Electroplating equipment and electroplating method

Abstract

The invention discloses electroplating equipment and an electroplating method, and the electroplating equipment comprises an electroplating tank which is provided with a cavity for accommodating electroplating liquid; the anode assembly is used for transmitting the first current and the second current; the cathode assembly is used for clamping a to-be-electroplated part; wherein the anode assembly is provided with a first anode plate and a second anode plate which are used for transmitting the first current and the second current, and a preset distance for placing the to-be-electroplated part is formed between the first anode plate and the second anode plate; and when the electroplating equipment is in a use state, the first current and the second current are respectively transmitted to the first anode plate and the second anode plate, so that the electroplating equipment can be used for electroplating by adjusting the numerical values of the first current and the second current. And the electroplating states of the two faces of the part to be electroplated located between the first anode plate and the second anode plate are controlled correspondingly. Current of different values can be applied to the first conductive support and the second conductive support at the same time, double-face electroplating is conducted on the to-be-electroplated parts at the same time, and the two faces of the to-be-electroplated parts can achieve the effect that electroplating circuit areas, electroplating areas and electroplating results are different.

Description

Technical Field

[0001] The present application relates to the field of electroplating technology, and in particular to an electroplating device and an electroplating method. Background Art

[0002] Electroplating is the process of plating a thin layer of other metals or alloys on certain metal surfaces using the principle of electrolysis. It is a process that uses electrolysis to attach a layer of metal film to the surface of metal or other material parts, thereby preventing metal oxidation, improving wear resistance, conductivity, reflectivity, corrosion resistance and enhancing aesthetics. Electroplating equipment mainly includes electroplating tanks, power supplies, anodes, cathodes, electroplating solutions and workpieces to be electroplated. During the electroplating process, the workpiece to be electroplated needs to be connected to the cathode, and then the power is turned on. The metal ions in the electrolyte are gradually adsorbed onto the workpiece to be electroplated to form a coating.

[0003] Existing electroplating equipment usually introduces a constant current during electroplating, and the electroplated parts only have a single electroplating effect in this way. However, with the continuous development of modern industrial technology, a single electroplating effect is difficult to meet the ever-increasing and increasingly stringent electroplating needs. For example, to electroplating both sides of a cell, different currents need to be input to the two sides of the cell, and different currents also need to be input to the two anode parts facing the two sides of the cell. Summary of the invention

[0004] The purpose of the present application is to provide an electroplating device that can simultaneously apply currents of different values ​​to a first conductive bracket and a second conductive bracket, and perform double-sided electroplating on multiple parts to be electroplated at the same time, so that the two sides of the parts to be electroplated can achieve different effects in terms of electroplating circuit areas, electroplating areas and electroplating results.

[0005] To achieve the above-mentioned purpose, the present application provides an electroplating device, comprising an electroplating tank having a cavity for containing an electroplating liquid; an anode assembly for transmitting a first current and a second current; and a cathode assembly for clamping a workpiece to be electroplated; wherein the anode assembly has a first anode plate and a second anode plate for transmitting the first current and the second current, and there is a preset distance between the first anode plate and the second anode plate for placing the workpiece to be electroplated; when the electroplating device is in use, the first current and the second current are respectively transmitted to the first anode plate and the second anode plate, so as to control the electroplating state of both sides of the workpiece to be electroplated located between the first anode plate and the second anode plate by adjusting the values ​​of the first current and the second current.

[0006] As a further improvement of the above technical solution: the anode assembly includes at least a first conductive bracket, a second conductive bracket, a first anode plate and a second anode plate; wherein, the first current and the second current are respectively transmitted to the first conductive bracket and the second conductive bracket, the first conductive bracket is electrically connected to the first anode plate, and the second conductive bracket is electrically connected to the second anode plate, so that the first current and the second current are respectively transmitted to the first anode plate and the second anode plate; when the two sides of the workpiece to be electroplated are respectively electrically connected to the first anode plate and the second anode plate, the first current and the second current respectively electroplate the two sides of the workpiece to be electroplated.

[0007] As a further improvement of the above technical solution: the first anode plate and the second anode plate both have conductive legs, and the conductive legs have a clip-on structure that matches the first conductive bracket and the second conductive bracket, so that the conductive legs are clip-on with the first conductive bracket or the second conductive bracket through the clip-on structure.

[0008] As a further improvement of the above technical solution: the first conductive bracket and the second conductive bracket are both provided with positioning buckles, and the positioning buckles have a plug-in structure, and the plug-in structure matches the shape of the first anode plate and the second anode plate, so that the first conductive bracket and the second conductive bracket can be plugged with the first anode plate and the second anode plate through the positioning buckles.

[0009] As a further improvement of the above technical solution: the anode assembly also includes a mounting frame, and the first anode plate and the second anode plate are independently arranged in the mounting frame; wherein the mounting frame has a plurality of filter holes so that the inside of the mounting frame is connected with the outside.

[0010] As a further improvement of the above technical solution: a filter membrane is arranged between the first anode plate, the second anode plate and the mounting frame.

[0011] As a further improvement of the above technical solution: the cathode assembly at least includes a conductive support frame and a cathode fixing frame; wherein the conductive support frame has at least one, and is connected through conductive connection, and a clamping structure is provided on the conductive support frame to clamp the workpiece to be electroplated.

[0012] As a further improvement of the above technical solution: a positioning structure is also provided on the conductive support frame to position the workpiece to be electroplated.

[0013] As a further improvement of the above technical solution: the positioning structure and the supporting structure are both provided with a groove body, and when the workpiece to be electroplated is placed in the conductive support frame, the bottom of the groove body contacts the edge of the workpiece to be electroplated.

[0014] As a further improvement of the above technical solution: there is a preset distance between two adjacent conductive support frames, and the preset distance is greater than the width of the installation frame.

[0015] To achieve the above-mentioned purpose, the present application also provides an electroplating method on the other hand, comprising placing the anode assembly in the electroplating tank and placing the cathode assembly on the anode assembly, wherein the workpiece to be electroplated clamped by the cathode assembly is located between the first anode plate and the second anode plate of the anode assembly; filling the electroplating tank with electroplating liquid; setting the values ​​of the first current and the second current for electroplating; and applying current to the first anode plate and the second anode plate respectively to form a plating layer on both sides of the workpiece to be electroplated.

[0016] It can be seen that the technical solution provided by the present application performs double-sided electroplating on multiple parts to be electroplated at the same time by applying currents of different values ​​to the first conductive bracket and the second conductive bracket at the same time, so that the two sides of the parts to be electroplated can be in corresponding electroplating states.

[0017] At the same time, in order to achieve double-sided electroplating, the present application is equipped with anode plates that transmit different current values. The anode plates can adjust their placement according to the number of parts to be electroplated, so that the electroplating equipment can change its internal structure according to the electroplating requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 is a schematic structural diagram of an electroplating device in one embodiment provided in the present application;

[0020] Figure 2 yes Figure 1 The structural schematic diagram of the electroplating equipment area A shown;

[0021] Figure 3 This is a schematic diagram of a structure in which a first conductive bracket and a second conductive bracket are independently arranged in an embodiment provided in the present application;

[0022] Figure 4 is a schematic structural diagram of a first anode plate and a second anode plate in an embodiment provided in the present application;

[0023] Figure 5This is a schematic diagram of the structure in which the first conductive bracket and the second conductive bracket alternate in an embodiment provided in the present application.

[0024] Figure 6 is a schematic structural diagram of a first anode plate and a second anode plate in another embodiment provided in the present application;

[0025] Figure 7 is a structural schematic diagram of a structural schematic diagram of a first conductive bracket and a second conductive bracket in an embodiment provided in the present application;

[0026] Figure 8 is a schematic structural diagram of a first anode plate and a second anode plate in another embodiment provided in the present application;

[0027] Fig. 9 This is a structural schematic diagram of a clamping structure in an embodiment provided by the present application;

[0028] Fig.10 is a structural schematic diagram of a clamping structure in another embodiment provided in the present application;

[0029] Fig.11 This is a schematic diagram of the structure of a positioning buckle in an embodiment provided by the present application;

[0030] Fig.12 It is a structural schematic diagram of a positioning buckle in another embodiment provided by the present application;

[0031] Fig.13 It is a structural schematic diagram of a positioning buckle in another embodiment provided by the present application;

[0032] Fig.14 This is a schematic diagram of the structure of an installation frame in an embodiment provided by the present application;

[0033] Fig.15 is a schematic structural diagram of a cathode structure in one embodiment provided in the present application;

[0034] Fig.16 This is a schematic structural diagram of a conductive support frame in an embodiment provided in the present application;

[0035] Fig.17 is a structural schematic diagram of a clamping structure in an embodiment provided in the present application;

[0036] Fig.18 is a structural schematic diagram of a clamping structure in an embodiment provided in the present application;

[0037] Fig.19 It is a schematic flow chart of an electroplating method in one embodiment provided in the present application.

[0038] Reference numerals:

[0039] 10-Parts to be plated;

[0040] 20- electroplating tank; 201- support seat; 202- support frame;

[0041] 30-anode assembly; 301-first conductive bracket; 302-second conductive bracket; 303-first anode plate; 304-second anode plate; 305-conductive access part; 306-conductive transmission part; 307-conductive support foot; 308-clamping structure; 309-positioning buckle; 310-elastic sheet; 311-installation frame;

[0042] 40- cathode assembly; 401- cathode fixing frame; 4011- side plate; 402- conductive support frame; 4021- clamping structure; 4022- positioning structure. DETAILED DESCRIPTION

[0043] To make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below in conjunction with the accompanying drawings. Terms such as "upper", "above", "lower", "below", "first end", "second end", "one end", "the other end" used in the present application to represent spatial relative positions are used to describe the relationship between a unit or feature as shown in the accompanying drawings relative to another unit or feature for the purpose of convenience of explanation. Terms of spatial relative position may be intended to include different orientations of the device in use or work other than the orientation shown in the figure. For example, if the device in the figure is turned over, the unit described as being "below" or "below" other units or features will be located "above" other units or features. Therefore, the exemplary term "below" can encompass both the above and below orientations. The device can be oriented in other ways (rotated 90 degrees or other orientations), and the spatially related descriptors used herein are interpreted accordingly.

[0044] In addition, the terms "installed", "set", "provided with", "connected", "slidingly connected", "fixed", and "sleeved" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0045] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the embodiments described in this application are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0046] The electroplating equipment provided in the embodiment of the present application is used to electroplate the part 10 to be electroplated so that a layer of metal film is attached to the surface of the part 10 to be electroplated, wherein the part 10 to be electroplated can be a product that needs to be given some special physical properties or decorative effects, such as a PCB board, a solar cell, etc.

[0047] Please refer to Figure 1 The electroplating equipment includes an electroplating tank 20, and the electroplating tank 20 has a cavity for containing an electroplating liquid. The electroplating liquid can use liquids with different functional characteristics according to the electroplating needs, such as nickel plating liquid, copper plating liquid and silver plating liquid. In order to make the electroplating liquid in the electroplating tank 20 in a flowing state, a liquid spraying component is provided in the electroplating tank 20. The nozzles in the liquid spraying component can be evenly arranged or independently arranged according to the size and position of the part 10 to be electroplated. Furthermore, a guide plate can be provided in the electroplating tank 20 to improve the fluidity of the electroplating liquid and enhance the electroplating effect.

[0048] The electroplating equipment also includes an anode assembly 30 and a cathode assembly 40. Specifically, the anode assembly 30 is used to transmit the first current and the second current, the cathode assembly 40 is used to clamp the workpiece 10 to be electroplated, and the anode assembly 40 also has a first anode plate 303 and a second anode plate 304 for transmitting the first current and the second current, and the first anode plate 303 and the second anode plate 304 have a preset spacing for placing the workpiece 10 to be electroplated. When the electroplating equipment is in use, the first current and the second current are respectively transmitted to the first anode plate 303 and the second anode plate 304, so as to control the electroplating state of the two sides of the workpiece 10 to be electroplated between the first anode plate 303 and the second anode plate 304 by adjusting the values ​​of the first current and the second current, so as to achieve that when electroplating is performed on both sides of the workpiece 10 to be electroplated at the same time, the two sides can achieve different effects of electroplating circuit area, electroplating area and electroplating result.

[0049] In practical applications, the electroplating equipment also includes a power supply. When the positive electrode of the power supply is connected to the anode assembly 30 and the negative electrode of the power supply is connected to the cathode assembly 40, the electroplated part 10 is in an electroplating state.

[0050] The anode assembly 30 is located on the same axis, so that the workpiece 10 to be plated and the first anode plate 303 and the second anode plate 304 are arranged at intervals from each other, and the workpiece 10 to be plated can be located between the first anode plate 303 and the second anode plate 304. Further, when the workpiece 10 to be plated is in a non-plating state, only the anode assembly 30 can be placed in the plating tank 20, and the cathode assembly 40 is placed above the plating tank 20 by other equipment. At this time, the cathode assembly 40 can be in a moving state or a stationary state, so as to facilitate other processing of the workpiece 10 to be plated.

[0051] In this embodiment, if Figure 2-Figure 8 As shown, the anode assembly 30 at least includes a first conductive support 301, a second conductive support 302, a first anode plate 303 and a second anode plate 304. Since in the embodiment of the present application, in order to form different electroplating results on the two sides of the workpiece 10 to be electroplated, the first conductive support 301 and the second conductive support 302 can introduce currents of different values ​​as needed, so the first conductive support 301 and the second conductive support 302 need to transmit the current to different receiving ends. Specifically, the first current and the second current are transmitted to the first conductive support 301 and the second conductive support 302 respectively, the first conductive support 301 and the first anode plate 303 are electrically connected, and the second conductive support 302 is electrically connected to the second anode plate 304, so that the first current and the second current are transmitted to the first anode plate 303 and the second anode plate 304 respectively. When the two sides of the workpiece 10 to be electroplated are respectively electrically connected to the first anode plate 303 and the second anode plate 304 through the electroplating solution, the first current and the second current are used to electroplate the two sides of the workpiece 10 to be electroplated. The first anode plate 303 and the second anode plate 304 can be made of titanium plate or titanium mesh. For the convenience of description, the first anode plate 303 and the second anode plate 304 are collectively referred to as anode plates, and the first conductive bracket 301 and the second conductive bracket 302 are collectively referred to as conductive brackets.

[0052] Further, the first conductive bracket 301 and the second conductive bracket 302 are both composed of a conductive access portion 305 and a conductive transmission portion 306. Among them, the conductive access portion 305 and the conductive transmission portion 306 can adopt an integrally formed structure to improve the stability of installation and current transmission, and avoid the conductive bracket being separated during the process of being placed in the electroplating tank 20 and electroplating the electroplated part 10; the conductive access portion 305 and the conductive transmission portion 306 can also adopt a detachable connection structure to facilitate the installation and replacement of the conductive bracket. In order to avoid the automatic separation of the conductive access portion 305 and the conductive transmission portion 306, a protective cover can be added at the connection between the conductive access portion 305 and the conductive transmission portion 306. The protective cover can be made of an elastic material to reduce the connection gap between the conductive access portion 305 and the conductive transmission portion 306 through the elastic force of the protective cover itself. Specifically, the conductive access portion 305 is used to introduce external current, and the conductive access portions 305 of the first conductive bracket 301 and the second conductive bracket 302 can introduce currents of different values ​​to form different electroplating results. It should be noted that, since the function of the conductive access portion 305 is to access the current, it does not need to be immersed in the electroplating solution. In other words, the portion of the conductive transmission portion 306 immersed in the electroplating solution is at a different height from the conductive access portion 305. In order to improve the stability of the conductive bracket placed in the electroplating tank 20, in a feasible embodiment, a support seat for supporting the conductive transmission portion 306 is provided in the electroplating tank 20, and support frames for supporting the conductive access portion 305 are provided at both ends of the electroplating tank 20. Specifically, a support groove is provided on the top of the support seat, and the width of the support groove matches the width of a single conductive transmission portion 306. In practical applications, the projected area of ​​the support seat 201 needs to be larger than the projected area of ​​the conductive bracket to support the conductive bracket as a whole.

[0053] Furthermore, a plurality of the first conductive bracket 301 and the second conductive bracket 302 can be provided. Figure 7 As shown, when only one of the first conductive bracket 301 and the second conductive bracket 302 is provided, there is no special requirement for their placement. In the present application, the first conductive bracket 301 and the second conductive bracket 302 are both used to transmit current to the anode plate. Therefore, when the number of conductive brackets is increased, the current transmission efficiency can be improved. When the number of the first conductive bracket 301 and the second conductive bracket 302 is both multiple, such as Figure 5 As shown, the first conductive bracket 301 and the second conductive bracket 302 can be arranged in a staggered manner. In this case, in order to ensure the current transmission of the conductive bracket alone, the first anode plate 303 and the second anode plate 304 connected to the conductive bracket also need to be arranged in a staggered manner to avoid current mixing. At the same time, Figure 3As shown, the first conductive bracket 301 and the second conductive bracket 302 can also be independently arranged, that is, the first conductive bracket 301 and the second conductive bracket 302 are respectively located on both sides of the support base 201. It should be pointed out that, in the case where the current transmission function can be achieved, the first conductive bracket 301 and the second conductive bracket 302 can also be arranged in other ways, and this application does not limit this.

[0054] In one possible implementation, Figure 9-13 As shown, the first anode plate 303 and the second anode plate 304 both have a conductive foot 307, which is used to electrically connect with the conductive bracket, and the conductive foot 307 has a clamping structure 308 matching the conductive transmission part 306, so that the conductive foot 307 is clamped with the conductive transmission part 306 through the clamping structure 308. Specifically, as Fig. 9 As shown, the clamping structure 308 can be configured as a structure having a clamping groove, the opening of the clamping groove faces the conductive transmission part 306, and the shape and size of the clamping groove match the shape and size of the conductive transmission part 306, that is, when the conductive support leg 307 is placed on the conductive transmission part 306, the anode plate will not move a second time due to the small gap between the clamping groove and the conductive transmission part 306, so as to achieve the effect of stable contact between the conductive support and the anode plate; Fig.10 As shown, the snap-fit ​​structure 308 can also be set as a block structure. This method requires opening a block snap-fit ​​groove on the conductive transmission part 306 for placing the block structure, and the size of the block snap-fit ​​groove matches the size of the block structure, that is, when the conductive support 307 is placed on the conductive transmission part 306, the anode plate will not move a second time due to the small gap between the block snap-fit ​​groove and the block structure, thereby ensuring that the current can be stably transmitted to the anode plate through the conductive bracket.

[0055] Different from the above-mentioned method of providing the clamping structure 308 on the conductive legs 307 of the first anode plate 303 and the second anode plate 304, in another feasible implementation, the first conductive bracket 301 and the second conductive bracket 302 are both provided with a positioning buckle 309, and the positioning buckle 309 has a plug-in structure, and the plug-in structure matches the shape of the first anode plate 303 and the second anode plate 304, so that the first conductive bracket 301 and the second conductive bracket 302 are plugged with the first anode plate 303 and the second anode plate 304 through the positioning buckle 309. Specifically, as Fig.11As shown, the positioning buckle 309 has an opening, and an elastic sheet 310 is arranged in the opening, and the elastic sheet 310 can be elastically deformed, and a gap is formed between the free end of the elastic sheet 310 and the inner wall of the positioning buckle 309, and the positioning buckle 309 can be vertically clamped on the conductive transmission part 306 through the gap. At this time, the two sides of the anode plate are in contact with the elastic sheet 310 and the inner wall of the positioning buckle 309 respectively, and the elastic sheet 10 uses its own elasticity to apply a clamping force to the anode plate, thereby reducing the gap between the anode plate and the elastic sheet 10 and the inner wall of the positioning buckle 309, so as to achieve a stable connection between the anode plate and the conductive bracket. It should be noted that, under the condition that the elastic sheet 10 can ensure sufficient contact area with the anode plate, the present application does not limit the structure of the elastic sheet 10 itself and its installation method.

[0056] Furthermore, if Fig.12 As shown, the positioning buckle 309 can be horizontally clamped on the conductive transmission part 306, and the elastic sheet 310 is in elastic contact with the bottom surface of the conductive transmission part 306. In this way, the first anode plate 303 and the second anode plate 304 are required to have conductive legs 307, and the bottom surface of the conductive legs 307 is located on the conductive transmission part 306, and the top surface is in close contact with the inner wall of the positioning buckle 309 to achieve stable placement of the anode plate. Compared with the method of vertically clamping the positioning buckle 309 on the conductive transmission part 306, although the horizontal clamping requires the addition of conductive legs on the anode plate, it can avoid the positioning buckle 309 from falling due to the large gap between the positioning buckle 309 and the conductive transmission part 306.

[0057] Furthermore, if Fig.13 As shown, more than one elastic sheet 310 can be set in the positioning buckle 309. When two elastic sheets 310 are set in the positioning buckle 309, both sides of the anode plate or the conductive support 307 can contact the elastic sheet 310, and the elasticity of the elastic sheet 310 is used to generate a clamping force to improve the placement stability of the anode plate.

[0058] Of course, in other embodiments of the present application, the first anode plate 303 and the second anode plate 304 can also be fixedly connected to the conductive bracket. Compared with the detachable connection, the fixed connection can ensure the stable connection between the anode plate and the conductive transmission part 306, but the anode plate cannot be disassembled, which is not convenient for subsequent maintenance and replacement. If a fixed connection is adopted, the influence of the stability factor is reduced, and the anode assembly can adopt a variety of structural types, which are not limited by the present application.

[0059] In practical applications, the first anode plate 303 and the second anode plate 304 together form an anode plate group, each anode assembly 30 includes at least one anode plate group, and the first anode plate 303 and the second anode plate 304 belonging to the same anode plate group can be arranged facing each other or facing each other. In order to achieve different electroplating effects on the two sides of the workpiece 10 to be electroplated, the two sides of the workpiece 10 to be electroplated need to face the first anode plate 303 and the second anode plate 304 respectively. Specifically, the back-to-back arrangement means that the surface of the first anode plate 303 used for electroplating and the surface of the second anode plate 304 used for electroplating are arranged facing each other. When the back-to-back arrangement is adopted, the workpiece 10 to be electroplated needs to be located between the two anode plate groups during electroplating, that is, the first anode plate 303 in one anode plate group faces one side of the workpiece 10 to be electroplated, and the second anode plate 304 in the other anode plate group faces the other side of the workpiece 10 to be electroplated; the facing arrangement means that the surface of the first anode plate 303 used for electroplating and the surface of the second anode plate 304 used for electroplating are arranged facing each other. When the facing arrangement is adopted, the workpiece 10 to be electroplated is located between the first anode plate 303 and the second anode plate 304 of the same group during electroplating. It should be noted that after determining the layout mode of the first anode plate 303 and the second anode plate 304, the position of the component clamping the workpiece 10 to be electroplated in the cathode assembly should be adjusted accordingly.

[0060] In a feasible implementation, the number of conductive legs 307 can be set to two or more, and the number of conductive legs 307 on each anode plate needs to be an integer multiple of the conductive bracket. For example, if there are two first conductive brackets 301, then the number of conductive legs 307 on each first anode plate 303 can be two, four, or other multiples of two. At the same time, the setting position of the conductive support 307 needs to correspond to the layout position of the conductive bracket. For example, when both the first conductive bracket 301 and the second conductive bracket 302 have two and are staggered, the conductive support 307 set on the first anode plate 303 and the second anode plate 304 can be two, and the conductive support 307 of the first anode plate 303 needs to correspond to the position setting of the first conductive bracket 301, and the conductive support 307 of the second anode plate 304 needs to correspond to the position setting of the second conductive bracket 302, that is, the conductive support 307 of the two anode plates needs to be staggered with the conductive brackets, and the distance between the two conductive support feet 307 belonging to the same anode plate needs to be greater than the width of one conductive support foot 307, so that the conductive support foot 307 of the other anode plate can be alternately set.

[0061] In one possible implementation, Fig.14As shown, the anode assembly 30 also includes a mounting frame 311, and the first anode plate 303 and the second anode plate 304 are independently arranged in the mounting frame 311. Specifically, the mounting frame 311 includes at least a mounting plate, and the first anode plate 303 and the second anode plate 304 are respectively arranged on both sides of the mounting plate, and the mounting plate is used to realize independent installation of the two anode plates, thereby avoiding mutual influence caused by transmitting currents of different values ​​between the first anode plate 303 and the second anode plate 304 during use.

[0062] In an achievable embodiment, the mounting frame 311 further includes a cover plate, two of which are provided, and the two cover plates are respectively provided on opposite sides of the mounting plate, that is, the anode plate is located between the cover plate and the mounting plate. Further, a plurality of filter holes are provided on the cover plate, so that the inside and outside of the mounting frame 311 are connected, so that the electroplating solution can contact the anode plate, and the filter holes can filter the electroplating solution flowing out of the mounting frame 311.

[0063] Furthermore, a filter membrane is provided between the first anode plate 303, the second anode plate 304 and the cover plate. The filter membrane is used to isolate oxygen. A PVDF membrane or a PTFE membrane may be selected. The thickness of the filter membrane is 100-200 μm.

[0064] In an achievable embodiment, in order to improve the stability of the contact between the multiple anode plates and the conductive bracket, the anode assembly 30 also includes a positioning bar. Specifically, a plurality of positioning ports are provided on the positioning bar, and the number of the positioning ports is equal to the number of the anode plate groups. The side of each anode plate group can be clamped in the positioning port. If the anode plate group is set in the mounting frame 311, the side of the mounting frame 311 is clamped in the positioning port. In this embodiment, the number of positioning bars is at least two, and the two positioning bars are respectively arranged on both sides of the anode plate group to further improve the stability of the structure. Furthermore, after the two positioning bars are respectively clamped with the anode plate group or the mounting frame 311, in order to prevent the positioning bars from falling, a matching plug-in structure, such as a plug-in protrusion and a plug-in groove, can be added to the contacting part of the two positioning bars. At the same time, the positioning bar and its plug-in structure can be made of elastic material, and the elastic force is used to press the anode plate group or the mounting frame 311 to position it, so as to avoid the situation where the electroplating position is offset due to shaking during the electroplating process.

[0065] In one possible implementation, Figure 15-18As shown, the cathode assembly 40 at least includes a cathode fixing frame 401 and at least one conductive support frame 402, and the cathode fixing frame 401 has a cathode conductive part connected to the negative electrode of the power supply. Specifically, the cathode fixing frame 401 has two side plates 4011, and the conductive support frames 402 are connected by conductive connection (for example, multiple conductive support frames 402 are fixedly connected and connected through wires to achieve circuit connection) and are arranged between the two side plates 4011. The conductive support frames 402 are further fixed by the two side plates 4011, and the conductive support frames 402 are limited to ensure that the position of the conductive support frame 402 corresponds to the position of the anode plate group for the electroplated part 10 to be placed, and there is a preset distance between two adjacent conductive support frames 402, and the preset distance is greater than the width of the mounting frame 311, so that at least two anode plates can be inserted. Among them, at least one clamping structure 4021 is arranged on the conductive support frame 402 to clamp the electroplated part 10.

[0066] In this embodiment, the conductive support frame 402 has an opening for placing the workpiece 10 to be plated. If the number of the clamping structures 4021 is two or more, multiple clamping structures 4021 are arranged along the bottom of the opening. Specifically, the clamping structure 4021 is a trough body with a downward depression on the top. When the workpiece 10 to be plated is located in the opening, the bottom edge of the workpiece 10 to be plated is located in the trough body. Among them, the trough body can be arranged in a manner that the width decreases from top to bottom, so as to guide the workpiece 10 to be plated during the placement process, and reduce the gap between the bottom of the workpiece 10 to be plated and the trough body, so as to achieve the effect of stably clamping and supporting the workpiece 10 to be plated. It should be noted that the clamping structure 4021 can be of any shape, as long as it is ensured that there is a trough body on the top, such as a V-shaped or X-shaped shape, etc., and this application does not limit this.

[0067] In an achievable implementation, a positioning structure 4022 is further provided on the conductive support frame 402 to position the workpiece 10 to be electroplated. Specifically, if two or more positioning structures 4022 are provided, the plurality of positioning structures 4022 are provided along the side wall of the opening, and the free end of the positioning structure 4022 has a groove body, and the groove body on the positioning structure 4022 and the groove body of the clamping structure 4021 may be of the same structure. When the workpiece 10 to be electroplated is located in the opening, the side edge of the workpiece 10 to be electroplated is located in the groove body, so as to play a role in positioning and supporting the workpiece 10 to be electroplated.

[0068] Furthermore, an elastic sheet 310 may be provided in the slots of the clamping structure 4021 and the positioning structure 4022. Specifically, the installation direction of the elastic sheet 310 needs to be opposite to the decreasing direction of the slot width, that is, the width of the slot gradually decreases from top to bottom, forming a V-shaped structure, and one end of the elastic sheet 310 is fixedly provided on the side wall of the slot, and the other end extends toward the slot opening, forming a structure opposite to the V-shape, and the two elastic sheets 310 are not fixedly connected and there is a certain distance between the free ends for the insertion of the workpiece 10 to be plated. The workpiece 10 to be plated is clamped by the elastic force of the elastic sheet 310 itself, so as to prevent the workpiece 10 to be plated from shaking and falling due to poor clamping effect during the electroplating process.

[0069] In an achievable implementation, a handle is provided at the opposite ends of the two side panels 4011. Further, multiple handles may be provided so that multiple workers can simultaneously move the cathode assembly 40. Furthermore, multiple handles may be provided on the side panels 4011 in a detachable manner, so that the handles can be easily repaired and replaced after long-term use.

[0070] Based on the same inventive concept, Fig.19 As shown, the present application also provides an electroplating method, which is applied to the electroplating equipment provided in any of the above embodiments, and the method includes:

[0071] S1: placing the anode assembly 30 in the electroplating tank 20 , and placing the cathode assembly 40 on the anode assembly 30 , wherein the workpiece 10 to be electroplated clamped by the cathode assembly 40 is located between the first anode plate 303 and the second anode plate 304 of the anode assembly 30 .

[0072] Specifically, if a detachable connection is adopted between the anode plate and the conductive bracket, the anode plate needs to be first fixed with the anode plate clamp or the positioning buckle 309. Further, ensure that the bottom of the conductive transmission part 306 is placed on the support seat 201 of the electroplating tank 20, and the conductive access part 305 is placed on the support frame 202 at both ends of the electroplating tank 20, so that the anode assembly 30 can be stably placed.

[0073] In this embodiment, the workpiece 10 to be plated is inserted into the conductive support frame 402 through its opening, and it is necessary to ensure that the bottom of the workpiece 10 to be plated is located in the groove of the clamping structure 4021, and the side of the workpiece 10 to be plated is against the groove of the positioning structure 4022, so that the workpiece 10 to be plated can be stably placed during the electroplating process. When multiple workpieces 10 to be plated are electroplated at the same time, the above operation needs to be repeated so that each workpiece 10 to be plated is stably placed in the conductive support frame 402.

[0074] It should be noted that in order to ensure that the double-sided electroplating of the workpiece 10 to be electroplated can be performed, the two sides of the workpiece 10 to be electroplated need to face the electroplating surfaces of the first anode plate 303 and the second anode plate 304 respectively. Specifically, if the first anode plate 303 and the second anode plate 304 belonging to the same anode plate group are arranged facing each other, then the conductive support frame 402 located at the end and the side plate 4011 are only separated by the distance of one anode plate, and at this time, the conductive support frame 402 is located between the first anode plate 303 and the second anode plate 304 belonging to the same anode plate group; if the first anode plate 303 and the second anode plate 304 belonging to the same anode plate group are arranged back to back, when the anode plates can be arranged separately, that is, when the mounting frame 311 is not used, the conductive support frame 402 located at the end and the side plate 4011 are arranged back to back, when the anode plates can be arranged separately, that is, when the mounting frame 311 is not used, the conductive support frame 402 located at the end and the side plate 4011 are The side plates 4011 are spaced apart by the distance of an anode plate, and the two sides of the workpiece 10 to be electroplated correspond to the first anode plate 303 in one anode plate group and the second anode plate 304 in another anode plate group. At this time, the first anode plate 303 is located on one side of the side plate 4011, and the second anode plate 304 belonging to the same anode plate group is no longer installed. When the anode plates need to be installed in groups, the conductive support frame 402 located at the end and the side plate 4011 need to be spaced apart by the distance of an anode plate group. Under this installation method, the number of workpieces 10 to be electroplated that can be simultaneously electroplated is relatively small.

[0075] S2: Fill the electroplating tank with electroplating solution. Specifically, the electroplating solution needs to immerse the workpiece 10 to be electroplated, so that metal ions can be freed through the electroplating solution and attached to the surface of the workpiece 10 to be electroplated.

[0076] S3: Setting the values ​​of the first current and the second current for electroplating.

[0077] If the two sides of the workpiece 10 to be electroplated need to achieve the same electroplating result, the first current and the second current can be adjusted to the same value; if the two sides of the workpiece 10 to be electroplated need to achieve different electroplating effects, the first current and the second current can be adjusted to different values.

[0078] S4: applying current to the first anode plate 303 and the second anode plate 304 respectively, so as to form electroplating layers on both sides of the workpiece to be electroplated.

[0079] Specifically, the anode assembly 30 and the cathode assembly 40 are respectively connected to the positive and negative electrodes of the power supply, and the first current and the second current are respectively transmitted to the first anode plate 303 and the second anode plate 304 through the conductive access portion 305 of the conductive bracket to perform double-sided electroplating on the electroplated part 10.

[0080] It can be seen that the technical solution provided by the present application performs double-sided electroplating on the workpiece to be electroplated by simultaneously applying currents of different values ​​to the first conductive bracket and the second conductive bracket, so that the two sides of the workpiece to be electroplated can be in corresponding electroplating states and present different electroplating results.

[0081] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. An electroplating device, characterized in that: include an electroplating tank having a cavity for containing an electroplating solution; an anode assembly for transmitting a first current and a second current; A cathode assembly for holding the parts to be plated; Wherein, the anode assembly comprises a first anode plate and a second anode plate for transmitting the first current and the second current, and a preset distance for placing the workpiece to be electroplated is provided between the first anode plate and the second anode plate; When the electroplating equipment is in use, the first current and the second current are transmitted to the first anode plate and the second anode plate respectively, so as to control the electroplating status of the two sides of the workpiece to be electroplated between the first anode plate and the second anode plate respectively by adjusting the values ​​of the first current and the second current.

2. The electroplating equipment according to claim 1, characterized in that: The anode assembly at least comprises a first conductive support, a second conductive support, a first anode plate and a second anode plate; The first current and the second current are transmitted to the first conductive support and the second conductive support respectively, the first conductive support is electrically connected to the first anode plate, and the second conductive support is electrically connected to the second anode plate, so that the first current and the second current are transmitted to the first anode plate and the second anode plate respectively; When the two sides of the workpiece to be electroplated are electrically connected to the first anode plate and the second anode plate respectively, the first current and the second current electroplate the two sides of the workpiece to be electroplated respectively.

3. The electroplating equipment according to claim 2, characterized in that: The first anode plate and the second anode plate both have conductive legs, and the conductive legs have a clamping structure that matches the first conductive bracket and the second conductive bracket, so that the conductive legs are clamped with the first conductive bracket or the second conductive bracket through the clamping structure.

4. The electroplating equipment according to claim 2, characterized in that: The first conductive bracket and the second conductive bracket are both provided with positioning buckles, and the positioning buckles have plug-in structures, and the plug-in structures match the shapes of the first anode plate and the second anode plate, so that the first conductive bracket and the second conductive bracket can be plugged with the first anode plate and the second anode plate through the positioning buckles.

5. The electroplating equipment according to any one of claim 2, characterized in that: The anode assembly further comprises a mounting frame, wherein the first anode plate and the second anode plate are independently arranged in the mounting frame; Wherein, the installation frame has a plurality of filtering holes so that the inside of the installation frame is connected with the outside.

6. The electroplating equipment according to claim 5, characterized in that: A filter membrane is disposed between the first anode plate, the second anode plate and the mounting frame.

7. The electroplating equipment according to claim 1, characterized in that: The cathode assembly at least includes a conductive support frame and a cathode fixing frame; There is at least one conductive support frame, and the conductive support frame is connected by conduction, and a clamping structure is provided on the conductive support frame to clamp the part to be electroplated.

8. The electroplating equipment according to claim 7, characterized in that: The conductive support frame is also provided with a positioning structure to position the workpiece to be electroplated.

9. The electroplating equipment according to claim 8, characterized in that: The positioning structure and the supporting structure are both provided with a groove body. When the workpiece to be electroplated is placed in the conductive supporting frame, the bottom of the groove body contacts the edge of the workpiece to be electroplated.

10. The electroplating equipment according to claim 7, characterized in that: There is a preset distance between two adjacent conductive support frames, and the preset distance is greater than the width of the installation frame.

11. An electroplating method, characterized in that: The electroplating method adopts the electroplating equipment according to any one of claims 1 to 10, and the electroplating method comprises: Placing the anode assembly in the electroplating tank, and placing the cathode assembly on the anode assembly, wherein the workpiece to be electroplated held by the cathode assembly is located between the first anode plate and the second anode plate of the anode assembly; filling the electroplating tank with electroplating solution; Setting the values ​​of the first current and the second current for electroplating; Current is applied to the first anode plate and the second anode plate respectively to form electroplating layers on both sides of the workpiece to be electroplated.

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