Circular silicon material chamfering device and machining method

Abstract

The invention provides a circular silicon material chamfering device and a machining method, and belongs to the field of silicon material machining. Comprising a workbench, a silicon material fixing assembly, a chamfering assembly and a position adjusting mechanism. The silicon material fixing assembly, the chamfering assembly and the position adjusting mechanism are arranged on the workbench. The position adjusting mechanism comprises an X-axis moving mechanism and a Z-axis moving mechanism, and the chamfering assembly is horizontally installed on the X-axis moving mechanism in a sliding mode so that the chamfering assembly can horizontally move in the X-axis direction; the X-axis moving mechanism vertically slides on the Z-axis moving mechanism so that the X-axis moving mechanism can drive the chamfering assembly to move up and down in the Z-axis direction. According to the chamfering device, the chamfering assembly can be controlled to move up and down or left and right through the X-axis moving mechanism and the Z-axis moving mechanism so as to adapt to circular silicon materials of different sizes, the circular silicon materials can be internally chamfered or externally chamfered, and the chamfering device is high in adaptability.

Description

Technical Field

[0001] The invention relates to the technical field of silicon material processing, and in particular to a circular silicon material chamfering device and a processing method. Background Art

[0002] Silicon is a hard and brittle material. During the processing of silicon, corners are prone to defects and damage. These incomplete surfaces can easily cause harm to the human body and have a negative impact on the processing technology. Therefore, the silicon that has been roughly processed needs to be chamfered to prevent destructive cracks from occurring during subsequent processing. Chamfering the silicon wafer can enhance the error resistance of its edges and prevent excessive stress on the wafer edge under pressure, thereby reducing damage to the silicon wafer caused by corner defects and stress damage. It can also improve the mechanical strength of the silicon wafer, giving it better pressure resistance and wear resistance, thereby improving the stability of the silicon wafer during the manufacturing process.

[0003] At present, the commonly used chamfering method is to manually use a manual grinder to grind and chamfer the edges, but the angle and strength of the chamfer cannot be accurately controlled, and the size and angle of the corners cannot be uniform. In the prior art, a Chinese patent with application number 202223416041.8 specifically discloses a single crystal silicon wafer chamfering device, and specifically discloses that when the single crystal silicon wafer needs to be chamfered, the staff will place the single crystal silicon wafer on a disc, use a rubber pressure plate to press the single crystal silicon wafer, and drive the single crystal silicon wafer to rotate by rotating the disc, so that the chamfer of the single crystal silicon wafer can be rotated to the left side of the grinding wheel, and then the grinding wheel is moved to the chamfer to chamfer the single crystal silicon wafer, so as to chamfer the single crystal silicon wafer using the chamfering device. However, this patent can only chamfer the outer circle of the silicon wafer, and cannot perform internal chamfering on silicon ring-type silicon wafers, and the device has low adaptability. Summary of the invention

[0004] In view of this, the present invention provides a device and a processing method for chamfering a center silicon material to solve the technical problem of low adaptability of the existing chamfering device.

[0005] The technical solution adopted by the present invention to solve its technical problem is: A circular silicon material chamfering device comprises a workbench, a silicon material fixing component, a chamfering component, and a position adjustment mechanism; the silicon material fixing component, the chamfering component, and the position adjustment mechanism are arranged on the workbench; the position adjustment mechanism comprises an X-axis moving mechanism and a Z-axis moving mechanism, wherein the chamfering component is horizontally slidably installed on the X-axis moving mechanism so that the chamfering component moves horizontally along the X-axis direction; the X-axis moving mechanism slides vertically on the Z-axis moving mechanism so that the X-axis moving mechanism drives the chamfering component to move up and down along the Z-axis direction.

[0006] Preferably, the silicon material fixing assembly comprises a turntable and a suction cup, the turntable is fixedly connected to the suction cup, and the suction cup is provided with an adsorption strip to adsorb and fix the circular silicon material on the turntable, and drive the circular silicon material to rotate through the turntable.

[0007] Preferably, the chamfering assembly includes a chamfering tool, a tool clamping mechanism, a tool motor and a cooling mechanism; the tool clamping mechanism clamps the chamfering tool at one end, and is connected to the tool motor at the other end, so that the tool motor drives the chamfering tool to perform chamfering through the tool clamping mechanism, and the cooling mechanism is arranged on one side of the chamfering tool to spray coolant onto the circular silicon material while the chamfering tool is chamfering.

[0008] Preferably, the X-axis moving mechanism and the Z-axis moving mechanism both include a ball screw and a guide rail.

[0009] Preferably, a first motor is provided at one end of the Z-axis moving mechanism, so that the ball screw on the Z-axis moving mechanism is driven by the first motor to move, driving the X-axis moving mechanism to move up and down along the Z-axis; a second motor is provided at one end of the X-axis moving mechanism, so that the ball screw on the X-axis moving mechanism is driven by the second motor to move, driving the chamfering assembly to move left and right along the X-axis.

[0010] Preferably, an accordion-type guide rail protective cover is installed on the guide rail.

[0011] Preferably, a protective cover is provided on the edge of the workbench to prevent splashing of coolant.

[0012] Preferably, a drain trough is provided on the table top of the workbench, and a drain port is opened on the drain trough for installing a drain pipe, and a liquid receiving box is provided directly below the drain pipe so that the coolant flows from the drain trough through the drain pipe to the liquid receiving box.

[0013] Preferably, a water pump is provided in the liquid receiving box, so that the coolant in the liquid receiving box can be pumped back to the cooling mechanism by the water pump to realize the recycling of the coolant.

[0014] A method for chamfering a circular silicon material, using the circular silicon material chamfering device as described above, comprises the following steps: S1. placing the circular silicon material to be chamfered on a silicon material fixing assembly; S2, moving the chamfering assembly to a suitable position through the X-axis moving mechanism and the Z-axis moving mechanism to chamfer the circular silicon material; S3. After chamfering is completed, remove the circular silicon material and turn it over, and repeat the above steps to complete all chamfering.

[0015] Compared with the prior art, the present invention has the following beneficial effects: When the circular silicon material chamfering device of the present invention is used, after the circular silicon material is fixed by the silicon material fixing assembly, the chamfering assembly is controlled by the X-axis moving mechanism and the Z-axis moving mechanism to move to the position where the circular silicon material needs to be chamfered, and the circular silicon material is chamfered. Thus, the chamfering assembly can be controlled to move up and down or left and right by the X-axis moving mechanism and the Z-axis moving mechanism to adapt to circular silicon materials of different sizes, and the circular silicon material can be chamfered internally or externally, and the chamfering device has high adaptability. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the circular silicon material chamfering device of the present invention.

[0017] Figure 2 It is a schematic structural diagram of the silicon material fixing assembly of the present invention.

[0018] Figure 3 It is a schematic structural diagram of the chamfering assembly of the present invention.

[0019] Figure 4 It is a front view structural schematic diagram of the circular silicon material chamfering device of the present invention.

[0020] Figure 5 It is another front view structural schematic diagram of the circular silicon material chamfering device of the present invention.

[0021] Figure 6 It is a schematic diagram of the top view of the circular silicon material chamfering device of the present invention.

[0022] Figure 7 It is a side structural schematic diagram of the circular silicon material chamfering device of the present invention.

[0023] In the figure: a workbench 10, a protective cover 11, a drainage trough 12, a drainage pipe 13, a liquid receiving box 14, a water pump 15, a round silicon material 20, a silicon material fixing assembly 100, a turntable 110, a suction cup 120, an adsorption strip 121, a connecting portion 130, a terminal box 140, a chamfering assembly 200, a chamfering tool 210, a tool clamping mechanism 220, a tool motor 230, a cooling mechanism 240, a motor protective cover 250, an X-axis moving mechanism 310, a Z-axis moving mechanism 320, a ball screw 330, a guide rail 340, a first motor 350, a second motor 360, and an accordion guide rail protective cover 370. DETAILED DESCRIPTION

[0024] The technical solutions and technical effects of the embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings of the present invention.

[0025] Please see Figure 1A circular silicon material chamfering device includes a workbench 10, a silicon material fixing component 100, a chamfering component 200, and a position adjustment mechanism; the silicon material fixing component 100, the chamfering component 200 and the position adjustment mechanism are arranged on the workbench 10; the position adjustment mechanism includes an X-axis moving mechanism 310 and a Z-axis moving mechanism 320, wherein the chamfering component 200 is horizontally slidably installed on the X-axis moving mechanism 310 so that the chamfering component 200 moves horizontally along the X-axis direction; the X-axis moving mechanism 310 slides vertically on the Z-axis moving mechanism 320 so that the X-axis moving mechanism 310 drives the chamfering component 200 to move up and down along the Z-axis direction.

[0026] When the circular silicon material chamfering device of the present invention is used, after the circular silicon material is fixed by the silicon material fixing assembly, the chamfering assembly is controlled by the X-axis moving mechanism and the Z-axis moving mechanism to move to the position where the circular silicon material needs to be chamfered, and the circular silicon material is chamfered. Thus, the chamfering assembly can be controlled to move up and down or left and right by the X-axis moving mechanism and the Z-axis moving mechanism to adapt to circular silicon materials of different sizes, and the circular silicon material can be chamfered internally or externally, and the chamfering device has high adaptability.

[0027] For further information, see Figure 2 The silicon material fixing assembly 100 includes a turntable 110 and a suction cup 120. The turntable 110 is fixedly connected to the suction cup 120. The suction cup 120 is provided with an adsorption strip 121 to adsorb and fix the circular silicon material on the turntable 110, and the turntable 110 drives the circular silicon material to rotate. Specifically, the turntable 110 is installed on the working platform, and the turntable 110 has a vacuum adsorption function inside. The suction cup 120 is installed on the turntable 110, and the turntable 110 and the suction cup 120 are fixed by a connector 130. The suction strip 121 is provided on the suction cup 120 to adsorb and fix the circular silicon material on the turntable 110, so that when the circular silicon material needs to be rotated, the turntable 110 is controlled to rotate to drive the circular silicon material to rotate, so as to achieve chamfering of different positions of the circular silicon material. In some embodiments, a junction box 140 is provided on the outside of the turntable 110 to protect the connecting wires of the turntable and prevent the coolant and silicon powder generated by the chamfering from falling on the connecting wires, affecting the normal operation of the connecting wires.

[0028] For further information, see Figure 3The chamfering assembly 200 includes a chamfering tool 210, a tool clamping mechanism 220, a tool motor 230, and a cooling mechanism 240; the tool clamping mechanism 220 clamps the chamfering tool 210 at one end, and is connected to the tool motor 230 at the other end, so that the tool motor 230 drives the chamfering tool 210 to chamfer through the tool clamping mechanism 220, and the cooling mechanism 240 is arranged on one side of the chamfering tool 210 to spray coolant to the circular silicon material while the chamfering tool 210 is chamfering. When chamfering, the tool is driven by the tool motor to chamfer, and the cooling mechanism 240 sprays coolant to the chamfer of the circular silicon material while chamfering. On the one hand, the temperature of the chamfering tool and the chamfer of the circular silicon material is reduced to avoid deformation of the chamfer due to heating, and ensure the accuracy of the size of the chamfer. On the other hand, the cut silicon powder can be washed out to prevent the silicon powder from being stuck between the tool and the chamfer, affecting the stability of the chamfer, and also preventing the silicon powder from floating in the environment and affecting the health of the staff. The tool can be customized to different angles, such as chamfered C angle, chamfered R angle, etc., to meet the needs of different chamfers, and the tool head can be made of silicon carbide diamond, ceramic, resin, etc. In some embodiments, a motor protection cover 250 can be provided outside the tool motor to protect the tool motor.

[0029] For further information, see Figure 4 , the X-axis moving mechanism 310 and the Z-axis moving mechanism 320 both include a ball screw 330 and a guide rail 340. Specifically, the X-axis moving mechanism 310 is horizontally provided with a ball screw 330 and a linear guide rail 340, and the chamfering assembly 200 is slidably mounted on the ball screw 330 and the guide rail 340. When the ball screw moves, the chamfering assembly 200 follows the ball screw and moves left and right along the guide rail; the Z-axis moving mechanism 320 is vertically provided with a ball screw 330 and a linear guide rail 340, and the X-axis moving mechanism 310 is slidably mounted on the ball screw 330 and the guide rail 340 on the Z-axis moving mechanism 320. When the ball screw moves, the X-axis moving mechanism 310 follows the ball screw and moves up and down along the guide rail, thereby driving the chamfering assembly 200 to move up and down. The use of ball screw transmission can achieve higher positioning accuracy and move the chamfering component to the precise chamfering position. At the same time, the ball screw can also accurately control the feed amount of the chamfering tool, thereby ensuring the chamfering effect of the silicon material.

[0030] For further information, please see Figure 4A first motor 350 is provided at one end of the Z-axis moving mechanism 320, so that the ball screw 330 on the Z-axis moving mechanism 320 is driven by the first motor 350 to move and drive the X-axis moving mechanism 310 to move up and down along the Z-axis; a second motor 360 is provided at one end of the X-axis moving mechanism 310, so that the ball screw 330 on the X-axis moving mechanism 310 is driven by the second motor 360 to move and drive the chamfering assembly 200 to move left and right along the X-axis. The first motor and the second motor can realize automatic control of the X-axis moving mechanism and the Z-axis moving mechanism, thereby improving the chamfering efficiency. The first motor and the second motor are servo motors.

[0031] In some embodiments, a handle is provided at one end of the Z-axis moving mechanism and the X-axis moving mechanism, respectively. The ball screw is controlled to move by rotating the handle on the Z-axis moving mechanism, so that the chamfering assembly moves up and down, and the ball screw is controlled to move by rotating the handle on the X-axis moving mechanism, so that the chamfering assembly moves left and right, thereby moving the chamfering assembly to a suitable position for chamfering. By manually rotating the handle to control the movement of the chamfering assembly, the position of the chamfering tool can be adjusted in real time according to the condition of the round silicon material, and chamfering can be performed accurately.

[0032] For further information, see Figure 5 , an accordion-type guide rail protective cover 370 is installed on the guide rail 340 to protect the X-axis moving mechanism and the Z-axis moving mechanism during the chamfering process. Among them, one accordion-type guide rail protective cover 370 installed on the X-axis moving mechanism is installed between the left end of the X-axis moving mechanism 310 and the left end of the motor protective cover 250, and the other is installed between the right end of the X-axis moving mechanism 310 and the right end of the motor protective cover 250. When the chamfering assembly 200 moves left and right along the X-axis moving mechanism, the accordion-type guide rail protective cover 370 follows the movement of the chamfering assembly 200 to expand or contract, thereby preventing coolant or silicon powder from falling on the X-axis moving mechanism during the chamfering process, ensuring the normal operation of the X-axis moving mechanism, and improving the service life of the X-axis moving mechanism. Similarly, the accordion-type guide rail protective cover 370 installed on the Z-axis moving mechanism is installed at one end between the upper end of the Z-axis moving mechanism 320 and the upper end of the X-axis moving mechanism 310, and the other end between the lower end of the Z-axis moving mechanism 320 and the lower end of the X-axis moving mechanism 310. When the X-axis moving mechanism 310 moves up and down along the Z-axis moving mechanism, the accordion-type guide rail protective cover 370 expands or contracts following the movement of the X-axis moving mechanism, thereby preventing coolant or silicon powder from falling on the Z-axis moving mechanism during chamfering, thereby ensuring the normal operation of the Z-axis moving mechanism and increasing the service life of the Z-axis moving mechanism.

[0033] For further information, see Figure 1A protective cover 11 is provided at the edge of the workbench 10 to prevent splashing of coolant. The overall frame of the workbench is welded with square steel, and the table top is round. A circle of protective cover 11 is provided at the edge of the table top, and the protective cover 11 is designed as a sliding door, so that the protective cover 11 is closed when chamfering to prevent splashing of coolant. After the chamfering is completed, the protective cover 11 is opened to take out the round silicon material.

[0034] Further, please also see Figure 1 , Figure 6 and Figure 7 A drain trough 12 is provided on the surface of the workbench 10, and a drain port is opened on the drain trough 12 for installing a drain pipe 13. A liquid receiving box 14 is provided directly below the drain pipe 13, so that the coolant flows from the drain trough 12 through the drain pipe 13 to the liquid receiving box 14, thereby realizing the recovery of the coolant.

[0035] In some embodiments, the drain trough can be designed to have a certain slope, with a smaller slope near the drain port and a larger slope away from the drain port, thereby accelerating the flow of coolant from the drain trough to the drain port and improving the efficiency of coolant recovery. In other embodiments, the bottom of the four frame rods under the workbench are provided with adjustable feet, so that the slope of the workbench can be adjusted by adjusting the feet, so that the coolant can flow quickly from the drain trough to the drain port.

[0036] In some embodiments, when the cooling mechanism flushes the chamfered area, in addition to the coolant, silicon powder will also fall into the drain trough. Some silicon powder cannot follow the coolant to flow to the liquid receiving box through the drain trough and the drain pipe, but is precipitated in the drain trough. Long-term accumulation will affect the recovery of the coolant. Therefore, the silicon powder precipitated in the drain trough can be cleaned regularly to ensure the recovery of the coolant.

[0037] For further information, see Figure 7 The liquid receiving box 14 is provided with a water pump 15, so as to pump the coolant in the liquid receiving box 14 back to the cooling mechanism 240 through the water pump 15, so as to realize the recycling of the coolant. Specifically, the water pump 15 is connected to the cooling mechanism 240, and when the chamfering tool is chamfering, the cooling mechanism sprays the coolant to the chamfering part at the same time, and the coolant flows to the drain tank, flows to the liquid receiving box through the drain pipe, and then the water pump pumps the coolant in the liquid receiving box back to the cooling mechanism, so as to form a coolant circulation system, realize the recycling of the coolant, and reduce the use cost of the coolant.

[0038] A method for chamfering a circular silicon material, using the circular silicon material chamfering device as described above, comprises the following steps: S1. placing the circular silicon material to be chamfered on a silicon material fixing assembly; S2, moving the chamfering assembly to a suitable position through the X-axis moving mechanism and the Z-axis moving mechanism to chamfer the circular silicon material; S3. After chamfering is completed, remove the circular silicon material and turn it over, and repeat the above steps to complete all chamfering.

[0039] Before processing the chamfer of circular silicon materials, you need to equip an electrical control cabinet, compile a PLC program to control the mechanical movement, and match it with an operating handle, which can control the feed movement of the X-axis moving mechanism and the Z-axis moving mechanism.

[0040] In the specific implementation process, in step S1, placing the circular silicon material to be chamfered on the silicon material fixing assembly includes: placing the circular silicon material to be chamfered on the suction cup 120 of the turntable. Specifically, firstly, the circular silicon material is roughly placed at the center of the suction cup, and then the dial indicator is sucked at a fixed position next to the turntable, and the dial indicator pointer is adjusted to contact the inner diameter or outer diameter surface of the circular silicon material, and the turntable is started. The turntable speed is 5r / min, and the position of the circular silicon material is adjusted according to the dial indicator indication until the diameter deviation is less than 0.1mm, and then the vacuum adsorption switch of the turntable is turned on to suck the circular silicon material tightly, and the turntable is stopped. Thus, the dial indicator is used to ensure that the circular silicon material is in the center of the turntable, and the distance between each chamfer and the chamfering tool is the same when the circular silicon material is chamfered, thereby ensuring the chamfering quality and improving the quality of the circular silicon material.

[0041] In the specific implementation process, in step S2, the chamfering assembly is moved to a suitable position by the X-axis moving mechanism and the Z-axis moving mechanism, and the circular silicon material is chamfered, including: first, the movement of the X-axis moving mechanism and the Z-axis moving mechanism is controlled by the operating handle to drive the chamfering tool to move to a suitable position, when the blade of the chamfering tool is close to the inner diameter or outer diameter edge of the circular silicon material, the Z-axis moving mechanism is controlled to be lifted a certain distance, and then the turntable is started, and the turntable speed is 200r / min.

[0042] Secondly, turn on the tool motor 230 switch and adjust the tool motor to a suitable speed. The motor speed can be adjusted between 0 and 10000. Among them, the tool motor speeds corresponding to tools of different materials are different. The tool motor speed corresponding to the diamond tool is 2500~3500r / min, the tool motor speed corresponding to the silicon carbide tool is 3500~4500r / min, the tool motor speed corresponding to the ceramic tool is 3500~4500r / min, and the tool motor speed corresponding to the resin tool is 4500~5500r / min. After selecting the appropriate speed of the tool motor according to the material of the tool, start chamfering.

[0043] When starting chamfering, first close the protective cover 11 of the workbench, turn on the cooling mechanism, and then operate the handle to control the Z-axis moving mechanism to move downward to drive the chamfering tool to feed downward, and start chamfering the round silicon material. While chamfering, the cooling mechanism sprays cutting fluid to the chamfering area to cool down and rinse the chamfering tool and the chamfering area. After the required chamfer size is poured out, control the Z-axis moving mechanism to move upward, drive the chamfering tool to lift up to stop the chamfering process, and turn off the turntable, tool motor and cooling mechanism.

[0044] In the specific implementation process, in step S3, after chamfering is completed, the circular silicon material is removed and turned over, and the above steps are repeated to complete all chamfering, including: turning off the vacuum adsorption switch of the turntable, removing the circular silicon material and turning it over, and repeating steps S1 and S2 after turning over, thereby completing all chamfering of the circular silicon material.

[0045] In some embodiments, the circular silicon material chamfering device of the present invention can process circular silicon materials with a size of 0-350 mm in height and 0-600 mm in diameter. The circular silicon material can be a cylindrical silicon material or a silicon wafer, or a silicon ring.

[0046] What is disclosed above is only a preferred embodiment of the present invention, which certainly cannot be used to limit the scope of rights of the present invention. A person skilled in the art can understand that all or part of the processes of the above embodiments and equivalent changes made according to the claims of the present invention still fall within the scope of the invention.

Claims

1. A circular silicon material chamfering device, characterized in that: It includes a workbench, a silicon material fixing component, a chamfering component, and a position adjustment mechanism; the silicon material fixing component, the chamfering component and the position adjustment mechanism are arranged on the workbench; the position adjustment mechanism includes an X-axis moving mechanism and a Z-axis moving mechanism, wherein the chamfering component is horizontally slidably installed on the X-axis moving mechanism so that the chamfering component moves horizontally along the X-axis direction; the X-axis moving mechanism slides vertically on the Z-axis moving mechanism so that the X-axis moving mechanism drives the chamfering component to move up and down along the Z-axis direction.

2. The circular silicon material chamfering device according to claim 1, characterized in that: The silicon material fixing assembly comprises a turntable and a suction cup, wherein the turntable is fixedly connected to the suction cup, and an adsorption strip is provided on the suction cup to adsorb and fix the circular silicon material on the turntable, and the turntable drives the circular silicon material to rotate.

3. The circular silicon material chamfering device according to claim 1, characterized in that: The chamfering assembly includes a chamfering tool, a tool clamping mechanism, a tool motor and a cooling mechanism; one end of the tool clamping mechanism clamps the chamfering tool, and the other end is connected to the tool motor, so that the tool motor drives the chamfering tool to chamfer through the tool clamping mechanism, and the cooling mechanism is arranged on one side of the chamfering tool to spray coolant onto the circular silicon material while the chamfering tool is chamfering.

4. The circular silicon material chamfering device according to claim 1, characterized in that: The X-axis moving mechanism and the Z-axis moving mechanism both include a ball screw and a guide rail.

5. The circular silicon material chamfering device according to claim 4, characterized in that: A first motor is provided at one end of the Z-axis moving mechanism, so that the ball screw on the Z-axis moving mechanism is driven by the first motor to move the X-axis moving mechanism up and down along the Z-axis; a second motor is provided at one end of the X-axis moving mechanism, so that the ball screw on the X-axis moving mechanism is driven by the second motor to move the chamfering assembly left and right along the X-axis.

6. The circular silicon material chamfering device according to claim 5, characterized in that: An accordion-type guide rail protective cover is installed on the guide rail.

7. The circular silicon material chamfering device according to claim 1, characterized in that: The edge of the workbench is provided with a protective cover to prevent the coolant from splashing.

8. The circular silicon material chamfering device according to claim 1, characterized in that: A drainage trough is arranged on the table top of the workbench, and a drainage port is opened on the drainage trough for installing a drainage pipe. A liquid receiving box is arranged directly below the drainage pipe so that the coolant flows from the drainage trough through the drainage pipe to the liquid receiving box.

9. The circular silicon material chamfering device according to claim 8, characterized in that: The liquid receiving box is provided with a water pump, so that the cooling liquid in the liquid receiving box can be pumped back to the cooling mechanism through the water pump to realize the recycling of the cooling liquid.

10. A method for chamfering a circular silicon material, using the circular silicon material chamfering device according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1. placing the circular silicon material to be chamfered on a silicon material fixing assembly; S2, moving the chamfering assembly to a suitable position through the X-axis moving mechanism and the Z-axis moving mechanism to chamfer the circular silicon material; S3. After chamfering is completed, remove the circular silicon material and turn it over, and repeat the above steps to complete all chamfering.

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