Bonding device, bonding method and storage medium

Abstract

The invention provides a bonding device and method and a storage medium. The wafer sucking disc is used for sucking a wafer to be bonded. The bonding head is at least used for bonding the to-be-bonded piece to the wafer according to the bonding parameters. And the detection head is used for detecting the pose of the to-be-bonded piece on the wafer after the bonding head completes bonding and leaves the corresponding bonding position so as to determine the bonding error of the to-be-bonded piece. The controller is configured to control the bonding head and bond the wafer and the first to-be-bonded piece according to the current bonding parameter; in response to completion of bonding of the first to-be-bonded piece, the bonding head is controlled to leave the current first bonding position so as to move to a second bonding position of a subsequent second to-be-bonded piece, and the detection head is controlled to move to the first bonding position so as to determine a first bonding error of the first to-be-bonded piece; according to the first bonding error, bonding parameters are adjusted online and fed back to the bonding head in real time; and controlling the bonding head, and bonding the wafer and the second to-be-bonded piece according to the bonding parameters after online adjustment.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor device processing, and in particular to a bonding device, a bonding method, and a computer-readable storage medium. Background Art

[0002] Since the price of the parts to be bonded used in the wafer bonding process is very expensive, semiconductor processing equipment is often equipped with high-precision, high-yield bonding equipment for wafer bonding. However, in traditional bonding equipment, a measurement mechanism is often integrated to improve accuracy and yield. However, since the integrated measurement mechanism has problems such as low accuracy and slow measurement speed, and the subsequent wafer bonding can only be performed after the measurement is completed, it will affect the yield and production capacity of the bonded product. In addition, in some bonding equipment, an offline detection machine is configured externally to improve the bonding accuracy. However, the offline detection machine can only perform batch testing on a batch of bonded wafers, and there is a problem that the bonding error cannot be corrected in time. When problems occur in the batch of bonded wafers, huge losses will be caused.

[0003] In order to overcome the above-mentioned defects in the prior art, there is an urgent need in the art for an improved bonding device for improving the yield and production capacity of the bonded products while ensuring the bonding accuracy of the wafer bonding process. Summary of the invention

[0004] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0005] In order to overcome the above-mentioned defects in the prior art, the present invention provides a bonding device, a bonding method and a computer-readable storage medium. A movable and independent bonding head and a detection head can be set, and the detection head can be used to detect the bonding deviation of the bonding sample after bonding, and the bonding parameters of the bonding head can be adjusted online according to the bonding deviation, so as to improve the yield and production capacity of the product after bonding while ensuring the bonding accuracy of the wafer bonding process.

[0006] Specifically, the bonding device provided according to the first aspect of the present invention includes a wafer suction cup, a bonding head, a detection head and a controller. The wafer suction cup is used to absorb the wafer to be bonded. The bonding head is at least used to bond the part to be bonded to the wafer according to the bonding parameters. The detection head is used to detect the posture of the part to be bonded on the wafer after the bonding head completes the bonding and leaves the corresponding bonding position, so as to determine the bonding error of the part to be bonded. The controller is configured to: control the bonding head to bond the wafer to a first component to be bonded according to current bonding parameters; in response to completion of bonding of the first component to be bonded, control the bonding head to leave the current first bonding position to move to a second bonding position of a second component to be bonded, and control the detection head to move to the first bonding position to determine a first bonding error of the first component to be bonded; adjust the bonding parameters online according to the first bonding error, and feed them back to the bonding head in real time; and control the bonding head to bond the wafer to the second component to be bonded according to the bonding parameters adjusted online.

[0007] Furthermore, in some embodiments of the present invention, the step of controlling the bonding head to leave the current first bonding position to move to the second bonding position of the second component to be bonded includes: while the detection head moves to the first bonding position and / or detects the posture of the first component to be bonded on the wafer, controlling the bonding head to move to a preset wafer pickup station to obtain the second component to be bonded; and before controlling the bonding head to move to the second bonding position, controlling the detection head to move to a preset waiting station to vacate the second bonding position and / or the bonding path for the bonding head to move to the second bonding position.

[0008] Further, in some embodiments of the present invention, the bonding device also includes a first displacement mechanism, a second displacement mechanism and a third displacement mechanism. The first displacement mechanism is arranged on the machine table of the bonding device, and is used to drive the second displacement mechanism and / or the third displacement mechanism to translate along a preset first direction. The first end of the second displacement mechanism is connected to the first driving end of the first displacement mechanism, and the second end thereof is connected to the bonding head, so as to drive the bonding head to translate along a preset second direction and / or a third direction. The first end of the third displacement mechanism is connected to the second driving end of the first displacement mechanism, and the second end thereof is connected to the detection head, so as to drive the detection head to translate along the second direction and / or the third direction. The first direction and the second direction are located in a transverse plane and are perpendicular to each other. The third direction extends longitudinally.

[0009] Furthermore, in some embodiments of the present invention, the detection head is a C-shaped structure. The C-shaped structure is arranged along the third longitudinal direction, and a light source is provided at one end thereof to provide detection light to the bonding position where the to-be-bonded component is located, and a camera is provided at the other end thereof to collect the detection light penetrating the to-be-bonded component, the wafer and the wafer chuck to generate a detection image indicating the bonding error.

[0010] Further, in some embodiments of the present invention, the wafer is a silicon-based wafer, the light source is an infrared light source, the camera is an infrared camera, and the wafer suction cup is a transparent suction cup.

[0011] Furthermore, in some embodiments of the present invention, the component to be bonded is a chip, on which at least one mark indicating its posture is provided. The step of determining the first bonding error of the first component to be bonded includes: in response to the detection head arriving at the first bonding position, collecting a corresponding detection image via the camera; parsing the detection image to determine the position and / or deflection angle of at least one mark, and determining the first actual posture of the first component to be bonded on the wafer accordingly; and obtaining the first target posture of the first component to be bonded on the wafer, and determining the first bonding error of the first component to be bonded based on the difference between the first target posture and the first actual posture.

[0012] Furthermore, in some embodiments of the present invention, the step of adjusting the bonding parameters online according to the first bonding error includes: obtaining a second target posture of the second part to be bonded on the wafer, and determining a first adjustment amount for the bonding parameters based on the difference between the second target posture and the first target posture; compensating the first adjustment amount according to the first bonding error to obtain a second adjustment amount for the bonding parameters; and adjusting the current bonding parameters online according to the second adjustment amount to determine the bonding parameters after online adjustment.

[0013] Furthermore, in some embodiments of the present invention, the bonding device comprises a plurality of bonding heads, and each bonding head performs bonding on each of the parts to be bonded synchronously or alternately.

[0014] Further, in some embodiments of the present invention, the bonding device includes two bonding heads. The first bonding head bonds the chip from one side of the wafer to the middle of the wafer. The second bonding head bonds the chip from the middle of the wafer to the other side of the wafer.

[0015] In addition, the above-mentioned bonding method provided according to the second aspect of the present invention includes the following steps: controlling the bonding head to bond the wafer to the first part to be bonded according to the current bonding parameters; in response to completing the bonding of the first part to be bonded, controlling the bonding head to leave the current first bonding position to move to the second bonding position of the second part to be bonded, and controlling the detection head to move to the first bonding position to determine the first bonding error of the first part to be bonded; adjusting the bonding parameters online according to the first bonding error, and feeding it back to the bonding head in real time; and controlling the bonding head to bond the wafer to the second part to be bonded according to the bonding parameters adjusted online.

[0016] In addition, the computer-readable storage medium provided in the third aspect of the present invention stores computer instructions, which, when executed by a processor, implement the bonding method provided in the second aspect of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0018] Figure 1 A schematic structural diagram of a bonding device provided according to some embodiments of the present invention is shown.

[0019] Figure 2 A schematic structural diagram of a second displacement mechanism provided according to some embodiments of the present invention is shown.

[0020] Figure 3 A schematic structural diagram of a third displacement mechanism provided according to some embodiments of the present invention is shown.

[0021] Figure 4 A schematic diagram showing a bonding sequence provided according to some embodiments of the present invention is shown.

[0022] Figure 5 A schematic flow chart of a bonding method provided according to some embodiments of the present invention is shown.

[0023] Reference numerals:

[0024] 101 Wafer Suction Cup

[0025] 102 Bonding head

[0026] 1021 First Bonding Head

[0027] 1022 Second Bonding Head

[0028] 103 Detection head

[0029] 1031 Light Source

[0030] 1032 Camera

[0031] 104 Wafer

[0032] 105 Parts to be bonded

[0033] 106 First displacement mechanism

[0034] 107 Second displacement mechanism

[0035] 108 Third displacement mechanism DETAILED DESCRIPTION

[0036] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0037] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0039] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0040] As mentioned above, in traditional bonding equipment, measurement mechanisms are often integrated to improve accuracy and yield. However, since the integrated measurement mechanism has problems such as low accuracy and slow measurement speed, and the next wafer bonding can only be performed after the measurement is completed, it will affect the yield and production capacity of the product after bonding. In addition, in some bonding equipment, an offline inspection machine is configured externally to improve the bonding accuracy. However, the offline inspection machine can only perform batch testing on a batch of bonded wafers, and there is a problem that the bonding error cannot be corrected in time. When problems occur in the batch of bonded wafers, huge losses will be caused.

[0041] In order to overcome the above-mentioned defects in the prior art, the present invention provides a bonding device, a bonding method and a computer-readable storage medium. A movable and independent bonding head and a detection head can be set, and the detection head can be used to detect the bonding deviation of the bonding sample after bonding, and the bonding parameters of the bonding head can be adjusted online according to the bonding deviation, so as to improve the yield and production capacity of the product after bonding while ensuring the bonding accuracy of the wafer bonding process.

[0042] Please refer to the reference for details Figure 1 to Figure 3 . Figure 1 A schematic structural diagram of a bonding device provided according to some embodiments of the present invention is shown. Figure 2 A schematic structural diagram of a second displacement mechanism provided according to some embodiments of the present invention is shown. Figure 3 A schematic structural diagram of a third displacement mechanism provided according to some embodiments of the present invention is shown.

[0043] exist Figure 1 In the illustrated embodiment, the bonding device provided by the first aspect of the present invention includes a wafer suction cup 101, a bonding head 102, a detection head 103 and a controller. Here, the wafer suction cup 101 is used to absorb the wafer 104 to be bonded. The bonding head 102 is at least used to bond the component 105 to be bonded to the wafer 104 according to the bonding parameters. The detection head 103 is used to detect the posture of the component 105 to be bonded on the wafer 104 after the bonding head 102 completes the bonding and leaves the corresponding bonding position, so as to determine the bonding error of the component 105 to be bonded.

[0044] In addition, Figure 1 to Figure 3In the illustrated embodiment, the bonding device provided by the first aspect of the present invention preferably further includes a first displacement mechanism 106 , a second displacement mechanism 107 and a third displacement mechanism 108 .

[0045] Specifically, in Figure 1 In the illustrated embodiment, the first displacement mechanism 106 is disposed on the machine platform of the bonding device, and is used to drive the second displacement mechanism 107 and / or the third displacement mechanism 108 to perform translation along a preset first direction. Here, the first direction is the Y direction, and the first displacement mechanism 106 is used to adjust the bonding position of the bonding head 102 and the detection position of the detection head 103 in the Y direction.

[0046] exist Figure 2 In the illustrated embodiment, the first end of the second displacement mechanism 107 is connected to the first driving end of the first displacement mechanism 106, and the second end thereof is connected to the bonding head 102 to drive the bonding head 102 to translate along a preset second direction and / or a third direction. Here, the second direction is the X direction, and the second displacement mechanism 107 is used to adjust the bonding position of the bonding head 102 in the X direction. The third direction is the Z direction, and the second displacement mechanism 107 is used to adjust the bonding head 102 in the Z direction to perform a bonding operation.

[0047] Similarly, in Figure 3 In the illustrated embodiment, the first end of the third displacement mechanism 108 is connected to the second driving end of the first displacement mechanism 106, and the second end thereof is connected to the detection head 103, so as to drive the detection head 103 to perform translation along the second direction and / or the third direction. Here, the second direction is the X direction, and the third displacement mechanism 108 is used to adjust the detection position of the detection head 103 in the X direction. The third direction is the Z direction, and the third displacement mechanism 108 is used to adjust the detection head 103 in the Z direction to perform detection focus.

[0048] Further, in some embodiments, the first direction and the second direction are located in a transverse plane and are perpendicular to each other, and the third direction extends in the longitudinal direction.

[0049] In addition, Figure 3 In the embodiment shown, the detection head 103 is a C-shaped structure. Here, the C-shaped structure is arranged along the third longitudinal direction, and a light source 1031 is provided at one end thereof to provide detection light to the bonding position where the to-be-bonded component is located, and a camera 1032 is provided at the other end thereof to collect detection light penetrating the to-be-bonded component 105, the wafer 104 and the wafer chuck 101 to generate a detection image indicating a bonding error.

[0050] Further, in some optional embodiments, the wafer 104 is a silicon-based wafer, the light source 1031 is an infrared light source, the camera 1032 is an infrared camera, and the wafer chuck 101 is a transparent chuck. Here, the wafer chuck 101 is made of quartz or acrylic board.

[0051] In addition, in some optional embodiments, the to-be-bonded part 105 is a chip, on which at least one mark indicating its position is provided.

[0052] Please refer to the following for further reference Figure 1 and Figure 4 . Figure 4 A schematic diagram showing a bonding sequence provided according to some embodiments of the present invention is shown.

[0053] In addition, Figure 1 In the illustrated embodiment, the bonding device provided in the first aspect of the present invention comprises a plurality of bonding heads 102. Here, each bonding head 102 performs bonding of each to-be-bonded component 105 synchronously or alternately.

[0054] Specifically, in an embodiment where each bonding head 102 performs bonding of each to-be-bonded component 105 synchronously, the bonding device provided in the first aspect of the present invention may be correspondingly configured with a plurality of detection heads 103 to respectively detect bonding errors of the corresponding bonding heads 102 .

[0055] Alternatively, in an embodiment where each bonding head 102 alternately bonds each to-be-bonded component 105 , the bonding device provided in the first aspect of the present invention may be provided with a detection head 103 to detect the bonding errors of each bonding head 102 in sequence.

[0056] Furthermore, in some preferred embodiments, the bonding device includes two bonding heads, wherein the first bonding head 1021 bonds the chip from one side of the wafer 104 to the middle of the wafer 104 , and the second bonding head 1022 bonds the chip from the middle of the wafer 104 to the other side of the wafer 104 .

[0057] Specifically, if Figure 4 As shown, the first bonding head 1021 and the second bonding head 1022 can bond each chip synchronously according to the bonding sequence. In this way, the first bonding head 1021 and the second bonding head 1022 can be bonded synchronously based on this bonding sequence, which can prevent the two bonding heads from interfering with each other, so as to ensure that the synchronous work of the two bonding heads is not disturbed.

[0058] In some non-limiting embodiments, the bonding device provided in the first aspect of the present invention further includes a memory. Here, the memory includes but is not limited to the computer-readable storage medium provided in the third aspect, on which computer instructions are stored. When the computer instructions are executed by the controller, the bonding method provided in the second aspect of the present invention is implemented. The controller is connected to the memory and is configured to execute the computer instructions stored in the memory to implement the bonding method provided in the second aspect of the present invention.

[0059] The working principle of the above-mentioned bonding device will be described below in conjunction with some embodiments of the bonding method. Those skilled in the art will understand that these embodiments of the bonding method are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than limiting all functions or all working modes of the bonding device. Similarly, the bonding device is also only a non-limiting implementation method provided by the present invention, and does not constitute a limitation on the execution subject and execution order of each step in these bonding methods.

[0060] Please refer to Figure 5 . Figure 5 A schematic flow chart of a bonding method provided according to some embodiments of the present invention is shown.

[0061] like Figure 5 As shown, the controller may first control the bonding head 102 to bond the wafer 104 to the first object to be bonded according to the current bonding parameters.

[0062] Afterwards, in response to completing the bonding of the first component to be bonded, the controller can control the bonding head 102 to leave the current first bonding position to move to the second bonding position of the second component to be bonded, and control the detection head 103 to move to the first bonding position to determine the first bonding error of the first component to be bonded.

[0063] In addition, in an embodiment where a single bonding head is provided, the second bonding member after the above can be the next bonding member to be bonded. Alternatively, in an embodiment where a double bonding head is provided, the second bonding member after the above can be the next bonding member to be bonded, so as to further improve the bonding efficiency.

[0064] Thereafter, the controller may obtain a first target posture of the first component to be bonded on the wafer 104 , and determine a first bonding error of the first component to be bonded according to a difference between the first target posture and the first actual posture.

[0065] Specifically, in the process of determining the first bonding error of the first component to be bonded, in response to the detection head 103 arriving at the first bonding position, the controller can collect the corresponding detection image via the camera 1032. Afterwards, the controller can parse the detection image to determine the position and / or deflection angle of at least one mark, and determine the first actual position of the first component to be bonded on the wafer accordingly. Here, the above-mentioned mark can be a mark with a direction (for example: an arrow) or a plurality of marks without a direction (for example: dots).

[0066] Furthermore, in some preferred embodiments, while the detection head 103 moves to the first bonding position and / or detects the position of the first component to be bonded on the wafer 104, the controller can also control the bonding head 102 to move to a preset wafer pickup station to obtain the second component to be bonded, so as to further improve the bonding efficiency.

[0067] Furthermore, in some preferred embodiments, before controlling the bonding head 102 to move to the second bonding position, the controller can also control the detection head 103 to move to a preset waiting station to vacate the second bonding position, and / or the bonding path for the bonding head 102 to move to the second bonding position, so as to avoid conflict between the control of the bonding head 102 and the detection head 103.

[0068] Thereafter, the controller may adjust the bonding parameters online according to the first bonding error, and feed it back to the bonding head 102 in real time.

[0069] Specifically, the controller can obtain a second target posture of the second part to be bonded on the wafer, and determine a first adjustment amount for the bonding parameter based on the difference between the second target posture and the first target posture. Afterwards, the controller can compensate the first adjustment amount based on the first bonding error to obtain a second adjustment amount for the bonding parameter. Afterwards, the controller can adjust the current bonding parameter online based on the second adjustment amount to determine the bonding parameter after online adjustment.

[0070] Afterwards, the controller may control the bonding head 102 to bond the wafer 104 to the second object to be bonded according to the bonding parameters adjusted online.

[0071] In this way, the above-mentioned bonding equipment provided by the first aspect of the present invention can directly control and adjust the bonding parameters of the bonding head 102 online according to the first bonding error of the first bonding sample, and then bond the subsequent wafers according to the adjusted bonding parameters, thereby improving the efficiency of the wafer bonding process and avoiding losses caused by batch errors.

[0072] In summary, the above-mentioned bonding equipment, bonding method and computer-readable storage medium provided by the present invention can all be configured with a movable, independent bonding head and a detection head, and use the detection head to detect the bonding deviation of the bonding sample after bonding, and adjust the bonding parameters of the bonding head online according to the bonding deviation, so as to improve the yield and production capacity of the product after bonding while ensuring the bonding accuracy of the wafer bonding process.

[0073] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0074] Although the controller described in the above embodiments can be implemented by a combination of software and hardware. However, it is understood that the controller can also be implemented in software and hardware. For hardware implementation, the controller can be implemented in one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, other electronic devices for performing the above functions, or a selection combination of the above devices. For software implementation, the controller can be implemented by independent software modules such as procedures and functions running on a general-purpose chip, each of which performs one or more functions and operations described herein.

[0075] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information from / to the storage medium. In an alternative, a storage medium may be integrated into a processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside in a user terminal as discrete components.

[0076] In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented as a computer program product in software, each function may be stored on or transmitted by a computer-readable medium as one or more instructions or codes. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media may be any available medium that can be accessed by a computer. As an example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer. Any connection is also properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, a server, or other remote source using a coaxial cable, a fiber optic cable, a twisted pair, a digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. Disk and disc as used herein include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc, wherein disk often reproduces data magnetically, while disc reproduces data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0077] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A bonding device, characterized in that: include: Wafer suction cup, used to absorb the wafer to be bonded; A bonding head, at least used to bond the component to be bonded to the wafer according to bonding parameters; A detection head, used for detecting the posture of the component to be bonded on the wafer after the bonding head completes the bonding and leaves the corresponding bonding position, so as to determine the bonding error of the component to be bonded; as well as A controller is configured to: control the bonding head to bond the wafer to the first object to be bonded according to current bonding parameters; In response to completing the bonding of the first part to be bonded, the bonding head is controlled to leave the current first bonding position to move to the second bonding position of the second part to be bonded, and the detection head is controlled to move to the first bonding position to determine the first bonding error of the first part to be bonded; according to the first bonding error, the bonding parameters are adjusted online and fed back to the bonding head in real time; and the bonding head is controlled to bond the wafer to the second part to be bonded according to the bonding parameters adjusted online.

2. The bonding device according to claim 1, characterized in that The step of controlling the bonding head to leave the current first bonding position to go to the second bonding position of the second part to be bonded comprises: When the detection head moves to the first bonding position and / or detects the position of the first component to be bonded on the wafer, the bonding head is controlled to move to a preset wafer pickup station to obtain the second component to be bonded; and Before controlling the bonding head to go to the second bonding position, controlling the detection head to go to a preset waiting station to vacate the second bonding position and / or a bonding path for the bonding head to go to the second bonding position.

3. The bonding device according to claim 2, characterized in that Also includes: A first displacement mechanism, provided on the platform of the bonding device, for driving the second displacement mechanism and / or the third displacement mechanism to perform translation along a preset first direction; The second displacement mechanism has a first end connected to the first driving end of the first displacement mechanism, and a second end connected to the bonding head, so as to drive the bonding head to translate along a preset second direction and / or a third direction; as well as The third displacement mechanism has a first end connected to the second driving end of the first displacement mechanism, and a second end connected to the detection head, so as to drive the detection head to translate along the second direction and / or the third direction, wherein the first direction and the second direction are located in a transverse plane and are perpendicular to each other, and the third direction extends in the longitudinal direction.

4. The bonding device according to claim 1, characterized in that The detection head is a C-shaped structure, wherein the C-shaped structure is arranged along the third longitudinal direction, a light source is provided at one end thereof to provide detection light to the bonding position where the part to be bonded is located, and a camera is provided at the other end thereof for collecting the detection light penetrating the part to be bonded, the wafer and the wafer suction cup to generate a detection image indicating the bonding error.

5. The bonding device according to claim 4, characterized in that The wafer is a silicon-based wafer, the light source is an infrared light source, the camera is an infrared camera, and the wafer suction cup is a transparent suction cup.

6. The bonding device according to claim 4, characterized in that The component to be bonded is a chip, on which at least one mark indicating its position is provided, and the step of determining a first bonding error of the first component to be bonded includes: In response to the detection head arriving at the first bonding position, collecting a corresponding detection image via the camera; parsing the detection image to determine the position and / or deflection angle of at least one mark therein, and determining a first actual position and posture of the first component to be bonded on the wafer accordingly; and A first target posture of the first component to be bonded on the wafer is acquired, and a first bonding error of the first component to be bonded is determined according to a difference between the first target posture and the first actual posture.

7. The bonding device according to claim 6, characterized in that The step of adjusting the bonding parameters online according to the first bonding error comprises: Acquire a second target posture of the second to-be-bonded part on the wafer, and determine a first adjustment amount for the bonding parameter according to a difference between the second target posture and the first target posture; compensating the first adjustment amount according to the first bonding error to obtain a second adjustment amount for the bonding parameter; and The current bonding parameter is adjusted online according to the second adjustment amount to determine the online adjusted bonding parameter.

8. The bonding device according to claim 1, characterized in that The bonding equipment includes a plurality of bonding heads, wherein each bonding head performs bonding on each of the parts to be bonded synchronously or alternately.

9. The bonding device according to claim 8, characterized in that The bonding equipment includes two bonding heads, wherein the first bonding head bonds the chip from one side of the wafer to the middle of the wafer, and the second bonding head bonds the chip from the middle of the wafer to the other side of the wafer.

10. A bonding method, characterized in that: The following steps are involved: Controlling the bonding head to bond the wafer to the first object to be bonded according to current bonding parameters; In response to completing the bonding of the first component to be bonded, controlling the bonding head to leave the current first bonding position to go to a second bonding position of a second component to be bonded, and controlling the detection head to go to the first bonding position to determine a first bonding error of the first component to be bonded; According to the first bonding error, adjusting the bonding parameter online and feeding it back to the bonding head in real time; as well as The bonding head is controlled to bond the wafer to the second object to be bonded according to the bonding parameters adjusted online.

11. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the bonding method according to claim 10 is implemented.

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