Bonding device, bonding method and storage medium

Abstract

The invention provides bonding equipment, a bonding method and a storage medium. The bonding equipment comprises a bonding machine table, a detection machine table, a manipulator and a controller. And the bonding machine table is used for bonding the wafer and the to-be-bonded piece according to the bonding parameters. And the detection machine table is used for detecting the bonding deviation between the wafer and the to-be-bonded piece in the bonding sample. And the manipulator is at least used for transmitting the bonding sample to the detection machine table. The controller is configured to control the bonding machine table and carry out bonding of the first wafer and the first to-be-bonded piece according to the current bonding parameters so as to prepare a first bonding sample; in response to completion of the preparation of the first bonding sample, controlling the manipulator to transmit the first bonding sample to a detection machine table to determine a first bonding deviation of the first bonding sample; according to the first bonding deviation, bonding parameters are adjusted online and fed back to the bonding machine table in real time; and controlling the bonding machine, and preparing the second bonding sample according to the bonding parameters adjusted on line.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor device processing, and in particular to a bonding device, a bonding method, and a computer-readable storage medium. Background Art

[0002] Since the price of the parts to be bonded used in the wafer bonding process is very expensive, semiconductor processing equipment is often equipped with high-precision, high-yield bonding equipment for wafer bonding. However, in traditional bonding equipment, a measurement mechanism is often integrated to improve accuracy and yield. However, since the integrated measurement mechanism has problems such as low accuracy and slow measurement speed, and the subsequent wafer bonding can only be performed after the measurement is completed, it will affect the yield and production capacity of the bonded product. In addition, in some bonding equipment, an offline detection machine is configured externally to improve the bonding accuracy. However, the offline detection machine can only perform batch testing on a batch of bonded wafers, and there is a problem that the bonding error cannot be corrected in time. When problems occur in the batch of bonded wafers, huge losses will be caused.

[0003] In order to overcome the above-mentioned defects in the prior art, there is an urgent need in the art for an improved bonding device for improving the yield and production capacity of the bonded products while ensuring the bonding accuracy of the wafer bonding process. Summary of the invention

[0004] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0005] In order to overcome the above-mentioned defects of the prior art, the present invention provides a bonding device, a bonding method and a computer-readable storage medium. By configuring an independent detection machine in the bonding device, the bonding deviation of the bonding sample after bonding can be determined, and the bonding parameters of the bonding machine can be adjusted online according to the bonding deviation, so as to improve the yield and production capacity of the product after bonding while ensuring the bonding accuracy of the wafer bonding process.

[0006] Specifically, the bonding equipment provided according to the first aspect of the present invention includes a bonding machine, a detection machine, a manipulator and a controller. The bonding machine is used to bond a wafer to a part to be bonded according to bonding parameters to prepare a bonding sample. The detection machine is used to detect the bonding deviation between the wafer and the part to be bonded in the bonding sample. The manipulator is at least used to transfer the bonding sample to the detection machine. The controller is configured to: control the bonding machine to bond a first wafer to a first part to be bonded according to current bonding parameters to prepare a first bonding sample; in response to completing the preparation of the first bonding sample, control the manipulator to transfer the first bonding sample to the detection machine to determine its first bonding deviation; according to the first bonding deviation, adjust the bonding parameters online and feed them back to the bonding machine in real time; and control the bonding machine to prepare a subsequent second bonding sample according to the online adjusted bonding parameters.

[0007] Furthermore, in some embodiments of the present invention, the part to be bonded is a chip. The bonding machine includes a pick-up head and a bonding head. The manipulator is also used to pick up the wafer from a wafer box and transfer it to the bonding machine. The pick-up head is used to pick up the chip to be bonded and transfer it to the bonding head. The bonding head is used to bond the acquired chip to the wafer according to current bonding parameters. The controller is also configured to: in response to all target positions of the wafer being fully bonded with chips, determine that the preparation of the bonding sample is completed.

[0008] Furthermore, in some embodiments of the present invention, the controller is further configured to: while detecting the first bonding deviation of the first bonding sample and / or adjusting the bonding parameters online, control the manipulator to pick up a second wafer for preparing the second bonding sample from the wafer box. The second wafer is a wafer that is arranged one position after the first wafer in the bonding process.

[0009] Furthermore, in some embodiments of the present invention, the detection machine is configured to: capture an image of the bonded sample and identify the actual position of a mark of at least one chip therein; and determine the bonding deviation of the bonded sample based on the difference between the actual position of the mark of the at least one chip and its target position.

[0010] Furthermore, in some embodiments of the present invention, the detection machine is further configured to: identify the image of the bonded sample to determine the actual positions of the marks of all the chips therein; and perform full map detection analysis based on the difference between the actual position of the mark of each chip and its target position to comprehensively determine the bonding deviation of the bonded sample.

[0011] Furthermore, in some embodiments of the present invention, the detection machine is also configured to: determine the bonding accuracy of the corresponding chip according to the value of the bonding deviation; and classify each of the chips according to the bonding accuracy.

[0012] Furthermore, in some embodiments of the present invention, the bonding machine includes a plurality of bonding heads, and each bonding head performs bonding of each chip synchronously or alternately.

[0013] Furthermore, in some embodiments of the present invention, the bonding machine includes two bonding heads. The first bonding head bonds the chip from one side of the wafer to the middle of the wafer. The second bonding head bonds the chip from the middle of the wafer to the other side of the wafer.

[0014] In addition, the above-mentioned bonding method provided according to the second aspect of the present invention includes the following steps: controlling the bonding machine to bond the first wafer and the first to-be-bonded member according to the current bonding parameters to prepare a first bonding sample; in response to the completion of the preparation of the first bonding sample, transmitting the first bonding sample to the detection machine to determine its first bonding deviation; adjusting the bonding parameters online according to the first bonding deviation, and feeding it back to the bonding machine in real time; and controlling the bonding machine to prepare the second bonding sample according to the online adjusted bonding parameters.

[0015] In addition, the computer-readable storage medium provided in the third aspect of the present invention stores computer instructions, which, when executed by a controller, implement the bonding method provided in the second aspect of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0017] Figure 1 A schematic structural diagram of a bonding device provided according to some embodiments of the present invention is shown.

[0018] Figure 2 A schematic structural diagram of a bonding device provided according to some embodiments of the present invention is shown.

[0019] Figure 3 A schematic diagram showing a bonding sequence provided according to some embodiments of the present invention is shown.

[0020] Figure 4 A schematic flow chart of a bonding method provided according to some embodiments of the present invention is shown.

[0021] Reference numerals:

[0022] 101 Bonding Machine

[0023] 1011 Pickup Head

[0024] 1012 Bonding Head

[0025] 21 First Bonding Head

[0026] 22 Second bonding head

[0027] 102 Inspection Machine

[0028] 103 Robot

[0029] 104 Wafer

[0030] 105 Chip

[0031] 106 Wafer Box DETAILED DESCRIPTION

[0032] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0033] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0035] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0036] As mentioned above, in traditional bonding equipment, measurement mechanisms are often integrated to improve accuracy and yield. However, since the integrated measurement mechanism has problems such as low accuracy and slow measurement speed, and the next wafer bonding can only be performed after the measurement is completed, it will affect the yield and production capacity of the product after bonding. In addition, in some bonding equipment, an offline inspection machine is configured externally to improve the bonding accuracy. However, the offline inspection machine can only perform batch testing on a batch of bonded wafers, and there is a problem that the bonding error cannot be corrected in time. When problems occur in the batch of bonded wafers, huge losses will be caused.

[0037] In order to overcome the above-mentioned defects of the prior art, the present invention provides a bonding device, a bonding method and a computer-readable storage medium. By configuring an independent detection machine in the bonding device, the bonding deviation of the bonding sample after bonding can be determined, and the bonding parameters of the bonding machine can be adjusted online according to the bonding deviation, so as to improve the yield and production capacity of the product after bonding while ensuring the bonding accuracy of the wafer bonding process.

[0038] Please refer to Figure 1 . Figure 1 A schematic structural diagram of a bonding device provided according to some embodiments of the present invention is shown.

[0039] exist Figure 1 In the illustrated embodiment, the bonding device provided by the first aspect of the present invention includes a bonding machine 101, a detection machine 102, a manipulator 103 and a controller. Here, the bonding machine 101 is used to bond a wafer 104 to a part to be bonded according to bonding parameters to prepare a bonding sample. The detection machine 102 is used to detect the bonding deviation between the wafer 104 and the part to be bonded in the bonding sample. The manipulator 103 is at least used to transfer the bonding sample to the detection machine 102.

[0040] Further, in Figure 1In the embodiment shown, the above-mentioned part to be bonded is a chip 105, and the bonding machine 101 includes a pick-up head 1011 and a bonding head 1012. Here, the robot 103 is also used to pick up the wafer 104 from the wafer box 106 and transfer it to the bonding machine 101. The pick-up head 1011 is used to pick up the chip 105 to be bonded and transfer it to the bonding head 1012. The bonding head 1012 is used to bond the obtained chip 105 to the wafer 104 according to the current bonding parameters.

[0041] Please refer to Figure 2 and Figure 3 . Figure 2 A schematic structural diagram of a bonding device provided according to some embodiments of the present invention is shown. Figure 3 A schematic diagram showing a bonding sequence provided according to some embodiments of the present invention is shown.

[0042] exist Figure 2 In the illustrated embodiment, the bonding machine 101 provided in the first aspect of the present invention includes a plurality of bonding heads, wherein each bonding head performs bonding of each chip 105 synchronously or alternately.

[0043] Furthermore, in some preferred embodiments, the bonding machine 101 includes two bonding heads. Here, the first bonding head 21 bonds the chip 105 from one side of the wafer 104 to the middle of the wafer 104 , and the second bonding head 22 bonds the chip 105 from the middle of the wafer 104 to the other side of the wafer 104 .

[0044] Specifically, if Figure 2 and Figure 3 As shown, the first bonding head 21 and the second bonding head 22 can perform bonding of each chip 105 synchronously according to the bonding sequence. In this way, the first bonding head 21 and the second bonding head 22 are synchronously bonded based on this bonding sequence, which can prevent the two bonding heads from interfering with each other, so as to ensure that the synchronous work of the two bonding heads is not disturbed.

[0045] In some non-limiting embodiments, the bonding device provided in the first aspect of the present invention further includes a memory. Here, the memory includes but is not limited to the computer-readable storage medium provided in the third aspect, on which computer instructions are stored. When the computer instructions are executed by the controller, the bonding method provided in the second aspect of the present invention is implemented. The controller is connected to the memory and is configured to execute the computer instructions stored in the memory to implement the bonding method provided in the second aspect of the present invention.

[0046] The working principle of the above-mentioned bonding device will be described below in conjunction with some embodiments of the bonding method. Those skilled in the art will understand that these embodiments of the bonding method are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than limiting all functions or all working modes of the bonding device. Similarly, the bonding device is also only a non-limiting implementation method provided by the present invention, and does not constitute a limitation on the execution subject and execution order of each step in these bonding methods.

[0047] Please refer to Figure 4 . Figure 4 A schematic flow chart of a bonding method provided according to some embodiments of the present invention is shown.

[0048] like Figure 4 As shown, the controller may first control the bonding machine 101 to bond the first wafer to the first object to be bonded according to the current bonding parameters to prepare a first bonding sample.

[0049] Afterwards, in response to completing the preparation of the first bonding sample, the controller may transfer the first bonding sample to the inspection platform 102 to determine the first bonding deviation thereof.

[0050] Specifically, the controller can collect an image of the bonded sample through the detection machine 102 and identify the actual position of the mark of at least one chip 105. Afterwards, the detection machine 102 can determine the bonding deviation of the bonded sample according to the difference between the actual position of the mark of at least one chip and its target position.

[0051] Furthermore, in some preferred embodiments, the detection machine 102 can also identify the image of the bonded sample to determine the actual positions of the marks of all the chips 105 therein, and perform a full map detection analysis based on the difference between the actual position of the mark of each chip 105 and its target position to comprehensively determine the bonding deviation of the bonded sample.

[0052] In addition, in some optional embodiments, the inspection machine 102 may also determine the bonding accuracy of the corresponding chip 105 according to the value of the bonding deviation, and classify each chip 105 according to the bonding accuracy.

[0053] Specifically, the inspection machine 102 can classify the chips 105 into high-precision chip products and low-precision chip products according to the bonding accuracy of each chip 105, and classify their application scenarios. For example, high-precision chip products can be used in application scenarios such as artificial intelligence that require high-performance chips.

[0054] Afterwards, the controller may adjust the bonding parameters online according to the first bonding deviation, and feed it back to the bonding machine 101 in real time.

[0055] Afterwards, the controller may control the bonding machine 101 to prepare a second bonding sample according to the bonding parameters adjusted online.

[0056] Specifically, while detecting the first bonding deviation of the first bonding sample and / or adjusting the bonding parameters online, the controller can control the robot 103 to pick up the second wafer for preparing the second bonding sample from the wafer box 106. Here, the second wafer is the wafer that is arranged after the first wafer in the bonding process.

[0057] In addition, in some embodiments, the second wafer may also be the wafer that is ranked two or three wafers after the first wafer in the bonding process.

[0058] In this way, the above-mentioned bonding equipment provided by the first aspect of the present invention can directly control and adjust the bonding parameters of the bonding machine 101 online according to the first bonding error of the first bonding sample, and then bond the subsequent wafers according to the adjusted bonding parameters, thereby avoiding losses caused by batch errors.

[0059] Thereafter, in response to all target locations of the wafer being fully bonded with chips 105 , the controller may determine that the preparation of the bonding sample is completed.

[0060] In summary, the above-mentioned bonding equipment, bonding method and computer-readable storage medium provided by the present invention can determine the bonding deviation of the bonding sample after bonding by configuring an independent detection machine in the bonding equipment, and adjust the bonding parameters of the bonding machine online according to the bonding deviation, so as to improve the yield and production capacity of the product after bonding while ensuring the bonding accuracy of the wafer bonding process.

[0061] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0062] Although the controller described in the above embodiments can be implemented by a combination of software and hardware. However, it is understood that the controller can also be implemented in software and hardware. For hardware implementation, the controller can be implemented in one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, other electronic devices for performing the above functions, or a selection combination of the above devices. For software implementation, the controller can be implemented by independent software modules such as procedures and functions running on a general-purpose chip, each of which performs one or more functions and operations described herein.

[0063] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information from / to the storage medium. In an alternative, a storage medium may be integrated into a processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside in a user terminal as discrete components.

[0064] In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented as a computer program product in software, each function may be stored on or transmitted by a computer-readable medium as one or more instructions or codes. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media may be any available medium that can be accessed by a computer. As an example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer. Any connection is also properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, a server, or other remote source using a coaxial cable, a fiber optic cable, a twisted pair, a digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. Disk and disc as used herein include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc, wherein disk often reproduces data magnetically, while disc reproduces data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0065] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A bonding device, characterized in that: include: A bonding machine, used to bond the wafer to the part to be bonded according to bonding parameters to prepare a bonding sample; A detection machine, used for detecting the bonding deviation between the wafer and the to-be-bonded component in the bonding sample; A manipulator, at least used to transfer the bonded sample to the detection machine; as well as A controller is configured to: control the bonding machine to bond the first wafer to the first object to be bonded according to current bonding parameters to prepare a first bonding sample; In response to completing the preparation of the first bonding sample, the robot is controlled to transfer the first bonding sample to the detection machine to determine its first bonding deviation; based on the first bonding deviation, the bonding parameters are adjusted online and fed back to the bonding machine in real time; and the bonding machine is controlled to prepare a second bonding sample based on the online adjusted bonding parameters.

2. The bonding device according to claim 1, characterized in that The part to be bonded is a chip, and the bonding machine includes a pick-up head and a bonding head, wherein: The robot is also used to pick up the wafer from the wafer box and transfer it to the bonding machine. The pickup head is used to pick up the chip to be bonded and transfer it to the bonding head. The bonding head is used to bond the acquired chip to the wafer according to the current bonding parameters. The controller is further configured to: in response to all target positions of the wafer being fully bonded with chips, determine that the preparation of the bonding sample is completed.

3. The bonding device according to claim 2, characterized in that The controller is also configured to: While detecting the first bonding deviation of the first bonding sample and / or adjusting the bonding parameters online, the robot is controlled to pick up the second wafer for preparing the second bonding sample from the wafer box, wherein the second wafer is the wafer that is placed after the first wafer in the bonding process.

4. The bonding device according to claim 2, characterized in that The detection machine is configured as follows: Acquiring an image of the bonded sample and identifying the actual position of a mark of at least one chip therein; and The bonding deviation of the bonding sample is determined according to the difference between the actual position of the mark of the at least one chip and the target position thereof.

5. The bonding device according to claim 4, characterized in that The detection machine is further configured as follows: Recognizing the image of the bonded sample to determine the actual positions of the marks of all chips therein; and According to the difference between the actual position of the mark of each chip and its target position, a full map detection analysis is performed to comprehensively determine the bonding deviation of the bonding sample.

6. The bonding device according to claim 4, characterized in that The detection machine is also configured as: Determining the bonding accuracy of the corresponding chip according to the value of the bonding deviation; and The chips are classified according to the bonding accuracy.

7. The bonding device according to claim 2, characterized in that The bonding machine includes a plurality of bonding heads, and each bonding head bonds each chip synchronously or alternately.

8. The bonding device according to claim 7, characterized in that The bonding machine includes two bonding heads, wherein the first bonding head bonds the chip from one side of the wafer to the middle of the wafer, and the second bonding head bonds the chip from the middle of the wafer to the other side of the wafer.

9. A bonding method, characterized in that: The following steps are involved: Controlling a bonding machine to bond a first wafer to a first object to be bonded according to current bonding parameters to prepare a first bonding sample; In response to completing the preparation of the first bonding sample, transmitting the first bonding sample to a detection platform to determine a first bonding deviation thereof; According to the first bonding deviation, adjusting the bonding parameter online, and feeding it back to the bonding machine in real time; as well as The bonding machine is controlled to prepare a second bonding sample according to the bonding parameters adjusted online.

10. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by the controller, the bonding method as claimed in claim 9 is implemented.

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