Integrated tool for reducing defects during manufacturing of semiconductor device

Abstract

The invention belongs to the field of semiconductor devices, and particularly relates to an integrated tool for reducing defects during manufacturing of semiconductor devices, the integrated tool comprises a device box, the inner bottom surface of the device box is fixedly connected with a telescopic base, and the upper surface of the telescopic base is fixedly connected with an arc-shaped supporting plate; and rotating columns are rotationally connected between the inner side walls of the device box, and clamping pieces are fixedly connected to the side faces, close to each other, of the two rotating columns. According to the device, the rotating bearing columns are arranged between the inner side walls of the device box, a plurality of diamond ropes are rotationally connected among the three rotating bearing columns, and after being polished, the monocrystalline silicon column is jacked up by the telescopic base and the arc-shaped supporting plate and then is cut by the rotating diamond ropes, so that the polishing efficiency is improved, and the polishing quality of the monocrystalline silicon column is improved. And a water tank and a spray head are arranged on the rear side face of the device box, water can be sprayed to the cutting position during cutting, the influence caused by dust can be eliminated, and cutting can be better lubricated.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor devices, and in particular relates to an integrated tool for reducing defects when manufacturing semiconductor devices. Background Art

[0002] Matter exists in various forms, including solid, liquid, gas, plasma, etc. Materials with poor conductivity are usually called insulators, metals with better conductivity are called conductors, and semiconductors refer to materials whose conductivity at room temperature is between that of conductors and insulators.

[0003] The existing publication number CN207425810U discloses an integrated tool for reducing defects in the manufacture of semiconductor devices, including a stage, a sample plate, a sensor probe, a scanning mirror device, a first focusing screw, a focusing device, a moving device, a second focusing screw, a telescope optical device, an adjustment knob, a controller, a sensor line, a switch button, a control button, a butterfly spring, a bearing sleeve, a thrust bearing, a protective cover, a push rod, a piston rod connector, a fixing bolt, and a spring.

[0004] Existing integrated tools for reducing defects in manufacturing semiconductor devices still have the following deficiencies: 1. In the process of manufacturing semiconductors, single crystal silicon rods are first produced and then polished to facilitate cutting in the next step. Existing devices mostly use edge polishing for polishing single crystal silicon rods, which is not only inefficient, but also not conducive to controlling the uniform diameter and shape of the entire single crystal silicon rod.

[0005] 2. After the single crystal silicon rod is polished, it needs to be cut. During the cutting process, single crystal silicon powder will be generated. If the powder is not processed, it will affect the cleanliness of the silicon wafer surface during the cutting process and also affect the cutting flatness of the silicon wafer.

[0006] 3. After cutting the single crystal silicon, the silicon wafer is prone to slipping, which will cause scratches or breakage of the silicon wafer, greatly affecting the quality and safety of the silicon wafer. Summary of the invention

[0007] The purpose of the present invention is to provide an integrated tool for reducing defects in the manufacture of semiconductor devices in response to the problems raised in the above-mentioned background technology, such as the low grinding efficiency of single crystal silicon rods, the powder generated when cutting single crystal silicon rods affecting the quality of finished products, and how to place single crystal silicon wafers after slicing the single crystal silicon rods.

[0008] To achieve the above-mentioned purpose, the present invention adopts the following technical solutions: an integrated tool for reducing defects in manufacturing semiconductor devices, comprising a device box, a telescopic base is fixedly connected to the inner bottom surface of the device box, an arc-shaped support plate is fixedly connected to the upper surface of the telescopic base, a rotating column is rotatably connected between the inner side walls of the device box, a clamping member is fixedly connected to the side surfaces where two rotating columns are close to each other, three clamping slides are slidably connected in a ring array on the side surfaces where two clamping members are close to each other, a single crystal silicon column is snap-connected in the three clamping slides, a No. 1 motor is fixedly connected to the outer side surface of the device box, the output end of the No. 1 motor passes through the device box and is fixedly connected to one end of the single crystal silicon column, a transmission scraping assembly is arranged between the device boxes, a transmission assembly is arranged on the outer side surface of the device box, a transmission box is fixedly connected to the side surface of the device box, the transmission assembly is arranged in the transmission box, and a clamping assembly and a cutting assembly are arranged above the clamping member.

[0009] Furthermore, the transmission scraping and grinding assembly includes a reciprocating screw rod and a scraping and grinding structure, the four reciprocating screw rods are rotatably connected to the inner wall of the device box, and the single crystal silicon column is arranged in the middle of the four reciprocating screw rods.

[0010] Furthermore, the scraping structure includes a transmission annular plate, a scraper, a rotating part and a transmission rod. The four scrapers penetrate through and are slidably connected to the transmission annular plate. The reciprocating screw penetrates through and is threadedly connected to the transmission annular plate. The four transmission rods are fixedly connected to the side of the transmission annular plate in an annular array. The side of the transmission annular plate is rotatably connected with a rotating part. The rotating part is provided with an arc groove, and the transmission rod penetrates the arc groove.

[0011] Furthermore, the transmission assembly includes a No. 1 gear, a No. 2 gear and a No. 2 motor, the No. 2 gear is rotatably connected to the side of the device box, the rotating column passes through the device box and is fixedly connected to the side of the No. 2 gear, the No. 1 gear is rotatably connected to the side of the device box, the four No. 1 gears are arranged in a circular array around the No. 2 gear, the No. 2 motor is fixedly connected to the inner side of the transmission box, and the output end of the No. 2 motor passes through the side of the No. 2 gear.

[0012] Further, it is characterized in that the clamping assembly includes an arc-shaped groove bar, a concave groove is provided on the inner wall of the device box, both ends of the arc-shaped groove bar are slidably connected in the concave groove by a slider, and the side surfaces of the two arc-shaped groove bars that are close to each other are both set as concave arc surfaces.

[0013] Furthermore, the cutting assembly includes a rotating bearing column and a diamond rope, three of the rotating bearing columns are rotatably connected to the inner side surface of the device box in a triangular shape, and a plurality of diamond ropes are evenly rotatably connected to the side surface of the rotating bearing column.

[0014] Furthermore, an I-shaped groove is provided on the inner side of the device box away from the rotating column, and the device box is slidably connected to a water tank through the I-shaped groove. A plurality of nozzles are provided on the water tank, and the output ports of the nozzles point to the rotating bearing column.

[0015] Furthermore, the width of the arc-shaped support plate is 5 cm smaller than the width between the two reciprocating screw rods, and the diameter of the single crystal silicon column is 10 cm smaller than the width between the two reciprocating screw rods.

[0016] Compared with the existing technology, the advantages of the integrated tool for reducing defects in manufacturing semiconductor devices are: The present invention connects the single crystal silicon column in the middle of two clamping parts, and a reciprocating screw is rotatably connected to the four sides of the clamping parts, and the transmission ring plate is threadedly connected to the reciprocating screw, and four scrapers are slidably connected to the sliding groove on the side of the transmission ring plate. The rotation of the No. 2 motor can be controlled to control the rotation of the No. 1 gear and the No. 2 gear, which ultimately affects the displacement of the transmission ring plate, and the displacement of the transmission rod in the arc groove can be controlled by controlling the rotation of the rotating part, thereby controlling the extension length of the scraper. Therefore, the present invention can be suitable for single crystal silicon columns of different diameters, and the side of the single crystal silicon column can be polished by controlling the No. 1 motor to drive the rotation of the rotating column. Compared with the original technology, this design improves the polishing efficiency and is suitable for the polishing of single crystal silicon columns of different diameters.

[0017] The present invention arranges rotating bearing columns between the inner side walls of the device box, and rotatably connects a plurality of diamond ropes between the three rotating bearing columns. After the single crystal silicon column is polished, the telescopic base and the arc-shaped support plate will lift up the single crystal silicon column, and then it will be cut by the rotating diamond rope. A water tank and a nozzle are arranged on the rear side of the device box, so that water can be sprayed on the cutting point during cutting, which can not only eliminate the influence of dust, but also make the cutting better lubricated.

[0018] The present invention arranges two arc-shaped grooves on the inner wall of the device box, and a concave groove is provided on the inner wall of the device box, and the arc-shaped grooves are slidably connected in the concave grooves. When the telescopic base and the arc-shaped support plate lift the single crystal silicon column, the arc-shaped grooves can be slid on both sides. When the single crystal silicon column is about to be cut, the arc-shaped grooves can move to a suitable position to effectively clamp the cut single crystal silicon slices, thereby avoiding the breakage of the single crystal silicon slices. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a front view structural schematic diagram of an integrated tool for reducing defects in manufacturing semiconductor devices provided by the present invention; Figure 2 yes Figure 1 A magnified view of part A; Figure 3It is a schematic side view of an integrated tool for reducing defects in manufacturing semiconductor devices provided by the present invention; Figure 4 It is a schematic diagram of the internal structure of an integrated tool for reducing defects in manufacturing semiconductor devices provided by the present invention; Figure 5 The present invention is a schematic diagram of a device box structure of an integrated tool for reducing defects in manufacturing semiconductor devices.

[0020] In the figure, 1 is a device box, 2 is an arc-shaped support plate, 3 is a No. 1 motor, 4 is a transmission box, 5 is a No. 1 gear, 6 is a No. 2 gear, 7 is a No. 2 motor, 8 is a rotating column, 9 is a clamping member, 10 is a clamping slide, 11 is a single crystal silicon column, 12 is a reciprocating screw rod, 13 is a transmission annular plate, 14 is a scraper, 15 is a rotating member, 16 is an arc-shaped groove, 17 is a transmission rod, 18 is a telescopic base, 19 is an arc-shaped groove bar, 20 is a concave groove, 21 is a rotating bearing column, 22 is a diamond rope, 23 is a water tank, and 24 is an I-shaped groove. DETAILED DESCRIPTION

[0021] The following examples are for illustrative purposes only and are not intended to limit the scope of the present invention.

[0022] like Figure 1-Figure 5 As shown, an integrated tool for reducing defects in manufacturing semiconductor devices comprises a device box 1, a telescopic base 18 is fixedly connected to the inner bottom surface of the device box 1, an arc-shaped support plate 2 is fixedly connected to the upper surface of the telescopic base 18, a rotating column 8 is rotatably connected between the inner side walls of the device box 1, a clamping member 9 is fixedly connected to the sides where two rotating columns 8 are close to each other, three clamping slides 10 are slidably connected in a ring array on the sides where two clamping members 9 are close to each other, a single crystal silicon column 11 is snap-connected inside the three clamping slides 10, a No. 1 motor 3 is fixedly connected to the outer side surface of the device box 1, an output end of the No. 1 motor 3 passes through the device box 1 and is fixedly connected to one end of the single crystal silicon column 11, a transmission scraping assembly is arranged between the device boxes 1, a transmission assembly is arranged on the outer side surface of the device box 1, a transmission box 4 is fixedly connected to the side surface of the device box 1, and the transmission assembly is arranged in the transmission box 4, and a clamping assembly and a cutting assembly are arranged above the clamping member 9; The transmission scraping assembly includes a reciprocating screw rod 12 and a scraping structure. The four reciprocating screw rods 12 are rotatably connected to the inner wall of the device box 1. The single crystal silicon column 11 is arranged in the middle of the four reciprocating screw rods 12. The scraping structure includes a transmission annular plate 13, a scraper 14, a rotating member 15 and a transmission rod 17. The four scrapers 14 penetrate and are slidably connected to the transmission annular plate 13. The reciprocating screw rod 12 penetrates and is threadedly connected to the transmission annular plate 13. The four transmission rods 17 are fixedly connected to the side of the transmission annular plate 13 in an annular array. The side of the transmission annular plate 13 is rotatably connected with the rotating member 15, and the rotating member 15 is provided with an arc groove 16 , the transmission rod 17 passes through the arc groove 16, and the rotation of the No. 1 gear 5 and the No. 2 gear 6 can be controlled by controlling the rotation of the No. 2 motor 7, thereby affecting the displacement of the transmission annular plate 13, and the displacement of the transmission rod 17 in the arc groove 16 can be controlled by controlling the rotation of the rotating member 15, thereby controlling the extension length of the scraper 14, which can be suitable for single crystal silicon columns of different diameters, and by controlling the No. 1 motor 3 to drive the rotation of the rotating column 8, the side of the single crystal silicon column 11 can be polished. Compared with the original technology, this design improves the polishing efficiency and is suitable for the polishing of single crystal silicon columns 11 of different diameters; The transmission assembly includes a No. 1 gear 5, a No. 2 gear 6 and a No. 2 motor 7. The No. 2 gear 6 is rotatably connected to the side of the device box 1. The rotating column 8 penetrates the device box 1 and is fixedly connected to the side of the No. 2 gear 6. The No. 1 gear 5 is rotatably connected to the side of the device box 1. Four No. 1 gears 5 are arranged in a circular array around the No. 2 gear 6. The No. 2 motor 7 is fixedly connected to the inner side of the transmission box 4. The output end of the No. 2 motor 7 penetrates the side of the No. 2 gear 6. The invention is characterized in that the clamping assembly includes an arc-shaped groove bar 19, and a concave groove 20 is provided on the inner side wall of the device box 1. The two ends of the arc-shaped groove bar 19 are slidably connected in the concave groove 20 through a slider, and the adjacent sides of the two arc-shaped groove bars 19 are both set as concave arc surfaces. When the telescopic base 18 and the arc-shaped support plate 2 lift the single crystal silicon column 11, the arc-shaped groove bar 19 can be slid on both sides. When the single crystal silicon column 11 is about to be cut, the arc-shaped groove bar 19 can move to a suitable position to effectively clamp the cut single crystal silicon slice, thereby avoiding the breakage of the single crystal silicon slice; The cutting assembly includes a rotating bearing column 21 and a diamond rope 22. The three rotating bearing columns 21 are rotatably connected to the inner side of the device box 1 in a triangular shape. Several diamond ropes 22 are evenly rotatably connected to the side of the rotating bearing column 21. An I-shaped groove 24 is provided on the inner side of the device box 1 away from the rotating column 8. The device box 1 is slidably connected to a water tank 23 through the I-shaped groove 24. The water tank is provided with several nozzles, and the output port of the nozzle points to the rotating bearing column 21. After the single crystal silicon column 11 is polished, the telescopic base 18 and the arc-shaped support plate 2 will lift the single crystal silicon column 11, and then cut it through the rotating diamond rope 22. A water tank 23 and a nozzle are provided on the rear side of the device box 1, which can spray water on the cutting position during cutting, which can eliminate the influence of dust and make the cutting better lubricated. The width of the arc-shaped support plate 2 is 5 cm smaller than the width between the two reciprocating screw rods 12 , and the diameter of the single crystal silicon column 11 is 10 cm smaller than the width between the two reciprocating screw rods 12 .

[0023] The working principle of the present invention is as follows: By engaging the single crystal silicon column 11 between the two clamping members 9, and rotating the reciprocating screw rod 12 around the clamping members 9, and threading the transmission annular plate 13 on the reciprocating screw rod 12, and slidingly connecting the four scrapers 14 in the sliding groove on the side of the transmission annular plate 13, the rotation of the No. 2 motor 7 can be controlled to control the rotation of the No. 1 gear 5 and the No. 2 gear 6, which ultimately affects the displacement of the transmission annular plate 13, and the displacement of the transmission rod 17 in the arc groove 16 can be controlled by controlling the rotation of the rotating member 15, thereby controlling the extension length of the scraper 14, which can be suitable for single crystal silicon columns of different diameters, and by controlling the No. 1 motor 3 to drive the rotation of the rotating column 8, the side of the single crystal silicon column 11 can be polished. Compared with the original technology, this design improves the polishing efficiency and is suitable for the polishing of single crystal silicon columns 11 of different diameters; By setting a rotating bearing column 21 between the inner side walls of the device box 1, and rotating a plurality of diamond ropes 22 between the three rotating bearing columns 21, after the single crystal silicon column 11 is polished, the telescopic base 18 and the arc-shaped support plate 2 will lift up the single crystal silicon column 11, and then cut it through the rotating diamond rope 22, and a water tank 23 and a nozzle are set on the rear side of the device box 1, which can spray water on the cutting position during cutting, which can not only eliminate the influence of dust, but also make the cutting better lubricated; By setting two arc-shaped grooves 19 on the inner wall of the device box 1, and providing a concave groove 20 on the inner wall of the device box 1, the arc-shaped groove 19 is slidably connected in the concave groove 20, and when the telescopic base 18 and the arc-shaped support plate 2 lift the single crystal silicon column 11, the arc-shaped groove 19 can be slid on both sides. When the single crystal silicon column 11 is about to be cut, the arc-shaped groove 19 can move to a suitable position to effectively clamp the cut single crystal silicon slice, thereby avoiding the breakage of the single crystal silicon slice.

[0024] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An integrated tool for reducing defects in the manufacture of semiconductor devices, characterized in that The invention comprises a device box 1, wherein a telescopic base (18) is fixedly connected to the inner bottom surface of the device box 1, an arc-shaped support plate (2) is fixedly connected to the upper surface of the telescopic base (18), a rotating column (8) is rotatably connected between the inner side walls of the device box 1, a clamping member (9) is fixedly connected to the sides close to each other of the two rotating columns (8), three clamping slides (10) are slidably connected in a ring-shaped array on the sides close to each other of the two clamping members (9), a single crystal silicon column (11) is snap-connected inside the three clamping slides (10), a No. 1 motor (3) is fixedly connected to the outer side surface of the device box 1, an output end of the No. 1 motor (3) passes through the device box 1 and is fixedly connected to one end of the single crystal silicon column (11), a transmission scraping assembly is arranged between the device boxes 1, a transmission assembly is arranged on the outer side surface of the device box 1, a transmission box (4) is fixedly connected to the side surface of the device box 1, and the transmission assembly is arranged in the transmission box (4), and a clamping assembly and a cutting assembly are arranged above the clamping member (9).

2. The integrated tool for reducing defects in manufacturing semiconductor devices according to claim 1, characterized in that The transmission scraping and grinding assembly comprises a reciprocating screw rod (12) and a scraping and grinding structure, wherein the four reciprocating screw rods (12) are rotatably connected to the inner side wall of the device box 1, and the single crystal silicon column (11) is arranged in the middle of the four reciprocating screw rods (12).

3. The integrated tool for reducing defects in manufacturing semiconductor devices according to claim 2, characterized in that The scraping structure comprises a transmission annular plate (13), a scraper (14), a rotating member (15) and a transmission rod (17); the four scrapers (14) penetrate through and are slidably connected to the transmission annular plate (13); the reciprocating screw rod (12) penetrates through and is threadedly connected to the transmission annular plate (13); the four transmission rods (17) are fixedly connected to the side of the transmission annular plate (13) in an annular array; the side of the transmission annular plate (13) is rotatably connected to the rotating member (15); the rotating member (15) is provided with an arc groove (16); and the transmission rod (17) penetrates through the arc groove (16).

4. The integrated tool for reducing defects in manufacturing semiconductor devices according to claim 1, characterized in that The transmission assembly comprises a first gear (5), a second gear (6) and a second motor (7); the second gear (6) is rotatably connected to the side of the device box 1; the rotating column (8) passes through the device box 1 and is fixedly connected to the side of the second gear (6); the first gear (5) is rotatably connected to the side of the device box 1; four first gears (5) are arranged around the second gear (6) in a circular array; the second motor (7) is fixedly connected to the inner side of the transmission box (4); and the output end of the second motor (7) passes through the side of the second gear (6).

5. The integrated tool for reducing defects in manufacturing semiconductor devices according to claim 1, characterized in that The clamping assembly comprises an arc-shaped groove (19), and a concave groove (20) is provided on the inner side wall of the device box 1. The two ends of the arc-shaped groove (19) are slidably connected in the concave groove (20) via a slider, and the adjacent side surfaces of the two arc-shaped grooves (19) are both arranged as concave arc surfaces.

6. The integrated tool for reducing defects in manufacturing semiconductor devices according to claim 1, characterized in that The cutting assembly comprises a rotating bearing column (21) and a diamond rope (22), wherein three rotating bearing columns (21) are rotatably connected to the inner side surface of the device box 1 in a triangular shape, and a plurality of diamond ropes (22) are evenly rotatably connected to the side surface of the rotating bearing column (21).

7. The integrated tool for reducing defects in manufacturing semiconductor devices according to claim 6, characterized in that An I-shaped groove (24) is provided on the inner side surface of the device box 1 away from the rotating column (8), and the device box 1 is slidably connected to a water tank (23) via the I-shaped groove (24). A plurality of nozzles are provided on the water tank, and the output ports of the nozzles point to the rotating bearing column (21).

8. The integrated tool for reducing defects in manufacturing semiconductor devices according to claim 2, characterized in that The width of the arc-shaped support plate (2) is 5 cm smaller than the width between the two reciprocating screw rods (12), and the diameter of the single crystal silicon column (11) is 10 cm smaller than the width between the two reciprocating screw rods (12).

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