Crystal bar fixing device and crystal bar processing system and method

Abstract

The invention provides a crystal bar fixing device and a crystal bar processing system and method.The crystal bar fixing device comprises a plate-shaped bearing table which is provided with a hollowed-out structure used for allowing detection light to penetrate through, and the hollowed-out structure penetrates through the bearing table; the bearing table comprises a first surface and a second surface which are opposite to each other, the first surface is provided with a vacuum adsorption area arranged around the hollow structure, and the vacuum adsorption area is used for adsorbing the first end face of the crystal bar; and when the first end face of the crystal bar is adsorbed on the vacuum adsorption area, a part of the first end face of the crystal bar is exposed at the hollow structure, so that detection light projected from the second surface side of the bearing table penetrates through the hollow structure and is irradiated on the first end face. The device, the system and the method provided by the invention are suitable for fixing and processing different types of crystal bars, and have the advantages of high directional measurement precision and the like.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor crystal rod processing, and in particular to a crystal rod fixing device, a crystal rod processing system and a method. Background Art

[0002] As a representative of the third generation of wide bandgap semiconductors, silicon carbide is mainly used in emerging industries such as new energy, high-speed rail, and 5G. Due to its own characteristics, it plays an irreplaceable role in some fields. With the rapid development of related industries, the field of silicon carbide crystal rod processing has also gained great development opportunities. The difficulty of growing and processing silicon carbide materials is an important factor restricting its development and popularization. At present, the production specifications of silicon carbide finished crystal rods are 4-8 inches, and the thickness is generally 5-25 mm. The thickness of some advanced processes can reach about 30 mm.

[0003] Due to the thin and pancake-like characteristics of silicon carbide crystal rods, conventional processing systems are not suitable for fixing crystal rods in the shape of round pancakes. In addition, existing systems also lack the accuracy of measuring the orientation of crystal rods. Summary of the invention

[0004] Based on the above situation, the main purpose of the present invention is to provide a crystal ingot fixing device, a crystal ingot processing system and a method.

[0005] To achieve the above purpose, the technical solution adopted by the present invention is as follows:

[0006] The present invention provides a crystal rod fixing device for fixing a crystal rod, wherein the crystal rod comprises a side surface and a first end surface and a second end surface opposite to each other, and the device comprises:

[0007] A carrier platform, the carrier platform is in the shape of a plate, and is provided with a hollow structure for transmitting detection light, and the hollow structure runs through the carrier platform; the carrier platform comprises a first surface and a second surface opposite to each other, and a vacuum adsorption area is provided on the first surface around the hollow structure, and the vacuum adsorption area is used to adsorb the first end face of the crystal rod;

[0008] When the first end face of the crystal rod is adsorbed on the vacuum adsorption area, part of the first end face of the crystal rod is exposed to the hollow structure, so that the detection light projected from the second surface side of the carrier table passes through the hollow structure and is projected onto the first end face;

[0009] A relief groove for making way for the detection light is provided on the second surface of the carrier, the depth of the relief groove is less than the distance between the first surface and the second surface, and one end of the relief groove extends to the hollow structure;

[0010] The depth of the avoidance groove gradually increases from an end away from the hollow structure to an end close to the hollow structure;

[0011] There are multiple avoidance grooves, which are symmetrically arranged with the hollow structure as the center.

[0012] Preferably, a limited position matching structure is provided on the crystal rod;

[0013] The device further comprises a limiting mechanism, which is arranged outside the vacuum adsorption area and cooperates with the limiting matching structure on the crystal rod to limit the position of the crystal rod.

[0014] Preferably, the limiting matching structure provided on the crystal rod is a notch, and the notch is provided on the side surface;

[0015] The limiting mechanism comprises an elastic ejector pin, a first roller and a second roller, wherein the first roller and the second roller are located on opposite sides of the elastic ejector pin. When the crystal rod is fixed, the elastic ejector pin abuts against the notch, the first roller and the second roller contact the side surface of the crystal rod, and the elastic ejector pin cooperates with the first roller and the second roller to limit the position of the crystal rod.

[0016] When the supporting platform extends in a vertical direction, the elastic ejector pin, the first roller and the second roller are located on the upper side of the crystal rod, and the elastic ejector pin is located on the top of the crystal rod.

[0017] Preferably, the limiting matching structure arranged on the crystal rod is a first flat edge and a second flat edge perpendicular to each other, and the first flat edge and the second flat edge are arranged on the side surface;

[0018] The limiting mechanism comprises a top limiting block and a side limiting block. When the crystal ingot is fixed, the first flat edge abuts against the top limiting block, and the second flat edge abuts against the side limiting block. The top limiting block and the side limiting block cooperate to limit the position of the crystal ingot.

[0019] When the supporting platform extends in the vertical direction, the top limiting block is located at the top of the crystal rod;

[0020] There is one side limit block, or two side limit blocks are arranged on opposite sides of the crystal rod.

[0021] Preferably, the crystal rod is fixed on a sacrificial material;

[0022] A sacrificial material accommodating space is provided between the carrying platform and the limiting mechanism and / or below the crystal rod fixing device, and when the crystal rod is fixed, the sacrificial material is located in the sacrificial material accommodating space;

[0023] The area corresponding to the sacrificial material accommodating space is staggered with the area where the vacuum adsorption space is located.

[0024] Preferably, the device includes a driving mechanism, which can drive the supporting platform to rotate to different positions to facilitate the loading of the crystal rod and / or adjust the crystal orientation deviation of the crystal rod and / or facilitate the bonding of the crystal rod, and the rotation direction of the supporting platform is perpendicular to the supporting platform.

[0025] Preferably, the limiting mechanism is fixed on the carrying platform;

[0026] A soft material layer is disposed on the first surface of the carrying platform, and the soft material layer covers the vacuum adsorption area.

[0027] The present invention also provides a crystal rod processing system, comprising the crystal rod fixing device, orientation measuring device and bonding device as described above; the orientation measuring device is arranged on one side of the second surface of the supporting platform, and the crystal rod fixing device cooperates with the orientation measuring device to provide orientation for the crystal rod; the crystal rod fixing device cooperates with the bonding device to fix the crystal rod on the base.

[0028] The present invention also provides a crystal rod processing method, which is implemented by a processing system, and the crystal rod processing system includes the crystal rod fixing device, the orientation measurement device and the bonding device as described above;

[0029] The crystal rod processing method comprises the steps of:

[0030] Loading; the driving mechanism drives the carrying platform to move to a first position, and the carrying platform extends in a horizontal direction so as to place the crystal rod in the vacuum adsorption area;

[0031] Vacuum adsorption: fixing the crystal rod in the vacuum adsorption area by vacuum adsorption;

[0032] Moving the carrying platform; the driving mechanism drives the carrying platform to move to a second position, and the carrying platform extends in a vertical direction;

[0033] Orientation; the detection light emitted by the orientation measurement device is projected onto the first end face of the crystal rod through the hollow structure, and the diffracted detection light is analyzed to obtain the crystal orientation deviation angle and crystal orientation deviation direction of the crystal rod.

[0034] Preferably, after the loading step, the method further comprises the steps of:

[0035] Limiting; the limiting mechanism is actuated to limit the position of the crystal rod;

[0036] After the orienting step, the method further comprises the steps of:

[0037] Adjusting the crystal orientation deviation; the driving mechanism drives the carrier to rotate, the rotation angle is equal to the crystal orientation deviation angle, and the rotation direction is opposite to the crystal orientation deviation direction;

[0038] Bonding; the bonding device moves the base coated with adhesive to the bottom of the crystal rod and contacts the sacrificial material at the bottom of the crystal rod;

[0039] After the adhesive is solidified, the vacuum adsorption of the crystal rod is released.

[0040] The crystal rod fixing device, crystal rod processing system and method provided by the present invention can be compatible with the fixing of crystal rods of different thicknesses by adsorbing and fixing a single end face of the crystal rod. After the crystal rod fixing device completes the fixation of the crystal rod through adsorption, it can assist the orientation measurement device and the bonding device to complete the orientation and bonding of the crystal rod. During orientation, since the detection light is projected onto the first end face through the hollow structure, the first end face serves as both an orientation measurement surface and an adsorption and fixing surface, eliminating the variables caused by the differences in the surface morphology of different crystal rods, and can improve the orientation measurement accuracy of the system or device.

[0041] Other beneficial effects of the present invention will be explained in the specific implementation manner through the introduction of specific technical features and technical solutions. Through the introduction of these technical features and technical solutions, those skilled in the art should be able to understand the beneficial technical effects brought about by the technical features and technical solutions. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The preferred embodiments of the crystal ingot fixing device and the crystal ingot processing system according to the present invention will be described below with reference to the accompanying drawings.

[0043] Figure 1 It is a schematic diagram of the three-dimensional structure of the crystal rod involved in the embodiment of the present invention.

[0044] Figure 2 for Figure 1 Schematic diagram of the main structure of the crystal rod with sacrificial material in the middle.

[0045] Figure 3 It is a schematic diagram of the front view structure of a crystal rod with a sacrificial material in another embodiment.

[0046] Figure 4 It is a schematic diagram of the module structure of the crystal rod processing system according to an embodiment of the present invention.

[0047] Figure 5 It is a schematic diagram of the three-dimensional structure of the crystal rod fixing device according to an embodiment of the present invention.

[0048] Figure 6Schematic diagram of the front view of the crystal rod fixing device according to an embodiment of the present invention.

[0049] Figure 7 This is a schematic diagram of the front view of the structure of the crystal rod fixing device after the crystal rod is fixed according to an embodiment of the present invention.

[0050] Figure 8 FIG. 4 is a schematic diagram of the three-dimensional structure of the crystal rod fixing device according to an embodiment of the present invention from another viewing angle.

[0051] Fig. 9 Schematic diagram of the main structure of the crystal rod fixing device according to an embodiment of the present invention at another viewing angle.

[0052] Fig.10 It is a schematic diagram of the crystal rod fixing device in accordance with an embodiment of the present invention in cooperation with orientation measurement.

[0053] Fig.11 Schematic diagram of the driving path of the crystal rod fixing device according to an embodiment of the present invention.

[0054] Fig.12 It is a schematic diagram of the front view of the structure after the crystal ingot is fixed by the crystal ingot fixing device in another embodiment of the present invention.

[0055] Fig.13 This is a schematic diagram of the main structure of the crystal rod fixing device according to an embodiment of the present invention after the crystal rod is fixed at another viewing angle. DETAILED DESCRIPTION

[0056] The present invention is described below based on embodiments, but the present invention is not limited to these embodiments. In the following detailed description of the present invention, some specific details are described in detail. In order to avoid confusing the essence of the present invention, known methods, processes, procedures, and components are not described in detail.

[0057] In addition, persons of ordinary skill in the art will appreciate that the drawings provided herein are for illustration purposes and are not necessarily drawn to scale.

[0058] Unless the context clearly requires otherwise, throughout the specification and claims, the words "include", "comprising" and similar words should be interpreted in an inclusive sense rather than an exclusive or exhaustive sense; that is, in the sense of "including but not limited to".

[0059] In the description of the present invention, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0060] The present invention provides a crystal rod processing system, which is used to process crystal rods. The processing steps include but are not limited to one or more of loading, orienting, bonding, cutting, chamfering, and grinding. In the present invention, the processing of the crystal rod by the crystal rod processing system includes at least orienting and bonding.

[0061] It can be understood that the crystal rod includes but is not limited to silicon carbide crystal rod, and can also be gallium nitride crystal rod and other crystal rods that can be used for semiconductor manufacturing.

[0062] See also Figure 1 and Figure 2 The crystal rod 8 is a columnar body, which includes a side surface 8c, and a first end surface 8a and a second end surface 8b opposite to each other. The crystal rod 8 is fixed on the sacrificial material 9. In the state to be bonded, the sacrificial material 9 is fixed on the bottom of the crystal rod 8.

[0063] As an embodiment, the crystal rod 8 is a silicon carbide crystal rod, and the sacrificial material 9 is a graphite tray.

[0064] As an embodiment, a limited position matching structure 81 is provided on the crystal rod 8. In this embodiment, the limited position matching structure 81 is a notch 811a. The notch 811a is provided on the side surface 8c and passes through from the first end surface 8a to the second end surface 8b.

[0065] As an embodiment, the cross-sectional shape of the notch 811a in the length direction of the crystal rod 8 is V-shaped, and it may also be other shapes that are convenient for limiting the crystal rod 8, such as hemispherical, U-shaped, etc.

[0066] See also Figure 3 As an embodiment, the crystal rod 8' and Figure 2 The difference between the crystal ingot 8 shown in the figure is only the specific structure of the position-limiting matching structure 81' provided on the crystal ingot 8'. In this embodiment, the position-limiting matching structure 81' is a first flat edge 812a and a second flat edge 812b that are perpendicular to each other, and the first flat edge 812a and the second flat edge 812b are provided on the side surface 8c'. In some embodiments, the first flat edge 812a and the second flat edge 812b extend from the first end surface 8a' of the crystal ingot 8' to the second end surface (not numbered).

[0067] Understandably, Figure 3 In the perspective, the first flat edge 812a is arranged on the top of the crystal rod 8', and the second flat edge 812b is arranged on the right side of the crystal rod 8'. In fact, the second flat edge 812b can also be arranged on the left side of the crystal rod 8'.

[0068] It is understood that the specific structure of the crystal rod 8 is not limited, and a limiting matching structure 81 may be provided on it, and the limiting matching structure 81 cooperates with other mechanisms to limit the position of the crystal rod 8. However, in some embodiments, the limiting matching structure 81 may not be provided on the crystal rod 8, and it may be directly limited by other mechanisms with specific structures, such as limiting it by other mechanisms matching the shape of the crystal rod 8. The structure and operation of the crystal rod processing system 1 are mainly described below by taking the crystal rod 8 as an example, and it is understood that all or part of the description is applicable to the crystal rod 8'.

[0069] See also Figure 4 The crystal rod processing system 1 includes a feeding system 10, an oriented bonding system 20 and a cutting system 30. The feeding system 10 is used to provide at least a crystal rod 8 with a sacrificial material 9 (for the sake of simplicity, it can be understood that the crystal rods 8 described below are all crystal rods 8 with sacrificial materials 9). After the crystal rod 8 moves from the feeding system 10 to the oriented bonding system 20, the oriented bonding system 20 performs the oriented and bonded processes on the crystal rod 8 fixed thereon. The cutting system 30 cuts the crystal rod 8 after the oriented and bonded processes to obtain wafers.

[0070] As an embodiment, the crystal rod processing system 1 may further include a system for performing chamfering and / or grinding on the wafer.

[0071] It is understandable that the specific structures of the feeding system 10 and the cutting system 30 are not limited, and the feeding system 10 only needs to be able to at least provide the crystal rod 8, and the crystal rod 8 in the feeding system 10 can be moved to the directional bonding system 20 manually or by a robot. The cutting system 30 only needs to be able to complete the cutting of the crystal rod 8.

[0072] As an embodiment, the oriented bonding system 20 includes a crystal rod fixing device 20a, an oriented measuring device 20b and a bonding device 20c. The crystal rod fixing device 20a is at least used to fix the crystal rod 8 transported from the loading system 10, and the oriented measuring device 20b is used to orient the crystal rod 8 fixed on the crystal rod fixing device 20a. The crystal rod fixing device 20a and the bonding device 20c are used in conjunction to fix the crystal rod 8 with the sacrificial material 9 to the base.

[0073] It can be understood that the orientation measurement device 20b and the bonding device 20c can adopt any existing device that can achieve orientation measurement and bonding.

[0074] As an embodiment, the orientation measurement device 20b uses the Bragg diffraction principle of X-rays to achieve orientation of the crystal rod 8. Specifically, the orientation measurement device 20b can transmit X-rays (detection light) to the crystal rod 8 through a transmitting component, and then receive the X-rays diffracted back from the crystal rod 8 through a receiving component, and the crystal orientation deviation angle and crystal orientation deviation direction of the crystal rod 8 can be obtained through analysis by an analyzing component.

[0075] As an embodiment, the bonding device 20c applies liquid glue on the base, and then moves the base with the liquid glue to the bottom of the crystal rod 8 to contact the sacrificial material 9 under the crystal rod 8. After the glue is solidified, the bonding between the crystal rod 8 and the base is completed.

[0076] See also Figures 5 to 7 As an embodiment, the crystal rod fixing device 20a includes a carrier 21, which is in the shape of a plate and is provided with a hollow structure 213 for transmitting the detection light, and the hollow structure 213 runs through the carrier 21. The carrier 21 includes a first surface 21a and a second surface 21b opposite to each other, and a vacuum adsorption area 211 is provided on the first surface 21a around the hollow structure 213, and the vacuum adsorption area 211 is used to adsorb the first end surface 8a of the crystal rod 8.

[0077] When the first end face 8a of the crystal rod 8 is adsorbed on the vacuum adsorption area 211, part of the first end face 8a of the crystal rod 8 is exposed to the hollow structure 213, so that the detection light emitted by the directional measurement device 20b is projected from the second surface 21b side of the supporting platform 21, passes through the hollow structure 213 and is projected onto the first end face 8a of the crystal rod 8.

[0078] As an embodiment, the orientation measurement device 20 b is disposed on a side of the second surface 21 b of the carrier 21 , and the crystal rod fixing device 20 a cooperates with the orientation measurement device 20 b to provide an orientation function for the crystal rod 8 .

[0079] As an embodiment, the vacuum adsorption area 211 is annular, which can form a larger vacuum adsorption space and greatly enhance the adsorption and fixing force.

[0080] As an embodiment, when the first end surface 8 a of the crystal rod 8 is adsorbed on the vacuum adsorption area 211 , the hollow area corresponds to the central area of ​​the first end surface 8 a .

[0081] It can be understood that the vacuum adsorption area 211 is provided with a vacuum cavity 214, and the vacuum cavity 214 is connected to a vacuum generator (not shown) through a pipeline (not shown), and the vacuum generator is evacuated to adsorb the first end surface 8a covering the vacuum cavity 214. As another embodiment, the vacuum adsorption area 211 is provided with a plurality of vacuum holes, and the vacuum holes are connected to the vacuum generator through pipelines, and the vacuum generator is evacuated to adsorb the first end surface 8a covering the vacuum holes. The vacuum space (vacuum cavity 214, vacuum holes, etc.) is connected to the vacuum generator through pipelines, so that the vacuum demand of the device becomes a standard CDA (compressed air) demand, which changes the factory installation conditions and improves the versatility of the system or device.

[0082] As an embodiment, a layer of soft material 212 is provided on the first surface 21a of the carrier 21, the layer of soft material 212 covers the vacuum adsorption area 211, and the crystal rod 8 is directly in contact with the layer of soft material 212. The soft material 212 may have holes and / or grooves according to adsorption requirements. The provision of the layer of soft material 212 can not only protect the crystal rod 8 from being damaged, but also improve the strength of vacuum adsorption and reduce the size requirements of the adsorption surface of the crystal rod 8.

[0083] In the present invention, the crystal rod fixing device 20a can be compatible with the fixing of crystal rods 8 of different thicknesses by adsorbing and fixing a single end face of the crystal rod 8. After the crystal rod fixing device 20a completes the fixing of the crystal rod 8 by adsorption, it can assist the orientation measurement device 20b and the bonding device 20c to complete the orientation and bonding of the crystal rod 8. During orientation, since the detection light is projected onto the first end face 8a through the hollow structure 213, the first end face 8a serves as both an orientation measurement surface and an adsorption and fixing surface, eliminating the variables caused by the differences in the surface morphology of different crystal rods 8, and improving the orientation measurement accuracy of the system or device.

[0084] The crystal rod fixing device 20a cooperates with the orientation measuring device 20b and the bonding device 20c to realize automatic orientation bonding, and the crystal rods 8 are bonded one by one. The crystal orientation of each crystal rod 8 can be adjusted individually, and all bonded crystal rods 8 can be re-inspected, which greatly improves the accuracy of the bonding of the crystal rods 8 and the accuracy of the crystal orientation of the wafer after cutting.

[0085] See also Figures 8 to 10As an embodiment, a relief groove 215 for making way for the detection light is provided on the second surface 21b of the carrier 21, and the depth of the relief groove 215 is less than the distance between the first surface 21a and the second surface 21b, that is, the relief groove 215 does not penetrate the carrier 21. One end of the relief groove 215 extends to the hollow structure 213, so that the detection light passes through the relief groove 215 and enters the hollow structure 213 without being blocked by the carrier 21. The setting of the relief groove 215 can reduce the size of the hollow structure 213 and increase the area of ​​the vacuum adsorption area 211 while ensuring that the detection light can smoothly enter the hollow structure 213.

[0086] like Fig.10 As shown, in some embodiments, the incident angle of the detection light L1 (i.e., the angle between L1 and the end face of the crystal rod 8) is large, and it can directly pass through the hollow structure 213 to the crystal rod 8 without passing through the avoidance groove 215. In other embodiments, the incident angle of the detection light L2 (i.e., the angle between L2 and the end face of the crystal rod 8) is small. When the size of the hollow structure 213 is small, it will be blocked by the carrier 21 and cannot be emitted into the hollow structure 213. The design of the avoidance groove 215 makes the detection light not blocked by the carrier 21, and can pass through the hollow structure 213 to the crystal rod 8. In this way, the crystal rod fixing device 20a can cooperate with the directional measurement device 20b to provide directional measurement for different types of crystal rods 8.

[0087] As an embodiment, the depth of the avoidance groove 215 gradually increases from the end far away from the hollow structure 213 to the end close to the hollow structure 213; in this way, while ensuring the passage of the detection light, the support platform 21 can also be guaranteed to have good mechanical strength.

[0088] It can be understood that the avoidance groove 215 can be in the shape of a triangle, a right-angled trapezoid, a square, etc., and its specific structural form is not limited as long as it can ensure the smooth passage of the detection light.

[0089] As an embodiment, there are multiple avoidance grooves 215 , which are symmetrically arranged with the hollow structure 213 as the center to ensure the injection and emission of the detection light.

[0090] As an embodiment, the size of the hollow structure 213 is 2-15 mm, the length of the avoidance groove 215 is 3-15°, and the depth is 0.2-3 mm. It can be understood that this size is only an embodiment, and the specific sizes of the hollow structure 213 and the avoidance groove 215 are not limited to the above parameters.

[0091] As an embodiment, the hollow structure 213 is rectangular, and there are four avoidance grooves 215, which are arranged at the rectangular corners of the hollow structure 213. The angle between the avoidance grooves 215 is 90°; the angle between the avoidance grooves 215 and the horizontal direction is 45°. In this way, the measurement requirements of the directional measurement device 20b can be better met.

[0092] See also Fig.11 The crystal rod fixing device 20a includes a driving mechanism (not shown), which can drive the supporting platform 21 to rotate to different positions with point O as the center of the circle to facilitate the loading of the crystal rod 8 and / or adjust the crystal orientation deviation of the crystal rod 8 and / or facilitate the bonding of the crystal rod 8. The rotation direction of the supporting platform 21 is perpendicular to the supporting platform 21.

[0093] As an embodiment, the driving mechanism drives the carrier 21 to move to the first position (position A). At this time, the carrier 21 extends in the horizontal direction, which is convenient for an operator or a robot to place the crystal rod 8 in the vacuum adsorption area 211.

[0094] As an embodiment, the driving mechanism drives the support platform 21 to move to the second position (position B). At this time, the support platform 21 extends in the vertical direction, which facilitates the orientation measurement device 20 b to perform orientation measurement on the crystal rod 8 .

[0095] As an embodiment, after the orientation measurement device measures the crystal orientation deviation angle and the crystal orientation deviation direction of the crystal rod 8, the driving mechanism drives the support platform 21 located at the B position to rotate (the rotation angle is determined according to the crystal orientation deviation angle, generally within 5°), the rotation angle is equal to the crystal orientation deviation angle, and the rotation direction is opposite to the crystal orientation deviation direction. That is, by rotating, the wafer deflection compensation and alignment function of the crystal rod 8 in the Y-axis direction is realized. After the adjustment of the crystal orientation deviation is completed, the bonding device 20c can move to the bottom of the crystal rod 8 to bond the crystal rod 8.

[0096] Please continue reading Figure 6 , Figure 7 As an embodiment, the crystal rod fixing device 20a further includes a limiting mechanism 22, which is arranged outside the vacuum adsorption area 211, and the limiting mechanism 22 cooperates with the limiting matching structure 81 on the crystal rod 8 to limit the position of the crystal rod 8.

[0097] As an embodiment, the limiting mechanism 22 is fixed on the supporting platform 21 .

[0098] As an embodiment, the crystal rod 8 is Figure 2The crystal rod 8 shown, the corresponding limiting mechanism 22 includes an elastic ejector pin 220, a first roller 221 and a second roller 222, and the first roller 221 and the second roller 222 are located on opposite sides of the elastic ejector pin 220. It can be understood that the elastic ejector pin 220 is a force-bearing and retractable component. The positions of the first roller 221 and the second roller 222 are relatively fixed. When loading, the operator or the manipulator pushes the crystal rod 8 to the vacuum adsorption area 211, and makes the elastic ejector pin 220 abut against the notch 811a. The elastic ejector pin 220 is retractable. When the crystal rod 8 continues to be pushed, the elastic ejector pin 220 retracts, and the crystal rod 8 will abut against the first roller 221 and the second roller 222, and the position of the crystal rod 8 is limited. At this time, the vacuum generator can be started, and the first end face 8a of the crystal rod 8 is adsorbed in the vacuum adsorption area 211. It can be understood that the elastic ejector pin 220, the first roller 221 and the second roller 222 cooperate to limit the position of the crystal rod 8, so that the position of the crystal rod 8 stays in the vacuum adsorption area 211, which is convenient for vacuum adsorption and fixing the crystal rod 8. When the crystal rod 8 is fixed, the elastic ejector pin 220 is against the notch 811a, and the first roller 221 and the second roller 222 are in contact with the side 8c of the crystal rod 8. After the crystal rod 8 is fixed, the support table 21 can be rotated.

[0099] As an embodiment, at the second position, the elastic ejector pin 220, the first roller 221 and the second roller 222 are located on the upper side of the crystal rod 8, and the elastic ejector pin 220 is located on the top of the crystal rod 8, so as to reserve a position for accommodating the sacrificial material 9 under the crystal rod 8 and / or facilitate bonding.

[0100] It can be understood that during bonding, when an omnidirectional torque is applied from below, the first roller 221 and the second roller 222 bear the lateral force to prevent the crystal rod 8 from moving in translation.

[0101] See also Fig.12 As an embodiment, the limiting mechanism 22 includes a top limiting block 241 and a side limiting block 243, which is suitable for Figure 3 The crystal rod 8' shown provides a limit. Specifically, when loading, the operator or the manipulator pushes the crystal rod 8' toward the vacuum adsorption area 211, and makes the first flat edge 812a abut against the top limit block 241, and the second flat edge 812b abuts against the side limit block 243, and the position of the crystal rod 8 is limited. At this time, the vacuum generator can be started, and the first end face 8a of the crystal rod 8 is adsorbed in the vacuum adsorption area 211. It can be understood that the top limit block 241 and the side limit block 243 cooperate to limit the crystal rod 8, so that the position of the crystal rod 8 stays in the vacuum adsorption area 211, which is convenient for vacuum adsorption to fix the crystal rod 8. When the crystal rod 8 is fixed, the support table 21 can be rotated.

[0102] As an embodiment, at the second position, the top stopper 241 is located at the top of the crystal ingot 8, and the side stopper 243 is located at the left and / or right side of the crystal ingot 8. The top stopper 241 and the side stopper 243 are located at the top and side of the crystal ingot 8, which is convenient for reserving a position for accommodating the sacrificial material 9 under the crystal ingot 8 and / or for facilitating bonding.

[0103] As an embodiment, there is one side limit block 243, such as a side limit block 243 arranged on the left side, or a side limit block 243 arranged on the right side.

[0104] As an embodiment, there are two side limit blocks 243, that is, one on each side. In a single crystal ingot 8 limiting process, the side limit blocks 243 on one side or both sides limit the crystal ingot 8. The number of side limit blocks 243 can also be only one on the left or right side.

[0105] It can be understood that the top stop block 241 and / or the side stop block 243 may be fixed or movable. In the case of being movable, the crystal rod 8 may be pushed to a suitable position.

[0106] As an embodiment, the position where the limiting mechanism 22 contacts the crystal rod 8 is at least partially made of non-metallic material. In some embodiments, the first roller 221 and the second roller 222 are circular rollers made of non-metallic material to protect the crystal rod 8 from damage during limiting, fixing and operation.

[0107] As an embodiment, the structure of the limiting mechanism 22 is not limited, as long as it can complete the limiting of the crystal rod 8 before the crystal rod 8 is adsorbed and fixed. For example, the limiting of the crystal rod 8 can be achieved by setting the structure of the vacuum adsorption area 211.

[0108] As an embodiment, the limiting mechanism 22 may be omitted, and the limiting of the crystal rod 8 may be completed manually or in other ways.

[0109] See also Figure 7 , Fig.12 and Fig.13 As an embodiment, a sacrificial material 9 accommodating space is provided between the support platform 21 and the limiting mechanism 22 and / or under the crystal rod fixing device 20a. When the crystal rod 8 is fixed, the sacrificial material 9 is located in the sacrificial material 9 accommodating space.

[0110] As an embodiment, the area corresponding to the accommodating space of the sacrificial material 9 is staggered with the area where the vacuum adsorption area is located to avoid affecting the bonding.

[0111] As an embodiment, when the supporting platform 21 extends in the vertical direction, the lowermost end of the vacuum adsorption area 211 or the lowermost end of the supporting platform 21 is higher than the lowermost end of the crystal rod 8, that is, at least part of the crystal rod 8 is located below the lowermost end of the vacuum adsorption area 211 or the lowermost end of the supporting platform 21. Such a design can reserve accommodation space for the sacrificial material 9.

[0112] The present invention further provides a crystal ingot processing method, wherein the crystal ingot processing system 1 (the component numbers in the previous embodiment are used in this embodiment) comprises the crystal ingot fixing device 20a, the orientation measuring device 20b and the bonding device 20c as described above; in some embodiments, the crystal ingot processing method comprises the steps of:

[0113] Loading; the driving mechanism drives the carrier 21 to move to the first position, and the carrier 21 extends in the horizontal direction to facilitate placing the crystal rod 8 in the vacuum adsorption area 211;

[0114] Vacuum adsorption: fixing the crystal rod 8 to the vacuum adsorption area 211 by vacuum adsorption;

[0115] Moving the carrying platform 21; the driving mechanism drives the carrying platform 21 to move to a second position, and the carrying platform 21 extends in a vertical direction;

[0116] The detection light emitted by the orientation measuring device 20b is projected onto the first end face 8a of the crystal rod 8 through the hollow structure 213, and the diffracted detection light is analyzed to obtain the crystal orientation deviation angle and crystal orientation deviation direction of the crystal rod 8.

[0117] In some embodiments, after the loading step, the method further comprises the steps of:

[0118] Limiting; the limiting mechanism 22 is actuated to limit the position of the crystal rod 8;

[0119] After the orienting step, the method further comprises the steps of:

[0120] Adjusting the crystal orientation deviation; the driving mechanism drives the carrier 21 to rotate, the rotation angle is equal to the crystal orientation deviation angle, and the rotation direction is opposite to the crystal orientation deviation direction;

[0121] Bonding; the bonding device moves the base coated with adhesive to the bottom of the crystal rod 8 and contacts the sacrificial material 9 at the bottom of the crystal rod 8;

[0122] After the adhesive is solidified, the vacuum adsorption of the crystal rod 8 is released.

[0123] As an embodiment, at the second position, at least a portion of the bottom of the first end surface 8 a of the crystal rod 8 is exposed outside the first surface 21 a of the supporting platform 21 .

[0124] More specifically, confirm that the system has been initialized and entered the state of waiting for loading. Enter the loading preparation operation through the screen or button of the control system, the carrier 21 swings to a horizontal position, the crystal rod 8 is placed on the preset station manually or by a manipulator, and the loading completion instruction is entered. The system performs vacuum adsorption, detects the vacuum degree formed by the crystal rod 8 and the adsorption space, and the vacuum degree reaches the preset value. The carrier 21 swings to adjust the crystal rod 8 to the vertical position, and the crystal rod fixing device 20a cooperates with other mechanisms such as the directional measurement device 20b and the bonding device 20c to complete the directional measurement and bonding process. After the directional measurement process is completed, the carrier 21 swings through the control system, and has the function of compensating the wafer angle in the Y-axis direction. During the directional measurement and bonding process, the vacuum degree of the equipment is monitored in real time, and an alarm is immediately triggered when fluctuations occur and the protection program is entered. When the bonding process is completed and the unloading process is entered, the vacuum generator has a vacuum breaking function, which separates the crystal rod 8 from the carrier 21 and enters the next process cycle.

[0125] It can be understood that the description of the crystal rod processing system in the foregoing embodiments is applicable to the method embodiments.

[0126] Those skilled in the art will appreciate that, without conflict, the above-mentioned preferred solutions can be freely combined and superimposed.

[0127] It should be understood that the above-mentioned embodiments are merely illustrative and not restrictive. Without departing from the basic principles of the present invention, various obvious or equivalent modifications or substitutions that can be made by those skilled in the art to the above-mentioned details will all be included in the scope of the claims of the present invention.

Claims

1. A crystal rod fixing device, used for fixing a crystal rod, wherein the crystal rod comprises a side surface and a first end surface and a second end surface opposite to each other, characterized in that: The device comprises: A carrier platform, the carrier platform is in the shape of a plate, and is provided with a hollow structure for transmitting detection light, and the hollow structure runs through the carrier platform; the carrier platform comprises a first surface and a second surface opposite to each other, and a vacuum adsorption area is provided on the first surface around the hollow structure, and the vacuum adsorption area is used to adsorb the first end face of the crystal rod; When the first end face of the crystal rod is adsorbed on the vacuum adsorption area, part of the first end face of the crystal rod is exposed to the hollow structure, so that the detection light projected from the second surface side of the carrier table passes through the hollow structure and is projected onto the first end face; A relief groove for making way for the detection light is provided on the second surface of the carrier, the depth of the relief groove is less than the distance between the first surface and the second surface, and one end of the relief groove extends to the hollow structure; The depth of the avoidance groove gradually increases from an end away from the hollow structure to an end close to the hollow structure; There are multiple avoidance grooves, which are symmetrically arranged with the hollow structure as the center.

2. The crystal rod fixing device according to claim 1, characterized in that: A limited position matching structure is provided on the crystal rod; The device further comprises a limiting mechanism, which is arranged outside the vacuum adsorption area and cooperates with the limiting matching structure on the crystal rod to limit the position of the crystal rod.

3. The crystal rod fixing device according to claim 2, characterized in that: The limiting matching structure provided on the crystal rod is a notch, and the notch is provided on the side surface; The limiting mechanism comprises an elastic ejector pin, a first roller and a second roller, wherein the first roller and the second roller are located on opposite sides of the elastic ejector pin. When the crystal rod is fixed, the elastic ejector pin abuts against the notch, the first roller and the second roller contact the side surface of the crystal rod, and the elastic ejector pin cooperates with the first roller and the second roller to limit the position of the crystal rod. When the supporting platform extends in a vertical direction, the elastic ejector pin, the first roller and the second roller are located on the upper side of the crystal rod, and the elastic ejector pin is located on the top of the crystal rod.

4. The crystal rod fixing device according to claim 2, characterized in that: The limiting matching structure arranged on the crystal rod is a first flat edge and a second flat edge perpendicular to each other, and the first flat edge and the second flat edge are arranged on the side surface; The limiting mechanism comprises a top limiting block and a side limiting block. When the crystal ingot is fixed, the first flat edge abuts against the top limiting block, and the second flat edge abuts against the side limiting block. The top limiting block and the side limiting block cooperate to limit the position of the crystal ingot. When the supporting platform extends in the vertical direction, the top limiting block is located at the top of the crystal rod; There is one side limit block, or two side limit blocks are arranged on opposite sides of the crystal rod.

5. The crystal rod fixing device according to claim 2, characterized in that: The crystal rod is fixed on the sacrificial material; A sacrificial material accommodating space is provided between the carrying platform and the limiting mechanism and / or below the crystal rod fixing device, and when the crystal rod is fixed, the sacrificial material is located in the sacrificial material accommodating space; The area corresponding to the sacrificial material accommodating space is staggered with the area where the vacuum adsorption space is located.

6. The crystal rod fixing device according to any one of claims 2 to 5, characterized in that: The device includes a driving mechanism, which can drive the support platform to rotate to different positions to facilitate the loading of the crystal rod and / or adjust the crystal orientation deviation of the crystal rod and / or facilitate the bonding of the crystal rod. The rotation direction of the support platform is perpendicular to the support platform.

7. The crystal rod fixing device according to any one of claims 2 to 5, characterized in that: The limiting mechanism is fixed on the carrying platform; A soft material layer is disposed on the first surface of the carrying platform, and the soft material layer covers the vacuum adsorption area.

8. A crystal rod processing system, characterized in that: The device comprises a crystal rod fixing device, an orientation measuring device and a bonding device as described in any one of claims 1 to 7; the orientation measuring device is arranged on one side of the second surface of the carrier, and the crystal rod fixing device cooperates with the orientation measuring device to provide orientation for the crystal rod; The crystal rod fixing device cooperates with the bonding device to fix the crystal rod on the base.

9. A crystal rod processing method, the crystal rod processing method is implemented by a processing system, characterized in that: The crystal ingot processing system comprises the crystal ingot fixing device, orientation measuring device and bonding device as claimed in claim 6; The crystal rod processing method comprises the steps of: Loading; the driving mechanism drives the carrying platform to move to a first position, and the carrying platform extends in a horizontal direction so as to place the crystal rod in the vacuum adsorption area; Vacuum adsorption; Fixing the crystal rod in the vacuum adsorption area by vacuum adsorption; Mobile loading platform; The driving mechanism drives the carrying platform to move to a second position, and the carrying platform extends in a vertical direction; Orientation; The detection light emitted by the orientation measurement device is projected onto the first end face of the crystal rod through the hollow structure, and the diffracted detection light is analyzed to obtain the crystal orientation deviation angle and crystal orientation deviation direction of the crystal rod.

10. The method for processing a crystal rod according to claim 9, characterized in that: After the feeding step, the method further comprises the steps of: Limiting; the limiting mechanism is actuated to limit the position of the crystal rod; After the orienting step, the method further comprises the steps of: Adjusting the crystal orientation deviation; the driving mechanism drives the carrier to rotate, the rotation angle is equal to the crystal orientation deviation angle, and the rotation direction is opposite to the crystal orientation deviation direction; Bonding; the bonding device moves the base coated with adhesive to the bottom of the crystal rod and contacts the sacrificial material at the bottom of the crystal rod; After the adhesive is solidified, the vacuum adsorption of the crystal rod is released.

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