Capacitive touch module with matrix coding metal layer
By introducing matrix coded metal layer and physical coding technology into capacitive touch modules, the problem of insufficient signal resolution in the prior art is solved, and more accurate press feedback and more efficient module performance are achieved.
Patent Information
- Application Number
- CN202411436612.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-15
- Publication Date
- 2025-02-07
AI Technical Summary
The signal resolution of existing capacitive touch modules is insufficient, resulting in insufficient press feedback, which affects performance.
The capacitive touch module with matrix coded metal layer is adopted to improve the resolution of the induction signal through a special stack structure and physical encoding method. The specific implementation includes a capacitive induction metal layer, a dielectric layer, a matrix coded metal layer and a processing unit, and uses the encoding matrix to physically encode the signal to improve the signal resolution.
It effectively improves signal resolution, makes the press feedback of the capacitive touch module more accurate, and enhances the performance of the module.
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Figure CN119396302A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a touch control module, and in particular to a capacitive touch control module with a matrix coding metal layer. Background Art
[0002] Capacitive touch modules are now a mature technology. For example, China Patent Publication No. CN117215434A describes optimizing the strength of the touch metal grid structure to achieve better appearance and touch effects; or Taiwan Patent No. I450149 studies signal noise immunity to make the touch device more widely applicable and suitable for large-sized touch panels. It can be seen that optimizing the performance of capacitive touch modules is still an important research topic in the industry.
[0003] Based on the demand for improving the performance of a capacitive touch module, the present application proposes a capacitive touch module with a matrix coded metal layer to effectively improve the signal resolution of the capacitive touch module. Summary of the invention
[0004] One purpose of the present invention is to provide a capacitive touch module with a matrix-coded metal layer. The present invention utilizes a special laminated structure to improve the resolution of sensing signals through physical coding.
[0005] In order to achieve the above object, the present invention provides a capacitive touch module with a matrix coded metal layer, comprising:
[0006] A capacitive sensing metal layer, composed of a plurality of signal lines TX and a plurality of receiving lines RX interlaced;
[0007] a dielectric layer located above the capacitive sensing metal layer;
[0008] a matrix coding metal layer, located above the dielectric layer, having a plurality of coding lines, the coding lines are mirror images and electrically connected to the signal lines TX, and the coding lines are physically coded using a coding matrix; and
[0009] A processing unit has a built-in operation matrix to output a sine wave signal to the signal line TX corresponding to the coding matrix, and recover the capacitive sensing signal encoded by the coding matrix through the receiving line RX, thereby improving the signal resolution through physical coding.
[0010] Furthermore, the material of the dielectric layer is polysiloxane (PDMS).
[0011] Furthermore, it also includes a film pressing component, which is arranged above the matrix coding metal layer and includes a base film and a bump. The base film is stacked on the matrix coding metal layer, and the bump is stacked on the base film.
[0012] Furthermore, the base film and the bumps are made of polyimide (PI).
[0013] Furthermore, it also includes a bottom film, which is arranged below the capacitive sensing metal layer.
[0014] Furthermore, the material of the base film is polyethylene terephthalate (PET).
[0015] Furthermore, the number of the signal lines TX is four, and the number of the receiving lines RX is four, thereby forming a basic touch pixel group of 4X4.
[0016] Furthermore, the number of the signal lines TX is five, and the number of the receiving lines RX is four, thereby forming a basic touch pixel group of 5X4.
[0017] Furthermore, the encoding line is electrically connected to the signal line TX through a via.
[0018] The beneficial effects brought about by the technical solution provided by the embodiment of the present invention include at least:
[0019] The capacitive touch module with matrix coded metal layer provided by the present invention utilizes a physical coding method different from the existing technology to effectively improve the signal resolution, so that the pressing feedback of the capacitive touch module is more accurate, thereby improving the performance of the capacitive touch module. With respect to the capacitive touch module with matrix coded metal layer, the present invention also proposes a plurality of further additional technical features to improve the performance or advantages of various aspects, as described in the above paragraphs. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0021] Figure 1 is a schematic cross-sectional view of a capacitive touch module structure provided by an exemplary embodiment of the present invention;
[0022] Figure 2A is a schematic diagram of the structure of a capacitive touch module provided by an exemplary embodiment of the present invention;
[0023] Figure 2B is a schematic diagram of an application of a capacitive touch module provided by an exemplary embodiment of the present invention;
[0024] Figure 3is a schematic diagram of a capacitive touch module in another implementation state provided by an exemplary embodiment of the present invention;
[0025] Figure 4 FIG. 4 is a partial schematic diagram of a capacitive touch module in another implementation state provided by an exemplary embodiment of the present invention.
[0026] Description of labels:
[0027] 1 Capacitive touch module
[0028] 10 Capacitive sensing metal layer
[0029] 11 Dielectric layer
[0030] 12 Matrix coded metal layer
[0031] 121 coding line
[0032] 14 Film pressing assembly
[0033] 141 basement membrane
[0034] 142 Bump
[0035] 15 Base film
[0036] AFirst frame selection range
[0037] B Second frame selection range
[0038] C The third frame selection range
[0039] TX signal line
[0040] RX receiving line DETAILED DESCRIPTION
[0041] In order to make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.
[0042] The present invention is described in detail below in conjunction with specific embodiments. The following embodiments will help those skilled in the art to further understand the present invention, but are not intended to limit the present invention in any form. It should be noted that, for those of ordinary skill in the art, several changes and improvements can also be made without departing from the concept of the present invention. These all belong to the protection scope of the present invention.
[0043] Please refer to Figures 1 and 2A, which are a cross-sectional view of a capacitive touch module structure and a schematic view of a capacitive touch module according to an embodiment of the present invention. The present invention provides a capacitive touch module 1 with a matrix coding metal layer, comprising a capacitive sensing metal layer 10, a dielectric layer 11, a matrix coding metal layer 12 and a processing unit.
[0044] The capacitive sensing metal layer 10 is composed of a plurality of signal lines TX and a plurality of receiving lines RX interlaced, the dielectric layer 11 is located above the capacitive sensing metal layer 10, the matrix coding metal layer 12 is located above the dielectric layer 11 and has a plurality of coding lines 121, the coding lines 121 are mirror images and electrically connected to the signal lines TX, and the coding lines are physically encoded by a coding matrix. The processing unit has a built-in operation matrix to output a sine wave signal to the signal line TX corresponding to the coding matrix, and recovers the capacitive sensing signal encoded by the coding matrix through the receiving line RX, thereby improving the signal resolution through physical coding. Among them, in a specific implementation, the capacitive sensing metal layer 10 can be connected to the matrix coding metal layer 12 through a via routing signal, that is, the signal line TX is electrically connected to the coding line 121 through a via routing. In addition, an application example of the processing unit can be an electronic component including a 20-pin general-purpose input / output pin (GPIO) and 20 analog-to-digital converters for signal data acquisition. The operation formula of the processing unit is
[0045] In a practical application example, the dielectric layer 11 material may be polysiloxane (PDMS), so that the capacitance value changes by reflecting pressure deformation through the flexible material, and has good conductivity and bending and stretching resistance, which is conducive to being an excellent conductive medium when pressed.
[0046] Regarding the overall structure of the capacitive touch module 1, in one implementation state, it can be designed to include a thin film pressing component 14, which is disposed above the matrix coding metal layer 12 and includes a base film 141 and a bump 142. The base film 141 is stacked on the matrix coding metal layer 12, and the bump 142 is stacked on the base film 141 to provide better pressing force.
[0047] Furthermore, the material of the base film 141 and the bump 142 may be polyimide (PI) to have excellent resistance, such as chemical resistance and mechanical properties.
[0048] In addition, in addition to disposing the film pressing element 14 above the matrix encoding metal layer 12 , the capacitive touch module 1 may also include a bottom film 15 disposed below the capacitive sensing metal layer 10 to construct a more complete structural module.
[0049] In order to make the capacitive touch module 1 have better structural rigidity, the material of the bottom film 15 can be polyethylene terephthalate (PET).
[0050] The following is an example of the structural state that the capacitive touch module 1 can present in a specific implementation. Please refer to Figure 2B for further reference, which is a schematic diagram of the application of a capacitive touch module according to an exemplary embodiment of the present invention. By staggering different numbers of signal lines TX and receiving lines RX, different pixel groups can be formed. For example, the number of signal lines TX can be four, and the number of receiving lines RX can be four, thereby forming a 4X4 basic touch pixel group, as shown in Figure 2A. For ease of understanding, RX1, RX2, RX3 and RX4 are marked next to the receiving line RX in Figure 2A. Because the signal line TX is actually located at the bottom side of the number line 121 and the two are mirror images of each other, the signal line TX and the number line 121 should be in an overlapping state in the perspective of the figure, so they are marked with the number 121 (TX). In this embodiment, the signal line TX and the coding line 121 of the matrix coding metal layer 12 carry signals S1-S4, and S1-S4 refer to four AC signals of different frequencies, that is, the sine wave signals mentioned above, and in different areas of the matrix coding metal layer 12, the signals of one or several coding lines 121 are covered so that they cannot be capacitively coupled to the receiving line RX, that is, the coding line is physically encoded by the coding matrix. Next, please refer to FIG. 2B. When the capacitive sensing metal layer 10 is set in the above manner, taking the first frame selection range A (the area surrounded by the dotted frame) of FIG. 2B as an example, the receiving line RX1 can detect the sum signal of (S2, S3, S4) + (S3, S4) + (S2, S4) + (S3) = 2S2 + 3S3 + 3S4, which can be defined as RX1 = 2S2 + 3S3 + 3S4. Similarly, RX2=3S1+S2+2S3+2S4, RX3=2S1+2S2+3S4, RX4=3S1+3S2+3S3+S4. In such a structure, when the second frame selection range B in Figure 2B is touched, the signals of one S3 and one S4 will be attenuated due to the touch, and this method can be used to determine which area is touched. For example, when the second frame selection range B in Figure 2B and the third frame selection range C next to it are touched, the changes in S3 and S4, as well as the changes in S2 and S4, can be recovered to evaluate how much the second frame selection range B and the third frame selection range C have been touched respectively.
[0051] Please refer to FIG. 3 again, which is a schematic diagram of a capacitive touch module in another implementation state of an embodiment of the present invention. In this implementation state, taking a 5X4 basic touch pixel group as an example, specifically, the capacitive sensing metal layer 10 can have five signal lines TX and four receiving lines RX, thereby forming the aforementioned 5X4 basic touch pixel group. As shown in FIG. 3, for ease of understanding, RX1, RX2, RX3 and RX4 are respectively marked beside the receiving line RX in FIG. 3, and in FIG. 3, the signal line TX and the encoding line 121 are drawn adjacent to each other as a schematic diagram to make it easier to understand. In practice, the signal line TX is located at the bottom side of the numbering line 121 and the two are mirror-imaged to each other and should be in a state of structural overlap, and the signal line TX and the encoding line 121 can be connected through a via routing method. In this embodiment, the signal line TX of the capacitive sensing metal layer 10 ie the lower wiring carries the signal SP ie the baseband signal, and the coding line 121 of the matrix coding metal layer 12 ie the upper wiring carries the signals S1 - S5 .
[0052] Please refer to FIG. 4 again, which is a partial schematic diagram of a capacitive touch module in another implementation state of an exemplary embodiment of the present invention. Figure 4 In the example, one receiving line RX and five signal lines TX (S1-S5) are used. In fact, the overall arrangement of the capacitive touch module 1 should be as shown in Figure 3. In this example, RX = P1*S1+P2*S2+P3*S3+P4*S4+P5*S5, and P1-P5 represent the capacitance coupling. Based on the above structure, we can get Cj = {+1, 0}, j = 1 to 5, five different codings can be decoded back to the state of each pixel unit, for example, Cj is Therefore, the first coding status is
[0053]
[0054] The first RX amplitude is measured to be
[0055] RX(1)=A×(P1×(+1)+P2×(+1)+P3×(0)+P4×(0)+P5×(+1)). Similarly,
[0056]
[0057] , that is, C×P=R→P=inv(C)×R.
[0058] In summary, the capacitive touch module with matrix coding metal layer provided by the present invention recovers the capacitive sensing signal after being encoded by the coding matrix through physical coding. Since the recovered signal is no longer consistent, the complexity of another dimension can be increased. More signals can be obtained after decoding. In other words, the signal resolution can be improved. In the present invention, a variety of additional detailed technical features are also proposed, such as selecting PDMS as a dielectric layer material, which has good conductivity and deformation characteristics; or setting a thin film pressing component above the matrix coding metal layer to have better pressing force, and further, the base film and the bump of the thin film pressing component can be selected from PI material to obtain excellent tolerance; in addition, a bottom film can also be added under the capacitive sensing metal layer, so as to achieve the effect of supporting the overall structure, and the bottom film part can be further made of PET material to have better structural rigidity performance; in order to make the coding line and the signal line TX tightly connected, the two can be electrically connected through the drilling (Via) routing method; in the present invention, two application examples are proposed for the capacitive touch module, one of which is to make the number of signal lines TX and the number of receiving lines RX four respectively to form a 4X4 basic touch pixel group, and the other is to make the number of signal lines TX five and the number of receiving lines RX four to form a 5X4 basic touch pixel group.
[0059] Those skilled in the art will readily appreciate other embodiments of the present invention after considering the specification and practicing the schemes disclosed herein. The present invention is intended to cover any variations, uses or adaptations of the present invention, which follow the general principles of the present invention and include common knowledge or customary technical means in the art that are not disclosed in the present invention.
[0060] It should be understood that the present invention is not limited to the exact construction that has been described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.
[0061] It should be understood that the "plurality" mentioned in this article refers to two or more. "And / or" describes the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects are in an "or" relationship.
[0062] A person skilled in the art will understand that all or part of the steps to implement the above embodiments may be accomplished by hardware or by instructing related hardware through a program, and the program may be stored in a computer-readable storage medium, and the above-mentioned storage medium may be a read-only memory, a disk or an optical disk, etc.
[0063] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims
1. A capacitive touch module with a matrix coded metal layer, characterized in that: include: A capacitive sensing metal layer, composed of a plurality of signal lines TX and a plurality of receiving lines RX interlaced; a dielectric layer located above the capacitive sensing metal layer; a matrix coding metal layer, located above the dielectric layer, having a plurality of coding lines, the coding lines are mirror images and electrically connected to the signal lines TX, and the coding lines are physically coded by a coding matrix; and A processing unit has a built-in operation matrix to output a sine wave signal to the signal line TX corresponding to the coding matrix, and recover the capacitive sensing signal encoded by the coding matrix through the receiving line RX, thereby improving the signal resolution through physical coding.
2. The capacitive touch module with matrix coded metal layer according to claim 1, characterized in that: The material of the dielectric layer is polysiloxane (PDMS).
3. The capacitive touch module with matrix coded metal layer according to claim 1, characterized in that: The invention also comprises a film pressing component which is arranged above the matrix coding metal layer and comprises a base film and a bump. The base film is stacked on the matrix coding metal layer, and the bump is stacked on the base film.
4. The capacitive touch module with matrix coded metal layer according to claim 3, characterized in that: The base film and the bumps are made of polyimide (PI).
5. The capacitive touch module with matrix coded metal layer according to claim 1, characterized in that: The device also comprises a bottom film which is arranged below the capacitive sensing metal layer.
6. The capacitive touch module with matrix coded metal layer according to claim 5, characterized in that: The material of the base film is polyethylene terephthalate (PET).
7. The capacitive touch module with matrix coded metal layer according to claim 1, characterized in that: The number of the signal lines TX is four, and the number of the receiving lines RX is four, thereby forming a 4X4 basic touch pixel group.
8. The capacitive touch module with matrix coded metal layer according to claim 1, characterized in that: The number of the signal lines TX is five, and the number of the receiving lines RX is four, thereby forming a basic touch pixel group of 5X4.
9. The capacitive touch module with matrix coded metal layer according to claim 1, characterized in that: The encoding line is electrically connected to the signal line TX through vias.
Citation Information
Patent Citations
Metal grid and preparation method thereof, touch sensor and electronic equipment
CN117215434A