Inductance position sensor

Abstract

A method and apparatus for obtaining improved performance and differentiation of an inductive position sensor through a non-destructive arrangement of multi-loop coil interconnects is disclosed. In a particular embodiment, a sensing element includes at least one transmit coil, a first receive coil including a first plurality of aligned loops, and a first plurality of interconnects; wherein two or more of the first plurality of arranged loops are phase mixing; each of the first plurality of interconnects connects two of the first plurality of aligned loops, wherein the first plurality of interconnects are arranged outside the sensing area of the sensing element.

Description

Background Art

[0001] Inductive position sensors provide feedback to the motor control system. For synchronous motors, this feedback is needed to calculate the phase currents necessary to achieve the desired torque and maximize motor efficiency.

[0002] Inductive position sensors operate on two core principles: electromotive force (EMF) induction in a wire loop and eddy current induction in a conductive material. EMF is induced by changing the magnetic flux through a wire loop. This can be done by changing the area of ​​the loop in the magnetic field or by changing the field strength. Eddy currents are induced by placing a conductor in a changing magnetic field or by relative motion between the conductor and the magnetic field.

[0003] Inductive position sensors can cause inaccurate readings when the signal strength in the sensing coil is weak or has a low signal-to-noise ratio. Although multiple coil loops can be arranged to produce a stronger signal, placing the interconnects of these arranged loops at the sensing area of ​​the sensing element can cause interruptions in the sensing element output. Summary of the invention

[0004] Embodiments according to the present disclosure relate to an inductive position sensor having phase-mixed, arrayed, multi-loop inductive coils having loop interconnects arranged outside of an intended sensing area. Phase-mixed, arrayed, multi-loop inductive coils increase the signal strength on the receiving coil of the inductive position sensor and reduce the number of printed circuit boards or printed film layers. By increasing the signal strength in the receiving coil using multiple arrayed loops, the signal-to-noise ratio can be increased. Placing the interconnects of the arrayed loops outside of the sensing area reduces interference with the intended signal generation and reduces nonlinearity of the output. This also allows for higher coil trace density for use in smaller applications, or for increasing coil loops to increase signal strength. Therefore, the disclosed embodiments provide a combination of improved performance, increased design flexibility, and reduced cost.

[0005] Embodiments according to the present disclosure improve the performance and versatility of inductive position sensors, such as those used in motor applications, by improving the sensing element. For inductive position sensing, the basic operating principle is to use the sensing element in pairs with a conductive target. When used in combination, the rotation of the target on the sensing element provides an output signal that can be captured using an application specific integrated circuit (ASIC) and provided to, for example, a vehicle electronic control unit (ECU).

[0006] An embodiment according to the present disclosure relates to a sensing element of an inductive position sensor. The sensing element includes at least one transmitting coil and a first receiving coil, the first receiving coil includes a first plurality of arranged loops, wherein two or more of the first plurality of arranged loops are phase mixed. The sensing element also includes a first plurality of interconnects, each of the first plurality of interconnects connects two of the first plurality of arranged loops, wherein the first plurality of interconnects are arranged outside the sensing area of ​​the sensing element.

[0007] Another embodiment according to the present disclosure relates to an inductive position sensor, which includes a sensing element, which includes at least one transmitting coil and two or more receiving coils. The two or more receiving coils include at least a first receiving coil and a second receiving coil, the first receiving coil includes a first plurality of arrangement loops, wherein two or more of the first plurality of arrangement loops are phase mixed, and the second receiving coil includes a second plurality of arrangement loops, wherein two or more of the second plurality of arrangement loops are phase mixed. The sensing element also includes a first plurality of interconnects, each of which connects two of the first plurality of arrangement loops of the first receiving coil, wherein the first plurality of interconnects are arranged outside the sensing area of ​​the sensing element. The sensing element also includes a second plurality of interconnects, each of which connects two of the second plurality of arrangement loops of the second receiving coil, wherein the second plurality of interconnects are arranged outside the sensing area of ​​the sensing element. The inductive position sensor also includes an integrated circuit, which is configured to provide a transmission signal to at least one transmitting coil, detect a first reference signal in the first receiving coil, detect a second reference signal in the second receiving coil, and detect the position of the conductive target based on changes in the first reference signal and the second reference signal.

[0008] Another embodiment according to the present disclosure relates to a method for an inductive position sensor. The method includes providing a sensing element including at least one transmitting coil and two or more receiving coils. The two or more receiving coils include at least a first receiving coil and a second receiving coil, the first receiving coil including a first plurality of arranged loops, wherein two or more of the first plurality of arranged loops are phase mixed, and the second receiving coil including a second plurality of arranged loops, wherein two or more of the second plurality of arranged loops are phase mixed. The sensing element also includes a first plurality of interconnects, each of the first plurality of interconnects connecting two of the first plurality of arranged loops of the first receiving coil, wherein the first plurality of interconnects are arranged outside the sensing area of ​​the sensing element. The sensing element also includes a second plurality of interconnects, each of the second plurality of interconnects connecting two of the second plurality of arranged loops of the second receiving coil, wherein the second plurality of interconnects are arranged outside the sensing area of ​​the sensing element. The method also includes driving a transmission signal to at least one transmitting coil by an integrated circuit. The method also includes detecting a first reference signal in the first receiving coil by the integrated circuit. The method also includes detecting a second reference signal in the second receiving coil by the integrated circuit. The method also includes determining, by the integrated circuit, a position of a conductive target near the sensing element based on changes in the first reference signal and the second reference signal.

[0009] The foregoing and other objects, features and advantages of the present invention will be apparent from the following more particular description of exemplary embodiments of the present invention, as illustrated in the accompanying drawings, wherein like reference numerals generally represent like parts of exemplary embodiments of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 An example coil layout of a single receive coil arranged at an angle is shown according to some embodiments of the present disclosure.

[0011] Figure 2A An example coil layout of a dual receive coil top layer is shown according to some embodiments of the present disclosure.

[0012] Figure 2B An example coil layout of a dual receive coil lower layer is shown according to some embodiments of the present disclosure.

[0013] Figure 3A Example coil layouts are provided where interconnections are located outside of the intended sensing area according to some embodiments of the present disclosure.

[0014] Figure 3B According to some embodiments of the present disclosure, Figure 3A Another view of the example coil layout shown.

[0015] Figure 3C According to some embodiments of the present disclosure, Figure 3AAnother view of an example coil layout including intended sensing areas is shown.

[0016] Figure 4A According to some embodiments of the present disclosure, Figure 3A A detailed view of a portion of an example coil layout is shown.

[0017] Figure 4B According to some embodiments of the present disclosure, Figure 4A The first layer of a portion of an example coil layout is shown.

[0018] Figure 4C Provided Figure 4B Another view of the first floor is shown.

[0019] Figure 4D According to some embodiments of the present disclosure, Figure 4A The second layer of a portion of an example coil layout is shown.

[0020] Figure 4E Provided Figure 4D Another view of the second floor is shown.

[0021] Figure 5 A flow chart is provided showing an example method of an inductive position sensor according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0022] The terms used herein to describe specific examples are not intended to limit other examples. When using singular forms such as "one", "a kind of" and "the" and only using a single element, whether explicitly or implicitly defined as mandatory, other examples may also use plural elements to implement the same function. Similarly, when a function is subsequently described as being implemented using multiple elements, other examples may use a single element or processing entity to implement the same function. It will be further understood that the terms "include", "encompass", "comprise" and / or "consist of" indicate the presence of the above-mentioned features, integers, steps, operations, processes, actions, elements and / or parts when used, but do not exclude the presence or addition of one or more other features, integers, steps, operations, processes, actions, elements, parts and / or any combination thereof.

[0023] It will be further understood that when an element is referred to as being "connected" or "coupled" to another element, these elements may be directly connected or coupled via one or more intermediate elements. If "or" is used to combine two elements A and B, this should be understood to disclose all possible combinations, i.e., only A, only B, and A and B. An alternative wording for the same combination is "at least one of A and B." The same applies to combinations of more than two elements.

[0024] Therefore, although other examples can have various modifications and alternative forms, some specific examples thereof are shown in the drawings and described in detail later. However, this detailed description does not limit other examples to the specific forms described. Other examples may encompass all modifications, equivalents and substitutes within the scope of the present disclosure. Throughout the illustrated description, the same numerals refer to the same or similar elements, which may be implemented in the same or modified form when compared to another element, while providing the same or similar functions.

[0025] In an embodiment according to the present disclosure, an inductive position sensor in a sensing element has an output signal that is two phase-shifted sinusoidal signals that allow a ratiometric measurement of angular position to be tracked by measuring the inverse tangent. A sensing element directly connected to an integrated circuit (e.g., an application-specific integrated circuit (ASIC)) includes a transmitting coil and two or more receiving coils. The transmitting coil generates a magnetic field that is received by the receiving coil. The transmitting coil, when driven by the integrated circuit and connected in parallel with a capacitor, acts as an LC oscillator circuit. The LC oscillator generates a magnetic field that is a transmission signal to the receiving coil. The polarity of the magnetic field is determined by the direction of the current in the loop. The two receiving coils are wire loops connected to the integrated circuit that exist in an oscillating magnetic field generated by the transmitting coil. The magnetic field induces current in the coils and induces an EMF in each wire loop that is proportional to the area of ​​the magnetic field. In alternative embodiments, the output of the sensing element can be any number of sinusoidal analog outputs, or the output of the sensing element can be a single digital angle (θ) output.

[0026] In some embodiments, the design of each receive coil creates multiple wire loops in the coil with opposite EMF generation. In the absence of a target, the sum of the EMFs for a given receive coil is designed to be 0V. This voltage signal is an input to the integrated circuit. Each coil is designed with a specific target that provides a sinusoidal voltage change when it moves from one point to another on the position sensor. In some embodiments, the target is a conductive material that interacts with the magnetic field generated by the transmitting coil. When placed above the coil, the magnetic field induces eddy currents within the conductive target. The eddy currents then generate a second magnetic field that, according to Lenz's law, is opposite to the initial magnetic field that interacts with the target. The result is a decaying magnetic field under (near) the target. The sensing element and the conductive target together generate a position signal. In the presence of a target above a given wire loop, the decaying magnetic field causes a change in the EMF generation of the affected loop. Δ is used to track the position of the target. To achieve this, the two receive coils are identical and phase-shifted by 90° (in the case of a different number of receive coils, the phase shift can be a different value, such as 60° for three receive coils). This will produce a sine and a cosine output, whose inverse tangent can be used to calculate the position of the target.

[0027] In an embodiment according to the present disclosure, the arranged coil loops (e.g., phase hybrid, multi-loop) can be implemented on a linear (X, Y, Z) or angular (θ, R, Z) sensor. When connected in series, the receiving coils arranged in the Y (linear) dimension or the R (radial) dimension produce a total sine wave that is phase-aligned, thereby generating a sine wave with a larger amplitude. The multi-coil loop group offset in the Y (linear) dimension or the R (radial) dimension obtains the benefit of each coil having a greater magnetic field uniformity to provide a clearer signal. The receiving coil loop group arranged in the X (linear) dimension or the θ (angle) dimension produces a total sine wave that is phase-mixed to an average position where each coil has a larger amplitude. The coils can be arranged in a complete electrical cycle in the X or θ dimension, but the phase hybrid coils are arranged in less than a complete electrical cycle, where the optimal phase separation value depends on the number of receiving coils and the signal transformation method (i.e., 2-phase or 3-phase sine waves). In various embodiments, the angle sensor can be implemented as a 360° sensor or an arc sensor. As used herein, "phase mixing" may refer to an angular arrangement of coil loop groups in a 360° sensor or arc sensor, or an X-arrangement of coil loop groups in a linear sensor. As used herein, "amplitude arrangement" may refer to a radial arrangement of coil loop groups in a 360° sensor or arc sensor, or a Y-arrangement of coil loop groups in a linear sensor.

[0028] Example devices and methods of inductive position sensors according to the present disclosure will be described with reference to the accompanying drawings. Figure 1 Start describing. Figure 1 FIG. 2 shows an example coil layout of a single receiving coil 100 of a position sensor in an angular arrangement (ie, a θ arrangement) according to the present disclosure. Figure 1 In an example of , the receiving coil 100 includes a first set of sinusoidal loops, the first set of sinusoidal loops having a first sinusoidal trace graph 101 (e.g., a sine wave) and a second sinusoidal trace graph 103, the second sinusoidal trace graph 103 being a reflection of the first sinusoidal trace graph 101. In some embodiments, the sinusoidal trace graphs 101, 103 are formed on the same plane (i.e., conductive layer) or different planes of the sensing element 120 (e.g., a multi-layer PCB or a printed film structure). In some embodiments, a portion of each sinusoidal trace graph 101, 103 is formed on one plane, while other portions of each sinusoidal trace graph 101, 103 are formed on a different plane. The sinusoidal trace graphs 101, 103 define a coil loop surrounding an intended sensing area 105 for detecting a magnetic field attenuated by a target when the target is located above the intended sensing area 105. When a target is present in the intended sensing area 105 , the decaying magnetic field produces a change in the EMF generation of the affected loop, which is detectable from the signal on the sinusoidal traces 101 , 103 .

[0029] exist Figure 1 In the example of , the receiving coil 100 further includes a second set of sinusoidal loops, the second set of sinusoidal loops having a first phase-shifted sinusoidal trace 107 and a second phase-shifted sinusoidal trace 109, the second phase-shifted sinusoidal trace 109 being a reflection of the first phase-shifted sinusoidal trace 107, wherein the phase-shifted sinusoidal traces 107, 109 are phase-shifted relative to the sinusoidal traces 101, 103. In some embodiments, the phase-shifted sinusoidal traces 107, 109 are formed on the same plane (i.e., conductive layer) or on different planes of the sensing element 120. In some embodiments, a portion of each phase-shifted sinusoidal trace 107, 109 is formed on one plane, while other portions of each phase-shifted sinusoidal trace 107, 109 are formed on different planes. The phase-shifted sinusoidal traces 107, 109 define a coil loop surrounding the intended sensing area 111 for detecting a magnetic field attenuated by a target when the target is located above the intended sensing area 111. When a target is present in the intended sensing area 111, the decaying magnetic field produces a change in the EMF generation of the affected loop, which is detectable from the signals on the sinusoidal traces 107, 109. By summing the EMF generation measured in the intended sensing areas 105, 111 and correlating the summed measurements with the average position of the intended sensing areas, an enhanced position signal is generated of the position of the target relative to the sensing element 120. The enhanced position signal has twice the amplitude of the signal derived from a single sensing area.

[0030] In various embodiments, an inductive sensing element for an inductive position sensor includes one or more receiving coils corresponding to one or more signals. For example, in some embodiments, the inductive position sensor includes a dual coil mode having two receiving coils corresponding to different signal modes (e.g., sine and cosine) arranged at an angle. Each receiving coil mode for each signal may further include a plurality of angularly arranged loops each having a positive winding and a negative winding. In some examples, the angularly arranged loops (i.e., phase windings) of the receiving coils are formed by a sinusoidal trace pattern on or in a printed circuit board (PCB) or a printed film structure. In some embodiments, as will be explained in detail below, portions of each sinusoidal trace pattern in each coil are formed on one plane, while other portions of the sinusoidal trace pattern are formed on different planes, such as the top and bottom layers of a PCB or the individual layers of a multi-layer PCB. In some examples, as will be explained in detail below, an inner ring of vias and an outer ring of vias allow signals to propagate between layers from a trace on one layer to a trace on another layer. In addition, vias are used for cross-interconnections between positive and negative windings, and cross-interconnections between phase windings.

[0031] For further explanation, according to some embodiments of the present disclosure, Figure 2AA coil layout 200 of a top layer of a dual coil pattern showing two receive coils corresponding to different signal patterns (eg, sine and cosine), Figure 2B The bottom layer of the dual coil pattern of two receiving coils corresponding to different signal patterns is shown in the coil layout 250. For example, the coil layout 200 can be arranged on the top layer of the PCB, and the coil layout 250 can be arranged on the bottom layer of the PCB. The coil layout 200 includes a transmitting coil 281 and a transmitting signal input line 281 surrounding the dual receiving coil layout as described below. Figure 2A and Figure 2B In the example of , interconnect vias for positive and negative winding crossing and phase winding crossing are formed at natural crossing points of the sensing area (ie, locations where current in the signal reverses).

[0032] exist Figure 2A In the embodiment, the coil arrangement 200 includes a first receive coil pattern arranged at an angle and a second receive coil pattern also arranged at an angle, wherein the first receive coil and the second receive signal coil pattern are themselves arranged at an angle to each other. The coil arrangement 200 includes a group of trace segments corresponding to portions of a sinusoidal graph. Figure 2A In the example of FIG. 1 , trace segment 201 corresponds to a portion of a first sinusoidal graph (e.g., sine) of a first signal, trace segment 203 corresponds to a portion of a first sinusoidal graph (e.g., cosine) of a second signal, trace segment 202 corresponds to a portion of a second sinusoidal graph (e.g., phase-shifted sine) of the first signal that is phase-shifted relative to the first sinusoidal graph of the first signal, and trace segment 204 corresponds to a portion of a second sinusoidal graph (e.g., phase-shifted cosine) of the second signal that is phase-shifted relative to the first sinusoidal graph of the second signal. Adjacent groups of trace segments 205, 206, 207, 208 move in the opposite direction of the signal pattern corresponding to trace segments 201, 202, 203, 204, respectively. The forward group of trace segments 201, 202, 203, 204 alternates with the reverse group of trace segments 205, 206, 207, 208 around the sensor, where each sinusoidal graph wraps around the sensor before reversing direction to form a reflection of the forward pattern. Each sinusoid reverses direction at a natural crossing point (i.e., where the current in the signal reverses). Figure 2A In the example of FIG. 2 , the sinusoidal pattern (e.g., sine, cosine, phase-shifted sine, phase-shifted cosine) reverses direction at via pair 230. Likewise, the initial signal pattern (e.g., sine and cosine) is transformed into a phase-shifted signal pattern (e.g., phase-shifted sine and phase-shifted cosine) at via pair 240.

[0033] Figure 2A The trace segments of the coil layout 200 are passed through Figure 2A The top layer and Figure 2B The bottom layer through-holes 210 are connected to Figure 2BThe trace segments of the coil layout 250. To minimize the crossover between the signal and the signal phase, the trace segments corresponding to the portion of the sinusoidal graph with increasing amplitude are arranged on one layer, and the trace segments corresponding to the portion of the sinusoidal graph with decreasing amplitude are arranged on another layer, and the increasing portion is connected to the decreasing portion by a through hole. For example, Figure 2A The trace segments 201, 202, 203, 204 are connected to Figure 2B The trace segments 211, 212, 213, 214, Figure 2A The trace segments 205, 206, 207, 208 are connected to Figure 2B Trace segments 215, 216, 217, 218.

[0034] exist Figure 2B In the example coil layout 250, similar to Figure 2A In an example coil layout 200, trace segment 211 corresponds to a portion of a first sinusoidal graph (e.g., sine) of a first signal, trace segment 213 corresponds to a portion of a first sinusoidal graph (e.g., cosine) of a second signal, trace segment 212 corresponds to a portion of a second sinusoidal graph (e.g., phase-shifted sine) of the first signal that is phase-shifted relative to the first sinusoidal graph of the first signal, and trace segment 214 corresponds to a portion of a second sinusoidal graph (e.g., phase-shifted cosine) of the second signal that is phase-shifted relative to the first sinusoidal graph of the second signal. Adjacent groups of trace segments 215, 216, 217, 218 move in opposite directions of the signal patterns corresponding to trace segments 211, 212, 213, 214, respectively. The forward group of trace segments 211, 212, 213, 214 alternates with the reverse group of trace segments 215, 216, 217, 218 around the sensor, where each sinusoidal graph wraps around the sensor before reversing direction to form a reflection of the forward pattern. Each sinusoid reverses direction at a natural crossing point (e.g., 0 amplitude). Figure 2B In the example of , the sinusoidal pattern (e.g., sine, cosine, phase-shifted sine, phase-shifted cosine) reverses direction at via pair 231. Likewise, the initial signal pattern (e.g., sine and cosine) is transformed into a phase-shifted signal pattern (e.g., phase-shifted sine and phase-shifted cosine) at via pair 241.

[0035] exist Figure 2B In the example of FIG. 2 , the coil layout 250 also includes input and output lines 285, 286 of the first receiving coil, input and output lines 287, 288 of the second receiving coil, and an output line of the transmitting coil 280. When superimposed, Figure 2A The trace segments in the coil layout 200 and Figure 2BThe trace segments in the coil layout 250 form four sinusoidal patterns that surround the sensor to form a dual signal sensing element. In this configuration, the two phases of each signal are mixed to improve the signal-to-noise ratio (SNR). The inverse tangent of the sine and cosine received signals can be calculated to determine the position of the target on the sensing element.

[0036] exist Figure 2A and Figure 2B In the example of FIG. 1 , interconnection vias for the crossover between the positive winding and the negative winding and the crossover between the phase windings are arranged at natural intersections of the sensing area. However, this may result in nonlinearity of the output. That is, these interconnections take up space within the intended area for measuring the magnetic flux generated by the transmitting coil, which may disrupt the intended output. According to an embodiment of the present disclosure, the signal output is improved by arranging the interconnection of the phase winding and the interconnection of the positive winding and the negative winding outside the intended sensing area.

[0037] Figure 3A and Figure 3B An example coil layout 300 of an example inductive sensing element 301 is provided in which positive and negative inter-winding interconnections and phase inter-winding interconnections are positioned outside of an intended sensing area. Figure 3A and Figure 3B The example coil layout 300 in the example of includes a first receiving coil 310 corresponding to a first signal (e.g., a sinusoid), and the first receiving coil 310 has four angle-arranged loops 312, 314, 316, 318. Among the four angle-arranged loops 312, 314, 316, 318, one loop propagates the original signal (e.g., a sinusoid), while the other three loops propagate phase-shifted signals of the original signal, respectively. The angle-arranged loops 312, 314, 316, 318 generate phase-mixed signals that improve the SNR of the signal. Figure 3A and Figure 3B The example coil layout 300 in the example also includes a second receiving coil 350 corresponding to a second signal (e.g., cosine), and the second receiving coil 350 has four angularly arranged loops 352, 354, 356, 358. In the four angularly arranged loops 352, 354, 356, 358, one loop propagates the original signal (e.g., cosine), while the other three loops propagate phase-shifted signals of the original signal, respectively. The angularly arranged loops 352, 354, 356, 358 produce a phase mixed signal that improves the SNR of the signal. In some examples, the arc tangent of the sine and cosine received signals in the receiving coils 310, 350 can be calculated to determine the position of the target on the example sensing element 301 (not shown). In various examples, the sensing element 301 is implemented on a PCB, a multi-layer PCB, or a printed PCB film using conductive ink. Although Figure 3A and Figure 3BTwo receiving coils 310 and 350 are described in FIG. 1 , and the coil layout according to an embodiment of the present disclosure may include more or fewer receiving coils corresponding to different signals. Figure 3A and Figure 3B , each receiving coil 310, 350 includes an input / output terminal 305, and the input / output terminal 305 includes a trace for signal input and a trace for signal output of each receiving coil 310, 350, respectively. In addition, the coil layout 300 includes one or more transmitting coils 390. In some examples, the coil layout 300 is coupled to the integrated circuit 303 through the input / output trace 305, wherein the integrated circuit 303 drives the transmission signal to the transmitting coil 390, detects the first reference signal in the first receiving coil 310 and the second reference signal in the second receiving coil 350, and determines the position of the conductive target near the sensing element 301 (not shown) based on the changes of the first reference signal and the second reference signal.

[0038] In some examples, multiple planes or forms (such as those described above with reference to Figure 2A and Figure 2B The receiving coils 310, 350 may be implemented on multiple layers of a multi-layer PCB or on opposite sides of a PCB (e.g., the top and bottom sides of the PCB). Figure 3A and Figure 3B As shown, these layers are superimposed to show the entirety of the receiving coils 310, 350. In some examples, one or more transmitting coils 390 are arranged on a PCB layer or surface of one or more layers including the receiving coils 310, 350. In other examples, one or more transmitting coils 390 are arranged on a separate layer opposite to the receiving coils 310, 350. Figure 2A and Figure 2BAs with the inductive sensing element described above, the coil layout 300 may implement sinusoidal trace elements on multiple planes such that a sinusoidal pattern is generated when a signal propagates from a trace element on one plane to a trace element on another plane, wherein each plane may be a layer of a PCB. Crossing between planes may be implemented by an inner ring 392 of vias 394 and an outer ring 396 of vias 394, wherein the inner ring 392 and the outer ring 396 terminate each trace segment. A forward group of trace segments on a particular layer may alternate with a reverse group of trace segments around the sensing element, wherein each sinusoidal pattern wraps around the sensing element before reversing direction to form a reflection of the forward pattern. Additionally, the trace segments of the first receiving coil 310 may alternate with the trace segments of the second receiving coil 350. To minimize crossover between signals and signal phases, the trace segments corresponding to portions of the sinusoidal pattern that are increasing in amplitude may be arranged on one layer, and the trace segments corresponding to portions of the sinusoidal pattern that are decreasing in amplitude may be arranged on another layer, with the increasing portions connected to the decreasing portions by vias.

[0039] exist Figure 3A and Figure 3B In the example of , the angle arrangement loops 312, 314, 316, 318 of the first receiving coil 310 are connected in series, wherein the first receiving coil 310 includes positive windings and negative windings of the angle arrangement loops 312, 314, 316, 318, so that the angle arrangement loops 312, 314, 316, 318 generate a reflected sinusoidal pattern. The input signal enters the receiving coil at the input end and propagates around the sensing element through the first phase loop before transitioning to the next phase loop, and so on, until the signal propagates from the positive winding of the phase loop to the negative winding, and so on, until the phase mixed signal reaches the output end. The first receiving coil 310 includes positive winding phase interconnections 322, 324, 326, and the signal crosses from one phase loop of the positive winding to the next phase loop through the positive winding phase interconnections 322, 324, 326. The first receiving coil 310 also includes negative winding phase interconnects 332, 334, 336 through which the signal crosses from one phase loop of the negative winding to the next phase loop. A connecting trace (not shown here) connects the positive winding of the first receiving coil 310 to the negative winding. The input interconnect 328 passes the input signal to the initial loop of the angular arrangement loops 312, 314, 316, 318. The interconnects 322, 324, 326 and the interconnects 332, 334, 336 are arranged outside the intended sensing area 380, such as Figure 3C shown.

[0040] exist Figure 3A and Figure 3BIn the example of , the angle arrangement loops 352, 354, 356, 358 of the second receiving coil 350 are connected in series, wherein the second receiving coil 350 includes the positive winding and the negative winding of the angle arrangement loops 352, 354, 356, 358, so that the angle arrangement loops 352, 354, 356, 358 generate a reflected sinusoidal pattern. The input signal enters the receiving coil at the input end and propagates around the sensing element through the first phase loop before transitioning to the next phase loop, and so on, until the signal propagates from the positive winding of the phase loop to the negative winding, and so on, until the phase mixed signal reaches the output end. The second receiving coil 350 includes positive winding phase interconnections 362, 364, 366, and the signal crosses from one phase loop of the positive winding to the next phase loop through the positive winding phase interconnections 362, 364, 366. The second receiving coil 350 also includes negative winding phase interconnects 372, 374, 376 through which the signal crosses from one phase loop of the negative winding to the next phase loop. A connecting trace (not shown here) connects the positive winding of the second receiving coil 350 to the negative winding. The input interconnect 368 passes the input signal to the initial loop of the angle arrangement loop 352, 354, 356, 358. The interconnects 322, 324, 326 and the interconnects 332, 334, 336 are arranged outside the intended sensing area 380, as shown in FIG. Figure 3C shown.

[0041] Figure 3C Depicted Figure 3A and Figure 3B 3 and 4. A coil layout 300 including an intended sensing area 380 is shown. Figure 3C A portion 400 of the coil arrangement 300 is further shown, which will be described below in conjunction with Figure 4A , Figure 4B and Figure 4C Describe it in more detail.

[0042] Figure 4A Depicted Figure 3C An enlarged view of a portion 400 of the coil arrangement 300 is shown. As shown in more detail, Figure 4APositive winding phase interconnects 322, 324, 326 through which a first received signal crosses from one phase loop of the positive winding to the next phase loop and negative winding interconnects 332, 334, 336 are depicted, and the first received signal crosses from one phase loop of the negative winding to the next phase loop through the positive winding phase interconnects 322, 324, 326. For example, an original received signal may be introduced into the first loop 312 of the first receiving coil 310, where the received signal propagates around the coil layout to the first positive winding phase interconnect 322, where the signal passes through the phase shift loop 314. The received signal then propagates around the loop 314 of the coil layout 300 to the second positive winding phase interconnect 324, where the signal passes through the next phase shift loop 316. The received signal then propagates along the loop 316 around the coil layout 300 to the third positive winding phase interconnect 326, where the signal passes through another phase shift loop 318. The received signal then propagates along loop 318 around the coil arrangement 300 until the signal transitions to the negative winding of the first receive coil 310. The process repeats with the signal transitioning between phase loops at the negative winding phase interconnects 332, 334, and 336. When the signal completes the last loop 358 of the negative winding, the signal reaches the output of the receive coil 310. Figure 4A Also shown in FIG. 4 is a transmitting coil 390 . As described above, portion 400 includes multiple superimposed layers of coil arrangement 300 .

[0043] To explain further, Figure 4BA first receiving coil PCB layer 401 of the coil layout 300 of the example sensing element 301 is depicted, wherein the first receiving coil PCB layer 401 corresponds to the portion 400. The first receiving coil PCB layer 401 includes a first positive winding trace segment 411 of a first loop 312 of the first receiving coil 310, a second positive winding trace segment 412 of a second loop 314 (phase shifted) of the first receiving coil 310, a third positive winding trace segment 413 of a third loop 316 (phase shifted) of the first receiving coil 310, and a fourth positive winding trace segment 414 of a fourth loop 318 (phase shifted) of the first receiving coil 310. The positive winding trace segments 412, 413, 414 are coupled to positive winding phase interconnects 322, 324, 326, respectively, which are disposed outside of the intended sensing area to allow received signals to propagate from one phase loop to the next. The first receiving coil PCB layer 401 also includes a first negative winding trace segment 421 of the first loop of the first receiving coil 310, a second negative winding trace segment 422 of the second loop (phase shift) of the first receiving coil 310, a third negative winding trace segment 423 of the third loop (phase shift) of the first receiving coil 310, and a fourth negative winding trace segment 424 of the fourth loop (phase shift) of the first receiving coil 310. The negative winding trace segments 421, 422, 423 are respectively coupled to negative winding phase interconnects 332, 334, 336, which are arranged outside the intended sensing area to allow the received signal to propagate from one phase loop to the next phase loop. The input line 490 is coupled to the input interconnect 328. The positive and negative trace segments 494 connect the fourth positive winding trace segment 414 to the first negative winding trace segment 421. The first receiving coil PCB layer 401 further includes a second signal trace segment 440, which is not coupled to Figure 4B The via 394 allows the first receive signal to pass from the trace in the first receive coil PCB layer 401 to the trace in the second receive coil PCB layer 402 . Figure 4C Depicted Figure 4B The first receiving coil PCB layer 401 is shown, but for clarity, the trace segments of the second receiving coil are removed.

[0044] To explain further, Figure 4DA second receive coil PCB layer 402 of the coil layout 300 of the example sensor element 301 is depicted, wherein the second receive coil PCB layer 402 corresponds to the portion 400. The second receive coil PCB layer 402 includes a first positive winding trace segment 451 of the first loop 312 of the first receive coil 310, a second positive winding trace segment 452 of the second loop 314 (phase shifted) of the first receive coil 310, a third positive winding trace segment 453 of the third loop 316 (phase shifted) of the first receive coil 310, and a fourth positive winding trace segment 454 of the fourth loop 318 (phase shifted) of the first receive coil 310. The positive winding trace segments 452, 453, 454 are coupled to the positive winding phase interconnects 322, 324, 326, respectively, which allow the received signal to propagate from one phase loop to the next. The second receiving coil PCB layer 402 further includes a first negative winding trace segment 461 of the first loop of the first receiving coil 310, a second negative winding trace segment 462 of the second loop (phase shift) of the first receiving coil 310, a third negative winding trace segment 463 of the third loop (phase shift) of the first receiving coil 310, and a fourth negative winding trace segment 464 of the fourth loop (phase shift) of the first receiving coil 310. The negative winding trace segments 461, 462, 463 are coupled to the negative winding phase interconnects 332, 334, 336, respectively. The output line 496 is coupled to the fourth negative winding trace segment 464. The first receiving coil PCB layer 401 further includes a second signal trace segment 440, which is not coupled to Figure 4D The via 394 allows the first receive signal to pass from the trace in the second receive coil PCB layer 402 to the trace in the first receive coil PCB layer 401 . Figure 4E Depicted Figure 4D The second receiving coil PCB layer 402 is shown in FIG. 4 , but for clarity, the trace segments of the second receiving coil are removed.

[0045] To explain further, Figure 5 A flow chart is provided that illustrates an example method of an inductive position sensor according to an embodiment of the present disclosure. Figure 5The method includes providing 510 a sensing element, the sensing element including at least one transmitting coil, a first receiving coil, a first plurality of interconnections, a second receiving coil, and a second plurality of interconnections; the first receiving coil includes a first plurality of arranged loops, wherein two or more of the first plurality of arranged loops are phase mixed; each of the first plurality of interconnections connects two of the first plurality of arranged loops, wherein the first plurality of interconnections are arranged outside a sensing area of ​​the sensing element; the second receiving coil includes a second plurality of arranged loops, wherein two or more of the second plurality of arranged loops are phase mixed; each of the second plurality of interconnections connects two of the second plurality of arranged loops, wherein the second plurality of interconnections are arranged outside a sensing area of ​​the sensing element. In some examples, providing 510 the sensing element is performed by providing an inductive position sensing element having an arranged receiving coil layout, such as with reference to Figure 3A , Figure 3B , Figure 3C , Figure 4A , Figure 4B , Figure 4C , Figure 4D and Figure 4E The receiving coil layout 300 .

[0046] Figure 5 The example method also includes driving 520 at least one transmit coil. In some examples, driving 520 at least one transmit coil includes driving the at least one transmit coil with a signal in parallel with a capacitor to generate a magnetic field of a transmit signal to the receive coil. In some examples, an integrated circuit (e.g., an ASIC) drives the at least one transmit coil.

[0047] Figure 5 The example method also includes detecting 530 a first reference signal in the first receiving coil, and detecting 540 a second reference signal in the second receiving coil. In some examples, detecting 530 the first reference signal in the first receiving coil and detecting 540 the second reference signal in the second receiving coil are performed by an integrated circuit that detects voltages in the first receiving coil and the second receiving coil caused by a magnetic field generated by a signal transmitted by the transmitting coil.

[0048] Figure 5 The example method also includes determining 550 a position of a conductive target near the sensing element based on changes in the first reference signal and the second reference signal. In some examples, the integrated circuit that determines the first reference signal and the second reference signal performs the act of determining 550 a position of a conductive target near the sensing element based on changes in the first reference signal and the second reference signal. The phase-mixed first reference signal of the first receiving coil is added and correlated to an average position of the coil loop, and the phase-mixed second reference signal of the second receiving coil is added and correlated to an average position of the coil loop.

[0049] In view of the above explanation, the reader will recognize that the advantages of phase hybrid, arrayed, multi-loop inductive coils with layout compensation geometry include increasing signal strength on the receiving coil of the inductive position sensor, providing the purest expected sinusoidal response signal for optimal sensor performance, allowing functionality in a variety of form factors and application requirements while maintaining signal quality, and reducing sensitivity to tolerance ranges and overlaps of sensor and system variables. By increasing the signal strength in the receiving coil, the signal-to-noise ratio can be increased, the threshold for proper signal conditioning can be met, and the sensitivity of the sensor to the target position under all application conditions (e.g., air gap and temperature range) is improved. Placing the interconnection of the arrayed loop outside the sensing area reduces interference with the expected signal generation and reduces nonlinearity of the output. This also allows for higher coil trace density for use in smaller applications, or adding coil loops to increase signal strength. Therefore, the disclosed embodiments provide a combination of improved performance, increased design flexibility, and reduced cost.

[0050] It will be appreciated from the above description that the various embodiments of the present disclosure may be modified and altered without departing from the true spirit of the present disclosure. The descriptions in this specification are for illustrative purposes only and are not limiting. The scope of the present disclosure is limited only by the language of the following claims.

Claims

1. A sensing element of an inductive position sensor, the sensing element comprising: at least one transmitting coil; a first receiving coil comprising a first plurality of arranged loops, wherein two or more of the first plurality of arranged loops are phase mixed; and A first plurality of interconnects, each of the first plurality of interconnects connecting two of the first plurality of arranged loops, wherein the first plurality of interconnects are arranged outside a sensing region of the sensing element.

2. The sensor element according to claim 1, further comprising: a second receiving coil, the second receiving coil comprising a second plurality of arranged loops, wherein two or more of the second plurality of arranged loops are phase mixed; as well as A second plurality of interconnects, each of the second plurality of interconnects connecting two of the second plurality of arranged loops, wherein the second plurality of interconnects are arranged outside a sensing region of the sensing element.

3. The sensor element according to claim 1, wherein: A connector trace between the positive winding of the first receiving coil and the negative winding of the first receiving coil is arranged outside a sensing area of ​​the sensing element.

4. The sensor element according to claim 1, wherein: A specific loop in the first plurality of arranged loops includes a first trace pattern in a first conductive layer, a second trace pattern in a second conductive layer, and a plurality of vias connecting the first trace pattern and the second trace pattern.

5. The sensor element according to claim 4, wherein: The first conductive layer and the second conductive layer are formed on opposite sides of a printed circuit board.

6. The sensor element according to claim 4, wherein: The first conductive layer and the second conductive layer are formed in different layers of a multilayer printed circuit board.

7. The sensor element according to claim 1, wherein: A particular loop in the first plurality of arranged loops includes a first trace pattern in a first conductive layer and a second trace pattern in a second conductive layer, wherein the first conductive layer and the second conductive layer are comprised of conductive ink on a printed film.

8. The sensor element according to claim 1, wherein: A particular interconnect of the first plurality of interconnects couples a trace segment of a first coil loop on a first layer of the sensing element to a trace segment of a phase-shifting coil loop on a second layer of the sensing element.

9. An inductive position sensor comprising: A sensor element, the sensor element comprising: at least one transmitting coil; Two or more receiving coils, the two or more receiving coils comprising at least: a first receiving coil comprising a first plurality of arranged loops, wherein two or more of the first plurality of arranged loops are phase mixed; and a second receiving coil, the second receiving coil comprising a second plurality of arranged loops, wherein two or more of the second plurality of arranged loops are phase mixed; a first plurality of interconnects, each of the first plurality of interconnects connecting two of the first plurality of arranged loops of the first receiving coil, wherein the first plurality of interconnects are arranged outside a sensing area of ​​the sensing element; and a second plurality of interconnects, each of the second plurality of interconnects connecting two of the second plurality of arranged loops of the second receiving coil, wherein the second plurality of interconnects are arranged outside the sensing area of ​​the sensing element; and An integrated circuit, the integrated circuit being configured to: providing a transmission signal to the at least one transmitting coil; detecting a first reference signal in the first receiving coil; detecting a second reference signal in the second receiving coil; and The position of the conductive target is detected based on changes in the first reference signal and the second reference signal.

10. The inductive position sensor according to claim 9, wherein: A connector trace between the positive winding of the first receiving coil and the negative winding of the first receiving coil is arranged outside a sensing area of ​​the sensing element.

11. The inductive position sensor according to claim 9, wherein: A specific loop in the first plurality of arranged loops includes a first trace pattern in a first conductive layer, a second trace pattern in a second conductive layer, and a plurality of vias connecting the first trace pattern and the second trace pattern.

12. The inductive position sensor according to claim 11, wherein: The first conductive layer and the second conductive layer are formed on opposite sides of a printed circuit board.

13. The inductive position sensor according to claim 11, wherein: The first conductive layer and the second conductive layer are formed in different layers of a multilayer printed circuit board.

14. The inductive position sensor according to claim 9, wherein: A particular loop in the first plurality of arranged loops includes a first trace pattern in a first conductive layer and a second trace pattern in a second conductive layer, wherein the first conductive layer and the second conductive layer are comprised of conductive ink on a printed film.

15. A method for an inductive position sensor, the method comprising: A sensor element is provided, the sensor element comprising: at least one transmitting coil; Two or more receiving coils, the two or more receiving coils comprising at least: a first receiving coil comprising a first plurality of arranged loops, wherein two or more of the first plurality of arranged loops are phase mixed; and a second receiving coil, the second receiving coil comprising a second plurality of arranged loops, wherein two or more of the second plurality of arranged loops are phase mixed; a first plurality of interconnects, each of the first plurality of interconnects connecting two of the first plurality of arranged loops of the first receiving coil, wherein the first plurality of interconnects are arranged outside a sensing area of ​​the sensing element; and a second plurality of interconnects, each of the second plurality of interconnects connecting two of the second plurality of arranged loops of the second receiving coil, wherein the second plurality of interconnects are arranged outside of a sensing area of ​​the sensing element; detecting, by an integrated circuit, a first reference signal in the first receiving coil; detecting, by the integrated circuit, a second reference signal in the second receiving coil; and The position of the conductive target near the sensing element is determined by the integrated circuit based on changes in the first reference signal and the second reference signal.

16. The method according to claim 15, wherein: A connector trace between the positive winding of the first receiving coil and the negative winding of the first receiving coil is arranged outside a sensing area of ​​the sensing element.

17. The method according to claim 15, wherein: A specific loop in the first plurality of arranged loops includes a first trace pattern in a first conductive layer, a second trace pattern in a second conductive layer, and a plurality of vias connecting the first trace pattern and the second trace pattern.

18. The method according to claim 17, wherein: The first conductive layer and the second conductive layer are formed on opposite sides of a printed circuit board.

19. The method according to claim 17, wherein: The first conductive layer and the second conductive layer are formed in different layers of a multilayer printed circuit board.

20. The method according to claim 15, wherein: A particular interconnect of the first plurality of interconnects couples a trace segment of a first coil loop on a first layer of the sensing element to a trace segment of a phase-shifting coil loop on a second layer of the sensing element.

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