Circuit board, circuit board assembly and computer equipment

Abstract

The embodiment of the invention provides a circuit board, a circuit board assembly and computer equipment, relates to the technical field of chip heat dissipation, is used for dissipating heat of an electronic device, and is relatively simple in structure. The circuit board comprises a first circuit substrate which comprises a first wiring layer and a first conductive column, the first conductive column is electrically connected with the first wiring layer, and the first conductive column is led out to the first side of the first circuit substrate; the first heat dissipation plate is arranged on the second side of the first circuit substrate in a stacked mode, and the second side is the opposite side of the first side; and the heat dissipation column is connected with the first heat dissipation plate and penetrates through the first through hole in the first circuit substrate so as to extend to the first side of the first circuit substrate. The circuit board provided by the embodiment of the invention is simple in structure, and can carry out heat dissipation on chips with different heights at the same time.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of chip heat dissipation technology, and in particular to a circuit board, a circuit board assembly, and a computer device. Background Art

[0002] Cold plate liquid cooling is a currently mainstream liquid cooling technology. It places a liquid cooling plate on top of a high-power chip and removes the heat generated by the chip through the flow of liquid inside the liquid cooling plate.

[0003] In the use of cold plate liquid cooling technology, in order to improve the heat dissipation capacity of the chip, the liquid cooling plate needs to be flatly attached to the chip surface. However, due to the different heights of different chips, multiple liquid cooling plates need to be set up to dissipate heat for chips of different heights, which leads to the problem of complex heat dissipation structure. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a circuit board, a circuit board assembly and a computer device for dissipating heat from electronic devices, and the structure is relatively simple.

[0005] In order to achieve the above purpose, the present application provides the following solutions:

[0006] On the one hand, a circuit board is provided, comprising: a first circuit substrate, comprising a first wiring layer and a first conductive column, the first conductive column being electrically connected to the first wiring layer, and the first conductive column being led out to a first side of the first circuit substrate; a first heat sink, stacked on a second side of the first circuit substrate, the second side being an opposite side to the first side; and a heat sink, connected to the first heat sink, and passing through a first through hole on the first circuit substrate to extend to the first side of the first circuit substrate.

[0007] The circuit board provided in the embodiment of the present application is provided with a heat dissipation column and a first heat dissipation plate, and the heat dissipation column can be used to directly or indirectly contact the electronic device (such as a chip) installed on the first side of the first circuit substrate, so that the heat on the electronic device can be conducted to the first heat dissipation plate through the heat dissipation column, and then the heat is dissipated by the first heat dissipation plate. When the first heat dissipation plate is a liquid cooling plate, the flow of the liquid cooling medium in the liquid cooling plate can take away the heat conducted from the heat dissipation column to the liquid cooling plate, which has a good heat dissipation effect. Since the circuit board in the embodiment of the present application is stacked on the second side of the first circuit substrate, and the heat dissipation column passes through the first circuit substrate to dissipate the heat of the electronic device (such as a chip) located on the first side of the first circuit substrate, it can match chips of different sizes (such as heights) at the same time (that is, it can dissipate heat for chips of different sizes (such as heights) at the same time). Compared with the related art, there is no need to separately set up multiple printed circuit boards (PCBs) and multiple liquid cooling plates, which reduces the space occupation, and has a simple structure, low cost, and good heat dissipation effect.

[0008] In some embodiments, the first heat sink comprises a liquid cooling plate, and the liquid cooling plate comprises a cooling medium channel having an inlet and an outlet. By introducing liquid cooling medium into the cooling medium channel, the first heat sink can have good heat dissipation capacity.

[0009] In some embodiments, the circuit board further includes: a second circuit substrate, located on the side of the first heat sink away from the first circuit substrate; the second circuit substrate includes a second wiring layer and a second conductive column, the second conductive column is electrically connected to the second wiring layer; the second conductive column passes through the second through hole on the first heat sink to connect to the first wiring layer, or the second conductive column passes through the second through hole on the first heat sink and the third through hole on the first circuit substrate to extend to the first side of the first circuit substrate. In this way, the surface of the second circuit substrate away from the first heat sink can also be used to install electronic devices. At this time, a heat sink can also be set on the side of the first heat sink close to the second circuit substrate. The specific setting method can refer to the previous description. In this way, the electronic devices on the second circuit substrate can also be cooled.

[0010] In some embodiments, there are multiple heat dissipation columns, at least one of which is connected to the first heat dissipation plate and passes through a through hole on the second circuit substrate to extend to a side of the second circuit substrate away from the first heat dissipation plate. In this way, the first heat dissipation plate and the heat dissipation column can also be used to dissipate heat for electronic devices disposed on the second circuit substrate.

[0011] In some embodiments, the circuit board includes a plurality of first heat sinks and a plurality of second circuit substrates that are alternately stacked. In this way, a stronger heat dissipation capability can be provided by the plurality of first heat sinks.

[0012] In some embodiments, the circuit board further comprises: an insulating material filled between the second conductive pillar and the hole wall of the second through hole. Such a configuration can improve the signal transmission quality of the second conductive pillar.

[0013] In some embodiments, the insulating material also covers the edge of the second through hole. This arrangement can better improve the signal transmission quality of the second conductive pillar 1042.

[0014] In some embodiments, the insulating material includes at least one of glass fiber material, resin material and rubber material, all of which have good insulating effects.

[0015] In some embodiments, the heat dissipation column and the first heat dissipation plate are made of metal. With this arrangement, on the one hand, the heat transfer coefficient of the heat dissipation column and the first heat dissipation plate is higher, which can have a better heat dissipation effect, and on the other hand, it can also have a conductive effect, for example, it can be used to transmit a ground signal (GND).

[0016] On the other hand, a circuit board assembly is provided, comprising: the circuit board of any of the above embodiments; an electronic device mounted on the first side of the first circuit substrate; the electronic device is electrically connected to the first conductive column, and the electronic device is in contact with the heat dissipation column. With such an arrangement, the heat dissipation column and the first heat dissipation plate can be used to dissipate heat from the electronic device.

[0017] In some embodiments, the ground pin of the electronic device is in electrical contact with the heat dissipation column. In this way, the heat dissipation column and the first heat dissipation plate can be used to dissipate heat from the electronic device, and the heat dissipation column and the first heat dissipation plate can also be used to transmit the ground signal of the electronic device.

[0018] In some embodiments, the number of the electronic devices is multiple, the multiple electronic devices include a first electronic device and a second electronic device, the power of the first electronic device is greater than the power of the second electronic device; the circuit board assembly also includes a second heat sink disposed on the side of the first electronic device away from the first circuit substrate. Such an arrangement can improve the heat dissipation capability of the first electronic device with higher power, for example, achieving double-sided heat dissipation of the first electronic device.

[0019] In some embodiments, the electronic device includes a chip. A plurality of chips of different types and heights can be mounted on the first circuit substrate of the circuit board assembly. The heat dissipation column and the first heat dissipation plate are used to dissipate heat for the mounted multiple chips at the same time.

[0020] On the other hand, a computer device is provided, comprising: the circuit board assembly in any of the above embodiments. The computer device provided in the embodiment of the present application has all the beneficial effects described above because it has the circuit board assembly in any of the above embodiments. This makes it less likely for the computer device to have overheating, such as serious heating of some chips and reduced operating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A structural block diagram of a computer device provided in an embodiment of the present application;

[0022] Figure 2 A structural diagram of a circuit board assembly in the related art;

[0023] Figure 3 A structural diagram of a circuit board assembly in the related art;

[0024] Figure 4 for Figure 1 A structural diagram of a circuit board assembly;

[0025] Figure 5 A structural diagram of a liquid cooling plate connected to a cooling structure provided in an embodiment of the present application;

[0026] Figure 6 for Figure 1 A structural diagram of another circuit board assembly in;

[0027] Figure 7 for Figure 1 A structural diagram of another circuit board assembly;

[0028] Figure 8 for Figure 6 Schematic diagram of heat dissipation for small and medium power chips;

[0029] Fig. 9 for Figure 6 Schematic diagram of heat dissipation for medium and high power chips. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0031] In the following, the terms "first", "second", etc. are used only for convenience of description and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0032] In the embodiments of the present application, unless otherwise clearly specified and limited, the term "electrical connection" can refer to a direct electrical connection or an indirect electrical connection through an intermediate medium, and "electrical contact" can refer to a direct electrical contact or an indirect electrical contact through an intermediate medium.

[0033] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0034] In the embodiments of the present application, "and / or" describes the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B may represent: A exists alone, A and B exist at the same time, and B exists alone, where A and B may be singular or plural. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0035] In the embodiments of the present application, directional indications such as up, down, left, right, front, and back, etc., used to explain the structure and movement of different components in the present application are relative. These indications are appropriate when the components are in the positions shown in the figures. However, if the description of the component position changes, then these directional indications will also change accordingly.

[0036] An embodiment of the present application provides a computer device, which may be a personal computer, a router, a switch, a server, a vehicle-mounted device, etc. Figure 1 1 is a block diagram of a computer device 1000 in an embodiment of the present application, wherein the computer device 1000 includes a circuit board assembly 300, and the circuit board assembly 300 includes a circuit board 100 and an electronic device 200. The electronic device 200 can be mounted on the circuit board to implement functions such as processing and calculation. In some examples, the electronic device 200 can be, for example, a chip, such as a processing chip, a storage chip, etc. In other examples, the electronic device 200 can also be, for example, an electronic component such as a resistor or a capacitor. The circuit board 100 can be used to dissipate heat for the electronic device 200, and the structure of the circuit board 100 is relatively simple.

[0037] Figure 2 4 is a structural diagram of a circuit board assembly 400 in the related art.

[0038] The circuit board assembly 400 includes a printed circuit board (PCB) 401, a plurality of chips 402, and a plurality of liquid cooling plates 403. The plurality of chips 402 are mounted on one side surface of the printed circuit board, and the heights of the plurality of chips 402 are different (two chips are used as an example in the figure). The plurality of liquid cooling plates 403 can be attached to the surfaces of the plurality of chips 402 in a one-to-one correspondence to dissipate heat for the corresponding chips 402. Among them, due to the different heights of the plurality of chips 402, the distances between the plurality of liquid cooling plates 403 and the printed circuit board 401 are different. The above scheme can be referred to as a liquid cooling plate floating heat dissipation scheme, that is, the printed circuit board 401 is a fixed whole plate, and the plurality of liquid cooling plates for dissipating heat for the plurality of chips 402 float to different height positions. Since the floating liquid cooling plate scheme requires a plurality of liquid cooling plates 403, there is a problem of complex structure.

[0039] Figure 3 4 is a structural diagram of a circuit board assembly 500 in the related art.

[0040] The circuit board assembly 500 includes a plurality of printed circuit boards (PCBs) 501, a plurality of chips 502 and an integrated liquid cooling plate 503. The plurality of chips 502 can be installed on the plurality of printed circuit boards 501 in a one-to-one correspondence, and each chip 502 contacts the integrated liquid cooling plate 503 with the surface of the correspondingly installed printed circuit board 501 away from the integrated liquid cooling plate 503, so that the integrated liquid cooling plate 503 can be used to dissipate heat for the plurality of chips 502. Among them, due to the different heights of the plurality of chips 402, the distances from the plurality of printed circuit boards 501 to the liquid cooling plate 403 are different. The above scheme can be referred to as a floating heat dissipation scheme for printed circuit boards, that is, the liquid cooling plate 503 does not float to different height positions, and an integrated liquid cooling plate 503 is used to dissipate heat for the plurality of chips 502, and the plurality of printed circuit boards float to different height positions. Since the floating scheme for printed circuit boards requires multiple printed circuit boards 501, there is also a problem of complex structure.

[0041] exist Figure 2 and Figure 3 In the embodiments, there may be some other low-power devices that need to be cooled by shell-mounted cooling or liquid cooling plate cooling, which will further increase the complexity of the circuit board assembly (400, 500). In addition, there may be some low-power chips that cannot be cooled by the designed liquid cooling plate (403, 503). In this case, it is necessary to design a separate heat dissipation structure for the low-power chips, which will further increase the complexity of the circuit board assembly (400, 500). In addition, Figure 2 and Figure 3In the embodiments, heat is dissipated only from the side of the chip away from the printed circuit board. However, as the power of the chip increases, it is gradually difficult to meet the heat dissipation requirements of high-power chips.

[0042] Based on the above technical problems, the embodiment of the present application further provides a circuit board 100 and a circuit board assembly 300 .

[0043] Figure 4 for Figure 1 1 is a structural diagram of a circuit board assembly 300. The circuit board assembly 300 includes a circuit board 100 and an electronic device 200. As described above, the electronic device 200 can be a chip or other electronic components. Figure 4 The electronic device 200 is schematically illustrated as a chip 201 .

[0044] The circuit board 100 includes a first circuit substrate 101 , a first heat dissipation plate 102 and heat dissipation columns 103 .

[0045] The first circuit substrate 101 includes a first wiring layer 1011 and a first conductive column 1012, the first conductive column 1012 is electrically connected to the first wiring layer 1011, and the first conductive column 1012 is led to the first side C1 of the first circuit substrate 101. The first circuit substrate 101 also includes an insulating substrate 1010. When the first circuit substrate 101 is a rigid substrate, the insulating substrate 1010 of the first circuit substrate 101 can be made of FR4 material, and the main components of the FR4 material are glass fiber and epoxy resin. Glass fiber is an excellent reinforcing material with high strength, high modulus, corrosion resistance, non-conductivity and other characteristics. Epoxy resin is a polymer material with excellent adhesion, mechanical properties, heat resistance and electrical properties. The combination of glass fiber and epoxy resin forms a FR4 material with excellent comprehensive properties. As a result, the first circuit substrate 101 has good mechanical (such as high strength, high modulus and excellent impact resistance, not easy to deform, not easy to crack, and can withstand large external forces and pressures), electrical (such as good insulation performance and heat resistance, and can also withstand high voltage and current), chemical (such as excellent corrosion resistance and chemical resistance, can be used in harsh environments such as acids, alkalis, and solvents) and thermal properties (such as good high temperature resistance, thermal expansion resistance and thermal conductivity, can work stably in high temperature environments). When the first circuit substrate 101 is a flexible substrate, the insulating base material 1010 of the first circuit substrate 101 can be made of materials such as polyimide (PI) and thermoplastic polyester (PET).

[0046] The first wiring layer 1011 may be located inside or on the surface of the insulating substrate 1010. For example, a first wiring layer 1011 may be sandwiched between two insulating substrates 1010 in a stacked manner. The present application does not limit the number of layers of the insulating substrate 1010 and the number of layers of the first wiring layer 1011, and when there are multiple layers of the first wiring layer 1011, the connection method of the multiple layers of the first wiring layer 1011 is not limited. The connection method of the multiple layers of the first wiring layer 1011 can be designed according to different usage scenarios. The first conductive column 1012 is electrically connected to the first wiring layer 1011, and the first conductive column 1012 can be led out to the first side C1 of the first circuit substrate 101 (also referred to as the first side of the insulating substrate 1010) through the via hole on the insulating substrate 1010. Here, the number of the first conductive columns 1012 is not limited either. For example, multiple first conductive columns 1012 may be connected to different positions of the same first wiring layer 1011, or multiple first conductive columns 1012 may be connected to different layers of the first wiring layer 1011.

[0047] The first heat sink 102 is stacked on the second side C2 of the first circuit substrate 101, and the second side C2 is the opposite side of the first side C1. The first heat sink 102 can be a liquid cooling plate 1021, an air cooling plate, a heat conducting plate, a temperature averaging plate, or other plate-like structures with cooling effects. Among them, the liquid cooling plate 1021 can take away the heat on its surface through the flow of liquid cooling medium inside it, and the air cooling plate can take away the heat on its surface through the flow of gas cooling medium inside it. The heat conducting plate can be a hollow or solid plate-like structure made of a material with a high heat transfer coefficient such as copper, for example. The temperature averaging plate refers to a structure that includes a phase change material inside, and the internal phase change material switches the flow between gas and liquid to achieve heat dissipation. It can improve the local overheating phenomenon of the first circuit substrate 101, which is beneficial to protect the electronic devices 200 on the first circuit substrate 101, such as the chip 201.

[0048] Taking the first heat sink 102 as a liquid cooling plate 1021 as an example, Figure 5 As shown, Figure 5 A structural diagram of a liquid cooling plate and a cooling structure provided in an embodiment of the present application. The liquid cooling plate 1021 may include a cooling medium channel 1020 having an inlet a1 and an outlet a2, and a liquid cooling medium, such as water, a refrigerant, etc., may flow through the cooling medium channel 1020. The inlet a1 and the outlet a2 of the cooling medium channel 1020 may be simultaneously arranged on the side of the liquid cooling plate 1021 (i.e. Figure 5As shown), it can also be set on other surfaces of the liquid cooling plate 1021 at the same time, or it can also be set on different surfaces of the liquid cooling plate 1021. In some examples, the liquid cooling plate 1021 can be used in conjunction with the cooling structure 600. For example, the inlet a1 of the cooling medium channel 1020 can be connected to the outlet of the cooling structure 600 through a pipeline, and the outlet a2 of the cooling medium channel 1020 can be connected to the inlet of the cooling structure 600 through a pipeline. The cooling structure 600 can be a cooler or a condenser. For example, the cooler can cool water when water flows through it, and the condenser can change the phase state of the refrigerant when the refrigerant flows through it, such as condensation heat dissipation. The cooling structure 600 can be used as a part of the circuit board assembly 300, or the cooling structure 600 can also be used as a part of the computer device 1000. When the cooling structure 600 is used as a part of the computer device 1000, in addition to being used in conjunction with the liquid cooling plate 1021 in the circuit board assembly 300, other pipelines can also be connected to the liquid cooling plate used to dissipate heat for other components (such as power modules, etc.).

[0049] The heat dissipation column 103 is connected to the first heat dissipation plate 102, and the heat dissipation column 103 passes through the first through hole H1 on the first circuit substrate 101 to extend to the first side C1 of the first circuit substrate 101. The first through hole H1 can be understood as a through hole on the insulating substrate 1010. The heat dissipation column 103 can pass through the opening on the first wiring layer 1011 while passing through the first through hole H1, or it can not pass through the opening on the first wiring layer 1011, and there is no restriction here. In addition, the heat dissipation column 103 can be a solid structure or a hollow structure with a fluid channel. By extending the heat dissipation column 103 to the first side C1 of the first circuit substrate 101, the heat dissipation column 103 can be used to conduct the heat of the electronic device 200 (such as a chip) installed on the first side C1 of the first circuit substrate 101 to the first heat dissipation plate 102, and then the heat can be dissipated by using the first heat dissipation plate 102.

[0050] The circuit board 100 provided in the embodiment of the present application, because it is provided with a heat dissipation column 103 and a first heat dissipation plate 102, can utilize the heat dissipation column 103 to directly or indirectly (for example, through heat conductive glue, solder or other heat conductive connection structures) contact the electronic device 200 (such as a chip) installed on the first side C1 of the first circuit substrate 101, so that the heat on the electronic device 200 can be conducted to the first heat dissipation plate 102 through the heat dissipation column 103, and then the heat is dissipated by the first heat dissipation plate 102. When the first heat dissipation plate 102 is a liquid cooling plate 1021, the flow of liquid cooling medium in the liquid cooling plate 1021 can take away the heat conducted to the liquid cooling plate 1021 by the heat dissipation column 103, and has a good heat dissipation effect. Since the circuit board 100 in the embodiment of the present application has the first heat sink 102 stacked on the second side C2 of the first circuit substrate 101, and the heat dissipation column 103 passes through the first circuit substrate 101 to dissipate heat for the electronic device 200 (such as a chip) located on the first side C1 of the first circuit substrate 101, it can match chips of different sizes (such as heights) at the same time (that is, it can dissipate heat for chips of different sizes (such as heights) at the same time). Compared with the related art, there is no need to separately set up multiple PCBs and multiple liquid cooling plates, which reduces the space occupied, and has a simple structure, low cost, and good heat dissipation effect.

[0051] In addition, in some examples, such as Figure 4 As shown, the circuit board assembly 100 can also simultaneously set a second heat sink 90 on the back side (the surface away from the first circuit substrate 101) of one or more electronic devices 200. The type of the second heat sink 90 can refer to the first heat sink 102, for example, it can also be a liquid cooling plate. In this way, the electronic device 200 can be cooled from both sides of the electronic device 200 at the same time, which can better meet the heat dissipation requirements of high-power electronic devices 200. For example, according to the heat dissipation requirements of different electronic devices 200, a second heat sink 90 can be separately set on the back side of some or all electronic devices 200, for example, Figure 4 In the embodiment shown, three chips are included, and the power increases from left to right. A second heat sink 90 can be added to the back of the rightmost chip (i.e., the chip with the highest power and the most heat generation) to achieve a better heat dissipation effect. Among them, the one with the higher power of any two electronic devices can be called the first electronic device, and the one with the lower power can be called the second electronic device. That is, a second heat sink 90 can be added to the side of the first electronic device away from the first circuit substrate 101.

[0052] In some embodiments, the heat dissipation column 103 and the first heat dissipation plate 102 are made of metal. With this arrangement, on the one hand, the heat transfer coefficient of the heat dissipation column 103 and the first heat dissipation plate 102 is higher, which can have a better heat dissipation effect, and on the other hand, it can also have a conductive effect, for example, it can be used to transmit a ground signal (GND).

[0053] Exemplarily, the heat dissipation column 103 and the first heat dissipation plate 102 may be made of copper, which has a good heat dissipation effect.

[0054] In some embodiments, the ground pin 2011 of the electronic device 200 is in electrical contact with the heat dissipation column 103. In this way, the heat dissipation column 103 and the first heat dissipation plate 102 can be used to dissipate heat from the electronic device 200, and the heat dissipation column 103 and the first heat dissipation plate 102 can be used to transmit the ground signal of the electronic device 200. Of course, in other embodiments, the heat dissipation column 103 can also be arranged to contact other parts of the electronic device to achieve heat dissipation. For example, the bottom surface (i.e., the surface close to the first circuit substrate 101) or the side surface of the electronic device 200 can also be made.

[0055] Figure 6 for Figure 1 A structural diagram of another circuit board assembly 300 is shown in FIG. Figure 6 and Figure 4 The difference is that a second circuit substrate 104 is added on the side of the first heat sink 102 away from the first circuit substrate 101. In some embodiments, Figure 6 As shown, the second circuit substrate 104 includes an insulating substrate 1010 and a second wiring layer 1041. The configuration of the insulating substrate 1010 and the second wiring layer 1041 can refer to the previous embodiment of the insulating substrate 1010 and the first wiring layer 1011, which will not be repeated here. The second circuit substrate 104 also includes a second conductive column 1042. The connection method between the second conductive column 1042 and the second wiring layer 1041 can also refer to the previous embodiment of the first conductive column 1012 and the first wiring layer 1011, which will not be repeated here. The difference is that, in some examples, the second conductive column 1042 passes through the second through hole H2 on the first heat sink 102 to connect to the first wiring layer 1011 (for example Figure 6 In other examples, the second conductive pillar 1042 passes through the second through hole H2 on the first heat sink 102 and the third through hole H3 on the first circuit substrate 101 to extend to the first side C1 of the first circuit substrate 101. Of course, the second conductive pillar 1042 can also be electrically connected to one or more first wiring layers 1011 while passing through the first circuit substrate 101. Both the first circuit substrate 101 and the second circuit substrate 104 can be PCBs.

[0056] Exemplarily, the surface of the second circuit substrate 104 facing away from the first heat sink 102 can also be used to install the electronic device 200 (not shown). In this case, the first heat sink 102 close to the second circuit substrate 104 can also be provided with a heat dissipation column 103, for example Figure 7 As shown, Figure 7 and Figure 6 The only difference is that a heat dissipation column 103 passing through the second circuit substrate 104 is added, and an electronic device 200 in contact with the heat dissipation column 103 is installed on the second circuit substrate 104. The specific arrangement can refer to the previous description, so that the electronic device 200 on the second circuit substrate 104 can also be cooled at the same time.

[0057] In some other embodiments, the number of the first heat sink 102 and the second circuit substrate 104 may be plural, for example, they may be alternately stacked in a direction away from the first side C1 of the first circuit substrate 101 .

[0058] In some embodiments, the circuit board further includes: an insulating material 105 filled between the second conductive pillar 1042 and the hole wall of the second through hole H2. This arrangement can prevent the first heat sink 102 and the cooling medium in the first heat sink 102 from affecting the signal transmitted by the second conductive pillar 1042, thereby improving the signal transmission quality of the second conductive pillar 1042.

[0059] Exemplarily, the insulating material 105 also covers the edge of the second through hole H2. This arrangement can further prevent the first heat sink 102 and the cooling medium in the first heat sink 102 from affecting the signal transmitted by the second conductive pillar 1042, thereby better improving the signal transmission quality of the second conductive pillar 1042.

[0060] Exemplarily, the insulating material 105 includes at least one of glass fiber material, resin material and rubber material, all of which have good insulating effects.

[0061] Figure 8 for Figure 6 Schematic diagram of heat dissipation for small and medium power chips. Figure 8 As shown, when the coolant (i.e., liquid cooling medium) in the first heat sink 102 flows from left to right as shown in the figure, the heat on the low-power chip 201 can flow along the dotted line with arrows to the pins of the chip 201 (such as the ground pin 2011), the heat sink 103, the first heat sink 102, and finally be taken away by the coolant in the first heat sink 102. In this way, there is no need to set the second heat sink 90 on the back of the low-power chip 201, and the structure is relatively simple.

[0062] Fig. 9 for Figure 6 Schematic diagram of heat dissipation for medium and high power chips. Fig. 9As shown, when the flow direction of the coolant (i.e., liquid cooling medium) in the first heat sink 102 is from left to right as shown in the figure, the heat on the high-power chip 201 can be dissipated along two paths (such as two dotted leads with arrows). Among them, path 1: the heat flows to the pins of the chip 201 (such as the ground pin 2011), the heat dissipation column 103, and the first heat sink 102 below in sequence, and is finally taken away by the coolant in the first heat sink 102 below; path 2: the heat flows to the second heat sink 90 above (the second heat sink 90 and the setting method can refer to the first heat sink 102, for example, it can also be a liquid cooling plate), and is taken away by the coolant in the second heat sink 90 above. In this way, the heat dissipation capacity of the high-power chip 201 can be increased.

[0063] It should be noted that in Figure 4 , Figure 6-Figure 9 In the embodiments, the heat sink 103 is in contact with the ground pin and / or the vacant pin at the bottom of the chip 201 as an example for illustration; however, in other embodiments, the heat sink 103 may be in contact with the bottom surface of the chip 201 (i.e., the surface of the chip 201 close to the first circuit substrate) to dissipate heat, or the heat sink 103 may be in contact with the side surface of the chip 201 to dissipate heat.

[0064] In some embodiments, multiple heat dissipation columns in contact with the same chip 201 can be evenly spaced within the positive projection range of the chip 201 on the first circuit substrate 101. In this way, the heat on the chip 201 can be better conducted to the first heat dissipation plate 102, thereby dissipating the heat faster through the first heat dissipation plate 102.

[0065] In some embodiments, the plurality of chips 201 may be relatively evenly distributed at different positions of the first circuit substrate 101 , thereby facilitating better utilization of the heat dissipation capability of the first heat sink 102 .

[0066] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A circuit board, characterized in that: include: A first circuit substrate, comprising a first wiring layer and a first conductive column, wherein the first conductive column is electrically connected to the first wiring layer and the first conductive column is led out to a first side of the first circuit substrate; A first heat dissipation plate, stacked on a second side of the first circuit substrate, the second side being an opposite side to the first side; as well as, The heat dissipation column is connected to the first heat dissipation plate and passes through the first through hole on the first circuit substrate to extend to the first side of the first circuit substrate.

2. The circuit board according to claim 1, characterized in that: Also includes: A second circuit substrate is located on a side of the first heat sink facing away from the first circuit substrate; the second circuit substrate includes a second wiring layer and a second conductive column, and the second conductive column is electrically connected to the second wiring layer; the second conductive column passes through the second through hole on the first heat sink to connect to the first wiring layer, or the second conductive column passes through the second through hole on the first heat sink and the third through hole on the first circuit substrate to extend to the first side of the first circuit substrate.

3. The circuit board according to claim 2, characterized in that: There are multiple heat dissipation columns, at least one of which is connected to the first heat dissipation plate and passes through a through hole on the second circuit substrate to extend to a side of the second circuit substrate away from the first heat dissipation plate.

4. The circuit board according to claim 2, characterized in that: The circuit board includes a plurality of first heat dissipation plates and a plurality of second circuit substrates which are alternately stacked.

5. The circuit board according to claim 2, characterized in that: Also includes: The insulating material is filled between the second conductive column and the hole wall of the second through hole.

6. The circuit board according to claim 5, characterized in that: The insulating material also covers an edge of the second through hole.

7. The circuit board according to claim 5, characterized in that: The insulating material includes at least one of a glass fiber material, a resin material and a rubber material.

8. The circuit board according to any one of claims 1 to 7, characterized in that: The heat dissipation column and the first heat dissipation plate are both made of metal.

9. The circuit board according to any one of claims 1 to 8, characterized in that: The first heat sink plate includes a liquid cooling plate including a cooling medium channel having an inlet and an outlet.

10. A circuit board assembly, characterized in that: include: The circuit board as claimed in any one of claims 1 to 9; An electronic device is mounted on the first side of the first circuit substrate; the electronic device is electrically connected to the first conductive column, and the electronic device is in contact with the heat dissipation column.

11. The circuit board assembly according to claim 10, characterized in that: The ground pin of the electronic device is in electrical contact with the heat dissipation column.

12. The circuit board assembly according to claim 10 or 11, characterized in that: The number of the electronic devices is multiple, the multiple electronic devices include a first electronic device and a second electronic device, and the power of the first electronic device is greater than the power of the second electronic device; The circuit board assembly further includes a second heat sink disposed on a side of the first electronic device away from the first circuit substrate.

13. The circuit board assembly according to any one of claims 10 to 12, characterized in that: The plurality of heat dissipation columns in contact with the same electronic device are evenly spaced and arranged within the range of the orthographic projection of the electronic device on the first circuit substrate.

14. A computer device, characterized in that: include: A circuit board assembly as claimed in any one of claims 10 to 13.

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