Inductor

Abstract

The present invention provides an inductor having desired characteristics. The inductor has a coil (40) provided inside the component body (10). A first end of the coil (40) is connected to the first external electrode (20), and a second end of the coil (40) is connected to the second external electrode (30). The coil (40) includes a plurality of coil conductor layers (41-48) provided in the width direction (W). Each of the coil conductor layers (41-48) is formed in a spiral shape (spiral shape) with a number of turns of at least one. The height dimension T1 of the component main body (10) is larger than the width dimension W1 (T1 > W1).

Description

[0001] This application is a further divisional application of the application with application number "2018 1 1092 536.5", filing date "September 19, 2018", and invention name "Inductor" Technical Field

[0002] The present invention relates to an inductor. Background Art

[0003] Conventionally, electronic components are mounted on various electronic devices. As one example of such electronic components, for example, a laminated inductor is known (see, for example, Patent Document 1).

[0004] Patent Document 1: Japanese Patent Application Publication No. 2013-153009

[0005] However, as electronic devices such as mobile phones have become more high-frequency, electronic devices require small inductors that can handle high-frequency signals. The miniaturization of inductors reduces the inductance value (L value) and Q value. Therefore, inductors used for high-frequency signals seek to improve the inductance value (L value), Q value and other characteristics.

[0006] However, for an inductor such as Patent Document 1, if the inductance value is increased, the number of coil conductor layers increases. Therefore, the laminate becomes larger in the stacking direction, and the mounting area of ​​the inductor becomes larger. In addition, in an inductor such as Patent Document 1, if the number of turns of the coil conductor layer is increased to 1 turn or more in order to increase the inductance value, the area inside the coil conductor layer becomes smaller, resulting in a decrease in the Q value. Summary of the invention

[0007] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide an inductor having desired characteristics.

[0008] An inductor as one embodiment of the present invention comprises: a rectangular component body having a mounting surface for exposing a first external electrode and a second external electrode; and a coil, which is arranged on the component body, with a first end connected to the first external electrode and a second end connected to the second external electrode, the coil comprising: a plurality of coil conductor layers arranged in a first direction parallel to the mounting surface and formed into a spiral shape with more than one turn on a plane perpendicular to the first direction; and a plurality of via-hole conductor layers connecting the coil conductor layers adjacent to each other in the first direction, wherein in the component body, a height dimension in a direction perpendicular to the mounting surface is greater than a width dimension in the first direction.

[0009] According to this structure, compared with an inductor whose width dimension is less than the height dimension, the area of ​​the main surface of the multiple insulating layers stacked along the width direction in the component body is relatively large. Therefore, the outer diameter of the coil (coil conductor layer) can be made larger, and the length of the coil can be made longer. Therefore, the acquisition range of the inductance value (L value) of the inductor is expanded. In addition, in the spiral coil conductor layer, the inner diameter can be made larger. Therefore, the Q value of the inductor becomes larger.

[0010] In the above-mentioned inductor, it is preferred that the above-mentioned component body has: a first end face and a second end face that are orthogonal to the above-mentioned mounting surface and parallel to the above-mentioned first direction, the above-mentioned first external electrode is buried in the interior of the above-mentioned component body, formed in an L shape, and is continuously exposed from the above-mentioned mounting surface to the above-mentioned first end face, and the above-mentioned second external electrode is buried in the interior of the above-mentioned component body, formed in an L shape, and is continuously exposed from the above-mentioned mounting surface to the above-mentioned second end face.

[0011] According to this structure, compared with a structure in which the external electrode is externally mounted on the component body, the inductor can be miniaturized, and the efficiency of obtaining the inductance value of the inductor relative to the mounting area can be improved.

[0012] In the above-mentioned inductor, it is preferred that the above-mentioned multiple coil conductor layers respectively have: a spiral winding portion; and a via pad provided for connecting the above-mentioned via conductor layers, and when viewed from the above-mentioned first direction, the above-mentioned winding portion includes: a portion along an annular outer peripheral track; a portion along an annular inner peripheral track that is closer to the inner side than the above-mentioned outer peripheral track; and a connecting portion connecting the portion of the above-mentioned outer peripheral track with the portion of the above-mentioned inner peripheral track, and in a second direction perpendicular to the above-mentioned first end face, at least one of the multiple via pads provided in the portion of the above-mentioned winding portion along the above-mentioned outer peripheral track included in the above-mentioned coil is provided at a position that does not overlap with the above-mentioned first external electrode.

[0013] The first external electrode and the second external electrode of the embedded component body play a role in reducing the outer diameter of the coil conductor layer. In contrast, in the second direction perpendicular to the first end face, at least one of the via pads is disposed at a position that does not overlap with the first external electrode (second external electrode). Therefore, the winding portion of the coil conductor layer can be formed close to the first external electrode (second external electrode). Therefore, the outer diameter of the coil conductor layer can be increased.

[0014] In the above-mentioned inductor, it is preferred that the above-mentioned multiple coil conductor layers respectively have: a spiral winding portion; and a via pad provided for connecting the above-mentioned via conductor layer, and when viewed from the above-mentioned first direction, the above-mentioned winding portion includes: a portion along an annular outer peripheral track; a portion along an annular inner peripheral track that is closer to the inner side than the above-mentioned outer peripheral track; and a connecting portion connecting the portion of the above-mentioned outer peripheral track with the portion of the above-mentioned inner peripheral track, and the above-mentioned via pad is not formed in at least one of the first area and the second area, wherein the above-mentioned first area is an area in the above-mentioned first external electrode that overlaps with the above-mentioned first external electrode in a direction perpendicular to the above-mentioned first side surface and in a direction perpendicular to the above-mentioned mounting surface, and the above-mentioned second area is an area in the above-mentioned second external electrode that overlaps with the above-mentioned second external electrode in a direction perpendicular to the above-mentioned second side surface and in a direction perpendicular to the above-mentioned mounting surface.

[0015] The first external electrode and the second external electrode of the embedded component body play a role in reducing the outer diameter of the coil conductor layer. In contrast, no via pad is formed in the first region, so the winding portion of the coil conductor layer can be formed close to the first external electrode. Similarly, no via pad is formed in the second region, so the winding portion of the coil conductor layer can be formed close to the second external electrode. Therefore, the outer diameter of the coil conductor layer can be increased.

[0016] In the above-mentioned inductor, it is preferred that the via pad connected to the winding portion of the outer track is formed to protrude outside the outer track, and the via pad connected to the winding portion of the inner track is formed to protrude inside the inner track.

[0017] According to this structure, the via hole pad of the outer track is formed to protrude outward from the outer track, so that the outer diameter of the winding portion of the inner track becomes larger. In addition, the via hole pad of the inner track is formed to protrude inward from the inner track, so that the outer diameter of the winding portion of the inner track, that is, the inner diameter of the winding portion, becomes larger. Therefore, the Q value of the inductor becomes larger.

[0018] In the above inductor, the component body preferably includes: a plurality of insulating layers stacked in the first direction; the coil conductor layer is formed in a spiral shape on one main surface of the insulating layer; and the plurality of via-hole conductor layers are formed to penetrate the insulating layer in a thickness direction.

[0019] According to this structure, the component body can be easily formed by a plurality of insulating layers. Furthermore, a plurality of coil conductor layers can be connected by via-hole conductor layers penetrating through the insulating layers, so that the coil can be easily formed.

[0020] In the above-mentioned inductor, it is preferable that the above-mentioned insulating layer is a non-magnetic material.

[0021] According to this structure, an inductor suitable for high-frequency signals is obtained.

[0022] According to one aspect of the present invention, an inductor having desired characteristics can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a perspective view of an inductor according to one embodiment.

[0024] Figure 2 This is a perspective view showing a coil conductor layer and external electrodes of an inductor according to an embodiment.

[0025] Figure 3 This is an exploded perspective view of an inductor.

[0026] Figure 4 It is a plan view showing the insulator layer of the coil conductor layer and the external electrode layer.

[0027] Figure 5 This is an explanatory diagram of an inductor viewed from the stacking direction.

[0028] Description of Reference Numerals

[0029] 10…component body; 11…mounting surface; 20…first external electrode; 30…second external electrode; 40…coil; 41-48…coil conductor layer; T1…height dimension; W1…width dimension. DETAILED DESCRIPTION

[0030] Hereinafter, one embodiment will be described.

[0031] In addition, the drawings sometimes enlarge the components for easy understanding. The size ratio of the components may be different from the actual or from that in other drawings. In addition, in the cross-sectional view, the hatching of some components may be omitted for easy understanding.

[0032] like Figure 1 As shown, the inductor 1 has a component body 10. The component body 10 is formed roughly in a rectangular parallelepiped shape. In addition, in this specification, "rectangular parallelepiped shape" includes a cube with chamfered corners and edges, and a cube with rounded corners and edges. In addition, it is also possible to form concave and convex portions on part or all of the main surface and the side surface. In addition, for the "rectangular parallelepiped shape", the opposing surfaces do not necessarily need to be completely parallel, and can also be slightly inclined.

[0033] The component body 10 has a mounting surface 11. The mounting surface 11 is a surface facing the circuit board when the inductor 1 is mounted on the circuit board. The component body 10 has an upper surface 12 parallel to the mounting surface 11. In addition, the component body 10 has two pairs of surfaces orthogonal to the mounting surface 11. One pair of the two pairs of surfaces is set as the first side surface 13 and the second side surface 14, and the other pair of the two pairs of surfaces is set as the first end surface 15 and the second end surface 16.

[0034] In this specification, the direction perpendicular to the upper surface 12 and the mounting surface 11 is referred to as the "height direction", the direction perpendicular to the first side surface 13 and the second side surface 14 is referred to as the "width direction", and the direction perpendicular to the first end surface 15 and the second end surface 16 is referred to as the "length direction". As a specific example, Figure 1 The figure shows "length direction L", "height direction T" and "width direction W". Moreover, the size in the "width direction" is referred to as "width dimension", the size in the "height direction" is referred to as "height dimension", and the size in the "length direction" is referred to as "length dimension".

[0035] In the component body 10, the size of the length direction L (length dimension L1) is preferably greater than 0 mm and less than 1.0 mm. For example, the length dimension L1 is 0.6 mm. In addition, in the component body 10, the size of the width direction W (width dimension W1) is preferably greater than 0 mm and less than 0.6 mm. The width dimension W1 is preferably less than 0.36 mm, and more preferably less than 0.33 mm. For example, the width dimension W1 of the component body 10 is 0.3 mm. In addition, in the component body 10, the size of the height direction T (height dimension T1) is preferably greater than 0 mm and less than 0.8 mm. For example, the height dimension T1 of the component body 10 is 0.4 mm. In the present embodiment, for the component body 10, the height dimension T1 is larger than the width dimension W1 (T1>W1).

[0036] The inductor 1 includes a first external electrode 20 and a second external electrode 30 exposed on the surface of a component body 10. The first external electrode 20 is exposed on the mounting surface 11 of the component body 10. In addition, the first external electrode 20 is exposed on the first end surface 15 of the component body 10. The second external electrode 30 is exposed on the mounting surface 11 of the component body 10. In addition, the second external electrode 30 is exposed on the second end surface 16 of the component body 10. In other words, the first external electrode 20 and the second external electrode 30 are exposed on the mounting surface 11. In other words, the surface of the component body 10 on which the first external electrode 20 and the second external electrode 30 are exposed is the mounting surface 11.

[0037] On the first end surface 15, the first external electrode 20 is formed to a length of approximately 2 / 3 of the height of the component body 10 from the mounting surface 11 of the component body 10. In the width direction W, the first external electrode 20 is formed at the approximate center of the component body 10, and the width dimension of the first external electrode 20 is smaller than the width dimension of the component body 10. On the second end surface 16, the second external electrode 30 is formed to a length of approximately 2 / 3 of the height of the component body 10 from the mounting surface 11 of the component body 10. In the present embodiment, in the width direction W, the second external electrode 30 is formed at the approximate center of the component body 10, and the width dimension of the second external electrode 30 is smaller than the width dimension of the component body 10. In addition, the width dimension of the second external electrode 30 may be equal to the width dimension of the component body 10.

[0038] like Figure 2 As shown in FIG. 1 , the inductor 1 includes a coil 40 disposed in the component body 10 . A first end of the coil 40 is connected to the first external electrode 20 , and a second end of the coil 40 is connected to the second external electrode 30 . Figure 2 In FIG. 1 , the component body 10 is indicated by a two-dot chain line, so that the coil 40 and the first external electrode 20 and the second external electrode 30 can be easily distinguished.

[0039] The first external electrode 20 is formed in an L-shape. The first external electrode 20 includes an end surface electrode 20a exposed at the first end surface 15 of the component body 10, and a lower surface electrode 20b exposed at the mounting surface 11 of the component body 10. In other words, the first external electrode 20 is continuously exposed from the mounting surface 11 to the first end surface 15 of the component body 10.

[0040] The second external electrode 30 is formed in an L-shape. The second external electrode 30 includes an end surface electrode 30a exposed at the second end surface 16 of the component body 10, and a lower surface electrode 30b exposed at the mounting surface 11 of the component body 10. In other words, the second external electrode 30 is continuously exposed from the mounting surface 11 to the second end surface 16 of the component body 10.

[0041] In addition, as an inductor, it can also be designed to include a covering layer covering the first external electrode 20 and the second external electrode 30. As the material of the covering layer, a material with high solder resistance and solder wettability can be used. For example, metals such as nickel (Ni), copper (Cu), tin (Sn), gold (Au), or alloys containing these metals can be used. In addition, the covering layer can also be formed by multiple layers. For example, the covering layer includes: Ni plating covering the first external electrode 20 and the second external electrode 30; and Sn plating covering the surface of the Ni plating. The covering layer prevents oxidation of the surface of the first external electrode 20 and the second external electrode 30. The covering layer can also protrude from the component body 10, or it can form the same surface as each surface of the component body 10.

[0042] like Figure 2 As shown, the first external electrode 20 includes: a plurality of external conductor layers 21 to 28 arranged in the width direction W. The plurality of external conductor layers 21 to 28 are connected to each other along the width direction W to form a first external electrode 20. Similarly, the second external electrode 30 includes: a plurality of external conductor layers 31 to 38 arranged in the width direction W. These plurality of external conductor layers 31 to 38 are connected to each other in the width direction W to form a second external electrode 30. The external conductor layers 21 to 28, 31 to 38 do not need to be in contact with each other along the width direction, and can also be connected by layers with slightly smaller shapes or vias, and can also be completely non-contacting. The coil 40 includes: a plurality of coil conductor layers 41 to 48 arranged in the width direction W. The plurality of coil conductor layers 41 to 48 are connected by via-hole conductor layers described later to form the coil 40.

[0043] like Figure 3 As shown, the component body 10 includes a plurality of insulator layers 60. In the present embodiment, when the plurality of insulator layers are not distinguished, the figure mark "60" is used, and when the plurality of insulator layers are distinguished one by one, the figure marks "61, 62, 63a to 63h, 64, 65" are used. The plurality of insulator layers 60 are respectively formed in a rectangular plate shape. The component body 10 is formed into a rectangular parallelepiped by the stacked insulator layers 60. As the material of the insulator layer 60, a non-magnetic material can be used. In addition, as the material of the insulator layer 60, a magnetic material can also be used. The insulator layer 60 is composed of materials such as an insulating material with borosilicate glass as the main component, an insulating resin such as aluminum oxide, zirconium oxide, and a polyimide resin. In addition, the interface of the plurality of insulator layers 60 of the component body 10 is sometimes unclear due to treatments such as firing and curing.

[0044] The colors of the insulating layers 61 and 65 are different from the colors of the other insulating layers 62 , 63 a to 63 h , and 64 . Figure 1 In the figure, the insulator layers 61 and 65 are shown to be distinguished from other insulator layers by hatching and solid lines. Thus, when the inductor 1 is mounted, lateral rolling of the inductor 1 can be detected. In addition, the color of the insulator layers 61 and 65 may be the same as that of the other insulator layers 62, 63a to 63h, and 64. If the length dimension L1, the width dimension W1, and the height dimension T1 are different values, lateral rolling can be detected even if the colors are the same as described above.

[0045] like Figure 3 and Figure 4As shown, the coil 40 includes: a plurality of coil conductor layers 41 to 48; and via conductor layers 51 to 57 connecting the coil conductor layers 41 to 48. Each coil conductor layer 41 to 48 is wound in a planar shape on the insulating layer 63a to 63h. Each coil conductor layer 41 to 48 is formed into a spiral shape (spiral shape) with more than one turn. In addition, Figure 4 In FIG. 1 , the outer shape of the insulating layer 60 ( 63 a to 63 h ) is shown by a two-dot chain line.

[0046] like Figure 4 As shown, the coil conductor layers 41 to 48 of the present embodiment are formed in a spiral shape (helical shape) substantially along two annular tracks R1 and R2. Therefore, the number of turns of the coil conductor layers 41 to 48 of the present embodiment is 1 turn or more and less than 2 turns.

[0047] The via hole conductor layers 51 to 57 are formed by penetrating the insulating layers 63b to 63h in the thickness direction. Figure 3 In FIG. 5 , the via conductor layers 51 to 57 are indicated by dashed lines between the coil conductor layers 41 to 48. Figure 4 In FIG. 1 , the via-hole conductor layers 51 to 57 are indicated by dotted lines, and the connection destinations of the via-hole conductor layers 51 to 57 are indicated by single-dot chain lines.

[0048] like Figure 2 As shown, the first external electrode 20 includes a plurality of external conductor layers 21 to 28. In addition, the second external electrode 30 includes a plurality of external conductor layers 31 to 38.

[0049] The external conductor layers 21 to 28, 31 to 38 are provided on the insulating layers 63a to 63h. The external conductor layers 21 to 28, 31 to 38 are formed in an L shape. The external conductor layers 22 to 28, 32 to 38 penetrate the insulating layers 63b to 63h in the thickness direction. Figure 2 As shown in FIG. 1 , the outer conductor layers 21 to 28 are connected to each other through the insulating layers 63a to 63h to form an L-shaped first outer electrode 20. Figure 2 As shown, the outer conductor layers 31 to 38 are connected to each other via the insulating layers 63 a to 63 h to form an L-shaped second outer electrode 30 .

[0050] Each coil conductor layer 41 to 48 and the via conductor layers 51 to 57 are formed of a conductive material such as a metal with low resistance such as silver (Ag), copper (Cu), gold (Au), or an alloy with these metals as a main component. Each external conductor layer 21 to 28, 31 to 38 is formed of a conductive material such as a metal with low resistance such as silver (Ag), copper (Cu), gold (Au), or an alloy with these metals as a main component.

[0051] exist Figure 4, the coil conductor layers 41 to 48 of the respective insulating layers 63a to 63h are described in order from the upper left.

[0052] In the insulator layer 63a, the coil conductor layer 41 includes: a winding portion 41L formed in a spiral shape from the outer peripheral track R1 to the inner peripheral track R2; and a via pad 41P formed at the second end of the winding portion 41L. In detail, the winding portion 41L has: a portion along the outer peripheral track R1, a portion along the inner peripheral track R2, and a connecting portion between the portion of the outer peripheral track R1 and the portion of the inner peripheral track R2. The first end of the winding portion 41L is connected to the upper end of the outer conductor layer 21 of the first external electrode 20.

[0053] In the insulator layer 63b, the coil conductor layer 42 includes: a winding portion 42L formed in a spiral shape from the inner peripheral track R2 to the outer peripheral track R1; and via pads 42P (42Pa, 42Pb) formed at both ends of the winding portion 42L. Like the coil conductor layer 41, the coil conductor layer 42 has: a portion along the outer peripheral track R1 and the inner peripheral track R2; and a connecting portion connecting the above portions. The via pad 42Pa is connected to the via pad 41P of the insulator layer 63a via the via conductor layer 51 of the insulator layer 63b.

[0054] In the insulator layer 63c, the coil conductor layer 43 includes: a winding portion 43L formed in a spiral shape from the outer peripheral track R1 to the inner peripheral track R2; and via pads 43P (43Pa, 43Pb) formed at both ends of the winding portion 43L. Similar to the coil conductor layer 41, the coil conductor layer 43 has: a portion along the outer peripheral track R1 and the inner peripheral track R2; and a connecting portion connecting the above portions. The via pad 43Pa is connected to the via pad 43Pb ​​of the insulator layer 63b via the via conductor layer 52 of the insulator layer 63c.

[0055] In the insulator layer 63d, the coil conductor layer 44 includes: a winding portion 44L formed in a spiral shape from the inner peripheral track R2 to the outer peripheral track R1; and via pads 44P (44Pa, 44Pb) formed at both ends of the winding portion 44L. Like the coil conductor layer 41, the coil conductor layer 44 has: a portion along the outer peripheral track R1 and the inner peripheral track R2; and a connecting portion connecting the above portions. In addition, the coil conductor layer 44 includes: a via pad 44Pc formed at a position symmetrical to the via pad 44Pb. The via pad 44Pa is connected to the via pad 43Pb ​​of the insulator layer 63c via the via conductor layer 53 of the insulator layer 63d.

[0056] In the insulator layer 63e, the coil conductor layer 45 includes: a winding portion 45L formed in a spiral shape from the outer peripheral track R1 to the inner peripheral track R2; and via pads 45P (45Pa, 45Pb) formed at both ends of the winding portion 45L. Like the coil conductor layer 41, the coil conductor layer 45 has: a portion along the outer peripheral track R1 and the inner peripheral track R2; and a connecting portion connecting the above portions. In addition, the coil conductor layer 45 includes: a via pad 45Pc formed at a position symmetrical to the via pad 45P. The via pads 45Pa and 45Pc are connected to the via pads 44Pc and 44Pb of the insulator layer 63d via the via conductor layer 54 (54a, 54b) of the insulator layer 63e.

[0057] In the insulator layer 63f, the coil conductor layer 46 includes: a winding portion 46L formed in a spiral shape from the inner peripheral track R2 to the outer peripheral track R1; and via pads 46Pa and 46Pb formed at both ends of the winding portion 46L. Similar to the coil conductor layer 41, the coil conductor layer 46 has: a portion along the outer peripheral track R1 and the inner peripheral track R2; and a connecting portion connecting the above portions. The via pad 46Pa is connected to the via pad 45Pb of the insulator layer 63e via the via conductor layer 55 of the insulator layer 63f.

[0058] In the insulator layer 63g, the coil conductor layer 47 includes: a winding portion 47L formed in a spiral shape from the outer peripheral track R1 to the inner peripheral track R2; and via pads 47P (47Pa, 47Pb) formed at both ends of the winding portion 47L. Similar to the coil conductor layer 41, the coil conductor layer 47 has: a portion along the outer peripheral track R1 and the inner peripheral track R2; and a connecting portion connecting the above portions. The via pad 47Pa is connected to the via pad 46Pb of the insulator layer 63f via the via conductor layer 56 of the insulator layer 63g.

[0059] In the insulator layer 63h, the coil conductor layer 48 includes: a winding portion 48L formed in a spiral shape from the inner peripheral track R2 to the outer peripheral track R1; and a via pad 48P formed at the first end of the winding portion 48L. Similar to the coil conductor layer 41, the coil conductor layer 48 has: a portion along the outer peripheral track R1 and the inner peripheral track R2; and a connecting portion connecting the above portions. The second end of the winding portion 48L is connected to the upper end of the outer conductor layer 38 of the second external electrode 30. The via pad 48P is connected to the via pad 47Pb of the insulator layer 63g via the via conductor layer 57 of the insulator layer 63h.

[0060] Each via pad 41P to 48P is formed to have an outer diameter greater than the line width of the winding portion 41L to 48L. Each via pad 41P to 48P is formed, for example, in a circular shape, and its diameter is greater than the line width of the winding portion 41L to 48L. In addition, the shape of each via pad 41P to 48P may be a shape other than a circular shape, for example, a polygonal shape, a semicircular shape, an elliptical shape, a shape obtained by combining these shapes, etc.

[0061] (Manufacturing method)

[0062] Next, refer to Figure 3 A method for manufacturing the above-mentioned inductor 1 will be described.

[0063] First, a mother insulator layer that should become the insulator layer 61 is formed. The mother insulator layer is a larger insulator layer in which multiple insulator layers 61 are arranged in a matrix in a connected state. After an insulating paste with borosilicate glass as the main component is applied to a carrier film of, for example, 8 inches square by screen printing, the entire insulating paste is exposed to ultraviolet rays. As a result, the insulating paste is cured to form the mother insulator layer that should become the insulator layer 61. In this embodiment, an insulating paste having a relative magnetic permeability of less than "2" after firing is used. In addition, the insulating paste used for the insulator layer 61 is colored differently from the insulating paste used to become the insulator layers 62, 63a~63h, 64.

[0064] Next, a mother insulator layer to be the insulator layer 62 is formed. After an insulating paste is applied to the mother insulator layer to be the insulator layer 61 by screen printing, the entire insulating paste is exposed to ultraviolet rays to form the mother insulator layer to be the insulator layer 62.

[0065] Next, a mother insulator layer to be the insulator layer 63a is formed. After an insulating paste is applied to the mother insulator layer to be the insulator layer 62, the entire insulating paste is exposed to ultraviolet light to form the mother insulator layer to be the insulator layer 63a.

[0066] Next, the coil conductor layer 41 and the external conductor layers 21 and 31 are formed by a photolithography process. For example, a photosensitive conductive paste containing Ag as a main metal component is printed on the mother insulator layer that should become the insulator layer 63a to form a conductive paste layer. Next, ultraviolet rays or the like are irradiated on the conductive paste layer through a photomask, and an alkaline solution or the like is used for development. Thus, the coil conductor layer 41 and the external conductor layers 21 and 31 are formed on the mother insulator layer that should become the insulator layer 63a.

[0067] Next, a mother insulator layer to be the insulator layer 63b is formed. After the insulating paste is applied to the mother insulator layer to be the insulator layer 63a, the insulating paste is exposed to ultraviolet light through a photomask that covers the position where the via hole conductor layer 51 and the external conductor layers 22 and 32 are formed. Next, the uncured insulating paste is removed by an alkaline solution or the like. Thus, a mother insulator layer to be the insulator layer 63b is formed, which has a through hole at a position corresponding to the via hole pad 41P of the coil conductor layer 41 and partially cuts off the corner corresponding to the external conductor layers 22 and 32.

[0068] Next, the coil conductor layer 42, the via hole conductor layer 51, and the external conductor layers 22 and 32 are formed by a photolithography process. As with the above-mentioned coil conductor layer 41, a photosensitive conductive paste is applied to form a conductive paste layer on the mother insulator layer that should become the insulator layer 63b. At this time, the conductive paste is filled in the above-mentioned through holes and notches. Next, ultraviolet rays are irradiated to the conductive paste layer through a photomask, and it is developed by an alkaline solution or the like. Thus, the coil conductor layer 42, the via hole conductor layer 51, and the external conductor layers 22 and 32 are formed on the mother insulator layer that should become the insulator layer 63b.

[0069] Thereafter, by alternately repeating the process of forming a mother insulator layer and the photolithography process, mother insulator layers to be insulator layers 63c to 63h, coil conductor layers 42 to 48, external conductor layers 23 to 28, 33 to 38, and via conductor layers 52 to 57 are formed.

[0070] Next, a mother insulator layer that will become insulator layer 64 is formed on the mother insulator layer that should become insulator layer 63h, similarly to the mother insulator layer that will become insulator layer 62 described above. Also, a mother insulator layer that will become insulator layer 65 is formed on the mother insulator layer that should become insulator layer 64, similarly to the mother insulator layer that will become insulator layer 61 described above.

[0071] Through the above steps, a mother laminated body including a plurality of component bodies 10 arranged in a matrix and connected to each other is obtained.

[0072] Next, the mother laminate is cut by a cutter or the like to obtain an unfired component body 10. In the cutting step, the outer conductor layers 21 to 28 and 31 to 38 are exposed from the component body 10 in the cut surface formed by the cutting. In addition, the component body 10 shrinks during the firing described later, and the mother laminate is cut in consideration of the shrinkage.

[0073] Next, the unfired component body 10 is fired under predetermined conditions to obtain the component body 10. Furthermore, the component body 10 is subjected to barrel polishing.

[0074] In the case of an inductor including a coating layer, after barrel polishing, the coating layer covering the outer conductor layers 21 to 28 and 31 to 38 is formed. For example, the coating layer can be formed by electroplating or chemical plating.

[0075] The inductor 1 is completed through the above steps.

[0076] In addition, the above-mentioned manufacturing method is an example, and as long as the structure of the inductor 1 can be realized, it can be replaced or supplemented by other well-known manufacturing methods. For example, a mother insulator layer that becomes each insulator layer is formed on a carrier film, and a coil conductor layer is formed on a desired mother insulator layer. It is also possible to obtain the above-mentioned mother laminate by stacking a plurality of mother insulator layers. In addition, the coil conductor layer can also be formed by other methods such as printing.

[0077] (effect)

[0078] Next, the operation of the above-mentioned inductor 1 will be described.

[0079] like Figure 1 As shown in FIG. 1 , the component body 10 of the inductor 1 is in the shape of a rectangular parallelepiped and has a mounting surface 11 that exposes the first external electrode 20 and the second external electrode 30. Figure 2 As shown, the inductor 1 includes: a coil 40 provided in the component body 10. The first end of the coil 40 is connected to the first external electrode 20, and the second end of the coil 40 is connected to the second external electrode 30. The coil 40 includes: a plurality of coil conductor layers 41 to 48 provided in the width direction W. Each coil conductor layer 41 to 48 is formed in a spiral shape (spiral shape) with a number of turns of one or more. The component body 10 has a height dimension T1 greater than a width dimension W1 (T1>W1).

[0080] For the component body 10, the main surface area of ​​the plurality of insulating layers 61, 62, 63a to 63h, 64, and 65 stacked in the width direction W is relatively large compared to an inductor whose width dimension W1 is less than the height dimension T1. Therefore, the outer diameter of the coil 40 (coil conductor layers 41 to 48) can be made larger, and the length of the coil 40 can be made longer. Therefore, the range of the inductance value (L value) of the inductor 1 becomes wider. In addition, in the spiral-shaped coil conductor layers 41 to 48, the inner diameter can be made larger. Therefore, the Q value of the inductor 1 becomes larger.

[0081] like Figure 4As shown, each coil conductor layer 41 to 48 has: a winding portion 41L to 48L formed in a spiral shape on the outer peripheral track R1 and the inner peripheral track R2; and a via hole pad 41P to 48P connecting the via hole conductor layers 51 to 57. Each via hole pad 41P to 48P is formed with an outer diameter larger than the line width of the winding portion 41L to 48L. Each via hole pad 41P to 48P forms a suitable coil 40. From the viewpoint of reducing the resistance value of the coil 40, it is preferred that the via hole conductor layers 51 to 57 are thicker. In addition, from the viewpoint of the connectivity between the via hole conductor layers 51 to 57 and the coil conductor layers 41 to 48, it is preferred that the via hole conductor layers 51 to 57 are thicker.

[0082] Each insulator layer 63a to 63h is formed by applying an insulating paste using screen printing. The coil conductor layers 41 to 48 and the via conductor layers 51 to 57 are formed by a photolithography process using a photosensitive conductive paste. Considering the misalignment of the manufacturing process, larger via pads 41P to 48P are required depending on the size of the via conductor layers 51 to 57.

[0083] like Figure 5 As shown in FIG. 1 , the first external electrode 20 and the second external electrode 30 of the inductor 1 are formed in an L shape. Furthermore, in the first external electrode 20, no via pad is formed in the first region A1 overlapping with the first external electrode 20 in the direction perpendicular to the first end face 15 and the direction perpendicular to the mounting surface 11. In addition, in the second external electrode 30, no via pad is formed in the second region A2 overlapping with the second external electrode 30 in the direction perpendicular to the second end face 16 and the direction perpendicular to the mounting surface 11. If a via pad is formed in the first region A1, the via pad must be separated from the first external electrode 20 from the viewpoint of short circuit between the via pad and the first external electrode 20, parasitic capacitance, etc. In accordance with this separation, the outer diameter of the winding portions 41L to 48L of the coil conductor layers 41 to 48 becomes smaller. Similarly, when a via pad is formed in the second area A2, the via pad must be separated from the second external electrode 30 from the viewpoint of short circuit, parasitic capacitance, etc. between the via pad and the second external electrode 30. In accordance with this separation, the outer diameter of the winding portions 41L to 48L of the coil conductor layers 41 to 48 is reduced.

[0084] Therefore, as in the present embodiment, since no via hole pad is formed in the first area A1, the winding portions 41L to 48L of the coil conductor layers 41 to 48 can be formed close to the first external electrode 20. Similarly, since no via hole pad is formed in the second area A2, the winding portions 41L to 48L of the coil conductor layers 41 to 48 can be formed close to the second external electrode 30. Therefore, the outer diameter of the coil conductor layers 41 to 48 can be made larger.

[0085] On the other hand, if the via pads are formed in the first area A1 and the second area A2, and the outer diameter of the coil conductor layers 41 to 48 is to be increased, the via pads are formed inside the outer peripheral track R1 of the coil conductor layers 41 to 48. This reduces the outer diameter of the inner peripheral track R2. In other words, the length of the coil 40 can be shortened.

[0086] In contrast, as in the present embodiment, the via pad is not formed in the first region A1, in other words, the via pad is formed at a position that does not overlap with the first external electrode 20. Therefore, the outer diameter of the inner track R2, in other words, the inner diameter of the inner track R2 can be increased. Similarly, the via pad is not formed in the second region A2, in other words, the via pad is formed at a position that does not overlap with the second external electrode 30. Therefore, the outer diameter of the inner track R2, in other words, the inner diameter of the inner track R2 can be increased. By increasing the inner diameter of the inner track R2, the Q value of the inductor 1 is increased.

[0087] In addition, the via pad connected to the winding portion of the outer track R1 is formed to protrude to the outside of the outer track R1, and the via pad connected to the winding portion of the inner track R2 is formed to protrude to the inside of the inner track R2. By forming the via pad of the outer track R1 to protrude to the outside than the outer track R1, the outer diameter of the winding portion of the inner track R2 becomes larger. In addition, by forming the via pad of the inner track R2 to protrude to the inside than the inner track R2, the outer diameter of the winding portion of the inner track R2, in other words, the inner diameter of the winding portion, becomes larger. Therefore, the Q value of the inductor can be increased.

[0088] As described above, according to this embodiment, the following effects are achieved.

[0089] (1) The component body 10 of the inductor 1 is in the shape of a rectangular parallelepiped and has a mounting surface 11 that exposes the first external electrode 20 and the second external electrode 30. The inductor 1 has a coil 40 disposed in the component body 10. The first end of the coil 40 is connected to the first external electrode 20, and the second end of the coil 40 is connected to the second external electrode 30. The coil 40 includes a plurality of coil conductor layers 41 to 48 disposed in the width direction W. Each coil conductor layer 41 to 48 is formed in a spiral shape (spiral shape) with a number of turns of one or more. The component body 10 has a height dimension T1 that is larger than a width dimension W1 (T1>W1).

[0090] For the component body 10, the main surface area of ​​the plurality of insulating layers 61, 62, 63a to 63h, 64, and 65 stacked in the width direction W is relatively large compared to an inductor whose width dimension W1 is less than the height dimension T1. Therefore, the outer diameter of the coil 40 (coil conductor layers 41 to 48) can be increased, and the length of the coil 40 can be increased. Therefore, the acquisition range of the inductance value (L value) of the inductor 1 can be made wider. In addition, in the spiral-shaped coil conductor layers 41 to 48, the inner diameter can be increased. Therefore, the Q value of the inductor 1 can be increased.

[0091] (2) The first external electrode 20 and the second external electrode 30 are formed in an L shape and embedded in the component body 10. Therefore, the inductor 1 can be made smaller than a structure in which the external electrodes are externally mounted on the component body. In addition, the efficiency of obtaining the inductance value relative to the mounting area of ​​the inductor 1 can be improved.

[0092] (3) The first external electrode 20 and the second external electrode 30 are not formed on the upper surface 12 and the upper surface 12 side of the first end surface 15 and the second end surface 16. Therefore, the magnetic flux generated near the above positions is not blocked, and the Q value of the inductor 1 can be increased. On the other hand, the first external electrode 20 and the second external electrode 30 are formed on the first end surface 15 and the second end surface 16 respectively to a length of approximately 2 / 3 of the height of the component body 10 from the mounting surface 11, so that the fixing force to the substrate during mounting can be ensured.

[0093] (4) The plurality of coil conductor layers 41 to 48 respectively include: spiral winding portions 41L to 48L; and via pads 41P to 48P provided to connect the via conductor layers 51 to 57. The winding portions 41L to 48L include: a portion along the annular outer peripheral track R1; a portion along the annular inner peripheral track R2 which is closer to the inner side than the outer peripheral track R1; and a connecting portion connecting the outer peripheral track R1 portion and the inner peripheral track R2 portion. A via pad is not formed in at least one of the first region A1 overlapping with the first external electrode 20 in the direction perpendicular to the first end face 15 and in the direction perpendicular to the mounting surface 11, and the second region A2 overlapping with the second external electrode 30 in the direction perpendicular to the second end face 16 and in the direction perpendicular to the mounting surface 11.

[0094] The first external electrode 20 and the second external electrode 30 of the embedded component body 10 play a role in reducing the outer diameter of the coil conductor layers 41 to 48. In contrast, at least one of the via pads is provided at a position that does not overlap with the first external electrode 20 (second external electrode) in a direction perpendicular to the first end face 15 (second end face 16). Therefore, the winding portions 41L to 48L of the coil conductor layer can be formed close to the first external electrode 20 (second external electrode 30). Therefore, the outer diameter of the coil conductor layers 41 to 48 can be made larger.

[0095] Furthermore, the via pads 41P to 48P are preferably provided at positions not overlapping the first external electrode 20 (second external electrode 30) in the direction perpendicular to the first end surface 15 (second end surface 16). In this way, the outer diameters of the coil conductor layers 41 to 48 can be increased.

[0096] (5) The via pad connected to the winding portion of the outer track R1 is formed to protrude to the outside of the outer track R1, and the via pad connected to the winding portion of the inner track R2 is formed to protrude to the inside of the inner track R2. By forming the via pad of the outer track R1 to protrude to the outside than the outer track R1, the outer diameter of the winding portion of the inner track R2 is increased. In addition, by forming the via pad of the inner track R2 to protrude to the inside than the inner track R2, the outer diameter of the winding portion of the inner track R2, in other words, the inner diameter of the winding portion, can be increased. Therefore, the Q value of the inductor can be made larger.

[0097] (6) The component body 10 includes a plurality of stacked insulating layers 61, 62, 63a to 63h, 64, and 65, the coil conductor layers 41 to 48 are formed in a spiral shape on one main surface of the insulating layers 63a to 63h, and a plurality of via-hole conductor layers 51 to 57 are formed by penetrating the insulating layers 63b to 63h in the thickness direction. Therefore, the component body 10 can be easily formed by the plurality of insulating layers 61, 62, 63a to 63h, 64, and 65. Furthermore, the plurality of coil conductor layers 41 to 48 are connected by the via-hole conductor layers 51 to 57 penetrating the insulating layers 63b to 63h, so that the coil 40 can be easily formed.

[0098] (7) The insulating layers 61, 62, 63a to 63h, 64, and 65 are non-magnetic. Therefore, the inductor 1 suitable for high-frequency signals is obtained.

[0099] (8) The height dimension of the component body 10 is preferably greater than the width dimension. The height of the first external electrode 20 of the first end surface 15 can be set higher relative to a constant mounting area, thereby improving the fixing force. Similarly, the height of the second external electrode 30 of the second end surface 16 can be set higher relative to a constant mounting area, thereby improving the fixing force.

[0100] In addition, the above-mentioned embodiment can also be implemented in the following manner.

[0101] In the above-mentioned embodiment, the number of turns of the coil conductor layer may be changed as appropriate. In addition, a single inductor may include a coil including coil conductor layers having different numbers of turns.

[0102] In the above embodiment, the first external electrode 20 and the second external electrode 30 may be formed on the surface (outside) of the component body 10. Such electrodes can be formed on the end of the coil conductor layer exposed from the component body 10 by plating, sputtering, coating and firing, for example.

[0103] In the above embodiment, the shape of the coil 40 (shape of the outer track R1 and the inner track R2), line width, line length, etc. may be appropriately changed. In addition, the shapes of the first external electrode 20 and the second external electrode 30 may be appropriately changed.

Claims

1. An inductor, characterized in that: have: A rectangular parallelepiped component body; A first external electrode and a second external electrode, which are respectively provided on a first end surface and a second end surface of the component body that are opposite to each other in the length direction (L), and are formed in an L shape; as well as a coil, which is arranged on the component body, has a first end connected to the first external electrode, and a second end connected to the second external electrode, The coil includes: a plurality of coil conductor layers formed in a spiral shape and arranged in a width direction (W) of the component body that is orthogonal to the length direction (L) and parallel to the mounting surface; and a via-hole conductor layer that connects adjacent ones of the plurality of coil conductor layers to each other, The first external electrode is embedded in the component body and is continuously exposed from the mounting surface to the first end surface. The second external electrode is buried in the component body and is continuously exposed from the mounting surface to the second end surface. The plurality of coil conductor layers each have a via hole pad provided so as to connect a spiral winding portion and the via hole conductor layer. The via pads include a first via pad provided at a portion of the coil along an outer peripheral track and a second via pad provided at a portion of the coil other than the outer peripheral track. In the winding portion, a first region overlapping with the first external electrode exists in two directions, the length direction (L) and a height direction (T) orthogonal to the length direction (L) and the width direction (W), and a second region overlapping with the second external electrode exists in two directions, the length direction (L) and the height direction (T), The via pad is not formed in at least one of the first region and the second region.

2. The inductor according to claim 1, characterized in that The via pad is not formed in either the first region or the second region.

3. An inductor, characterized in that: have: A rectangular parallelepiped component body; A first external electrode and a second external electrode, which are respectively provided on a first end surface and a second end surface of the component body that are opposite to each other in the length direction (L), and are formed in an L shape; as well as a coil, which is arranged on the component body, has a first end connected to the first external electrode, and a second end connected to the second external electrode, The coil includes: a plurality of coil conductor layers formed in a spiral shape and arranged in a width direction (W) of the component body that is orthogonal to the length direction (L) and parallel to the mounting surface; and a via-hole conductor layer that connects adjacent ones of the plurality of coil conductor layers to each other, The first external electrode is embedded in the component body and is continuously exposed from the mounting surface to the first end surface. The second external electrode is buried in the component body and is continuously exposed from the mounting surface to the second end surface. The plurality of coil conductor layers each have a via hole pad provided so as to connect a spiral winding portion and the via hole conductor layer. At least one of the via pads provided in the spiral portion along the outer peripheral track of the coil is provided at a position that does not overlap with the first external electrode when the component body is viewed from the longitudinal direction (L).

4. The inductor according to claim 3, characterized in that The plurality of via pads provided along a portion of an outer peripheral track of the coil are provided at positions that do not overlap with the first external electrode when the component body is viewed from the longitudinal direction (L).

5. The inductor according to claim 3, characterized in that: At least one of the via pads provided at a portion of the coil other than the outer peripheral track is provided so as to at least partially overlap with the first external electrode when the component body is viewed from the longitudinal direction (L).

6. The inductor according to claim 5, characterized in that The plurality of via pads provided at a portion other than the outer peripheral track of the coil are provided so as to at least partially overlap with the first external electrode when the component body is viewed from the longitudinal direction (L).

7. The inductor according to claim 3, characterized in that At least one of the plurality of via pads provided along the outer peripheral track of the winding portion included in the coil is provided at a position that does not overlap with the first external electrode in a length direction (L) perpendicular to the first end surface, At least one of the plurality of via pads provided in the portion along the inner circumferential track of the winding portion included in the coil is provided at a position that does not overlap at least partially with the first external electrode in the length direction (L) perpendicular to the first end surface.

8. An inductor, characterized in that: have: A rectangular parallelepiped component body; A first external electrode and a second external electrode, which are respectively provided on a first end surface and a second end surface of the component body that are opposite to each other in the length direction (L), and are formed in an L shape; as well as a coil, which is arranged on the component body, has a first end connected to the first external electrode, and a second end connected to the second external electrode, The coil includes: a plurality of coil conductor layers formed in a spiral shape and arranged in a width direction (W) of the component body that is orthogonal to the length direction (L) and parallel to the mounting surface; and a via-hole conductor layer that connects adjacent ones of the plurality of coil conductor layers to each other, The first external electrode is embedded in the component body and is continuously exposed from the mounting surface to the first end surface. The second external electrode is buried in the component body and is continuously exposed from the mounting surface to the second end surface. The plurality of coil conductor layers each have a via hole pad provided so as to connect a spiral winding portion and the via hole conductor layer. The via pads include a via pad provided along the outer peripheral track of the coil and a via pad provided at a portion of the coil other than the outer peripheral track. The via hole pad provided in the portion along the outer peripheral track of the coil is not provided in at least one of a first region overlapping with the first external electrode in both the length direction (L) and the height direction (T) orthogonal to the length direction (L) and the width direction (W) and a second region overlapping with the second external electrode in both the length direction (L) and the height direction (T).

9. An inductor, characterized in that: have: A rectangular parallelepiped component body; A first external electrode and a second external electrode, which are respectively provided on a first end surface and a second end surface of the component body that are opposite to each other in the length direction (L), and are formed in an L shape; as well as a coil, which is arranged on the component body, has a first end connected to the first external electrode, and a second end connected to the second external electrode, The coil includes: a plurality of coil conductor layers formed in a spiral shape and arranged in a width direction (W) of the component body that is orthogonal to the length direction (L) and parallel to the mounting surface; and a via-hole conductor layer that connects adjacent ones of the plurality of coil conductor layers to each other, The first external electrode is embedded in the component body and is continuously exposed from the mounting surface to the first end surface. The second external electrode is buried in the component body and is continuously exposed from the mounting surface to the second end surface. The plurality of coil conductor layers each have a via hole pad provided so as to connect a spiral winding portion and the via hole conductor layer. The via pads include a via pad provided along the outer peripheral track of the coil and a via pad provided at a portion of the coil other than the outer peripheral track. The via pad provided in the portion other than the outer peripheral track of the coil is not provided in at least one of a first region overlapping with the first external electrode in both the length direction (L) and the height direction (T) orthogonal to the length direction (L) and the width direction (W) and a second region overlapping with the second external electrode in both the length direction (L) and the height direction (T).

10. An inductor, characterized in that: have: A rectangular parallelepiped component body; A first external electrode and a second external electrode, which are respectively provided on a first end surface and a second end surface of the component body that are opposite to each other in the length direction (L), and are formed in an L shape; as well as a coil, which is arranged on the component body, has a first end connected to the first external electrode, and a second end connected to the second external electrode, The coil includes: a plurality of coil conductor layers formed in a spiral shape and arranged in a width direction (W) of the component body that is orthogonal to the length direction (L) and parallel to the mounting surface; and a via-hole conductor layer that connects adjacent ones of the plurality of coil conductor layers to each other, The first external electrode is embedded in the component body and is continuously exposed from the mounting surface to the first end surface. The second external electrode is buried in the component body and is continuously exposed from the mounting surface to the second end surface. The plurality of coil conductor layers each have a via hole pad provided so as to connect a spiral winding portion and the via hole conductor layer. The plurality of via pads include via pads located at symmetrical positions.

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