Manufacturing method of circuit board and electronic equipment

Abstract

The invention provides electronic equipment and a manufacturing method of a circuit board, the electronic equipment comprises a loudspeaker and a circuit board, the loudspeaker is electrically connected with the circuit board, a shielding structure can be arranged in the circuit board, and the shielding structure contains a magnetic material. Interference sources such as electronic components and interconnection lines on the circuit board can be arranged on one side, far away from the loudspeaker, of the shielding structure. Namely, the shielding structure is arranged between the loudspeaker and the interference source on the circuit board, and the electromagnetic interference generated by the circuit board can be blocked or absorbed by the shielding structure to a certain extent, so that the intensity of the electromagnetic interference of the circuit board to the outside is small, and the intensity of the electromagnetic interference of the circuit board on the voice coil of the loudspeaker in the electronic equipment comprising the circuit board is small. And the sound production effect of the loudspeaker is good.

Description

Technical Field

[0001] The present application relates to the field of terminal device hardware, and in particular, to a method for manufacturing a circuit board and an electronic device. Background Art

[0002] For example, in electronic devices such as headphones, the internal electronic components and circuit boards may generate electromagnetic interference to the voice coil loop of the speaker, generating current sound. How to reduce the electromagnetic interference of interference sources in electronic devices to the speaker and improve the sound effect of the speaker is a problem worth considering. Summary of the invention

[0003] The present application provides an electronic device, which includes a circuit board and a speaker. A shielding structure is arranged inside the circuit board, and the shielding structure can be used to shield electromagnetic interference generated by interconnection lines and electronic components of the circuit board, thereby reducing the adverse effects of the circuit board on the sound effect of the speaker.

[0004] In a first aspect, a circuit board and a speaker are provided, wherein the speaker is electrically connected to the circuit board, the circuit board includes a shielding structure and an interference source, the shielding structure is located inside the circuit board and between the interference source and the speaker, the interference source includes electronic components and / or interconnecting lines; wherein the shielding structure includes a magnetic material having a relative magnetic permeability greater than a first threshold value.

[0005] The interference source may refer to an electronic component or interconnection line that generates electromagnetic interference with an intensity greater than a preset threshold. In some scenarios, the interference source may also refer to an electronic component or interconnection line that radiates a frequency less than another preset threshold.

[0006] In some examples, the interference source is an electronic component or interconnection line with a radiation frequency less than 1 MHz. For example, the interference source may be a power inductor and / or a power supply line with a radiation frequency between 200 Hz and 200 kHz.

[0007] The shielding structure may refer to a structure that has a certain shielding effect on the electromagnetic interference generated by the interference source. The magnetic material included in the shielding structure may refer to a material containing one or more of iron, cobalt or nickel.

[0008] In some examples, the relative magnetic permeability of the magnetic material is greater than 20.

[0009] In the present technical solution, a shielding structure can be arranged inside the circuit board inside the electronic device. Since the shielding structure contains magnetic material and is located between the interference source on the circuit board and the speaker, it can block the electromagnetic interference generated by the interference source in the process of propagating to the speaker, which is beneficial to reducing the electromagnetic interference of the circuit board to the speaker and improving the sound effect of the speaker.

[0010] In combination with the first aspect, in certain implementations of the first aspect, a projection of the interference source in the plane where the circuit board is located is located within a region of a projection of the shielding structure in the plane where the circuit board is located.

[0011] In a possible implementation manner, the shielding structure is in the form of a sheet, a plate or a film.

[0012] In some scenarios, the technical solution can also be understood as that the projection of the interference source in the plane where the circuit board is located does not exceed the area range of the projection of the shielding structure in the plane where the circuit board is located.

[0013] The projection of the interference source can fall within the projection area of ​​the shielding structure, which means that more propagation paths of the electromagnetic field radiated outward from the interference source will be blocked by the shielding structure during the process of propagating to the speaker. In other words, the electromagnetic field that would originally propagate to the speaker from the interference source has a greater chance of being reflected or absorbed by the shielding structure when passing through the shielding structure. The implementation of this technical solution is conducive to improving the shielding effect of the shielding structure on the electromagnetic interference generated by the circuit board and reducing the adverse effects of the circuit board on the sound of the speaker.

[0014] In combination with the first aspect, in certain implementations of the first aspect, the shielding structure includes multiple sub-shielding structures, and the projection of the interference source in the plane where the circuit board is located is located within an area composed of multiple projections of the multiple sub-shielding structures in the plane where the circuit board is located.

[0015] In a possible implementation, the multiple sub-shielding structures have the same properties, such as structure and constituent materials.

[0016] In a possible implementation, the properties of the multiple sub-shielding structures, such as structures and constituent materials, may be determined according to the properties of the interference sources that the sub-shielding structures need to shield (eg, the intensity of the electromagnetic interference that can be generated).

[0017] In this technical solution, multiple sub-shielding structures can be set in the circuit board, and the multiple sub-shielding structures can work together on the interference source on the circuit board to block the electromagnetic field generated by the interference source from propagating to the speaker. Compared with using a whole shielding structure, setting up multiple sub-shielding structures is conducive to improving the flexibility of setting the shielding structure inside the circuit board. Setting shielding structures with different structures and performances for interference sources with different radiation intensities is conducive to improving the shielding efficiency of the shielding structure and reducing the electromagnetic interference of the circuit board to the speaker.

[0018] In combination with the first aspect, in some implementations of the first aspect, the multiple sub-shielding structures are in different planes.

[0019] In this technical solution, the sub-shielding structure is arranged parallel to the plane where the circuit board is located, which is conducive to improving the area utilization efficiency of the shielding structure. Multiple sub-shielding structures can be arranged in different planes in the thickness direction of the circuit board, which is conducive to adjusting the position of the shielding structure in the circuit board in combination with the layout of the interconnection lines and components on the circuit board, which is conducive to improving the space utilization inside the circuit board and improving the shielding effect of the shielding structure on the electromagnetic interference of the circuit board.

[0020] In combination with the first aspect, in certain implementations of the first aspect, the shielding structure includes at least one first functional layer and multiple second functional layers, the outer side of the shielding structure is the second functional layer, wherein the first functional layer is composed of magnetic material, the second functional layer is composed of non-magnetic non-conductor material, and the first functional layer and the second functional layer are adjacent to and stacked.

[0021] In a possible implementation, the magnetic material may include one or more of iron, cobalt, or nickel.

[0022] In some examples, the first functional layer can be in the form of a film.

[0023] In a possible implementation, the non-magnetic non-conductor material does not contain any of the elements iron, cobalt or nickel. It should be understood that the non-magnetic non-conductor material refers to a material having a relative magnetic permeability lower than a preset threshold and an electrical conductivity lower than another preset threshold.

[0024] In some examples, the non-magnetic non-conductive material includes carbon and oxygen, and the second functional layer is in the form of a film.

[0025] In the technical solution, the shielding structure is a composite layered structure with a second functional layer arranged on the outside. This composite layered structure can include more layers of the first functional layer. More first functional layers can increase the loss of the electromagnetic field incident to the inside of the shielding material, and improve the shielding effect of the shielding structure against electromagnetic interference. In addition, since the relative magnetic permeability of the non-magnetic non-conductor material is low, the non-magnetic non-conductor material on the outside can reduce the probability of the electromagnetic field incident to the shielding structure penetrating the shielding structure, and further improve the shielding effectiveness of the shielding structure.

[0026] In addition, the magnetic material layer and the non-magnetic non-conductor material layer in the shielding structure are adjacent to and stacked. The shielding structure can be regarded as a plurality of shielding structures including the first functional layer superimposed in the thickness direction. The electromagnetic field generated by the interference source needs to penetrate multiple shielding structures at the same time to propagate to the speaker. The shielding structure has better shielding effectiveness and the circuit board has less electromagnetic interference to the speaker.

[0027] In combination with the first aspect, in certain implementations of the first aspect, the shielding structure includes at least one second functional layer and multiple first functional layers, the outer side of the shielding structure is the first functional layer, the first functional layer is composed of magnetic material, and the second functional layer is composed of non-magnetic non-conductor material; the first functional layer and the second functional layer are adjacent and stacked; the circuit board also includes a dielectric layer, which covers the shielding structure, and the dielectric layer is composed of non-magnetic non-conductor material.

[0028] In a possible implementation, the magnetic material layer may include one or more of iron, cobalt, or nickel.

[0029] In some examples, the first functional layer may be in the form of a film.

[0030] In a possible implementation, the non-magnetic non-conductor material does not contain any of the elements iron, cobalt or nickel. It should be understood that the non-magnetic non-conductor material refers to a material having a relative magnetic permeability lower than a preset threshold and an electrical conductivity lower than another preset threshold.

[0031] In some examples, the non-magnetic non-conductive material includes carbon and oxygen, and the second functional layer is in the form of a film.

[0032] In the present technical solution, the outside of the shielding structure can be coated with the first functional layer. For the composite layered shielding structure with the first functional layer coated on the outside, the structure can include more layers of the first functional layer, and more magnetic materials can increase the loss of the electromagnetic field incident on the inside of the shielding material, thereby improving the shielding effect of the shielding structure against electromagnetic interference. In addition, for shielding structures with the same shielding effectiveness, the magnetic material is coated on the outside, and such a shielding structure can include more layers of magnetic material per unit thickness, which is beneficial to improving the shielding effectiveness of the shielding structure. For shielding structures with the same shielding effectiveness, the manufacturing process of the shielding structure provided in this embodiment is also simpler.

[0033] In addition, in the present technical solution, the magnetic material layer and the non-magnetic non-conductor material layer in the shielding structure are adjacent to and stacked. The shielding structure can be regarded as a plurality of shielding structures including the first functional layer superimposed in the thickness direction. The electromagnetic field generated by the interference source needs to penetrate multiple shielding structures at the same time to propagate to the speaker. The shielding structure has better shielding effectiveness, and the circuit board has less electromagnetic interference to the speaker.

[0034] In combination with the first aspect, in certain implementations of the first aspect, the shielding structure includes a first functional layer, and the circuit board also includes a dielectric layer, which covers the first functional layer, and the dielectric layer is composed of a non-magnetic and non-conductive material.

[0035] For the shielding structure including only one first functional layer, the preparation process of the shielding structure is simple.

[0036] In combination with the first aspect, in some implementations of the first aspect, the shielding structure is disposed close to the interference source.

[0037] In a possible implementation, in the case where interference sources are disposed on both sides of the circuit board, the shielding structure may be disposed close to the side that can generate a higher electromagnetic interference intensity.

[0038] In actual use, the interference source with greater interference intensity on the circuit board can be set away from the speaker, or in other words, the circuit board and the speaker can be installed in a manner that satisfies the shielding structure in the circuit board is located between the speaker and the interference source with greater interference intensity.

[0039] Because the magnetic field generated by the magnet inside the speaker will also have an adverse effect on the performance of the shielding structure to a certain extent, placing the shielding structure close to the interference source on the circuit board, or in other words, placing the shielding structure away from the speaker, will help reduce the impact of the speaker on the performance of the shielding structure and improve the stability of the performance of the shielding structure.

[0040] In combination with the first aspect, in some implementations of the first aspect, the electronic device is a headset.

[0041] In the technical solution, a shielding structure is arranged inside the circuit board. This type of circuit board occupies less space and is particularly suitable for electronic devices with limited accommodating space, such as headphones.

[0042] In a second aspect, a method for manufacturing a circuit board is provided, the method comprising: laying a first dielectric layer on the interconnection line of the circuit board, the first dielectric layer being composed of a non-magnetic non-conductor material, and the thickness of the first dielectric layer being no greater than the thickness of the interconnection line; laying a shielding structure at a position on the first dielectric layer corresponding to an interference source on the circuit board, the shielding structure comprising a magnetic material having a relative magnetic permeability greater than a first threshold value, the interference source comprising interconnection lines and / or electronic components, and the outer side of the shielding structure being coated with a non-magnetic non-conductor material.

[0043] The interference source may refer to an electronic component or interconnection line that generates electromagnetic interference with an intensity greater than a preset threshold. In some scenarios, the interference source may also refer to an electronic component or interconnection line that radiates a frequency less than another preset threshold.

[0044] In this technical solution, during the manufacturing process of the circuit board, a shielding structure with an electromagnetic shielding function is laid inside the circuit board, and the shielding structure is laid at the position corresponding to the interfering interconnection line and / or the interfering component. Due to the addition of the shielding structure, the intensity of electromagnetic interference generated by the circuit board manufactured using this technical solution to the outside world is reduced. In addition, compared with the solution of external shielding structure, the assembly process of assembling electronic equipment with the shielding structure built into the circuit board is simpler.

[0045] The thickness of the first dielectric layer and the thickness of the interconnection line refer to the size of the first dielectric layer in the thickness direction of the circuit board and the size of the interconnection line in the thickness direction of the circuit board respectively.

[0046] In some scenarios, the technical solution can also be understood as: when the outer side of the shielding structure is coated with non-magnetic non-conductive material, the shielding structure can be in direct contact with the interconnection line. When the outer side of the shielding structure is coated with magnetic material or the shielding structure only includes one layer of magnetic material, a first dielectric layer can be provided between the shielding structure and the interconnection line.

[0047] Relatively speaking, the outer side of the shielding structure is covered with non-magnetic non-conductive materials, the manufacturing process of the circuit board is relatively simple, and the thickness of the circuit board is thinner.

[0048] In combination with the second aspect, in some implementations of the second aspect, the shielding structure is divided into a plurality of sub-shielding structures according to the location of the interference source, and the locations of the plurality of sub-shielding structures correspond to the location of the interference source.

[0049] In a possible implementation, the plurality of sub-shielding structures may be obtained by processing the shielding structure through processes such as photolithography and development.

[0050] In the present technical solution, an entire shielding structure is processed into multiple dispersed sub-shielding structures, that is, the shielding structure is only set for the interference source on the circuit board, and the position where the shielding structure is not set can be used to set other structures, which is beneficial to improve the rationality of the arrangement of the shielding structure, interconnection lines and other structures in the circuit board, improve the utilization efficiency of the internal space of the circuit board, and help reduce the adverse effects of the shielding structure on other electronic components or interconnections on the circuit board.

[0051] In combination with the second aspect, in certain implementations of the second aspect, the method further includes: laying a second dielectric layer on the shielding structure, the second dielectric layer being composed of a non-magnetic, non-conductive material, and a thickness of the second dielectric layer being no greater than a thickness of the shielding structure.

[0052] Laying a second dielectric layer composed of non-magnetic and non-conductive materials on the side of the shielding material away from the first dielectric layer can reduce the probability of electromagnetic waves incident on the shielding structure penetrating the shielding structure to a certain extent, and is beneficial to improving the shielding effectiveness of the shielding structure for interference sources on the circuit board to a certain extent. The second dielectric layer can also protect the shielding structure to a certain extent and improve the structural stability of the shielding structure.

[0053] The thickness of the second dielectric layer and the thickness of the shielding structure refer to the size of the second dielectric layer in the thickness direction of the circuit board and the size of the shielding structure in the thickness direction of the circuit board respectively.

[0054] Relatively speaking, the outer side of the shielding structure is covered with non-magnetic non-conductive materials, the manufacturing process of the circuit board is relatively simple, and the thickness of the circuit board is thinner.

[0055] In combination with the second aspect, in certain implementations of the second aspect, the method further includes: opening a through hole on the first dielectric layer and the second dielectric layer, the through hole penetrating the first dielectric layer and the second dielectric layer, and one end of the through hole opening is located above the interconnect line; and electroplating a conductive material on an inner wall of the through hole.

[0056] Since both the first dielectric layer and the second dielectric layer are made of non-magnetic and non-conductive materials, providing conductive through holes on the dielectric layers is beneficial to achieving electrical connection between multiple electronic components on the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] Figure 1A It is a schematic diagram of an electronic device provided in an embodiment of the present application.

[0058] Figure 1B It is a schematic diagram of another electronic device provided in an embodiment of the present application.

[0059] Figure 2A This is a top view of a circuit board provided in an embodiment of the present application.

[0060] Figure 2B yes Figure 2A A cross-sectional view of a circuit board in Figure 1.

[0061] Figures 3 to 12 It is a schematic diagram of the structure of the circuit board provided in the embodiment of the present application.

[0062] Figures 13 to 15 It is a structural schematic diagram of the shielding structure provided in an embodiment of the present application.

[0063] FIG. 16A to FIG. 16G It is a flow chart of a method for manufacturing a circuit board provided in an embodiment of the present application.

[0064] 17A to 17H It is a flow chart of another method for manufacturing a circuit board provided in an embodiment of the present application. DETAILED DESCRIPTION

[0065] Embodiments of the present application are described in detail below, and examples of the embodiments of the present application are shown in the accompanying drawings. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0066] Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by persons having ordinary skills in the technical field to which this application belongs. In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to this application.

[0067] Before introducing the embodiments of the present application, some terms that may be used in the following content are first explained.

[0068] Interconnection line: refers to the signal transmission carrier between unit circuits, modules and multi-chip components in the chip system.

[0069] Electromagnetic interference (EMI) refers to any electromagnetic phenomenon that occurs when the conduction or electromagnetic field is accompanied by voltage or current and that may reduce the performance of a device, equipment or system, or may have adverse effects on biological or material output. In the electrical field, electromagnetic interference can refer to the interference effect on surrounding electronic equipment caused by electromagnetic waves generated by electromagnetic induction after the electrical product itself is powered on. In electromagnetic interference, the device or device that sends interference can be called the interference source, and the device or device affected by electromagnetic interference can be called the interfered body. The intensity of electromagnetic interference can be understood as the intensity of the electromagnetic wave signal or the intensity of radiation.

[0070] Shielding effectiveness refers to the ratio of the incident or emitted electromagnetic wave energy when there is no shielding material to the electromagnetic wave energy reflected or transmitted after being shielded by the shielding material at the same location.

[0071] Single-sided board is a printed circuit board with conductive patterns on one side of an insulating dielectric board. On a single-sided board, electronic components are concentrated on one side, and wires are concentrated on the other side.

[0072] Multilayer boards and insulating dielectric boards have conductive patterns on both sides. Since there are conductive patterns on both sides, metallized holes are generally used to connect the conductive patterns on both sides.

[0073] Figure 1AThe electronic device 100 provided by an embodiment of the present application is shown, and the electronic device 100 may include a circuit board 110 and a speaker 120. The circuit board 110 and the speaker 120 may be arranged adjacent to each other, and an electrical connection may be arranged between the circuit board 110 and the speaker 120. The circuit board 110 may include one or more interference sources, and the interference source may include an interconnection line 210 and an electronic component 230 mounted on the circuit board 110. The interconnection line 210 may be a power loop, etc., and the electronic component 230 may be an inductor component, etc. A voice coil 121 may be arranged in the speaker 120.

[0074] When the circuit board 110 is powered on, the interference source in the circuit board 110 may generate an electric field and / or a magnetic field, and the electric field and / or the magnetic field may propagate around the interference source. The speaker 120 disposed adjacent to the circuit board 110 is located on the path where the electric field and / or the magnetic field propagate outward, and the voice coil 121 in the speaker 120 may be regarded as a disturbed body. Under the interference of the electromagnetic field, the voice coil 121 may generate current sound (or howling), affecting the normal operation of the speaker 120 and the electronic device 100.

[0075] In some examples, such as Figure 1B As shown, in order to reduce the adverse effects of electromagnetic interference caused by the circuit board 110 on the speaker 120, a shielding structure 220 may be provided inside the circuit board 110. The shielding structure 220 may be provided on the path where the electromagnetic interference generated by the interference source on the circuit board 110 propagates to the voice coil 121, thereby being able to reduce the electromagnetic interference of the interference source on the voice coil 121 to a certain extent.

[0076] The circuit board including the shielding structure is referred to as the first circuit board 200 in the following example. The first circuit board 200 may be provided with a shielding structure inside. The shielding structure may be used to reduce the electromagnetic interference of the first circuit board 200 to the external environment, which is described in detail below.

[0077] In some examples, the first circuit board 200 may include a first surface and a second surface that are arranged opposite to each other, and one or more electronic components may be connected to the first circuit board 200, and the one or more electronic components may be arranged on the first surface of the first circuit board 200 or on the second surface of the first circuit board 200. When the first circuit board 200 is powered on, the one or more electronic components connected to the circuit board may operate.

[0078] The one or more electronic components mentioned above may include interference components and non-interference components. Interference components may refer to electronic components that can radiate electromagnetic fields outward after being powered on, and non-interference components may refer to electronic components that do not radiate electromagnetic fields outward after being powered on. In some scenarios, interference components may refer to electronic components that can generate electromagnetic interference beyond a threshold range, and non-interference components may refer to electronic components that can generate electromagnetic interference within a threshold range. Similar to the description of the one or more electronic components mentioned above, interference components and non-interference components may be arranged on the first side and / or the second side of the first circuit board 200.

[0079] In some examples, the interfering components may refer to electronic components having a radiation frequency less than 1 MHz. For example, the radiation frequency of the interfering components may be 1 kHz, 5 kHz, 50 kHz, 100 kHz, 150 kHz, 200 Hz to 200 kHz, 200 kHz to 500 kHz, or 500 kHz to 1 MHz.

[0080] In some examples, the aforementioned one or more electronic components may include one or more of the following: a resistor, a capacitor, an inductor, a diode, a transistor, or a field effect transistor, etc.

[0081] The first circuit board 200 may also include one or more electrical connection lines (or interconnection lines), which may be used to connect one or more electronic components on the first circuit board 200. The one or more interconnection lines may be arranged on a surface (e.g., the first surface or the second surface) of the first circuit board 200, or the one or more interconnection lines may also be arranged inside the first circuit board 200 (i.e., between the first surface and the second surface in the thickness direction of the first circuit board 200).

[0082] The interconnects on the first circuit board 200 may include interfering interconnects and non-interfering interconnects. An interfering interconnect may refer to an interconnect that can radiate an electromagnetic field after being powered on, and a non-interfering interconnect may refer to an interconnect that does not radiate an electric field or a magnetic field after being powered on. In some scenarios, an interfering interconnect may refer to an interconnect that can generate electromagnetic interference beyond a threshold range, and a non-interfering interconnect may refer to an interconnect that can generate electromagnetic interference within a threshold range.

[0083] In some examples, the interfering interconnect line may refer to an interconnect line having a radiation frequency less than 1 MHz, for example, the radiation frequency of the interfering interconnect line may be 1 kHz, 5 kHz, 50 kHz, 100 kHz, 150 kHz, 200 Hz to 200 kHz, 200 kHz to 500 kHz, or 500 kHz to 1 MHz.

[0084] A shielding structure may be provided in the first circuit board 200 , and the shielding structure may be used to block the electromagnetic field radiated outward by interfering components and / or interfering interconnecting lines on the circuit board 200 , so as to reduce electromagnetic interference of the circuit board 200 to the outside world.

[0085] Figure 2A , Figure 2B , Figures 3 to 12 Some schematic diagrams of the structure of the first circuit board 200 are provided as examples, wherein: Figure 2A and Figures 3 to 7 2 is a schematic diagram of observing the first circuit board 200 along the first direction. Figure 2B and Figures 8 to 12 Schematic diagram of observing the first circuit board 200 along the second direction. The first direction is a direction perpendicular to the plane where the first circuit board 200 is located, or is called the thickness direction of the first circuit board 200. The second direction is parallel to the plane where the first circuit board 200 is located. The first direction can be regarded as Figure 2B The Z-axis direction, the second direction can be regarded as Figure 2A in the Y direction.

[0086] For the convenience of explanation, the dimensions of the first circuit board 200 in the thickness direction are appropriately enlarged in the drawings.

[0087] It should be noted that since interfering components or interfering interconnects on a circuit board are the main factors that generate electromagnetic interference, while non-interfering components and non-interfering interconnects contribute less to the electromagnetic interference generated by the circuit board, the following examples are mainly based on the case where the circuit board contains interfering components or interfering interconnects.

[0088] Figure 2A In the embodiment, the first circuit board 200 includes an interconnection line 210 and a shielding structure 220, the number of the interconnection line 210 is one, and the shielding structure 220 is in the form of a film, a sheet or a block. The shielding structure 220 can be arranged close to the interconnection line 210. The projection of the interconnection line 210 in the plane where the first circuit board 200 is located can all fall within the area of ​​the projection of the shielding structure 220 in the plane where the first circuit board 200 is located. In other words, the projection of the interconnection line 210 in the plane where the first circuit board 200 is located falls within the first area, and the projection of the shielding structure 220 in the plane where the first circuit board 200 is located falls within the second area, the area of ​​the second area is not less than the area of ​​the first area, and the first area is not located outside the range (or boundary) of the second area.

[0089] A whole shielding structure is set inside the circuit board to reduce the electromagnetic interference generated by the interconnection line. Compared with the method of placing the shielding structure outside the circuit board, placing the shielding structure inside the circuit board is conducive to improving the integrity of the electronic equipment with electromagnetic shielding performance and improving the utilization rate of the internal space of the electronic equipment. Moreover, compared with the external shielding structure, the shielding structure is placed inside the circuit board, and its physical structure and electromagnetic shielding performance are more stable and reliable.

[0090] Figure 3 In the embodiment, the first circuit board 200 includes an interconnection line 210 and a plurality of shielding structures 220, the number of the interconnection line 210 is one, and the plurality of shielding structures 220 may be in the form of a film, a sheet, or a block. The positions and the number of the plurality of shielding structures 220 in the circuit board 200 may be determined according to the interconnection line 210. In some examples, the positions and the number of the plurality of shielding structures 220 may satisfy: the projection of the interconnection line 210 in the plane where the first circuit board 200 is located can fall within the range of the plurality of shielding structures 220. In other words, the projection of the interconnection line 210 in the plane where the first circuit board 200 is located includes a plurality of line segments, the plurality of line segments are in a plurality of discontinuous first regions, the projection of the plurality of shielding structures 220 in the plane where the first circuit board 200 is located is in a plurality of discontinuous second regions, and the plurality of first regions fall within the range of the plurality of second regions.

[0091] In some examples, the interconnection line 210 may include four lines connected end to end in sequence, the number of the shielding structures 220 may be four, and the projections of the four shielding structures 220 in the first direction are connected end to end.

[0092] Compared with setting a whole shielding structure inside the circuit board, this embodiment uses multiple shielding structures with smaller areas to achieve the electromagnetic shielding function of the whole shielding structure. Multiple shielding structures can be distributed in different planes, and the setting of the shielding structure in the circuit board can be more flexible, and the utilization efficiency of the shielding structure is higher. In addition, for thin-film shielding structures with smaller thickness, replacing a whole large shielding structure with multiple small shielding structures is also helpful to reduce the manufacturing difficulty of the shielding structure to a certain extent.

[0093] Figure 4In the embodiment, the first circuit board 200 may include a plurality of interconnecting lines 210 and a shielding structure 220, and the plurality of interconnecting lines 210 may be located in different planes, or in other words, the plurality of interconnecting lines 210 may be located at different positions in the thickness direction of the circuit board 200. In order to minimize the electromagnetic interference caused by the electromagnetic radiation of the plurality of interconnecting lines 210, in some examples, the position and area of ​​the shielding structure 220 in the first circuit board 200 may satisfy: the projection of the plurality of interconnecting lines 210 in the plane where the first circuit board 200 is located may fall within the range of the projection of the shielding structure 220 in the plane where the first circuit board 200 is located. In other words, the projection of the plurality of interconnecting lines 210 in the first direction includes a plurality of line segments, and the plurality of line segments are located in a plurality of discontinuous first regions, the projection of the shielding structure 220 in the plane where the first circuit board 200 is located falls within the second region, and the plurality of first regions fall within the range of the second region.

[0094] When a circuit board includes multiple interconnecting lines, a whole shielding structure is used to shield the electromagnetic interference generated by the multiple interconnecting lines. The technical solution provided by this embodiment is conducive to simplifying the manufacturing process of the circuit board and improving the production efficiency of the circuit board.

[0095] Figure 5 In the embodiment, the first circuit board 200 may include a plurality of interconnecting lines 210 and a plurality of shielding structures 220, and the plurality of interconnecting lines 210 may be located in different planes, or in other words, the positions of the plurality of interconnecting lines 210 in the first direction are different. The positions of the plurality of shielding structures 220 in the circuit board 200 and the number of the plurality of shielding structures 220 may be determined according to the plurality of interconnecting lines 210. In some examples, the positions and the number of the plurality of shielding structures 220 may satisfy the following requirement: the projections of the plurality of interconnecting lines 210 in the plane where the first circuit board 200 is located may fall within the range of the projections of the plurality of shielding structures 220 in the plane where the first circuit board 200 is located. In other words, the projections of the plurality of interconnecting lines 210 in the plane where the first circuit board 200 is located include a plurality of line segments, and the plurality of line segments are located in a plurality of discontinuous first regions, the projections of the plurality of shielding structures 220 in the plane where the first circuit board 200 is located are located in a plurality of discontinuous second regions, and the plurality of first regions do not exceed the range of the plurality of second regions.

[0096] In some examples, the first circuit board 200 includes a first interconnection line 211, a second interconnection line 212, and a third interconnection line 213. In order to improve the shielding effect of the shielding structure 220 on the plurality of interconnections, the first circuit board 200 may be provided with a first shielding structure 221, a second shielding structure 222, and a third shielding structure 223. The projection of the first interconnection line 211 in the plane where the first circuit board 200 is located may fall within the range of the projection of the first shielding structure 221 in the plane where the first circuit board 200 is located, the projection of the second interconnection line 212 in the plane where the first circuit board 200 is located may fall within the range of the second shielding structure 222 in the plane where the first circuit board 200 is located, and the projection of the third interconnection line 213 in the plane where the first circuit board 200 is located may fall within the range of the third shielding structure 223 in the plane where the first circuit board 200 is located.

[0097] Figure 5 In the embodiment, the first shielding structure 221, the second shielding structure 222 and the third shielding structure 223 can be arranged in different planes. In some examples, in order to reduce the complexity of the manufacturing process of the first circuit board 200, the first shielding structure 221, the second shielding structure 222 and the third shielding structure 223 can be arranged in the same plane, that is, at the same position in the first direction.

[0098] In some examples, the thickness, area, material composition and other properties of the first shielding structure 221, the second shielding structure 222 and the third shielding structure 223 can be the same, which is conducive to reducing the process complexity of the circuit board. In some examples, the thickness, area, material composition and other properties of the first shielding structure 221, the second shielding structure 222 and the third shielding structure 223 can be determined according to the intensity of the electromagnetic interference generated by the interconnection lines that need to be shielded, which is conducive to reducing the overall intensity of the electromagnetic interference generated by the circuit board.

[0099] In the case where a circuit board contains multiple interconnects, multiple shielding structures can be used to shield the electromagnetic interference generated by each interconnect, and the thickness, material and performance of different shielding structures can be set according to the interconnect lines to be shielded. Compared with the method of using an entire shielding structure to shield the electromagnetic interference of multiple interconnects, the circuit board provided in this embodiment is more conducive to reducing the total intensity of the electromagnetic interference generated by the circuit board and reducing the electromagnetic interference of the circuit board to the outside world.

[0100] When the interference source is an electronic component, or when one or more interfering components are connected to the first circuit board 200, a shielding structure 220 may also be provided in the first circuit board 200 to reduce the electromagnetic interference generated by the one or more interfering components.

[0101] Figure 6In the embodiment, a first circuit board 200 is connected to a plurality of interfering components 230 on the first surface, and a shielding structure 220 may be provided in the first circuit board 200. In some examples, the position and area of ​​the shielding structure 120 may satisfy that the projections of the plurality of interfering components 230 in the plane where the first circuit board 200 is located can all fall within the range of the projection of the shielding structure 220 in the plane where the first circuit board 200 is located. In other words, the projections of the plurality of interfering components 230 in the first direction include a plurality of discontinuous third regions, the projections of the plurality of shielding structures 220 in the plane where the first circuit board 200 is located fall within the second region, and the plurality of third regions do not exceed the range of the second region.

[0102] In some examples, the shielding structure 220 can be disposed close to the first surface, and the surface of the first circuit board 200 including the shielding structure 220 and provided with the interference component 230 can be disposed away from the speaker 120. Placing the shielding structure close to the interference source generating electromagnetic interference is conducive to better achieving the shielding effect of the shielding structure on electromagnetic interference.

[0103] A whole shielding structure is set inside the circuit board to reduce the electromagnetic interference generated by interfering components. Compared with the method of placing the shielding structure outside the circuit board, placing the shielding structure inside the circuit board is conducive to improving the integrity of electronic equipment with electromagnetic shielding performance and improving the utilization rate of the internal space of the electronic equipment. Moreover, compared with the external shielding structure, the shielding structure placed inside the circuit board has a more stable and reliable physical structure and electromagnetic shielding performance.

[0104] Figure 7 In the embodiment, a plurality of interference components 230 may be connected to the first surface of the first circuit board 200, and a plurality of shielding structures 220 may be provided in the first circuit board 200. The areas of the plurality of shielding structures 220 and the positions of the plurality of shielding structures 220 in the first circuit board 200 may be determined according to the positions of the plurality of interference components 230. In some examples, the areas of the plurality of shielding structures 220 and the positions of the plurality of shielding structures 220 in the first circuit board 200 may satisfy: the projections of the plurality of interference components 230 in the plane where the first circuit board 200 is located may all fall within the range of the projections of the plurality of shielding structures 220 in the plane where the first circuit board 200 is located. In other words, the projections of the plurality of interference components 230 in the plane where the first circuit board 200 is located include a plurality of discontinuous third regions, the projections of the plurality of shielding structures 220 in the plane where the first circuit board 200 is located include a plurality of second regions, and the plurality of third regions do not exceed the range of the plurality of second regions.

[0105] In some examples, a first interference component 231, a second interference component 232, and a third interference component 233 are connected to the first surface of the first circuit board 200, and a first shielding structure 221, a second shielding structure 222, and a third shielding structure 223 may be correspondingly provided in the first circuit board 200. The projection of the first interference component 231 in the plane where the first circuit board 200 is located may fall within the range of the projection of the first shielding structure 221 in the plane where the first circuit board 200 is located, the projection of the second interference component 232 in the plane where the first circuit board 200 is located may fall within the range of the projection of the second shielding structure 222 in the plane where the first circuit board 200 is located, and the projection of the third interference component 233 in the plane where the first circuit board 200 is located may fall within the range of the projection of the third shielding structure 223 in the plane where the first circuit board 200 is located.

[0106] Figure 7 In the embodiment, the first shielding structure 221, the second shielding structure 222 and the third shielding structure 223 can be arranged in different planes. In some examples, in order to reduce the complexity of the manufacturing process of the first circuit board 200, the first shielding structure 221, the second shielding structure 222 and the third shielding structure 223 can be arranged in the same plane, that is, at the same position in the first direction.

[0107] In some examples, the thickness, area, material composition and other properties of the first shielding structure 221, the second shielding structure 222 and the third shielding structure 223 can be the same, which is conducive to reducing the process complexity of the circuit board. In some examples, the thickness, area, material composition and other properties of the first shielding structure 221, the second shielding structure 222 and the third shielding structure 223 can be determined according to the intensity of the electromagnetic interference generated by the interconnection lines that need to be shielded, which is conducive to reducing the overall intensity of the electromagnetic interference generated by the circuit board.

[0108] In the case where a circuit board contains multiple interfering components, multiple shielding structures can be used to respectively shield the electromagnetic interference generated by each interfering component. The thickness, material and performance of different shielding structures can be set according to the interfering components to be shielded. Compared with the method of using an entire shielding structure to shield the electromagnetic interference of multiple interfering components, the circuit board provided in this embodiment is more conducive to reducing the total intensity of the electromagnetic interference generated by the circuit board and reducing the electromagnetic interference of the circuit board to the outside world.

[0109] Similar to the case in which only electronic components or interconnections are arranged on the first circuit board 200 in the previous text, when the circuit board 200 includes both interference devices and interference interconnections, the electromagnetic interference generated by the first circuit board 200 can be reduced to a certain extent by arranging a shielding structure 220 in the first circuit board 200.

[0110] Figure 8 In the embodiment, the first circuit board 200 includes only one shielding structure 220, and the shielding structure 220 can be used to simultaneously shield the electromagnetic field generated by multiple interference components (first interference component 231, second interference component 232 and third interference component 233) and multiple interference interconnects (first interference interconnect 211 and second interference interconnect 212). Similarly, the position and area of ​​the shielding structure 220 can satisfy: the projections of the interference components and the interference interconnects in the plane where the first circuit board 200 is located can fall within the range of the shielding structure. In other words, the projections of the multiple interference components in the plane where the first circuit board 200 is located fall into multiple discontinuous third areas, the projections of the multiple interference interconnects in the plane where the first circuit board 200 is located include multiple line segments, and the multiple line segments fall into multiple discontinuous first areas, the projection of the shielding structure 220 in the plane where the first circuit board 200 is located falls into the second area, and the multiple first areas and the multiple third areas do not exceed the range of the second area.

[0111] Fig. 9 In the embodiment, the first circuit board 200 may include a plurality of interconnects, a plurality of shielding structures, and a plurality of interfering components. Each of the plurality of shielding structures may be used to shield the electromagnetic interference generated by the interfering components and / or the interfering interconnects on the first circuit board 200. The area and position of each of the plurality of shielding structures may be determined according to the interfering components and / or the interfering interconnects on the first circuit board 200. In some examples, the area and position of each of the plurality of shielding structures may satisfy: the projection of the interfering components and the interfering interconnects arranged on the first circuit board 200 in the plane where the first circuit board 200 is located may fall within the range of the projection of the plurality of shielding structures in the plane where the first circuit board 200 is located. In other words, the projection of the plurality of interfering components in the plane where the first circuit board 200 is located falls into a plurality of discontinuous third regions, the projection of the plurality of interfering interconnects in the plane where the first circuit board 200 is located falls into a plurality of discontinuous first regions, the projection of the plurality of shielding structures in the plane where the first circuit board 200 is located includes a plurality of second regions, and the plurality of first regions and the plurality of third regions do not exceed the range of the region composed of the plurality of second regions.

[0112] In some examples, the first interference component 231, the second interference component 232, and the third interference component 233 are connected to the first surface of the first circuit board 200, the first interference interconnection line 211 and the second interference interconnection line 212 are arranged inside the first circuit board 200, and the first shielding structure 221 and the second shielding structure 222 are also arranged inside the first circuit board 200. The projections of the first interference component 231, the second interference component 232, and the first interference interconnection line 211 in the plane where the first circuit board 200 is located can fall within the range of the projection of the first shielding structure 221 in the plane where the first circuit board 200 is located. The projections of the third interference component 233 and the second interference interconnection line 212 in the plane where the first circuit board 200 is located can fall within the range of the projection of the second shielding structure 222 in the plane where the first circuit board 200 is located.

[0113] In some examples, in order to reduce the process complexity of circuit board manufacturing, multiple shielding structures can be located on the same plane. In some examples, in order to provide a shielding effect of the shielding structure and improve the space utilization rate in the circuit board, multiple shielding structures can be located on different planes.

[0114] The above only illustrates the arrangement of the shielding structure inside the circuit board by taking the arrangement of electronic components on one side of the circuit board as an example. For the case where interfering components are connected to both relatively arranged sides of the circuit board, or the case where there are multiple interfering interconnection lines distributed in the thickness direction of the circuit board, it is possible to consider arranging the shielding structure inside the circuit board close to the side containing more interfering components or more interfering lines.

[0115] In some examples, the shielding structure 220 in the first circuit board 200 can be arranged close to a side that can generate a stronger electromagnetic interference. For example, three electronic components are connected to the first side and the second side of the first circuit board 200. The electromagnetic interference generated by the electronic components on the first side is relatively stronger, and the electromagnetic interference generated by the electronic components on the second side is relatively weaker. In this case, the shielding structure can be arranged close to the first side. In the opposite case, the shielding structure can be arranged close to the second side.

[0116] Fig.10Among them, M interference components (interference component 230-11, interference component 230-12... interference component 230-1M) are connected to the first surface of the first circuit board 200, and N interference components (interference component 230-21, interference component 230-22... interference component 230-2N) are connected to the second surface of the second circuit board 200. If the intensities of the electromagnetic interference generated by these interference components alone are the same, when M≥N, the shielding structure 220 of the first circuit board 200 can be arranged close to the first surface. When M<N, the shielding structure 220 of the first circuit board 200 can be arranged close to the second surface. Here, both M and N are integers greater than or equal to 1. For example, M is 3 and N is 1.

[0117] Fig.11 Among them, a first type of interference component 230A is connected to the first surface of the first circuit board 200, and a second type of interference component 230B is connected to the second surface of the first circuit board 200. Among them, the intensity of the electromagnetic interference that the first type of interference component 230A can cause is S, and the intensity of the electromagnetic interference that the second type of interference component 230B can cause is T. When S≥T, the shielding structure 220 of the first circuit board 200 can be arranged close to the first surface. When S<T, the shielding structure 220 of the first circuit board 200 can be arranged close to the second surface.

[0118] Similarly, when there are multiple interference interconnecting lines inside the first circuit board 200 that are not in the same plane, the arrangement method of the shielding structure 220 inside the first circuit board 200 can also be determined according to the intensity of the electromagnetic interference generated by the interference interconnecting lines.

[0119] Take Fig.12 the first circuit board 200 in [description] as an example. There are multiple interference interconnecting lines inside the first circuit board 200. These multiple interference interconnecting lines are located at different positions in the first direction. Or rather, the planes where these multiple interference interconnecting lines are located are located at different positions in the first direction. Or rather, these multiple interference interconnecting lines are in different planes.

[0120] In some examples, the multiple interference interconnecting lines are non-uniformly distributed in the first direction. For example, Fig.12In the cross section of the first circuit board 200 in the thickness direction shown, the two sides of the AA plane can be respectively referred to as the first side and the second side. On the first side of the AA plane, the number of interfering interconnects per unit thickness is P. On the second side of the AA plane, the number of interfering interconnects per unit thickness is Q. If the intensity of electromagnetic interference that can be generated by all interfering interconnects is the same, in the case of P≥Q, the shielding structure 220 in the first circuit board 200 can be arranged close to the first side of the AA plane, and in the case of P<Q, the shielding structure 220 in the first circuit board 200 can be arranged close to the second side of the AA plane.

[0121] In some examples, the intensity of electromagnetic interference caused by the interfering interconnection line on the second side of the AA plane in the first circuit board 200 is greater than the intensity of electromagnetic interference caused by the interfering interconnection line on the first side of the AA plane. In this case, the shielding structure can be set on the second side of the AA plane. If the intensity of electromagnetic interference caused by the interfering interconnection line on the first side of the AA plane is greater than the intensity of electromagnetic interference caused by the interfering interconnection line on the second side of the AA plane, the shielding structure can be set on the first side of the AA plane.

[0122] The shielding structure is placed close to the interference source with greater interference intensity, and the interfered body is placed on the side of the shielding structure away from the interference source when the electronic device is assembled. The circuit board provided in this technical solution is conducive to reducing the electromagnetic interference of the circuit board to the outside world. In addition, since the interfered body is a speaker as an example, the magnetic field generated by the magnet inside it will also have an adverse effect on the performance of the shielding structure to a certain extent. Placing the shielding structure close to the interference source on the circuit board, or in other words, placing the shielding structure away from the interfered body, is conducive to reducing the impact of the interfered body on the performance of the shielding structure and improving the stability of the performance of the shielding structure.

[0123] It should be noted that, in actual use, in order to improve the shielding effect of the shielding structure in the first circuit board 200, the side of the first circuit board 200 containing the interference source with high interference intensity can be set away from (or facing away from) the disturbed body, and the side of the first circuit board 200 containing the interference source with low interference intensity can be set close to (or facing) the disturbed body. In this way, the shielding structure in the first circuit board 200 can be between the interference source with high interference intensity and the disturbed body, and the shielding structure can better shield the electromagnetic interference of the interference source with high interference intensity to the disturbed body.

[0124] In order to reduce the electromagnetic interference of the first circuit board 200 to the outside world, it is possible to consider reducing the proportion of electromagnetic waves radiated outward from the first circuit board 200 passing through the shielding structure 220. In other words, it is possible to consider increasing the proportion of electromagnetic waves incident on the surface of the shielding structure 220 that are reflected and the proportion of electromagnetic waves incident on the inside of the shielding structure 220 that are absorbed.

[0125] Fig.13 Shown is a schematic structural diagram of a shielding structure 220 provided in an embodiment of the present application.

[0126] The shielding structure 220 includes a layer of magnetic material, which may include one or more of iron (Fe), cobalt (Co), and nickel (Ni). In some examples, the magnetic material may be in the form of a film, a sheet, or a block. Exemplarily, the magnetic material may be a film-like structure with a magnetic permeability greater than 20.

[0127] Here, the film, sheet or block can be understood as the state of the magnetic material when the magnetic material is set inside the circuit board, or it can also be understood as the state of the magnetic material itself. In other words, in the manufacturing process of the circuit board, the magnetic material in different states such as semi-solid, powdery, etc. can be laid or pressed inside the circuit board to form a film, sheet or block shielding structure.

[0128] A shielding structure 220 comprising only one layer of magnetic material may, when laid in a circuit board, be provided with a non-magnetic, non-conductive material between the magnetic material and the interfering interconnects or interfering components, thereby improving the shielding capability of the shielding structure 220 against the electromagnetic fields of the interfering interconnects and / or interfering components on the circuit board.

[0129] Fig.14 Shown is a schematic structural diagram of another shielding structure 220 provided in an embodiment of the present application.

[0130] The shielding structure 220 may be a composite layered structure, the outer side of the shielding structure 220 is coated with a non-magnetic non-conductor material layer, and the shielding structure includes at least one magnetic material layer. The magnetic material may contain one or more of iron, cobalt, and nickel, or in other words, the relative magnetic permeability of the magnetic material is greater than or equal to a first preset threshold. The magnetic material may be in the form of a film, a sheet, or a block.

[0131] Compared with a shielding structure composed of a single layer of magnetic material, a composite layered shielding structure can include more layers of magnetic material. More magnetic materials can increase the loss of the electromagnetic field incident on the inside of the shielding material, and improve the shielding effect of the shielding structure against electromagnetic interference. The outer side of the composite layered shielding structure is coated with non-magnetic non-conductor material, which can be used to support magnetic materials to a certain extent. Especially for thin film magnetic materials, the arrangement of non-magnetic non-conductor material on the outer side of the shielding structure is beneficial to improving the structural stability of the shielding structure and improving the yield rate of circuit board manufacturing. In addition, since the relative magnetic permeability of non-magnetic non-conductor material is low, the non-magnetic non-conductor material on the outside can reduce the probability of the electromagnetic field incident on the shielding structure penetrating the shielding structure, further improving the shielding effectiveness of the shielding structure.

[0132] Exemplarily, the magnetic material may be a film-like structure with a relative magnetic permeability greater than 20.

[0133] The non-magnetic non-conductor material may not contain any of the iron element, the cobalt element and the nickel element, or in other words, the relative magnetic permeability of the non-magnetic non-conductor material is less than the second preset threshold value, and the electrical conductivity of the non-magnetic non-conductor is less than the third preset threshold value. In some examples, the non-magnetic non-conductor material may contain oxygen element and / or carbon element. The non-magnetic non-conductor material may be in the form of a film, a sheet or a block.

[0134] For example, the non-magnetic non-conductor material may have a relative magnetic permeability of less than 20 and an electrical conductivity of less than 10. -12 S / m thin film structure.

[0135] As an example but not limitation, the shielding structure 220 may include a first magnetic material layer 321, a first non-magnetic non-conductor material layer 311, and a second non-magnetic non-conductor layer 312. The first magnetic material layer 321 is located between the first non-magnetic non-conductor material layer 311 and the second non-magnetic non-conductor layer 312. In other words, the first magnetic material layer 321 is coated with the first non-magnetic non-conductor layer 311 and the second non-magnetic non-conductor layer 312 on the outside.

[0136] In some examples, the shielding structure 220 may also include more layers of magnetic material layers and more layers of non-magnetic non-conductor material layers, and the number of layers of the multiple magnetic material layers and the number of layers of the multiple non-magnetic non-conductor material layers may meet, the magnetic material layers and the non-magnetic material layers may be arranged alternately, and the outer side of the shielding structure 220 is a non-magnetic non-conductor material. Exemplarily, the number of layers of the multiple magnetic material layers and the number of layers of the multiple non-magnetic non-conductor material layers may be: 2 layers and 3 layers, 5 layers and 6 layers, n layers and (n+1) layers, where n is a positive integer.

[0137] Fig.15 FIG. 2 is a schematic structural diagram of another shielding structure 220 provided in an embodiment of the present application.

[0138] The shielding structure 220 may be a composite layered structure including at least one non-magnetic non-conductor material layer and at least two magnetic material layers. The outer side of the shielding structure 220 is coated with a magnetic material. The non-magnetic non-conductor material may not contain any of the iron element, the cobalt element, and the nickel element. In other words, the relative magnetic permeability of the non-magnetic non-conductor material is less than the second preset threshold value, and the electrical conductivity of the non-magnetic non-conductor is less than the third preset threshold value. In some examples, the non-magnetic non-conductor material may contain oxygen and / or carbon. The non-magnetic non-conductor material may be in the form of a film, a sheet, or a block.

[0139] Compared with a shielding structure composed of a single layer of magnetic material, a composite layered shielding structure may include more layers of magnetic material. More magnetic material can increase the loss of the electromagnetic field incident on the inside of the shielding material and improve the shielding effect of the shielding structure against electromagnetic interference.

[0140] The outer side of the composite layered shielding structure is coated with magnetic material. During the manufacturing process of the circuit board, the non-magnetic non-conductive material in the circuit board can be used to coat the outer side of the shielding structure. In this technical solution, the shielding structure can contain more layers of magnetic material per unit thickness, which is beneficial to improve the shielding effectiveness of the shielding structure. For shielding structures with the same shielding effectiveness, the manufacturing process of the shielding structure provided by this embodiment is simpler.

[0141] For example, the non-magnetic non-conductor material may have a relative magnetic permeability of less than 20 and an electrical conductivity of less than 10. -12 S / m thin film structure.

[0142] The magnetic material may contain one or more of iron, cobalt and nickel, or the relative magnetic permeability of the magnetic material is greater than or equal to the first preset threshold. The magnetic material may be in the form of a film, a sheet or a block.

[0143] Exemplarily, the magnetic material may be a film-like structure with a relative magnetic permeability greater than 20.

[0144] As an example but not limitation, the shielding structure 220 may include a second magnetic material layer 322, a third magnetic material layer 323, a fourth magnetic material layer 324, a third non-magnetic non-conductor material layer 313, and a fourth non-magnetic non-conductor material layer 314. The magnetic material layer and the non-magnetic non-conductor material layer are arranged alternately in sequence. In other words, the outermost layer of the magnetic material located in the shielding structure 220 may be a magnetic material layer.

[0145] In some examples, the shielding structure 220 may also include more layers of magnetic material layers and more layers of non-magnetic non-conductor material layers, and the number of layers of the multiple magnetic material layers and the number of layers of the multiple non-magnetic non-conductor material layers should satisfy that the magnetic material layers and the non-magnetic material layers are arranged alternately, and the outer side of the shielding structure 220 is a magnetic material. Exemplarily, the number of layers of the multiple magnetic material layers and the number of layers of the multiple non-magnetic non-conductor material layers may be: 5 layers and 4 layers, 8 layers and 7 layers, (m+1) layers and m layers, where m is a positive integer.

[0146] For a structure in which the outermost layer of the shielding structure 220 is a magnetic material, in order to improve the shielding effect of the shielding structure on the electromagnetic field caused by the circuit board, it can be considered to set a non-magnetic non-conductive layer between the interfering interconnection line / interfering component and the shielding structure 220.

[0147] It should be noted that the present application does not limit the thickness of the magnetic material layer contained in the shielding structure, the thickness of the non-magnetic non-conductor material layer, the relationship between the thickness of the magnetic material layer and the thickness of the non-magnetic non-conductor material layer, the relationship between the thickness of different magnetic material layers in the multi-layer magnetic material layer, and the relationship between the thickness of different non-magnetic non-conductor material layers in the multi-layer non-magnetic non-conductor material layer.

[0148] The higher the magnetic permeability of the magnetic material in the shielding structure 220, the better the shielding effectiveness of the shielding structure 220 against the electromagnetic field emitted by the first circuit board 200. -7 H / m) is a unit of 1. In some examples, a magnetic material with a relative magnetic permeability greater than or equal to 20 can be used in the shielding structure 220. For example, a magnetic material with a relative magnetic permeability of 20 to 100, 100 to 10000, and greater than 10000. For example, the magnetic material can be an iron alloy with a relative magnetic permeability of about 500, or the magnetic material can also be an iron-nickel alloy with a relative magnetic permeability greater than 10000.

[0149] Increasing the thickness of the magnetic material can, to a certain extent, improve the shielding effectiveness of the shielding structure 220 against the electromagnetic field emitted by the first circuit board 200. In some examples, the thickness of the magnetic material in the shielding structure 220 can be 1 to 100 microns (eg, 10 microns, 20 microns, 50 microns, etc.).

[0150] like FIG. 16A to FIG. 16G The present invention shows a method for manufacturing a first circuit board 200 provided in an embodiment of the present application. In the process of manufacturing the first circuit board 200, the shielding structure 220 provided in the above embodiment is buried inside the first circuit board 200, so as to reduce the electromagnetic interference of the first circuit board 200 to the outside by using the shielding structure 220. The shielding structure 220 may include only one layer of magnetic material, or the outer side of the shielding structure 220 may be covered with magnetic material.

[0151] S1001, laying a conductive layer on the insulating dielectric board.

[0152] like Fig.16A As shown, a conductive layer 420 is laid on an insulating dielectric board 410. In some scenarios, the insulating dielectric board 410 on which the conductive layer 420 is laid may be referred to as a core layer, a core board, a substrate, or a copper clad board.

[0153] In some examples, the insulating dielectric board 410 may be made of a non-conductive material, or the insulating dielectric board 410 has a weak conductivity. For example, the insulating dielectric board 410 may be a fiberglass board, a cardboard, a plastic (such as polyimide, polytetrafluoroethylene, etc.) board, etc.

[0154] The conductive layer 420 laid on the insulating dielectric board 410 can be used to make interconnects connecting various components on the first circuit board 200. The conductive layer 420 can be made of a material with good conductivity. In some examples, the conductive layer 420 can be a metal (such as copper, indium tin oxide, etc.) foil.

[0155] For example, a fiberglass board is used as the insulating medium board 410, and copper foil is laid on one or both of the two opposite sides of the fiberglass board to form one or two conductive layers. In some scenarios, a fiberglass board with copper foil laid on one side may be called a single-sided copper-clad laminate, and a fiberglass board with copper foil laid on both sides may be called a double-sided copper-clad laminate.

[0156] In this embodiment, a single-sided copper clad laminate is used as an example to illustrate the method for manufacturing the first circuit board 200. The process of manufacturing the first circuit board 200 using a double-sided copper clad laminate can be performed as a reference.

[0157] S1002, processing the conductive layer to form interconnection lines.

[0158] For example, Fig. 16B As shown, the processed conductive layer 420 can form a first interconnection line 421 and a second interconnection line 422, and the side wall of the first interconnection line 421 and the insulating dielectric plate 410, and the side wall of the second interconnection line 422 and the insulating dielectric plate 410 can be regarded as forming a groove or channel structure, which can be used to fill the dielectric layer.

[0159] Here, the first interconnection line 421 can be an interfering interconnection line or a non-interfering interconnection line, and similarly, the second interconnection line 422 can be an interfering interconnection line or a non-interfering interconnection line. For the non-interfering interconnection line, the electromagnetic interference intensity generated by it is small, and its contribution to the electromagnetic interference generated by the circuit board 200 can be ignored. In this embodiment, the first interconnection line 421 and the second interconnection line 422 are both interfering interconnections for illustration.

[0160] In some examples, the designed conductive circuits can be transferred to the conductive layer 420 through photolithography and development, and the conductive materials other than the conductive circuits on the conductive layer 420 can be removed through processes such as tinning and etching, that is, only the interconnection lines are retained.

[0161] For example, a layer of film material can be laid on the conductive layer 420, a negative film containing a designed conductive circuit pattern can be attached to the film material, and the designed conductive circuit pattern can be transferred to the film material by exposing the film material with ultraviolet light. The conductive layer 420 is treated with chemical reagents to sequentially remove the film material and the conductive material in the non-conductive circuit area, thereby obtaining a conductive layer 420 with conductive material only arranged on the conductive circuit, that is, the interconnection line.

[0162] S1003, laying a first dielectric layer on the conductive circuit.

[0163] In order to allow the conductive lines to be connected as designed and to avoid short circuits between different interconnected lines, a dielectric layer with weaker conductivity needs to be laid on the conductive layer 420 .

[0164] In some examples, the dielectric layer with weaker conductivity can be referred to as the first dielectric layer 430. The first dielectric layer 430 can be composed of a non-magnetic non-conductive material. In some examples, the first dielectric layer 430 can be a glass fiber cloth impregnated with epoxy resin, in which case the first dielectric layer can also be referred to as a prepreg (PP) layer.

[0165] In some examples, the top of the first dielectric layer 430 may be higher than the top of the conductive layer 420 by a certain height, and the top of the first dielectric layer 430 forms a plane. Fig. 16C A first dielectric layer 430 is shown.

[0166] S1004, laying a shielding structure on the first dielectric layer.

[0167] In this embodiment, the shielding structure 220 may include only one magnetic material layer (eg Fig.13 Alternatively, the shielding structure 220 may also be a composite layered structure with a magnetic material coated on the outside (such as Fig.15 shown).

[0168] In some examples, the shielding structure 220 may be in a film, sheet, or block shape, and the shielding structure 220 may be pressed onto the first dielectric layer 430 through a pressing process.

[0169] For example, Fig.16D As shown, in S1003, the top of the first dielectric layer 430 is higher than the top of the conductive layer 420, and the shielding structure 220 can be laid on the plane formed on the top of the first dielectric layer 430. In this case, the first dielectric layer 430 can be regarded as a non-magnetic non-conductive material wrapped outside the shielding structure 220. In other words, when the shielding structure 220 only includes one layer of magnetic material, or when the outermost side of the shielding structure 220 is a magnetic material, the provision of the first dielectric layer 430 can improve the shielding effect of the shielding structure 220 on the electromagnetic interference generated by the first circuit board 200 to a certain extent, and improve the electromagnetic shielding effect of the shielding structure 220.

[0170] S1005, processing the shielding structure to form a plurality of sub-shielding structures.

[0171] Optionally, for a circuit board with a smaller area, the shielding structure of S1004 can be processed by photolithography, development and other process methods to form multiple sub-shielding structures. The positions, areas, etc. of the multiple sub-shielding structures can be determined according to the positions of the interfering components or interfering interconnects in the circuit board. Specifically, reference can be made to the relevant description in the above embodiments.

[0172] In some examples, during the processing of the shielding structure, it is also possible to consider reserving the positions of one or more through holes on the first circuit board 200 .

[0173] S1006, laying a second dielectric layer on the shielding structure.

[0174] like Fig.16E As shown, a second dielectric layer 450 may be laid on the surface of the shielding structure 220. The second dielectric layer 450 may be composed of a non-magnetic non-conductive material. In some examples, the second dielectric layer 450 may be a glass fiber cloth impregnated with epoxy resin, and the second dielectric layer may also be called a PP layer.

[0175] Since the outermost side of the shielding structure 220 is a magnetic material, similar to the aforementioned first dielectric layer 430 , the second dielectric layer 450 can be a non-magnetic non-conductive material coated outside the magnetic material. The second dielectric layer 450 is helpful to improve the shielding effect of the shielding structure 220 .

[0176] In some examples, the top of the second dielectric layer 450 may be higher than the top of the shielding structure 220 by a certain height. In other words, the second dielectric layer 450 may cover the top surface of the shielding structure 220 .

[0177] S1007, process the via holes and electroplate the inner walls of the via holes.

[0178] In order to conduct electricity between the interconnection lines (such as the first interconnection line 421 or the second interconnection line 422) in the inner layer and the electronic components in the outer layer, vias can be opened in the first dielectric layer 430 and the second dielectric layer 450 and conductive materials can be electroplated on the inner walls of the vias, so that electrical conduction can be achieved between the electronic components and the interconnection lines through the conductive materials on the inner walls of the vias.

[0179] For example, Fig.16F As shown, one end of the first through hole 460 contacts the first interconnection line 421, and the other end of the first through hole 460 is opened on the second dielectric layer 450. The inner wall of the first through hole 460 is electroplated with a conductive material so that the inner wall of the first through hole 460 can be electrically connected to the two ends of the first through hole 460, that is, as shown in FIG. Figure 16G A first conductive via 470 is shown.

[0180] In some examples, a multi-layer interconnection line and a multi-layer shielding structure may be provided in the thickness direction of the first circuit board 200. The provision of the multi-layer interconnection line and the multi-layer shielding structure may be achieved by repeating part or all of the operations in S1001 to S1006 based on S1007, which will not be repeated here for the sake of brevity.

[0181] In the manufacturing method of the circuit board provided in this embodiment, the non-magnetic non-conductor material in the shielding structure can be replaced by the non-magnetic non-conductor dielectric layer in the circuit board, which is helpful to simplify the manufacturing process of the shielding structure.

[0182] like 17A to 17H Another method for manufacturing a first circuit board 200 provided in an embodiment of the present application is shown. In the process of manufacturing the first circuit board 200, the shielding structure 220 provided in the above embodiment is buried inside the first circuit board 200, so as to reduce the electromagnetic interference of the first circuit board 200 to the outside by using the shielding structure 220. The outer side of the shielding structure 220 can be covered with a non-magnetic non-conductive material.

[0183] S1101, laying a conductive layer on the insulating dielectric board.

[0184] like Fig.17A As shown, a conductive layer 520 is laid on the insulating dielectric plate 510. In some scenarios, the insulating dielectric plate 510 on which the conductive layer 520 is laid may be referred to as a core layer.

[0185] In some examples, the insulating dielectric board 510 may be made of a non-conductive material, or the insulating dielectric board 510 has a weak conductivity. For example, the insulating dielectric board 510 may be a fiberglass board, a cardboard, a plastic (such as polyimide, polytetrafluoroethylene, etc.) board, etc.

[0186] The conductive layer 520 laid on the insulating dielectric board 510 can be used to make a circuit connecting various components on the first circuit board 200. The conductive layer 520 can be made of a material with good conductivity. In some examples, the conductive layer can be a metal (such as copper, indium tin oxide, etc.) foil.

[0187] For example, a fiberglass board is used as the insulating medium board 510, and copper foil is laid on one or both of the two opposite sides of the fiberglass board to form one or two conductive layers. In some scenarios, a fiberglass board with copper foil laid on one side may be called a single-sided copper-clad laminate, and a fiberglass board with copper foil laid on both sides may be called a double-sided copper-clad laminate.

[0188] In this embodiment, a single-sided copper clad laminate is used as an example to illustrate the method for manufacturing the first circuit board 200. The process of manufacturing the first circuit board 200 using a double-sided copper clad laminate can be performed as a reference.

[0189] S1102, processing the conductive layer to form interconnection lines.

[0190] For example, Fig. 17B As shown, the processed conductive layer 520 can form a third interconnect 521 and a fourth conductive line 522, and the side wall of the third interconnect line 521 and the insulating dielectric plate 510, and the side wall of the fourth interconnect line 522 and the insulating dielectric plate 510 can be regarded as forming a groove or channel structure, which can be used to fill the dielectric layer.

[0191] Here, the third interconnection line 521 can be an interfering interconnection line or a non-interfering interconnection line, and similarly, the fourth interconnection line 522 can be an interfering interconnection line or a non-interfering interconnection line. For the non-interfering interconnection line, the electromagnetic interference intensity generated by it is small, and its contribution to the electromagnetic interference generated by the circuit board 200 can be ignored. In this embodiment, the third interconnection line 521 and the fourth interconnection line 522 are both interfering interconnections.

[0192] In some examples, the designed conductive circuit can be transferred to the conductive layer 520 through photolithography and development, and the conductive materials other than the conductive circuit on the conductive layer 520 can be removed through processes such as tinning and etching, that is, only the conductive circuit is retained.

[0193] For example, a layer of film material can be laid on the conductive layer 520, a negative film containing a designed conductive circuit pattern can be attached to the film material, and the designed conductive circuit pattern can be transferred to the film material by exposing the film material with ultraviolet light. The conductive layer 520 is treated with chemical reagents to sequentially remove the film material and the conductive material in the non-conductive circuit area, thereby obtaining a conductive layer 520 with conductive material only on the conductive circuit, that is, the interconnection line.

[0194] S1103, laying a third dielectric layer on the conductive circuit.

[0195] In order to allow the conductive lines to be connected as designed and to avoid short circuits between different interconnected lines, a dielectric layer with weaker conductivity needs to be laid on the conductive layer 520 .

[0196] In some examples, the dielectric layer with weaker conductivity can be called the third dielectric layer 530. The third dielectric layer 530 can be composed of non-magnetic, non-conductive materials. In some examples, the third dielectric layer 530 can be glass fiber cloth impregnated with epoxy resin, in which case the third dielectric layer can also be called a prepreg layer.

[0197] In some examples, the top of the third dielectric layer 530 may be flush with the top of the conductive layer 520, and the top of the third dielectric layer 530 and the top of the conductive layer 520 are connected to form a plane. Fig. 17C shown.

[0198] In some examples, the top of the third dielectric layer 530 may be higher than the top of the conductive layer 520 by a certain height, and the top of the third dielectric layer 530 forms a plane, similar to Fig.16A A first dielectric layer 430 is shown.

[0199] S1104, laying a shielding structure on the third dielectric layer.

[0200] In this embodiment, the shielding structure 220 is a composite layered structure (such as Fig.14 shown).

[0201] In some examples, the shielding structure 220 may be in a film or sheet shape, and the shielding structure 220 may be pressed onto the third dielectric layer 530 through a pressing process.

[0202] For example, Fig.17D As shown, the shielding structure 220 can be laid on a plane formed by the top of the third dielectric layer 530 and the top of the conductive layer 520. In other words, the shielding structure 220 can be attached to the surface of the interconnection line, or the shielding structure 220 and the interconnection line can be in direct contact.

[0203] In the case where the top of the third dielectric layer 530 is higher than the conductive layer 520, the setting method of the shielding structure 220 is similar to the embodiment shown in FIG. 16 , and the specific method can be referred to Fig.16D For the sake of brevity, the relevant description is not repeated here.

[0204] S1105, processing the shielding structure to obtain a plurality of sub-shielding structures.

[0205] Optionally, for a circuit board with a smaller area, the shielding structure 220 of S1104 can be processed by photolithography, development and other process methods to form multiple sub-shielding structures. The positions, areas, etc. of the multiple sub-shielding structures can be determined according to the positions of the interfering components or interfering interconnects in the circuit board. Specifically, reference can be made to the relevant description in the above embodiments.

[0206] For example, Fig.17E As shown, the shielding structure 220 may be processed into a first sub-shielding structure 220A and a second sub-shielding structure 220B, and the first sub-shielding structure 220A and the second sub-shielding structure 220B are not connected to each other.

[0207] The space between the sidewall of the first sub-shielding structure 220A and the third dielectric layer 530 and the space between the sidewall of the second sub-shielding structure 220B and the third dielectric layer 530 can be considered as grooves or trenches, which can be used to accommodate and lay the fourth dielectric layer.

[0208] In some examples, during the processing of the shielding structure, it is also possible to consider reserving the positions of one or more through holes on the first circuit board 200 .

[0209] S1106, laying a fourth dielectric layer on the shielding structure.

[0210] like Fig.17F As shown, a fourth dielectric layer 550 may be laid on the surface of the shielding structure 220. The fourth dielectric layer 550 may be composed of non-magnetic, non-conductive materials. In some examples, the fourth dielectric layer 550 may be glass fiber cloth impregnated with epoxy resin, and the fourth dielectric layer 550 may also be called a PP layer.

[0211] In this embodiment, the outer side of the shielding structure 220 is covered with a non-magnetic non-conductive material. In some examples, the top of the fourth dielectric layer 550 may be flush with the top of the shielding structure 220 (eg, Fig.17F In other words, the fourth dielectric layer 550 can be used to fill the gaps formed between the plurality of shielding structures 220 after processing. In some examples, the top of the fourth dielectric layer 550 can be higher than the shielding structure 220 by a certain height (similar to Fig.16E ).

[0212] S1107, process the via holes and electroplate the inner walls of the via holes.

[0213] In order to conduct electricity between the interconnection lines (such as the third interconnection line 521 or the fourth interconnection line 522) in the inner layer and the electronic components in the outer layer, via holes can be opened in the third dielectric layer 530 and the fourth dielectric layer 550 and conductive materials can be electroplated on the inner walls of the via holes, so that electrical conduction can be achieved between the electronic components and the interconnection lines through the conductive materials on the inner walls of the via holes.

[0214] For example, Figure 17G As shown, one end of the second through hole 560 contacts the third interconnection line 521, and the other end of the second through hole 560 is opened on the fourth dielectric layer 550. The inner wall of the second through hole 560 is electroplated with a conductive material so that the inner wall of the second through hole 560 can be electrically connected to the two ends of the second through hole 560, that is, as shown in FIG. Fig.17H A second conductive via 570 is shown.

[0215] In some examples, a multi-layer interconnection line and a multi-layer shielding structure may be provided in the thickness direction of the first circuit board 200. The provision of the multi-layer interconnection line and the multi-layer shielding structure may be achieved by repeating part or all of the operations in S1101 to S1106 based on S1107, which will not be repeated here for the sake of brevity.

[0216] In the manufacturing method of the circuit board provided in this embodiment, the outermost side of the shielding structure is coated with non-magnetic non-conductive material. In this case, the shielding structure can be attached to the surface of the conductive layer, which is beneficial to reduce the thickness of the dielectric layer inside the circuit board and the thickness of the circuit board.

[0217] Based on a similar principle, an embodiment of the present application also provides an electronic device, which may include a speaker and any one or more circuit boards provided in the above embodiments, the circuit board is arranged adjacent to the speaker, and the shielding structure in the circuit board is located between the interfering components and / or interfering interconnection lines on the circuit board and the speaker. In other words, the interfering components and / or interfering interconnection lines on the circuit board are arranged on a side of the shielding structure away from the speaker.

[0218] In some examples, the electronic device may also include other structures such as a display screen, a battery, a camera, a distance sensor, etc. Exemplarily, the electronic device may be a mobile phone, a tablet computer, a smart speaker, etc.

[0219] In some examples, the electronic device may further include a housing, leads and an electrical connection interface, and a speaker and a circuit board of the electronic device may together constitute a sound unit. Exemplarily, the electronic device may be a headset.

[0220] In some examples, the electronic device may further include a battery, and the circuit board of the electronic device may be connected to one or more electronic components such as a micro-electro-mechanical system (MEMS) microphone, a noise reduction chip, a Bluetooth antenna, and a memory. Exemplarily, the electronic device may be a true wireless stereo (TWS) headset.

[0221] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0222] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An electronic device, characterized in that: include: A circuit board and a speaker, wherein the speaker is electrically connected to the circuit board, The circuit board includes a shielding structure and an interference source, wherein the shielding structure is located inside the circuit board and between the interference source and the speaker, and the interference source includes electronic components and / or interconnecting wires; Wherein, the shielding structure includes a magnetic material whose relative magnetic permeability is greater than a first threshold value.

2. The electronic device according to claim 1, characterized in that: The projection of the interference source in the plane where the circuit board is located is located within the region of the projection of the shielding structure in the plane where the circuit board is located.

3. The electronic device according to claim 1, characterized in that: The shielding structure comprises a plurality of sub-shielding structures, and the projection of the interference source in the plane where the circuit board is located is located within a region formed by the projections of the plurality of sub-shielding structures in the plane where the circuit board is located.

4. The electronic device according to claim 3, characterized in that: The plurality of sub-shielding structures are located in different planes.

5. The electronic device according to any one of claims 1 to 4, characterized in that: The shielding structure includes at least one first functional layer and multiple second functional layers, the first functional layer is composed of magnetic material, the second functional layer is composed of non-magnetic non-conductor material, and the outer side of the shielding structure is the second functional layer; the first functional layer and the second functional layer are adjacent to each other and are stacked.

6. The electronic device according to any one of claims 1 to 4, characterized in that: The shielding structure comprises at least one second functional layer and multiple first functional layers, and the outer side of the shielding structure is the first functional layer; wherein the first functional layer is composed of a magnetic material, and the second functional layer is composed of a non-magnetic non-conductor material; the first functional layer and the second functional layer are adjacent and stacked; The circuit board also includes a dielectric layer, which covers the shielding structure and is composed of non-magnetic and non-conductive materials.

7. The electronic device according to any one of claims 1 to 4, characterized in that: The shielding structure includes a first functional layer, and the circuit board also includes a dielectric layer. The dielectric layer covers the first functional layer, and the dielectric layer is composed of non-magnetic and non-conductive materials.

8. The electronic device according to any one of claims 1 to 7, characterized in that: The shielding structure is arranged close to the interference source.

9. The electronic device according to any one of claims 1 to 8, characterized in that: The electronic device is a headset.

10. A method for manufacturing a circuit board, characterized in that: The method comprises: Laying a first dielectric layer on the interconnection line of the circuit board, the first dielectric layer is composed of a non-magnetic non-conductor material, and the thickness of the first dielectric layer is not greater than the thickness of the interconnection line; A shielding structure is laid on the first dielectric layer at a position corresponding to the interference source on the circuit board, the shielding structure includes a magnetic material with a relative magnetic permeability greater than a first value threshold, the interference source includes interconnecting wires and / or electronic components, and the outer side of the shielding structure is coated with non-magnetic non-conductive material.

11. The manufacturing method according to claim 10, characterized in that: The method further comprises: According to the position of the interference source, the shielding structure is divided into a plurality of sub-shielding structures, and the positions of the plurality of sub-shielding structures correspond to the positions of the interference source.

12. The manufacturing method according to claim 10 or 11, characterized in that: The method further comprises: A second dielectric layer is laid on the shielding structure, wherein the second dielectric layer is composed of a non-magnetic and non-conductive material, and a thickness of the second dielectric layer is not greater than a thickness of the shielding structure.

13. The manufacturing method according to claim 12, characterized in that: The method further comprises: A through hole is formed on the first dielectric layer and the second dielectric layer, wherein the through hole penetrates the first dielectric layer and the second dielectric layer, and one end of the through hole is opened above the interconnection line; Conductive material is electroplated on the inner wall of the through hole.

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