Grounding structure and grounding device

Abstract

The invention provides a grounding structure and a grounding device. The grounding structure comprises a cavity part and an exhaust port part, wherein under the condition that the grounding structure is clamped between the element to be grounded and the grounding end, the exhaust port part can be switched from the closed state to the open state, so that gas in the cavity part is released outwards through the exhaust port part, and the counter-acting force applied to the element to be grounded or the grounding end by the cavity part is reduced or counteracted. According to the grounding structure and the grounding device provided by the invention, the problem that the to-be-grounded element is easily damaged due to the counter-acting force of the grounding structure in the prior art can be solved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of terminal equipment, and in particular to a grounding structure and a grounding device. Background Art

[0002] The functional modules of electronic devices (such as the backlight modules of display screens, etc.) usually need to be electrically connected to the housing or frame to realize the grounding function of the functional modules. However, the grounding structure in the related art is usually conductive foam or conductive spring. Such a grounding structure can easily damage the functional modules due to the reaction force of the grounding structure during the assembly or use of the functional modules. Summary of the invention

[0003] The embodiments of the present disclosure provide a grounding structure and a grounding device to solve the problem in the related art that a grounded element is easily damaged due to the reaction force of the grounding structure.

[0004] In the first aspect, an embodiment of the present disclosure provides a grounding structure, which includes a chamber portion and an exhaust port portion; wherein, when the grounding structure is clamped between an element to be grounded and a grounding end, the exhaust port portion can be switched from a closed state to an open state to release the gas in the chamber portion to the outside through the exhaust port portion.

[0005] In a second aspect, an embodiment of the present disclosure further provides a grounding device, including:

[0006] Components to be grounded;

[0007] ground terminal; and

[0008] The grounding structure as described in any one of the above items electrically connects the element to be grounded and the grounding terminal.

[0009] In a third aspect, an embodiment of the present disclosure further provides an electronic device, comprising the grounding device as described above.

[0010] The grounding structure and grounding device provided by the embodiments of the present disclosure have the following advantages: when the grounding structure is clamped between the element to be grounded and the grounding end, the exhaust port portion can be switched from a closed state to an open state to release the gas in the chamber portion to the outside through the exhaust port portion, thereby reducing or offsetting the reaction force applied by the chamber portion to the element to be grounded or the grounding end, thereby reducing or avoiding damage to the element to be grounded or the grounding end, and improving the safety and reliability of the element to be grounded during assembly or use. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0012] Figure 1 is a schematic structural diagram of a grounding device provided by an embodiment of the present disclosure;

[0013] Figure 2 is a structural schematic diagram of a grounding structure provided by an embodiment of the present disclosure;

[0014] Figure 3 is a structural schematic diagram of a grounding structure provided by an embodiment of the present disclosure;

[0015] Figure 4 is a schematic diagram of gas exhaust of a grounding structure provided by an embodiment of the present disclosure;

[0016] Figure 5 is a structural schematic diagram of a grounding structure provided by an embodiment of the present disclosure at an angle;

[0017] Figure 6 is a structural schematic diagram of a grounding structure provided by an embodiment of the present disclosure from another angle;

[0018] Figure 7 is a structural schematic diagram of a grounding structure provided by an embodiment of the present disclosure;

[0019] Figure 8 It is a partial structural schematic diagram of a grounding device provided by an embodiment of the present disclosure at one angle;

[0020] Fig. 9 It is a partial structural schematic diagram from another angle of the grounding device provided by an embodiment of the present disclosure.

[0021] Description of reference numerals:

[0022] 100. Grounding structure;

[0023] 10. chamber portion; 20. exhaust port portion; 21. opening sub-portion; 22. sealing member;

[0024] 30. deformable member; 40. conductive layer;

[0025] 200. Component to be grounded; 300. Grounding terminal. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0027] In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present disclosure. In addition, the terms "first" and "second" are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0028] It should also be understood that the terms used in this disclosure are only for the purpose of describing specific embodiments and are not intended to limit the disclosure. As used in this disclosure and the appended claims, the singular forms "a", "an" and "the" are intended to include plural forms unless the context clearly indicates otherwise.

[0029] It should be further understood that the term “and / or” used in this disclosure and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0030] In the related art, conductive foam is usually used to electrically connect the element to be grounded to the grounding end to achieve grounding of the element to be grounded. However, this grounding method requires that the conductive foam needs to be compressed to a certain pre-compression amount in order to achieve reliable grounding of the element to be grounded, but the conductive foam will exert a rebound force on the element to be grounded, causing the element to be grounded to be easily damaged during use or assembly. For example, the element to be grounded includes an LCD display screen, and conductive foam is attached to the back of the LCD display screen. The rebound force of the conductive foam is easy to damage the backlight film material of the display screen and cause the appearance of white masses. For another example, the element to be grounded includes an OLED display screen. Conductive foam is attached to the back of the OLED display screen. The rebound force of the conductive foam will cause the display screen to be subjected to uneven stress, causing the OLED screen glass to be easily broken when it falls. For another example, for flexible display screens, the conductive foam has a large compression amount, and the local pressure stress on the OLED screen body is large, which may cause protrusion deformation of the screen body, and the deformation on the screen can be seen when there is no display.

[0031] To this end, the present embodiment provides a grounding structure and a grounding device to solve the problem in the related art that the grounded element is easily damaged due to the reaction force of the grounding structure.

[0032] In conjunction with the accompanying drawings, some embodiments of the present disclosure are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0033] See also Figure 1 This embodiment provides a grounding structure 100, which can be used in electronic devices. The electronic devices may include mobile communication devices such as mobile phones, watches or tablet computers.

[0034] In some embodiments, the element to be grounded 200 includes a functional module of an electronic device. Exemplarily, the element to be grounded 200 includes a functional module on the electronic device that needs to be grounded, and the functional module is used to implement a preset function of the electronic device. For example, in the case where the electronic device is a mobile phone, the element to be grounded 200 may include at least one of the following: a display screen, a sensor, a circuit board, a speaker, etc. The display screen may include an LCD display screen, an OLED display screen, or other types of display screens. Exemplarily, the element to be grounded 200 includes a backlight module of the display screen.

[0035] In actual use, the grounded element 200 is susceptible to electromagnetic interference, and it is often necessary to ground the grounded element 200. In order to achieve the grounding of the grounded element 200, the grounded element 200 is usually electrically connected to the ground terminal 300 (GND). In order to achieve the grounding of the grounded element 200, the grounding structure 100 is sandwiched between the grounded element 200 and the ground terminal 300 to electrically connect the grounded element 200 and the ground terminal 300. Exemplarily, the ground terminal 300 includes a frame or a housing. For example, for a mobile phone, the ground terminal 300 is usually a housing or a frame of the mobile phone.

[0036] See also Figure 2 In some embodiments, the grounding structure 100 includes a chamber portion 10 and an exhaust port portion 20; wherein, when the grounding structure 100 is sandwiched between a grounded element 200 and a grounding end 300, the exhaust port portion 20 can be switched from a closed state to an open state to release the gas in the chamber portion 10 to the outside through the exhaust port portion 20.

[0037] In the grounding structure 100 of the above embodiment, when the grounding structure 100 is sandwiched between the grounding element 200 and the grounding end 300, the exhaust port 20 can be switched from a closed state to an open state, so as to release the gas in the chamber 10 outward through the exhaust port 20, thereby reducing or offsetting the reaction force applied by the chamber 10 to the grounding element 200 or the grounding end 300, thereby reducing or avoiding damage to the grounding element 200 or the grounding end 300; for example, it can reduce or avoid the problems of white mass, easy breakage of the grounding element 200, or easy local deformation of the grounding element 200 caused by the reaction force of the grounding structure 100 on the grounding element 200. Therefore, the grounding structure 100 can not only realize the reliable electrical connection between the grounding element 200 and the grounding end 300, but also improve the safety and reliability of the grounding element 200 during assembly or use, improve the functional effect of the grounding element 200 and the quality of the whole machine, and the grounding structure 100 has a simple structure.

[0038] In some embodiments, the exhaust port 20 can be switched from a closed state to an open state under force to release the gas in the chamber 10 outward through the exhaust port 20, thereby reducing or offsetting the reaction force applied by the chamber 10 to the grounded element 200 or the grounding terminal 300.

[0039] Exemplarily, the force applied to the exhaust port portion 20 may come from a component or object outside the chamber portion 10 , such as a puncturing component that may puncture the exhaust port portion 20 , so that the exhaust port portion 20 switches from a closed state to an open state.

[0040] Exemplarily, the force exerted on the exhaust port portion 20 may come from the gas pressure in the chamber portion 10 . When the gas pressure in the chamber portion 10 increases to a preset threshold, the exhaust port portion 20 may be switched from a closed state to an open state.

[0041] In some embodiments, the exhaust port portion 20 can be switched from a closed state to an open state when the chamber portion 10 is squeezed. It can be understood that when the chamber portion 10 is squeezed and the exhaust port portion 20 is in a closed state, the volume of the chamber portion 10 is reduced, resulting in an increase in the gas pressure inside the chamber portion 10, and the opening pressure of the exhaust port portion 20 is also increased accordingly. When the opening pressure of the exhaust port portion 20 reaches a preset threshold, the exhaust port portion 20 is switched from a closed state to an open state to release the gas in the chamber portion 10 outward through the exhaust port portion 20. Exemplarily, when the grounding structure 100 is sandwiched between the element to be grounded 200 and the grounding end 300, the element to be grounded 200 and the grounding end 300 can squeeze the grounding structure 100, and the gas in the chamber portion 10 of the grounding structure 100 can be released outward through the exhaust port portion 20, thereby reducing or offsetting the reaction force applied by the chamber portion 10 to the element to be grounded 200 or the grounding end 300.

[0042] Exemplarily, before being assembled with the element to be grounded 200, the exhaust port portion 20 of the grounding structure 100 is in a closed state. During the assembly process, the grounding structure 100 is sandwiched between the element to be grounded 200 and the grounding terminal 300. After the grounding structure 100 is squeezed by the element to be grounded 200 or the grounding terminal 300, the volume of the chamber portion 10 is reduced, resulting in an increase in the gas pressure inside the chamber portion 10. When the gas pressure in the chamber portion 10 increases to the point where the exhaust port portion 20 can be opened, the gas in the chamber portion 10 can be released outward from the exhaust port portion 20, reducing or discharging the squeezing force on the grounding structure 100, so that the grounding structure 100 can be reliably electrically connected to the element to be grounded 200 and the grounding terminal 300, and can also reduce or offset the reaction force applied by the grounding structure 100 to the element to be grounded 200 or the grounding terminal 300.

[0043] It can be understood that when the exhaust port 20 is switched to the open state, as the gas in the chamber 10 is released to the outside through the exhaust port 20, the gas in the chamber 10 is reduced, and the gas pressure in the chamber 10 is reduced; after the gas pressure in the chamber 10 is reduced to a certain extent, the exhaust port 20 can be switched from the open state to the closed state. At this time, the grounding structure 100 can be reliably electrically connected to the grounded element 200 and the grounding terminal 300, and the reaction force applied by the grounding structure 100 to the grounded element 200 or the grounding terminal 300 is zero. For example, refer to Figure 2The exhaust port portion 20 includes an opening sub-portion 21 and a sealing member 22, wherein the sealing member 22 is used to seal the opening sub-portion 21; when the opening sub-portion 21 is opened, as the gas in the chamber portion 10 is released outward through the opening sub-portion 21, the gas in the chamber portion 10 decreases, and the gas pressure in the chamber portion 10 decreases; after the gas pressure in the chamber portion 10 decreases to a certain extent, the sealing member 22 can be sealed and connected to the wall of the opening sub-portion 21 to close the opening sub-portion 21, at this time, the grounding structure 100 can be reliably electrically connected to the element to be grounded 200 and the grounding terminal 300, and the reaction force applied by the grounding structure 100 to the element to be grounded 200 or the grounding terminal 300 is zero.

[0044] In some embodiments, after assembly, the grounding structure 100 can reliably electrically connect the grounded element 200 and the grounding terminal 200, the reaction force applied by the grounding structure 100 to the grounded element 200 or the grounding terminal 300 is zero, and the grounded element 200 is safe and reliable during use.

[0045] It can be understood that the thickness of the exhaust port portion 20 along the preset direction is less than or equal to the thickness of the chamber portion 10 along the preset direction. Exemplarily, the thickness of the exhaust port portion 20 along the preset direction is 0.1 mm, 0.8 mm, or any other suitable value between 0.1 mm and 0.8 mm. Exemplarily, the preset direction is the clamping direction of the grounding structure 100 clamped by the grounding element 200 and the grounding terminal 300.

[0046] See also Figure 2 In some embodiments, the exhaust port portion 20 includes an opening sub-portion 21 and a sealing member 22, wherein the sealing member 22 is disposed at the opening sub-portion 21 and is used to seal the opening sub-portion 21. The sealing member 22 can open the opening sub-portion 21 when a preset condition is met, so as to release the gas in the chamber portion 10 to the outside through the opening sub-portion 21, thereby reducing or offsetting the reaction force applied by the chamber portion 10 to the grounded element 200 or the grounding terminal 300.

[0047] In some embodiments, the preset condition includes at least one of the following: the pressure in the chamber portion 10 reaches a preset pressure; the ambient temperature of the seal 22 reaches a preset temperature. Exemplarily, the seal 22 includes a sealant, and when the grounding structure 100 or the chamber portion 10 is not subjected to an extrusion force, the seal 22 is sealed and connected to the wall of the opening sub-portion 21, and the opening sub-portion 21 is closed. When the grounding structure 100 is sandwiched between the element to be grounded 200 and the grounding terminal 300, as the chamber portion 10 is squeezed, the pressure in the chamber portion 10 increases; when the pressure in the chamber portion 10 reaches a preset pressure, the seal 22 is disconnected from the wall of the opening sub-portion 21, the opening sub-portion 21 is opened, and the gas in the chamber portion 10 can be released outward through the opening sub-portion 21.

[0048] Exemplarily, the seal 22 includes a sealant. When the ambient temperature of the seal 22 is lower than a preset temperature, the wall of the opening sub-portion 21 is sealed and connected to the seal 22. When the ambient temperature of the seal 22 is higher than or equal to the preset temperature, the wall of the opening sub-portion 21 is separated from the seal 22, the opening sub-portion 21 is opened, and the gas in the chamber portion 10 can be released outward through the opening sub-portion 21.

[0049] It is understandable that the opening degree of the opening sub-portion 21 may include one, two or more, which is not limited here. When the opening degree of the opening sub-portion 21 includes multiple, the amount of gas discharged from the opening sub-portion 21 per unit time is different for opening sub-portions 21 with different opening degrees.

[0050] Exemplarily, the thickness of the seal 22 along a preset direction is 0.03 mm, 1 mm or any other suitable value between 0.03 mm and 1 mm, so as to ensure that the seal 22 can reliably seal the opening sub-portion 21 when the grounding structure 100 is not squeezed; when the grounding structure 100 is clamped between the element to be grounded 200 and the grounding end 300, the opening sub-portion 21 can be opened to release the gas in the chamber portion 10 to the outside through the opening sub-portion 21, thereby reducing or offsetting the reaction force applied by the chamber portion 10 to the element to be grounded 200 or the grounding end 300.

[0051] Exemplarily, the width of the seal 22 along the gas discharge direction is 0.5 mm, 1 mm or any other suitable value between 0.5 mm and 1 mm to ensure that the seal 22 can reliably seal the opening sub-portion 21 when the grounding structure 100 is not squeezed; when the grounding structure 100 is clamped between the element to be grounded 200 and the grounding end 300, the opening sub-portion 21 can be opened to release the gas in the chamber portion 10 to the outside through the opening sub-portion 21, thereby reducing or offsetting the reaction force applied by the chamber portion 10 to the element to be grounded 200 or the grounding end 300.

[0052] It is understandable that the number of the sealing members 22 can be set according to actual needs, such as one, two, three or more. Figure 2 and Figure 3In some embodiments, the number of the sealing members 22 includes multiple sealing members 22, and the multiple sealing members 22 are arranged at intervals along the gas discharge direction. In this structure, the multiple sealing members 22 need to be separated from the sealing connection with the wall of the opening sub-portion 21 in turn, and the gas in the chamber portion 10 can be slowly released to the outside through the opening sub-portion 21, thereby improving the stability of the gas in the chamber portion 10 being discharged to the outside; in addition, when the opening sub-portion 21 is closed, the arrangement of the multiple sealing members 22 can improve the sealing reliability of the chamber portion 10, and prevent the opening sub-portion 21 from being easily opened to affect the functional effect of the grounding structure 100. Each opening sub-portion 21 can be provided with one, two or more sealing members 22. For example, each opening sub-portion 21 is provided with 1-5 sealing members 22 to ensure that the sealing member 22 can reliably seal the opening sub-portion 21 when the grounding structure 100 is not squeezed; when the grounding structure 100 is sandwiched between the element to be grounded 200 and the grounding end 300, the opening sub-portion 21 can be opened to release the gas in the chamber portion 10 to the outside through the opening sub-portion 21, thereby reducing or offsetting the reaction force applied by the chamber portion 10 to the element to be grounded 200 or the grounding end 300.

[0053] See also Figure 4 , illustratively, under the gas pressure of the chamber portion 10, the wall of the opening sub-portion 21 is separated from the sealing connection with the sealing member 22, and the opening sub-portion 21 is opened. It can be understood that, Figure 4 The dotted arrows in the figure indicate the direction of gas discharge.

[0054] See also Figure 2 In some embodiments, the number of the exhaust port 20 includes one, so that the structure is simple and the processing is convenient.

[0055] See also Figure 5 and Figure 6 In some embodiments, the number of the exhaust port portions 20 includes at least two, and each exhaust port portion 20 is correspondingly provided with at least one sealing member 22, so that the gas in the chamber portion 10 can be released to the outside faster.

[0056] Exemplarily, the connection method of the grounding structure 100 and the element to be grounded 200 includes: adhesive connection, etc. Compared with welding the grounding spring to the element to be grounded 200, this embodiment reduces environmental pollution caused by welding.

[0057] Exemplarily, the connection method between the grounding structure 100 and the grounding terminal 300 includes: adhesive connection, etc. Compared with welding the grounding spring to the grounding terminal 300, this embodiment reduces environmental pollution caused by welding.

[0058] See also Figure 7In some embodiments, the grounding structure 100 includes a deformable member 30 and a conductive layer 40, the deformable member 30 is formed with a chamber portion 10 and an exhaust port portion 20; the conductive layer 40 is arranged on the side of the deformable member 30 away from the chamber portion 10, and the conductive layer 40 is used to conductively connect the grounded element 200 and the grounding terminal 300.

[0059] Exemplarily, the deformable member 30 may include: a flexible film or an airbag, etc. The thickness of the deformable member 30 may be set according to actual needs, such as 0.01 mm, 0.2 mm or any other suitable value between 0.01 mm and 0.2 mm.

[0060] Exemplarily, the conductive layer 40 includes at least one of the following: a silver conductive layer 40 , a copper conductive layer 40 , and the like.

[0061] It can be understood that one, two, three, four or more grounding structures 100 can be arranged between the grounded element 200 and the grounding terminal 300. Figure 1 , Figure 8 and Fig. 9 For example, at least two grounding structures 100 may be arranged between the grounding terminal 300 and a grounding element 200, and the plurality of grounding structures 100 are arranged at intervals, thereby providing deformation space for the grounding structure 100. For example, Figure 1 The dotted line in illustrative figures represents one of the deformation states of the grounding structure 100 after being squeezed by the grounding element 200 or the grounding end 300 .

[0062] This embodiment further provides a grounding device, comprising a grounding element 200 , a grounding terminal 300 , and a grounding structure 100 according to any one of the above embodiments. The grounding structure 100 is electrically connected to the grounding element 200 and the grounding terminal 300 .

[0063] In the grounding device of the above embodiment, when the grounding structure 100 is sandwiched between the element to be grounded 200 and the grounding end 300, the exhaust port 20 can be switched from a closed state to an open state, so as to release the gas in the chamber 10 outward through the exhaust port 20, thereby reducing or offsetting the reaction force applied by the chamber 10 to the element to be grounded 200 or the grounding end 300, thereby reducing or avoiding damage to the element to be grounded 200 or the grounding end 300, for example, it can reduce or avoid the problem of white mass, easy breakage of the element to be grounded 200, or easy local deformation of the element to be grounded 200 caused by the reaction force of the grounding structure 100. Therefore, the grounding structure 100 can not only realize the reliable electrical connection between the element to be grounded 200 and the grounding end 300, but also improve the safety and reliability of the element to be grounded 200 during assembly or use, improve the functional effect of the element to be grounded 200 and the quality of the whole machine, and the structure of the grounding structure 100 is simple.

[0064] In some embodiments, the element to be grounded 200 includes a functional module of an electronic device, and the grounding terminal 300 includes a frame or a housing.

[0065] Exemplarily, the element to be grounded 200 includes the element to be grounded 200 of any one of the above embodiments. The grounding terminal 300 includes the grounding terminal 300 of any one of the above embodiments.

[0066] This embodiment also provides an electronic device, comprising the grounding device of any one of the above embodiments.

[0067] In the electronic device of the above embodiment, when the grounding structure 100 is sandwiched between the element to be grounded 200 and the grounding end 300, the exhaust port 20 can be switched from a closed state to an open state, so as to release the gas in the chamber 10 outward through the exhaust port 20, thereby reducing or offsetting the reaction force applied by the chamber 10 to the element to be grounded 200 or the grounding end 300, thereby reducing or avoiding damage to the element to be grounded 200 or the grounding end 300, for example, it can reduce or avoid the formation of white lumps, the element to be grounded 200 being easily broken, or the element to be grounded 200 being easily deformed locally due to the reaction force of the grounding structure 100 on the element to be grounded 200. Therefore, the grounding structure 100 can not only realize the reliable electrical connection between the element to be grounded 200 and the grounding end 300, but also improve the safety and reliability of the element to be grounded 200 during assembly or use, improve the functional effect of the element to be grounded 200 and the quality of the whole machine, and the structure of the grounding structure 100 is simple.

[0068] Illustratively, the electronic device includes the electronic device of any one of the above embodiments.

[0069] In the description of the present disclosure, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "mechanically coupled" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the internal connection of two elements or the interaction relationship between two elements. The mechanical coupling or coupling of two components includes direct coupling and indirect coupling, for example, direct fixed connection, connection through a transmission mechanism, etc. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to the specific circumstances.

[0070] In the present disclosure, unless otherwise expressly specified and limited, a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being “above”, “above”, and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0071] The disclosure above provides many different embodiments or examples to realize different structures of the present disclosure. In order to simplify the disclosure of the present disclosure, the components and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present disclosure. In addition, the present disclosure can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present disclosure provides various specific examples of processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0072] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific method steps, features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific method steps, features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0073] The above is only a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present disclosure, and these modifications or replacements should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A grounding structure, characterized in that: The grounding structure includes a chamber portion and an exhaust port portion; wherein, when the grounding structure is sandwiched between the element to be grounded and the grounding end, the exhaust port portion can be switched from a closed state to an open state to release the gas in the chamber portion to the outside through the exhaust port portion.

2. The grounding structure according to claim 1, characterized in that: The exhaust port portion can be switched from the closed state to the open state when a force is applied.

3. The grounding structure according to claim 2, characterized in that: The exhaust port portion can be switched from the closed state to the open state when the chamber portion is pressed.

4. The grounding structure according to claim 1, characterized in that: The exhaust port portion comprises: an opening sub-portion, communicating with the chamber portion; A sealing member is provided at the opening sub-portion and is used for sealing the opening sub-portion; the sealing member can open the opening sub-portion when a preset condition is met.

5. The grounding structure according to claim 4, characterized in that: The preset condition includes at least one of the following: the pressure in the chamber reaches a preset pressure; the ambient temperature of the sealing element reaches a preset temperature.

6. The grounding structure according to claim 4, characterized in that: The number of the sealing members includes a plurality, and the plurality of sealing members are arranged at intervals along the gas discharge direction.

7. The grounding structure according to claim 4, characterized in that: The number of the exhaust port portion includes one; or, The number of the exhaust openings includes at least two, and each exhaust opening is correspondingly provided with the sealing member.

8. The grounding structure according to claim 1, characterized in that: The grounding structure comprises: a deformable member, formed with the chamber portion and the exhaust port portion; The conductive layer is arranged on a side of the deformable member away from the chamber portion, and is used for conductively connecting the element to be grounded and the grounding terminal.

9. A grounding device, characterized in that: include: Components to be grounded; Ground terminal; as well as The grounding structure according to any one of claims 1 to 8, electrically connected to the element to be grounded and the grounding terminal.

10. The grounding device according to claim 9, characterized in that: The element to be grounded includes a functional module of an electronic device, and the grounding end includes a frame or a housing.

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