Radiator circuit

Abstract

The invention belongs to the field of radiators, and particularly relates to a radiator circuit which comprises a cooling fin driving module, a fan driving module, a fantasy color lamp module, an MIC module and an MCU module, and cooling fins, a fan, the fantasy color lamp module and the MIC module are all connected with the MCU module. According to the invention, through the arrangement of the cooling fin driving module and the fan driving module, the cooling fin driving module can be controlled through the MCU module to drive the cooling fins to work and the fan driving module to drive the fan to work according to needs, so that cooling is carried out through the cooperation of the fan and the cooling fins, multiple cooling modes are integrated, and the cooling effect is better; besides, a fantasy color lamp module and an MIC module are integrated in the radiator circuit, so that the radiator circuit can have a sound control function and a colorful light function, and the radiator circuit is rich in function and can better meet the use requirements of users.

Description

Technical Field

[0001] The invention belongs to the field of radiators, and in particular relates to a radiator circuit. Background Art

[0002] If the heat generated by computers and other devices during operation cannot be effectively discharged, the temperature will rise, triggering the temperature protection mechanism, resulting in performance degradation, system crashes, and even damage to components. Therefore, computers and other devices are often equipped with radiators to solve this problem, so as to ensure that the temperature of the device is maintained within the normal range by transferring the heat generated by the device during operation in a timely manner.

[0003] There are several problems with common radiator products on the market:

[0004] 1. Low heat dissipation efficiency: Traditional radiators have a single heat dissipation method, such as heat dissipation through fans or cooling fins alone, and the heat dissipation efficiency is low.

[0005] 2. Lack of fashion and interest: The radiators currently on the market only have the function of heat dissipation, and the functions are monotonous. With the development of society, users' demands for radiators are becoming more and more diversified. Therefore, the existing radiators cannot meet user needs well. Summary of the invention

[0006] In order to solve the above problems, the primary purpose of the present invention is to provide a heat sink circuit, which integrates multiple heat dissipation methods and has a better heat dissipation effect.

[0007] Another object of the present invention is to provide a heat sink circuit which has rich functions and can better meet the needs of users.

[0008] In order to achieve the above object, the technical solution of the present invention is as follows.

[0009] A heat sink circuit, comprising:

[0010] A heat sink driving module for driving the heat sink to work;

[0011] A fan driving module for driving a fan to work;

[0012] A colorful light module with colorful lighting effects;

[0013] MIC module for collecting external sound signals;

[0014] An MCU module is used to control a heat sink driving module, a fan driving module, and a magic light module. The heat sink, the fan, the magic light module, and the MIC module are all connected to the MCU module.

[0015] In the radiator circuit, by providing a heat sink driving module and a fan driving module, the heat sink driving module can be controlled by the MCU module to drive the heat sink to work, and the fan driving module can drive the fan to work, so that the fan and the heat sink cooperate to dissipate heat, and a variety of heat dissipation methods are integrated to achieve better heat dissipation effects. In addition, a colorful light module and a MIC module are also integrated in the radiator circuit, so that the radiator circuit can have a voice control function and a colorful light function. The circuit is rich in functions and can better meet the user's needs.

[0016] Specifically, the control process of the magic light module of the circuit is as follows: the MCU module processes and analyzes the electrical signal data of the MIC module in real time to drive the magic light module to work, and can control the magic light module to display different lighting effects as the volume of external sound changes, so that the magic light produces a rhythmic effect, enriching the interaction mode and making the product fashionable and interesting.

[0017] Furthermore, the circuit also includes a display module for displaying the temperature of the heat sink, and the display module is connected to the MCU module.

[0018] Furthermore, the circuit also includes a Program module for firmware upgrade, and the Program module is connected to the MCU module.

[0019] Furthermore, the circuit also includes an LDO module for converting an external input voltage into a stable voltage to power each module.

[0020] Furthermore, the circuit also includes a TYPEC interface module for an external power supply and an anti-backflow module for preventing charging backflow current. The LDO module and the anti-backflow module are both connected to the TYPEC interface module, and the anti-backflow module is connected to the MCU module.

[0021] Furthermore, the MUC module includes a main control chip for controlling a heat sink driving module, a fan driving module, a fantasy light module, and dynamically identifying a fast charging protocol to control different voltage outputs of an external power supply connected to the TYPEC interface module.

[0022] Furthermore, the backflow prevention module includes an NMOS tube Q6, an NMOS tube Q7, a resistor R15, and a resistor R17, one end of the resistor R15 is connected to one end of the resistor R17, the other end of the resistor R17 is grounded, and the other end of the resistor R15 is connected to the LDO module;

[0023] The gate of the NMOS tube Q6 is connected to one end of the resistor R15 and one end of the resistor R17, the drain of the NMOS tube Q6 is connected to the TYPEC interface module, and the source of the NMOS tube Q6 is connected to the MCU module.

[0024] The gate of the NMOS tube Q7 is connected to one end of the resistor R15 and one end of the resistor R17, the drain of the NMOS tube Q7 is connected to the TYPEC interface module, and the source of the NMOS tube Q7 is connected to the MCU module.

[0025] Furthermore, the MIC module includes:

[0026] MIC for receiving external sound signals;

[0027] The PMOS tube Q3 is used to control the MIC switch, the drain of the PMOS tube Q3 is connected to the positive electrode of the MIC, the source of the PMOS tube Q3 is connected to the power input terminal, and the gate of the PMOS tube Q3 is connected to the switch control terminal MIC_POWER_EN, and the switch control terminal MIC_POWER_EN is connected to the MCU module.

[0028] Furthermore, the MIC module also includes a signal amplifying circuit for amplifying the electrical signal converted by the MIC, the signal amplifying circuit is connected to the MIC, and the signal amplifying circuit is connected to a signal output terminal MIC_AD for connecting to the MCU module.

[0029] Furthermore, the signal amplification circuit includes a capacitor C30 for filtering and a transistor Q2 for amplifying the electrical signal;

[0030] The base of the transistor Q2 is connected in series with the capacitor C30 and then connected to the positive electrode of MIC. The collector of the transistor Q2 is connected to the signal output terminal MIC_AD.

[0031] The beneficial effect of the present invention lies in that, in the radiator circuit, by providing a heat sink driving module and a fan driving module, the heat sink driving module can be controlled by the MCU module to drive the heat sink to work and the fan driving module to drive the fan to work as needed, so that heat is dissipated by the cooperation of the fan and the heat sink, and a variety of heat dissipation methods are integrated to achieve better heat dissipation effect; in addition, a colorful light module and a MIC module are also integrated in the radiator circuit, so that the radiator circuit can have a voice control function and a colorful light function. The circuit is rich in functions and can better meet the user's usage needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a circuit module block diagram of the present invention.

[0033] Figure 2 It is a circuit schematic diagram of the MCU module of the present invention.

[0034] Figure 3 It is a circuit schematic diagram of the fan driving module of the present invention.

[0035] Figure 4 It is a circuit schematic diagram of the heat sink driving module of the present invention.

[0036] Figure 5 It is a circuit schematic diagram of the TYPEC interface module of the present invention.

[0037] Figure 6 It is a circuit principle diagram of the backflow prevention module of the present invention.

[0038] Figure 7 1 is a circuit schematic diagram of the LDO circuit of the present invention.

[0039] Figure 8 It is a circuit schematic diagram of the VSEL circuit of the present invention.

[0040] Fig. 9 It is a circuit principle diagram of the display module of the present invention.

[0041] Fig.10 It is a circuit schematic diagram of the Program module of the present invention.

[0042] Fig.11 This is the circuit schematic of the MIC module.

[0043] Fig.12 This is the circuit schematic diagram of the colorful light module.

[0044] Fig.13 This is the system structure diagram of the main control chip.

[0045] Fig.14 This is the pin arrangement diagram of the main control chip. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0047] See also Figure 1-14 , this embodiment provides a heat sink circuit, including:

[0048] A heat sink driving module for driving the heat sink to work;

[0049] A fan driving module for driving a fan to work;

[0050] A colorful light module with colorful lighting effects;

[0051] MIC module for collecting external sound signals;

[0052] The MCU module is used to control the heat sink driver module, fan driver module, and colorful light module. The heat sink, fan, colorful light module, and MIC module are all connected to the MCU module. Figure 3 , Figure 4 It can be seen that the fan driver module is connected to the fan through the J2 interface, and the heat sink driver module is connected to the heat sink through the J4 interface.

[0053] In the radiator circuit, by providing a heat sink driving module and a fan driving module, the heat sink driving module can be controlled by the MCU module to drive the heat sink to work, and the fan driving module can drive the fan to work, so that the fan and the heat sink cooperate to dissipate heat, and a variety of heat dissipation methods are integrated to achieve better heat dissipation effects. In addition, a colorful light module and a MIC module are also integrated in the radiator circuit, so that the radiator circuit can have a voice control function and a colorful light function. The circuit is rich in functions and can better meet the user's needs.

[0054] In this embodiment, the circuit further includes a display module for displaying the temperature of the heat sink, and the display module is connected to the MCU module.

[0055] In this embodiment, the circuit further includes a Program module for firmware upgrade, and the Program module is connected to the MCU module.

[0056] In this embodiment, the circuit further includes an LDO module for converting an external input voltage into a stable voltage to power each module.

[0057] In this embodiment, the circuit further includes an LDO circuit for converting an external input voltage into a stable 3.3V voltage and a VSEL circuit for converting the 3.3V voltage into a 9V voltage, and the LDO circuit is connected to the VSEL circuit.

[0058] In this embodiment, the circuit also includes a TYPEC interface module for an external power supply and an anti-backflow module for preventing charging backflow current. The LDO module and the anti-backflow module are both connected to the TYPEC interface module, and the anti-backflow module is connected to the MCU module.

[0059] In this embodiment, the MUC module includes a main control chip for controlling a heat sink driving module, a fan driving module, a colorful light module, and dynamically identifying a fast charging protocol to control different voltage outputs of an external power supply connected to the TYPEC interface module.

[0060] In this embodiment, the backflow prevention module includes an NMOS tube Q6, an NMOS tube Q7, a resistor R15, and a resistor R17. One end of the resistor R15 is connected to one end of the resistor R17, the other end of the resistor R17 is grounded, and the other end of the resistor R15 is connected to the LDO module.

[0061] The gate of the NMOS tube Q6 is connected to one end of the resistor R15 and one end of the resistor R17, the drain of the NMOS tube Q6 is connected to the TYPEC interface module, and the source of the NMOS tube Q6 is connected to the MCU module.

[0062] The gate of the NMOS tube Q7 is connected to one end of the resistor R15 and one end of the resistor R17, the drain of the NMOS tube Q7 is connected to the TYPEC interface module, and the source of the NMOS tube Q7 is connected to the MCU module.

[0063] In this embodiment, the MIC module includes:

[0064] MIC for receiving external sound signals;

[0065] The PMOS tube Q3 is used to control the MIC switch, the drain of the PMOS tube Q3 is connected to the positive electrode of the MIC, the source of the PMOS tube Q3 is connected to the power input terminal, the gate of the PMOS tube Q3 is connected to the switch control terminal MIC_POWER_EN, and the switch control terminal MIC_POWER_EN is connected to the MCU module.

[0066] In this embodiment, the MIC module further includes a signal amplifying circuit for amplifying the electrical signal converted by the MIC. The signal amplifying circuit is connected to the MIC, and the signal amplifying circuit is connected to a signal output terminal MIC_AD for connecting to the MCU module.

[0067] In this embodiment, the signal amplification circuit includes a capacitor C30 for filtering and a transistor Q2 for amplifying the electrical signal;

[0068] The base of the transistor Q2 is connected in series with the capacitor C30 and then connected to the positive electrode of MIC. The collector of the transistor Q2 is connected to the signal output terminal MIC_AD.

[0069] The working principle of this embodiment is as follows:

[0070] 1. MCU module:

[0071] The MCU module is the main control part of the present invention, wherein the main control chip adopts AD18F128 chip, SSOP24 package. The VDD33 part of the main control chip requires 3.3V power supply (pin 6), and the power supply voltage is provided by an external power supply.

[0072] The AD18F128 chip is connected to the magic light module by two signal lines, one of which is used to connect the signal line of the magic light module, and the other is used to connect the power control line of the magic light module. In the present invention, each magic light module lamp bead can be controlled separately; through the cooperation of the two signal lines, it is ensured that the MCU module can correctly send commands and data to the magic light module, and control the magic light module to display different lighting effects, so as to achieve personalized lighting effect display:

[0073] a.LED_IO: The on / off switch signal line of the magic light module. When the power line of the magic light module is connected and the MCU module sends a high level, the magic light module is turned on.

[0074] b.LED_POWER_EN: The power line of the colorful light module is connected to a MOS circuit. The power switch of the colorful light module is controlled by controlling the on and off of the MOS. The colorful light module is controlled to be in the off state when it is not needed to achieve low power consumption.

[0075] The AD18F128 chip is connected to the display module through 6 signal lines. Through the coordinated cooperation of the 6 signal lines, it is ensured that the MCU module can correctly send commands and data to the digital tube and control the display module to display the current temperature of the heat sink.

[0076] The AD18F128 chip is connected to the fan driver module via a signal line (pin 22) for controlling the start and stop of the fan.

[0077] The AD18F128 chip is connected to the heat sink driver module via a signal line (pin 21) for controlling the start and stop of the heat sink.

[0078] The present invention has a voice interaction function, and is connected to the MIC_AD (pin 2) and MIC_POWER_EN (pin 1) of the MIC module through the MCU module. When the microphone of the MIC collects external sound signals, the sound signals are converted into analog signals, and then amplified, and the MCU module collects the signals through MIC_AD. MIC_POWER_EN is used to control the operation of the triode. When MIC_POWER_EN receives a high level, the triode with amplification function is turned on, and the signal amplified by the triode will be more easily collected by MIC_AD. When the MCU module receives different voltages, it will drive the magic light module to display different lighting effects.

[0079] The AD18F128 chip uses the I2C communication interface to connect to the Program module. Through SDA and SCL (pins 4 and 5), users can upgrade the firmware of the MCU module.

[0080] The AD18F128 chip is connected to the VSEL circuit through the VSEL pin (pin 18). The power supply voltage can be stably output to 3.3V after passing through the LDO circuit and then given to the VSEL circuit. After passing through the VSEL circuit, 3.3V becomes 9V and is output to the MCU module.

[0081] The AD18F128 chip is connected to the TYPEC module through the CC1, CC2, DM, and DP pins. The connection of the above signal lines ensures that the MCU module correctly identifies and connects to the TYPEC interface module, so that power can be supplied normally.

[0082] 2. MIC module:

[0083] The MIC module receives external sound signals through the microphone. After analog conversion, the sound signals are filtered by capacitors and amplified by transistor amplifiers. The signals are then transmitted to the MCU module through the MIC_AD pin. After analysis and processing, the MCU module sends relevant instructions to the fantasy light module, and the fantasy light module will display the corresponding lighting effects. The external sound volume is different, and the voltage collected by the MCU module is also different, so the lighting effects displayed by the fantasy light module are also different. A PMOS tube is also added to the circuit, and its function is to achieve low power consumption. That is, when the microphone is not triggered, the MCU module will control MIC_POWER_EN to output a high or low level to control the transistor amplifier circuit.

[0084] 3. TYPEC module, anti-backflow module

[0085] This circuit includes a TYPEC interface module and an anti-backflow module for preventing charging backflow current. The TYPEC interface module is connected to the DP and DM pins of the MCU module to identify the USB protocol, that is, whether the TYPEC interface module is correctly connected. The TYPEC interface module is connected to the anti-backflow module for preventing charging backflow current through TypeC_CC1 and TypeC_CC2 to prevent charging backflow current. The CC1 and CC2 pins of the anti-backflow module for preventing charging backflow current are then connected to the MCU module for charging. The entire charging process uses the PD protocol, that is, when the TYPEC interface module is connected to the MCU module, the two devices begin the device identification process, which is realized through the change of VBUS voltage, the level signal of the CC pin and other mechanisms. Through this process, the power supply end can understand the basic power requirements of the device. After the device identification is completed, the radiator will send a power request to the power supply device through the DM and DP data channels. After receiving the power request, the power supply device will evaluate whether its own capabilities meet the request. If the conditions are met, the power supply device will send an acceptance response; if not, it may send a rejection or propose a compromise power supply plan for negotiation. This process may involve multiple round-trip communications until both parties reach an agreement. Once the power supply parameters are negotiated successfully, the two parties will conduct a protocol handshake. This process ensures the synchronization and coordination of the two devices during the power transmission process, laying the foundation for subsequent stable power supply.

[0086] The pull-down resistors on CC1 and CC2 of the Type-C interface module are used to implement the device's insertion detection and power supply negotiation functions. When the device acts as a power receiving end, it configures pull-down resistors Rd on the CC1 and CC2 pins. In this way, when the Type-C plug is inserted into the socket, the CC pin is connected to the ground wire through the pull-down resistor Rd, and the voltage of the CC pin is 0V. The system determines the device's insertion status and role by detecting the voltage change on the CC pin.

[0087] 4. Display module

[0088] The display module is specifically a digital tube, which is connected to the MCU module through SWG1, SWG2, SWG3, and SWG4, receives instructions from the MCU module, and is used to display the current temperature of the heat sink.

[0089] 5. Magic light module

[0090] The magic light module can receive signals from the MCU module, and the MCU module issues specific instructions to drive the magic light module to display specific lighting effects. The magic light module is connected to the AD18F128 chip by two signal lines, one of which is used to connect the signal line of the magic light module, and the other is used to connect the power control line of the magic light module. When the power line of the magic light module is connected, when the MCU module sends a high level through the magic light module on and off switch signal line, the magic light module is lit. The magic light module power line is connected to a MOS circuit, and the power switch control of the magic light module is realized by controlling the conduction and closing of the MOS, so as to control the magic light module to be in a closed state when it is not needed to work, so as to achieve low power consumption. In the present invention, each lamp bead of the magic light module can be controlled separately; through the cooperation of the two signal lines, it is ensured that the MCU module can correctly send commands and data to the magic light module, and control the magic light module to display different lighting effects, so as to achieve personalized lighting effect display. When the brightness of the lamp beads of the magic light module is different, the combined lighting effect is also different, and each LED chip can work separately.

[0091] 6. Fan Control Module

[0092] By receiving instructions from the MCU module, the fan is controlled to achieve the heat dissipation function of the device. When FAN_IO receives a high level, the fan starts working.

[0093] 7. Heat sink control module

[0094] The heat sink is controlled by receiving instructions from the MCU module. The heat sink is connected to the MCU module through Cooler_IO and receives instructions from the MCU module. When Cooler_IO receives a high level, the heat sink starts to dissipate heat.

[0095] 8. LDO module

[0096] The LDO module includes an LDO circuit and a VSEL circuit. The LDO circuit is composed of an LN1179P332MR linear regulator. One end of the LDO circuit is connected to the VIN pin of TYPEC, that is, the power supply voltage is transmitted to the LDO circuit through the TYPEC module, and the other end is connected to the 3V3 pin of VSEL. The battery voltage can be converted into a stable voltage output after passing through the LDO, and then converted into a 9V voltage after being given to the VSEL. The VSEL circuit is then connected to the MCU module and other modules through the VSEL pin to provide power to the MCU module and other modules.

[0097] 9. Program Module

[0098] In the present invention, the firmware is upgraded through the Program module, and the DAT and CLK pins are connected to the MCU module, so the firmware upgrade can be flexibly performed.

[0099] The working process is:

[0100] First, connect the TYPEC interface module to realize power supply. The power supply voltage passes through the anti-backflow module, and then to the LDO regulator to output a stable 3.3V voltage, and then to the VSEL voltage selection circuit to output a 9V voltage to the AD18F128 chip. After the AD18F128 chip is connected to the TYPEC interface module, it communicates with the charging chip at the TYPEC interface module end through the PD protocol. After communication, the MCU module will determine whether the charger supports the fast charging protocol. If it does, the charging chip at the TYPEC interface module end outputs a high voltage. If it does not, it outputs a low voltage, and the voltage is given to the AD18F128 chip. After the AD18F128 chip gets the voltage, it starts to work. It will read the resistance of the NTC thermistor of the heat sink to get the current temperature of the heat sink, and display the temperature value on the digital tube. At the same time, the AD18F128 chip will determine whether the temperature exceeds the set threshold according to the program. If it exceeds, the fan speed will be adjusted to be faster and the heat sink will start working. The AD18F128 chip will detect the temperature cyclically and update the changed temperature to the digital tube. If it does not exceed the threshold, the AD18F128 chip controls the fan and heat sink to remain in their original state. In addition, when the AD18F128 chip is in working state, the AD18F128 chip will detect in real time whether the microphone is triggered. If it is triggered, the AD18F128 chip will perform analog conversion according to the sound signal transmitted by the microphone, analyze and process it, and then drive the magic light module to display the corresponding light effect according to the obtained data. If the volume of the external sound changes, the light effect of the magic light module will also change, so it will present a rhythmic effect. If it is not triggered, the AD18F128 chip will continue to maintain the detection state. When the heat sink disconnects the TYPEC interface module, the AD18F128 chip stops working because there is no power supply.

[0101] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat sink circuit, characterized in that: include: A heat sink driving module for driving the heat sink to work; A fan driving module for driving a fan to work; A colorful light module with colorful lighting effects; MIC module for collecting external sound signals; An MCU module is used to control a heat sink driving module, a fan driving module, and a magic light module. The heat sink, the fan, the magic light module, and the MIC module are all connected to the MCU module.

2. A heat sink circuit according to claim 1, characterized in that: The circuit also includes a display module for displaying the temperature of the heat sink, and the display module is connected to the MCU module.

3. A heat sink circuit according to claim 1, characterized in that: The circuit also includes a Program module for firmware upgrade, and the Program module is connected to the MCU module.

4. A heat sink circuit according to claim 1, characterized in that: The circuit further includes an LDO module for converting an external input voltage into a stable voltage to power each module.

5. A heat sink circuit according to claim 4, characterized in that: The circuit also includes a TYPEC interface module for an external power supply and an anti-backflow module for preventing charging backflow current. The LDO module and the anti-backflow module are both connected to the TYPEC interface module, and the anti-backflow module is connected to the MCU module.

6. A heat sink circuit according to claim 5, characterized in that: The MUC module includes a main control chip for controlling a heat sink drive module, a fan drive module, a fantasy light module, and dynamically identifying a fast charging protocol to control different voltage outputs of an external power supply connected to a TYPEC interface module.

7. The heat sink circuit according to claim 5, characterized in that: The backflow prevention module includes an NMOS tube Q6, an NMOS tube Q7, a resistor R15, and a resistor R17. One end of the resistor R15 is connected to one end of the resistor R17, the other end of the resistor R17 is grounded, and the other end of the resistor R15 is connected to the LDO module. The gate of the NMOS tube Q6 is connected to one end of the resistor R15 and one end of the resistor R17, the drain of the NMOS tube Q6 is connected to the TYPEC interface module, and the source of the NMOS tube Q6 is connected to the MCU module. The gate of the NMOS tube Q7 is connected to one end of the resistor R15 and one end of the resistor R17, the drain of the NMOS tube Q7 is connected to the TYPEC interface module, and the source of the NMOS tube Q7 is connected to the MCU module.

8. A heat sink circuit according to any one of claims 1 to 7, characterized in that: The MIC module comprises: MIC for receiving external sound signals; The PMOS tube Q3 is used to control the MIC switch, the drain of the PMOS tube Q3 is connected to the positive electrode of the MIC, the source of the PMOS tube Q3 is connected to the power input terminal, and the gate of the PMOS tube Q3 is connected to the switch control terminal MIC_POWER_EN, and the switch control terminal MIC_POWER_EN is connected to the MCU module.

9. A heat sink circuit according to claim 8, characterized in that: The MIC module also includes a signal amplifying circuit for amplifying the electrical signal converted by the MIC. The signal amplifying circuit is connected to the MIC, and the signal amplifying circuit is connected to a signal output terminal MIC_AD for connecting to the MCU module.

10. A heat sink circuit according to claim 9, characterized in that: The signal amplification circuit includes a capacitor C30 for filtering and a transistor Q2 for amplifying the electrical signal; The base of the transistor Q2 is connected in series with the capacitor C30 and then connected to the positive electrode of MIC. The collector of the transistor Q2 is connected to the signal output terminal MIC_AD.

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