A copper clad laminate processing film pasting machine for circuit board production

Abstract

This invention relates to the field of circuit board manufacturing technology, and more particularly to a copper-clad laminate (CCL) lamination machine for CCL production. The machine includes a mounting platform, a frame, a housing, an electric guide rail, and a sliding frame. The mounting platform has a frame connected to its top, and a housing for storing photosensitive film is connected inside the frame. An electric guide rail is mounted on the frame, and a sliding frame is connected to a slider on the electric guide rail. This invention uses a lead screw motor to drive an electric suction cup downwards, which in turn moves the photosensitive film downwards. The photosensitive film contacts the CCL, adhering it to the CCL. A pressure plate holds the photosensitive film in place, preventing displacement during subsequent processing. This automatic film application and fixation reduces manual operation and improves production efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board production, and in particular to a copper clad plate processing film pasting machine for circuit board production. Background Art

[0002] In the circuit board production process, copper clad laminate film is a key link. A layer of photosensitive film is pasted on the copper clad laminate to achieve precise pattern transfer and etching process, thereby forming the required circuit pattern on the copper clad laminate.

[0003] Some fine photolithography processes require higher precision and control. The photosensitive film with a non-sticky surface can be more easily accurately aligned and adjusted, and the photosensitive film with a non-sticky surface is less likely to absorb dust and impurities, which can ensure the exposure and development effect of the photosensitive film. The photosensitive film with a non-sticky surface needs to be pre-cut into the required size and then fixed to the copper clad laminate by other means. Especially when dealing with larger-sized copper clad laminates, it is generally necessary to stick tape between the photosensitive film and the copper clad laminate for fixation. This step not only increases labor costs, but the process of manual tape fixation is cumbersome, which reduces production efficiency and increases production costs. Especially in large-scale production, these problems are more obvious. Summary of the invention

[0004] In order to overcome the disadvantages of sticking tape between the photosensitive film and the copper clad laminate, which not only increases the labor cost, but also makes the process of manual tape fixing cumbersome, reduces production efficiency and increases production cost, the present invention provides a copper clad laminate processing film sticking machine for circuit board production.

[0005] The technical implementation scheme of the present invention is: a copper clad laminate processing film pasting machine for circuit board production, including a mounting table, a frame, a box, an electric guide rail, a sliding frame, a sliding plate, a screw motor, a cross plate, a first guide frame, a mounting frame, a first spring, an electric suction cup, a conveying mechanism and a pressing mechanism. The top of the mounting table is connected to the frame, and a box for storing a photosensitive film is connected in the frame. The frame is installed with an electric guide rail, and the slider of the electric guide rail is connected to the sliding frame, and the sliding plate is slidably connected in the sliding frame. The screw motor is installed on the sliding frame, and the screw of the screw motor and the sliding plate are connected by threads. The bottom of the sliding plate is connected to the cross plate, and the top of the cross plate is connected to the first guide frame, and the mounting frame is slidably connected to the first guide frame. A first spring is connected between the first guide frame and the mounting frame, and an electric suction cup for absorbing the photosensitive film is connected to the bottom of the mounting frame. The conveying mechanism is used to convey the copper clad laminate to the bottom of the electric suction cup, so that the electric suction cup can stick the photosensitive film to the copper clad laminate, and the pressing mechanism is used to press the photosensitive film on the copper clad laminate.

[0006] Further description, the conveying mechanism includes an electric slide rail and a conveying plate. The electric slide rail is installed on the top of the mounting table. The top of the slider of the electric slide rail is connected to the conveying plate. The conveying plate and the top of the mounting table are slidably connected. The top of the conveying plate is evenly spaced with conveying grooves for placing copper-clad boards.

[0007] Further explanation, the pressing mechanism includes a mounting plate, a mounting block, a rotating shaft, a pressure plate, a contact block, a guide block and a push plate. The top of the conveying plate is evenly connected to the mounting plates, and two mounting blocks are connected to the top of the mounting plates. The two mounting blocks on the same mounting plate are connected to the rotating shaft for rotation together, and the pressure plates are connected to the rotating shafts. The contact blocks are connected to the rotating shafts, and a torsion spring is connected between the contact blocks and the mounting blocks. Two guide blocks are connected to the top of the mounting plates, and the tops of the two guide blocks on the same mounting plate are connected to the push plates for sliding together. The front part of the cross plate is the pushing part, and the pushing part of the cross plate is used to push the push plate downward. The push plate pushes the contact block to rotate the pressure plate downward, and the pressure plate presses the photosensitive film on the copper-clad laminate.

[0008] Further explanation: the copper clad laminate processing film pasting machine for circuit board production also includes a flattening mechanism, which includes a second guide frame, a slide plate, a second spring, a mounting rod, a flattening plate, a contact frame and a push block. The second guide frame is connected to the top of the mounting platform, and the slide plate is slidably connected to the second guide frame. A second spring is connected between the second guide frame and the slide plate. Three mounting rods are connected to the bottom of the slide plate, and the lower ends of the three mounting rods are commonly connected to the flattening plate. The top of the slide plate is connected to the contact frame, and the sliding plate is connected to the push block. The push block is used to push the contact frame to move downward, and the contact frame drives the flattening plate to move downward, and the flattening plate flattens the copper clad laminate in the conveying trough.

[0009] Further explanation: the copper clad laminate processing film pasting machine for circuit board production also includes a correction mechanism, which includes a moving plate, a third spring and a correction plate. The moving plate is slidably connected to three mounting rods, and a third spring is connected between the slide plate and the moving plate. Correction plates for correcting the position of the copper clad laminate in the conveying trough are connected to the front and rear sides and the left and right sides of the moving plate. A receiving groove for accommodating the correction plate is opened on the top of the conveying plate, and the correction plate moves downward and enters the receiving groove.

[0010] To further explain, the copper clad laminate processing film pasting machine for circuit board production also includes a scraping mechanism, which includes a connecting frame and a scraper. The top of the mounting table is connected to the connecting frame, and the bottom of the connecting frame is connected to the scraper for scraping dust on the copper clad laminate.

[0011] Further explanation: the copper clad laminate processing film pasting machine for circuit board production also includes a suction mechanism, which includes a dust pump, a dust pipe, a connecting pipe and a dust box. A dust pump is installed in the frame, and a dust pipe is connected to the dust suction end of the dust pump, which is connected to a scraper. Three connecting pipes are connected to the bottom of the dust pipe, and the lower ends of the three connecting pipes are commonly connected to a dust box for sucking dust on the copper clad laminate.

[0012] Further explanation: round holes are opened at the bottom of the conveying trough.

[0013] The beneficial effects are as follows: 1. The present invention can drive the electric suction cup to move downward through the screw motor, and the electric suction cup drives the photosensitive film to move downward, so that the photosensitive film contacts the copper clad laminate and the photosensitive film is attached to the copper clad laminate. The photosensitive film on the copper clad laminate can be pressed by the pressing plate to prevent the position of the photosensitive film from shifting during subsequent processing. The copper clad laminate is automatically attached and the photosensitive film is automatically fixed, which can reduce manual operations and improve production efficiency.

[0014] 2. The contact frame can be pushed downward by the push block, and the contact frame drives the pressing plate to move downward. The pressing plate can flatten the copper clad laminate in the conveying trough. The flat copper clad laminate surface can reduce the residual air between the photosensitive film and the copper clad laminate to avoid the formation of bubbles.

[0015] 3. The sliding plate can drive the moving plate to move downward, and the moving plate drives the correction plate to move downward. The correction plate can correct the position of the copper clad laminate to prevent the copper clad laminate from tilting and ensure close contact between the photosensitive film and the copper clad laminate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A three-dimensional structural schematic diagram of the present invention is shown.

[0017] Figure 2 The three-dimensional structural schematic diagram of the box body, electric guide rail, sliding frame, sliding plate and screw motor of the present invention is shown.

[0018] Figure 3 A schematic diagram of the three-dimensional structure of the transverse plate, the first guide frame, the mounting frame, the first spring and the electric suction cup of the present invention is shown.

[0019] Figure 4 A three-dimensional structural schematic diagram of the conveying mechanism of the present invention is shown.

[0020] Figure 5 A first three-dimensional structural schematic diagram of the pressing mechanism of the present invention is shown.

[0021] Figure 6 A second three-dimensional structural schematic diagram of the pressing mechanism of the present invention is shown.

[0022] Figure 7A three-dimensional structural schematic diagram of the rotating shaft and the contact block of the present invention is shown.

[0023] Figure 8 A three-dimensional structural schematic diagram of the transverse plate and the pushing part of the present invention is shown.

[0024] Fig. 9 A three-dimensional structural schematic diagram of the flattening mechanism of the present invention is shown.

[0025] Fig.10 A three-dimensional structural schematic diagram of the second spring, the mounting rod and the pressing plate of the present invention is shown.

[0026] Fig.11 A three-dimensional structural schematic diagram of the correction mechanism of the present invention is shown.

[0027] Fig.12 A schematic diagram showing the position of the receiving groove of the present invention is shown.

[0028] Fig.13 A first three-dimensional structural schematic diagram of the scraping mechanism of the present invention is shown.

[0029] Fig.14 A second three-dimensional structural schematic diagram of the scraping mechanism of the present invention is shown.

[0030] Fig.15 A three-dimensional structural schematic diagram of the suction mechanism of the present invention is shown.

[0031] Fig.16 The three-dimensional structural schematic diagram of the connecting pipe and the dust collection box of the present invention is shown.

[0032] In the above figures: 1: mounting table, 2: frame, 3: box, 4: electric guide rail, 5: sliding frame, 6: sliding plate, 7: screw motor, 8: cross plate, 9: first guide frame, 10: mounting frame, 11: first spring, 12: electric suction cup, 13: electric slide rail, 14: conveying plate, 15: conveying trough, 16: mounting plate, 17: mounting block, 18: rotating shaft, 19: pressure plate, 21: contact block, 22: guide Toward block, 23: push plate, 231: push part, 24: second guide frame, 25: slide plate, 26: second spring, 27: mounting rod, 28: pressure plate, 29: contact frame, 30: push block, 31: moving plate, 32: third spring, 33: correction plate, 34: receiving groove, 35: connecting frame, 36: scraper, 37: dust pump, 38: dust pipe, 39: connecting pipe, 40: dust box, 41: round hole. DETAILED DESCRIPTION

[0033] The present invention will be further described below in conjunction with specific embodiments. The illustrative embodiments and descriptions of the present invention are used to explain the present invention but are not intended to limit the present invention.

[0034] Reference Figure 1-Figure 8 , a copper clad laminate processing film pasting machine for circuit board production, including a mounting platform 1, a frame 2, a box body 3, an electric guide rail 4, a sliding frame 5, a sliding plate 6, a screw motor 7, a cross plate 8, a first guide frame 9, a mounting frame 10, a first spring 11, an electric suction cup 12, a conveying mechanism and a pressing mechanism. The top right side of the mounting platform 1 is connected to the frame 2 by bolts, and the middle part of the frame 2 is connected to the box body 3 by bolts. The box body 3 has gaps on both the front and rear sides, and the gaps can provide activity space for the cross plate 8, so that the mounting frame 10 can enter the box body 3, so that the electric suction cup 12 can absorb the photosensitive film in the box body 3. The electric guide rails 4 are installed on the left and right sides of the upper part of the frame 2 by bolts, and the bottom of the sliders of the two electric guide rails 4 are connected to the sliding frame 5 by bolts. The sliding frame 5 is located between the two electric guide rails 4, and the two electric guide rails 4 jointly drive the sliding frame 5, which can improve the sliding The stability of the frame 5 is prevented from tilting. A sliding plate 6 is slidably connected inside the sliding frame 5. A screw motor 7 is installed on the top of the sliding frame 5 by bolts. The screw of the screw motor 7 and the sliding plate 6 are threadedly connected. A cross plate 8 is connected to the bottom of the sliding plate 6 by bolts. A first guide frame 9 is connected to the front side of the top of the cross plate 8. A mounting frame 10 is slidably connected to the first guide frame 9. The left and right parts of the first guide frame 9 are both sleeved with a first spring 11. The two ends of the first spring 11 are respectively connected to the first guide frame 9 and the mounting frame 10, and the first spring 11 is sleeved on the first guide frame 9 to prevent the first spring 11 from bending. Electric suction cups 12 are evenly spaced and connected to the bottom of the mounting frame 10. The conveying mechanism is used to convey the copper clad laminate to the bottom of the electric suction cup 12, so that the electric suction cup 12 can stick the photosensitive film to the copper clad laminate, and the pressing mechanism is used to press the photosensitive film on the copper clad laminate.

[0035] Reference Figure 4 The conveying mechanism includes an electric slide rail 13 and a conveying plate 14. The electric slide rail 13 is installed on the front side of the top of the mounting platform 1 by bolts. The top of the slider of the electric slide rail 13 is connected with the conveying plate 14. The conveying plate 14 is slidably connected to the top of the mounting platform 1, which can improve the stability of the conveying plate 14. Four conveying grooves 15 are evenly spaced from left to right on the top of the conveying plate 14, and a circular hole 41 is opened in the middle of the bottom of the conveying groove 15.

[0036] Reference Figure 5-Figure 8The pressing mechanism includes a mounting plate 16, a mounting block 17, a rotating shaft 18, a pressing plate 19, a contact block 21, a guide block 22 and a push plate 23. Four groups of mounting plates 16 are evenly spaced from left to right on the top of the conveying plate 14, each group has two mounting plates 16, and each conveying trough 15 is located between the two mounting plates 16 of each group. The left and right sides of the top of the mounting plate 16 are connected with mounting blocks 17, and the two mounting blocks 17 on the same mounting plate 16 are connected to the rotating shaft 18 for rotation. The rotating shaft 18 is connected with a pressing plate 19, and the pressing plate 19 is made of transparent material. The left and right ends of the rotating shaft 18 are connected with contact blocks 21, and a torsion spring is connected between the contact block 21 and the mounting block 17. The left and right sides of the top of the mounting plate 16 are connected with guide blocks 22, and the tops of the two guide blocks 22 on the same mounting plate 16 are connected to a push plate 23 for sliding connection. The bottom of the push plate 23 contacts the top of the contact block 21, and the front part of the cross plate 8 is a pushing part 231.

[0037] The staff puts the photosensitive film neatly into the box body 3, and then controls the electric guide rail 4 to drive the sliding frame 5 and the sliding plate 6 to move backward, and the sliding plate 6 drives the electric suction cup 12 to move backward, and moves the electric suction cup 12 to the top of the box body 3, and then controls the screw motor 7 to drive the sliding plate 6 to move downward, and the sliding plate 6 drives the electric suction cup 12 to move downward, and moves the electric suction cup 12 into the box body 3. The electric suction cup 12 will contact the top photosensitive film, and the electric suction cup 12 will suck the top photosensitive film, and then controls the screw motor 7 to drive the electric suction cup 12 to move upward, and move the photosensitive film out of the box body 3, and then controls the electric guide rail 4 to drive the electric suction cup 12 to move forward, and moves the photosensitive film to the top of the conveying plate 14, and then puts the copper clad laminate into the conveying trough 15. The electric slide rail 13 is controlled to drive the conveying plate 14 to move rightward, and the copper-clad laminate on the far right is conveyed to the bottom of the electric suction cup 12. Then the screw motor 7 is controlled to drive the sliding plate 6 to move downward, and the sliding plate 6 drives the cross plate 8 and the electric suction cup 12 to move downward. The electric suction cup 12 drives the photosensitive film to move downward, and the photosensitive film contacts the copper-clad laminate. The electric suction cup 12 stops moving downward, and the cross plate 8 continues to move downward. The first spring 11 is compressed. Under the action of the first spring 11, the electric suction cup 12 can press the photosensitive film so that the photosensitive film can be attached to the copper-clad laminate, and the copper-clad laminate is automatically attached, which reduces manual operations and improves production efficiency. Then the pushing part 231 of the cross plate 8 pushes the push plate 23 to move downward, and the push plate 23 pushes the contact block 21. The contact block 21 rotates downward, the torsion spring is deformed, the contact block 21 drives the rotating shaft 18 to rotate, the rotating shaft 18 drives the pressure plate 19 to rotate downward, the pressure plate 19 can press the photosensitive film on the copper clad laminate to prevent the position of the photosensitive film from shifting during subsequent processing, and automatically fix the photosensitive film, which can reduce manual operation and improve production efficiency. After the film is pasted, the electric suction cup 12 releases the photosensitive film, and then controls the screw motor 7 to drive the cross plate 8 and the electric suction cup 12 to move upward and reset, the first spring 11 returns to its original state, the pushing part 231 of the cross plate 8 and the push plate 23 are out of contact, the push plate 23 keeps pushing the contact block 21, and the contact block 21 cannot be reset, so the pressure plate 19 keeps pressing the copper clad laminate, and then controls the electric slide rail 13 to drive the conveying plate 14 to move to the right , the copper-clad laminate with film pasting is transported to the next process, and the second copper-clad laminate is transported to the bottom of the electric suction cup 12, and the film pasting is continued. The copper-clad laminate with film pasting can be irradiated with ultraviolet rays. The pressing plate 19 is made of transparent material. Ultraviolet rays can pass through the pressing plate 19 and irradiate on the copper-clad laminate. The photosensitive film will be activated after being irradiated by ultraviolet rays, and the photosensitive film will harden. The hardened photosensitive film will firmly adhere to the copper-clad laminate. Then the staff pulls the push plate 23 upward, and the push plate 23 and the contact block 21 are out of contact. Under the action of the torsion spring, the contact block 21 rotates upward, and the contact block 21 drives the pressing plate 19 to rotate upward. The pressing plate 19 no longer presses the copper-clad laminate. A ejection device can be set on the right side of the mounting table 1. The ejection device passes through the circular hole 41 and pushes the copper-clad laminate.Push the copper-clad laminate out of the conveying trough 15 to facilitate unloading.

[0038] Reference Fig. 9 and Fig.10 The copper clad laminate processing film pasting machine for circuit board production also includes a flattening mechanism, which includes a second guide frame 24, a slide plate 25, a second spring 26, a mounting rod 27, a flat plate 28, a contact frame 29 and a push block 30. The second guide frame 24 is connected to the front side of the top of the mounting platform 1, and the slide plate 25 is slidably connected to the second guide frame 24. The left and right parts of the second guide frame 24 are both sleeved with second springs 26. The two ends of the second spring 26 are respectively connected to the second guide frame 24 and the slide plate 25, and the second spring 26 is sleeved on the second guide frame 24 to avoid the second spring 26 from bending. Three mounting rods 27 are evenly spaced from left to right at the bottom of the slide plate 25, and the lower ends of the three mounting rods 27 are commonly connected to the flat plate 28. The contact frame 29 is connected to the right side of the top of the slide plate 25, and the upper front part of the sliding plate 6 is connected to the push block 30 by bolts.

[0039] When the sliding plate 6 moves downward, it will drive the push block 30 to move downward, and the push block 30 will contact the contact frame 29 and push the contact frame 29 to move downward. The contact frame 29 drives the slide plate 25 to move downward, the second spring 26 is compressed, the slide plate 25 drives the mounting rod 27 to move downward, and the mounting rod 27 drives the pressing plate 28 to move downward. The pressing plate 28 can flatten the copper clad laminate in the conveying trough 15. The flat copper clad laminate surface can reduce the residual air between the photosensitive film and the copper clad laminate to avoid the formation of bubbles.

[0040] Reference Fig.11 and Fig.12 The copper clad laminate processing film pasting machine for circuit board production also includes a correction mechanism, which includes a moving plate 31, a third spring 32 and a correction plate 33. The moving plate 31 is slidably connected to the three mounting rods 27. The mounting rods 27 on the left and right sides are sleeved with third springs 32. The two ends of the third spring 32 are respectively connected to the slide plate 25 and the moving plate 31, and the third spring 32 is sleeved on the mounting rod 27 to prevent the third spring 32 from bending. The front and rear sides and the left and right sides of the moving plate 31 are connected with correction plates 33. The pressing plate 28 is located at four The bottom of the correction plate 33 is an inclined surface between the correction plates 33. The correction plate 33 corrects the position of the copper-clad laminate by the inclined surface. There are four groups of receiving grooves 34 evenly spaced from left to right on the top of the conveying plate 14, and each group has four receiving grooves 34. Each conveying groove 15 is located between the four receiving grooves 34 of each group. The correction plate 33 moves downward and enters the receiving groove 34. The inclined surface at the bottom of the correction plate 33 contacts the bottom of the receiving groove 34, which can increase the contact area between the correction plate 33 and the conveying plate 14 and improve the ability of the correction plate 33 to withstand pressure.

[0041] When the slide plate 25 moves downward, it will drive the movable plate 31 to move downward, and the movable plate 31 will drive the correction plate 33 to move downward. The correction plate 33 will first contact the copper clad laminate, and then the pressing plate 28 will contact the copper clad laminate. The correction plate 33 can correct the position of the copper clad laminate to prevent the copper clad laminate from tilting and ensure that the photosensitive film and the copper clad laminate are in close contact. Then the pressing plate 28 will contact the copper clad laminate and flatten it.

[0042] Reference Fig.13 and Fig.14 The copper clad laminate processing film pasting machine for circuit board production also includes a scraping mechanism, which includes a connecting frame 35 and a scraper 36. The connecting frame 35 is connected to the front side of the top of the mounting table 1, and the scraper 36 is connected to the bottom of the connecting frame 35 by bolts. The scraper 36 can be disassembled and replaced to ensure the dust removal effect.

[0043] Reference Fig.15 and Fig.16 The copper clad laminate processing film pasting machine for circuit board production also includes a suction mechanism, which includes a dust pump 37, a dust pipe 38, a connecting pipe 39 and a dust box 40. The dust pump 37 is installed on the front side of the bottom of the frame 2 by bolts, and the dust pipe 38 is connected to the dust suction end of the dust pump 37. The dust pipe 38 and the left side of the scraper 36 are connected by bolts. Three connecting pipes 39 are evenly spaced and connected to the bottom of the dust pipe 38. The lower ends of the three connecting pipes 39 are commonly connected to the dust box 40. The dust suction port of the dust box 40 faces downward, which can better absorb dust on the copper clad laminate.

[0044] When the conveying plate 14 moves to the right to convey the copper-clad laminate, the scraper 36 can scrape off the dust on the copper-clad laminate to enhance the adhesion effect of the photosensitive film. The dust suction pump 37 suctions dust through the dust suction pipe 38. The dust enters the dust suction pipe 38 through the dust suction box 40 and the connecting pipe 39. The dust scraped by the scraper 36 is cleaned to ensure the cleanliness of the conveying plate 14.

[0045] The above description is only an example of the present invention and is not intended to limit the present invention. Any equivalent substitutions made within the principles of the present invention should be included in the protection scope of the present invention. The contents not elaborated in detail in the present invention belong to the existing technologies known to those skilled in the art.

Claims

1. A copper clad laminate processing film pasting machine for circuit board production, comprising a mounting platform (1) and a frame (2), wherein the top of the mounting platform (1) is connected to the frame (2), and is characterized in that: The machine also comprises a box body (3), an electric guide rail (4), a sliding frame (5), a sliding plate (6), a screw motor (7), a cross plate (8), a first guide frame (9), a mounting frame (10), a first spring (11), an electric suction cup (12), a conveying mechanism and a pressing mechanism. The frame (2) is connected with a box body (3) for storing a photosensitive film. The frame (2) is equipped with an electric guide rail (4). The sliding frame (5) is connected with a slider of the electric guide rail (4). The sliding frame (5) is slidably connected with a sliding plate (6). The sliding frame (5) is equipped with a screw motor (7). The screw of the screw motor (7) is The rod and the sliding plate (6) are connected by threads, the bottom of the sliding plate (6) is connected to a horizontal plate (8), the top of the horizontal plate (8) is connected to a first guide frame (9), the first guide frame (9) is slidably connected to a mounting frame (10), a first spring (11) is connected between the first guide frame (9) and the mounting frame (10), the bottom of the mounting frame (10) is connected to an electric suction cup (12) for sucking the photosensitive film, the conveying mechanism is used to convey the copper-clad laminate to the bottom of the electric suction cup (12), so that the electric suction cup (12) can stick the photosensitive film to the copper-clad laminate, and the pressing mechanism is used to press the photosensitive film on the copper-clad laminate; The conveying mechanism comprises an electric slide rail (13) and a conveying plate (14); the electric slide rail (13) is installed on the top of the mounting platform (1); the top of the slider of the electric slide rail (13) is connected to the conveying plate (14); the conveying plate (14) and the top of the mounting platform (1) are slidably connected; and conveying grooves (15) for placing copper-clad laminates are evenly spaced on the top of the conveying plate (14); The pressing mechanism comprises a mounting plate (16), a mounting block (17), a rotating shaft (18), a pressing plate (19), a contact block (21), a guide block (22) and a push plate (23). The top of the conveying plate (14) is evenly spaced and connected to the mounting plate (16). The top of each mounting plate (16) is connected to two mounting blocks (17). The two mounting blocks (17) on the same mounting plate (16) are connected to the rotating shaft (18) in a rotating manner. The rotating shaft (18) is connected to a pressing plate (19). The rotating shaft (18) is connected to a contact block (21). ), a torsion spring is connected between the contact block (21) and the mounting block (17), two guide blocks (22) are connected to the top of the mounting plate (16), and a push plate (23) is slidably connected to the top of the two guide blocks (22) on the same mounting plate (16). The front part of the horizontal plate (8) is a pushing part (231), and the pushing part (231) of the horizontal plate (8) is used to push the push plate (23) to move downward. The push plate (23) pushes the contact block (21) to rotate the pressure plate (19) downward, and the pressure plate (19) presses the photosensitive film on the copper-clad plate.

2. A copper clad laminate processing film laminating machine for circuit board production according to claim 1, characterized in that: The copper clad laminate processing film pasting machine for circuit board production also includes a flattening mechanism, which includes a second guide frame (24), a slide plate (25), a second spring (26), a mounting rod (27), a flattening plate (28), a contact frame (29) and a push block (30). The second guide frame (24) is connected to the top of the mounting platform (1), the slide plate (25) is slidably connected to the second guide frame (24), a second spring (26) is connected between the second guide frame (24) and the slide plate (25), three mounting rods (27) are connected to the bottom of the slide plate (25), the lower ends of the three mounting rods (27) are commonly connected to the flattening plate (28), the top of the slide plate (25) is connected to the contact frame (29), and the sliding plate (6) is connected to the push block (30), the push block (30) is used to push the contact frame (29) to move downward, the contact frame (29) drives the flattening plate (28) to move downward, and the flattening plate (28) flattens the copper clad laminate in the conveying trough (15).

3. A copper clad laminate processing film laminating machine for circuit board production according to claim 2, characterized in that: The copper-clad laminate processing film pasting machine for circuit board production also includes a correction mechanism, which includes a moving plate (31), a third spring (32) and a correction plate (33). The moving plate (31) is slidably connected to three mounting rods (27). The third spring (32) is connected between the slide plate (25) and the moving plate (31). The moving plate (31) is connected to the front and rear sides and the left and right sides with correction plates (33) for correcting the position of the copper-clad laminate in the conveying groove (15). The conveying plate (14) is provided with a receiving groove (34) on the top thereof. The correction plate (33) moves downward and enters the receiving groove (34).

4. A copper clad laminate processing film laminating machine for circuit board production according to claim 3, characterized in that: The copper-clad laminate processing film pasting machine for circuit board production also includes a scraping mechanism, which includes a connecting frame (35) and a scraper (36). The top of the mounting platform (1) is connected to the connecting frame (35), and the bottom of the connecting frame (35) is connected to the scraper (36) for scraping dust on the copper-clad laminate.

5. A copper clad laminate film laminating machine for circuit board production according to claim 4, characterized in that: The copper-clad laminate processing film pasting machine for circuit board production also includes a suction mechanism, which includes a dust suction pump (37), a dust suction pipe (38), a connecting pipe (39) and a dust suction box (40). The dust suction pump (37) is installed in the frame (2). The dust suction end of the dust suction pump (37) is connected to the dust suction pipe (38). The dust suction pipe (38) is connected to the scraper (36). The bottom of the dust suction pipe (38) is connected to three connecting pipes (39). The lower ends of the three connecting pipes (39) are commonly connected to a dust suction box (40) for sucking dust on the copper-clad laminate.

6. A copper clad laminate processing film laminating machine for circuit board production according to claim 1, characterized in that: The bottom of the conveying trough (15) is provided with a circular hole (41).

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