A chip substrate loading mechanism and a semiconductor packaging device

Abstract

The present invention provides a chip substrate loading mechanism and a semiconductor packaging device, which mainly include a first base that moves in a reciprocating linear motion, a second moving layer that moves relative to the first base. A first suction cup assembly, a first substrate clamping assembly, a second suction cup assembly, and a second tray clamping assembly are arranged on the second moving layer. The first suction cup assembly and the first substrate clamping assembly are arranged on the same side, the second suction cup assembly and the second tray clamping assembly are arranged on the same side, and the positions of the first suction cup assembly and the second suction cup assembly correspond to each other, and the positions of the first substrate clamping assembly and the second tray clamping assembly correspond to each other. The first suction cup assembly adsorbs and fixes the encapsulated chip substrate, the second suction cup assembly adsorbs the waste film, at the same time the first substrate clamping assembly provides the unencapsulated chip substrate, and the second tray clamping assembly conducts the transmission of the resin. Through the secondary extension of the second moving layer, the resin and the chip substrate can be simultaneously transmitted between the lower die and the upper die of the press unit, improving the packaging efficiency.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor chip substrate packaging, and in particular to a chip substrate loading mechanism and a conductor packaging device. Background Art

[0002] As time goes by, semiconductor technology continues to advance, and more complex semiconductor devices such as integrated circuits and large-scale integrated circuits have gradually been developed. The development of these technologies has greatly promoted the progress of computers, communications, medical treatment and other fields, making our lives more convenient and efficient.

[0003] The compression packaging of chip substrates is an indispensable step. Traditional compression packaging equipment for chip substrates requires manual loading, which has low precision and increased risk factors for manual operation. At the same time, regarding the transmission of resin, traditional equipment needs to be divided into two transmission mechanisms with the transmission of chip substrates and run on the same plane track. The transportation process is that the first loading mechanism first feeds the substrate into the press and then exits the press area. Then the second loading mechanism feeds the resin into the press and then exits. The press performs mold clamping and pressurization to package the chip. This loading method requires a certain amount of time to allow the chip substrate transport mechanism to completely exit the press before the resin can be transported, resulting in a complicated process and low production efficiency. Summary of the invention

[0004] The present invention provides a chip substrate loading mechanism, which solves the problem in the above technical background that the resin and the chip substrate of the traditional packaging equipment cannot be fed into the press unit at the same time, resulting in low packaging efficiency.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] A chip substrate loading mechanism, comprising:

[0007] The first base is capable of reciprocating linear movement;

[0008] a second movable layer, movably arranged relative to the first base, the second movable layer comprising a second movable substrate, and the second movable layer is movably arranged on the first base through the second movable substrate;

[0009] A first suction cup assembly is liftable and arranged on the upper side of the second movable substrate, and the first suction cup assembly is used to absorb and fix the packaged chip substrate;

[0010] A first substrate clamping assembly is movably disposed on the upper side of the second movable substrate and is spaced apart from the first suction cup assembly. The first substrate clamping assembly is used for transporting unpackaged chip substrates.

[0011] A second suction cup assembly is disposed at the lower side of the second movable substrate and corresponds to the position of the first suction cup assembly, and the second suction cup assembly is used to absorb the waste film after packaging;

[0012] The second tray clamping assembly is arranged at the lower side of the second movable substrate and corresponds to the position of the first substrate clamping assembly. The second tray clamping assembly is used for moving the resin tray, thereby realizing the transportation of the resin and the reciprocating use of the resin tray.

[0013] In some embodiments, a first moving layer is further included, the first moving layer includes the first translation substrate, the first translation substrate is movably set on the first base, the second moving layer is provided with a second translation substrate, the second moving layer is movably set on the first moving layer through the second translation substrate, wherein the first moving layer and the second moving layer have the same moving direction, and the moving direction of the first moving layer is perpendicular to the moving direction of the first base.

[0014] In some embodiments, it also includes a first driving component arranged on the first substrate, the first driving component includes a first substrate translation motor, a first transmission component, a first substrate translation guide rail and a first substrate translation slider, the first substrate translation motor is arranged on the first base, the first substrate translation guide rail is arranged on the first base, the first substrate translation slider is arranged on the first substrate translation guide rail, and the first translation substrate is arranged on the first substrate translation slider, wherein the output end of the first substrate translation motor is connected to the first translation substrate through the first transmission component.

[0015] In some embodiments, the first transmission assembly includes a first substrate translation screw and a first substrate translation nut, the first substrate translation screw is rotatably set on the first base, the first substrate translation nut is movably sleeved on the first substrate translation screw, the first substrate translation screw is connected to the output end of the first substrate translation motor, and the first substrate translation nut is fixedly connected to the first translation substrate, wherein the first substrate translation wire is arranged parallel to the first substrate translation guide rail.

[0016] In some embodiments, it also includes a second driving component arranged on the first translation substrate, the second driving component includes a second substrate translation motor, a second transmission component, a second substrate translation guide rail and a second substrate translation slider, the second substrate translation motor is arranged on the first translation substrate, the second substrate translation guide rail is arranged on the first translation substrate, the second substrate translation slider is arranged on the second substrate translation guide rail, the second translation substrate is arranged on the second substrate translation slider, and the second translation substrate is connected to the output end of the second substrate translation motor through the second transmission component.

[0017] In some embodiments, there are two second substrate translation guide rails, which are parallel and symmetrically arranged on the first translation substrate, and the second transmission assembly includes a first moving shaft, a first translation synchronous pulley, a second translation synchronous pulley, a first translation synchronous belt and a second fixed clamp, the first translation synchronous pulley is fixedly arranged on the first transmission shaft, the second translation synchronous pulley is rotatably arranged on the first translation substrate, the first translation synchronous belt is wound around the first translation synchronous pulley and the second translation synchronous pulley, the second fixed clamp is fixedly arranged on the first translation synchronous belt, and the second fixed clamp is fixedly connected to the second translation substrate.

[0018] In some embodiments, the first suction cup assembly includes a first main lifting cylinder, a first lifting base, a first auxiliary lifting cylinder, a first adsorption support and a plurality of first suction cups, the first main lifting cylinder is arranged on the second translation substrate, the first lifting base is arranged on the free end of the first main lifting cylinder, the first auxiliary lifting cylinder is arranged on the first lifting base, the first adsorption support is arranged on the free end of the first auxiliary lifting cylinder, and the plurality of first suction cups are distributed on the first adsorption support at intervals, wherein the lifting directions of the first lifting base and the first adsorption support are consistent.

[0019] In some embodiments, the first substrate clamping assembly includes a second main lifting cylinder, a second lifting base, a second auxiliary lifting cylinder and a first substrate clamping claw, the second main lifting cylinder is arranged on the second translational substrate, the second lifting base is arranged on the free end of the second main lifting cylinder, the second auxiliary lifting cylinder is arranged on the second lifting base, and the first substrate clamping claw is arranged on the free end of the second auxiliary lifting cylinder;

[0020] The first substrate clamp comprises a first substrate base arranged on the second auxiliary lifting cylinder, two first substrate rotating shafts rotating relative to the first substrate base and symmetrically arranged, a plurality of first substrate support claws arranged on the two first substrate rotating shafts, and two first substrate connecting rods arranged on the first substrate rotating shafts, one end of the two first substrate connecting rods is fixedly connected to the corresponding first substrate rotating shaft, and the other ends of the two first substrate connecting rods are movably connected, so as to realize the synchronous opening and closing of the first substrate support claws located on the two first substrate rotating shafts;

[0021] The first substrate clamping claw further comprises a first substrate rocking arm and a first claw cylinder movably connected to one end of the first substrate rocking arm, and the other end of the first substrate rocking arm is fixedly connected to the first substrate rotating shaft.

[0022] In some embodiments, the second tray clamping assembly includes a second upper base and a second lower base connected to each other from top to bottom, the second upper base is connected to the lower side of the second translation substrate, and the second lower base is provided with a second main clamping mechanism and a second auxiliary clamping mechanism;

[0023] The second main clamping mechanism comprises two second main clamping connecting rods arranged in parallel with each other, the second main clamping connecting rods are movably arranged on the second lower base, and second main clamping claws that can be opened and closed are arranged at both ends of the second main clamping connecting rods;

[0024] The second secondary clamping mechanism comprises two secondary movable seats arranged relative to the second lower base, and the secondary movable seats are provided with a first main clamping block capable of being raised and lowered and a first secondary clamping block arranged in a fixed manner;

[0025] The first main clamping block can be lifted and lowered relative to the first auxiliary clamping block, thereby realizing the opening and closing of the first main clamping block and the first auxiliary clamping block.

[0026] The two auxiliary movable seats can move away from or towards each other, thereby driving the first auxiliary clamping block to open and close.

[0027] In some embodiments, the present invention further provides a semiconductor packaging device, comprising:

[0028] The chip substrate loading mechanism as described in the above embodiment;

[0029] a first mounting platform, wherein a first transport guide rail is disposed on the first mounting platform, a first transport slide block is disposed on the first transport guide rail, and a first base of the chip substrate loading mechanism is disposed on the first transport slide block; and

[0030] The base driving assembly is used to drive the chip substrate loading mechanism to perform reciprocating linear motion along the first transport guide rail.

[0031] Compared with the prior art, the present invention has the following beneficial effects:

[0032] The present invention arranges a movable first moving layer and a second moving layer on the chip substrate, and can maximize the extension length of the second moving layer on the limited size of the chip substrate loading mechanism. At the same time, a first suction cup assembly, a first substrate clamping assembly, a second suction cup assembly and a second tray clamping assembly are respectively arranged on the second moving layer, and the positions of the first suction cup assembly and the second suction cup assembly correspond to each other, and the positions of the first substrate clamping assembly and the second tray clamping assembly correspond to each other. During one extension of the second moving layer, the packaged chip substrate can be first adsorbed and fixed, and the waste film can be adsorbed and taken away, and then, after the second movement of the second moving layer, the unpackaged chip substrate of the resin box is driven to be synchronously sent to the press unit, thereby improving the packaging efficiency.

[0033] Additional aspects and advantages of the present application will be partially given in the following description, which will become apparent from the following description, or will be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A three-dimensional diagram of the chip substrate loading mechanism of the present invention in a retracted state;

[0035] Figure 2 A first stereoscopic view of the chip substrate loading mechanism of the present invention in an extended state;

[0036] Figure 3 A second stereoscopic view of the chip substrate loading mechanism of the present invention in an extended state;

[0037] Figure 4 A top view of the chip substrate loading mechanism of the present invention;

[0038] Figure 5 for Figure 4 Sectional view at GG in the middle;

[0039] Figure 6 for Figure 4 Sectional view at EE;

[0040] Figure 7 for Figure 4 Cross-sectional view at FF;

[0041] Figure 8 An exploded view of a first substrate clamping assembly of a chip substrate loading mechanism of the present invention;

[0042] Fig. 9 A three-dimensional diagram of a second tray clamping assembly of the chip substrate loading mechanism of the present invention;

[0043] Fig.10 A partial perspective view of a semiconductor packaging device of the present invention;

[0044] Fig.11 An exploded view of a second tray clamping assembly of the chip substrate loading mechanism of the present invention;

[0045] Fig.12 is an exploded view of a first substrate clamping assembly of the present invention;

[0046] Fig.13 It is a second stereoscopic view of the first substrate clamping assembly of the present invention. DETAILED DESCRIPTION

[0047] The present application is further described in detail below in conjunction with specific drawings. In the description of this embodiment, unless otherwise specified, the terms "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the present application must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present application.

[0048] like Figure 1-3 as well as Fig.10 As shown, the chip substrate loading mechanism 400 and the semiconductor packaging device provided by the present invention are shown. The chip substrate loading mechanism 400 is movably arranged on the first mounting platform 101, and is used for transporting unpackaged chip substrates and packaged chip substrates. The chip substrate loading mechanism 400 can perform reciprocating linear movement on the first mounting platform 101. Specifically, in this embodiment, as shown in FIG. Fig.10 As shown, two parallel first transport rails 1015 are arranged on the first installation platform 101, and a first straight rack 1016 is arranged between the two parallel first transport rails 1015. The first straight rack 1016 is parallel to the first transport rail 1015. Figure 1 As shown, a base driving component is arranged on the chip substrate loading mechanism 400, and the base driving component includes a first transport motor 4011, and a first driving gear 40111 is arranged at the output end of the first transport motor 4011, and the first driving gear 40111 is meshed with the first straight rack 1016. At least two first transport sliders 4012 are arranged on the chip substrate loading mechanism 400, and the two first transport sliders 4012 are located on different first transport guide rails 1015. The chip substrate loading mechanism 400 is slidably arranged on the first installation platform 101 through the first transport sliders 4012, and the first driving gear 40111 is driven by the forward and reverse rotation of the first transport motor 4011. Combined with the first transport guide rail 1015 and the first transport slider 4012, the reciprocating linear movement of the chip substrate transport mechanism 400 on the first installation platform 102 is realized. Optionally, the transmission structure of the first driving gear 40111 and the first spur rack 1016 can also be replaced by a combination structure of synchronous wheels and synchronous belts, or a screw slider structure for transmission. It can be known that the driving structure and power type of the chip substrate loading mechanism 400 are not limited by the present invention, and the purpose is to drive the chip substrate loading mechanism 400 to perform reciprocating linear movement on the first mounting platform 101.

[0049] Specifically, Fig.10As shown, the chip substrate loading mechanism 400 includes a structure that can move back and forth linearly along the first mounting platform 101 as described above, a first transport motor 4011 is disposed on the first base 401, and a first transport slider 4012 is fixedly connected to the first base 401. The specific situation will not be described in detail here;

[0050] like Figure 2 As shown, the first moving layer includes the first translation substrate 402 and two first moving side plates 4024, the two first moving side plates 4024 are arranged in parallel and opposite to each other, and are both arranged vertically on the first translation substrate 402, two parallel first substrate translation guide rails 4015 are arranged on the first base 401, and a first substrate translation slider 40151 is arranged on the first substrate translation guide rail 4015, the first translation substrate 402 of the first moving layer is arranged on the first substrate translation slider 40151, and a first driving component and a first transmission component are also arranged on the first base 401, the first driving component includes a first substrate translation motor 4013, and the first transmission component includes The first substrate translation screw 4014 and the first substrate translation nut 40141 are provided on the first substrate translation screw 4014 and are rotatably arranged on the first base 401 through the bearing. The first substrate translation nut 40141 is connected to the first moving layer 402, and the axial direction of the first substrate translation screw 4014 is consistent with the axial direction of the first substrate translation guide rail 4015. The output end of the first substrate translation motor 4013 is connected to the first substrate translation screw 4014 in transmission connection. In this embodiment, the power connection is made through the synchronous wheel and synchronous belt. Optionally, it can also be directly connected through a coupling; or it can be connected in a gear meshing manner. Optionally, the first driving member can be a push rod cylinder that directly drives the first moving layer to move.

[0051] Second substrate translation guide rails 4023 parallel to each other are arranged on the two first movable side plates 4024, a second substrate translation slider 40231 is arranged on the second substrate translation guide rails 4023, the second movable substrate 403 is fixedly connected to the second substrate translation slider 40231, a second driving assembly and a second transmission assembly are arranged on the first translation substrate 402, the second driving assembly includes a second substrate translation motor 4021, the second transmission assembly includes a first movable shaft 4022 rotatably mounted by a bearing arranged on the two first movable side plates 4024, and a first translation synchronous pulley is arranged on the first movable shaft 4022 40221, a second translation synchronous pulley 40223 and a first translation synchronous belt 40222 arranged parallel to the second substrate translation guide rail 4023 are arranged on the first moving side plate 4024, the first translation synchronous belt 40222 is wound around the first translation synchronous pulley 40221 and the second translation synchronous pulley 40223, a second fixing clamp 40224 is arranged on the second moving substrate 402, the second fixing clamp 40224 is fixedly connected to the first translation synchronous belt 40222, and the second substrate translation motor 4021 is driven by the synchronous belt and synchronous pulley assembly to drive the first transmission shaft 4022 to rotate. In this embodiment, in order to facilitate the second moving layer to respond more quickly and without power jam, the second fixing clamp 40224, the first translation synchronous belt 40222, the first translation synchronous pulley 40221, and the second translation synchronous pulley 40223 are symmetrically arranged about the radial plane where the middle of the first moving shaft 4022 is located.

[0052] The first moving layer and the second moving layer move in the same direction, and the moving direction of the first moving layer is perpendicular to the moving direction of the first base 401.

[0053] Optionally, the second substrate translation motor 4021 and the first movable shaft 4022 may be connected to each other by gear meshing, or the output shaft of the second substrate translation motor 4021 may be directly connected to the first movable shaft 4022 via a coupling.

[0054] Optionally, the second driving assembly may also be a push rod cylinder to directly push the second moving layer to move.

[0055] Furthermore, the second movable layer includes a first suction cup assembly 4031 and a first substrate clamping assembly 4032 which are arranged above the second movable layer and can be lifted and lowered. The first suction cup assembly 4031 is arranged close to the press unit 500, and the first substrate clamping assembly 4032 is arranged away from the press unit 500.

[0056] Specifically, Figure 1-2As shown, the first suction cup assembly 4031 includes a first lifting base 40313, four first guide shafts 40314 are arranged on the first lifting base 40313, and four matching first guide sleeves are arranged on the second movable substrate. The first guide shaft 40314 is movably inserted in the first guide sleeve. At the same time, a first main lifting cylinder 40314 is arranged on the second movable substrate 402, and the fixed end of the first main lifting cylinder 40314 is fixed on the second movable substrate 403, and the free end of the first main lifting cylinder 40314 is fixed under the first lifting base 40313 to drive the first lifting base 40313 to rise and fall. The first suction cup assembly 4031 also includes a plurality of first suction cups 40312 distributed at intervals, and the first suction cup 40312 is connected to the negative pressure mechanism, so as to grab and adsorb and fix the plastic-sealed finished chip substrate. Furthermore, the first suction cup assembly 4031 further includes a first suction support 40311, and a plurality of first suction cups 40312 are disposed on the first suction support 40311. Figure 4-6 As shown, the first adsorption support 40311 can be lifted and moved relative to the first lifting base 40313, wherein the first adsorption support 40311 and the first lifting base 40313 have the same lifting direction. Specifically, the first adsorption support 40311 is connected to two first secondary guide shafts 403152 and a first secondary guide sleeve 403151 disposed on the first lifting base 40313, the first secondary guide shaft 403152 is movably disposed on the first secondary guide sleeve 403151, a first secondary lifting cylinder 40315 is disposed between the first adsorption support 40311 and the first lifting base 40313, the first secondary lifting cylinder 40315 is fixed on the first lifting base 40313, and the free end of the first secondary lifting cylinder 40315 is connected to the first adsorption support 40311. In this embodiment, the first suction cup assembly 4031 is divided into two groups, both of which are disposed on the first lifting base 40313, so that two packaged chip substrates can be sucked at the same time.

[0057] like Figure 5 , Figure 7 As shown, the first substrate clamping assembly 4032 includes a second lifting base 40322, a first substrate clamping claw 40321 disposed on the second lifting base 40322, the second lifting base 40322 is disposed at the free end of the second main lifting cylinder 40324, the first substrate base 403214 is disposed at the free end of the second auxiliary lifting cylinder 40325, the second auxiliary lifting cylinder 40325 is disposed on the second lifting base 40322, and the second main lifting cylinder 40324 is disposed on the second translation substrate 403. In the present application, the first substrate clamping claw 40321 is two groups, which can grasp two chip substrates at the same time. In order to reduce the driving device, such as Fig.13As shown, a power connecting rod 403210 is arranged between the two first substrate rockers of the two first substrate clamps 40321, and the power connecting rod 403210 is connected to the free end of the cylinder to synchronize the opening and closing of the two first substrate clamps 40321. Optionally, the first transport clamps 3023 can also be driven by an independent driving cylinder.

[0058] Specifically, Figure 8 , Fig.12 and Fig.13 As shown, the first substrate clamp 40321 also includes a first substrate base 403214, two first substrate rotating shafts 403213 rotatably arranged relative to the first substrate base 403214, when a chip substrate is clamped on the first substrate clamp, the positions of the two first substrate rotating shafts 403212 are symmetrically arranged with respect to the chip substrate, one of the first substrate rotating shafts 403212 is segmented, thereby forming a clearance space to facilitate the installation of the positioning component, and both ends of the first substrate rotating shaft 403212 are movably connected by two first substrate connecting rods 403213, thereby realizing the synchronous opening and closing of the first substrate supporting claws 403211 on the two first substrate rotating shafts 403212; in this embodiment, the two first substrate rotating shafts 403212 are rotatably arranged on the second lifting base 40322, and optionally, two first substrate rotating shafts 403212 can also be rotatably arranged on the first substrate base 403214.

[0059] Furthermore, the first substrate clamp 40321 also includes a first substrate rocker. In this embodiment, the first substrate rocker and one of the above-mentioned first substrate connecting rods 403213 are arranged to form an integrated structure. One end of the first substrate rocker is movably connected to the first claw cylinder, and the other end is fixedly connected to the first substrate rotating shaft 403212. The rotation of the first substrate rocker drives the rotation of the first substrate rotating shaft 403212.

[0060] Furthermore, a plurality of first making way slots 403215 are provided on the first substrate base 403214 to make way for the clamping claws for clamping the chip substrate when the chip substrate is placed.

[0061] like Figure 5 , Figure 6As shown, a second tray clamping assembly 4034 and a second suction cup assembly 4033 are provided below the second movable substrate 403. The second suction cup assembly 4033 is arranged close to one side of the press unit 500, and the second tray clamping assembly 4034 is arranged away from the one side of the press unit 500. In this embodiment, the second suction cup assembly 4033 corresponds to the position of the first suction cup assembly 4031, and the second tray clamping assembly 4034 corresponds to the position of the first substrate clamping assembly 4032, that is, when the first suction cup 40312 can adsorb and fix the finished chip substrate, the second suction cup 40331 can adsorb the waste film without horizontal movement, and when the first substrate clamping claw 40321 can transport the unpackaged chip substrate to the upper mold 503 of the press unit 500 by lifting, at this time, the second tray clamping assembly 4034 can place the resin tray 40344 carrying the resin and the film into the lower mold 502 of the press unit 500 for resin delivery.

[0062] Specifically, the second suction cup assembly 4033 includes a plurality of second suction cups 40331. The structure distribution and principle of the plurality of second suction cups 40331 are the same as those of the first suction cup 40312, as mentioned above, and will not be described in detail here.

[0063] like Fig. 9 , Fig.11 As shown, the second tray clamping assembly 4034 includes a second clamping base, the second clamping base includes a second upper base 40341 ​​and a second lower base 40342 fixedly connected to each other from top to bottom, a preset distance is set between the second upper base 40341 ​​and the second lower base 40342, the second upper base 40341 ​​is fixedly connected to the second movable base 403, and the second tray clamping assembly 4034 also includes a second main clamping mechanism and a second auxiliary clamping mechanism, and its specific mechanism is as follows;

[0064] like Fig.11As shown, the second main clamping mechanism includes four second main clamping jaws 403424, two second main clamping connecting rods 403423 arranged in parallel with each other, a main clamping cylinder 403433 with two opening and closing free ends, and the two free ends can move away from or towards each other at the same time to realize the opening and closing of the second main clamping jaws 303424; two main clamping push rods 403422, wherein the four second main clamping jaws 403424 are divided into two groups, each group is fixedly arranged at the two ends of the second main clamping connecting rod 403423, and the second main clamping jaws 403424 are connected to the resin The main clamping cylinder 403433 is fixed on the second lower base 40342, and the two main clamping push rods 403422 are respectively fixed on the two opening and closing free ends of the main clamping cylinder 403433. The two free ends of the main clamping cylinder 403433 move toward or away from each other, driving the four second main clamping jaws 403424 to open and close, thereby grabbing or putting down the resin tray 40344. In this embodiment, the second main clamping jaw 403424 is an L-shaped hook.

[0065] Furthermore, four second main guide rails 403426 are arranged on the second lower base 40342, and four corresponding second main sliders 403425 are arranged on the four second main guide rails 403426. The axial direction of the second main guide rails 403426 is consistent with the opening and closing direction of the free end of the main clamping cylinder 403433. The four second main sliders 403425 are respectively fixedly arranged at the two ends of the corresponding two main clamping connecting rods 403423, thereby supporting the second main clamping connecting rods 403423.

[0066] Alternatively, if Fig. 9As shown, the second main clamping jaw 403424 can also be configured as a rotating structure, and two parallel second main clamping connecting rods 403434 are rotatably arranged on the second lower base 40342. Specifically, four rotating brackets 403435 are arranged on the second lower base 40342, and the second main clamping connecting rod 403434 is rotatably arranged on the four rotating brackets 403425 through bearings. A second main clamping rocker 403436 is arranged between the two free ends of the main clamping cylinder 403433 and the corresponding two second main clamping connecting rods 403434, and one end of the second main clamping rocker 403436 is fixedly connected to the second main clamping connecting rod 40344. The other end of the clamp rocker 403436 is movably connected to a free end of the main clamp cylinder 403433. For example, a first connecting rod with a first connecting notch of a long strip structure is provided, and one end of the first connecting rod is movably connected to a free end of the main clamp cylinder 403433. The end of the first connecting rod with the first connecting notch is arranged away from the second lower base 40342, so that the first connecting notch compensates for the movement of the first connecting rod in the vertical direction to avoid motion interference. The first connecting notch can be a rectangular structure or a U-shaped groove structure, so that the free end of the main clamp cylinder 403433 that can be opened and closed drives the second main clamp jaw 403424 to rotate. For example, when the two free ends of the main clamp cylinder 403433 are opened and separated, the second main clamp jaw 403424 is not engaged with the resin tray 40344. When the two free ends of the main clamp cylinder 403433 are closed and close, the second main clamp jaw 403424 cooperates and abuts with the clamping groove 403441 of the resin tray.

[0067] like Fig.11As shown, the second secondary clamping mechanism includes a secondary clamping cylinder 403421, on which two free ends capable of moving toward or away from each other are provided, a secondary moving seat 403428 is provided at the free end of the secondary clamping cylinder 403421, on which a first secondary clamping block 403431 is provided, and the first secondary clamping block 403431 can clamp and cover one side of the resin tray 40344, and on the secondary moving seat 403428, a first main clamping block 403430 capable of being raised and lowered is provided. The second lifting cylinder 403429 is provided on the movable seat 403428, and the free end of the second lifting cylinder 403429 is connected to the first main clamping block 403430. The first main clamping block 403430 is lifted and lowered to close and open with the first auxiliary clamping block 403431, and the film is clamped and fixed. Then, in combination with the auxiliary clamping cylinder 403421, the auxiliary movable seat 403428 is brought closer, so as to fix the edge of the film carrying the resin, so that the film is fixed relative to the resin tray 40344. In this embodiment, the auxiliary movable seat 403428, the first auxiliary clamping block 40341, the first main clamping block 40340, and the second lifting cylinder 403429 are all two groups, which are symmetrically arranged about the second upper base 40341, so as to clamp and fix the film at the edge of the resin tray 40344, so that the resin tray 40344 and the film keep moving synchronously.

[0068] Furthermore, a second auxiliary guide rail 403411 is provided on the second upper base 40341, and a second auxiliary slider 403432 is provided on the second auxiliary guide rail 403411. The second auxiliary slider 403432 is connected to the auxiliary movable seat 403428, thereby providing support for the auxiliary movable seat 403428, and the axial direction of the second auxiliary guide rail 403411 is consistent with the opening and closing movement direction of the free end of the auxiliary clamp cylinder 403421.

[0069] In this embodiment, Fig.11 As shown, the first auxiliary clamping block 403431 and the first main clamping block 403430 are located at two opposite sides of the resin tray 40344 , and the second main clamping jaw 403424 is located at the other two opposite sides of the resin tray 40344 .

[0070] The above is only a preferred embodiment of the present invention. It should be noted that a person skilled in the art can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be considered as the protection scope of the present invention.

Claims

1. A chip substrate loading mechanism, characterized in that: include: The first base is capable of reciprocating linear movement; a second movable layer, movably arranged relative to the first base, the second movable layer comprising a second movable substrate, and the second movable layer is movably arranged on the first base through the second movable substrate; A first suction cup assembly is liftable and arranged on the upper side of the second movable substrate, and the first suction cup assembly is used to absorb and fix the packaged chip substrate; A first substrate clamping assembly is movably disposed on the upper side of the second movable substrate and is spaced apart from the first suction cup assembly. The first substrate clamping assembly is used for transporting unpackaged chip substrates. A second suction cup assembly is disposed at the lower side of the second movable substrate and corresponds to the position of the first suction cup assembly, and the second suction cup assembly is used to absorb the waste film after packaging; A second tray clamping assembly is disposed at the lower side of the second movable substrate and corresponds to the position of the first substrate clamping assembly. The second tray clamping assembly is used to move the resin tray, thereby realizing the transportation of the resin and the reciprocating use of the resin tray; It also includes a first moving layer, the first moving layer includes a first translation substrate, the first translation substrate is movably set on the first base, the second moving layer is provided with a second translation substrate, the second moving layer is movably set on the first moving layer through the second translation substrate, wherein the first moving layer and the second moving layer have the same moving direction, and the moving direction of the first moving layer is perpendicular to the moving direction of the first base.

2. A chip substrate loading mechanism according to claim 1, characterized in that: It also includes a first driving component arranged on the first base, the first driving component includes a first substrate translation motor, a first transmission component, a first substrate translation guide rail and a first substrate translation slider, the first substrate translation motor is arranged on the first base, the first substrate translation guide rail is arranged on the first base, the first substrate translation slider is arranged on the first substrate translation guide rail, and the first translation substrate is arranged on the first substrate translation slider, wherein the output end of the first substrate translation motor is connected to the first translation substrate through the first transmission component.

3. A chip substrate loading mechanism according to claim 2, characterized in that: The first transmission assembly includes a first substrate translation screw and a first substrate translation nut, the first substrate translation screw is rotatably set on the first base, the first substrate translation nut is movably sleeved on the first substrate translation screw, the first substrate translation screw is connected to the output end of the first substrate translation motor, and the first substrate translation nut is fixedly connected to the first translation substrate, wherein the first substrate translation wire is arranged parallel to the first substrate translation guide rail.

4. A chip substrate loading mechanism according to claim 1, characterized in that: It also includes a second driving component arranged on the first translation substrate, the second driving component includes a second substrate translation motor, a second transmission component, a second substrate translation guide rail and a second substrate translation slider, the second substrate translation motor is arranged on the first translation substrate, the second substrate translation guide rail is arranged on the first translation substrate, the second substrate translation slider is arranged on the second substrate translation guide rail, the second translation substrate is arranged on the second substrate translation slider, and the second translation substrate is connected to the output end of the second substrate translation motor through the second transmission component.

5. A chip substrate loading mechanism according to claim 4, characterized in that: There are two second substrate translation guide rails, which are parallel and symmetrically arranged on the first translation substrate. The second transmission assembly includes a first moving shaft, a first translation synchronous pulley, a second translation synchronous pulley, a first translation synchronous belt and a second fixed clamp. The first translation synchronous pulley is fixedly arranged on the first transmission shaft, and the second translation synchronous pulley is rotatably arranged on the first translation substrate. The first translation synchronous belt is wound around the first translation synchronous pulley and the second translation synchronous pulley. The second fixed clamp is fixedly arranged on the first translation synchronous belt, and the second fixed clamp is fixedly connected to the second translation substrate.

6. The chip substrate loading mechanism according to claim 1, characterized in that: The first suction cup assembly includes a first main lifting cylinder, a first lifting base, a first auxiliary lifting cylinder, a first adsorption support and a plurality of first suction cups, the first main lifting cylinder is arranged on the second translation substrate, the first lifting base is arranged on the free end of the first main lifting cylinder, the first auxiliary lifting cylinder is arranged on the first lifting base, the first adsorption support is arranged on the free end of the first auxiliary lifting cylinder, and the plurality of first suction cups are distributed on the first adsorption support at intervals, wherein the lifting directions of the first lifting base and the first adsorption support are consistent.

7. The chip substrate loading mechanism according to claim 1, characterized in that: The first substrate clamping assembly includes a second main lifting cylinder, a second lifting base, a second auxiliary lifting cylinder and a first substrate clamping claw, the second main lifting cylinder is arranged on the second translational substrate, the second lifting base is arranged on the free end of the second main lifting cylinder, the second auxiliary lifting cylinder is arranged on the second lifting base, and the first substrate clamping claw is arranged on the free end of the second auxiliary lifting cylinder; The first substrate clamp comprises a first substrate base arranged on the second auxiliary lifting cylinder, two first substrate rotating shafts rotating relative to the first substrate base and symmetrically arranged, a plurality of first substrate support claws arranged on the two first substrate rotating shafts, and two first substrate connecting rods arranged on the first substrate rotating shafts, one end of the two first substrate connecting rods is fixedly connected to the corresponding first substrate rotating shaft, and the other ends of the two first substrate connecting rods are movably connected, so as to realize the synchronous opening and closing of the first substrate support claws located on the two first substrate rotating shafts; The first substrate clamping claw further comprises a first substrate rocking arm and a first claw cylinder movably connected to one end of the first substrate rocking arm, and the other end of the first substrate rocking arm is fixedly connected to the first substrate rotating shaft.

8. The chip substrate loading mechanism according to claim 1, characterized in that: The second tray clamping assembly comprises a second upper base and a second lower base connected to each other from top to bottom, the second upper base is connected to the lower side of the second translation base plate, and the second lower base is provided with a second main clamping mechanism and a second auxiliary clamping mechanism; The second main clamping mechanism comprises two second main clamping connecting rods arranged in parallel with each other, the second main clamping connecting rods are movably arranged on the second lower base, and second main clamping claws that can be opened and closed are arranged at both ends of the second main clamping connecting rods; The second secondary clamping mechanism comprises two secondary movable seats arranged relative to the second lower base, and the secondary movable seats are provided with a first main clamping block capable of being raised and lowered and a first secondary clamping block arranged in a fixed manner; The first main clamping block can be lifted and lowered relative to the first auxiliary clamping block, thereby realizing the opening and closing of the first main clamping block and the first auxiliary clamping block. The two auxiliary movable seats can move away from or towards each other, thereby driving the first auxiliary clamping block to open and close.

9. A semiconductor packaging device, characterized in that: include: The chip substrate loading mechanism according to any one of claims 1 to 8; a first mounting platform, wherein a first transport guide rail is disposed on the first mounting platform, a first transport slide block is disposed on the first transport guide rail, and a first base of the chip substrate loading mechanism is disposed on the first transport slide block; and The base driving assembly is used to drive the chip substrate loading mechanism to perform reciprocating linear motion along the first transport guide rail.

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