Cutting machine for semiconductor wafer processing

Abstract

The invention discloses a cutting machine for semiconductor wafer processing, which comprises a cutter body, a first linear slide rail, a U-shaped frame and a wafer, and the upper end of the U-shaped frame is fixedly provided with a second linear slide rail. According to the cutting device, the cutting knife shaft is inserted into the circular inserting groove, the rectangular protrusion is inserted into the rectangular clamping groove, and the cylindrical inserting block is inserted into the circular inserting groove, so that the cutting knife shaft is effectively clamped and fixed to the coupling rod, the stability of the cutting knife shaft is improved, and loosening during cutting is avoided; a cutting blade is arranged between two annular gaskets and connected to a cylindrical protrusion in a sleeving mode, so that a plurality of cylindrical clamping blocks penetrate through a plurality of overlapped first circular holes and second circular holes correspondingly, and a T-shaped sleeve cover is connected to the cylindrical protrusion in a sleeving mode, so that the cylindrical clamping blocks are inserted into annular grooves; the T-shaped sleeve cover is rotated to enable the threaded protrusion to be in threaded connection with the threaded groove, the cutting blade is effectively fixed to the cutting cutter shaft, and the cutting blade can be detached and replaced conveniently.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cutting machines, and in particular to a cutting machine for semiconductor wafer processing. Background Art

[0002] Semiconductor wafers are the dielectric substrates of integrated circuits. Integrated circuits are a way to miniaturize circuits. They are used to interconnect components such as transistors, resistors, inductors, and wiring required in the circuits and are manufactured on dielectric substrates. Semiconductor wafer cutting machines are commonly used wafer cutting equipment.

[0003] The authorized patent document with patent application number CN201721366020.6 discloses "a semiconductor wafer cutting machine", including a cutting mechanism and a control system. The cutting mechanism includes a cutting device and a position adjustment device. The cutting device includes a blade for cutting semiconductor wafers. The position adjustment device is connected to the cutting device for adjusting the position of the blade.

[0004] When the cutting machine is in use, the cutting blade shaft has poor stability and is easily loosened during cutting, and the blade installed at the free end of the cutting blade shaft is not convenient to remove and replace. A cutting machine for semiconductor wafer processing is now proposed to solve the above problems. Summary of the invention

[0005] The present invention proposes a cutting machine for semiconductor wafer processing, which is used to solve the technical problems in the background technology that the cutting shaft of the cutting machine is not stable enough during use, is easy to loosen during cutting, and the blade installed at the free end of the cutting shaft is not convenient to be disassembled and replaced.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A cutting machine for semiconductor wafer processing, comprising a cutter body, a first linear slide, a U-shaped frame and a wafer, a second linear slide being fixedly mounted on the upper end of the U-shaped frame, the first linear slide being located on the left side of the U-shaped frame and being vertically arranged with the second linear slide, a first guide block being arranged on the first linear slide, a cylinder being fixedly mounted on the upper end of the first guide block, the cutter body being fixedly mounted on the upper end of the cylinder piston rod, a coupling rod being arranged at the cutting end of the cutter body, a cutting knife shaft being fixedly clamped on the coupling rod, a cutting blade being arranged at the free end of the cutting knife shaft, a second linear slide being arranged with a second guide block, a buffer pad being fixedly connected to the upper end of the second guide block, a clamping mechanism being arranged on the upper end of the buffer pad, the wafer being placed on the buffer pad and in contact with the clamping mechanism.

[0008] Preferably, a circular slot is provided at one end of the coupling rod facing the cutting blade shaft, a rectangular protrusion is provided on the inner wall of the circular slot facing the cutting blade shaft, a rectangular slot is provided at one end of the cutting blade shaft facing the coupling rod, the cutting blade shaft is inserted in the circular slot, the rectangular protrusion is inserted in the rectangular slot, two symmetrically distributed circular slots are provided on the annular side wall of the cutting blade shaft located in the circular slot, first springs are fixedly connected to the relative inner walls of the two circular grooves, and columnar plug blocks are fixedly connected to the free ends of the two first springs, two symmetrically distributed columnar slots are provided on the annular inner wall of the circular slot, and the two columnar plug blocks are respectively inserted in the two columnar slots.

[0009] Preferably, a rectangular pull block is provided on the annular side wall of the columnar plug away from the first spring, a strip opening is provided on the annular inner wall of the columnar slot, the strip opening is communicated with the circular slot, and the rectangular pull block passes through the strip opening.

[0010] Preferably, the cutting blade shaft is provided with a cylindrical protrusion and a plurality of cylindrical blocks at one end away from the coupling rod, the cylindrical protrusion is provided with a threaded protrusion at one end away from the cutting blade shaft, and the plurality of cylindrical blocks are distributed in a cross shape, two annular washers are sleeved on the cylindrical protrusion, and the two annular washers are provided with a plurality of first circular holes, the cutting blade is provided with a circular through groove, the cylindrical protrusion passes through the circular through groove, the cutting blade is provided with a plurality of second circular holes, the cutting blade is arranged between the two annular washers, and the plurality of cylindrical blocks respectively pass through the plurality of first circular holes and the second circular holes, the cylindrical protrusion is sleeved on the end away from the cutting blade shaft, the T-shaped cover is provided with an annular groove at one end facing the cutting blade shaft, the plurality of cylindrical blocks are all inserted in the annular groove, a threaded groove is provided in the T-shaped cover, the threaded protrusion is threadedly connected to the threaded groove, and the T-shaped cover is in contact with the outer annular washer.

[0011] Preferably, the first circular hole and the second circular hole have the same aperture size, and the inner diameter of the annular gasket and the aperture size of the circular through groove are the same.

[0012] Preferably, the cylindrical protrusion and the threaded protrusion are integrally formed with the cutting blade shaft.

[0013] Preferably, the clamping mechanism includes two grooves arranged at the upper end of the buffer pad, and the two grooves are respectively arranged close to the left and right end side walls of the buffer pad, and a plurality of second springs are fixedly connected to the bottom of the two grooves, and the upper ends of the plurality of second springs on the same side are fixedly connected to the same L-shaped clip, and the lower ends of the horizontal sections of the two L-shaped clips are in contact with the chip.

[0014] Preferably, the buffer pad, the annular gasket and the L-shaped clip are all made of rubber.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. By inserting the cutting knife shaft into the circular slot, the rectangular protrusion is inserted into the rectangular slot, and the columnar plug is inserted into the circular slot, the cutting knife shaft is effectively clamped and fixed on the coupling rod, thereby improving the stability of the cutting knife shaft and avoiding looseness during cutting.

[0017] 2. By placing the cutting blade between two annular washers and sleeved on the cylindrical protrusion, a number of cylindrical blocks are respectively passed through a number of overlapping first circular holes and second circular holes, and a T-shaped cover is sleeved on the cylindrical protrusion so that a number of cylindrical blocks are inserted into the annular groove. The T-shaped cover is rotated so that the threaded protrusion is threadedly connected with the threaded groove, thereby effectively fixing the cutting blade on the cutting shaft and facilitating the removal and replacement of the cutting blade. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the structure of a cutting machine for semiconductor wafer processing proposed by the present invention;

[0019] Figure 2 A perspective schematic diagram of a semiconductor wafer processing cutting machine proposed by the present invention;

[0020] Figure 3 for Figure 2 A partial enlarged view of the middle A;

[0021] Figure 4 for Figure 3 A partial enlarged view of point B in the middle;

[0022] Figure 5 This is a schematic structural diagram of a columnar insert block and a rectangular pull block of a semiconductor wafer processing cutting machine proposed by the present invention;

[0023] Figure 6 for Figure 2 A partial enlarged view of point C in the middle;

[0024] Figure 7 This is a schematic diagram of the split structure of the connection between the cutting shaft and the cutting blade of a cutting machine for semiconductor wafer processing proposed by the present invention;

[0025] Figure 8 for Figure 2 A partial enlarged view of point D in the middle.

[0026] In the figure: 1 cutter body, 2 first linear slide, 3 U-shaped frame, 4 wafer, 5 second linear slide, 6 first guide block, 7 cylinder, 8 coupling rod, 9 cutting knife shaft, 10 cutting blade, 11 second guide block, 12 buffer pad, 13 circular slot, 14 rectangular protrusion, 15 rectangular card slot, 16 circular groove, 17 first spring, 18 columnar plug block, 19 columnar slot, 20 rectangular pull block, 21 strip opening, 22 columnar protrusion, 23 columnar card block, 24 threaded protrusion, 25 annular gasket, 26 first circular hole, 27 circular through groove, 28 second circular hole, 29 T-type cover, 30 annular groove, 31 threaded groove, 32 groove, 33 second spring, 34 L-type clip. DETAILED DESCRIPTION

[0027] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0028] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0029] Reference Figure 1-8As shown, a semiconductor wafer processing cutting machine includes a cutter body 1, a first linear slide 2, a U-shaped frame 3 and a wafer 4. The upper end of the U-shaped frame 3 is fixedly installed with a second linear slide 5. The first linear slide 2 cooperates with a first guide block 6 to drive the cutter body 1 to adjust the cutting position. The model of the first linear slide 2 is: HSR40A, and the model of the second linear slide 5 is: HSR15A. The second linear slide 5 cooperates with the second guide block 11 to drive the wafer 4 clamped on the buffer pad 12 to move. The first linear slide 2 is located on the left side of the U-shaped frame 3 and is connected to the second linear slide 5 is vertically arranged, a first guide block 6 is arranged on the first linear slide rail 2, a cylinder 7 is fixedly installed on the upper end of the first guide block 6, the cylinder 7 is used to drive the cutter body 1 to perform lifting and cutting operations, the model of the cylinder 7 is: SCD16X32-32-LB, the cutter body 1 is fixedly installed on the upper end of the piston rod of the cylinder 7, a coupling rod 8 is arranged on the cutting end of the cutter body 1, a cutting blade shaft 9 is fixedly clamped on the coupling rod 8, a circular slot 13 is arranged on one end of the coupling rod 8 facing the cutting blade shaft 9, a rectangular protrusion 14 is arranged on the inner wall of the circular slot 13 facing the cutting blade shaft 9, and the cutting blade shaft 9 is cut by the coupling rod 8. A rectangular slot 15 is provided at one end of the cutter shaft 9 facing the coupling rod 8, the cutter shaft 9 is inserted into the circular slot 13, the rectangular protrusion 14 is inserted into the rectangular slot 15, and the rectangular protrusion 14 inserted into the rectangular slot 15 can effectively limit the cutter shaft 9 in the circular slot 13. Two symmetrically distributed circular slots 16 are provided on the annular side wall of the cutter shaft 9 located in the circular slot 13, and first springs 17 are fixedly connected to the opposite inner walls of the two circular slots 16. The elastic performance of the first spring 17 enables the columnar plug 18 to be inserted into the columnar slot 19. The free ends of the two first springs 17 are fixedly connected with a cylindrical plug-in block 18. Two symmetrically distributed cylindrical slots 19 are provided on the annular inner wall of the circular slot 13. The two cylindrical plug-in blocks 18 are respectively inserted in the two cylindrical slots 19. A rectangular pull block 20 is provided on the annular side wall of the cylindrical plug-in block 18 away from the first spring 17. A strip opening 21 is provided on the annular inner wall of the cylindrical slot 19. The strip opening 21 is connected to the circular slot 13. The rectangular pull block 20 passes through the strip opening 21. The rectangular pull block 20 in the strip opening 21 facilitates pulling the cylindrical plug-in block 18 to move.

[0030] A cutting blade 10 is provided at the free end of the cutting shaft 9, and a cylindrical protrusion 22 and a plurality of cylindrical blocks 23 are provided at one end of the cutting shaft 9 away from the coupling rod 8, a threaded protrusion 24 is provided at one end of the cylindrical protrusion 22 away from the cutting shaft 9, and the plurality of cylindrical blocks 23 are distributed in a cross shape, and two annular washers 25 are sleeved on the cylindrical protrusion 22, and the annular washers 25 made of rubber products can provide protection for the cutting blade 10, and a plurality of first circular holes 26 are provided on the two annular washers 25, and a circular through groove 27 is provided on the cutting blade 10, and the cylindrical protrusion 22 penetrates the circular through groove 27, and a plurality of second circular holes 28 are provided on the cutting blade 10, and the cutting blade 10 is arranged between the two annular washers 25, and a plurality of cylindrical blocks 23 respectively penetrate the plurality of first circular holes 26 and the second circular holes 28, and the plurality of cylindrical blocks 23 are used for the annular washers 25 and the cutting blade 10. The cutting blade 10 is limited to prevent the cutting blade 10 from loosening during cutting. A T-shaped sleeve cover 29 is sleeved on the end of the cylindrical protrusion 22 away from the cutting blade shaft 9. An annular groove 30 is provided on the end of the T-shaped sleeve cover 29 facing the cutting blade shaft 9. Several cylindrical blocks 23 are inserted into the annular groove 30. A threaded groove 31 is provided in the T-shaped sleeve cover 29. The threaded protrusion 24 is threadedly connected with the threaded groove 31. When the threaded protrusion 24 is threadedly connected with the threaded groove 31, the T-shaped sleeve cover 29 can be fixedly sleeved on the cylindrical protrusion 22, and the annular gasket 25 and the cutting blade 10 are fixed. The T-shaped sleeve cover 29 is in contact with the outer annular gasket 25. The aperture size of the first circular hole 26 and the second circular hole 28 is the same. The inner diameter of the annular gasket 25 is the same as the aperture size of the circular through groove 27. The cylindrical protrusion 22 and the threaded protrusion 24 are both integrally formed with the cutting blade shaft 9.

[0031] The second linear slide 5 is provided with a second guide block 11, and a buffer pad 12 is fixedly connected to the upper end of the second guide block 11. A clamping mechanism is provided at the upper end of the buffer pad 12. The wafer 4 is placed on the buffer pad 12 and contacts the clamping mechanism. The second linear slide 5 cooperates with the second guide block 11 to drive the wafer 4 clamped on the buffer pad 12 to move. The clamping mechanism includes two grooves 32 arranged at the upper end of the buffer pad 12. The two grooves 32 are respectively arranged near the left and right end side walls of the buffer pad 12. A plurality of second springs 33 are fixedly connected to the bottoms of the two grooves 32. The plurality of second springs 33 The elastic property enables the L-shaped clip 34 to clamp and fix the chip 4 placed on the buffer pad 12. The chip 4 is pressed on the rubber buffer pad 12, and the chip 4 is slid to the lower ends of the two L-shaped clips 34 while being pressed. After the chip 4 is released, the L-shaped clip 34 cooperates with a plurality of second springs 33 to clamp and fix it. The upper ends of the plurality of second springs 33 on the same side are fixedly connected to the same L-shaped clip 34. The lower ends of the horizontal sections of the two L-shaped clips 34 are in contact with the chip 4. The buffer pad 12, the annular gasket 25 and the L-shaped clip 34 are all rubber products.

[0032] When the present invention is in use, one end of the cutting blade shaft 9 provided with the rectangular slot 15 is manually inserted into the circular slot 13 on the coupling rod 8, and the two rectangular pull blocks 20 are manually pressed, so that the rectangular pull block 20 drives the columnar insert block 18 to shrink into the circular slot 16 and compress the first spring 17, until the rectangular pull block 20 is inserted into the strip opening 21 and then released. At this time, the rectangular protrusion 14 in the circular slot 13 is inserted into the rectangular slot 15, and the columnar insert block 18 is inserted into the columnar slot 19 on the circular slot 13, effectively clamping and fixing the cutting blade shaft 9 on the coupling rod 8, improve the stability of the cutting blade shaft 9, avoid loosening during cutting, and when disassembling, just press the rectangular pull block 20 to separate from the strip opening 21, so that the rectangular pull block 20 drives the columnar plug block 18 to separate from the columnar slot 19, pull the cutting blade shaft 9 to separate the rectangular protrusion 14 from the rectangular slot 15, and then the cutting blade shaft 9 can be pulled out from the circular slot 13 in the coupling rod 8, which is convenient for disassembly and assembly; press the wafer 4 on the buffer pad 12 and slide to the lower end of the two L-shaped clips 34, so that the second spring 33 in the groove 32 drives the two L-shaped clips 3 The wafer 4 is clamped and fixed, and the cutting blade 10 is placed between the two annular washers 25 so that a plurality of first circular holes 26 and second circular holes 28 with the same aperture size overlap, and the cylindrical protrusion 22 is set to penetrate the two annular washers 25 and the circular through groove 27 on the cutting blade 10, so that a plurality of cylindrical blocks 23 on the cutting blade shaft 9 are respectively set to penetrate a plurality of overlapping first circular holes 26 and second circular holes 28, and the T-shaped cover 29 is set to be sleeved on the cylindrical protrusion 22 so that a plurality of cylindrical blocks 23 are inserted into the annular holes on the T-shaped cover 29. In the groove 30, rotate the T-shaped sleeve cover 29 to make the threaded protrusion 24 and the threaded groove 31 threadedly connected, effectively fixing the cutting blade 10 on the cutting tool shaft 9. When disassembling, just twist the T-shaped sleeve cover 29 to separate the threaded protrusion 24 from the threaded groove 31, and pull the cutting blade 10 to separate from the cylindrical protrusion 22, so that the cutting blade 10 can be easily replaced. Start the first linear slide 2, the second linear slide 5 and the cylinder 7, so that the cutter body 1 cooperates with the coupling rod 8 and the cutting tool shaft 9 to drive the cutting blade 10 to cut the wafer 4 on the buffer pad 12.

[0033] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A cutting machine for semiconductor wafer processing, comprising a cutter body (1), a first linear slide rail (2), a U-shaped frame (3) and a wafer (4), wherein a second linear slide rail (5) is fixedly mounted on the upper end of the U-shaped frame (3), the first linear slide rail (2) is located on the left side of the U-shaped frame (3) and is arranged vertically with the second linear slide rail (5), characterized in that: The first linear slide rail (2) is provided with a first guide block (6), the upper end of which is fixedly mounted with a cylinder (7), the cutter body (1) is fixedly mounted on the upper end of the piston rod of the cylinder (7), the cutting end of the cutter body (1) is provided with a coupling rod (8), a cutting shaft (9) is fixedly clamped on the coupling rod (8), a cutting blade (10) is provided at the free end of the cutting shaft (9), the second linear slide rail (5) is provided with a second guide block (11), the upper end of the second guide block (11) is fixedly connected with a buffer pad (12), the upper end of the buffer pad (12) is provided with a clamping mechanism, the chip (4) is placed on the buffer pad (12) and is in contact with the clamping mechanism.

2. A semiconductor wafer processing cutting machine according to claim 1, characterized in that: The end of the coupling rod (8) facing the cutting blade shaft (9) is provided with a circular slot (13), the inner wall of the circular slot (13) facing the cutting blade shaft (9) is provided with a rectangular protrusion (14), the end of the cutting blade shaft (9) facing the coupling rod (8) is provided with a rectangular card slot (15), the cutting blade shaft (9) is inserted into the circular slot (13), the rectangular protrusion (14) is inserted into the rectangular card slot (15), and the cutting blade shaft (9) is located in the circular slot. Two symmetrically distributed circular grooves (16) are provided on the annular side wall inside the circular slot (13); first springs (17) are fixedly connected to the opposite inner walls of the two circular grooves (16); free ends of the two first springs (17) are fixedly connected to columnar plug blocks (18); two symmetrically distributed columnar slots (19) are provided on the annular inner wall of the circular slot (13); the two columnar plug blocks (18) are respectively inserted into the two columnar slots (19).

3. A semiconductor wafer processing cutting machine according to claim 2, characterized in that: A rectangular pull block (20) is provided on the annular side wall of the columnar plug block (18) away from the first spring (17), a strip opening (21) is provided on the annular inner wall of the columnar slot (19), the strip opening (21) is connected to the circular slot (13), and the rectangular pull block (20) passes through the strip opening (21).

4. A semiconductor wafer processing cutting machine according to claim 1, characterized in that: The end of the cutting blade shaft (9) away from the coupling rod (8) is provided with a cylindrical protrusion (22) and a plurality of cylindrical blocks (23); the end of the cylindrical protrusion (22) away from the cutting blade shaft (9) is provided with a threaded protrusion (24); the plurality of cylindrical blocks (23) are arranged in a cross shape; two annular washers (25) are sleeved on the cylindrical protrusion (22); the two annular washers (25) are provided with a plurality of first circular holes (26); the cutting blade (10) is provided with a circular through groove (27); the cylindrical protrusion (22) passes through the circular through groove (27); the cutting blade (10) is provided with a plurality of second circular holes (28); the cutting The blade (10) is arranged between two annular washers (25), and a plurality of the columnar blocks (23) are respectively arranged to penetrate a plurality of first circular holes (26) and second circular holes (28). The end of the columnar protrusion (22) away from the cutting blade shaft (9) is sleeved with a T-shaped sleeve cover (29), and the end of the T-shaped sleeve cover (29) facing the cutting blade shaft (9) is provided with an annular groove (30), and the plurality of the columnar blocks (23) are all inserted into the annular groove (30), and a threaded groove (31) is provided in the T-shaped sleeve cover (29). The threaded protrusion (24) is threadedly connected to the threaded groove (31), and the T-shaped sleeve cover (29) is in contact with the outer annular washer (25).

5. A semiconductor wafer processing cutting machine according to claim 4, characterized in that: The first circular hole (26) and the second circular hole (28) have the same diameter, and the inner diameter of the annular gasket (25) and the diameter of the circular through groove (27) have the same diameter.

6. A semiconductor wafer processing cutting machine according to claim 4, characterized in that: The cylindrical protrusion (22) and the threaded protrusion (24) are both integrally formed with the cutting blade shaft (9).

7. A semiconductor wafer processing cutting machine according to claim 4, characterized in that: The clamping mechanism comprises two grooves (32) arranged at the upper end of the buffer pad (12), the two grooves (32) being respectively arranged close to the left and right end side walls of the buffer pad (12), a plurality of second springs (33) being fixedly connected to the bottom of the two grooves (32), the upper ends of the plurality of second springs (33) on the same side being fixedly connected to the same L-shaped clip (34), and the lower ends of the horizontal sections of the two L-shaped clips (34) being in contact with the wafer (4).

8. A semiconductor wafer processing cutting machine according to claim 7, characterized in that: The buffer pad (12), the annular gasket (25) and the L-shaped clip (34) are all made of rubber.

Images