Electronic equipment and preparation method thereof

Abstract

The invention discloses electronic equipment and a preparation method of the electronic equipment, and belongs to the technical field of electronic equipment. The electronic equipment comprises a frame body, a clearance area is arranged in the frame body, the clearance area is provided with a first inner wall and a second inner wall which are oppositely arranged in the first direction, and the first inner wall is sunken towards the side away from the second inner wall; wherein the first direction intersects with the thickness direction of the electronic equipment.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to an electronic equipment and a method for preparing the electronic equipment. Background Art

[0002] The electronic device includes a frame with a receiving cavity, and the battery is arranged in the receiving cavity. As the demand for electronic devices to be thinner and lighter and for larger battery capacity continues to increase, the thickness of the frame continues to decrease, resulting in a reduction in the space of the antenna clearance area in the frame.

[0003] In the related art, a T-shaped cutter is usually used to process inside the frame to form the antenna clearance area. However, the antenna clearance area formed by the above processing method has the problems of small size and high processing difficulty. Summary of the invention

[0004] The present application discloses an electronic device and a method for preparing the electronic device, so as to solve or at least partially solve the problems existing in the prior art, such as small size of antenna clearance area and great processing difficulty.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, the present application discloses an electronic device, comprising a frame having a clearance area therein, wherein along a first direction, the clearance area has a first inner wall and a second inner wall arranged opposite to each other, and the first inner wall is recessed toward a side away from the second inner wall; wherein the first direction intersects with a thickness direction of the electronic device.

[0007] In a second aspect, the present application also discloses a method for preparing an electronic device, the method comprising: providing a frame, wherein the frame has a first side and a second side that are relatively arranged along a second direction, and the frame is placed horizontally along the first direction; forming a first groove by processing the first side along the second direction by a straight knife; rotating the frame so that the first side faces upward and a first angle is formed between the frame and the first direction; processing the first groove along the second direction by a straight knife so that the first groove extends in a direction close to the second side to form a clearance area; wherein the second direction is perpendicular to the first direction.

[0008] The present application discloses an electronic device and a method for preparing the electronic device. The electronic device includes a frame having a clearance area therein. Along a first direction, the clearance area has a first inner wall and a second inner wall that are oppositely arranged. The first inner wall is recessed toward a side away from the second inner wall, wherein the first direction intersects with a thickness direction of the electronic device.

[0009] In the present application, the first inner wall is set to be recessed toward a side away from the second inner wall to increase the space between the first inner wall and the second inner wall, thereby ensuring the space of the clearance area and ensuring the performance of the electronic device antenna.

[0010] Furthermore, through the above arrangement, the frame can be processed by a straight knife to form a clearance area, thereby helping to reduce the processing difficulty of the electronic device and reduce the processing cost of the electronic device.

[0011] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0013] Figure 1 A schematic diagram showing a partial structure of an electronic device described in an embodiment of the present application;

[0014] Figure 2 Schematic diagram showing the processing process of the frame in the embodiment of the present application Figure 1 ;

[0015] Figure 3 Schematic diagram showing the processing process of the frame in the embodiment of the present application Figure 2 ;

[0016] Figure 4 Schematic diagram showing the processing process of the frame in the embodiment of the present application Figure 3 ;

[0017] Figure 5 Schematic diagram showing the processing process of the frame in the embodiment of the present application Figure 4 ;

[0018] Figure 6 Schematic diagram showing the processing process of the frame in the embodiment of the present application Figure 5 ;

[0019] Figure 7 Schematic diagram showing the processing process of the frame in the embodiment of the present application Figure 6 ;

[0020] Figure 8 The process of manufacturing the electronic device described in the embodiment of the present application is shown in FIG. Figure 1 ;

[0021] Fig. 9 The process of manufacturing the electronic device described in the embodiment of the present application is shown in FIG. Figure 2 .

[0022] Reference numerals:

[0023] 10: frame; 11: clearance area; 12: first inner wall; 121: first connecting surface; 122: second connecting surface; 123: transition surface; 13: second inner wall; 131: protrusion; 14: groove;

[0024] 15: first side; 151: first groove; 16: second side; 161: second groove;

[0025] 20: connecting line;

[0026] 30: Filling piece;

[0027] X: first direction; Y: second direction. DETAILED DESCRIPTION

[0028] Embodiments of the present invention will be described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0029] The term "first" or "second" in the specification and claims of the present application may include one or more of the features explicitly or implicitly. In the description of the present invention, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0030] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0031] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] Reference Figure 1 , shows a schematic diagram of the partial structure of the electronic device described in the embodiment of the present application.

[0033] like Figure 1 As shown, an embodiment of the present application discloses an electronic device, which includes a frame 10, wherein the frame 10 has a clearance area 11, and along a first direction X, the clearance area 11 has a first inner wall 12 and a second inner wall 13 that are oppositely arranged, and the first inner wall 12 is recessed toward a side away from the second inner wall 13; wherein the first direction X intersects with a thickness direction of the electronic device.

[0034] like Figure 1 As shown, the embodiment of the present application discloses an electronic device, which can be a mobile phone, a tablet computer, or a watch. In the embodiment of the present application, there are no excessive restrictions on the specific type of the electronic device, and any electronic device that needs to be provided with an antenna can be used.

[0035] The electronic device disclosed in the embodiment of the present application will be specifically described below by taking the electronic device as a mobile phone as an example.

[0036] like Figure 1 As shown, the electronic device disclosed in the embodiment of the present application includes a frame 10, which is arranged on the outside of the electronic device to support and protect the various components of the electronic device. The frame 10 can be made of metal material. Of course, the frame 10 can also be made of other materials. In the embodiment of the present application, there are no excessive restrictions on the specific material of the frame 10. The following will take the frame 10 made of metal material as an example to explain the present application.

[0037] It should be noted that the electronic device disclosed in the embodiment of the present application has a second direction Y extending along the thickness direction of the electronic device, and a first direction X intersecting with the second direction Y. Exemplarily, the second direction Y is perpendicular to the first direction X.

[0038] like Figure 1As shown, the frame 10 in the embodiment of the present application has a clearance area 11. Along the second direction Y, the clearance area 11 runs through the frame 10. Along the first direction X, the clearance area 11 has a first inner wall 12 and a second inner wall 13 that are oppositely arranged. The first inner wall 12 and the second inner wall 13 enclose the clearance area 11.

[0039] It should be noted that the clearance area 11 in the embodiment of the present application, also referred to as the antenna clearance area, refers to the size of the area between the first inner wall 12 and the second inner wall 13. The main function of the clearance area 11 is to keep the metal away from the antenna body, and the resonant frequency can be changed by changing the size of the clearance area 11. In addition, the clearance area 11 can change the division of the antenna near field and far field to a certain extent, thereby affecting the performance of the electronic device antenna.

[0040] like Figure 1 As shown, in the embodiment of the present application, the first inner wall 12 is set to be recessed toward the side away from the second inner wall 13 to increase the distance between the first inner wall 12 and the second inner wall 13, thereby increasing the space of the clearance area 11, ensuring that the space of the clearance area 11 can meet the antenna performance requirements, thereby improving the performance of the electronic device.

[0041] Furthermore, through the above arrangement, the frame can be processed by a straight knife to form a clearance area, thereby helping to reduce the processing difficulty of the electronic device and reduce the processing cost of the electronic device.

[0042] For example, the first inner wall 12 may be configured as a curved structure that is concave toward a side away from the second inner wall 13 to increase the distance between the first inner wall 12 and the second inner wall 13 , thereby increasing the space of the clearance area 11 and improving the performance of the electronic device.

[0043] For another example, the first inner wall 12 is recessed in a direction away from the second inner wall 13 , and includes a first connecting surface 121 and a second connecting surface 122 , an obtuse angle is formed between the first connecting surface 121 and the second connecting surface 122 , and both the first connecting surface 121 and the second connecting surface 122 are planar structures.

[0044] Of course, the above are only individual examples of the specific structure of the first inner wall 12 and are not intended to be limiting of the present application. In actual applications, technicians can also set the specific structure of the first inner wall 12 as needed, as long as the first inner wall 12 is recessed toward the side away from the second inner wall 13.

[0045] The embodiment of the present application discloses an electronic device, which includes a frame 10, wherein a clearance area 11 is provided in the frame 10, wherein the clearance area 11 has a first inner wall 12 and a second inner wall 13 which are arranged opposite to each other along a first direction X, wherein the first inner wall 12 is recessed toward a side away from the second inner wall 13, wherein the first direction X intersects with a thickness direction of the electronic device. In the embodiment of the present application, by setting the first inner wall 12 to be recessed toward a side away from the second inner wall 13, the space between the first inner wall 12 and the second inner wall 13 is increased, thereby ensuring the space of the clearance area 11 and ensuring the antenna performance of the electronic device.

[0046] Furthermore, through the above arrangement, the frame 10 can be processed by a straight knife to form the clearance area 11, thereby helping to reduce the processing difficulty of the electronic device and reduce the processing cost of the electronic device.

[0047] Alternatively, if Figure 1 As shown, the first inner wall 12 in the embodiment of the present application includes a first connecting surface 121 and a second connecting surface 122 , and the angle formed between the first connecting surface 121 and the second connecting surface 122 is an obtuse angle.

[0048] like Figure 1 As shown, the first inner wall 12 in the embodiment of the present application includes a first connecting surface 121 and a second connecting surface 122, and a first angle is formed between the first connecting surface 121 and the second connecting surface 122, and the first angle is an obtuse angle. Exemplarily, the first angle can be 175°, 170°, 165°, 160°, 155°, 150°, 145°, 140°, etc.

[0049] It should be noted that the first connection surface 121 in the embodiment of the present application may be a planar structure or a curved structure. For example, the first connection surface 121 may be a curved structure that is concave in a direction away from the second inner wall 13 .

[0050] Similarly, the second connection surface 122 in the embodiment of the present application may be a planar structure, or a curved structure. For example, the second connection surface 122 may be a curved structure that is concave in a direction away from the second inner wall 13 .

[0051] It should be noted that in the embodiment of the present application, along the thickness direction of the electronic device, that is, the second direction Y, the height of the first connection surface 121 can be the same as the height of the second connection surface 122. Along the thickness direction of the electronic device, the height of the first connection surface 121 can also be different from the height of the second connection surface 122.

[0052] In addition, the angle between the first connection surface 121 and the first direction X may be equal to the angle between the second connection surface 122 and the first direction X. The angle between the first connection surface 121 and the first direction X may also be different from the angle between the second connection surface 121 and the first direction X. In this regard, no specific limitation is made in the embodiments of the present application, and any method belongs to the protection scope of the present application.

[0053] In the embodiment of the present application, the first inner wall 12 is configured to include a first connection surface 121 and a second connection surface 122, and a first angle is formed between the first connection surface 121 and the second connection surface 122, and the first angle is an obtuse angle. The distance between the first inner wall 12 and the second inner wall 13 is increased, thereby increasing the space of the clearance area 11, thereby improving the performance of the electronic device antenna and making the performance of the electronic device better.

[0054] Furthermore, when the battery capacity of the electronic device remains unchanged, through the above arrangement, the thickness of the frame 10 can be reduced while ensuring the space of the clearance area 11, making the electronic device more lightweight.

[0055] Alternatively, if Figure 1 As shown, in the embodiment of the present application, the first inner wall 12 further includes a transition surface 123 , which is connected between the first connecting surface 121 and the second connecting surface 122 , and the transition surface 123 is recessed in a direction away from the second inner wall 13 .

[0056] like Figure 1 As shown, in the embodiment of the present application, the first inner wall 12 further includes a transition surface 123, and the transition surface 123 is connected between the first connecting surface 121 and the second connecting surface 122. The transition surface 123 is recessed in a direction away from the second inner wall 13. The provision of the transition surface 123 can reduce the difficulty of processing the frame 10, thereby reducing the processing cost of the frame 10.

[0057] It should be noted that the transition surface 123 in the embodiment of the present application can be a planar structure or a curved structure. Exemplarily, the transition surface 123 can be a curved structure, and the curved structure is concave in the direction away from the second inner wall 13. The distance between the first inner wall 12 and the second inner wall 13 is increased, thereby increasing the space of the clearance area 11, so as to improve the performance of the electronic device antenna and make the performance of the electronic device better.

[0058] Preferably, if Figure 1 As shown, the transition surface 123 in the embodiment of the present application is recessed in a direction away from the second inner wall 13 .

[0059] As a preferred implementation direction, in the embodiment of the present application, the transition surface 123 can be set to a curved surface structure that is concave in the direction away from the second inner wall 13. This can further increase the distance between the first inner wall 12 and the second inner wall 13, thereby increasing the space of the clearance area 11, thereby improving the antenna performance of the electronic device and making the performance of the electronic device better.

[0060] Furthermore, the transition surface 123 is recessed in a direction away from the second inner wall 13 , which helps to reduce the difficulty of processing the frame 10 , reduce the processing cost of the frame 10 , and improve the process yield of the frame 10 .

[0061] Alternatively, if Figure 1 As shown, a protrusion 131 is provided on the second inner wall 13 in the embodiment of the present application, and a groove 14 is provided on the inner wall of the frame body 10 , and the protrusion 131 and the groove 14 are provided correspondingly; the electronic device also includes a connecting wire 20 , and the connecting wire 20 is provided in the groove 14 .

[0062] like Figure 1 As shown, in the embodiment of the present application, a protrusion 131 is provided on the second inner wall 13, and a groove 14 is provided on the inner wall of the frame 10, and the protrusion 131 and the groove 14 are provided correspondingly. This improves the reliability of the frame 10 and makes the reliability of the frame 10 higher. It is avoided to directly provide the groove 14 on the inner wall of the frame 10, which results in a smaller thickness of the frame 10, affects the strength of the frame 10, and reduces the reliability of the frame 10.

[0063] It should be noted that, along the thickness direction of the electronic device, that is, the second direction Y, the height of the protrusion 131 is greater than the height of the groove 14. It can be understood that, along the first direction X, the groove 14 has a first projection on the plane where the protrusion 131 is located, and the first projection falls into the protrusion 131, so as to ensure the strength of the frame 10 and the reliability of the frame 10.

[0064] Alternatively, if Figure 1 As shown, the electronic device disclosed in the embodiment of the present application further includes a connecting line 20 , and the connecting line 20 is disposed in the groove 14 .

[0065] like Figure 1 As shown, the electronic device disclosed in the embodiment of the present application further includes a connecting wire 20, and the connecting wire 20 is disposed in the groove 14 so as to accommodate the connecting wire 20 through the groove 14. Thus, the internal arrangement of the electronic device is optimized and the use space of the frame 10 is expanded.

[0066] Furthermore, the above arrangement helps to reduce the width of the frame 10 along the first direction X, which helps to increase the capacity of the battery pack while keeping the size of the electronic device unchanged, thereby improving the performance of the electronic device.

[0067] It should be noted that the connecting line 20 in the embodiment of the present application may be a coaxial line, such as Figure 1 As shown, the coaxial line may include two, both of which are disposed in the groove 14 .

[0068] Of course, the above are only examples of specific types of the connecting wire 20. In the embodiment of the present application, there are no excessive restrictions on the specific types of the connecting wire 20. In actual applications, technicians can choose according to their needs.

[0069] Alternatively, if Figure 1 As shown, the electronic device disclosed in the embodiment of the present application further includes a filling member 30 , and the filling member 30 is filled in the clearance area 11 .

[0070] like Figure 1 As shown, in the embodiment of the present application, a filler 30 is disposed in the clearance area 11 enclosed by the first inner wall 12 and the second inner wall 13 , so as to enhance the strength of the frame 10 through the filler 30 , thereby improving the reliability of the frame 10 .

[0071] For example, plastic may be filled in the clearance area 11 between the first inner wall 12 and the second inner wall 13 by nano injection molding to enhance the strength of the frame 10 through the plastic, thereby improving the strength of the frame 10 and increasing the reliability of the frame 10.

[0072] It should be noted that, in the embodiment of the present application, other materials can also be filled in the clearance area 11 between the first inner wall 12 and the second inner wall 13 by injection molding to enhance the strength of the frame 10, make the frame 10 lighter, and improve the reliability of the frame 10. In the embodiment of the present application, there are no excessive restrictions on the specific material of the filling member 30. In actual applications, technicians can choose according to needs.

[0073] Exemplarily, the filling member 30 in the embodiment of the present application includes a plastic member or a silicone member.

[0074] The filler 30 in the embodiment of the present application may be a plastic part, a silicone part, or other materials that are convenient for injection molding. In this regard, the embodiment of the present application does not make too many restrictions, and in actual applications, technicians can choose according to needs.

[0075] Alternatively, if Figure 1 As shown, in the embodiment of the present application, along the thickness direction of the electronic device, that is, the second direction Y, the height of the filling member 30 is flush with the height of the second inner wall 13 .

[0076] like Figure 1As shown, along the thickness direction of the electronic device, that is, the second direction Y, the height of the filler 30 is set to be flush with the height of the second inner wall 13 to optimize the appearance of the electronic device and avoid appearance quality problems such as discoloration and whitening of the electronic device.

[0077] For example, after filling the clearance area 11 between the first inner wall 12 and the second inner wall 13 with plastic by nano injection molding, the front and back sides of the frame 10 can be finely milled so that the height of the filling piece 30 is flush with the height of the second inner wall 13, thereby improving the appearance of the frame 10 and enhancing the appearance of the electronic device, thereby avoiding appearance quality problems such as discoloration and whitening of the electronic device.

[0078] An embodiment of the present application discloses an electronic device, which includes a frame having a clearance area therein. Along a first direction, the clearance area has a first inner wall and a second inner wall that are oppositely arranged, and the first inner wall is recessed toward a side away from the second inner wall, wherein the first direction intersects with a thickness direction of the electronic device.

[0079] In the embodiment of the present application, the first inner wall is set to be recessed toward the side away from the second inner wall to increase the space between the first inner wall and the second inner wall, thereby ensuring the space of the clearance area and ensuring the performance of the electronic device antenna.

[0080] Furthermore, through the above arrangement, the frame can be processed by a straight knife to form a clearance area, thereby helping to reduce the processing difficulty of the electronic device and reduce the processing cost of the electronic device.

[0081] Reference Figure 2 , showing a schematic diagram of the processing process of the frame in the embodiment of the present application Figure 1 ;reference Figure 3 , showing a schematic diagram of the processing process of the frame in the embodiment of the present application Figure 2 ;reference Figure 4 , showing a schematic diagram of the processing process of the frame in the embodiment of the present application Figure 3 ;reference Figure 5 , showing a schematic diagram of the processing process of the frame in the embodiment of the present application Figure 4 ;reference Figure 6 , showing a schematic diagram of the processing process of the frame in the embodiment of the present application Figure 5 ;reference Figure 7 , showing a schematic diagram of the processing process of the frame in the embodiment of the present application Figure 6 ;reference Figure 8 , showing the process of preparing the electronic device described in the embodiment of the present application Figure 1 ;reference Fig. 9 , showing the process of preparing the electronic device described in the embodiment of the present application Figure 2 .

[0082] The following will be combined Figures 2 to 9 , a brief description is given of the method for preparing the electronic device in the embodiment of the present application.

[0083] like Figure 8 As shown, the embodiment of the present application discloses a method for preparing an electronic device, the method comprising:

[0084] 101 , providing a frame 10 , along a second direction Y, the frame 10 has a first side 15 and a second side 16 that are oppositely arranged, and placing the frame 10 horizontally along the first direction X.

[0085] The frame 10 in the embodiment of the present application is arranged outside the electronic device, and the frame 10 supports and protects various parts of the electronic device. The frame 10 can be made of metal or other materials. In the embodiment of the present application, there are no excessive restrictions on the specific material of the frame 10. In actual applications, technicians can choose according to needs.

[0086] The following will take the case where the frame 10 is made of metal as an example to explain the present application.

[0087] It should be noted that the electronic device disclosed in the embodiment of the present application has a second direction Y extending along the thickness direction of the electronic device, and a first direction X intersecting with the second direction Y. Exemplarily, the second direction Y is perpendicular to the first direction X.

[0088] 102 , along the second direction Y, a first groove 151 is formed on the first side 15 by machining with a straight knife.

[0089] The frame 10 is clamped by a clamp, and the first side 15 of the frame 10 is placed upward. A first groove 151 is formed by machining the first side 15 with a straight knife. The first groove 151 extends along the second direction Y, and the first groove 151 does not pass through the frame 10.

[0090] The straight knife in the embodiment of the present application refers to a knife extending along the second direction Y. For example, the knife is a cylindrical structure, and the axis of the cylindrical knife extends along the second direction Y. Of course, the above are only individual examples of the specific structure of the knife, and are not intended to be limiting of the present application. In actual applications, technicians can also select a suitable knife according to needs.

[0091] 103 , rotate the frame 10 so that the first side 15 faces upward and a first angle is formed between the frame 10 and the first direction X.

[0092] The frame 10 is clamped by a clamp and rotated so that the first side 15 of the frame 10 faces upward and a first angle is formed between the frame 10 and the first direction X.

[0093] It should be noted that the first angle in the embodiment of the present application is greater than or equal to 0° and less than or equal to 45°. For example, the first angle may be 0°, 10°, 20°, 30°, 40°, 45°, etc.

[0094] 104 , along the second direction Y, use a straight knife to process the first groove 151 so that the first groove 151 extends toward the direction close to the second side 16 to form a clearance area 11 . The second direction Y is perpendicular to the first direction X.

[0095] It should be noted that the clearance area 11 formed in the embodiment of the present application may penetrate the frame 10 or may not penetrate the frame 10. In actual applications, technicians may set it as needed.

[0096] The method for preparing the electronic device disclosed in the embodiment of the present application can use a straight knife to process the frame 10 to form the clearance area 11, thereby helping to reduce the difficulty of processing the electronic device and reduce the processing cost of the electronic device.

[0097] like Fig. 9 As shown, the embodiment of the present application discloses a method for preparing an electronic device, the method comprising:

[0098] 201 , provide a frame 10 , along a second direction Y, the frame 10 has a first side 15 and a second side 16 that are oppositely arranged, and place the frame 10 horizontally along the first direction X.

[0099] The frame 10 in the embodiment of the present application is arranged on the outside of the electronic device, and the frame 10 supports and protects various parts of the electronic device. The frame 10 can be made of metal material or other materials. In the embodiment of the present application, there are no excessive restrictions on the specific material of the frame 10. In actual applications, technicians can choose according to needs. The following will take the frame 10 made of metal material as an example to explain the present application.

[0100] It should be noted that the electronic device disclosed in the embodiment of the present application has a second direction Y extending along the thickness direction of the electronic device, and a first direction X intersecting with the second direction Y. Exemplarily, the second direction Y is perpendicular to the first direction X.

[0101] 202 , a first groove 151 is formed on the first side 15 of the frame 10 by a straight knife along the second direction Y. At this time, the first groove 151 extends along the second direction Y, and the first groove 151 does not penetrate the frame 10 .

[0102] The straight knife in the embodiment of the present application refers to a knife extending along the second direction Y. For example, the knife is a cylindrical structure, and the axis of the cylindrical knife extends along the second direction Y. Of course, the above are only individual examples of the specific structure of the knife, and are not intended to be limiting of the present application. In actual applications, technicians can also select a suitable knife according to needs.

[0103] 203 , rotate the frame 10 to place it horizontally along the first direction X with the second side 16 facing upward, and form a second groove 161 on the second side 16 by machining with a straight knife. The second groove 161 and the first groove 151 are arranged opposite to each other along the second direction Y.

[0104] The frame 10 is clamped at an angle and rotated. The frame 10 is placed horizontally along the first direction X, with the second side 16 facing upward. The frame 10 is processed by a straight knife to form a second groove 161 on the second side 16 of the frame 10, and the second groove 161 extends along the second direction Y. In addition, along the second direction Y, the second groove 161 is arranged opposite to the first groove 151. It should be noted that the second groove 161 does not penetrate the first groove 151.

[0105] 204 , rotate the frame 10 so that the first side 15 of the frame 10 faces upward and a first angle is formed between the frame 10 and the first direction X.

[0106] The frame 10 is clamped by a clamp and rotated so that the first side 15 of the frame 10 faces upward and a first angle is formed between the frame 10 and the first direction X.

[0107] It should be noted that the first angle in the embodiment of the present application is greater than or equal to 0° and less than or equal to 45°. For example, the first angle may be 0°, 10°, 20°, 30°, 40°, 45°, etc.

[0108] 205 , along the second direction Y, the first groove 151 is processed by a straight knife so that the first groove 151 extends toward the direction close to the second groove 161 . At this time, the first groove 151 is at least partially bent.

[0109] 206 , the frame body 10 is rotated again so that the second side 16 of the frame body 10 faces upward, and a second angle is formed between the frame body 10 and the first direction X.

[0110] The frame 10 is clamped by a clamp and rotated so that the second side 16 of the frame 10 faces upward and a second angle is formed between the frame 10 and the first direction X.

[0111] It should be noted that the second angle in the embodiment of the present application is greater than or equal to 0° and less than or equal to 45°. For example, the second angle can be 0°, 10°, 20°, 30°, 40°, 45°, etc.

[0112] 207 , along the second direction Y, the second groove 161 is processed by a straight knife, so that the second groove 161 extends toward the direction close to the first groove 151 , and the second groove 161 is connected with the first groove 151 to form a clearance area 11 .

[0113] The method for preparing the electronic device disclosed in the embodiment of the present application can use a straight knife to process the frame 10 to form the clearance area 11, thereby helping to reduce the difficulty of processing the electronic device and reduce the processing cost of the electronic device.

[0114] The method for preparing the electronic device disclosed in the embodiment of the present application also includes:

[0115] A filling piece 30 is formed in the clearance area 11 by injection molding.

[0116] For example, in the embodiment of the present application, plastic can be filled in the clearance area 11 between the first inner wall 12 and the second inner wall 13 by nano injection molding to form a filling member 30. The strength of the frame 10 is enhanced by the filling member 30, so that the strength of the frame 10 is better and the reliability of the frame 10 is higher.

[0117] It should be noted that the injection molding method in the embodiment of the present application is not limited to nano injection molding, and other materials can also be filled in the clearance area 11 between the first inner wall 12 and the second inner wall 13 by other injection molding methods to enhance the strength of the frame 10, make the frame 10 lighter, and improve the reliability of the frame 10. In addition, in the embodiment of the present application, there are no excessive restrictions on the specific material of the filler 30. In actual applications, technicians can choose according to needs.

[0118] The first side 15 and the second side 16 of the frame 10 are finely milled so that the height of the filling piece 30 is flush with the height of the clearance area 11 .

[0119] In the embodiment of the present application, the first side 15 and the second side 16 of the frame 10 can be finely milled so that the height of the filling piece 30 is flush with the height of the clearance area 11, thereby improving the appearance of the frame 10, thereby improving the appearance of the electronic device and avoiding appearance quality problems such as discoloration and white exposure in the electronic device.

[0120] It should be noted that, in the embodiment of the present application, the groove 14 can also be formed on the inner wall of the frame 10 by using a T-shaped tool to complete the overall processing of the frame 10 .

[0121] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0122] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: A frame (10), wherein the frame (10) has a clearance area (11), and along a first direction (X), the clearance area (11) has a first inner wall (12) and a second inner wall (13) arranged opposite to each other, and the first inner wall (12) is recessed toward a side away from the second inner wall (13); Wherein, the first direction (X) intersects with the thickness direction of the electronic device.

2. The electronic device according to claim 1, characterized in that: The first inner wall (12) comprises a first connecting surface (121) and a second connecting surface (122), and the angle formed between the first connecting surface (121) and the second connecting surface (122) is an obtuse angle.

3. The electronic device according to claim 2, characterized in that: The first inner wall (12) further comprises a transition surface (123), wherein the transition surface (123) is connected between the first connecting surface (121) and the second connecting surface (122); The transition surface (123) is recessed in a direction away from the second inner wall (13).

4. The electronic device according to claim 1, characterized in that: The second inner wall (13) is provided with a protrusion (131), the inner wall of the frame body (10) is provided with a groove (14), and the protrusion (131) and the groove (14) are arranged correspondingly; The electronic device further comprises a connecting wire (20), wherein the connecting wire (20) is arranged in the groove (14).

5. The electronic device according to any one of claims 1 to 4, characterized in that: The electronic device further comprises a filling piece (30), wherein the filling piece (30) is filled in the clearance area (11).

6. The electronic device according to claim 5, characterized in that: The filling piece (30) comprises one of a plastic piece and a silicone piece.

7. The electronic device according to claim 5, characterized in that: Along the thickness direction of the electronic device, the height of the filling piece (30) is flush with the height of the second inner wall (13).

8. A method for preparing an electronic device, characterized in that: The method comprises: Providing a frame (10), wherein along a second direction (Y), the frame (10) has a first side (15) and a second side (16) that are arranged opposite to each other, and placing the frame (10) horizontally along the first direction (X); Along the second direction (Y), forming a first groove (151) on the first side (15) by machining with a straight knife; Rotating the frame (10) so that the first side (15) faces upward and a first angle is formed between the frame (10) and the first direction (X); machining the first groove (151) by a straight knife along the second direction (Y), so that the first groove (151) extends toward a direction close to the second side (16), so as to form a clearance area (11); The second direction (Y) is perpendicular to the first direction (X).

9. The method for preparing an electronic device according to claim 8, characterized in that: After forming the first groove (151) by machining the first side (15) along the second direction (Y) with a straight knife, the method further comprises: The frame (10) is rotated so that the frame (10) is placed horizontally along the first direction (X) with the second side (16) facing upwards, and a second groove (161) is formed on the second side (16) by machining with a straight knife, and the second groove (161) and the first groove (151) are arranged opposite to each other along the second direction (Y); After machining the first groove (151) along the second direction (Y) by a straight knife so that the first groove (151) extends in a direction close to the second side (16), the method further comprises: Rotating the frame (10) again so that the second side (16) faces upward and a second angle is formed between the frame (10) and the first direction (X); The second groove (161) is machined along the second direction (Y) by a straight knife so that the first groove (151) and the second groove (161) are connected to form the clearance area (11).

10. The method for preparing an electronic device according to claim 8 or 9, characterized in that: The method further comprises: Forming a filling piece (30) in the clearance area (11) by injection molding; The first side (15) and the second side (16) are finely milled so that the height of the filling piece (30) is flush with the height of the clearance area (11).

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