Integrated radiator, preparation method of integrated radiator and chip packaging structure

Abstract

The invention provides an integrated radiator, a preparation method of the integrated radiator and a chip packaging structure. The invention provides an integrated radiator. The integrated radiator comprises a radiating cover and a surrounding part extending downwards in the circumferential direction of the radiating cover. A macroscopic anchoring structure is arranged on one surface, facing the substrate, of the surrounding part; when the surrounding part is adhered to the substrate through a sealant, the sealant flows into or wraps the macroscopic anchoring structure, and the sealant can mechanically clamp or hook the macroscopic anchoring structure after being cured, so that the cured sealant and the surrounding part form a mechanical interlocking structure; and the integrated radiator and the substrate are stably fixed together through the mechanical interlocking structure. According to the integrated radiator, the bonding strength between the radiator and the substrate can be improved, and the risk that the radiator is layered or separated is reduced.

Description

Technical Field

[0001] The present application relates to the field of chip packaging technology, and in particular to an integrated heat sink, a method for preparing an integrated heat sink, and a chip packaging structure. Background Art

[0002] Chips generate a lot of heat during operation. Excessive temperature may cause performance degradation or even damage. In order to ensure that the chip is not damaged by overheating during high-performance operation, a heat sink is often installed on the chip during the chip packaging process.

[0003] The heat sink is bonded to the substrate to enhance heat dissipation and protect the fragile chip. However, due to thermal cycling, mechanical stress during installation, or poor adhesion between the heat sink and the substrate, the bond between the heat sink and the substrate will weaken over time, causing the heat sink to delaminate or separate. Summary of the invention

[0004] In view of this, the present application provides an integrated heat sink, a method for preparing the integrated heat sink, and a chip packaging structure, so as to improve the bonding strength between the heat sink and the substrate and reduce the risk of delamination or separation of the heat sink.

[0005] Specifically, the present application is implemented through the following technical solutions: A first aspect of the present application provides an integrated heat sink, comprising a heat sink cover and a surrounding portion extending downward along the circumference of the heat sink cover; wherein: The surrounding portion has a macro-anchoring structure on one side facing the substrate; when the surrounding portion is bonded to the substrate by means of sealant, the sealant flows into or wraps around the macro-anchoring structure, and the sealant can mechanically clamp or hook the macro-anchoring structure after curing, so that the cured sealant forms a mechanical interlocking structure with the surrounding portion, so as to firmly fix the integrated radiator and the substrate together through the mechanical interlocking structure.

[0006] Optionally, the macro anchoring structure is an array structure consisting of at least one of the following structures: grooves, holes, protrusions and hooks; Wherein, the array structure is evenly distributed on a surface of the surrounding portion facing the substrate.

[0007] Optionally, the groove or the hole is a tapered groove or a stepped groove; Wherein, the stepped groove is composed of at least two levels of grooves, and the inner surface of each level of groove is a plane or a curved surface.

[0008] Optionally, the hook-shaped object is a hook-shaped protrusion; or, The hook-shaped object is a hook accommodated in the groove.

[0009] Optionally, the protrusion is a protrusion in any of the following shapes: conical, trumpet-shaped, cylindrical, rectangular, spherical, or hemispherical.

[0010] Optionally, the groove or the hole has a downwardly contracted morphology.

[0011] Optionally, the macro anchoring structure is formed by a stamping process.

[0012] A second aspect of the present application provides a method for preparing an integrated heat sink, the method being used to prepare the above-mentioned integrated heat sink, the method comprising: Prepare a standard heat sink; wherein the standard heat sink comprises a heat sink cover and a surrounding portion extending downward along the circumference of the heat sink cover; A macro-anchoring structure is formed on a side of the surrounding portion facing the substrate; wherein, when the surrounding portion is bonded to the substrate by means of a sealant, the sealant flows into or wraps around the macro-anchoring structure, and the sealant can mechanically clamp or hook the macro-anchoring structure after curing, so that the cured sealant forms a mechanical interlocking structure with the surrounding portion, so as to firmly fix the integrated heat sink and the substrate together through the mechanical interlocking structure.

[0013] Optionally, the macro anchoring structure is an array structure composed of at least one of the following structures: grooves, holes, protrusions and hooks; the array structure is evenly distributed on the side of the surrounding portion facing the substrate; the macro anchoring structure is formed on the side of the surrounding portion facing the substrate, comprising: A groove, a hole, a protrusion or a hook is formed on a surface of the surrounding portion facing the base by a punching process, a stamping process and / or a CNC machining process.

[0014] A third aspect of the present application provides a chip packaging structure, the chip packaging structure comprising a substrate, a chip, and an integrated heat sink as described in any one of the first aspects of the present application; The chip is fixed on the substrate; The heat dissipation cover of the integrated heat sink is fixed on the chip, and the surrounding part of the integrated heat sink is bonded to the substrate by means of sealant; wherein, when the surrounding part is bonded to the substrate by means of the sealant, the sealant flows into or wraps around the macro-anchoring structure on the surrounding part, and the sealant can mechanically clamp or hook the macro-anchoring structure after curing, so that the cured sealant and the surrounding part form a mechanical interlocking structure, so as to firmly fix the integrated heat sink and the substrate together through the mechanical interlocking structure.

[0015] The integrated heat sink, the preparation method of the integrated heat sink and the chip packaging structure provided by the present application are characterized by arranging a macro-anchoring structure on the side of the surrounding part facing the substrate. When the surrounding part is bonded to the substrate by a sealant, the sealant flows into or wraps the macro-anchoring structure, and the sealant can mechanically clamp or hook the macro-anchoring structure after curing, so that the cured sealant and the surrounding part form a mechanical interlocking structure. In this way, through the mechanical interlocking structure, the firm connection between the heat sink and the substrate can be ensured to avoid loosening due to temperature changes or vibrations; in addition, the mechanical interlocking structure can provide stronger tensile and shear resistance, which can enhance the long-term stability and reliability of the integrated heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A three-dimensional diagram of the first embodiment of the integrated heat sink provided in the present application; Figure 2 for Figure 1 A cross-sectional view of the integrated heat sink shown; Figure 3 for Figure 1 A schematic diagram of a chip packaging structure where an integrated heat sink is shown; Figure 4 A diagram showing the relationship between the macro anchoring structure and the substrate according to an exemplary embodiment of the present application; Figure 5 A schematic diagram of a second embodiment of an integrated heat sink provided in the present application; Figure 6 A schematic diagram of a third embodiment of the macro anchoring structure provided in the present application; Figure 7 A schematic diagram of a fourth embodiment of a macro anchoring structure provided in the present application; Figure 8 A flow chart of Embodiment 1 of the method for preparing an integrated radiator provided in the present application; Fig. 9 This is a schematic diagram showing the implementation principle of preparing an integrated heat sink according to another exemplary embodiment of the present application; Fig.10 This is a schematic diagram showing the implementation principle of preparing an integrated heat sink according to another exemplary embodiment of the present application.

[0017] Description of reference numerals: 1: Integrated heat sink; 11: Heat dissipation cover; 12: surrounding part; 121: Macro anchoring structure; 2: Chip; 3: base; 4: Sealant; 5: Thermal interface material. DETAILED DESCRIPTION

[0018] Here, exemplary embodiments will be described in detail, and examples thereof are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application.

[0019] The terms used in this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used in this article refers to and includes any or all possible combinations of one or more associated listed items.

[0020] It should be understood that although the terms first, second, third, etc. may be used in the present application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0021] Specific embodiments are given below to introduce the technical solution of the present application in detail.

[0022] Figure 1 This is a three-dimensional diagram of the first embodiment of the integrated heat sink provided in this application. Figure 2 for Figure 1 Cross-sectional view of the integrated heat sink shown (along Figure 1 sectional view cut along the dotted line shown in FIG. Figure 3 for Figure 1 Schematic diagram of the chip package structure where the integrated heat sink is located. Please also refer to Figures 1 to 3 The integrated heat sink 1 provided in this embodiment comprises a heat sink cover 11 and a surrounding portion 12 extending downwardly along the circumference of the heat sink cover 11; wherein, The surrounding portion 12 has a macro-anchoring structure 121 on one side facing the substrate 3; when the surrounding portion 12 is bonded to the substrate 3 through the sealant 4, the sealant 4 flows into or wraps around the macro-anchoring structure 121, and the sealant 4 can mechanically clamp or hook the macro-anchoring structure 121 after curing, so that the cured sealant 4 and the surrounding portion 12 form a mechanical interlocking structure, so as to firmly fix the integrated radiator 1 and the substrate 3 together through the mechanical interlocking structure.

[0023] Please refer to Figure 3It can be understood that the integrated heat sink 1 provided in the present application is applied to a chip packaging structure. The chip packaging structure includes a substrate 3, a chip 2 and an integrated heat sink 1; the chip 2 is fixed on the substrate 3; the heat sink cover 11 of the integrated heat sink 1 is fixed on the chip 2, and the surrounding portion 12 of the integrated heat sink 1 is bonded to the substrate 3 through a sealant 4. The heat sink cover 11 can not only enhance the heat dissipation function of the chip 2, but also protect the chip 2. It can be understood that in one possible implementation, the chip 2 can be a CPU (CPU is a central processing unit).

[0024] In addition, please continue to refer to Figure 3 It can be understood that the chip 2 and the integrated heat sink 1 are welded together via a thermal interface material.

[0025] For details, please continue to refer to Figure 1 and Figure 2 The integrated heat sink 1 includes a heat dissipation cover 11 and a surrounding portion 12. It should be noted that in one embodiment, the outer periphery of the surrounding portion 12 may be flush with the outer periphery of the heat dissipation cover 11, and in another embodiment, the outer periphery of the surrounding portion 12 is smaller than the outer periphery of the heat dissipation cover 11, which is not limited in this embodiment.

[0026] Furthermore, the heat dissipation cover 11 and the surrounding portion 12 may be integrally formed or separately provided, and this application does not limit this. For example, in one embodiment, the surrounding portion 12 and the heat dissipation cover 11 are made by an integrally formed mold; for another example, in another embodiment, the heat dissipation cover 11 is a plate-shaped object, and the surrounding portion 12 is a rectangular frame, and the two can be fixedly connected by mechanical connection.

[0027] Furthermore, a side of the surrounding portion 12 facing the substrate 3 has a macro-anchoring structure 121 , and the macro-anchoring structure 121 can help form a tighter connection structure between the surrounding portion 12 and the substrate 3 .

[0028] It should be noted that the specific form of the macro anchoring structure 121 is set according to actual needs and is not limited in this embodiment. It is understandable that the macro anchoring structure 121 can provide a mechanical anchor point or a fixed point to grasp the adhesive and increase the contact area between the sealant 4 and the integrated heat sink 1, so that a stronger mechanical bonding force is formed between the sealant and the integrated heat sink.

[0029] These macrostructures further enhance the sealant's grip during the curing process, helping to maintain the stability of the integrated heat sink 1 and reduce the risk of delamination, especially when undergoing thermal cycling or mechanical stress.

[0030] The following is an introduction to the matching method between the integrated heat sink 1 and the substrate: Figure 4 This is a diagram showing the relationship between the macro anchoring structure and the substrate according to an exemplary embodiment of the present application. Figure 4 , Figure 4 The macro anchoring structure 121 is taken as an example of a groove. Figure 4 As shown in FIG. 1A , when the heat dissipation cover 11 needs to be fixed on the substrate, a certain amount of sealant 4 is first applied on the substrate. Figure 4 As shown in (B), after the sealant 4 is applied, the surrounding portion 12 is fixed on the sealant 4. It should be noted that in the process of fixing the surrounding portion 12, downward pressure is applied to the integrated heat sink 1. Under the action of the pressure, the surrounding portion 12 moves downward, and further, the sealant 4 flows into or wraps the macro anchoring structure 121, as shown in FIG. Figure 4 As shown in (C) in FIG. 1 , the surrounding portion 12 is continuously pressed downward, so that the distance between the surrounding portion 12 and the substrate 3 is gradually reduced, and more and more sealant 4 flows into or wraps the macro anchoring structure 121. Then, as shown in FIG. Figure 4 As shown in (D), when a layer of uniform sealant 4 forms a tight fit between the surrounding portion 12 and the substrate 3, the sealant 4 flowing into or including the macro anchoring structure 121 is gradually accumulated, and the sealant 4 fills the space of the macro anchoring structure or fully wraps the macro anchoring structure 121 before curing; further, after the sealant 4 is cured, the cured sealant 4 is tightly meshed with the macro anchoring structure 121, and the macro anchoring structure 121 is stuck or hooked to form a mechanical interlocking structure with the surrounding portion 12. In this way, the bonding strength between the sealant 4 and the substrate 3 can be enhanced by mechanical interlocking. In addition, the mechanical interlocking structure can provide additional physical fixation, thereby significantly enhancing the firmness and durability of the bonding, improving the chip packaging structure's ability to resist heat cycles and mechanical stress, and effectively preventing the delamination problem between the integrated heat sink 1 and the substrate 3 or the falling off problem of the integrated heat sink 1 under stress conditions or temperature changes.

[0031] With reference to the foregoing description, it can be understood that the integrated heat sink 1 provided in this embodiment can ensure continuous contact between the integrated heat sink 1 and the substrate 3 , and can effectively maintain the heat dissipation of the chip 2 and the overall performance of the chip 2 .

[0032] The mechanical interlocking structure provided by the macro-anchoring features and sealant can prevent the integrated heat sink from delamination or falling off, specifically: Thermal Cycling: When subjected to repeated expansion and contraction due to temperature changes, the mechanical bond remains strong because the sealant does not easily separate from the substrate.

[0033] Mechanical stress: The interlocking structure prevents the integrated heat sink from falling off the substrate when the heat sink is mounted or subjected to other mechanical loads.

[0034] Improved thermal transfer: By preventing delamination, continuous contact between the integrated heat sink and the substrate is ensured, maintaining effective heat dissipation and overall performance.

[0035] It should be noted that the integrated heat sink provided in the present application is particularly suitable for high-performance chips that need to withstand significant thermal stress and mechanical stress, such as overclocked processors, server-level chips, and gaming system-level chips.

[0036] The integrated heat sink provided in the present embodiment is provided with a macro-anchoring structure on a side of the surrounding portion facing the substrate. When the surrounding portion is bonded to the substrate by means of a sealant, the sealant flows into or wraps around the macro-anchoring structure, and the sealant can mechanically clamp or hook the macro-anchoring structure after curing, so that the cured sealant and the surrounding portion form a mechanical interlocking structure. In this way, through the mechanical interlocking structure, a firm connection between the heat sink and the substrate can be ensured to avoid loosening due to temperature changes or vibrations. In addition, the mechanical interlocking structure can provide stronger tensile and shear resistance, and can enhance the long-term stability and reliability of the integrated heat sink.

[0037] Optionally, in a possible implementation, the macro anchoring structure is an array structure composed of at least one of the following structures: a groove, a hole, a protrusion, and a hook; The array structure is evenly distributed on a surface of the surrounding portion 12 facing the substrate 3 .

[0038] Specifically, the macro anchoring structure 121 is an array structure, which is composed of a plurality of substructures, and the plurality of substructures include at least one of the following structures: grooves, holes, protrusions, and hooks. For example, in a possible implementation, the plurality of substructures are substructures of one type, for example, all are grooves; for another example, in a possible implementation, the plurality of substructures include at least two types of substructures, for example, in one embodiment, the plurality of substructures include both grooves and holes.

[0039] Further, the array structure is evenly distributed on the side of the surrounding portion 12 facing the substrate 3. For example, in a possible implementation, the array structure may be a linearly arranged N-column structure, in each column, a plurality of substructures are evenly distributed (for example, the intervals between two adjacent substructures are equal), where N is a positive integer greater than or equal to 1.

[0040] The integrated heat sink provided in this embodiment provides a specific morphology of the macro-anchoring structure. The macro-anchoring structure can enhance the bonding force between the integrated heat sink and the substrate, thereby preventing the integrated heat sink from separating from the substrate and the integrated heat sink from falling off the chip.

[0041] It should be noted that the specific morphology of the groove or hole is set according to actual needs and is not limited in this embodiment. For example, in one possible implementation, the groove or hole is a straight cylindrical structure, a conical structure or a stepped structure; wherein the stepped structure is composed of at least two levels, and the inner surface of each level is a plane or a curved surface.

[0042] Figure 5 For a schematic diagram of the second embodiment of the integrated heat sink provided in this application, please refer to Figure 5 , for example, in Figure 5 In the example shown in FIG. (A), the macro anchoring structure 121 is an array structure consisting of a plurality of conical grooves; Figure 5 In the example shown in FIG. 2 (B), the macro anchoring structure 121 is an array structure composed of a plurality of stepped grooves, and the inner surface of each step of the groove is a plane; further, Figure 5 In the example shown in (C), the macro anchoring structure 121 is an array structure composed of a plurality of stepped grooves, and the inner surface of each step of the groove is a curved surface; further, in Figure 5 In the example shown in FIG. 2 (D), the macro anchoring structure 121 is an array structure composed of a plurality of straight-through grooves.

[0043] It should be noted that when the groove or hole is a straight-cylindrical structure, the specific size of the groove or the diameter of the hole is set according to actual needs, and is not limited in this embodiment. Further, when the groove or hole is a conical structure, the contraction end (the end with a smaller size) of the conical structure can be the end facing the base or the end facing the heat dissipation cover, and is not limited in this embodiment. Further, when the groove or hole is a stepped structure, the stepped structure can be gradually contracted or gradually expanded in the direction toward the base, and is not limited in this embodiment.

[0044] In addition, please continue to refer to Figure 5 In (B) and (C), when the groove or hole is a step-type structure, the step-type structure is composed of at least two levels, and the inner surface of each level can be a plane or a curved surface, which is not limited in this embodiment. Figure 5 In the example shown in FIG. (B) of FIG. 1 , the stepped structure includes three levels of structures, and the inner surface of each level of the structure is a plane. For another example, in Figure 5 In the example shown in Figure (C), the stepped structure includes two levels of structures, wherein the inner surface of one level of structure is a plane and the inner surface of the other level of structure is a curved surface.

[0045] It should be noted that when the inner surface of a certain level structure is a curved surface, the specific morphology of the curved surface is set according to actual needs and is not limited in this embodiment. Figure 5 As shown in Figure (C) in the figure, the surface can be a bowl-shaped surface.

[0046] It is understandable that different macro-anchoring structures 121 have different specific functions. In actual application scenarios, different macro-anchoring structures 121 can be selected according to different needs. In this embodiment, no limitation is imposed on them.

[0047] For example, the stepped structure has multiple levels, so that the inflowing sealant 4 has a certain layered structure, which helps to withstand long-term loads and reduce deformation or damage to the macro anchoring structure 121 caused by the weight of the sealant 4. Further, when the surface of the stepped structure is a curved surface, the contact surface with the sealant 4 inside it gradually increases in the form of a curve as the height increases, which can further optimize the contact area with the sealant 4, help to disperse heat, and improve the thermal conductivity of the macro anchoring structure 121. In addition, the straight-tube structure reduces the weight of the macro anchoring structure 121 itself by opening a hole in the surrounding part 12, improves air circulation, and can achieve interlocking with the sealant 4 while satisfying the need to reduce its own weight.

[0048] Preferably, in a possible implementation manner, the groove or the hole presents a downwardly contracted morphology.

[0049] It can be understood that when the groove or cavity presents a downward contracting morphology, the entrance for the sealant 4 to flow in is smaller, and the internal space after flowing in gradually expands, so that the flowing sealant 4 has a larger contact area with the macro anchoring structure 121. As its internal shape gradually changes, the flowing sealant 4 fills the internal space and gradually solidifies. The sealant 4 and the macro anchoring structure 121 are embedded together to form a stable interlocking structure, providing strong mechanical connection and shock resistance.

[0050] Furthermore, Figure 6 For a schematic diagram of the third embodiment of the macro anchoring structure provided in this application, please refer to Figure 6 ,exist Figure 6 In the example shown, the macro anchoring structure 121 is an array structure composed of protrusions.

[0051] Optionally, the protrusion may be any of the following shapes: conical, trumpet-shaped, cylindrical, rectangular, spherical, or hemispherical.

[0052] It should be noted that different shapes of protrusions can be selected according to actual needs, and are not limited in this application. For example, in one embodiment, a strong locking effect is required between the macro anchoring structure 121 and the substrate, and a conical protrusion can be selected; for another example, in another embodiment, a spherical protrusion can be selected to ensure that the pressure between the macro anchoring structure 121 and the substrate is evenly distributed.

[0053] Furthermore, Figure 7 For a schematic diagram of the fourth embodiment of the macro anchoring structure provided in this application, please refer to Figure 7 , the hook-shaped object is a hook-shaped protrusion; or, the hook-shaped object is a hook accommodated in a groove. Specifically, for example, in Figure 7 In the example shown in (A) of FIG. , the hook is a hook-shaped protrusion; Figure 7 In the example shown in FIG. 7 (B), the hook-shaped object is a hook received in the groove.

[0054] For details, see Figure 7 In (A), the specific morphology of the hook-shaped protrusion is similar to a hook, protruding outward, so that it can hang or hook the cured sealant 4. When the sealant 4 covers the hook and cures, it forms a firm interlocking structure with the macro anchoring structure 121. For further information, see Figure 7 As shown in FIG. 5 (B), the hooks contained in the grooves can form a highly stable interlocking structure with the internal hooks after the sealant 4 flows into the grooves.

[0055] It should be noted that a suitable hook-shaped structure can be selected according to actual needs to form the macro anchoring structure 121 , and this is not limited in the present embodiment.

[0056] Referring to the above description, it should be noted that the macroscopic anchoring structure is formed by a stamping process. A specific embodiment will be given below to explain the preparation method of the integrated heat sink in detail, which will not be repeated here.

[0057] Referring to the previous description, it can be seen that the macro-anchoring structure provides a mechanical grip for the sealant during the curing process and can form a mechanical interlocking structure with the sealant. The mechanical interlocking structure significantly improves the bonding strength between the integrated heat sink and the substrate and reduces the risk of delamination, especially under thermal cycling or mechanical stress conditions.

[0058] In the present application, by providing a macro-anchoring structure on the side of the surrounding portion facing the substrate, the macro-anchoring structure is mechanically engaged with the sealant and has excellent resistance to delamination. Further, exemplary, the macro-anchoring structure can be a hook, a barb, a groove and a protrusion, and a hole; wherein the hook has a curved protrusion to form a mechanical anchor point for the sealant; the barb can be designed to be a sharp part that can grasp the sealant to prevent sliding or separation. The grooves and protrusions increase the contact surface area between the surrounding portion and the sealant through a repeated pattern and provide a mechanical fixation effect. The holes can provide small depressions or embedded structures that can trap the sealant and enhance the mechanical retention. The specific morphology of the macro-anchoring structure can be customized according to the characteristics of the sealant (such as viscosity, curing process) and the specific requirements of the chip package (such as thermal expansion, mechanical load).

[0059] The above-mentioned embodiments give the specific morphology of the macro-anchoring structure. By arranging the macro-anchoring structure on the side of the surrounding portion toward the substrate, a macro-mechanical interlocking structure can be integrated between the integrated heat sink and the substrate through the synergistic effect of the macro-anchoring structure and the sealant, so as to prevent the integrated heat sink from being delaminated or falling off through the mechanical interlocking structure.

[0060] The second aspect of the present application further provides a method for preparing an integrated radiator. The preparation method of the integrated radiator provided in the present application is introduced below.

[0061] Figure 8 This is a flow chart of Example 1 of the preparation method of the integrated radiator provided in this application. Figure 8 The method provided in this embodiment is used to prepare any integrated heat sink provided in the first aspect of the present application, and the method comprises: S801. Prepare a standard heat sink; wherein the standard heat sink comprises a heat sink cover and a surrounding portion extending downward along the circumference of the heat sink cover.

[0062] S802. A macro-anchoring structure is formed on a side of the surrounding portion facing the substrate; wherein, when the surrounding portion is bonded to the substrate by means of a sealant, the sealant flows into or wraps around the macro-anchoring structure, and the sealant can mechanically clamp or hook the macro-anchoring structure after curing, so that the cured sealant forms a mechanical interlocking structure with the surrounding portion, so that the integrated heat sink and the substrate are firmly fixed together by means of the mechanical interlocking structure.

[0063] Optionally, the macro anchoring structure is an array structure composed of at least one of the following structures: grooves, holes, protrusions and hooks; the array structure is evenly distributed on the side of the surrounding portion facing the substrate; the macro anchoring structure is formed on the side of the surrounding portion facing the substrate, comprising: A groove, a hole, a protrusion or a hook is formed on a surface of the surrounding portion 12 facing the base 3 by a punching process, a stamping process and / or a CNC machining process.

[0064] For example, the macro anchoring structure is a straight-through groove as an example for explanation. At this time, a straight-cylindrical groove can be directly formed in the surrounding part through a punching process.

[0065] In example, Fig. 9 This is a schematic diagram of an implementation principle of preparing an integrated heat sink according to an exemplary embodiment of the present application. Fig. 9 , if necessary, Figure 5 When the integrated heat sink is shown in FIG. (C), a through hole can be formed in the surrounding portion 12 by a punching process, and then a stepped structure can be formed by a stamping process. Fig.10 This is another exemplary embodiment of the present application showing the implementation principle diagram of preparing an integrated heat sink, please refer to Fig.10 , if necessary, Figure 7 When an integrated heat sink is formed as shown in FIG. 2 (B), a stamping process can be used to first form an intermediate structure, and then a stamping process can be further used to form the desired macroscopic anchoring structure.

[0066] Specifically, in this embodiment, by preparing a standard heat sink including a heat dissipation cover and a surrounding portion extending downward along the heat dissipation cover, and then forming a macro anchoring structure on a side of the surrounding portion facing the substrate, any integrated heat sink provided in the first aspect of the present application can be formed to enhance the bonding strength between the heat sink and the substrate and reduce the risk of delamination or separation of the heat sink.

[0067] This application provides a chip packaging structure, please continue to refer to Figure 3 , the chip packaging structure comprises a substrate 3, a chip 2 and any integrated heat sink 1 provided in the first aspect of the present application; Wherein, the chip 2 is fixed on the substrate 3; The heat dissipation cover 11 of the integrated heat sink 1 is fixed on the chip 2, and the surrounding portion 12 of the integrated heat sink 1 is bonded to the substrate 3 through the sealant 4; wherein, when the surrounding portion 12 is bonded to the substrate 3 through the sealant 4, the sealant 4 flows into or wraps the macro-anchoring structure 121 on the surrounding portion 12, and the sealant 4 can mechanically clamp or hook the macro-anchoring structure 121 after curing, so that the cured sealant 4 forms a mechanical interlocking structure with the surrounding portion 12, so as to firmly fix the integrated heat sink 1 and the substrate 3 together through the mechanical interlocking structure.

[0068] In this embodiment, the chip packaging structure includes a substrate 3, a chip 2 and an integrated heat sink 1, the chip 2 is fixed on the substrate 3, the integrated heat sink 1 includes a heat dissipation cover 11 and a surrounding portion 12 along the periphery of the heat dissipation cover 11, the heat dissipation cover 11 is fixed on the chip 2, the surrounding portion 12 is bonded to the substrate 3 through a sealant 4, and a macro anchoring structure 121 is also provided on the bottom of the surrounding portion 12 facing the side of the substrate 3. When the surrounding portion 12 and the substrate 3 are bonded by the sealant 4, the sealant 4 flows into the macro anchoring structure 121. When the sealant 4 is cured, a stable mechanical interlocking structure is formed, and the integrated heat sink 1, the substrate 3 and the chip 2 are firmly fixed together. Such a chip packaging structure not only has a stable connection but also has a reliable heat dissipation effect.

[0069] For details, please continue to refer to Figure 3 , Figure 3 In the example shown, a thermal interface material 5 is also included between the integrated heat sink 1 and the chip 2. The heat dissipation cover 11 of the integrated heat sink 1 is bonded to the thermal interface material 5 on the side facing the chip 2, and the chip 2 is bonded to the thermal interface material 5 on the side facing the heat dissipation cover 11. In this way, the heat conduction efficiency between the heat dissipation cover 11 and the chip 2 can be improved. By arranging a uniform thermal interface material 5 between the heat dissipation cover 11 and the chip 2, the thermal contact between the heat dissipation cover 11 and the chip 2 is more uniform, which helps to conduct the heat generated by the chip 2 into the integrated heat sink 1 to prevent the chip 2 from overheating.

[0070] It should be noted that the thermal interface material 5 is a material with excellent thermal conductivity efficiency, which can not only help fill the gap between the chip 2 and the heat dissipation cover 11, but also ensure better thermal contact and heat transfer. Furthermore, the type of thermal interface material 5 can be selected according to actual needs, and is not limited in this application. For example, in one embodiment, the thermal interface material 5 can be an indium sheet, etc.

[0071] In the chip packaging structure provided in this embodiment, a mechanical interlocking structure is formed between the heat dissipation cover and the substrate. The bonding strength between the heat dissipation cover and the substrate is high, and the heat dissipation cover is not easy to delaminate or fall off, which can effectively maintain the heat dissipation of the chip and the overall performance of the chip.

[0072] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. An integrated radiator, characterized in that: The integrated heat sink comprises a heat dissipation cover and a surrounding portion extending downward along the circumference of the heat dissipation cover; wherein, The surrounding portion has a macro-anchoring structure on one side facing the substrate; when the surrounding portion is bonded to the substrate by means of sealant, the sealant flows into or wraps around the macro-anchoring structure, and the sealant can mechanically clamp or hook the macro-anchoring structure after curing, so that the cured sealant forms a mechanical interlocking structure with the surrounding portion, so as to firmly fix the integrated radiator and the substrate together through the mechanical interlocking structure.

2. The integrated heat sink according to claim 1, characterized in that: The macro anchoring structure is an array structure composed of at least one of the following structures: grooves, holes, protrusions and hooks; Wherein, the array structure is evenly distributed on a surface of the surrounding portion facing the substrate.

3. The integrated heat sink according to claim 2, characterized in that: The groove or the hole is a straight cylindrical structure, a conical structure or a stepped structure; The stepped structure is composed of at least two levels, and the inner surface of each level is a plane or a curved surface.

4. The integrated heat sink according to claim 2, characterized in that: The hook-shaped object is a hook-shaped protrusion; or, The hook-shaped object is a hook accommodated in the groove.

5. The integrated heat sink according to claim 2, characterized in that: The protrusion is any of the following shapes: conical, trumpet-shaped, cylindrical, rectangular, spherical, and hemispherical.

6. The integrated heat sink according to claim 2, characterized in that: The groove or the hole presents a downwardly contracted morphology.

7. The integrated heat sink according to claim 1, characterized in that: The macro anchoring structure is formed by a stamping process.

8. A method for preparing an integrated radiator, characterized in that: The method is used to prepare the integrated heat sink according to any one of claims 1 to 7, and the method comprises: Prepare a standard heat sink; wherein the standard heat sink comprises a heat sink cover and a surrounding portion extending downward along the circumference of the heat sink cover; A macro-anchoring structure is formed on a side of the surrounding portion facing the substrate; wherein, when the surrounding portion is bonded to the substrate by means of a sealant, the sealant flows into or wraps around the macro-anchoring structure, and the sealant can mechanically clamp or hook the macro-anchoring structure after curing, so that the cured sealant forms a mechanical interlocking structure with the surrounding portion, so as to firmly fix the integrated heat sink and the substrate together through the mechanical interlocking structure.

9. The method according to claim 8, characterized in that The macro anchoring structure is an array structure composed of at least one of the following structures: grooves, holes, protrusions and hooks; the array structure is evenly distributed on the side of the surrounding portion facing the substrate; The macro anchoring structure is formed on a side of the surrounding portion facing the substrate, comprising: A groove, a hole, a protrusion or a hook is formed on a surface of the surrounding portion facing the base by a punching process, a stamping process and / or a CNC machining process.

10. A chip packaging structure, characterized in that: The chip packaging structure comprises a substrate, a chip and an integrated heat sink as claimed in any one of claims 1 to 7; The chip is fixed on the substrate; The heat dissipation cover of the integrated heat sink is fixed on the chip, and the surrounding part of the integrated heat sink is bonded to the substrate by means of sealant; wherein, when the surrounding part is bonded to the substrate by means of the sealant, the sealant flows into or wraps around the macro-anchoring structure on the surrounding part, and the sealant can mechanically clamp or hook the macro-anchoring structure after curing, so that the cured sealant and the surrounding part form a mechanical interlocking structure, so as to firmly fix the integrated heat sink and the substrate together through the mechanical interlocking structure.

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