Testing device and testing method

Abstract

The invention discloses a testing device and a testing method, and belongs to the field of testing. The testing device provided by the invention comprises a target chip, a chip testing seat, a voltage sampling module and a target resistor, the target chip is communicated with the chip test seat, and the chip test seat is connected with the target resistor; the voltage sampling module is arranged between the chip testing seat and the target resistor, and the voltage sampling module is connected with the target resistor in parallel; the output end of the voltage sampling module is connected with the target chip; wherein the target chip is used for detecting the contact impedance between the target chip and the chip test seat; the contact impedance is determined based on a first voltage signal output by the target chip, a second voltage value detected by the voltage sampling module and the target resistance.

Description

Technical Field

[0001] The present invention relates to the field of testing, and specifically to a testing device and a testing method. Background Art

[0002] The speed of chip updates and iterations is getting faster and faster, and the functions are becoming more and more complex, which requires higher test reliability and less test time to quickly launch products to the market. After the chip is packaged and tested, it is generally necessary to use a chip test socket (such as IC Socket) to perform functional verification tests such as FT (Function Test) and SLT (System Level Test). However, the chip test socket is affected by the probe process and materials. As the number of uses increases, its contact state and stability will deteriorate, the test signal loss will increase, and the test signal integrity will be affected, resulting in the failure of functional test verification such as FT and SLT, which affects the efficiency of chip testing. Therefore, before using the chip test socket for functional verification testing, it is very important to ensure that the contact state of the chip test socket is normal.

[0003] In the related art, it is generally possible to directly embed electrical signals into the probes of the chip test socket when the chip to be tested is not placed on the chip test socket, and test the contact impedance of the chip test socket. However, there is a problem in the related art that the contact impedance of the chip test socket obtained by the test is poor in accuracy. Specifically, in the related art, since the impedance of the chip test socket is tested when the chip test socket is not in use, only part of the contact impedance between one end and the other end of the probe of the chip test socket can be detected, but the part of the impedance between the probe of the chip test socket and the PCB (Printed Circuit Board) pad, and the impedance between the probe of the chip test socket and the pin of the chip to be tested cannot be detected, so it is difficult to accurately test and obtain the real contact impedance between the chip to be tested and the chip test socket, resulting in poor accuracy of the contact impedance of the chip test socket obtained by the test. Summary of the invention

[0004] The embodiments of the present application provide a testing device and a testing method, which can solve the problem of poor accuracy of contact impedance of a chip test socket obtained by testing in the related art.

[0005] In a first aspect, an embodiment of the present application provides a testing device, comprising: Target chip, chip test socket, voltage sampling module and target resistor; The target chip is connected to the chip test socket, and the chip test socket is connected to the target resistor; the voltage sampling module is arranged between the chip test socket and the target resistor, and the voltage sampling module is connected in parallel with the target resistor; the output end of the voltage sampling module is connected to the target chip; The target chip is used to detect the contact impedance between the target chip and the chip test socket; the contact impedance is determined based on a first voltage signal output by the target chip, a second voltage value detected by the voltage sampling module, and the target resistance.

[0006] In a second aspect, an embodiment of the present application provides a testing method, which is applied to the testing device described in the first aspect, and the method includes: The target chip outputs a first voltage signal to the chip test socket; The target chip receives a second voltage value detected by the voltage sampling module; The target chip determines the contact impedance between the target chip and the chip test socket based on the first voltage signal, the second voltage value and the resistance value of the target resistor.

[0007] In an embodiment of the present application, the test device includes a target chip, a chip test socket, a voltage sampling module and a target resistor; the target chip is connected to the chip test socket, and the chip test socket is connected to the target resistor; the voltage sampling module is arranged between the chip test socket and the target resistor, and the voltage sampling module is connected in parallel with the target resistor; the output end of the voltage sampling module is connected to the target chip; wherein the target chip is used to detect the contact impedance between the target chip and the chip test socket; the contact impedance is determined based on the first voltage signal output by the target chip, the second voltage value detected by the voltage sampling module and the target resistor. In this way, since the contact impedance between the target chip and the chip test socket is tested when the target chip is connected to the chip test socket (i.e., when the chip test socket is used), the contact impedance obtained by the test can reflect the real contact impedance between the target chip and the chip test socket during the functional verification test of the target chip using the chip test socket, thereby improving the accuracy of the contact impedance obtained by the test. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 A schematic structural diagram of a testing device provided in an embodiment of the present application; Figure 2 A schematic structural diagram of another testing device provided in an embodiment of the present application; Figure 3 A schematic structural diagram of another testing device provided in an embodiment of the present application; Figure 4-1 A schematic diagram of a working state of a testing device provided in an embodiment of the present application; Figure 4-2 A schematic diagram of another working state of the testing device provided in an embodiment of the present application; Figure 4-3 A schematic diagram of another working state of the test device provided in an embodiment of the present application; Figure 5 A schematic flow chart of a testing method provided in an embodiment of the present application; Figure 6 A schematic flow chart of another testing method provided in an embodiment of the present application.

[0009] Description of reference numerals: 100-test device; 110-target chip; a-target pin of target chip; 111-voltage sampling unit; 120-chip test socket; 130-voltage sampling module; 140-target resistor; 150-first channel switching module; 160-second channel switching module; 170-functional verification test module; 180-host computer; R1-first resistor; R2-second resistor; R3-adjustable resistor; SW1-first switch; SW2-second switch. DETAILED DESCRIPTION

[0010] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0011] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0012] In order to solve the problem of poor accuracy of the contact impedance of the chip test socket obtained by testing in the related art, the testing device provided in the embodiment of the present application can test the contact impedance between the target chip and the chip test socket when the target chip is connected to the chip test socket (that is, when the chip test socket is in use). The contact impedance obtained by the test can reflect the actual contact impedance between the target chip and the chip test socket during the functional verification test of the target chip using the chip test socket, thereby improving the accuracy of the contact impedance obtained by the test.

[0013] The parameter calling method provided in the embodiment of the present application is described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0014] Figure 1 A schematic structural diagram of a testing device provided in an embodiment of the present application.

[0015] like Figure 1 As shown, the test device 100 provided in the embodiment of the present application may include: a target chip 110, a chip test socket 120, a voltage sampling module 130 and a target resistor 140; The target chip 110 is connected to the chip test socket 120, and the chip test socket 120 is connected to the target resistor 140; the voltage sampling module 130 is arranged between the chip test socket 120 and the target resistor 140, and the voltage sampling module 130 is connected in parallel with the target resistor 140; the output end of the voltage sampling module 130 is connected to the target chip 110; The target chip 110 is used to detect the contact impedance between the target chip 110 and the chip test socket 120 ; the contact impedance is determined based on the first voltage signal output by the target chip 110 , the second voltage value detected by the voltage sampling module 130 , and the target resistor 140 .

[0016] In an embodiment of the present application, the target chip 110 can be used to output a first voltage signal to the chip test socket 120; receive a second voltage value detected by the voltage sampling module 130; and determine the contact impedance between the target chip 110 and the chip test socket 120 based on the first voltage signal, the second voltage value and the resistance value of the target resistor.

[0017] In the embodiment of the present application, the target chip 110 may be any type of chip, and the present application does not limit the type of the target chip 110 .

[0018] In the embodiment of the present application, the target chip 110 may be a chip to be tested. Specifically, the chip test socket 120 may be used to perform functional verification tests such as FT and SLT on the target chip 110 .

[0019] Among them, FT testing is a test after packaging is completed, which is used to check the yield of packaging. FT testing can specifically check the manufacturing process level of the packaging factory. FT testing generally tests and verifies the electrical characteristics of the chip.

[0020] Among them, SLT test is a system-level test, which tests whether the functions of specific modules inside the chip are normal. Generally, the chip to be tested is installed on the chip test socket of the test motherboard. After configuring the memory and peripherals of the test motherboard, an operating system can be started, and then the software is used to perform the test, and the results are recorded and compared to verify whether the functions of specific modules inside the chip are normal.

[0021] The main function of the chip test socket 120 is to connect and conduct, and is used for integrated circuit application function verification. The chip test socket 120 is a static connector between the PCB and the chip to be tested, which can make the replacement test of the chip more convenient, without the need to repeatedly solder and remove the chip to be tested, reducing the damage to the chip to be tested and the PCB, so as to achieve a fast and efficient test effect. The chip test socket is generally required during the FT and SLT testing process.

[0022] It is understandable that the chip test seat is affected by the probe process and materials, and its contact state and stability will deteriorate as the number of uses increases. For example, after the impedance of the high-frequency signal transmission line on the chip test seat changes, the quality of high-frequency signal transmission decreases, the signal loss increases, and the signal integrity is affected, resulting in FT and SLT verification failures, affecting the efficiency of chip testing. Therefore, it is very important to detect the contact impedance of the chip test seat before performing functional verification tests such as FT and SLT to ensure that the contact impedance of the chip test seat is normal. The existing contact impedance test method of the chip test seat is to test the impedance of the chip test seat when the chip test seat is not in use, and can only detect the partial contact impedance between one end of the probe of the chip test seat and the other end, but cannot detect the partial impedance between the probe of the chip test seat and the PCB pad, and the impedance between the probe of the chip test seat and the pin of the chip to be tested, so it is difficult to accurately test the real contact impedance between the chip to be tested and the chip test seat, resulting in poor accuracy of the contact impedance of the chip test seat obtained by the test. In the test device provided in the embodiment of the present application, when the chip test socket is in use (that is, the target chip is placed in the chip test socket and the target chip is connected to the chip test socket), the actual contact impedance between the target chip and the chip test socket is tested. In this way, the actual contact impedance between the target chip and the chip test socket can be tested more accurately.

[0023] For example, when the target chip 110 is connected to the target resistor 140 via the chip test socket 120, the target chip 110 can output a first voltage signal to the chip test socket 120; the voltage sampling module 130 is connected in parallel with the target resistor 140, and can detect the voltage value across the target resistor 140 to obtain a second voltage value; then the target chip 110 receives the second voltage value detected by the voltage sampling module 130, and determines the contact impedance of the chip test socket 120 based on the first voltage signal, the second voltage value and the resistance value of the target resistor 140.

[0024] The first voltage signal can be recorded as V0, the second voltage value can be recorded as V1, the resistance value of the target resistor 140 can be recorded as R3, and the contact impedance of the chip test socket 120 can be recorded as R, wherein the resistance value of the target resistor 140 is a known value. Since the target resistor 140 has a voltage dividing effect on the first voltage signal, the voltage value V1 across the target resistor 140 = V0*[R3 / (R3+R)], and then based on the first voltage signal V0, the second voltage value V1 and the resistance value R3 of the target resistor 140, the contact impedance R = R3*(V0 / V1)-R3 of the chip test socket 120 can be determined.

[0025] In this way, since the contact impedance between the target chip 110 and the chip test socket 120 is detected when the target chip 110 is connected to the chip test socket 120 (that is, when the chip test socket 120 is in use), the detected contact impedance is real, and may include the partial contact impedance between one end of the probe of the chip test socket to the other end, the partial impedance between the probe of the chip test socket and the PCB pad, and the sum of the partial impedance between the probe of the chip test socket and the pin of the target chip. Therefore, the contact impedance obtained by the test can reflect the real contact impedance between the target chip 110 and the chip test socket 120 during the functional verification test of the target chip 110 using the chip test socket 120, thereby improving the accuracy of the contact impedance obtained by the test.

[0026] According to the test device provided by the embodiment of the present application, it includes a target chip, a chip test socket, a voltage sampling module and a target resistor; the target chip is connected to the chip test socket, and the chip test socket is connected to the target resistor; the voltage sampling module is arranged between the chip test socket and the target resistor, and the voltage sampling module is connected in parallel with the target resistor; the output end of the voltage sampling module is connected to the target chip; wherein the target chip is used to detect the contact impedance between the target chip and the chip test socket; the contact impedance is determined based on the first voltage signal output by the target chip, the second voltage value detected by the voltage sampling module and the target resistor. In this way, since the contact impedance between the target chip and the chip test socket is tested when the target chip is connected to the chip test socket (i.e., when the chip test socket is used), the contact impedance obtained by the test can reflect the real contact impedance between the target chip and the chip test socket during the functional verification test of the target chip using the chip test socket, thereby improving the accuracy of the contact impedance obtained by the test.

[0027] In a specific embodiment, in order to improve the accuracy of the contact impedance obtained by the test, when determining the contact impedance, the voltage division calculation can be performed based on the actual sampling value of the first voltage signal (rather than the theoretical output value). The actual voltage sampling value of the first voltage signal can also be detected by the voltage sampling module. For example, Figure 2 As shown, the test device 100 provided in the embodiment of the present application may further include a first channel switching module 150, and the chip test socket 120 is connected to the target resistor 140 via the first channel switching module 150; the first channel switching module 150 has a first end, a second end and a third end, the first end of the first channel switching module 150 is connected to the chip test socket 120, the second end of the first channel switching module 150 is in a floating state, and the third end of the first channel switching module 150 is connected to the target resistor 140; In the embodiment of the present application, the first channel switching module 150 has a switch switching function, for example, Figure 4-1 The first channel switching module 150 may include a first switch SW1, and the first switch SW1 may include a single-pole double-throw switch. Of course, the first channel switching module 150 may also be other types of switches, and the present application does not make any specific restrictions on this.

[0028] In the embodiment of the present application, the first channel switching module 150 has a first state and a second state; In the first state, the first end of the first channel switching module 150 is connected to the second end of the first channel switching module 150, so that the target pin a of the target chip 110 is in a floating state, and the target pin a is a pin connected to the chip test socket 120; refer to Figure 2 In the first state, the first channel switching module 150 switches to the A1 channel, so that the target pin a of the target chip 110 is in a floating state. At this time, the voltage sampling module 130 can detect a first voltage value, which can be an actual sampling value of the first voltage signal.

[0029] In the second state, the first end of the first channel switching module 150 is connected to the third end of the first channel switching module 150 , so that the target chip 110 is connected to the target resistor 140 via the chip test socket 120 , the first channel switching module 150 .

[0030] refer to Figure 2 In the second state, the first channel switching module 150 switches to the A2 channel, so that the target chip 110 is connected to the target resistor 140 via the chip test socket 120. At this time, the voltage sampling module 130 can detect a second voltage value, which can be the actual voltage sampling value at both ends of the target resistor 140.

[0031] For example, when the first channel switching module 150 is in the first state, the voltage sampling module 130 is used to detect the first voltage signal to obtain a first voltage value (for example, V0); when the first channel switching module 150 is in the second state, the voltage sampling module 130 is used to detect the second voltage signal to obtain a second voltage value (for example, V1); wherein the second voltage signal is a voltage signal after the first voltage signal is divided by the chip test socket 120 and the target resistor 140. Then, the contact impedance R=R3*(V0 / V1)-R3 of the chip test socket 120 can be determined.

[0032] In this way, when the first channel switching module 150 switches to the A1 channel to make the target pin a of the target chip 110 in a floating state, the voltage sampling module 130 can detect and obtain the first voltage value, which can be the actual sampling value of the first voltage signal. Furthermore, when determining the contact impedance, the voltage division calculation can be performed based on the actual sampling value of the first voltage signal (rather than the theoretical output value), thereby further improving the calculation accuracy of the contact impedance.

[0033] In a specific example, in order to improve the sampling accuracy of the voltage sampling module 130, as shown in FIG. Figure 2 As shown, in the test device provided in the embodiment of the present application, the target chip 110 may include a voltage sampling unit 111, and the voltage sampling unit 111 is connected to a target pin a of the target chip 110; Wherein, when the first channel switching module 150 is in the first state, the voltage sampling unit 111 is used to detect the first voltage signal to obtain a third voltage value; The target chip 110 is used to control the first channel switching module 150 to switch from the first state to the second state when the first voltage value is the same as the third voltage value.

[0034] For example, refer to Figure 4-1 , when the first channel switching module 150 is in the first state, the first channel switching module 150 switches to the A1 channel to make the target pin a of the target chip 110 in a floating state. At this time, if the first voltage value sampled by the voltage sampling module 130 outside the target chip 110 is the same as the third voltage value sampled by the voltage sampling unit 111 inside the target chip 110 (for example, the first voltage value and the third voltage value are both equal to the theoretical output value of the first voltage signal), it means that the sampling error of the voltage sampling module 130 is negligible and the accuracy of the sampled voltage is high. Figure 4-2 , the target chip 110 can control the first channel switching module 150 to switch from the first state to the second state (the first channel switching module 150 switches from the A1 channel to the A2 channel) when the first voltage value is the same as the third voltage value, and control the voltage sampling module 130 to sample the voltage across the target resistor 140 to obtain a more accurate second voltage value.

[0035] In addition, when the first voltage value is different from the third voltage value, it indicates that the voltage sampling module 130 has a large sampling error. At this time, the target chip 110 is also used to calibrate the voltage sampling module 130. For example, the voltage sampling module 130 is zeroed and calibrated to improve the accuracy of the sampling data of the voltage sampling module 130.

[0036] In this way, sampling is performed when it is determined that the sampling accuracy of the voltage sampling module 130 is high, and a valid sampled voltage (eg, a first voltage value, a second voltage value) is obtained, thereby improving the accuracy of the sampling data of the voltage sampling module 130 .

[0037] In addition, after the contact impedance calculation is completed, the present application can perform subsequent signal-related functional tests, combining the contact impedance calculation and the functional verification test together to improve the efficiency of the functional verification test.

[0038] For example, in another specific example, in order to improve the efficiency of functional verification testing, such as Figure 3 As shown, the test device 100 provided in the embodiment of the present application may further include: a second channel switching module 160 and a function verification test module 170, the chip test socket 120 is connected to the target resistor 140 via the second channel switching module 160; the chip test socket 120 is also connected to the function verification test module 170 via the second channel switching module 160; The second channel switching module 160 has a first end, a second end and a third end. The first end of the second channel switching module 160 is connected to the chip test socket 120, the second end of the second channel switching module 160 is connected to the target resistor 140, and the third end of the second channel switching module 160 is connected to the functional verification test module 170.

[0039] In the embodiment of the present application, the second channel switching module 160 has a switch switching function, for example, Figure 4-1 The second channel switching module 160 may include a second switch SW2, and the second switch SW2 may include a single-pole double-throw switch. Of course, the second channel switching module 160 may also be other types of switches, and the present application does not make any specific restrictions on this.

[0040] Wherein, the second channel switching module 160 has a third state and a fourth state; In the third state, the first end of the second channel switching module 160 is connected to the second end of the second channel switching module 160, so that the target chip 110 is connected to the target resistor 140 via the chip test socket 120, the second channel switching module 160; refer to Figure 3 In the third state, the second channel switching module 160 switches to the A3 channel, so that the target chip 110 and the target resistor 140 are turned on. At this time, the target chip 110 can control the voltage sampling module 130 to perform voltage sampling and calculate the contact impedance between the target chip 110 and the chip test socket 120.

[0041] In the fourth state, the first end of the second channel switching module 160 is connected to the third end of the second channel switching module 160 , so that the target chip 110 is connected via the chip test socket 120 , the second channel switching module 160 and the function verification test module 170 .

[0042] refer to Figure 3 In the fourth state, the second channel switching module 160 switches to the A4 channel, so that the target chip 110 is connected to the functional verification test module 170. At this time, the functional verification test can be performed on the target chip 110.

[0043] For example, refer to Figure 4-2 , when the second channel switching module 160 is in the third state (the second channel switching module 160 is switched to the A3 channel), the target chip 110 is used to determine the contact impedance between the target chip 110 and the chip test socket 120; refer to Figure 4-3 When the second channel switching module 160 is in the fourth state (the second channel switching module 160 is switched to the A4 channel), the function verification test module 170 is used to perform a function verification test on the target chip 110 to obtain a function verification test result.

[0044] In this way, the embodiment of the present application integrates a function verification test module in the test device, combines the contact impedance calculation and the function verification test together, and improves the efficiency of the function verification test.

[0045] In practical applications, in order to improve the yield of the functional verification test, the target chip 110 is specifically used to control the second channel switching module 160 to switch from the third state to the fourth state when the contact impedance R is less than or equal to a preset threshold.

[0046] In the embodiment of the present application, after the contact impedance calculation is completed, it is determined whether the contact impedance exceeds the preset threshold value, and then whether to perform a functional verification test is determined. When the contact impedance is less than or equal to the preset threshold value, it indicates that the contact impedance is normal, and a functional verification test can be performed subsequently. When the contact impedance exceeds the preset threshold value, it indicates that the contact impedance is abnormal, and the subsequent use of a chip test socket with abnormal contact impedance for functional verification testing may lead to misjudgment, and it is not recommended to perform a functional verification test.

[0047] In this way, before the target chip is subjected to a functional verification test, it can be detected whether the contact impedance between the target chip and the chip test socket is abnormal. When the contact impedance is normal (for example, the contact impedance is less than or equal to a preset threshold), a functional verification test can be performed, thereby avoiding misjudgment of the test results of the target chip due to external contact impedance problems and improving the yield of the functional verification test.

[0048] In addition, in another specific example, in order to promptly remind the user that the contact impedance of the chip test socket is abnormal, so as to facilitate the subsequent replacement of the chip test socket with normal contact impedance for functional verification testing, such as Figure 3 As shown, the test device 100 provided in the embodiment of the present application may further include a host computer 180; the host computer 180 is connected to the target chip 110; The target chip 110 is used to receive a first voltage signal provided by the host computer 180; The target chip 110 is also used to upload the target test result to the host computer 180; the target test result includes at least one of the contact impedance and the function verification test result; The host computer 180 is used to prompt that the contact impedance is abnormal when the contact impedance is greater than a preset threshold.

[0049] Among them, the host computer 180 can be a mobile phone, a tablet computer, a laptop computer, a PDA, an in-vehicle electronic device, a mobile Internet Device (MID), an ultra-mobile personal computer (UMPC), a netbook or a personal digital assistant (PDA), etc. It can also be a server, a network attached storage (NAS), a personal computer (PC), etc., and the embodiments of the present application are not specifically limited.

[0050] In this way, the host computer 180 can make timely judgments and processing when abnormal contact impedance occurs during the use of the chip test socket 120, and promptly prompt the abnormal contact impedance of the chip test socket, so as to facilitate subsequent replacement of the chip test socket with normal contact impedance for functional verification testing.

[0051] In addition, in order to improve the test accuracy of contact impedance, such as Figure 4-2 As shown, the target resistor 140 is an adjustable resistor R3 ; the resistance of the adjustable resistor R3 can be determined based on the interface type of the target pin a of the target chip; the target pin a is a pin connected to the chip test socket 120 .

[0052] Among them, different interface types of target pins have corresponding contact impedances of different magnitudes. The target chip 110 can set the resistance value of the target resistor 140 based on the interface type of the target pin a of the target chip, so that the size of the target resistor 140 is close to the magnitude of the contact impedance corresponding to the target pin of the current interface type, thereby avoiding the large difference in magnitude between the target resistor 140 and the contact impedance and affecting the test accuracy of the contact impedance.

[0053] In this way, in the present application, the target chip 110 can set the resistance value of the target resistor 140 based on the interface type of the target pin a of the target chip, so that the size of the target resistor 140 is close to the order of magnitude of the contact impedance corresponding to the target pin of the current interface type, thereby further improving the test accuracy of the contact impedance.

[0054] Based on the same technical concept as the testing device provided in the above embodiments, the embodiments of the present application also provide a testing method, which is applied to the testing device provided in any of the above embodiments.

[0055] Figure 5 A schematic flow chart of a testing method provided in an embodiment of the present application.

[0056] like Figure 5As shown, the test method provided in the embodiment of the present application is applied to the test device provided in any of the above embodiments, and the test method may include: Step 510: The target chip outputs a first voltage signal to the chip test socket; Step 520: The target chip receives a second voltage value detected by the voltage sampling module; Step 530: The target chip determines the contact impedance between the target chip and the chip test socket based on the first voltage signal, the second voltage value and the resistance value of the target resistor.

[0057] According to the test method provided in the embodiment of the present application, a first voltage signal is output to the chip test socket through the target chip; the target chip receives a second voltage value detected by the voltage sampling module; the target chip determines the contact impedance of the chip test socket based on the first voltage signal, the second voltage value and the resistance value of the target resistor. In this way, since the contact impedance between the target chip and the chip test socket is tested when the target chip is connected to the chip test socket (i.e., when the chip test socket is used), the contact impedance obtained by the test can reflect the actual contact impedance between the target chip and the chip test socket during the functional verification test of the target chip using the chip test socket, thereby improving the accuracy of the contact impedance obtained by the test.

[0058] It should be pointed out that the testing method provided in the embodiments of the present application is applied to the testing device provided in any of the above embodiments, and can realize all the functions of the testing device provided in any of the above embodiments. To avoid repetition, it will not be described here.

[0059] In practical applications, FT and SLT test systems generally include a set of test machines consisting of a PC, an SLT test motherboard, and a manipulator, etc. The present application provides a test device for detecting the contact impedance of a chip test socket, which can be used to detect the contact impedance of a chip test socket during FT and SLT testing.

[0060] Among them, reference Figure 3 The test device 100 may include: a host computer 180 , a target chip 110 , a chip test socket 120 , a second channel switching module 160 , a first channel switching module 150 , a function verification test module 170 , a voltage sampling module 130 and a target resistor 140 .

[0061] The host computer 180 may be a PC. The host computer and the target chip are connected via a serial port or a USB interface to receive and display the test verification results sent by the target chip. The host computer records the results of each test of the target chip.

[0062] The target chip 110 may be a chip to be tested. Usually, after being powered on, a test program may be run to complete the contact impedance calculation of the chip test socket and related functional verification tests, and the test results may be transmitted to the host computer 180 .

[0063] The chip test socket 120 can be used to connect the target chip and the PCB. Different chips have different packages and chip test sockets, but their structures are similar.

[0064] The first channel switching module 150 / the second channel switching module 160 can be used to switch the signal channel to be tested, which usually refers to high-speed signals that are sensitive to impedance changes. Usually, such signals need to detect the impedance changes of the transmission channel to exclude the test results of the chip affected by the changes in external conditions. The channel switching module is controlled by the target chip and switches to different signal channels according to the command of the target chip for contact impedance detection of the chip test socket and related functional verification tests.

[0065] Among them, the functional verification test module 170 may include an FT test module and an SLT test module, which can be used to complete chip electrical characteristics and functional tests. In addition to realizing the contact impedance detection of the chip test socket, the present application also ensures that the FT and SLT tests are not affected. The functional verification test can be designed and implemented according to the interface function of the target chip.

[0066] Among them, the voltage sampling module 130: collects voltage data of the signal. It should be noted that the voltage sampling unit inside the target chip 110 collects the voltage at the chip pin, and the voltage sampling module outside the target chip 110 collects the voltage of the signal after passing through the chip test socket. At the same time, the target chip 110 can read the voltage (e.g., the second voltage value) of the external voltage sampling module 130 during the contact impedance detection phase to calculate the contact impedance between the target chip 110 and the chip test socket.

[0067] When calculating the chip test socket contact impedance, the target resistor 110 can be connected to the measured signal interface of the target chip. The resistance of the target resistor is adjusted and controlled by the target resistor 110, and the specific resistance is set by the target resistor 110 according to the signal interface type.

[0068] Take a pair of high-speed differential signals output by the target pin of the target chip as an example. Figure 6 As shown, the testing method of the embodiment of the present application may include the following process: Step 601: Place the target chip into the chip test socket and power it on; After the host computer completes the settings related to the target chip test, the target chip can be placed in the chip test socket, powered on, and the target chip runs the system program; Step 602: The target chip controls the first channel switching module to switch to A1, and controls the second channel switching module to switch to A3; Among them, reference Figure 4-1 , after the target chip controls the first channel switching module to switch to A1 and controls the second channel switching module to switch to A3, the target pin of the target chip can be placed in a floating state; Step 603: the target chip outputs DC voltages V0p and V0n; Step 604: the target chip reads the sampled voltages of the internal voltage sampling unit and the external voltage sampling module; Step 605: determine whether the sampled voltages are equal to V0p and V0n; Wherein, in step 605, if the target chip determines that the sampling voltages of the internal voltage sampling unit and the external voltage sampling module are both equal to V0p and V0n, then step 606 is executed, otherwise step 607 is executed; Step 606: The target chip controls the first channel switching module to switch to A2, so that the target chip and the target resistor are connected; Step 607: zeroing and calibrating the voltage sampling module; Among them, in step 603 to step 607, a pair of high-speed differential signals output by the target pin of the target chip is used as an example. The power module (DC) in the target chip outputs a pair of DC voltages V0p and V0n through the target pin. At the same time, the voltage sampling unit inside the target chip and the voltage sampling module outside the target chip both collect the voltage on the signal channel. After the target chip reads the sampled voltages of the voltage sampling unit inside the target chip and the voltage sampling module outside the target chip, it compares them. If the sampled voltages are equal to the output voltages (V0p and V0n), the next step is performed. If they are not equal, the voltage sampling module will be adjusted for zero calibration.

[0069] Step 608: The target chip reads the sampled voltages V1p and V1n of the external voltage sampling module; In step 608, reference Figure 4-2 After the target chip controls the first channel switching module to switch to A2, so that the target chip and the resistor R3 are turned on, a pair of DC voltages V1p and V1n collected by the external voltage sampling module can be read.

[0070] Step 609: Calculate the contact impedance of the chip test socket inside the target chip, R=R3*(V0p-V0n) / (V1p-V1n)-R3; Here, a pair of high-speed differential signals is used as an example. Its equivalent circuit is as follows: Figure 4-2As shown, the first resistor R1 and the second resistor R2 represent the contact impedance on the two signal lines after passing through the chip test socket. The first switch SW1 and the second switch SW2 are equivalent to two channel switching modules. The calculation formula of the contact impedance R is as follows: R=R1+R2=R3*(V0p-V0n) / (V1p-V1n)-R3.

[0071] Since the contact impedance between the target chip and the chip test socket is tested when the target chip is connected to the chip test socket (i.e., when the chip test socket is in use), the contact impedance obtained by the test can reflect the actual contact impedance between the target chip and the chip test socket during the functional verification test of the target chip using the chip test socket, thereby improving the accuracy of the contact impedance obtained by the test.

[0072] Moreover, the embodiment of the present application can combine the voltage sampling unit inside the target chip with the voltage sampling module outside the target chip, and complete the contact impedance calculation of the chip test socket inside the target chip by controlling the external channel signal switching, without directly testing the probe impedance on the chip test socket, and the test implementation scheme is simple.

[0073] Step 610: determining whether the contact impedance R is less than or equal to a preset threshold; Among them, in step 610, if the target chip determines that the contact impedance R is less than or equal to the preset threshold, then step 611 is executed, otherwise step 612 is executed. Specifically, in the test program, the host computer can set a preset threshold M. If the contact impedance R calculated by the target chip is greater than the preset threshold M, it means that the chip test socket is in abnormal contact with the target chip and the PCB, which may lead to a misjudgment of the test result. The chip test socket needs to be processed and the test is stopped. If the contact impedance R calculated by the target chip is less than or equal to the preset threshold M, it means that the contact is good and a functional verification test can be performed; Step 611: the target chip controls the second channel switching module to switch to A4, so that the target chip is connected to the function verification test module; Among them, reference Figure 4-3 , after the target chip controls the second channel switching module to switch to A4, the functional verification test module can be used to perform a functional verification test; Step 612: The target chip uploads the test result to the host computer; the host computer prompts that the contact impedance of the chip test socket is abnormal; Among them, if the contact impedance R calculated by the target chip is greater than the preset threshold M, it means that the chip test socket is in abnormal contact with the target chip and PCB, which may lead to misjudgment of the test results. The host computer prompts that the contact impedance of the chip test socket is abnormal, that is, the user is prompted to process the chip test socket and the test stops.

[0074] Step 613: The target chip performs a functional verification test.

[0075] After the contact impedance calculation is completed, since a subsequent signal-related functional verification test is also performed, the contact impedance calculation and functional test verification are combined together, thereby improving the efficiency and yield of the functional verification test.

[0076] The test method provided in the embodiment of the present application realizes the calculation of the signal channel impedance from the target chip pin to the PCB pad by combining the target chip with internal and external voltage sampling and signal channel switching, and the implementation scheme is simple; because the contact impedance between the target chip and the chip test socket is tested when the target chip is connected to the chip test socket (i.e., when the chip test socket is used), the contact impedance obtained by the test can reflect the actual contact impedance between the target chip and the chip test socket during the functional verification test of the target chip using the chip test socket, thereby improving the accuracy of the contact impedance obtained by the test. Moreover, after the impedance calculation is completed, by judging whether it exceeds the set threshold, and then deciding whether to perform a functional test, it can be detected whether the contact impedance between the target chip and the chip test socket is abnormal before the functional verification test of the target chip, which can avoid the misjudgment of the functional verification test result due to the external contact impedance problem, thereby improving the efficiency and yield of the functional verification test.

[0077] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0078] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a computer software product, which is stored in a storage medium (such as ROM / RAM, a magnetic disk, or an optical disk), and includes a number of instructions for enabling a terminal (which can be a mobile phone, a computer, a server, or a network device, etc.) to execute the methods described in each embodiment of the present application.

[0079] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A testing device, characterized in that: It includes a target chip, a chip test socket, a voltage sampling module and a target resistor; The target chip is connected to the chip test socket, and the chip test socket is connected to the target resistor; the voltage sampling module is arranged between the chip test socket and the target resistor, and the voltage sampling module is connected in parallel with the target resistor; the output end of the voltage sampling module is connected to the target chip; The target chip is used to detect the contact impedance between the target chip and the chip test socket; the contact impedance is determined based on a first voltage signal output by the target chip, a second voltage value detected by the voltage sampling module, and the target resistance.

2. The testing device according to claim 1, characterized in that: The test device further includes a first channel switching module, and the chip test socket is connected to the target resistor via the first channel switching module; the first channel switching module has a first end, a second end and a third end, the first end of the first channel switching module is connected to the chip test socket, the second end of the first channel switching module is in a floating state, and the third end of the first channel switching module is connected to the target resistor; Wherein, the first channel switching module has a first state and a second state; In a first state, the first end of the first channel switching module is connected to the second end of the first channel switching module, so that the target pin of the target chip is in a floating state, and the target pin is a pin connected to the chip test socket; In the second state, the first end of the first channel switching module is connected to the third end of the first channel switching module, so that the target chip is connected to the target resistor via the chip test socket, the first channel switching module and the target resistor.

3. The testing device according to claim 2, characterized in that: When the first channel switching module is in a first state, the voltage sampling module is used to detect the first voltage signal to obtain a first voltage value; When the first channel switching module is in the second state, the voltage sampling module is used to detect the second voltage signal to obtain a second voltage value; The second voltage signal is a voltage signal obtained by dividing the first voltage signal by the chip test socket and the target resistor.

4. The testing device according to claim 2, characterized in that: The target chip comprises a voltage sampling unit, and the voltage sampling unit is connected to a target pin of the target chip; Wherein, when the first channel switching module is in the first state, the voltage sampling unit is used to detect the first voltage signal to obtain a third voltage value; The target chip is used to control the first channel switching module to switch from the first state to the second state when the first voltage value is the same as the third voltage value.

5. The testing device according to claim 4, characterized in that: The target chip is further used to calibrate the voltage sampling module when the first voltage value is different from the third voltage value.

6. The testing device according to any one of claims 1 to 5, characterized in that: The test device further comprises a second channel switching module and a function verification test module, wherein the chip test socket is connected to the target resistor via the second channel switching module; the chip test socket is also connected to the function verification test module via the second channel switching module; The second channel switching module has a first end, a second end and a third end, the first end of the second channel switching module is connected to the chip test socket, the second end of the second channel switching module is connected to the target resistor, and the third end of the second channel switching module is connected to the function verification test module; Wherein, the second channel switching module has a third state and a fourth state; In the third state, the first end of the second channel switching module is connected to the second end of the second channel switching module, so that the target chip is connected to the target resistor via the chip test socket, the second channel switching module; In the fourth state, the first end of the second channel switching module is connected to the third end of the second channel switching module, so that the target chip is connected to the function verification test module via the chip test socket, the second channel switching module and the function verification test module.

7. The testing device according to claim 6, characterized in that: When the second channel switching module is in a third state, the target chip is used to determine the contact impedance between the target chip and the chip test socket; When the second channel switching module is in the fourth state, the function verification test module is used to perform a function verification test on the target chip to obtain a function verification test result.

8. The testing device according to claim 7, characterized in that: When the contact impedance is less than or equal to a preset threshold, the target chip is used to control the second channel switching module to switch from the third state to the fourth state.

9. The testing device according to claim 7, characterized in that: The test device also includes a host computer; the host computer is connected to the target chip; The target chip is also used to upload a target test result to the host computer; the target test result includes at least one of the contact impedance and the function verification test result; The host computer is used for prompting that the contact impedance is abnormal when the contact impedance is greater than a preset threshold.

10. The testing device according to claim 1, characterized in that: The target resistor is an adjustable resistor; the resistance of the adjustable resistor is determined based on the interface type of the target pin of the target chip; the target pin is a pin connected to the chip test socket.

11. A testing method, applied to the testing device according to any one of claims 1 to 10, characterized in that: The test method includes: The target chip outputs a first voltage signal to the chip test socket; The target chip receives a second voltage value detected by the voltage sampling module; The target chip determines the contact impedance between the target chip and the chip test socket based on the first voltage signal, the second voltage value and the resistance value of the target resistor.

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