Method for performing patterned deposition on flexible thin film material

Abstract

The invention provides a method for carrying out patterned deposition on a flexible thin film material, and relates to the technical field of flexible electronic micro-nano processing. The method comprises the steps that a preset polymer solution is smeared on a preset substrate and cured, and a cured elastic layer is obtained; adhering a flexible film material to the cured elastic layer to obtain a composite structure layer; coating two layers of photoresist on the composite structure layer by adopting a secondary spin coating process to obtain a substrate to be photoetched, the two layers of photoresist comprising high-sensitivity photoresist and low-sensitivity photoresist; carrying out photoetching treatment and material deposition treatment on the to-be-photoetched substrate according to a preset photoetching pattern, and generating a patterned deposition structure on the flexible film material; removing the photoresist on the flexible film material by using a developing solution; stripping the flexible thin film material from the cured elastic layer to obtain a flexible thin film with a patterned deposition structure; the problem that a film is prone to damage or deformation in the stripping process can be solved, damage or deformation of the film is reduced, and device performance is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of flexible electronic micro-nano processing, and in particular to a method for patterning deposition on a flexible thin film material. Background Art

[0002] In recent years, with the rapid development of fields such as the Internet of Things, bionic robots and mobile medical care, flexible electronic materials and devices have gradually become a hot spot in scientific research and application. Flexible thin film materials, especially in sensors, memories and other electronic devices, have shown their unique advantages. These flexible materials not only have good deformability, but also have some new physical effects and response characteristics, providing new solutions for technologies such as non-contact sensing, high-sensitivity strain detection and super-resolution tactile perception. With the continuous advancement of flexible film preparation technology, high-quality, stretchable metal and oxide films have been successfully manufactured, and these innovative materials have shown great application potential in flexible magnetic electronic devices. Therefore, how to efficiently and accurately manufacture and process these thin film materials has become a key research issue.

[0003] At present, the conventional method of patterning deposition on a flexible thin film material includes: pasting the flexible film onto a flat substrate with a photoresist film, and patterning through steps such as ultraviolet exposure and thermal curing.

[0004] However, after the curing process of traditional flexible thin film lithography is completed, a strong adhesion force is usually formed on the contact surface between the flexible film and the substrate. This adhesion force comes from a variety of factors, including physical adsorption, chemical bonding and the curing process of the photoresist, making it very difficult to peel off the flexible thin film material. There is a problem that the film is easily damaged or deformed during the peeling process, which in turn affects the device performance. Summary of the invention

[0005] In view of this, an embodiment of the present invention provides a method for patterned deposition on a flexible thin film material to eliminate or improve one or more defects existing in the prior art.

[0006] One aspect of the present invention provides a method for patterning deposition on a flexible thin film material, the method comprising the following steps: Applying a predetermined polymer solution on a predetermined substrate and curing the solution to obtain a cured elastic layer; adhering a flexible film material to the cured elastic layer to obtain a composite structure layer; Applying two layers of photoresist on the composite structure layer by a secondary coating process to obtain a substrate to be photoetched, wherein the two layers of photoresist include a high-sensitivity photoresist and a low-sensitivity photoresist; Performing photolithography processing and material deposition processing on the substrate to be photolithography according to a preset photolithography pattern to generate a patterned deposition structure on the flexible thin film material; Removing the photoresist on the flexible film material using a developer; The flexible film material is peeled off from the cured elastic layer to obtain a flexible film with a patterned deposition structure.

[0007] In some embodiments of the present invention, applying a predetermined polymer solution on a predetermined substrate and curing the solution comprises: Spin coating a predetermined polymer solution on a predetermined substrate at 4000 rpm for 30 seconds; The predetermined substrate coated with the predetermined polymer solution is baked at a temperature of 110 degrees for 50 minutes for curing.

[0008] In some embodiments of the present invention, the preset polymer solution is a single elastic material solution or a solution obtained by mixing two or more elastic material solutions in a preset proportion.

[0009] In some embodiments of the present invention, when the preset polymer solution is obtained by mixing two or more elastic material solutions in a preset proportion, before applying the preset polymer solution on a preset substrate and curing it, it also includes: vacuuming the preset polymer solution.

[0010] In some embodiments of the present invention, a second photoresist layer is applied on the composite structure layer using a secondary coating process, including: applying a high-sensitivity photoresist on the composite structure layer; and Apply low-sensitivity photoresist on high-sensitivity photoresist.

[0011] In some embodiments of the present invention, the preset polymer solution is a polydimethylsiloxane solution or a two-component silicone rubber material, or the preset polymer solution is a polymer solution obtained by mixing a polydimethylsiloxane solution and a two-component silicone rubber material in a preset ratio.

[0012] In some embodiments of the present invention, the preset ratio is 1:4.

[0013] In some embodiments of the present invention, before adhering the flexible film material to the cured elastic layer, the process further includes: heating the flexible film material for a preset time and at a preset temperature.

[0014] In some embodiments of the present invention, the preset time is 5 minutes; the preset temperature is 120 degrees.

[0015] In some embodiments of the present invention, the predetermined substrate includes a glass substrate or a silicon substrate.

[0016] The method of patterned deposition on a flexible film material of the present invention can solve the problem that the film is easily damaged or deformed during the stripping process, thereby improving device performance; by applying and curing a preset polymer solution on a preset substrate, a cured elastic layer is obtained as a buffer, thereby reducing the adhesion between the flexible film material and the preset substrate; at the same time, during the stripping process of the flexible film material, since the cured elastic layer has a certain elasticity, it can absorb the stress generated during the stripping process, avoiding these stresses from directly acting on the film, thereby reducing the damage or deformation of the film and improving device performance.

[0017] In addition, two layers of photoresist are applied on the composite structure layer, so that in the subsequent stripping step, it only needs to be immersed in a developer, and there is no need to use acetone or N-methylpyrrolidone solution that affects the cured elastic layer and the thin film material; through the multi-layer structure design, the synergistic effect of the cured elastic layer and the two layers of photoresist, the thin film material can be successfully stripped with lower stress, thereby maintaining its integrity and ensuring the high performance of the device.

[0018] Additional advantages, purposes, and features of the present invention will be described in part in the following description, and will become apparent to those skilled in the art after studying the following, or may be learned from the practice of the present invention. The purposes and other advantages of the present invention may be achieved and obtained by the structures specifically indicated in the specification and the accompanying drawings.

[0019] Those skilled in the art will appreciate that the objectives and advantages that can be achieved with the present invention are not limited to the above specific description, and the above and other objectives that can be achieved by the present invention will be more clearly understood from the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings described herein are used to provide a further understanding of the present invention, constitute a part of the present application, and do not constitute a limitation of the present invention. In the drawings: Figure 1 A flow chart of a method for patterned deposition on a flexible thin film material provided by one embodiment of the present invention.

[0021] Figure 2 A schematic diagram of a process of patterned deposition on a flexible thin film material is provided for one embodiment of the present invention. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the embodiments and the accompanying drawings. Here, the illustrative embodiments of the present invention and their descriptions are used to explain the present invention, but are not intended to limit the present invention.

[0023] It should also be noted that, in order to avoid obscuring the present invention due to unnecessary details, only structures and / or processing steps closely related to the solutions according to the present invention are shown in the accompanying drawings, while other details that are not closely related to the present invention are omitted.

[0024] It should be emphasized that the term “include / comprises” when used herein refers to the presence of features, elements, steps or components, but does not exclude the presence or addition of one or more other features, elements, steps or components.

[0025] It should also be noted that, unless otherwise specified, the term “connection” herein may refer not only to a direct connection but also to an indirect connection involving an intermediate.

[0026] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the accompanying drawings, the same reference numerals represent the same or similar components, or the same or similar steps.

[0027] The method for patterned deposition on a flexible thin film material provided in the present application is described in detail below.

[0028] like Figure 1 As shown, an embodiment of the present application provides a method for patterning deposition on a flexible thin film material. The implementation of the method may rely on a computer program, and the computer program may be run on a micro-nano processing device or a semiconductor manufacturing device. This embodiment does not limit the operating subject of the method. The method includes at least the following steps: Step S101 , applying a predetermined polymer solution on a predetermined substrate and curing the solution to obtain a cured elastic layer.

[0029] The preset polymer solution refers to a preset elastic material solution, which is a single elastic material solution or a solution obtained by mixing two or more elastic material solutions in a preset ratio. The elastic material solution includes but is not limited to polydimethylsiloxane (Pre-cured PDMS), polyurethane solution, silicone rubber solution, natural rubber solution or polyvinyl alcohol (PVA) solution. This embodiment does not limit the implementation of the elastic material solution.

[0030] In which, when the preset polymer is easily obtained by mixing two or more elastic material solutions in a preset proportion, the chemical compositions corresponding to different elastic material solutions are different; or, the chemical compositions corresponding to different elastic material solutions are the same, but the solution viscosities and / or fluidities are different.

[0031] In some embodiments of the present invention, the preset polymer solution is a polydimethylsiloxane solution or a two-component silicone rubber material, or the preset polymer solution is a polymer solution obtained by mixing a polydimethylsiloxane solution and a two-component silicone rubber material in a preset ratio. The two-component silicone rubber material refers to a liquid material obtained by mixing a polydimethylsiloxane solution and a curing agent (e.g., a polydimethylsiloxane solution).

[0032] In some embodiments of the present invention, the preset ratio is 1:4. For example, the elastic material solution is a common polydimethylsiloxane solution and a two-component silicone rubber material (such as a commercial polydimethylsiloxane solution of model Sylgard 184) as an example; the common polydimethylsiloxane solution and the two-component silicone rubber material are mixed and stirred in a ratio of 1:4 to obtain a preset polymer solution.

[0033] In actual implementation, the ratio and the preset proportion of the preset polymer solution may be adjusted based on the actual requirements for curing the elastic layer. This embodiment does not limit the implementation method of the preset polymer solution.

[0034] For example, the elastic material solution includes a high-concentration polydimethylsiloxane solution A and a polydimethylsiloxane solution B obtained by diluting the polydimethylsiloxane solution A with hexane or xylene; the polydimethylsiloxane solution B and the polydimethylsiloxane solution A are mixed and stirred at a preset ratio of 1:2 to obtain a preset polymer solution.

[0035] In addition, when the preset polymer solution is obtained by mixing two or more elastic material solutions in a preset ratio, the two or more elastic material solutions need to be mixed and stirred. During the mixing and stirring process, there is a possibility that air is mixed into the solution, resulting in bubbles that affect the uniformity of the material, causing pores or uneven structures to appear on the surface of the elastic layer after curing. Based on this, after the preset polymer solution is obtained by mixing and stirring, the preset polymer solution needs to be vacuumed to discharge the air and tiny bubbles, so that the mixture is more uniform, the transparency, uniformity and mechanical properties of the material are improved, the defects caused by bubbles are avoided, and the pattern accuracy and quality in applications such as photolithography can be ensured.

[0036] Specifically, when the preset polymer solution is obtained by mixing two or more elastic material solutions in a preset ratio, before applying the preset polymer solution on the preset substrate and curing it, the method further includes: vacuuming the preset polymer solution.

[0037] In some embodiments of the present invention, a preset polymer solution is applied to a preset substrate according to a preset application strategy by a coating device (Spin Coater). The preset application strategy refers to an application strategy that can evenly apply the preset polymer solution to the preset substrate, which is used to indicate the application speed and application time; or, the preset application strategy is also used to indicate the application direction.

[0038] In some embodiments of the present invention, the preset coating strategy includes but is not limited to: bidirectional alternating spin coating and / or unidirectional spin coating. Bidirectional alternating spin coating means that the directions of two adjacent coatings are clockwise and counterclockwise respectively, and the duration and speed of each coating are the same; unidirectional spin coating means that the direction of each coating is clockwise or counterclockwise, and the duration and speed of each coating are the same.

[0039] For example: when the preset coating strategy is a two-way alternating spin coating strategy, coating is performed alternately in clockwise and counterclockwise directions, each coating lasts 30 seconds, and the coating speed is 4000 revolutions per minute; when the preset coating strategy is a unidirectional spin coating strategy, coating is performed in a clockwise or counterclockwise direction, each coating lasts 30 seconds, and the coating speed is 4000 revolutions per minute.

[0040] After the preset polymer solution is applied to the preset substrate, the preset polymer solution needs to be cured. In some embodiments of the present invention, the preset substrate after the preset polymer solution is applied is baked by a curing device (such as an oven, etc.) according to a preset baking time (including but not limited to 50 minutes or 100 minutes, etc.) to cure the preset polymer solution on the preset substrate.

[0041] Specifically, the preset polymer solution is applied to the preset substrate and cured, including: spin coating the preset polymer solution on the preset substrate at 4000 rpm for 30 seconds; and baking the preset substrate coated with the preset polymer solution at a temperature of 110 degrees for 50 minutes for curing.

[0042] In actual implementation, the coating speed and coating time can be adjusted according to the actual solution type of the preset polymer solution and the substrate material of the preset substrate. This embodiment does not limit the coating speed and coating time.

[0043] In addition, since the flexible substrate is prone to local bending during the processing process, the effect of photolithography on the flexible substrate is often not very good. Based on this, researchers usually lay the flexible film material flat on a flat preset substrate to solve this problem. The preset substrate includes a preset glass substrate or a preset silicon substrate.

[0044] After the preset polymer solution is evenly applied on the preset substrate, the preset substrate coated with the preset polymer solution is heated according to a preset time and a preset temperature to solidify the preset polymer solution to form a solidified elastic layer.

[0045] Step S102 , adhering a flexible film material to the cured elastic layer to obtain a composite structure layer.

[0046] In this embodiment, the flexible film material refers to a film material that can be bent, stretched or deformed mechanically, including but not limited to a polyimide (PI) film, a polyester film (PET) film, a polyurethane (PU) film or an indium tin oxide (ITO) film.

[0047] During the bending or stretching process, if the internal stress of the flexible film material is too large, it will cause the flexible film material to deform or even crack; at the same time, when there is stress at the interface between the flexible film material and the elastic cured layer, the film may peel off or lose adhesion; therefore, before adhering the flexible film material to the cured elastic layer, it is necessary to use a heating device to uniformly heat the flexible film material to eliminate the stress. The heating device includes but is not limited to a temperature-controlled oven or an electric heating plate.

[0048] Specifically, before the flexible film material is adhered to the cured elastic layer, the method further includes: heating the flexible film material according to a preset time and a preset temperature, wherein the preset time is 5 minutes and the preset temperature is 120 degrees.

[0049] In actual implementation, the preset time and the preset temperature may be adjusted according to the actual type of the flexible film material; this embodiment does not limit the heating time and the heating temperature of the flexible film material.

[0050] In some embodiments of the present invention, the thin film material is adhered to the cured elastic layer by an adhesive, wherein the adhesive includes but is not limited to thermosetting glue, double-sided tape, or epoxy resin or polyurethane adhesive, etc. This embodiment does not limit the implementation method of adhering the thin film material to the cured elastic layer.

[0051] Step S103, applying two layers of photoresist on the composite structure layer by a secondary coating process to obtain a substrate to be photoetched.

[0052] The two-layer photoresist includes a high-sensitivity photoresist and a low-sensitivity photoresist. Figure 2In some embodiments of the present invention, in order to perform exposure under lower light intensity and thus achieve higher resolution pattern transfer, a high-sensitivity photoresist that responds strongly to ultraviolet light is first applied to the composite structure. Under lower light intensity conditions, the high-sensitivity photoresist can complete the chemical reaction within a shorter exposure time. Thereafter, a low-sensitivity photoresist is applied to the high-sensitivity photoresist to establish a protective layer on the high-sensitivity photoresist that is not easily affected by light.

[0053] Specifically, two layers of photoresist are coated on the composite structure layer by adopting a secondary coating process, including: coating a high-sensitivity photoresist on the composite structure layer; and coating a low-sensitivity photoresist on the high-sensitivity photoresist.

[0054] In some embodiments of the present invention, the coating method of the two-layer photoresist includes but is not limited to scraping, spin coating, spray coating or dipping. The coating method corresponding to the high-sensitivity photoresist is the same as or different from the coating method corresponding to the low-sensitivity photoresist.

[0055] In some embodiments of the present invention, two layers of photoresist are applied on the composite structure layer, so that in the subsequent stripping step, it only needs to be immersed in a developer, without the need to use acetone or N-methylpyrrolidone (N-Methyl-2-pyrrolidone, NMP) solution that will affect the cured elastic layer and the film material, thereby further avoiding the breakage or deformation of the flexible film material during the stripping process.

[0056] Step S104, performing photolithography and material deposition on the substrate to be photolithography according to a preset photolithography pattern to generate a patterned deposition structure on the flexible film material. The preset photolithography pattern refers to a pattern pre-set for photolithography on the flexible film material.

[0057] In some embodiments of the present invention, a substrate to be photolithographically exposed is subjected to exposure processing by photolithography equipment, wherein the photolithography equipment refers to a precision tool used to manufacture microelectronic devices, integrated circuits (ICs), sensors, optical components, etc., which transfers tiny patterns onto photosensitive materials through light irradiation and mask technology. The photolithography equipment includes but is not limited to steppers, full-wafer exposure systems, or extreme ultraviolet (EUV) photolithography machines.

[0058] In actual implementation, the lithography equipment may be selected according to the requirements, and this embodiment does not limit the equipment type of the lithography equipment and the implementation method of the exposure process.

[0059] In some embodiments of the present invention, a material deposition process is performed by a deposition device and a preset deposition material. The deposition device includes, but is not limited to, a chemical vapor deposition device (CVD), a physical vapor deposition device (PVD) or a molecular beam epitaxy device (MBE). The preset deposition material refers to a preset deposition material, including but not limited to a metal material, an oxide material or a silicon-based material. This embodiment does not limit the implementation method of the material deposition process.

[0060] Step S105, using a developer to remove the photoresist on the flexible film material.

[0061] Before the flexible film material is peeled off from the cured elastic layer, there are two layers of unexposed photoresist on the photolithography substrate, so the two layers of unexposed photoresist on the substrate to be photolithography need to be removed first.

[0062] Among them, removing the unexposed second layer of photoresist on the substrate to be photolithographic means first developing the photoresist, which only needs to be immersed in a developer, without using acetone or N-methylpyrrolidone (N-Methyl-2-pyrrolidone, NMP) solution that will affect the preset polymer solution and flexible film material, to remove the unexposed part and leave the exposed pattern.

[0063] for example: Figure 2 An example is given in which the preset polymer solution is a PDMS solution and the film material is a PET film material; after the PDMS solution is spin-coated on a preset substrate (silicon / glass substrate) and cured, a cured elastic layer is obtained, and the PET film material is pasted on the cured elastic layer; then, high-sensitivity photoresist and low-sensitivity photoresist are sequentially coated to obtain a substrate to be photolithographically processed; after photolithographic processing is performed by a photolithographic device, a deposition material and a deposition device are used to perform material deposition processing, and the unexposed two layers of photoresist are stripped off by immersion in a developer.

[0064] When the second layer of photoresist is a positive photoresist, the exposed area becomes soluble by the developer, and the unexposed area is retained; when the second layer of photoresist is a negative photoresist, the exposed area is retained by the developer, and the unexposed part is removed.

[0065] Step S106 , peeling the flexible film material from the cured elastic layer to obtain a flexible film with a patterned deposition structure.

[0066] refer to Figure 2The flexible film material is deposited on the cured elastic layer. There is no need to use a stripping solution or physical methods such as dry etching or solvent immersion. The film material can be directly stripped from the cured elastic layer to obtain a flexible film with a patterned deposition structure.

[0067] In summary, the method for patterned deposition on a flexible thin film material provided in this embodiment comprises applying a preset polymer solution on a preset substrate and curing the solution to obtain a cured elastic layer; adhering the flexible thin film material to the cured elastic layer to obtain a composite structure layer; applying two layers of photoresist on the composite structure layer by a secondary coating process to obtain a substrate to be photolithography, wherein the two layers of photoresist include a high-sensitivity photoresist and a low-sensitivity photoresist; performing photolithography processing and material deposition processing on the substrate to be photolithography according to a preset photolithography pattern to generate a patterned deposition structure on the flexible thin film material; removing the photoresist on the flexible thin film material by using a developer. Etching; peeling the flexible film material from the cured elastic layer to obtain a flexible film with a patterned deposition structure; being able to solve the problem of easy breakage or deformation of the film during the peeling process, thereby improving device performance; by applying and curing a preset polymer solution on a preset substrate, a cured elastic layer is obtained as a buffer, thereby reducing the adhesion between the flexible film material and the preset substrate; at the same time, during the peeling process of the flexible film material, since the cured elastic layer has a certain elasticity, it can absorb the stress generated during the peeling process, avoiding these stresses from directly acting on the film, thereby reducing the damage or deformation of the film, thereby improving device performance.

[0068] In addition, two layers of photoresist are applied on the composite structure layer, so that in the subsequent stripping step, it only needs to be immersed in a developer, and there is no need to use acetone or N-methylpyrrolidone solution that affects the cured elastic layer and the thin film material; through the multi-layer structure design, the synergistic effect of the cured elastic layer and the two layers of photoresist, the thin film material can be successfully stripped with lower stress, thereby maintaining its integrity and ensuring the high performance of the device.

[0069] It should be understood by those skilled in the art that the exemplary components, systems and methods described in conjunction with the embodiments disclosed herein can be implemented in hardware, software or a combination of the two. Whether it is performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention. When implemented in hardware, it can be, for example, an electronic circuit, an application-specific integrated circuit (ASIC), appropriate firmware, a plug-in, a function card, etc. When implemented in software, the elements of the present invention are programs or code segments used to perform the required tasks. The program or code segment can be stored in a machine-readable medium, or transmitted on a transmission medium or a communication link via a data signal carried in a carrier.

[0070] It should be clear that the present invention is not limited to the specific configuration and processing described above and shown in the figures. For the sake of simplicity, a detailed description of the known method is omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of the present invention is not limited to the specific steps described and shown, and those skilled in the art can make various changes, modifications and additions, or change the order between the steps after understanding the spirit of the present invention.

[0071] In the present invention, features described and / or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, and / or combined with features of other embodiments or replace features of other embodiments.

[0072] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the embodiments of the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A method for patterned deposition on a flexible thin film material, characterized in that: The method comprises the following steps: Applying a predetermined polymer solution on a predetermined substrate and curing the solution to obtain a cured elastic layer; Adhere a flexible film material to the cured elastic layer to obtain a composite structure layer; Applying two layers of photoresist on the composite structure layer by a secondary coating process to obtain a substrate to be photoetched, wherein the two layers of photoresist include a high-sensitivity photoresist and a low-sensitivity photoresist; Performing photolithography and material deposition on the substrate to be photolithography according to a preset photolithography pattern to generate a patterned deposition structure on the flexible film material; removing the photoresist on the flexible film material by using a developer; The flexible film material is peeled off from the cured elastic layer to obtain a flexible film with a patterned deposition structure.

2. The method according to claim 1, characterized in that The step of applying the predetermined polymer solution on the predetermined substrate and curing the solution comprises: Spin coating the predetermined polymer solution on the predetermined substrate at 4000 rpm for 30 seconds; The predetermined substrate coated with the predetermined polymer solution is baked at a temperature of 110 degrees for 50 minutes for curing.

3. The method according to claim 1, characterized in that The preset polymer solution is a single elastic material solution or a solution obtained by mixing two or more elastic material solutions in a preset proportion.

4. The method according to claim 3, characterized in that In the case where the preset polymer solution is obtained by mixing two or more elastic material solutions in a preset ratio, before applying the preset polymer solution on the preset substrate and curing it, the method further includes: vacuuming the preset polymer solution.

5. The method according to claim 1, characterized in that Applying two layers of photoresist on the composite structure layer by a secondary coating process includes: Applying the high-sensitivity photoresist on the composite structure layer; and The low-sensitivity photoresist is coated on the high-sensitivity photoresist.

6. The method according to claim 3, characterized in that: The preset polymer solution is a polydimethylsiloxane solution or a two-component silicone rubber material, or the preset polymer solution is a polymer solution obtained by mixing a polydimethylsiloxane solution and a two-component silicone rubber material according to the preset ratio.

7. The method according to claim 6, characterized in that The preset ratio is 1 to 4.

8. The method according to claim 1, characterized in that Before the flexible film material is adhered to the cured elastic layer, the method further includes: heating the flexible film material according to a preset time and a preset temperature.

9. The method according to claim 8, characterized in that The preset time length is 5 minutes; the preset temperature is 120 degrees.

10. The method according to claim 1, characterized in that The preset substrate includes a glass substrate or a silicon substrate.

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