Sapphire crystal bar cutting process monitoring method based on feedback analysis

Abstract

The invention relates to the technical field of production process monitoring, in particular to a sapphire crystal bar cutting process monitoring method based on feedback analysis, and the method comprises the following steps: S1, obtaining cutting depth data, sawing wire operation data and crystal bar feeding data in the sapphire crystal bar cutting process; s2, the feeding speed consistency and the wire sawing speed consistency of symmetrical cutting depths in the cutting process are analyzed; s3, the direction consistency of saw wire vibration and crystal bar feeding in the cutting process is analyzed; and S4, evaluating the stability of the cutting process based on the consistency analysis results of the step S2 and the step S3, and giving a cutting stability alarm. According to the method, the feeding speed consistency and the sawing wire speed consistency of the crystal bar with the symmetrical cutting depth and the direction consistency of sawing wire vibration and crystal bar feeding in the cutting process are quantitatively analyzed, a cutting stability warning mechanism is constructed based on the consistency analysis result, and the crystal bar cutting stability and cutting efficiency are effectively improved.

Description

Technical Field

[0001] The present application relates to the technical field of production monitoring, and in particular to a sapphire crystal rod cutting process monitoring method based on feedback analysis. Background Art

[0002] Sapphire is a special corundum mineral material, whose main component is aluminum oxide. It exhibits excellent properties in optics, thermal, mechanical and electrical aspects. It is an excellent technical crystal material and is widely used in national defense construction and the development of civilian high-tech products.

[0003] Sapphire crystal rod processing mainly includes cutting, grinding, polishing and other processes. Cutting is the first process in the processing. Diamond wire saw cutting technology has been widely used in the cutting of hard and brittle materials such as sapphire crystals due to its high cutting quality and small cutting loss. The stability of the cutting process determines the chip forming accuracy, which directly affects the quality and cost of subsequent processing.

[0004] The crystal rod is a cylindrical workpiece. The contact length between the saw wire and the crystal rod is different at different cutting depths. In the actual process of cutting the crystal rod, the crystal rod feed speed and saw wire speed corresponding to different cutting depths are usually adjusted to match different contact lengths, thereby improving the cutting stability and cutting efficiency of the crystal rod. At the same time, the consistency of the saw wire vibration and the crystal rod feed direction also affects the cutting stability of the crystal rod. The existing sapphire crystal rod cutting process monitoring method ignores the influence of the consistency of the crystal rod feed speed and the saw wire speed at symmetrical cutting depths and the consistency of the saw wire vibration and the crystal rod feed direction during cutting on the cutting stability, resulting in problems such as unbalanced cutting force distribution, abnormal saw wire vibration, and poor slice surface quality that are difficult to detect in time. Summary of the invention

[0005] In order to overcome the defects and shortcomings of the prior art, the present application provides a sapphire crystal rod cutting process monitoring method based on feedback analysis, which effectively improves the crystal rod cutting stability and cutting efficiency by quantitatively analyzing the consistency of the crystal rod feed speed and the saw wire speed at symmetrical cutting depths and the consistency of the saw wire vibration and the crystal rod feed direction during the cutting process.

[0006] In order to achieve the above objectives, this application adopts the following technical solutions: In a first aspect, the present application provides a sapphire crystal rod cutting process monitoring method based on feedback analysis, comprising the following steps: S1: Obtain cutting depth data, wire running data and ingot feeding data during sapphire ingot cutting; S2: Analyze the feed speed consistency and wire speed consistency of symmetrical cutting depth during cutting; S3: Analyze the consistency of wire vibration and ingot feeding direction during cutting; S4: Based on the consistency analysis results of step S2 and step S3, the stability of the cutting process is evaluated and a cutting stability alarm is issued.

[0007] Optionally, the specific steps of analyzing the consistency of the feeding speed in step S2 include: S21: Obtain cutting depth data and crystal rod feeding data, where the crystal rod feeding data includes crystal rod feeding speed data and crystal rod feeding direction data; S22: Determine the symmetrical cutting depth of the crystal rod based on the cutting depth data ,in, , and Indicates Group symmetrical cutting depth, Indicates the cross-sectional diameter of the crystal rod; S23: Cut each set of symmetrical cutting depths Combined with the ingot feeding data, the ingot feeding speed corresponding to the symmetrical cutting depth is extracted and , Indicates cutting depth The ingot feed speed at Indicates cutting depth The ingot feed speed at S24: Calculate the feed speed consistency index based on the ingot feed speed data. The feed speed consistency index is used to evaluate the feed speed consistency at the symmetrical cutting depth during the cutting process. The calculation formula of the feed speed consistency index is: ; In the formula Indicates cutting depth The ingot feed speed at Indicates cutting depth The ingot feed speed at It represents the average feeding speed of the ingot corresponding to all cutting depths, Indicates the number of groups of symmetrical cutting depths, Indicates the feed rate consistency index.

[0008] Optionally, the specific steps of analyzing the consistency of the saw wire speed in step S2 include: S25: obtaining cutting depth data and saw wire operation data, where the saw wire operation data includes saw wire speed data and saw wire vibration data; S26: Cut each set of symmetrical cutting depths Combined with the saw wire running data, the saw wire speed corresponding to the symmetrical cutting depth is extracted and , Indicates cutting depth The wire speed at Indicates cutting depth Wire speed at S27: Calculate the wire speed consistency index based on the wire speed data. The wire speed consistency index is used to evaluate the wire speed consistency at the symmetrical cutting depth during the cutting process. The calculation formula of the wire speed consistency index is: ; In the formula Indicates cutting depth The wire speed at Indicates cutting depth The wire speed at Represents the average wire speed corresponding to all cutting depths, Indicates the number of groups of symmetrical cutting depths, Indicates the wire speed consistency index.

[0009] Optionally, the specific steps of step S3 include: S31: Acquire saw wire operation data and crystal rod feeding data, where the saw wire operation data includes saw wire speed data and saw wire vibration data, and the crystal rod feeding data includes crystal rod feeding speed data and crystal rod feeding direction data; S32: decomposing the wire vibration data and the component parallel to the horizontal plane of the crystal rod feeding direction as the parallel component of the wire vibration, and decomposing the wire vibration data and the component perpendicular to the horizontal plane of the crystal rod feeding direction as the vertical component of the wire vibration; S33: Calculate the directional consistency index based on the parallel component of the wire vibration and the vertical component of the wire vibration. The directional consistency index is used to evaluate the directional consistency of the wire vibration and the crystal rod feeding during the cutting process. The calculation formula of the directional consistency index is: ; In the formula express The parallel component of the saw wire vibration at time, express The vertical component of the saw wire vibration at time Indicates the wire vibration monitoring time. Represents the directional consistency index.

[0010] Optionally, the specific steps of evaluating the stability of the cutting process in step S4 include: S41: obtaining a feed speed consistency index and a saw wire speed consistency index at a symmetrical cutting depth during the cutting process, and obtaining a direction consistency index of saw wire vibration and crystal rod feeding during the cutting process; S42: The feed speed consistency index, the wire speed consistency index and the direction consistency index are weighted and summed to obtain a cutting stability index. The cutting stability index is used to evaluate the stability of the cutting process. The calculation formula of the cutting stability index is: ; In the formula Indicates the feed speed consistency index, Indicates the saw wire speed consistency index, represents the directional consistency index, represents the feed speed consistency weight, represents the consistency weight of wire speed, represents the direction consistency weight, Represents the cutting stability index.

[0011] Optionally, the specific steps of performing the cutting stability alarm in step S4 include: S43: Obtaining a cutting stability index and a preset cutting stability threshold; S44: Compare the cutting stability index with a preset cutting stability threshold, and issue a cutting stability alarm when the cutting stability index is less than the preset cutting stability threshold; and do not issue a cutting stability alarm when the cutting stability index is greater than or equal to the preset cutting stability threshold.

[0012] It should be noted here that the feed speed consistency weight, wire speed consistency weight, direction consistency weight and preset cutting stability threshold are determined as follows: 5000 sets of cutting depth data, wire speed operation data and crystal rod feeding data are collected to distinguish whether the crystal rod cutting stability meets production requirements, and the cutting depth data, wire speed operation data and crystal rod feeding data are substituted into the calculation formula of the cutting stability index for calculation, and the calculated cutting stability index and the distinction result are simultaneously imported into the fitting software, and the optimal feed speed consistency weight, wire speed consistency weight, direction consistency weight and preset cutting stability threshold that meet the distinction accuracy of the distinction result are output.

[0013] In a second aspect, the present application provides a sapphire crystal rod cutting process monitoring system based on feedback analysis, comprising: A data acquisition module is used to acquire cutting depth data, saw wire running data and crystal rod feeding data during the sapphire crystal rod cutting process; The first analysis module is used to analyze the feed speed consistency and wire speed consistency of the symmetrical cutting depth during the cutting process; The second analysis module is used to analyze the consistency of the direction of saw wire vibration and crystal rod feeding during the cutting process; A stability alarm module is used to evaluate the stability of the cutting process based on the consistency analysis results and issue a cutting stability alarm; The control module is used to control the operation of the data acquisition module, the first analysis module, the second analysis module and the stability alarm module.

[0014] In a third aspect, the present application provides an electronic device, comprising: a processor and a memory, wherein the memory stores a computer program that can be called by the processor, and the processor executes a sapphire crystal rod cutting process monitoring method based on feedback analysis by calling the computer program stored in the memory.

[0015] In a fourth aspect, the present application provides a computer-readable storage medium storing instructions, which, when executed on a computer, enable the computer to execute a sapphire crystal rod cutting process monitoring method based on feedback analysis.

[0016] Compared with the prior art, this application has the following advantages and beneficial effects: This application obtains the cutting depth data, saw wire operation data and crystal rod feeding data during the sapphire crystal rod cutting process, and then quantitatively analyzes the consistency of the crystal rod feeding speed and the saw wire speed at symmetrical cutting depths during the crystal rod cutting process, as well as the consistency of the saw wire vibration and the crystal rod feeding direction, and constructs a cutting stability alarm mechanism based on the consistency analysis results, which effectively improves the stability and cutting efficiency of the crystal rod cutting process. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings: Figure 1 It is a schematic diagram of the overall process of a sapphire crystal rod cutting process monitoring method based on feedback analysis provided in an embodiment of the present application; Figure 2 is a schematic diagram of a crystal rod cutting process provided in an embodiment of the present application; Figure 3 is a schematic diagram of a set of symmetrical cutting depths provided in an embodiment of the present application; Figure 4 It is a structural schematic diagram of a sapphire crystal rod cutting process monitoring system based on feedback analysis provided in an embodiment of the present application; Figure 5 It is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0018] The technical solution of the present application is described in detail below through the accompanying drawings and specific embodiments. It should be understood that the embodiments of the present application and the specific features in the embodiments are detailed descriptions of the technical solution of the present application, rather than limitations on the technical solution of the present application. In the absence of conflict, the embodiments of the present application and the technical features in the embodiments can be combined with each other.

[0019] See also Figure 1 , Figure 1 : is a schematic diagram of the overall process of the sapphire crystal rod cutting process monitoring method based on feedback analysis provided in an embodiment of the present application, which specifically includes the following steps: S1: Obtain the cutting depth data, wire saw operation data and crystal rod feed data during the sapphire crystal rod cutting process, wherein the wire saw operation data and the crystal rod feed data are both time consistent with the cutting depth data, that is, the wire saw operation data, the crystal rod feed data and the cutting depth data are matched with each other and obtained synchronously at the same time point, ensuring that different types of cutting data can work together at the same time point to realize the monitoring and analysis of the crystal rod cutting process.

[0020] S2: Analyze the feed speed consistency and wire speed consistency of symmetrical cutting depth during cutting; See also Figure 2 , Figure 2 : is a schematic diagram of the crystal rod cutting process provided by an embodiment of the present application. The saw wire is wound on a roller, and the saw wire is alternately retracted and released by the roller to complete the crystal rod cutting action. The sapphire crystal rod is a cylindrical workpiece. The contact lengths between the saw wire and the crystal rod at different cutting depths are different. If the same feed speed is collected, the cutting efficiency will be low when the contact length is small, and the wire saw performance cannot be brought into play. Therefore, in the actual cutting process of sapphire crystal rods, variable speed feeding is usually adopted, that is, the feed speed of the crystal rods at different cutting depths is adjusted to match different contact lengths, thereby improving the crystal rod cutting efficiency. The contact lengths between the saw wire and the crystal rod at symmetrical cutting depths are the same, and the feed speed should be kept consistent. When the feed speeds of symmetrical cutting depths are inconsistent, it indicates that there are uneven forces, mechanical deviations or other abnormalities in the cutting process, resulting in an imbalance in the distribution of cutting force and thus affecting the cutting stability. The specific steps for analyzing the consistency of the feed speed include: S21: Obtain cutting depth data and crystal rod feeding data, where the crystal rod feeding data includes crystal rod feeding speed data and crystal rod feeding direction data; S22: Determine the symmetrical cutting depth of the crystal rod based on the cutting depth data ,in, , and Indicates Group symmetrical cutting depth, Indicates the cross-sectional diameter of the crystal rod, see Figure 3 , Figure 3is a schematic diagram of a set of symmetrical cutting depths provided in an embodiment of the present application. When the saw wire cuts along the same direction of the cross section of the crystal rod, when the sum of the two cutting depths is the cross section diameter of the crystal rod, they are a set of symmetrical cutting depths; S23: Cut each set of symmetrical cutting depths Combined with the ingot feeding data, the ingot feeding speed corresponding to the symmetrical cutting depth is extracted and , Indicates cutting depth The ingot feed speed at Indicates cutting depth The ingot feed speed at S24: Calculate the feed speed consistency index based on the ingot feed speed data. The feed speed consistency index is used to evaluate the feed speed consistency at the symmetrical cutting depth during the cutting process. The calculation formula of the feed speed consistency index is: ; In the formula Indicates cutting depth The ingot feed speed at Indicates cutting depth The ingot feed speed at It represents the average feeding speed of the ingot corresponding to all cutting depths, , Indicates the cutting depth is The feeding speed of the crystal rod is The number indicating the cutting depth, Used to normalize the feed rate consistency index, Indicates the number of groups of symmetrical cutting depths, Indicates the feed speed consistency index; Similarly, since the contact length between the saw wire and the crystal rod is different at different cutting depths, different saw wire speeds are usually used to match the different contact lengths. The contact length between the saw wire and the crystal rod is the same for symmetrical cutting depths, and the saw wire speed should also be consistent. If the saw wire speed at symmetrical cutting depths is inconsistent, it will affect the cutting stability and increase the risk of wire breakage or cutting surface damage. The specific steps to analyze the consistency of saw wire speed include: S25: obtaining cutting depth data and saw wire operation data, where the saw wire operation data includes saw wire speed data and saw wire vibration data; S26: Cut each set of symmetrical cutting depths Combined with the saw wire running data, the saw wire speed corresponding to the symmetrical cutting depth is extracted and , Indicates cutting depth The wire speed at Indicates cutting depth Wire speed at S27: Calculate the wire speed consistency index based on the wire speed data. The wire speed consistency index is used to evaluate the wire speed consistency at the symmetrical cutting depth during the cutting process. The calculation formula of the wire speed consistency index is: ; In the formula Indicates cutting depth The wire speed at Indicates cutting depth The wire speed at Represents the average wire speed for all cutting depths. Similarly, , Indicates the cutting depth is The wire speed is The number indicating the cutting depth, Used to normalize the wire speed consistency index, Indicates the number of groups of symmetrical cutting depths, Indicates the wire speed consistency index.

[0021] S3: Analyze the consistency of wire vibration and ingot feeding direction during cutting; During the ingot cutting process, the saw wire vibrates. When the saw wire vibration direction is parallel to the horizontal plane of the ingot feeding direction, the movement of the saw wire can more efficiently cut the ingot material, thereby improving the cutting efficiency and maintaining a uniform distribution of the cutting force, which helps to smoothly carry out the cutting process. However, when the saw wire vibration direction is perpendicular to the horizontal plane of the ingot feeding direction, it will have an adverse effect on the cutting, increase the risk of the saw wire deviating from the normal cutting trajectory, and thus cause defects or even damage to the cutting surface, and even cause the saw wire to break or equipment abnormality. Therefore, the consistency of the saw wire vibration and the ingot feeding direction during the cutting process is of great significance to the cutting stability. The specific steps for analyzing the consistency of the saw wire vibration and the ingot feeding direction during the cutting process include: S31: Acquire saw wire operation data and crystal rod feeding data, where the saw wire operation data includes saw wire speed data and saw wire vibration data, and the crystal rod feeding data includes crystal rod feeding speed data and crystal rod feeding direction data; S32: decomposing the wire vibration data and the component parallel to the horizontal plane of the crystal rod feeding direction as the parallel component of the wire vibration, and decomposing the wire vibration data and the component perpendicular to the horizontal plane of the crystal rod feeding direction as the vertical component of the wire vibration; S33: Calculate the directional consistency index based on the parallel component of the wire vibration and the vertical component of the wire vibration. The directional consistency index is used to evaluate the directional consistency of the wire vibration and the crystal rod feeding during the cutting process. The calculation formula of the directional consistency index is: ; In the formula express The parallel component of the saw wire vibration at time, express The vertical component of the saw wire vibration at time Indicates the wire vibration monitoring time. represents the directional consistency index, It represents the sum of the amplitudes of the saw wire vibration, that is, the overall movement amplitude of the saw wire vibration at all sampling moments, which is used to normalize the directional consistency index. The value range is between, when Close to 1, indicating that the vibration direction of the saw wire is mainly parallel to the feeding direction of the crystal rod, which is beneficial to improve the cutting efficiency and cutting stability. When it is close to 0, it means that the vibration direction of the saw wire is mainly perpendicular to the feeding direction of the crystal rod, which will lead to a decrease in cutting quality and cutting stability.

[0022] S4: Evaluate the stability of the cutting process based on the consistency analysis results of step S2 and step S3 and issue a cutting stability alarm; When the evaluation results of the feed speed consistency of the symmetrical cutting depth, the wire speed consistency, and the wire vibration and the crystal ingot feeding direction consistency are abnormal during the cutting process, it indicates that there is a mechanical imbalance or equipment abnormality in the cutting process, thereby affecting the cutting stability and cutting quality. The specific steps for evaluating the stability of the cutting process include: S41: obtaining a feed speed consistency index and a saw wire speed consistency index at a symmetrical cutting depth during the cutting process, and obtaining a direction consistency index of saw wire vibration and crystal rod feeding during the cutting process; S42: The feed speed consistency index, the wire speed consistency index and the direction consistency index are weighted and summed to obtain a cutting stability index. The cutting stability index is used to evaluate the stability of the cutting process. The calculation formula of the cutting stability index is: ; In the formula Indicates the feed speed consistency index, Indicates the saw wire speed consistency index, represents the directional consistency index, represents the feed speed consistency weight, represents the consistency weight of wire speed, represents the direction consistency weight, represents the cutting stability index; Based on the consistency assessment results, cutting stability alarms can be issued to timely identify potential problems in the cutting process and take corresponding measures to ensure efficient and stable cutting. The specific steps for cutting stability alarms include: S43: Obtaining a cutting stability index and a preset cutting stability threshold; S44: Compare the cutting stability index with a preset cutting stability threshold, and issue a cutting stability alarm when the cutting stability index is less than the preset cutting stability threshold; and do not issue a cutting stability alarm when the cutting stability index is greater than or equal to the preset cutting stability threshold.

[0023] See also Figure 4 , Figure 4 : is a schematic diagram of the structure of a sapphire crystal rod cutting process monitoring system based on feedback analysis provided in an embodiment of the present application. This embodiment provides a sapphire crystal rod cutting process monitoring system based on feedback analysis, including: The data acquisition module 210 is used to acquire the cutting depth data, the wire running data and the crystal rod feeding data during the sapphire crystal rod cutting process; A first analysis module 220 is used to analyze the feed speed consistency and wire speed consistency of the symmetrical cutting depth during the cutting process; The second analysis module 230 is used to analyze the consistency of the direction of the saw wire vibration and the crystal rod feeding during the cutting process; A stability warning module 240, for evaluating the stability of the cutting process based on the consistency analysis result and issuing a cutting stability warning; The control module 250 is used to control the operation of the data acquisition module, the first analysis module, the second analysis module and the stability alarm module.

[0024] In the embodiment of the present application, the first analysis module 220 is used to analyze the feed speed consistency and wire speed consistency of the symmetrical cutting depth during the cutting process. The specific steps of analyzing the feed speed consistency include: Obtain cutting depth data and crystal rod feeding data, where the crystal rod feeding data includes crystal rod feeding speed data and crystal rod feeding direction data; Determine the symmetrical cutting depth of the crystal rod based on the cutting depth data ,in, , and Indicates Group symmetrical cutting depth, Indicates the cross-sectional diameter of the crystal rod; Each set of symmetrical cutting depth Combined with the ingot feeding data, the ingot feeding speed corresponding to the symmetrical cutting depth is extracted and , Indicates cutting depth The ingot feed speed at Indicates cutting depth The ingot feed speed at The feed speed consistency index is calculated based on the ingot feed speed data. The feed speed consistency index is used to evaluate the feed speed consistency at the symmetrical cutting depth during the cutting process. The calculation formula of the feed speed consistency index is: ; In the formula Indicates cutting depth The ingot feed speed at Indicates cutting depth The ingot feed speed at It represents the average feeding speed of the ingot corresponding to all cutting depths, Indicates the number of groups of symmetrical cutting depths, Indicates the feed speed consistency index; The specific steps to analyze wire speed consistency include: Obtain cutting depth data and saw wire operation data, where the saw wire operation data includes saw wire speed data and saw wire vibration data; Each set of symmetrical cutting depth Combined with the saw wire running data, the saw wire speed corresponding to the symmetrical cutting depth is extracted and , Indicates cutting depth The wire speed at Indicates cutting depth Wire speed at The wire speed consistency index is calculated based on the wire speed data. The wire speed consistency index is used to evaluate the wire speed consistency at the symmetrical cutting depth during the cutting process. The calculation formula of the wire speed consistency index is: ; In the formula Indicates cutting depth The wire speed at Indicates cutting depth The wire speed at Represents the average wire speed corresponding to all cutting depths, Indicates the number of groups of symmetrical cutting depths, Indicates the wire speed consistency index.

[0025] In the embodiment of the present application, the second analysis module 230 is used to analyze the consistency of the direction of the saw wire vibration and the crystal rod feeding during the cutting process. The specific steps of analyzing the consistency of the direction of the saw wire vibration and the crystal rod feeding during the cutting process include: Obtain saw wire operation data and crystal rod feeding data, the saw wire operation data includes saw wire speed data and saw wire vibration data, and the crystal rod feeding data includes crystal rod feeding speed data and crystal rod feeding direction data; The component of the saw wire vibration data decomposed parallel to the horizontal plane of the crystal rod feeding direction is taken as the parallel component of the saw wire vibration, and the component of the saw wire vibration data decomposed perpendicular to the horizontal plane of the crystal rod feeding direction is taken as the vertical component of the saw wire vibration; The directional consistency index is calculated based on the parallel component of the saw wire vibration and the vertical component of the saw wire vibration. The directional consistency index is used to evaluate the directional consistency of the saw wire vibration and the crystal rod feeding during the cutting process. The calculation formula of the directional consistency index is: ; In the formula express The parallel component of the saw wire vibration at time, express The vertical component of the saw wire vibration at time Indicates the wire vibration monitoring time. Represents the directional consistency index.

[0026] In the embodiment of the present application, the stability alarm module 240 is used to evaluate the stability of the cutting process based on the consistency analysis result and issue a cutting stability alarm. The specific steps of evaluating the stability of the cutting process include: Obtain the feed speed consistency index and wire speed consistency index at the symmetrical cutting depth during the cutting process, and obtain the direction consistency index of wire vibration and crystal rod feeding during the cutting process; The cutting stability index is obtained by weighted summing the feed speed consistency index, wire speed consistency index and direction consistency index. The cutting stability index is used to evaluate the stability of the cutting process. The calculation formula of the cutting stability index is: ; In the formula Indicates the feed speed consistency index, Indicates the saw wire speed consistency index, represents the directional consistency index, represents the feed speed consistency weight, represents the consistency weight of wire speed, represents the direction consistency weight, represents the cutting stability index; The specific steps for cutting stability alarm include: Obtaining a cutting stability index and a preset cutting stability threshold; The cutting stability index is compared with a preset cutting stability threshold, and a cutting stability alarm is issued when the cutting stability index is less than the preset cutting stability threshold, and no cutting stability alarm is issued when the cutting stability index is greater than or equal to the preset cutting stability threshold.

[0027] The above-mentioned parameters and steps for each unit module to implement corresponding functions in the sapphire crystal rod cutting process monitoring system based on feedback analysis of the present application can refer to the parameters and steps in the embodiment of the sapphire crystal rod cutting process monitoring method based on feedback analysis above, and will not be repeated here.

[0028] like Figure 5 As shown, an embodiment of the present invention further provides an electronic device 300, including a memory 320 for storing a computer program 322; a processor 310 for executing the computer program 322 to implement a sapphire crystal rod cutting process monitoring method based on feedback analysis as in any of the above embodiments.

[0029] It should be noted that Figure 5 It is a structural diagram of an electronic device 300 according to an exemplary embodiment. The content in the diagram cannot be regarded as any limitation on the scope of application of the present invention.

[0030] Specifically, the electronic device 300 may include: at least one processor 310, at least one memory 320, a power supply 330, a communication interface 340, an input / output interface 350, and a communication bus 360. The memory 320 is used to store a computer program 322, which is loaded and executed by the processor 310 to implement the relevant steps in the sapphire crystal rod cutting process monitoring method based on feedback analysis disclosed in any of the above embodiments. In addition, the electronic device 300 in the embodiment of the present invention may be specifically an electronic computer.

[0031] In an embodiment of the present invention, a power supply 330 is used to provide a working voltage for each hardware device on the electronic device 300; the communication interface 340 can create a data transmission channel between the electronic device 300 and an external device, and the communication protocol it follows is any communication protocol that can be applied to the technical solution of the present invention, and is not specifically limited here; the input and output interface 350 is used to obtain external input data or output data to the outside world, and its specific interface type can be selected according to specific application needs and is not specifically limited here.

[0032] In addition, the memory 320, as a carrier for storing resources, can be a read-only memory, a random access memory, a disk or an optical disk, etc. The resources stored thereon can include an operating system 321, a computer program 322, etc., and the storage method can be temporary storage or permanent storage.

[0033] The operating system 321 is used to manage and control the hardware devices and computer programs on the electronic device 300, and can be Windows Server, Netware, Unix, Linux, etc. In addition to the computer program 322 that can be used to complete the sapphire crystal rod cutting process monitoring method based on feedback analysis performed by the electronic device 300 disclosed in any of the aforementioned embodiments, the computer program 322 can further include a computer program 322 that can be used to complete other specific tasks.

[0034] An embodiment of the present invention further provides a computer-readable storage medium for storing a computer program 322. When the computer program 322 is executed by the processor 310, the method for monitoring the sapphire crystal rod cutting process based on feedback analysis as described in any of the above embodiments is implemented.

[0035] For example, the computer readable storage medium can be a read-only memory (ROM), a random access memory (RAM), a compact disc (CD-ROM), a magnetic tape, a floppy disk, an optical data storage device, etc.

Claims

1. A sapphire crystal rod cutting process monitoring method based on feedback analysis, characterized in that: The steps include: S1: Obtaining cutting depth data, wire running data and ingot feeding data during sapphire ingot cutting; S2: Analyze the feed speed consistency and wire speed consistency of symmetrical cutting depth during cutting; S3: Analyze the consistency of wire vibration and ingot feeding direction during cutting; S4: Based on the consistency analysis results of step S2 and step S3, the stability of the cutting process is evaluated and a cutting stability alarm is issued.

2. The sapphire crystal rod cutting process monitoring method based on feedback analysis according to claim 1 is characterized in that: The specific steps of analyzing the consistency of the feeding speed in step S2 include: S21: Obtain cutting depth data and crystal rod feeding data, where the crystal rod feeding data includes crystal rod feeding speed data and crystal rod feeding direction data; S22: Determine the symmetrical cutting depth of the crystal rod based on the cutting depth data ,in, , and Indicates Group symmetrical cutting depth, Indicates the cross-sectional diameter of the crystal rod; S23: Cut each set of symmetrical cutting depths Combined with the ingot feeding data, the ingot feeding speed corresponding to the symmetrical cutting depth is extracted and , Indicates cutting depth The ingot feed speed at Indicates cutting depth The ingot feed speed at S24: Calculate the feed speed consistency index based on the ingot feed speed data. The feed speed consistency index is used to evaluate the feed speed consistency at the symmetrical cutting depth during the cutting process. The calculation formula of the feed speed consistency index is: ； In the formula Indicates cutting depth The ingot feed speed at Indicates cutting depth The ingot feed speed at It represents the average feeding speed of the ingot corresponding to all cutting depths, Indicates the number of groups of symmetrical cutting depths, Indicates the feed rate consistency index.

3. The sapphire crystal rod cutting process monitoring method based on feedback analysis according to claim 2 is characterized in that: The specific steps of analyzing the consistency of the saw wire speed in step S2 include: S25: obtaining cutting depth data and saw wire operation data, where the saw wire operation data includes saw wire speed data and saw wire vibration data; S26: Cut each set of symmetrical cutting depths Combined with the saw wire running data, the saw wire speed corresponding to the symmetrical cutting depth is extracted and , Indicates cutting depth The wire speed at Indicates cutting depth Wire speed at S27: Calculate the wire speed consistency index based on the wire speed data. The wire speed consistency index is used to evaluate the wire speed consistency at the symmetrical cutting depth during the cutting process. The calculation formula of the wire speed consistency index is: ； In the formula Indicates cutting depth The wire speed at Indicates cutting depth The wire speed at Represents the average wire speed corresponding to all cutting depths, Indicates the number of groups of symmetrical cutting depths, Indicates the wire speed consistency index.

4. The sapphire crystal rod cutting process monitoring method based on feedback analysis according to claim 1 is characterized in that: The specific steps of step S3 include: S31: Acquire saw wire operation data and crystal rod feeding data, where the saw wire operation data includes saw wire speed data and saw wire vibration data, and the crystal rod feeding data includes crystal rod feeding speed data and crystal rod feeding direction data; S32: decomposing the wire vibration data and the component parallel to the horizontal plane of the crystal rod feeding direction as the parallel component of the wire vibration, and decomposing the wire vibration data and the component perpendicular to the horizontal plane of the crystal rod feeding direction as the vertical component of the wire vibration; S33: Calculate the directional consistency index based on the parallel component of the wire vibration and the vertical component of the wire vibration. The directional consistency index is used to evaluate the directional consistency of the wire vibration and the crystal rod feeding during the cutting process. The calculation formula of the directional consistency index is: ； In the formula express The parallel component of the saw wire vibration at time, express The vertical component of the saw wire vibration at time Indicates the wire vibration monitoring time. Represents the directional consistency index.

5. The sapphire crystal rod cutting process monitoring method based on feedback analysis according to claim 1 is characterized in that: The specific steps of evaluating the stability of the cutting process in step S4 include: S41: obtaining a feed speed consistency index and a saw wire speed consistency index at a symmetrical cutting depth during the cutting process, and obtaining a direction consistency index of saw wire vibration and crystal rod feeding during the cutting process; S42: The feed speed consistency index, the wire speed consistency index and the direction consistency index are weighted and summed to obtain a cutting stability index. The cutting stability index is used to evaluate the stability of the cutting process. The calculation formula of the cutting stability index is: ； In the formula Indicates the feed speed consistency index, Indicates the saw wire speed consistency index, represents the directional consistency index, represents the feed speed consistency weight, represents the consistency weight of wire speed, represents the direction consistency weight, Represents the cutting stability index.

6. The sapphire crystal rod cutting process monitoring method based on feedback analysis according to claim 1, characterized in that: The specific steps of performing the cutting stability alarm in step S4 include: S43: Obtaining a cutting stability index and a preset cutting stability threshold; S44: Compare the cutting stability index with a preset cutting stability threshold, and issue a cutting stability alarm when the cutting stability index is less than the preset cutting stability threshold; and do not issue a cutting stability alarm when the cutting stability index is greater than or equal to the preset cutting stability threshold.

7. A sapphire crystal rod cutting process monitoring system based on feedback analysis, applied to a sapphire crystal rod cutting process monitoring method based on feedback analysis as claimed in any one of claims 1 to 6, characterized in that: The system comprises: A data acquisition module is used to acquire cutting depth data, saw wire running data and crystal rod feeding data during the sapphire crystal rod cutting process; The first analysis module is used to analyze the feed speed consistency and wire speed consistency of the symmetrical cutting depth during the cutting process; The second analysis module is used to analyze the consistency of the direction of saw wire vibration and crystal rod feeding during the cutting process; A stability alarm module is used to evaluate the stability of the cutting process based on the consistency analysis results and issue a cutting stability alarm; The control module is used to control the operation of the data acquisition module, the first analysis module, the second analysis module and the stability alarm module.

8. An electronic device, comprising: A processor and a memory, wherein the memory stores a computer program that can be called by the processor; characterized in that the processor executes the sapphire crystal rod cutting process monitoring method based on feedback analysis as described in any one of claims 1 to 6 by calling the computer program stored in the memory.

9. A computer-readable storage medium, characterized in that: Instructions are stored, and when the instructions are executed on a computer, the computer is caused to execute the sapphire crystal rod cutting process monitoring method based on feedback analysis as described in any one of claims 1 to 6.

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