A ceramic substrate convenient for welding

Abstract

The invention relates to the technical field of substrate production, and specifically to a ceramic substrate that is convenient for welding, comprising a substrate, wherein a protective mechanism is provided on the outer side of the substrate, and the outer sides and the upper end of the substrate are protected by the protective mechanism, and a cross bar is provided on the upper side of the substrate, and the cross bar is connected to the protective mechanism, and two pusher assemblies are provided in the upper end of the protective mechanism, and the pusher assemblies are connected to a solder paste coating mechanism; when the cross bar is pushed to move along the upper surface of the substrate, during the movement of the cross bar, the pusher assembly will be squeezed so that the solder paste stored inside is pushed into the solder paste coating mechanism, and at the same time, during the movement of the cross bar, the solder paste coating mechanism will roll along the surface of the substrate, and the squeezed solder paste enters the solder paste coating mechanism, and the rolling solder paste coating mechanism evenly coats the solder paste on the surface of the substrate, so that the substrate is automatically coated with solder paste after the package is removed, thereby improving welding and production efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of substrates, in particular to a ceramic substrate which is convenient for welding. Background Art

[0002] Ceramic substrate for IGBT refers to a ceramic material substrate designed specifically for insulated gate bipolar transistor (IGBT) modules. This substrate is mainly used to support IGBT chips and provide good heat dissipation performance. It usually has the following characteristics: high thermal conductivity, the ceramic substrate can effectively conduct the heat generated from the IGBT, help reduce the device temperature, and improve efficiency and reliability; electrical insulation, the ceramic material has good electrical insulation properties and can work safely under high voltage conditions; high temperature stability, the ceramic substrate can withstand high temperatures and rapid temperature changes, and is suitable for use in harsh environments.

[0003] For example, the Chinese patent with the announcement number CN114192915A discloses an IGBT welding process method, which includes the following steps: high-temperature solder paste printing → IGBT, FRD patch → primary high-temperature welding → copper substrate printing → low-temperature solder paste printing → DBC, base plate assembly → secondary low-temperature welding. In the present invention, the secondary welding uses SnPbAg low-temperature solder paste. After reaching its melting point, the solder on the first reflow surface will not melt for the second time, and the void will not deteriorate.

[0004] The above patent mentions that a layer of low-temperature solder paste is printed on the upper surface of a metal substrate, and the DBC ceramic copper-clad plate after high-temperature welding and the metal substrate coated with low-temperature solder paste are assembled with a positioning fixture to obtain a semi-finished product. Finally, the assembled semi-finished product is placed in a vacuum welding furnace for secondary low-temperature welding to obtain a finished product. However, the above solution has the following shortcomings: in the actual production process, it is necessary to add special equipment for coating solder paste to the production line, and the solder paste is coated on the surface of the substrate through the screen and scraper in the equipment, which makes the process of welding the substrate with other components longer and the welding efficiency lower. For this reason, we have introduced a ceramic substrate that is easy to weld. Summary of the invention

[0005] The object of the present invention is to provide a ceramic substrate that is convenient for welding, so as to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A ceramic substrate convenient for welding comprises a substrate, wherein a protective mechanism is arranged on the outer side of the substrate, and the outer sides and the upper end of the substrate are protected by the protective mechanism; a cross bar is arranged on the upper side of the substrate, and the cross bar is connected to the protective mechanism; two pusher assemblies are arranged in the upper end of the protective mechanism, and the pusher assemblies are connected to a solder paste coating mechanism; when the pusher assemblies move along the upper surface of the substrate through the cross bar, the solder paste stored inside the pusher assemblies is pushed into the solder paste coating mechanism, and the solder paste is coated on the surface of the substrate by the solder paste coating mechanism.

[0008] Preferably, the protective mechanism includes a first limit plate, a second limit plate and two protective plates, the two protective plates are arranged on both sides of the base plate, the two ends of the cross bar are fixedly connected to the two protective plates, one end of the base plate is provided with a first limit plate, the two ends of the first limit plate are inserted into the limit holes, the limit holes are opened in the protective plate, the end of the base plate away from the first limit plate is provided with a second limit plate, two first plug holes are opened on the outer side of the second limit plate, and the end of the protective plate away from the first limit plate passes through the first plug holes.

[0009] Preferably, a plug plate is provided on the side of the second limit plate away from the base plate, both ends of the plug plate are plugged into the second plug holes, the second plug holes are provided in the protective plate, a first sealing groove is provided on the outer side of the base plate, the protective plate, the first limit plate and the second limit plate are fixedly connected with a first sealing rubber strip on the side close to the base plate, the first sealing rubber strip is plugged into the first sealing groove, the first limit plate is fixedly connected with a second sealing rubber strip on the side close to the base plate, the second sealing rubber strip is plugged into the second sealing groove, and the second sealing groove is provided in the cross bar

[0010] Preferably, a protective film is provided on the upper end of the substrate, and the two sides of the protective film are fixedly connected to the two protective plates. One end of the protective film is fixedly connected to the cross bar, and the other end is fixedly connected to the adhesive strip, and the adhesive strip is bonded to the second limiting plate.

[0011] Preferably, the pushing assembly includes a T-shaped slide groove, which is opened in the upper end of the protective plate, a push plate is slidably connected in the T-shaped slide groove, the upper end of the push plate extends out of the T-shaped slide groove, a storage bag is slidably connected in the T-shaped slide groove, solder paste is stored in the storage bag, and a plurality of conical rods are fixedly connected to one end of the T-shaped slide groove away from the push plate. The T-shaped slide groove is connected to the solder paste coating mechanism through a material guide cavity, and the material guide cavity is opened in the protective plate.

[0012] Preferably, the solder paste coating mechanism includes a rotating drum, which has a cavity inside. The rotating drum is movably connected to a make way cavity, and the make way cavity is opened in the lower end of the cross bar. The lower end of the rotating drum contacts the upper end of the substrate, and a plurality of discharge holes are opened on the outer side of the rotating drum, and the plurality of discharge holes are arranged at equal intervals.

[0013] Preferably, a material guide pipe is movably connected inside the rotating drum, both ends of the material guide pipe extend out of the rotating drum and are fixedly connected to the cross bar, a connecting plate is fixedly connected to the lower end of the rotating drum, the lower end of the connecting plate is in contact with the inner side of the rotating drum, a connecting cavity is provided in the connecting plate, the connecting cavity is connected with the inner side of the rotating drum, and the material guide cavity is connected to the material guide pipe at one end away from the T-shaped slide groove.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: the outer sides and the upper end of the substrate are protected by the protective mechanism to prevent the substrate from being damaged due to the external environment during transportation; when the cross bar is pushed to move along the upper surface of the substrate, during the movement of the cross bar, the pushing assembly will be squeezed so that the solder paste stored inside is pushed into the solder paste coating mechanism; at the same time, during the movement of the cross bar, the solder paste coating mechanism will roll along the surface of the substrate, and the squeezed solder paste will enter the solder paste coating mechanism; the rolling solder paste coating mechanism will evenly coat the surface of the substrate with the solder paste, so that the substrate is automatically coated with solder paste after the packaging is removed, thereby improving welding and production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0016] Figure 2 It is a schematic diagram of the structure of the present invention in a three-dimensional decomposed state;

[0017] Figure 3 It is a three-dimensional structural schematic diagram of the connection relationship between the T-shaped slideway and the storage bag of the present invention;

[0018] Figure 4 It is a schematic diagram of a three-dimensional cross-sectional structure of the present invention;

[0019] Figure 5 It is a three-dimensional cross-sectional structural schematic diagram of the connection relationship between the protective film and the adhesive strip of the present invention;

[0020] Figure 6 It is a three-dimensional structural schematic diagram of the connection relationship between the protective plate and the cross bar of the present invention;

[0021] Figure 7 It is a schematic diagram of the three-dimensional cross-sectional structure of the rotating drum of the present invention.

[0022] In the figure: 1, base plate; 2, first sealing groove; 3, second sealing rubber strip; 4, first limiting plate; 5, limiting hole; 6, cone rod; 7, material guide cavity; 8, second sealing groove; 9, connecting cavity; 10, rotating drum; 11, protective plate; 12, T-shaped slide groove; 13, push plate; 14, second limiting plate; 15, plug plate; 16, adhesive strip; 17, first plug hole; 18, second plug hole; 19, first sealing rubber strip; 20, storage bag; 21, protective film; 22, material guide pipe; 23, connecting plate; 24, discharge hole; 25, cross bar; 26, give way cavity. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] See also Figure 1-7 , the present invention provides a technical solution:

[0025] Embodiment 1:

[0026] A ceramic substrate that is easy to weld, such as Figure 1 , Figure 2 As shown, it includes a substrate 1, and a protective mechanism is provided on the outside of the substrate 1. The protective mechanism is used to protect the outer sides and the upper end of the substrate 1 to prevent the substrate 1 from being damaged due to the external environment during transportation. A cross bar 25 is provided on the upper side of the substrate 1, and the cross bar 25 is connected to the protective mechanism. Two pushing assemblies are provided in the upper end of the protective mechanism, and the pushing assemblies are connected to the solder paste coating mechanism. When the cross bar 25 is pushed to move along the upper surface of the substrate 1, during the movement of the cross bar 25, the pushing assembly will be squeezed so that the solder paste stored inside is pushed into the solder paste coating mechanism. At the same time, during the movement of the cross bar 25, the solder paste coating mechanism will roll along the surface of the substrate 1, and the squeezed solder paste will enter the solder paste coating mechanism. The rolling solder paste coating mechanism will evenly coat the solder paste on the surface of the substrate 1, and the substrate 1 coated with solder paste is sent to the production line, and assembled with the DBC ceramic copper clad laminate with a positioning fixture, and sent to the vacuum welding furnace for secondary low-temperature welding.

[0027] Embodiment 2:

[0028] On the basis of Example 1, in order to prevent the substrate 1 from being damaged due to the external environment during transportation, the protective mechanism includes a first limiting plate 4, a second limiting plate 14 and two protective plates 11. The two protective plates 11 are arranged on both sides of the substrate 1, and the two ends of the cross bar 25 are fixedly connected to the two protective plates 11. The lower end of the cross bar 25 does not contact the upper end of the substrate 1. A first limiting plate 4 is arranged at one end of the substrate 1. The two ends of the first limiting plate 4 are inserted into the limiting hole 5. The limiting hole 5 is opened in the protective plate 11. A second limiting plate 14 is arranged at the end of the substrate 1 away from the first limiting plate 4. Two limiting plates are opened on the outer side of the second limiting plate 14. The first plug hole 17, the end of the protective plate 11 away from the first limiting plate 4 passes through the first plug hole 17, after the substrate 1 is produced, the first sealing rubber strip 19 connected to the inner sides of the two protective plates 11 is inserted into the first sealing groove 2, and the protective plate 11 is pushed so that the first sealing rubber strip 19 moves along the first sealing groove 2. When the cross bar 25 moves to the upper side of the substrate 1, the pushing of the protective plate 11 is stopped, and the first limiting plate 4 is plugged into the two limiting holes 5. During the plugging process, the first sealing rubber strip 19 connected to one side of the first limiting plate 4 moves along the first sealing groove 2, and the second sealing rubber strip 3 moves along the second sealing groove 8;

[0029] like Figure 2 , Figure 4 As shown, a plug plate 15 is provided on the side of the second limiting plate 14 away from the substrate 1, and both ends of the plug plate 15 are plugged into the second plug hole 18, and the second plug hole 18 is opened in the protective plate 11. A first sealing groove 2 is opened on the outer side of the substrate 1, and the protective plate 11, the first limiting plate 4 and the second limiting plate 14 are fixedly connected with a first sealing rubber strip 19 on the side close to the substrate 1, and the first sealing rubber strip 19 is plugged into the first sealing groove 2. The first limiting plate 4 is fixedly connected with a second sealing rubber strip 3 on the side close to the substrate 1, and the second sealing rubber strip 3 is plugged into the second sealing groove 8, and the second sealing groove 8 is opened in the cross bar 25. One end of the two protective plates 11 is passed through the first plug hole 17, so that the first sealing rubber strip 19 connected to one side of the second limiting plate 14 is plugged into the first sealing groove 2, and the plug plate 15 is plugged into the two second plug holes 18, so that the second limiting plate 14 will not detach from the outside of the two protective plates 11;

[0030] like Figure 5As shown, a protective film 21 is provided on the upper end of the substrate 1, and the two sides of the protective film 21 are fixedly connected to the two protective plates 11, one end of the protective film 21 is fixedly connected to the cross bar 25, and the other end is fixedly connected to the adhesive strip 16, and the adhesive strip 16 is bonded to the second limiting plate 14. The adhesive strip 16 and the second limiting plate 14 can be bonded, and the four sides of the substrate 1 are protected by the first limiting plate 4, the second limiting plate 14 and the two protective plates 11, and the upper end welding surface of the substrate 1 is protected by the protective film 21 to prevent the substrate 1 from being damaged due to the external environment during transportation. At the same time, during the movement of the cross bar 25, the protective film 21 will be damaged;

[0031] like Figure 3 As shown, the push assembly includes a T-shaped slide 12, the T-shaped slide 12 is opened in the upper end of the protective plate 11, a push plate 13 is slidably connected in the T-shaped slide 12, the upper end of the push plate 13 extends out of the T-shaped slide 12, a storage bag 20 is slidably connected in the T-shaped slide 12, and solder paste is stored in the storage bag 20. The end of the T-shaped slide 12 away from the push plate 13 is fixedly connected to a plurality of cone rods 6, and the T-shaped slide 12 is connected to the solder paste coating mechanism through a material guide cavity 7, and the material guide cavity 7 is opened in the protective plate 11. After the insert plate 15 and the first limit plate 4 are removed from the board 11, the second limit plate 14 is pressed and the cross bar 25 is pushed to start moving along the surface of the substrate 1. During the movement, the push plate 13 is pushed by the second limit plate 14 to start moving. The movement of the push plate 13 drives the storage bag 20 to move. When the storage bag 20 contacts the cone rod 6, the storage bag 20 will be punctured, and the solder paste stored in the storage bag 20 will enter the guide tube 22 through the guide cavity 7.

[0032] like Figure 4 As shown, the solder paste coating mechanism includes a rotating drum 10, which is provided with a cavity. The rotating drum 10 is movably connected to a make way cavity 26, which is provided in the lower end of a cross bar 25. The lower end of the rotating drum 10 contacts the upper end of a substrate 1, and a plurality of discharge holes 24 are provided on the outer side of the rotating drum 10. The plurality of discharge holes 24 are provided at equal intervals. A material guide tube 22 is movably connected to the rotating drum 10, and both ends of the material guide tube 22 extend out of the rotating drum 10 and are fixedly connected to the cross bar 25. A connecting plate 23 is fixedly connected to the lower end of the rotating drum 10, and the lower end of the connecting plate 23 contacts the inner side of the rotating drum 10. A connecting cavity 9 is provided in the connecting plate 23, and the connecting cavity 9 is communicated with the inner side of the rotating drum 10. The end of the material guide cavity 7 away from the T-shaped slide groove 12 is communicated with the material guide tube 22.

[0033] Working principle: when in use, after the production of the substrate 1 is completed, the first sealing rubber strip 19 connected to the inner sides of the two protective plates 11 is inserted into the first sealing groove 2, and the protective plate 11 is pushed so that the first sealing rubber strip 19 moves along the first sealing groove 2. When the cross bar 25 moves to the upper side of the substrate 1, the pushing of the protective plate 11 is stopped, and the first limiting plate 4 is plugged into the two limiting holes 5. During the plugging process, the first sealing rubber strip 19 connected to one side of the first limiting plate 4 moves along the first sealing groove 2, and the second sealing rubber strip 3 moves along the second sealing groove 8.

[0034] Pass one end of the two protective plates 11 through the first plug hole 17, so that the first sealing rubber strip 19 connected to one side of the second limiting plate 14 is inserted into the first sealing groove 2, and the plug plate 15 is inserted into the two second plug holes 18, so that the second limiting plate 14 will not be separated from the outside of the two protective plates 11, and the adhesive strip 16 is bonded to the second limiting plate 14. The first limiting plate 4, the second limiting plate 14 and the two protective plates 11 are used to protect the surroundings of the substrate 1, and the protective film 21 is used to protect the upper welding surface of the substrate 1 to prevent the substrate 1 from being damaged due to the external environment during transportation;

[0035] After removing the insert plate 15 and the first limiting plate 4, press the second limiting plate 14 and push the cross bar 25 to start moving along the surface of the substrate 1. During the movement, the push plate 13 will be pushed by the second limiting plate 14 to start moving. The movement of the push plate 13 drives the storage bag 20 to move. When the storage bag 20 contacts the cone rod 6, the storage bag 20 will be punctured, and the solder paste stored in the storage bag 20 will enter the guide tube 22 through the guide cavity 7. The solder paste entering the guide tube 22 will enter the connecting cavity 9. The solder paste entering the connecting cavity 9 is discharged to the surface of the substrate 1 through a plurality of discharge holes 24.

[0036] When the cross bar 25 is pushed to move, the rotating drum 10 will move along the surface of the substrate 1. Since a number of discharge holes 24 are opened on the outside of the rotating drum 10, and the discharge port of the connecting cavity 9 is always downward when the rotating drum 10 rotates, the solder paste will be evenly coated on the surface of the substrate 1 through the number of discharge holes 24 under the continuous push of the push plate 13. After the solder paste coating is completed, the protective plate 11 and the second limiting plate 14 can be removed from the surface of the substrate 1, and the substrate 1 coated with solder paste, the DBC ceramic copper clad plate and the substrate 1 coated with solder paste are assembled with a positioning fixture and sent into a vacuum welding furnace for secondary low-temperature welding.

[0037] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A ceramic substrate convenient for welding, comprising a substrate, characterized in that: A protective mechanism is provided on the outside of the substrate, and the outer sides and the upper end of the substrate are protected by the protective mechanism. A cross bar is provided on the upper side of the substrate, and the cross bar is connected to the protective mechanism. Two pushing assemblies are provided in the upper end of the protective mechanism, and the pushing assemblies are connected to the solder paste coating mechanism. When the pushing assemblies move along the upper surface of the substrate through the cross bar, the solder paste stored inside the pushing assemblies is pushed into the solder paste coating mechanism, and the solder paste is coated on the surface of the substrate through the solder paste coating mechanism.

2. A ceramic substrate convenient for welding according to claim 1, characterized in that: The protective mechanism includes a first limit plate, a second limit plate and two protective plates, the two protective plates are arranged on both sides of the base plate, the two ends of the cross bar are fixedly connected to the two protective plates, one end of the base plate is provided with a first limit plate, the two ends of the first limit plate are inserted into the limit holes, the limit holes are opened in the protective plate, the end of the base plate away from the first limit plate is provided with a second limit plate, the outer side of the second limit plate is provided with two first plugging holes, and the end of the protective plate away from the first limit plate passes through the first plugging holes.

3. A ceramic substrate convenient for welding according to claim 2, characterized in that: A plug plate is provided on the side of the second limiting plate away from the base plate, and both ends of the plug plate are plugged into the second plug hole. The second plug hole is opened in the protective plate, and a first sealing groove is opened on the outer side of the base plate. The protective plate, the first limiting plate and the second limiting plate are fixedly connected with a first sealing rubber strip on the side close to the base plate, and the first sealing rubber strip is plugged into the first sealing groove. The first limiting plate is fixedly connected with a second sealing rubber strip on the side close to the base plate, and the second sealing rubber strip is plugged into the second sealing groove. The second sealing groove is opened in the cross bar.

4. A ceramic substrate convenient for welding according to claim 3, characterized in that: A protective film is provided on the upper end of the base plate, and the two sides of the protective film are fixedly connected to the two protective plates. One end of the protective film is fixedly connected to the cross bar, and the other end is fixedly connected to the adhesive strip, and the adhesive strip is bonded to the second limiting plate.

5. The ceramic substrate convenient for welding according to claim 2, characterized in that: The pushing assembly includes a T-shaped slide groove, which is opened in the upper end of the protective plate, a push plate is slidably connected in the T-shaped slide groove, and the upper end of the push plate extends out of the T-shaped slide groove, a storage bag is slidably connected in the T-shaped slide groove, and solder paste is stored in the storage bag. A plurality of cone rods are fixedly connected to one end of the T-shaped slide groove away from the push plate, and the T-shaped slide groove is connected to the solder paste coating mechanism through a material guide cavity, and the material guide cavity is opened in the protective plate.

6. The ceramic substrate convenient for welding according to claim 5, characterized in that: The solder paste coating mechanism includes a rotating drum, a cavity is set inside the rotating drum, the rotating drum is movably connected to the give-way cavity, the give-way cavity is opened in the lower end of the cross bar, the lower end of the rotating drum contacts the upper end of the substrate, and a plurality of discharge holes are opened on the outer side of the rotating drum, and the plurality of discharge holes are arranged at equal intervals.

7. The ceramic substrate convenient for welding according to claim 6, characterized in that: A material guide pipe is movably connected inside the rotating drum, and both ends of the material guide pipe extend out of the rotating drum and are fixedly connected to the cross bar. A connecting plate is fixedly connected to the lower end of the rotating drum, and the lower end of the connecting plate contacts the inner side of the rotating drum. A connecting cavity is opened in the connecting plate, and the connecting cavity is connected to the inner side of the rotating drum. The end of the material guide cavity away from the T-shaped slide groove is connected to the material guide pipe.

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