal transmitter 71 and the signal receiver 72. The position of the two limit frames 51 can be dynamically adjusted through the drive component 52 to ensure that the ceramic rock slab 1 is stably centered when entering the two first limit plates 511 without being subjected to excessive pressure, thereby ensuring that the ceramic rock slab 1 moves smoothly following the conveyor belt 3, significantly improving the efficiency of the grinding process.

[0074] The above embodiments merely represent one or more embodiments of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of protection of the present invention. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present invention, and such modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the appended claims.

Claims

1. A ceramic rock slab bottom surface grinding, chamfering and polishing device, comprising a belt conveyor and polishing machines (4) symmetrically arranged on both sides thereof, wherein the belt conveyor has a frame (2) and a conveyor belt (3); It is characterized in that It also includes a limiting mechanism (5) for keeping the ceramic rock plate (1) in a central position on the conveyor belt (3), the limiting mechanism (5) comprising: Limiting frames (51) symmetrically arranged on both sides of the frame (2); and a driving assembly (52) for driving the two limiting frames (51) to move in a conveying direction perpendicular to the conveyor belt (3); A plurality of the polishing machines (4) are fixedly provided on each limiting frame (51) along the conveying direction of the conveyor belt (3); When the driving component (52) drives the two limiting frames (51) to approach each other, the ceramic rock plate (1) is gradually limited between the two limiting frames (51), and the polishing machine (4) is accurately located at the position where the edge of the ceramic rock plate (1) passes, so that the bottom chamfer of the ceramic rock plate (1) is fully polished; The area between the two limiting frames (51) is sequentially divided into a first limiting area (31) and a second limiting area (32) along the conveying direction of the conveyor belt (3); the polishing machine (4) is located in the second limiting area (32); and the first limiting area (31) is provided with a sliding lifting component (6) for lifting the ceramic rock plate (1) upwards to prevent the ceramic rock plate (1) from generating friction with the conveyor belt (3) during the limiting process; The limiting frame (51) is composed of a first limiting plate (511) and a second limiting plate (512), and a movable side plate (513) connected to the driving assembly (52) is fixedly connected between the first limiting plate (511) and the second limiting plate (512). When the ceramic rock plate (1) is limited by the two first limiting plates (511), the first limiting area (31) is formed between the two first limiting plates (511). At the same time, the second limiting area (32) is formed between the two second limiting plates (512), so that the ceramic rock plate (1) is polished by the polishing machine (4) immediately when entering the second limiting area (32); The movable side plate (513) has a guide rod (5131) extending outward near both ends thereof, a guide sleeve (5132) for the guide rod (5131) to pass through is fixedly provided on the frame (2), a return spring (5133) is fixedly connected between the guide sleeve (5132) and the guide rod (5131), a guide rail (521) is fixedly provided on the outer side of each movable side plate (513) along its length direction, two sliders (5211) are slidably provided in the guide rail (521), and the driving assembly (52) includes a connecting rod (522) hingedly provided between each slider (5211) and the corresponding guide sleeve (5132), and a rotation driver (523) fixedly provided on the frame (2) for driving each connecting rod (522) to rotate about the hinge point of the guide sleeve (5132) as the axis.

2. The ceramic rock plate bottom surface grinding, chamfering and polishing device according to claim 1 is characterized in that: A plurality of limiting rollers (5111) capable of contacting the edge of the ceramic rock slab (1) are provided on the first limiting plate (511) and the second limiting plate (512) along the conveying direction of the conveyor belt (3), and the rotation direction of the limiting rollers (5111) is parallel to the conveying direction of the conveyor belt (3).

3. The ceramic rock plate bottom surface grinding, chamfering and polishing device according to claim 2 is characterized in that: A camera (7) for observing the size of the ceramic rock plate (1) is provided on the frame (2) and located at the first limiting area (31). A signal transmitter (71) is provided on one of the two movable side plates (513), and a signal receiver (72) corresponding to the signal transmitter (71) is provided on the other movable side plate (513). When the camera (7) observes the size of the ceramic rock plate (1) and senses the distance through the signal transmitter (71) and the signal receiver (72), the two first limiting plates (511) are in a state of limiting the ceramic rock plate (1) therein rather than applying pressure, so that the ceramic rock plate (1) can still move along with the conveyor belt (3).

4. The ceramic rock plate bottom surface grinding, chamfering and polishing device according to claim 1, characterized in that: A support (21) for mounting the polishing machine (4) is fixedly provided on each second limiting plate (512), and a slide rail (22) for sliding connection with the support (21) is fixedly provided on the frame (2) along the direction of movement of the second limiting plate (512). The slide rail (22) is provided with a positioning assembly (23) for fixing the position of the polishing machine (4) after the second limiting area (32) is formed.

5. The ceramic rock plate bottom surface grinding, chamfering and polishing device according to claim 4 is characterized in that: A supporting sphere (5121) is provided on each second limiting plate (512) at a position corresponding to the polishing machine (4), and a ball seat (5122) for mounting the supporting sphere (5121) is provided on the second limiting plate (512).

6. The ceramic rock plate bottom surface grinding, chamfering and polishing device according to claim 5, characterized in that: The polishing machine (4) includes a grinding disc (41) and a grinding driver (42) fixedly arranged on a support (21), wherein the grinding driver (42) has a main shaft (421) capable of rotating and lifting, and the grinding disc (41) has a rotating shaft (422) coaxial with the main shaft (421), a shaft sleeve (423) is fixedly provided on the main shaft (421), and the rotating shaft (422) is inserted into the shaft sleeve (423) in the form of a sliding engagement, and a compression spring (424) is fixedly provided between the rotating shaft (422) and the shaft sleeve (423).

7. The ceramic rock plate bottom surface grinding, chamfering and polishing device according to claim 6, characterized in that: A cooling chamber (411) fixedly connected to the support (21) is provided on the shaft sleeve (423), the cooling chamber (411) having a liquid inlet (4111), a liquid outlet channel (4112) between the cooling chamber (411) and the shaft sleeve (423), and an inner ring (4231) and an outer ring (4232) for opening and closing the liquid outlet channel (4112) are also provided between the cooling chamber (411) and the shaft sleeve (423). When the inner ring (4231) and the outer ring (4232) fit together, the liquid outlet channel (4112) is in a closed state, and when the outer ring (4232) gradually moves away from the inner ring (4231), the liquid outlet channel (4112) is in a gradually open state.

8. The ceramic rock plate bottom surface grinding, chamfering and polishing device according to claim 1, characterized in that: The sliding lifting assembly (6) includes a lifting plate (61) arranged below the conveyor belt (3), balls (62) arranged in a matrix on the lifting plate (61), and a lifting cylinder (63) fixedly arranged on the frame (2) for driving the lifting plate (61) to move up and down.

9. A method for grinding and polishing the bottom surface of a ceramic rock plate, applied to a device for grinding and polishing the bottom surface of a ceramic rock plate according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1, start the conveyor belt (3) to transport the ceramic rock plate (1); S2, start the limiting mechanism (5) to gradually center the ceramic rock plate (1). During this process, start the sliding lifting assembly (6) to lift the ceramic rock plate (1) upward to prevent friction between the ceramic rock plate (1) and the conveyor belt (3); S3, after the ceramic rock plate (1) is limited, the polishing machine (4) is at the position where the edge of the ceramic rock plate (1) passes, and the sliding lifting assembly (6) is started again to lower the ceramic rock plate (1) onto the conveyor belt (3), and continue to be transported by the conveyor belt (3); S4, start the polishing machine (4), and use the grinding disc (41) to fully grind the bottom chamfer of the ceramic rock plate (1) during the transportation process.

Citation Information

Patent Citations

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