Inductor assembly and power transmission unit including same
By designing a non -flat imitation structure cooling channel between the bottom and the back panel of the electrochemical component, the problem of insufficient heat dissipation performance of existing electromor components has been solved, and more efficient cooling and manufacturing costs are achieved.
Patent Information
- Application Number
- CN202310923426.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-07-25
- Publication Date
- 2025-01-28
AI Technical Summary
The thermal dissipation performance of existing inductor components is insufficient, resulting in the inability to effectively cool the coil windings and high manufacturing costs.
A inductor component is designed, and a non -flat imitation structure cooling channel is formed between the bottom of the shell and the back panel, which is closely corresponding to the outer surface of the coil winding, thereby improving the heat conduction area and cooling efficiency, and reducing the amount of thermal conductivity. Reduce manufacturing costs.
Improve the heat dissipation performance of the electrical sensor component, reduce the gap between the coil winding and the shell, reduce the amount of thermal conductivity, and save the manufacturing cost.
Smart Images
Figure CN119381123A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of electric vehicles, and in particular to an inductor component with good heat dissipation performance and a power transmission unit including the inductor component. Background Art
[0002] As used herein, the term "electric vehicle" includes vehicles having a vehicle propulsion motor, such as a battery electric vehicle (BEV), a hybrid electric vehicle (HEV), and a plug-in hybrid electric vehicle (PHEV). Generally speaking, an electric vehicle may include a power transfer unit (PTU) in which a DC boost circuit including an inductor assembly is used to boost a lower DC voltage provided by a battery to a voltage value required for normal operation. A typical inductor assembly includes a magnetic core and a coil winding wound around the magnetic core, which generates heat during operation to cause power loss of the vehicle inductor. In order for the inductor to operate efficiently, a cooling device is required to dissipate heat from the coil winding.
[0003] In the prior art, Figure 1 As shown in the schematic diagram, the current inductor 1 is usually potted with thermally conductive glue and cooled by a cooling medium flowing through the cooling channel 2 below it in the vertical direction. The cooling channel 2 used in the existing inductor assembly is designed in a flat form with heat dissipation fins in the inductor housing. As can be seen from the figure, since the cooling channel 2 designed in the housing is in a flat form below the inductor 1, only a small part of the coil winding is relatively close to the flat surface of the cooling channel. In other words, the cooling medium cannot flow as close to the coil winding as possible, which will cause a limited amount of heat to be dissipated and the coil winding cannot be effectively cooled. In addition, since there is a relatively large gap between the housing and the coil winding and between the coil windings, this part of the space requires additional thermally conductive glue for potting, and the relatively expensive thermally conductive glue will cause high manufacturing costs for the inductor assembly.
[0004] It should be noted that the "background technology" section is only used to help understand the content of the present invention, so the content disclosed in the "background technology" section may contain some prior art that is not known to those skilled in the art. The content disclosed in the "background technology" section does not mean that the content or the problems to be solved by one or more embodiments of the present invention have been known or recognized by those skilled in the art before the application of the present invention. Summary of the invention
[0005] The object of the present invention is to overcome the defects in the above-mentioned prior art and provide an improved inductor assembly and a power transmission unit including the inductor assembly, wherein the inductor assembly has improved heat dissipation performance and reduced manufacturing cost.
[0006] To achieve the above-mentioned purpose, an inductor assembly is provided, comprising: a shell, the bottom of which has a first surface facing the inside of the shell and a second surface opposite to the first surface; an inductor, which comprises a magnetic core and a coil winding arranged around the magnetic core, and the inductor is fixed in the shell by using a thermally conductive adhesive so that the gap between the outer peripheral surface of the coil winding and the first surface of the shell is filled with the thermally conductive adhesive; a back plate, the back plate covers the second surface of the shell, and below the area where the inductor is arranged, the back plate is spaced apart from the second surface, so that a cooling channel is formed between the bottom of the shell and the back plate for cooling medium to flow through; wherein in the corresponding area where the cooling channel is formed, the bottom of the shell and the back plate are respectively formed as non-flat contoured structures, and the shape of the contoured structure corresponds to the shape of the outer peripheral surface of the coil winding.
[0007] According to another aspect of the present invention, a power transmission unit for an electric vehicle is provided, comprising the inductor assembly according to the above invention, for boosting a DC voltage provided by a battery of the electric vehicle to a voltage value required for normal operation. BRIEF DESCRIPTION OF THE DRAWINGS
[0008] The above and other aspects of the present invention will be more thoroughly understood and appreciated with reference to the accompanying drawings, in which:
[0009] Figure 1 It is a partial cross-sectional view along the vertical direction of an inductor assembly according to the prior art, showing the coil winding of the inductor and the flat cooling channel located therebelow;
[0010] Figure 2 A partial cross-sectional view of an inductor assembly along a vertical direction according to a preferred embodiment of the present invention is shown, showing a coil winding of the inductor and a contoured housing bottom and a back plate, wherein a non-flat cooling channel is defined between the housing bottom and the back plate;
[0011] Figure 3A The profile structure of the inner surface of the bottom of the housing of the inductor assembly according to the present invention is shown in a plan view, with the coil windings removed for clarity, wherein the wave crests between the coil windings are presented as a continuous structure in the lateral direction;
[0012] Figure 3B The contoured structure of the inner surface of the bottom of the housing of the inductor assembly according to the present invention is shown in plan view, with the coil winding removed for clarity. Figure 3A In contrast, the crests located between the coil windings present a discontinuous structure in the transverse direction;
[0013] Figure 4Ais an internal plan view of an inductor assembly according to the present invention after removing the bottom back plate, which clearly shows the cooling channels used and the heat dissipation feature structures arranged in the cooling channels;
[0014] Figure 4B for Figure 4A A perspective view of the inductor assembly shown in FIG. 1 with the bottom side back plate removed clearly showing the flow path of the cooling medium. DETAILED DESCRIPTION
[0015] In order to make the technical problems, technical solutions and beneficial technical effects to be solved by the present invention clearer, the present invention will be further described in detail in conjunction with the accompanying drawings and exemplary embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the scope of protection of the present invention. Unless otherwise clearly stated in the drawings, the sizes, positions, etc. of various parts, features, elements, etc. and any distances therebetween are not necessarily drawn to scale, and may be disproportionate and / or exaggerated for the sake of clarity.
[0016] The terms used herein are only used to describe the purpose of specific exemplary embodiments, and are not intended to be restrictive. As used herein, unless the context clearly indicates, the singular forms "one", "an" and "the" are intended to also include plural forms. It should be recognized that the terms "include", "comprise" and / or "compose" when used in this specification specify the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or combinations thereof. Unless otherwise indicated, when the range of values is enumerated, the upper and lower limits of the range are included, as well as any sub-ranges therebetween. Unless otherwise specified, terms such as "first", "second", etc., are only used to distinguish one element from another element. For example, an element may be referred to as a "first element", and similarly, another element may be referred to as a "second element", and vice versa. The paragraph titles used herein are only used for organizational purposes and should not be interpreted as limiting the subject matter described.
[0017] Unless otherwise indicated, the terms "about," "approximately," "substantially," and the like mean that quantities, sizes, formulations, parameters, and other quantities and features are not and need not be exact, but may be approximate and / or larger or smaller as desired.
[0018] As shown in the figure, spatially relative terms such as "right", "left", "below", "below", "down", "above", and "upper" can be used to describe the relationship of one element or feature to another element or feature in this article for ease of description. It should be recognized that in addition to the orientation depicted in the figure, the spatially relative terms are also intended to include different orientations. For example, if the object in the figure is turned over, the element described as "below other elements or features" or "below other elements or features" will be oriented to "above other elements or features". Therefore, the term "below" can, for example, include two orientations of above and below. The object can be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein can be interpreted accordingly.
[0019] Unless expressly indicated otherwise, all connections and all operative connections may be direct or indirect. Likewise, unless expressly indicated otherwise, all connections and all operative connections may be rigid or non-rigid.
[0020] Like reference numerals refer to like elements throughout the text. Therefore, the same or similar reference numerals may be described with reference to other figures even if they are neither mentioned nor described in the corresponding figures. Moreover, even elements that are not marked with reference numerals may be described with reference to other figures.
[0021] See also Figure 2, which is a partial cross-sectional view of an inductor assembly according to a preferred embodiment of the present invention along the vertical direction. In this embodiment, an inductor assembly used in a power transmission unit of an electric vehicle is used as an example for explanation and description, but it can be understood that the inductor assembly conceived according to the present invention can also be applied to other occasions such as photovoltaics and energy storage inverters. As shown in the figure, the inductor assembly generally includes a housing 10, an inductor 20 and a back plate 30. The bottom of the housing 10 has a first surface 101 facing the interior of the housing and a second surface 102 opposite to the first surface. The inductor 20 includes a magnetic core and a coil winding arranged around the magnetic core (two magnetic cores 201a, 201b and two corresponding coil windings 202a, 202b are shown in the figure). After other electronic components including the inductor and structural components for supporting each electronic component are placed inside the housing, the interior of the entire housing 10 is potted with a thermal conductive adhesive 40 so that the thermal conductive adhesive 40 fills the gaps between each component and the housing 10, especially the gaps between the outer peripheral surfaces of the coil windings 202a, 202b and the first surface 101 of the housing 10. After curing, the thermal conductive adhesive has high insulation, high thermal conductivity and high strength, which can not only play a dual role of fixing and protecting the inductor, but also can transfer the heat generated by the coil winding from the inside of the inductor to the external space in a timely manner. Furthermore, the second surface 102 of the housing 10 is covered with the back plate 30, and below the region where the inductor 20 is disposed, the back plate 30 is spaced apart from the second surface 102, so that a cooling channel 50 is formed between the bottom of the housing 10 and the back plate 30 in this region for the cooling medium to flow through. Figure 1 The flat bottom of the shell and the cooling channel in the prior art are different in that, in order to improve the heat dissipation efficiency of the entire inductor assembly and save the potting cost of the thermal conductive glue, the corresponding area of the cooling channel is formed in the present invention, and the bottom of the shell 10 and the back plate 30 are respectively formed as non-completely flat profiling structures, and the non-flat shape of the profiling structure corresponds to the shape of the outer peripheral surface of the inductor coil winding. For example, if a part of the outer peripheral surface of the coil winding is a plane, then the bottom of the shell 10 and the surface of the corresponding part of the back plate 30 are formed as corresponding planes; if a part of the outer peripheral surface of the coil winding is a convex arc surface, then the bottom of the shell 10 and the surface of the corresponding part of the back plate 30 are formed as corresponding concave arc surfaces. It should be understood by those skilled in the art that the "corresponding" does not mean that the two have exactly the same contours, as long as their outer contours are roughly equivalent. The profiling structures formed on the bottom of the shell and the back plate are preferably formed integrally with the shell and the back plate, respectively, and the material is a metal with good thermal conductivity.
[0022] The structure of the above-mentioned profiling structure is described in detail below in conjunction with the accompanying drawings. Figure 2As shown, the contoured structure formed on the bottom of the shell includes a peak portion 110, which is arranged on the first surface 101 of the bottom of the shell and rises toward the inside of the shell along the vertical direction. Figure 3A and Figure 3B It can be seen that the crest portion 110 extends a certain length in a transverse direction parallel to the axial direction of the inductor coil winding. Accordingly, the second surface 102 of the housing is concave at a corresponding position of the crest portion 110 formed with the first surface 101 to form a recessed portion 120. Similarly, the recessed portion 120 extends the same length as the crest portion 110 in the transverse direction. In order to facilitate the processing of the bottom of the housing, the depth of the recessed portion 120 from the second surface 102 is less than the height of the crest portion 110 formed on the first surface 101. Taking the figure as an example, the inductor includes a first coil winding 202a and a second coil winding 202b arranged side by side along the longitudinal direction (i.e., the left and right direction shown in the figure, which is perpendicular to both the vertical direction and the transverse direction). The first coil winding 202a has a first outer peripheral surface 2021a, and the second coil winding 202b has a second outer peripheral surface 2021b. The first outer peripheral surface 2021a and the second outer peripheral surface 2021b are both convex cylindrical surfaces and constitute the overall outer peripheral surface of the inductor. Correspondingly, the profiling structure formed on the first surface 101 at the bottom of the shell has a concave cylindrical surface (two sections in the figure) separated by the crest portion 110, wherein one section of the concave cylindrical surface 1102a is opposite to the first outer peripheral surface 2021a, and the other section of the concave cylindrical surface 1102b is opposite to the second outer peripheral surface 2021b, and the gaps between each section of the concave cylindrical surface and the outer peripheral surface of the corresponding coil winding are uniformly distributed. Specifically, the heat generated by the inductor 20 is mainly concentrated in the first coil winding 202a and the second coil winding 202b. The first outer peripheral surface 2021a is the heating surface of the first coil winding 202a, and the second outer peripheral surface 2021b is the heating surface of the second coil winding 202b. By setting the first outer peripheral surface 2021a and the second outer peripheral surface 2021b to be convex cylindrical surfaces, and the shell bottom being divided into multiple sections of concave cylindrical surfaces by means of the crest portion 110, the heat conduction area of the profiling structure formed at the shell bottom is larger than the heat conduction area of the flat bottom in the prior art, so that the heat conduction efficiency of the crest portion 110 is improved, which is conducive to improving the heat dissipation effect of the inductor. In addition, the profiling structure formed at the shell bottom can significantly reduce the gap between the shell bottom and the coil windings 202a, 202b, so that the path for the heat generated at various parts of the inductor to be conducted through the heat conductive adhesive 40 is shorter, thus reducing the proportion of the heat conductive adhesive with a lower thermal conductivity than the metal shell during the heat conduction process, thereby improving the heat dissipation effect of the inductor. On the other hand, since the gaps between the coil windings are at least partially occupied by the profiling structure at the shell bottom, the amount of relatively expensive heat conductive adhesive can be saved, thereby saving the overall cost of the inductor assembly.
[0023] In the above embodiment, two coil windings are arranged side by side for explanation and description. However, those skilled in the art will appreciate that a plurality of coil windings of inductors may be arranged along the longitudinal direction at the bottom of the shell. In this case, a plurality of peaks 110 are formed at the bottom of the shell, wherein each peak 110 protrudes into the gap between the coil windings of adjacent inductors, and a space for accommodating the corresponding inductor is formed between adjacent peaks 110. It should also be noted that in order to prevent the peaks 110 made of metal from blocking the magnetic flux between the coil windings due to excessive protrusion height, the height of the peaks 110 protruding into the gaps is preferably not more than one third of the overall height of the coil windings 202a, 202b in the vertical direction. Figure 2 It can be seen from the cross section shown that the cross section of the coil windings 202a, 202b in the cross-sectional direction is not strictly circular, but is approximately flat on the four sides of the upper, lower, left and right sides, and is formed by connecting two adjacent planes through a similar rounded arc surface, wherein the radius of curvature of the arc surface is approximately equal to the length of the left and right flat sides in the vertical direction. In this case, the top surface 1101 of the crest portion 110 protruding into the gap between adjacent inductors is at most at the height of the transition portion between the arc surface and the flat side surface, so that it can be ensured that the concave cylindrical surfaces 1102a, 1102b on both sides of the crest portion 110 form a rounded transition with an approximately obtuse angle with the top surface 1101, thereby facilitating the demolding operation when processing the housing. Similarly, in the case where the cross section of the coil winding is approximately circular, it is also required that the height of the crest portion 110 protruding into the gap between adjacent inductors does not exceed one third of the diameter of the coil winding (i.e., the height in the vertical direction). Similar to the above description of the coil winding with a non-circular cross section, such an arrangement can still ensure that the magnetic flux between adjacent coil windings is not blocked, and facilitate the demolding operation when processing the housing. Compared with the crests 110 protruding into the gaps between adjacent inductors, the crests 110 at the outermost ends of a series of inductors can protrude from the first surface 101 to a greater height, usually one-third to one-half of the overall height of the coil winding, so as to facilitate the positioning of the coil winding in the contoured structure at the bottom of the housing.
[0024] In addition to a portion of the bottom of the housing 10 used to accommodate the inductor 20 being processed into a contoured structure corresponding to the coil windings 202a, 202b of the inductor 20, the back plate 30 used to cover the housing 10 is also processed into a contoured structure in the area corresponding to the contoured structure of the housing bottom. As shown in the figure, the contoured structure of the back plate 30 is constructed to correspond to the shape of the second surface 102 of the housing bottom, so that the height of the cooling channel 50 formed between the bottom of the housing 10 and the back plate 30 in the vertical direction is consistent. In other words, the cooling channel 50 has a cross-section of the same size throughout the entire flow path. Such a configuration can ensure that the cooling medium maintains a relatively constant speed and pressure when flowing through the cooling channel 50. In order to further improve the heat dissipation efficiency of the inductor assembly, a heat dissipation feature structure is provided in the cooling channel 50. The heat dissipation feature structure is in the form of an array composed of a plurality of pin-type feature structures 60, each of which includes a body 601 extending from the second surface 102 of the housing bottom and a round head 602 located at the end of the body. See Figure 2 And combined Figure 4A and Figure 4BAs shown, the pin-type feature structure 60 extends from the second surface 102 of the bottom of the housing toward the back plate 30 in the vertical direction. Ideally, the distance that each pin-type feature structure 60 extends corresponds to the height of the cooling channel 50 in the vertical direction. That is, for each pin-type feature structure, regardless of which part of the second surface contour structure it is located in, the distance it extends toward the back plate is substantially equal to the height of the cooling channel, so that when assembled, the round head 602 of the pin-type feature structure 60 substantially contacts the back plate 30. It should be noted here that since the back plate 30 is also contoured, the surface of the back plate 30 to be contacted by the round head 602 of the pin-type feature structure 60 is not flat, so the round heads 602 of some of the pin-type feature structures 60 in the array are chamfered to match the non-flat surface of the back plate 30. In practical operation, considering factors such as fitting tolerance, the vertical extension distance (e.g., 3.5 mm) of the heat dissipation feature structure is slightly smaller than the vertical height (e.g., 4 mm) of the cooling channel 50. By means of the above arrangement, when the cooling medium flows through the cooling channel 50, it is necessary to bypass each pin-type feature structure 60. By arranging the array formed by the pin-type feature structure 60 in the cooling channel 50, the turbulence of the cooling medium in the cooling channel 50 can be enhanced, and the heat dissipated from the coil windings 202a and 202b can be effectively taken away, thereby improving the heat dissipation effect of the inductor assembly. In addition, it can be seen from the accompanying drawings that the spacing between two adjacent pin-type feature structures 60 in each row or column of the array is the same and the spacing is determined based on the diameter of the round head 602 of the pin-type feature structure 60. In practical operation, the above spacing is 9 mm and the diameter of the round head is 3 mm, that is, the spacing between two adjacent pin-type feature structures in the same row or column is 3 times the diameter of the pin-type feature structure. However, the present invention is not limited thereto, and the size and spacing of the pin-type characteristic structures can be flexibly set according to actual needs. Moreover, those skilled in the art can imagine that other forms of heat dissipation characteristic structures (such as plate fins, etc.) can also be used to replace the above-mentioned pin-type characteristic structures.
[0025] Further, Figure 3A and Figure 3B The first surface 101 of the bottom of the housing of the inductor assembly is shown from a top view (the inductor is removed for clarity). As can be seen from the figure, a mounting frame 11 is provided in a portion of the bottom of the housing, and the mounting frame 11 defines accommodating spaces I, II, III and IV, each of which accommodates a coil winding of an inductor, that is, the coil windings arranged in a 2×2 array (respectively along the left and right longitudinal directions and the up and down lateral directions shown in the figure) are provided in the portion. Figure 3AAs can be seen, the peak portion 110 located between the coil windings is formed as a continuous structure in the transverse direction, and the two end faces 1103a and 1103b of the peak portion 110 in the transverse direction are substantially perpendicular to the first surface 101 of the bottom of the housing. In practical operations, for the convenience of the demolding operation during the housing processing, the above two end faces can be slightly inclined at a certain angle towards the region where the accommodation space is located, and even can be processed into beveled surfaces in order to avoid the rest of the electronic components or structural parts arranged in the housing. Compared with Figure 3A In Figure 3B , the peak portion 110 located between the coil windings presents a discontinuous structure in the transverse direction. Similarly to the embodiment shown in Figure 3A , 2×2 arrayed coil windings are also arranged in the accommodation spaces I, II, III, and IV. The difference is that an additional magnetic core (not shown in the figure) is arranged in the region V between the four coil windings. The additional magnetic core can change the "mouth" - shaped magnetic flux transfer (i.e., the magnetic flux is sequentially circulated through the coil windings arranged in the accommodation spaces I, II, III, IV, and I) in Figure 3A to an "∞" - shaped magnetic flux transfer (i.e., the magnetic flux is sequentially circulated through the coil windings arranged in the accommodation spaces I, V, III, II, V, IV, and I), thereby improving the working efficiency of the inductor. Correspondingly, in the embodiment shown in Figure 3B , the peak portion 110 between the coil windings is formed into two sections spaced apart in the transverse direction. The bottom of the housing between these two peak portions 110 remains flat so that this part of the space can be used to accommodate the additional magnetic core. Correspondingly, the back - plate part corresponding to this part of the bottom of the housing is also constructed in a flat shape. Those skilled in the art can think that the inductor according to the inventive concept is not limited to the above 2×2 array arrangement, but can be flexibly set according to actual needs. For example, M columns can be arranged along the longitudinal direction, and N并排 inductors (M and N are positive integers) can be arranged in each column along the transverse direction (i.e., along the axial direction of the inductor coil windings). Correspondingly, from the Figure 2 perspective of the cross - section shown, at this time, the profiling structure of the bottom of the housing forms M - 1 peak portions 110. Similarly, in the case where an additional magnetic core is arranged between two adjacent rows of inductors arranged along the transverse direction, the additional magnetic core will separate the peak portions between the respective coil windings into N - 1 discontinuous structures in the transverse direction. In addition, it should be understood that the size of the profiling structure formed by the bottom of the housing and the back - plate in the above transverse direction should be greater than the sum of the thicknesses of each row of inductors in the axial direction so that when observing the profiling structure from the Figure 3A and Figure 3B perspective of the top view shown, the profiling structure can completely cover the area where the above - mentioned inductor is arranged, so as to ensure that the cooling channels can be formed to spread under each inductor.
[0026] The following combination Figure 4A and Figure 4B The flow path of the cooling medium is further described. As shown in the figure, the housing 10 is provided with a main inlet 103 and a main outlet 104 for the cooling medium on the side, and the housing is provided with a plurality of cooling areas for cooling different electronic components at the bottom, and the housing is further provided with a protruding partition 105 at the bottom to separate the various cooling areas from each other, and a respective cooling medium inlet and cooling medium outlet are provided for each cooling area. Taking the illustrated embodiment as an example, the cooling medium first enters the first cooling area 111 after flowing in through the main inlet 103, and a first branch outlet 1001 is provided in the first cooling area 111 for the cooling medium to flow to the external environment, and a first branch guide port 1002 is provided for the cooling medium to be diverted from the first cooling area 111 to the upper area (not shown in the figure) of the inductor assembly to cool other electronic components located in the corresponding area. In addition, the cooling channel between the bottom of the shell and the back plate according to the present invention is located in the second cooling area 222 roughly close to the center of the bottom of the shell, and a second branch guide port 1003 is provided in this partial area to receive the cooling medium from the upper area of the inductor assembly. The cooling medium flows through the second branch guide port 1003 and enters the cooling channel. In the cooling channel, a turbulent flow is formed by the array formed by the aforementioned heat dissipation characteristic structure, thereby taking away the heat generated by the coil winding. The cooling medium flowing through the cooling channel 50 further flows through the third cooling area 333, and the third cooling area 333 is respectively connected to the main outlet 104 and the second branch outlet 1004 to guide the cooling medium to the external environment. It should be noted here that the cooling medium used in the present invention is, for example, an ethanol-type, glycerol-type or ethylene glycol-type coolant. However, it can be anticipated by those skilled in the art that the inductor assembly of the present invention can also be air-cooled as needed, and the cooling medium can be selected from air or hydrogen, for example.
[0027] In summary, for inductor components with higher heat dissipation requirements, by adopting the technical solution of the present invention, the heat generated by the coil winding can be more efficiently transferred to a non-flat cooling channel that conforms to the shape of the coil winding as closely as possible, and the cost of potting thermal conductive adhesive can be saved by reducing the gap between the coil winding and the shell and between the coil windings.
[0028] The above describes in detail a feasible but non-limiting implementation of the inductor assembly according to the present invention with the aid of the accompanying drawings. For those skilled in the art, without departing from the scope and essence of the present disclosure as set forth in the following claims, modifications and supplements to the technology and structure and the re-combination of the features in each embodiment should be considered to be included in the scope of the present invention. Therefore, these modifications and supplements that can be conceived under the teachings of the present invention should be considered as part of the present disclosure. The scope of the present disclosure is defined by the claims attached below, and includes equivalent technologies known at the filing date of the present disclosure and equivalent technologies that have not yet been foreseen.
Claims
1. An inductor assembly, characterized in that: include: A housing (10), the bottom of the housing (10) having a first surface (101) facing the interior of the housing and a second surface (102) opposite to the first surface (101); An inductor (20), comprising a magnetic core (201a, 201b) and a coil winding (202a, 202b) arranged around the magnetic core, wherein the inductor (20) is fixed in the housing (10) using a thermally conductive adhesive (40) so that a gap between an outer peripheral surface of the coil winding (202a, 202b) and a first surface (101) of the housing (10) is filled with the thermally conductive adhesive (40); a back plate (30), the back plate (30) covering the second surface (102) of the housing (10), and being spaced apart from the second surface (102) below a region where the inductor (20) is disposed, so as to form a cooling channel (50) between the bottom of the housing (10) and the back plate (30) for a cooling medium to flow through; In the corresponding area where the cooling channel (50) is formed, the bottom of the shell (10) and the back plate (30) are respectively formed into non-flat contoured structures, and the shape of the contoured structure corresponds to the shape of the outer peripheral surface of the coil winding (202a, 202b).
2. The inductor assembly according to claim 1, characterized in that The contoured structure formed at the bottom of the shell (10) comprises a wave crest portion (110), the wave crest portion (110) being arranged on the first surface (101) and rising toward the inside of the shell along the vertical direction, and the wave crest portion (110) extending a certain length in a transverse direction parallel to the axial direction of the coil windings (202a, 202b).
3. The inductor assembly according to claim 2, characterized in that The second surface (102) of the shell (10) is recessed at a position corresponding to the crest portion (110) formed on the first surface (101) to form a recessed portion (120), wherein the recessed portion (120) extends in the transverse direction by the same length as the crest portion (110), and the depth of the recessed portion (120) from the second surface (102) is less than the height of the crest portion (110) formed on the first surface (101).
4. The inductor assembly according to claim 3, characterized in that The contoured structure of the back plate (30) is configured to correspond to the shape of the second surface (102) of the bottom of the shell (10), so that the height of the cooling channel (50) formed between the bottom of the shell (10) and the back plate (30) remains consistent in the vertical direction.
5. The inductor assembly according to any one of claims 2 to 4, characterized in that: The bottom of the housing (10) is formed with a plurality of wave peaks (110) in a longitudinal direction perpendicular to both the vertical direction and the transverse direction, wherein each wave peak (110) in the middle protrudes into the gap between the coil windings (202a, 202b) of adjacent inductors (20), and a space for accommodating the corresponding coil windings is formed between adjacent wave peaks (110).
6. The inductor assembly according to claim 5, characterized in that The height of the peak portion (110) protruding into the gap does not exceed one third of the overall height of the coil windings (202a, 202b) in the vertical direction, and the height of the peak portions located at the outermost ends in the longitudinal direction is one third to one half of the overall height of the coil windings (202a, 202b) in the vertical direction.
7. The inductor assembly according to claim 5, characterized in that A mounting frame (11) defining an accommodation space is provided in a portion of the bottom area of the housing (10), and the accommodation space is used to accommodate an inductor array arranged in the longitudinal direction and the transverse direction.
8. The inductor assembly according to claim 7, characterized in that The peak portion (110) between each coil winding (202a, 202b) is formed into a continuous structure in the transverse direction; or an additional magnetic core is provided between two adjacent rows of inductors arranged along the transverse direction, and the additional magnetic core separates the peak portion (110) between each coil winding (202a, 202b) into a discontinuous structure in the transverse direction.
9. The inductor assembly according to any one of claims 1 to 4, characterized in that: A heat dissipation feature structure is disposed in the cooling channel (50) and extends vertically from a second surface (102) at the bottom of the housing (10) toward the back plate (30).
10. The inductor assembly according to claim 9, characterized in that The heat dissipation feature structure is an array composed of a plurality of pin-type feature structures (60), and the distance each pin-type feature structure (60) extends in the vertical direction corresponds to the height of the cooling channel (50); The pin-type feature structure (60) comprises a body (601) vertically extending from the second surface (102) and a round head (602) located at the end of the body (601), and a portion of the round head (602) of the pin-type feature structure (60) is chamfered to adapt to the non-flat surface of the back plate (30); as well as The spacing between adjacent pin-type feature structures (60) in each row or column is the same as each other and is determined based on the diameter of the rounded head (602) of the pin-type feature structure (60).
11. The inductor assembly according to any one of claims 1 to 4, characterized in that: The shell (10) is provided with a main inlet (103) and a main outlet (104) for the cooling medium at the side, and the shell (10) is provided with a plurality of cooling areas (111, 222, 333) separated from each other by means of a protruding partition (105) at the bottom, each cooling area is provided with its own cooling medium inlet and cooling medium outlet, and the cooling channel (50) is located in one of the cooling areas.
12. A power transmission unit for an electric vehicle, characterized in that: The inductor assembly according to any one of claims 1 to 11 is used to boost a DC voltage provided by a battery of an electric vehicle to a voltage value required for normal operation.