Coil structure and inductance component

Abstract

The invention discloses a coil structure and an inductance component. The coil structure comprises a first conductive layer and a second conductive layer, the dielectric layer is arranged above the first conductive layer, and at least one electrode is embedded in the dielectric layer; the second conducting layer is arranged above the dielectric layer, the second conducting layer is electrically connected with the first conducting layer through the electrode, and the second conducting layer comprises at least one connecting point; a conductive portion disposed at a connection point on the second conductive layer; and the insulating part is arranged in a non-connection point area outside the connection point above the second conductive layer. The connecting points and the non-connecting-point areas are arranged on the second conducting layer, the connecting points are used for arranging the conducting parts, the non-connecting-point areas are used for arranging the insulating parts, and when circulation deformation occurs, compared with the prior art, the risk of short circuit of the coil structure is reduced, and the function stability of the whole structure is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic equipment, and in particular to a coil structure and an inductor component. Background Art

[0002] With the development trend of miniaturization of electronic components, the surface area of ​​PCB is reduced, and it is transformed into three-dimensional integrated vertical multi-layer molding. In the prior art, the inductor component has multiple layers of coils stacked inside, and the two layers of conductive coils are connected and connected by coating the entire surface with another conductive material.

[0003] Due to cost and process selection, the conductive material often uses tin alloy solder, which will deform and flow above 220 degrees Celsius. During the preparation and use of the coil structure, the ambient temperature may rise to above 220 degrees Celsius. Under such conditions, the deformation and flow of this conductive material in the large-area main coil will first affect the mechanical properties of the product and cause changes in the interlayer spacing; secondly, the flow of this conductive material will cause multiple parallel connections between layers, and even spread to non-adjacent conductive layers, especially when this conductive material flows between the main coil and the cylindrical lead-out electrode, which will cause the product to short-circuit and affect the electrical properties and reliability of the product.

[0004] Therefore, there is an urgent need for a coil structure with low short-circuit risk and stable structure. Summary of the invention

[0005] In view of the above problems, the present invention is proposed to provide a coil structure and an inductor component that overcome the above problems or at least partially solve the above problems.

[0006] Other features and advantages of the present invention will become apparent from the following detailed description, or may be learned in part by practice of the present invention.

[0007] According to a first aspect of an embodiment of the present invention, there is provided a coil structure, the coil structure comprising:

[0008] a first conductive layer;

[0009] A dielectric layer, disposed above the first conductive layer, wherein at least one electrode is embedded in the dielectric layer;

[0010] A second conductive layer, disposed above the dielectric layer, the second conductive layer is electrically connected to the first conductive layer through the electrode, and the second conductive layer includes at least one connection point;

[0011] A conducting portion, arranged at a connection point on the second conductive layer;

[0012] The insulating portion is arranged above the second conductive layer in a non-connection point region outside the connection point.

[0013] In some embodiments of the present invention, the thickness of the conductive portion is the same as the thickness of the insulating portion, and the thickness of the conductive portion is 2-20 μm.

[0014] In some embodiments of the present invention, the conductive portion fully covers or partially covers the connection point.

[0015] In some embodiments of the present invention, the surface area of ​​the conducting portion is 5% to 20% of the surface area of ​​the second conductive layer.

[0016] In some embodiments of the present invention, the insulating portion fully or partially covers the non-connection point area.

[0017] In some embodiments of the present invention, the line width of the dielectric layer is not less than the line width of the second conductive layer.

[0018] In some embodiments of the present invention, the insulating portion covers a side surface of the conductive portion.

[0019] In some embodiments of the present invention, the conductive portion is a solder alloy of one or any combination of tin, lead, silver, bismuth, antimony, indium or cadmium.

[0020] According to a second aspect of an embodiment of the present invention, an inductor component is provided, comprising a coil structure and a magnetic coating layer, wherein a plurality of the coil structures are stacked longitudinally in sequence, and the magnetic coating layer is filled and coated on the outer sides of the stacked coil structures.

[0021] In some embodiments of the present invention, two adjacent coil structures are electrically connected via a conductive portion.

[0022] The technical solution provided in the embodiments of the present invention has at least the following technical effects or advantages:

[0023] The coil structure and inductor component described in the embodiment of the present invention, the coil structure described in the embodiment of the present invention is provided with a connection point and a non-connection point area on the second conductive layer, the connection point is used to set the conductive part, and the non-connection point area is used to set the insulating part. When flow deformation occurs, compared with the prior art, the risk of short circuit of the coil structure is reduced and the functional stability of the overall structure is improved.

[0024] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented according to the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A schematic structural diagram of a coil structure provided by an embodiment of the present invention;

[0027] Figure 2 for Figure 1 Schematic diagram of the explosion structure;

[0028] Figure 3 It is a structural schematic diagram of Example 3;

[0029] Figure 4 It is a structural schematic diagram of Example 4;

[0030] Figure 5 It is a structural schematic diagram of Example 5;

[0031] Figure 6 It is a structural schematic diagram of Example 6;

[0032] Figure 7 A schematic structural diagram of an inductor component provided by an embodiment of the present invention.

[0033] Description of reference numerals:

[0034] 100. Coil structure;

[0035] 1. First conductive layer; 2. Dielectric layer; 3. Second conductive layer; 4. Insulating part; 5. Connecting point; 6. Conducting part; 7. Electrode. DETAILED DESCRIPTION

[0036] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings.

[0037] Various structural schematic diagrams according to embodiments of the present disclosure are shown in the accompanying drawings. These figures are not drawn to scale, and some details are magnified and some details may be omitted for the purpose of clear expression. The shapes of various regions and layers shown in the figures and the relative sizes and positional relationships therebetween are only exemplary, and may deviate in practice due to manufacturing tolerances or technical limitations, and those skilled in the art may further design regions / layers with different shapes, sizes, and relative positions according to actual needs.

[0038] In the context of the present disclosure, when a layer / element is referred to as being "on" another layer / element, the layer / element may be directly on the other layer / element, or there may be an intervening layer / element therebetween. Additionally, if a layer / element is "on" another layer / element in one orientation, the layer / element may be "below" the other layer / element when the orientation is reversed. In the context of the present disclosure, similar or identical components may be denoted by the same or similar reference numerals.

[0039] In order to better understand the above-mentioned technical scheme, the above-mentioned technical scheme will be described in detail below in combination with specific implementation methods. It should be understood that the embodiments of the present disclosure and the specific features in the embodiments are detailed descriptions of the technical scheme of the present invention, rather than limitations on the technical scheme of the present invention. In the absence of conflict, the embodiments of the present invention and the technical features in the embodiments can be combined with each other.

[0040] Example 1

[0041] The embodiment of the present invention provides a coil structure 100, referring to Figure 1-2 As shown, Figure 1 is a schematic structural diagram of a coil structure 100 provided in an embodiment of the present invention. Figure 2 for Figure 1 Schematic diagram of the explosion structure, the coil structure 100 includes a first conductive layer 1, a dielectric layer 2, a second conductive layer 3, a conducting portion 6 and an insulating portion 4, the first conductive layer 1, the dielectric layer 2 and the second conductive layer 3 are stacked in sequence from bottom to top; the first conductive layer 1 and the second conductive layer 3 are made of the same material, both of which are made of conductive materials, such as copper or other conductive materials; the dielectric layer 2 is arranged between the first conductive layer 1 and the second conductive layer 3, the dielectric layer 2 is used to separate the first conductive layer 1 and the second conductive layer 3 to avoid a short circuit caused by direct and complete adhesion between the two, and the dielectric layer 2 is an insulating material.

[0042] Among them, the dielectric layer 2 is arranged above the first conductive layer 1, and at least one electrode 7 is embedded in the dielectric layer 2; the second conductive layer 3 is arranged above the dielectric layer 2, and the second conductive layer 3 is electrically connected to the first conductive layer 1 through the electrode 7, and the second conductive layer 3 includes at least one connection point 5; the conductive part 6 is arranged at the connection point 5 on the second conductive layer 3; the insulating part 4 is arranged in the non-connection point 5 area above the second conductive layer 3 and outside the connection point 5.

[0043] In the embodiment of the present invention, the electrode 7 is embedded in the dielectric layer 2. A through hole (not shown) may be provided on the dielectric layer 2, and the electrode 7 is embedded in the through hole. The thickness of the electrode 7 is the same as that of the dielectric layer 2. The number of electrodes 7 in the dielectric layer 2 is determined according to actual application requirements (e.g., structural changes of the first conductive layer 1 and the second conductive layer 3). For example, in the embodiment of the present invention, the number of electrodes 7 is one. In other embodiments, the number of electrodes 7 may be two or more according to structural changes of the first conductive layer 1 and the second conductive layer 3. The electrode 7 is made of copper or other conductive materials so that the second conductive layer 3 located on the upper layer can be electrically connected to the first conductive layer 1 located on the lower layer.

[0044] In an embodiment of the present invention, the structure of the electrode 7 can be a solid structure or a hollow ring structure. In order to reduce material consumption and reduce weight, for example, the electrode 7 can be selected as a hollow ring structure, and in order to obtain better flow capacity, for example, the electrode 7 can be selected as a solid structure. According to actual application requirements and process control effects, the embodiment of the present invention can select a suitable method.

[0045] In an embodiment of the present invention, since the conductive portion 6 and the insulating portion 4 are located on the same layer, in order to reduce the process difficulty and maintain the structural stability when the multi-layer coil structure 100 is stacked, the thickness of the conductive portion 6 is the same as the thickness of the insulating portion 4; in order to maintain the overall thickness of the coil structure 100 controllable, in an embodiment of the present invention, the thickness of the conductive portion 6 (or the insulating portion 4) is 2-20μm.

[0046] It should be noted that, in the embodiment of the present invention, the connection point 5 is not an independent structure, and the connection point 5 is an area on the second conductive layer 3 that contacts the conductive portion 6. Figure 1 As shown, when the planar shape of the second conductive layer 3 is a non-closed-loop spiral coil structure 100, the connection point 5 is the two ends of the non-closed-loop spiral coil structure 100, and the line width of the connection point 5 can be considered to be the same as the line width of the two ends.

[0047] In an embodiment of the present invention, the function of the conductive portion 6 is to enable two adjacent coil structures 100 to be electrically connected through the conductive portion 6 when multiple coil structures 100 are stacked, that is, the second conductive layer 3 corresponding to the coil structure 100 located at the lower layer is electrically connected to the first conductive layer 1 corresponding to the coil structure 100 located at the upper layer through the conductive portion 6.

[0048] In the embodiment of the present invention, the conductive portion 6 can be a solder alloy of tin, lead, silver, bismuth, antimony, indium or cadmium or any combination thereof, and has better current conduction capability.

[0049] In the embodiment of the present invention, since the conductive portion 6 is in a high temperature environment when the current is conducted, flow deformation may occur. According to the difficulty of the process, the conductive portion 6 fully covers or partially covers the connection point 5 (in the embodiment of the present invention, the coverage refers to the covering area of ​​the structure located in the upper layer on the structure located in the lower layer, the same below); when the conductive portion 6 fully covers the connection point 5, that is, the line width of the conductive portion 6 is equal to the line width of the connection point 5, the process difficulty is relatively low, and it can be suitable for mass production and processing; when there is a better processing technology or there is a higher demand for structural stability, the conductive portion 6 can partially cover the connection point 5, that is, the line width of the conductive portion 6 (characterized as the width on the plane area or the projected area) is smaller than the line width of the connection point 5, even if flow deformation occurs, the overflow part of the lateral deformation of the conductive portion 6 does not exceed the line width range of the connection point 5, thereby improving the structural stability.

[0050] Optionally, in a specific scenario where the space occupation requirement is low, in an embodiment of the present invention, the insulating part 4 can be wrapped around the side of the conductive part 6. For example, when the insulating part 4 is at the same height as the conductive part 6, the insulating part 4 is arranged around the side of the conductive part 6 to wrap around it, so as to achieve lateral conductive isolation. In this way, when flow deformation occurs, the overflowing part of the lateral deformation of the conductive part 6 is always isolated by the insulating part 4, effectively avoiding the problem of short circuit in the coil structure 100.

[0051] In another embodiment of the present invention, if the conductive portion 6 partially covers the connection point 5 and the insulating portion 4 covers the side of the conductive portion 6, the advantages of both can be combined at the same time, which not only reduces the space requirement but also improves the structural stability.

[0052] Of course, it should be noted that, when having better current conduction capability, in order to reduce material loss, the surface area of ​​the conducting portion 6 can be 5% to 20% of the surface area of ​​the second conductive layer 3 .

[0053] Correspondingly, since the insulating portion 4 is arranged in the non-connection point 5 area outside the connection point 5 on the second conductive layer 3, the insulating portion 4 is also in a high temperature environment when the coil structure 100 is in working state. Although the insulating portion 4 will not deform under normal circumstances, it may still produce flow deformation or fatigue aging deformation under long-term working conditions. Similarly, according to the difficulty of processing technology, the insulating portion 4 fully covers or partially covers the non-connection point 5 area; when the insulating portion 4 fully covers the non-connection point 5 area, that is, the line width of the insulating portion 4 is equal to the line width of the non-connection point 5 area, the processing difficulty of the process is relatively low, and it can be applied to mass production and processing; when there is a better processing technology or there is a higher demand for structural stability, the insulating portion 4 can partially cover the non-connection point 5 area, that is, the line width of the insulating portion 4 is smaller than the line width of the non-connection point 5 area. Even if flow deformation occurs, the overflow part of the lateral deformation of the insulating portion 4 does not exceed the line width range of the non-connection point 5 area, which reduces the use and cost of materials and improves structural stability.

[0054] In the embodiment of the present invention, the insulating part 4 is a thermosetting adhesive or a thermosetting film. Specifically, the insulating part 4 can be a blend of one or more of polyimide, epoxy resin, bismaleimide, and triazine. The insulating part 4 is preferably epoxy resin.

[0055] In the embodiment of the present invention, refer to Figure 1 As shown, the structure of the first conductive layer 1 and the (planar shape) structure of the dielectric layer 2 can be a closed-loop spiral coil structure 100, the structure of the second conductive layer 3 can be a non-closed-loop spiral coil structure 100, and the line widths of the first conductive layer 1, the dielectric layer 2 and the second conductive layer 3 can be the same. It should be noted that, according to actual application requirements, the line widths of the first conductive layer 1, the dielectric layer 2 and the second conductive layer 3 can also be different.

[0056] For example, in an embodiment of the present invention, the line width of the dielectric layer 2 is not less than the line width of the second conductive layer 3 (or the first conductive layer 1). Specifically, when the coil structure 100 is in a working state, it is also in a high-temperature environment, and flow deformation may occur, resulting in a short circuit between the first conductive layer 1 and the second conductive layer 3. Then, according to the width requirement of the entire structure, when the line width of the dielectric layer 2 is equal to the line width of the second conductive layer 3 (or the first conductive layer 1), the overall width consistency of the structure is high, and the structure has a low space requirement, which can be applied to specific scenarios with high space requirements. When the line width of the dielectric layer 2 is greater than the line width of the second conductive layer 3 (or the first conductive layer 1), for example, the line width of the dielectric layer 2 is 0.02 mm greater than the line width of the second conductive layer 3. Even if flow deformation occurs, the overflow portion of the lateral deformation of the insulating portion 4 does not exceed the line width range of the non-connection point 5 area, thereby avoiding the short circuit problem between the conductive layers, improving the functional stability, and being applicable to scenarios with low space requirements.

[0057] The coil structure 100 described in the embodiment of the present invention is provided with a connection point 5 and a non-connection point 5 area on the second conductive layer 3, the connection point 5 is used to set the conductive part 6, and the non-connection point 5 area is used to set the insulating part 4. When flow deformation occurs, compared with the prior art, the insulating part 4 can play a bonding support role. The insulating part 4 after curing and forming usually does not deform at high temperature, thereby enhancing the structural strength of the product and improving the product stability. At the same time, by limiting the area ratio of the conductive part 6, too many parallel short-circuit points or line burrs will not be generated. At the same time, the distance between the conductive part 6 and the columnar lead-out electrode 7 is extended in physical space, which basically limits the short-circuit path, avoids the possibility of short-circuit, reduces the risk of short-circuit of the coil structure 100, and improves the functional stability of the overall structure.

[0058] Comparative Example 1

[0059] Comparative Example 1 provides a coil structure 100, wherein the insulating portion 4 is removed from the coil structure 100 of Comparative Example 1, and the conductive portion 6 completely covers the second conductive layer 3, and the remaining structure of Comparative Example 1 is the same as that of Example 1.

[0060] Example 2

[0061] Based on Example 1, this embodiment of the present invention provides a coil structure 100. The structure of this embodiment is as follows: Figure 1-2As shown, the structure of the electrode 7 is a hollow ring structure, the material of the electrode 7 is copper, and the thickness of the electrode 7 is the same as the thickness of the dielectric layer 2; the structure of the first conductive layer 1 and the dielectric layer 2 is a closed-loop spiral coil structure 100, and the line width of the first conductive layer 1 and the dielectric layer 2 is the same; the structure of the second conductive layer 3 can be a non-closed-loop spiral coil structure 100; the material of the first conductive layer 1 and the second conductive layer 3 is copper; the thickness of the first conductive layer 1 and the second conductive layer 3 is the same, both of which are 5μm; the material of the dielectric layer 2 is polyimide, and the thickness is 12.5μm.

[0062] The conductive portion 6 completely covers the connection point 5 , that is, the line width of the conductive portion 6 is the same as the line width of the second conductive layer 3 .

[0063] The insulating portion 4 completely covers the non-connection point 5 area, and the insulating portion 4 is epoxy resin.

[0064] The thickness of the conducting portion 6 and the insulating portion 4 are the same, which is 8 μm.

[0065] The rest of the structure of this embodiment is the same as that of Embodiment 1.

[0066] Compared with comparative example 1, the conductive portion 6 of this embodiment enables the upper and lower conductive layers to form a parallel structure, and the increase in DC resistance is controlled within 10%, but has no effect on the inductance of the coil structure 100. The probability of short circuit in this embodiment is <1%, while the probability of short circuit in comparative example 1 is about 40%, thereby improving the functional stability of the overall structure.

[0067] Example 3

[0068] Based on Example 1, this embodiment of the present invention provides a coil structure 100. The structure of this embodiment is as follows: Figure 3 As shown, the conductive portion 6 partially covers the connection point 5, that is, the line width of the conductive portion 6 is smaller than the line width of the second conductive layer 3, specifically, the line width of the conductive portion 6 is 20 μm smaller than the line width of the second conductive layer 3.

[0069] The insulating portion 4 is made of epoxy resin.

[0070] The rest of the structure of this embodiment is the same as that of Embodiment 1.

[0071] Compared with comparative example 1, the conductive portion 6 of this embodiment enables the upper and lower conductive layers to form a parallel structure, and the increase in DC resistance is controlled within 10%, but has no effect on the inductance of the coil structure 100. The probability of short circuit in this embodiment is <1%, while the probability of short circuit in comparative example 1 is about 40%, thereby improving the functional stability of the overall structure.

[0072] Compared with the second embodiment, even if flow deformation occurs, the overflow portion of the lateral deformation of the conducting portion 6 does not exceed the line width range of the connecting point 5, thereby improving the structural stability.

[0073] Example 4

[0074] Based on Example 3, this embodiment of the present invention provides a coil structure 100. Figure 4 As shown, the insulating portion 4 partially covers the non-connection point 5 area, that is, the line width of the insulating portion 4 is smaller than the line width of the non-connection point 5 area, and the line width of the edge portion is 20 μm smaller than the line width of the non-connection point 5 area.

[0075] The rest of the structure of this embodiment is the same as that of Embodiment 3.

[0076] Compared with comparative example 1, the conductive portion 6 of this embodiment enables the upper and lower conductive layers to form a parallel structure, and the increase in DC resistance is controlled within 10%, but has no effect on the inductance of the coil structure 100. The probability of short circuit in this embodiment is <1%, while the probability of short circuit in comparative example 1 is about 40%, thereby improving the functional stability of the overall structure.

[0077] Compared with the third embodiment, even if flow deformation occurs, the overflow portion of the lateral deformation of the insulating portion 4 does not exceed the line width range of the non-connection point 5 area, thereby improving the structural stability.

[0078] Example 5

[0079] Based on Example 3, this embodiment of the present invention provides a coil structure 100. Figure 5 As shown, the insulating portion 4 fully covers the non-connection point 5 area, that is, the line width of the insulating portion 4 is equal to the line width of the non-connection point 5 area; and the insulating portion 4 is wrapped around the side of the conductive portion 6.

[0080] The rest of the structure of this embodiment is the same as that of Embodiment 3.

[0081] Compared with comparative example 1, the conductive portion 6 of this embodiment enables the upper and lower conductive layers to form a parallel structure, and the increase in DC resistance is controlled within 10%, but has no effect on the inductance of the coil structure 100. The probability of short circuit in this embodiment is <1%, while the probability of short circuit in comparative example 1 is about 40%, thereby improving the functional stability of the overall structure.

[0082] Compared with Example 3, in this embodiment, the conductive portion 6 is surrounded by the insulating portion 4. Even if flow deformation occurs, the overflow of the conductive portion 6 due to lateral deformation will not cause the second conductive layer 3 to be connected in series with other structures to cause a short circuit, thereby improving the structural stability.

[0083] Example 6

[0084] Based on Example 1, this embodiment of the present invention provides a coil structure 100. The structure of this embodiment is as follows: Figure 6 As shown, the line width of the dielectric layer 2 is greater than the line width of the second conductive layer 3, the line width of the dielectric layer 2 is set to 340 μm, and the line width of the conductive layer 320 is set to μm. The conductive layer is made of copper with a thickness of 31.5 μm; the dielectric layer 2 is made of polyimide with a thickness of 12.5 μm; the electrode 7 is made of copper with the same thickness as the dielectric layer 2, which is 12.5 μm.

[0085] The insulating portion 4 is made of epoxy resin.

[0086] The thickness of the conducting portion 6 and the insulating portion 4 are both 8 μm.

[0087] The rest of the structure of this embodiment is the same as that of Embodiment 1.

[0088] Compared with comparative example 1, the conductive portion 6 of this embodiment enables the upper and lower conductive layers to form a parallel structure, and the increase in DC resistance is controlled within 10%, but has no effect on the inductance of the coil structure 100. The probability of short circuit in this embodiment is <1%, while the probability of short circuit in comparative example 1 is about 40%, thereby improving the functional stability of the overall structure.

[0089] Compared with embodiments 2-5, even if flow deformation occurs, the overflowing part of the lateral deformation of the conductive part 6 will not cause the second conductive layer 3 to be connected in series with other structures to cause a short circuit. The overflowing part of the lateral deformation of the insulating part 4 also has an avoidance gap, thereby improving the structural stability.

[0090] Based on the above embodiments, the present invention further provides an inductor component. Figure 7 As shown, the inductor component includes the coil structure 100 and the magnetic coating layer (not shown) described in any of the above embodiments, and a plurality of the coil structures 100 are stacked longitudinally in sequence, and the outer sides of the stacked coil structures 100 are filled and coated with the magnetic coating layer; and two adjacent coil structures 100 are electrically connected through the conductive portion 6.

[0091] The magnet coating layer is a mixture of magnetic alloy filler and adhesive. The stacked coil structure 100 is pressed in the magnet coating layer and then cut and ground to form an inductor component of a specific size.

[0092] It should be noted that the number of stacked layers of the coil structure 100 is determined according to actual needs, and the embodiment of the present invention has no limitation to this.

[0093] The inductor component described in the embodiment of the present invention has the corresponding functional components and beneficial effects of the coil structure 100 described in the above embodiment. Please refer to the embodiment of the above coil structure 100 for details, and the embodiment of the present invention will not be described in detail here.

[0094] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description.

[0095] Similarly, it should be understood that in order to streamline the present disclosure and aid in understanding one or more of the various inventive aspects, in the above description of exemplary embodiments of the present invention, various features of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. However, this disclosed method should not be interpreted as reflecting the intention that the claimed invention requires more features than those expressly recited in each claim. Rather, as reflected in the claims, inventive aspects lie in less than all of the features of the individual embodiments previously disclosed. Therefore, the claims that follow the detailed description are hereby expressly incorporated into the detailed description, with each claim itself serving as a separate embodiment of the present invention.

[0096] It should be noted that the above-mentioned embodiments illustrate rather than limit the invention and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims.

Claims

1. A coil structure, characterized in that: The coil structure comprises: a first conductive layer; A dielectric layer, disposed above the first conductive layer, wherein at least one electrode is embedded in the dielectric layer; A second conductive layer, disposed above the dielectric layer, the second conductive layer is electrically connected to the first conductive layer through the electrode, and the second conductive layer includes at least one connection point; A conducting portion, arranged at a connection point on the second conductive layer; The insulating portion is arranged above the second conductive layer in a non-connection point region outside the connection point.

2. The coil structure according to claim 1, characterized in that: The thickness of the conductive portion is the same as that of the insulating portion, and the thickness of the conductive portion is 2-20 μm.

3. The coil structure according to claim 1, characterized in that: The conductive portion fully covers or partially covers the connection point.

4. The coil structure according to claim 3, characterized in that: The surface area of ​​the conducting portion is 5% to 20% of the surface area of ​​the second conductive layer.

5. The coil structure according to claim 1, characterized in that: The insulating portion fully or partially covers the non-connection point area.

6. The coil structure according to claim 1, characterized in that: The line width of the dielectric layer is not less than the line width of the second conductive layer.

7. The coil structure according to claim 1, characterized in that: The insulating portion covers a side surface of the conducting portion.

8. The coil structure according to claim 1, characterized in that: The conductive portion is a solder alloy of one or any combination of tin, lead, silver, bismuth, antimony, indium or cadmium.

9. An inductor component, characterized in that: It comprises the coil structure and the magnetic coating layer as described in any one of claims 1 to 8, wherein a plurality of the coil structures are stacked longitudinally in sequence, and the outer sides of the stacked coil structures are filled and coated with the magnetic coating layer.

10. The inductor component according to claim 9, characterized in that: Two adjacent coil structures are electrically connected via a conducting portion.

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