Multifunctional cooling structure for rapidly cooling copper wire tin layer

Abstract

The invention relates to a multifunctional cooling structure for rapidly cooling a copper wire tin layer, and belongs to the technical field of tinned copper wire processing equipment. The multifunctional cooling structure for rapid cooling of the copper wire tin layer comprises a liquid storage shell, the liquid storage shell is filled with cooling liquid, the top of the liquid storage shell is fixedly connected with two side plates which are symmetrically distributed, and two sets of semiconductor chilling plates which are evenly distributed are installed on the inner side of the liquid storage shell in an embedded mode; multiple cooling is achieved through the cooling module, preliminary cooling of a copper wire tin layer is achieved through the air cooling assembly, and the problem that a large amount of cooling liquid is lost due to the fact that the cooling liquid is directly sprayed to the surface of the tin layer and a large amount of water vapor is generated due to large temperature difference is solved; and the water cooling assembly is matched for secondary cooling, so that the cooling effect is effectively improved, the purpose of stepped cooling is achieved, and the situation that the forming effect of the tin layer is affected by the temperature difference caused by spraying is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of tinned copper wire processing equipment, in particular to a multifunctional cooling structure for rapid cooling of a tin layer of a copper wire. Background Art

[0002] Tinned copper wire refers to copper wire with a thin layer of metal tin on the surface. Tinned copper wire is relatively soft and has good conductivity. Compared with bare copper wire, it has stronger corrosion resistance and oxidation resistance, which can greatly extend the service life of weak current cables.

[0003] After searching, a Chinese patent discloses a tinned copper wire cooling device (publication number CN217839093U). This patented technology extracts the coolant from the storage box through a liquid pump, and the coolant after heat exchange flows back to the storage box. The output end of the refrigeration equipment passes through the cooling box and extends to the inside of the storage box. The refrigeration equipment is located outside the cooling box, which is conducive to heat dissipation, thereby achieving the effect of recycling cooling water and reducing resource waste. However, the method of directly spraying the coolant is prone to produce a large amount of water vapor due to the high surface temperature of the tin layer and the large temperature difference between the two, resulting in the loss of coolant. Therefore, technical personnel in this field provide a multifunctional cooling structure for rapid cooling of the tin layer of copper wire to solve the problems raised in the above background technology. Summary of the invention

[0004] Based on this, it is necessary to provide a multifunctional cooling structure for rapid cooling of the copper wire tin layer, in order to address the problem that the existing method of directly spraying coolant is prone to the loss of coolant due to the high surface temperature of the tin layer and the large temperature difference between the two, which produces a large amount of water vapor.

[0005] A multifunctional cooling structure for rapid cooling of a copper wire tin layer, comprising: A liquid storage shell, wherein the interior of the liquid storage shell is filled with coolant, the top of the liquid storage shell is fixedly connected with two symmetrically distributed side plates, the inner side of the liquid storage shell is embedded with two groups of uniformly distributed semiconductor cooling sheets, each group of semiconductor cooling sheets has no less than five, and condensing tubes are fixedly connected between the two groups of semiconductor cooling sheets, and a temperature sensor is arranged on one side of the liquid storage shell; Cooling module; The cooling module comprises an air cooling component and an auxiliary component arranged on the top of the liquid storage shell, and a water cooling component located between the two side plates is arranged on the opposite sides of the air cooling component and the auxiliary component; Among them, the air cooling component includes a mounting block fixedly connected to the inner wall of the liquid storage shell, the top of the mounting block passes through the liquid storage shell, the surface of the mounting block is provided with evenly distributed inlet holes, the top of the mounting block is fixedly connected to a connection box, a filter is embedded in one side of the connection box, and evenly distributed fans are arranged inside the connection box.

[0006] In one embodiment, one side of the mounting block is fixedly connected with evenly distributed annular tubes, the annular tubes are coaxially arranged with the adjacent introduction holes, the surface of the annular tubes is connected with a conduit, and the other end of the conduit is connected with the connection box.

[0007] In one embodiment, a connecting pipe distributed in an annular manner is embedded in the inner wall of the introduction hole, one end of the connecting pipe passes through the introduction hole and is connected to the adjacent annular pipe, and the surface of the connecting pipe is provided with uniformly distributed air injection holes.

[0008] In one embodiment, the auxiliary component includes a connecting block fixedly connected to the top of the liquid storage shell, the surface of the connecting block is provided with an outlet hole coaxially arranged with the inlet hole, the inner wall of the outlet hole is provided with an installation cavity, and the inner wall of the installation cavity is provided with a liquid return groove connected to the liquid storage shell.

[0009] In one of the embodiments, the inner wall of the installation cavity is fixedly connected with evenly distributed extrusion blocks, the extrusion blocks are hollow, and the side of the extrusion blocks close to the center of the installation cavity is an arc-shaped surface, and the surface of the extrusion blocks is provided with evenly distributed water inlet holes, and the surface of the extrusion blocks is provided with evenly distributed drainage grooves.

[0010] In one embodiment, the water cooling component includes a mounting ring rotatably connected to one side of the connecting block, a gear ring is fixedly connected to the surface of the mounting ring, two adjacent gear rings are meshed with each other, a motor is provided on one side of the connecting block, a gear is fixedly connected to the output shaft of the motor, the gear is meshed with the adjacent gear rings, and a water absorbent block located inside the mounting cavity is provided on one side of the mounting ring, the diameter of the water absorbent block is smaller than the inner diameter of the mounting cavity, and the water absorbent block is a component made of absorbent cotton material.

[0011] In one of the embodiments, a connecting plate distributed in an annular manner is fixedly connected to the other side of the mounting ring, a through groove is provided inside the connecting plate, and spray holes evenly distributed and connected to the through groove are provided on the surface of the connecting plate.

[0012] In one embodiment, a swivel is rotatably connected to one side of the mounting block, a cavity is provided on the surface of the swivel, one end of the connecting plate away from the mounting ring is fixedly connected to the swivel, and the through groove is communicated with the cavity.

[0013] In one embodiment, the inner wall of the cavity is slidably connected with a connecting ring, the outer side of the connecting ring passes through the cavity and is fixedly connected to the inner wall of the mounting block, and an introduction tube is provided on the surface of the connecting ring, one end of the introduction tube passes through the connecting ring and is connected to the cavity.

[0014] In one embodiment, a connecting cavity is opened inside the mounting block, a pump body is arranged inside the liquid storage shell, the water outlet end of the pump body is connected to a water outlet pipe, the water outlet pipe is connected to the connecting cavity, and the other end of the inlet pipe is connected to the connecting cavity.

[0015] The multifunctional cooling structure for rapid cooling of the copper wire tin layer achieves multiple cooling through the cooling module, and uses the air cooling component to achieve the initial cooling of the copper wire tin layer, thereby avoiding the problem of large loss of coolant due to large temperature difference caused by large amount of water vapor generated by directly spraying the coolant on the surface of the tin layer. The air cooling component is used to reduce the temperature difference after initial cooling, and then the water cooling component is used to perform secondary cooling, which effectively improves the cooling effect, achieves the purpose of step cooling, and avoids the temperature difference caused by direct spraying affecting the forming effect of the tin layer. The cooperation between the auxiliary components and the water cooling components can clean the surface of the copper wire after water cooling, actively absorb the coolant adhering to the surface, and avoid the adhering coolant affecting subsequent processing. At the same time, the water adsorbed by the water absorbent block can be squeezed out under the action of the extrusion block to maintain a good adsorption effect of the water absorbent block. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction is given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a schematic diagram of the separation of the cooling module and the liquid storage shell of the present invention; Figure 3 It is a schematic diagram of the connection between the condenser tube and the semiconductor refrigeration sheet of the present invention; Figure 4 It is a connection diagram of the motor and the connection block of the present invention; Figure 5 It is a schematic diagram of the connection between the mounting ring, the swivel ring and the connecting plate of the present invention; Figure 6 A partial cross-sectional view of the auxiliary component of the present invention; Figure 7 It is a partial cross-sectional view of the air-cooling component of the present invention.

[0018] Reference numerals: 1. Liquid storage shell; 2. Cooling module; 101. Side plate; 102. Temperature sensor; 103. Condenser; 104. Semiconductor refrigeration chip; 21. Air cooling assembly; 2101. Mounting block; 2102. Inlet hole; 2103. Connecting pipe; 2104. Conduit; 2105. Connecting box; 2106. Fan; 2107. Filter; 2108. Ring pipe; 22. Water cooling assembly; 2201. Motor; 2202. Gear; 2203. Installation Ring; 2204, gear ring; 2205, water absorption block; 2206, connecting plate; 2207, swivel; 2208, connecting ring; 2209, inlet pipe; 2210, through groove; 2211, spray hole; 2212, cavity; 2213, pump body; 2214, water outlet pipe; 2215, connecting cavity; 23, auxiliary component; 2301, connecting block; 2302, installation cavity; 2303, outlet hole; 2304, extrusion block; 2305, return liquid tank. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of the present invention are for illustrative purposes only and do not represent the only implementation method.

[0021] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0022] In the present invention, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, a first feature being “above”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0023] Unless otherwise defined, all technical and scientific terms used in the specification of the present invention have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in the specification of the present invention includes any and all combinations of one or more related listed items.

[0024] Combine the following Figure 1-Figure 7 The invention describes a multifunctional cooling structure for rapid cooling of a copper wire tin layer.

[0025] like Figure 1-Figure 7 As shown, in one embodiment, a multifunctional cooling structure for rapid cooling of a copper wire tin layer comprises: A liquid storage shell 1, the interior of which is filled with coolant, two symmetrically distributed side plates 101 are fixedly connected to the top of the liquid storage shell 1, two groups of uniformly distributed semiconductor cooling sheets 104 are embedded and installed on the inner side of the liquid storage shell 1, and the number of semiconductor cooling sheets 104 in each group is not less than five, and a condensing tube 103 is fixedly connected between the two groups of semiconductor cooling sheets 104, and a temperature sensor 102 is arranged on one side of the liquid storage shell 1; Cooling module 2; The cooling module 2 includes an air cooling component 21 and an auxiliary component 23 disposed on the top of the liquid storage shell 1, and a water cooling component 22 located between the two side plates 101 is disposed on the opposite sides of the air cooling component 21 and the auxiliary component 23; Among them, the air cooling component 21 includes a mounting block 2101 fixedly connected to the inner wall of the liquid storage shell 1, the top of the mounting block 2101 passes through the liquid storage shell 1, the surface of the mounting block 2101 is provided with evenly distributed inlet holes 2102, the top of the mounting block 2101 is fixedly connected with a connecting box 2105, one side of the connecting box 2105 is embedded with a filter 2107, and the interior of the connecting box 2105 is provided with evenly distributed fans 2106.

[0026] The tinned copper wire is passed through the air cooling assembly 21, the water cooling assembly 22 and the auxiliary assembly 23 in sequence for cooling. During this process, the copper wire passes through the introduction hole 2102 on the mounting block 2101; Specifically, the temperature sensor 102 is an inserted temperature sensor 102, wherein the detection end of the temperature sensor 102 passes through the liquid storage shell 1 and extends to the inner side of the liquid storage shell 1 to contact the coolant, and can be used to detect the temperature of the coolant, and a corresponding controller is provided that can read the temperature reading detected by the temperature sensor 102. When the temperature of the coolant is too high, the semiconductor refrigeration sheet 104 is turned on to transfer cold energy to the coolant through the condenser 103, which is used to cool the coolant. The cold surface of the semiconductor refrigeration sheet 104 is in contact with the condenser 103, and the hot surface of the semiconductor refrigeration sheet 104 is provided with a heat sink.

[0027] like Figure 1 , Figure 2 and Figure 7 As shown, one side of the mounting block 2101 is fixedly connected with an evenly distributed annular tube 2108, the annular tube 2108 is coaxially arranged with the adjacent inlet hole 2102, the surface of the annular tube 2108 is connected with a conduit 2104, and the other end of the conduit 2104 is connected to the connection box 2105.

[0028] The inner wall of the introduction hole 2102 is embedded with a connecting pipe 2103 distributed in an annular manner. One end of the connecting pipe 2103 passes through the introduction hole 2102 and is connected to the adjacent annular pipe 2108. The surface of the connecting pipe 2103 is provided with uniformly distributed air injection holes. By starting the fan 2106, the outside air can be filtered through the filter 2107 and then introduced into the interior of the connecting box 2105. The filtered airflow can be injected into the interior of the annular tube 2108 through the conduit 2104, and introduced into the interior of the connecting tube 2103 connected thereto, and finally sprayed out evenly through the jet hole, thereby achieving the effect of preliminary cooling of the surface of the copper wire passing through the introduction hole 2102 by air cooling.

[0029] like Figure 1 , Figure 2 and Figure 6 As shown, the auxiliary component 23 includes a connecting block 2301 fixedly connected to the top of the liquid storage shell 1, the surface of the connecting block 2301 is provided with an outlet hole 2303 coaxially arranged with the inlet hole 2102, the inner wall of the outlet hole 2303 is provided with an installation cavity 2302, and the inner wall of the installation cavity 2302 is provided with a liquid return groove 2305 connected to the liquid storage shell 1.

[0030] The inner wall of the installation cavity 2302 is fixedly connected with evenly distributed extrusion blocks 2304, the extrusion blocks 2304 are hollow, and the side of the extrusion blocks 2304 close to the center of the installation cavity 2302 is arc-shaped, and the surface of the extrusion blocks 2304 is provided with evenly distributed water inlet holes, and the surface of the extrusion blocks 2304 is provided with evenly distributed drainage grooves.

[0031] The auxiliary component 23 is mainly used for the dehydration work after the copper wire is initially cooled by air through the air cooling component 21 and cooled by water through the water cooling component 22. The water adhering to the surface of the copper wire is recovered to the inside of the installation cavity 2302, and is guided back to the inside of the liquid storage shell 1 through the return liquid groove 2305 for storage and reuse, which effectively reduces the loss of coolant and reduces the cost of use.

[0032] like Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, the water cooling component 22 includes a mounting ring 2203 rotatably connected to one side of a connecting block 2301, a gear ring 2204 is fixedly connected to the surface of the mounting ring 2203, two adjacent gear rings 2204 are meshed with each other, a motor 2201 is provided on one side of the connecting block 2301, an output shaft of the motor 2201 is fixedly connected to a gear 2202, the gear 2202 is meshed with the adjacent gear ring 2204, a water absorbent block 2205 located inside the mounting cavity 2302 is provided on one side of the mounting ring 2203, a diameter of the water absorbent block 2205 is smaller than the inner diameter of the mounting cavity 2302, and the water absorbent block 2205 is a component made of absorbent cotton material.

[0033] A ring-shaped connecting plate 2206 is fixedly connected to the other side of the mounting ring 2203 . A through groove 2210 is formed inside the connecting plate 2206 . A spray hole 2211 evenly distributed and connected to the through groove 2210 is formed on the surface of the connecting plate 2206 .

[0034] A swivel 2207 is rotatably connected to one side of the mounting block 2101 . A cavity 2212 is formed on the surface of the swivel 2207 . One end of the connecting plate 2206 away from the mounting ring 2203 is fixedly connected to the swivel 2207 , and the through slot 2210 is in communication with the cavity 2212 .

[0035] The inner wall of the cavity 2212 is slidably connected with a connecting ring 2208, the outer side of the connecting ring 2208 passes through the cavity 2212 and is fixedly connected to the inner wall of the mounting block 2101, and the surface of the connecting ring 2208 is provided with an introduction tube 2209, one end of the introduction tube 2209 passes through the connecting ring 2208 and is connected to the cavity 2212.

[0036] A connecting cavity 2215 is provided inside the mounting block 2101, a pump body 2213 is provided inside the liquid storage shell 1, a water outlet end of the pump body 2213 is connected to a water outlet pipe 2214, the water outlet pipe 2214 is connected to the connecting cavity 2215, and the other end of the inlet pipe 2209 is connected to the connecting cavity 2215.

[0037] The gear 2202 can be driven to rotate by starting the motor 2201, and in this process, the gear ring 2204 connected thereto can be driven to rotate synchronously, so that the gear ring 2204 under the mutual meshing action can synchronously drive the mounting ring 2203 connected thereto to rotate, and in this process, the connecting plate 2206 and the water absorption block 2205 connected thereto can be driven to rotate; Specifically, both sides of the water absorption block 2205 are fixedly connected with connection plates that are slidably connected to the inner wall of the installation cavity 2302, so as to keep the water absorption block 2205 stable during the rotation process inside the installation cavity 2302; By starting the pump body 2213, the coolant stored in the liquid storage shell 1 can be introduced into the interior of the connecting cavity 2215 through the water outlet pipe 2214, and introduced into the cavity 2212 connected thereto through the inlet pipe 2209, and the connecting plate 2206 can drive the rotating ring 2207 to rotate synchronously during the rotation process. Since the setting of the connecting ring 2208 can keep the position of the inlet pipe 2209 fixed and seal the cavity 2212, the coolant injected into the cavity 2212 will not leak and is introduced into the interior of the through groove 2210 and sprayed out through the spray hole 2211, wherein the spray hole 2211 can be installed with a nozzle, and the nozzle can adopt a mist nozzle to increase the contact area between the sprayed coolant and the surface of the copper wire. The specific method should be selected according to the actual situation, and no further elaboration is made here. The sprayed coolant can achieve secondary cooling of the surface of the copper wire, effectively improving the cooling effect; After the secondary cooling, the surface of the copper wire will adhere to the coolant, and in the process of passing through the outlet hole 2303, it can contact the inner side of the water absorbent block 2205, so that the coolant adhered to its surface is absorbed by the water absorbent block 2205 made of the absorbent cotton material component, reducing the situation of water adhering to the surface of the copper wire, which is convenient for subsequent storage operations, and the water absorbent block 2205 can rotate synchronously with the mounting ring 2203. Under the action of the auxiliary component 23, the water absorbent block 2205 is continuously squeezed by the extrusion block 2304 during its rotation, so that the coolant adsorbed by it can be introduced into the interior of the extrusion block 2304 through the water inlet hole opened on the surface of the extrusion block 2304, and discharged through the drainage groove opened on the surface of the extrusion block 2304, and finally guided back to the interior of the liquid storage shell 1 through the return liquid groove 2305 for storage and reuse, and the good water absorption effect of the water absorbent block 2205 can be maintained by extrusion.

[0038] Working principle: The tinned copper wire is passed through the air cooling component 21, the water cooling component 22 and the auxiliary component 23 in turn for cooling. In this process, the outside air can be filtered through the filter 2107 and introduced into the interior of the connecting box 2105 by starting the fan 2106. The filtered airflow can be injected into the interior of the annular tube 2108 through the conduit 2104, and introduced into the interior of the connecting tube 2103 connected thereto, and finally sprayed out evenly through the jet hole, so as to achieve the effect of preliminary air cooling on the surface of the copper wire passing through the introduction hole 2102. By starting the pump body 2213, the coolant stored in the liquid storage shell 1 can be introduced into the interior of the connecting cavity 2215 through the water outlet pipe 2214, and introduced into the cavity 2212 connected thereto through the introduction pipe 2209. The connecting plate 2206 can drive the rotating ring 2207 to rotate synchronously during the rotation. Since the connecting ring 220 The setting of 8 can keep the position of the inlet pipe 2209 fixed and seal the cavity 2212, so that the coolant injected into the cavity 2212 will not leak and is introduced into the interior of the through groove 2210 and sprayed out through the spray hole 2211, wherein the spray hole 2211 can be installed with a nozzle, and the nozzle can adopt a mist nozzle to increase the contact area between the sprayed coolant and the surface of the copper wire. The specific method should be selected according to the actual situation and will not be elaborated here. The sprayed coolant can achieve secondary cooling of the surface of the copper wire, effectively improving the cooling effect. The setting of the auxiliary component 23 is mainly used for the dehydration work after the copper wire is initially cooled by air cooling component 21 and cooled by water cooling component 22, and the water adhering to the surface of the copper wire is recovered to the interior of the installation cavity 2302, and it is guided back to the interior of the liquid storage shell 1 through the return liquid groove 2305 for storage and reuse, effectively reducing the loss of coolant and reducing the cost of use.

[0039] It should be noted that the temperature sensor 102, semiconductor refrigeration plate 104, fan 2106, motor 2201, pump body 2213 and controller in the above description are all relatively mature devices in existing technology applications. The specific models can be selected according to actual needs. At the same time, the temperature sensor 102, semiconductor refrigeration plate 104, fan 2106, motor 2201, pump body 2213 and controller can be powered by a built-in power supply or by AC power. The specific power supply method is selected according to the situation and will not be elaborated here.

[0040] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0041] The above-described embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. A multifunctional cooling structure for rapid cooling of a copper wire tin layer, characterized in that: include: A liquid storage shell (1), the interior of the liquid storage shell (1) is filled with cooling liquid, two symmetrically distributed side plates (101) are fixedly connected to the top of the liquid storage shell (1), two groups of uniformly distributed semiconductor cooling sheets (104) are embedded and installed on the inner side of the liquid storage shell (1), the number of semiconductor cooling sheets (104) in each group is not less than five, a condensing tube (103) is fixedly connected between the two groups of semiconductor cooling sheets (104), and a temperature sensor (102) is arranged on one side of the liquid storage shell (1); Cooling module (2); The cooling module (2) comprises an air cooling component (21) and an auxiliary component (23) arranged on the top of the liquid storage shell (1), and a water cooling component (22) located between the two side plates (101) is arranged on opposite sides of the air cooling component (21) and the auxiliary component (23); The air cooling component (21) comprises a mounting block (2101) fixedly connected to the inner wall of the liquid storage shell (1), the top of the mounting block (2101) passes through the liquid storage shell (1), the surface of the mounting block (2101) is provided with evenly distributed inlet holes (2102), the top of the mounting block (2101) is fixedly connected to a connection box (2105), a filter screen (2107) is embedded and installed on one side of the connection box (2105), and evenly distributed fans (2106) are arranged inside the connection box (2105); The auxiliary component (23) comprises a connection block (2301) fixedly connected to the top of the liquid storage shell (1); a surface of the connection block (2301) is provided with an outlet hole (2303) coaxially arranged with the inlet hole (2102); an inner wall of the outlet hole (2303) is provided with an installation cavity (2302); and an inner wall of the installation cavity (2302) is provided with a liquid return groove (2305) connected to the liquid storage shell (1); The inner wall of the installation cavity (2302) is fixedly connected with evenly distributed extrusion blocks (2304), the extrusion blocks (2304) are arranged in a hollow shape, and one side of the extrusion blocks (2304) close to the center of the installation cavity (2302) is arranged in an arc-shaped surface, and the surface of the extrusion blocks (2304) is provided with evenly distributed water inlet holes, and the surface of the extrusion blocks (2304) is provided with evenly distributed drainage grooves; The water cooling component (22) comprises a mounting ring (2203) rotatably connected to one side of a connecting block (2301); a toothed ring (2204) is fixedly connected to the surface of the mounting ring (2203); two adjacent toothed rings (2204) are meshed with each other; a motor (2201) is provided on one side of the connecting block (2301); an output shaft of the motor (2201) is fixedly connected to a gear (2202); the gear (2202) is meshed with adjacent toothed rings (2204); a water absorbing block (2205) located inside the mounting cavity (2302) is provided on one side of the mounting ring (2203); the diameter of the water absorbing block (2205) is smaller than the inner diameter of the mounting cavity (2302), and the water absorbing block (2205) is a component made of a water absorbing cotton material.

2. The multifunctional cooling structure for rapid cooling of copper wire tin layer according to claim 1, characterized in that: One side of the mounting block (2101) is fixedly connected with evenly distributed annular tubes (2108), the annular tubes (2108) are coaxially arranged with the adjacent introduction holes (2102), the surface of the annular tubes (2108) is connected with a conduit (2104), and the other end of the conduit (2104) is connected with a connection box (2105).

3. The multifunctional cooling structure for rapid cooling of copper wire tin layer according to claim 2, characterized in that: An annularly distributed connecting pipe (2103) is embedded in the inner wall of the introduction hole (2102), one end of the connecting pipe (2103) passes through the introduction hole (2102) and is connected to the adjacent annular pipe (2108), and the surface of the connecting pipe (2103) is provided with uniformly distributed air injection holes.

4. The multifunctional cooling structure for rapid cooling of copper wire tin layer according to claim 1, characterized in that: The other side of the mounting ring (2203) is fixedly connected to a connecting plate (2206) distributed in an annular manner, a through groove (2210) is provided inside the connecting plate (2206), and a surface of the connecting plate (2206) is provided with spray holes (2211) that are evenly distributed and connected to the through groove (2210).

5. The multifunctional cooling structure for rapid cooling of copper wire tin layer according to claim 4, characterized in that: A swivel (2207) is rotatably connected to one side of the mounting block (2101), a cavity (2212) is provided on the surface of the swivel (2207), one end of the connecting plate (2206) away from the mounting ring (2203) is fixedly connected to the swivel (2207), and the through groove (2210) is in communication with the cavity (2212).

6. The multifunctional cooling structure for rapid cooling of copper wire tin layer according to claim 5, characterized in that: The inner wall of the cavity (2212) is slidably connected to a connecting ring (2208); the outer side of the connecting ring (2208) passes through the cavity (2212) and is fixedly connected to the inner wall of the mounting block (2101); an introduction tube (2209) is provided on the surface of the connecting ring (2208); one end of the introduction tube (2209) passes through the connecting ring (2208) and is connected to the cavity (2212).

7. The multifunctional cooling structure for rapid cooling of copper wire tin layer according to claim 6, characterized in that: A connecting cavity (2215) is provided inside the mounting block (2101), a pump body (2213) is provided inside the liquid storage shell (1), a water outlet end of the pump body (2213) is connected to a water outlet pipe (2214), the water outlet pipe (2214) is connected to the connecting cavity (2215), and the other end of the inlet pipe (2209) is connected to the connecting cavity (2215).

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