Jet welding device

Abstract

A solder removal mechanism (520) according to the present invention is a solder removal mechanism for removing solder from a transfer claw (510) for transferring a substrate (200) to which solder is supplied. The solder removal mechanism includes a contact body 530 that can relatively pass through the inside of a recess 511 of a transfer claw 510 or below the transfer claw 510.

Description

Technical Field

[0001] The present invention relates to a jet soldering device for supplying molten solder to a substrate. Background Art

[0002] Conventionally, a plurality of conveying claws for conveying substrates are used in welding devices such as jet welding devices. During welding, the molten solder of the jet falls on the conveying claws, and the molten solder solidifies without being attached to the conveying claws. The solder may be attached to the conveying claws, and thus the solder attached to the conveying claws has been removed from the past. Japanese Patent Publication No. 2002-190666 shows a prior art method of removing the solder attached to the conveying claws by using a removal brush, and proposes a method of removing the solder by hot air supplied from a blow nozzle.

[0003] Depending on the composition of solder used in the jet soldering device, the solder may have strong adhesion, and the solder adhering to the transport claw may not be removed by the conventional removal brush or the hot air supplied from the blow nozzle.

[0004] The present invention provides a solder removing mechanism for more reliably removing solder attached to a conveying claw. Summary of the invention

[0005]

Concept 1

[0006] The solder removing mechanism of the present invention is used to remove solder from a conveying claw for conveying a substrate to which solder is supplied, and is characterized by comprising:

[0007] The abutment body can relatively pass through the concave portion of the conveying claw or under the conveying claw.

[0008]

Concept 2

[0009] The solder removal mechanism according to concept 1 is characterized in that:

[0010] The abutment body includes: a first abutment body that can relatively pass through the concave portion of the conveying claw, and a second abutment body that can relatively pass through the bottom of the conveying claw.

[0011]

Concept 3

[0012] The solder removal mechanism according to concept 1 or 2 is characterized by comprising:

[0013] The brush is located at a position downstream of the contact body in the moving direction of the conveying claw.

[0014]

Concept 4

[0015] The solder removal mechanism according to concept 1 or 2 is characterized in that:

[0016] Wherein, the abutment body is composed of an abutment plate.

[0017]

Concept 5

[0018] The solder removal mechanism according to concept 1 or 2 is characterized in that:

[0019] The contact body includes a curved portion and a front end portion extending from the curved portion toward the downstream side in the moving direction of the transport claw.

[0020]

Concept 6

[0021] The solder removal mechanism according to concept 1 or 2 is characterized by comprising:

[0022] The guide portion is provided to extend downward from the abutment body and is used to guide the solder dropped from the conveying claw to the storage tank.

[0023]

Concept 7

[0024] The solder removal mechanism according to concept 1 or 2 is characterized by comprising:

[0025] The cover is provided on the upstream side of the conveying claw in the moving direction relative to the contact body and extends in the up-down direction.

[0026] Effects of the Invention

[0027] According to the present invention, it is possible to provide a solder removing mechanism for more reliably removing solder adhering to a transport claw. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic diagram showing a welding device according to this embodiment.

[0029] Figure 2 It is a longitudinal sectional view showing the relationship between the transport claw and the abutment body according to the present embodiment.

[0030] Figure 3 This is a photograph showing the contact body and the brush according to the present embodiment.

[0031] Figure 4 It is a front view showing the contact body and the brush according to the present embodiment.

[0032] Figure 5 This is a side view showing an example of the solder removing mechanism according to the present embodiment.

[0033] Figure 6 This is a side view showing another example of the solder removing mechanism according to the present embodiment.

[0034] Figure 7 It is a side view showing an example of the jet welding device according to the present embodiment.

[0035] Figure 8 It is a side view showing another example of the jet welding device according to the present embodiment. DETAILED DESCRIPTION

[0036] Figure 1 The soldering device shown is, for example, a device for soldering a substrate 200 on which electronic components such as semiconductor components, resistors, and capacitors are mounted on a circuit. Typically, the electronic components and the like are positioned on the lower side of the substrate 200. The soldering device includes a main body 1 and a conveying portion 5 for conveying the substrate 200. The main body 1 includes an inlet 2 for conveying the substrate 200 in, and an outlet 3 for conveying the substrate 200 out. The conveyance of the substrate 200 can be performed at a predetermined angle, such as an inclination of about 3 to 6 degrees, when viewed from the side (see FIG. 1 ). Figure 7 and Figure 8 ). In this case, the downstream is positioned at a higher position than the upstream in the substrate conveying direction A. However, the present invention is not limited thereto, and the substrate 200 may be conveyed horizontally, for example. The conveying section 5 may include: a conveying rail 6 (see Figure 7 ); conveying claw 510 (refer to Figure 2 ), which can move along the conveying rail 6 while holding the substrate 200; and a conveying drive unit (not shown) which provides a driving force for moving the conveying claw 510 along the conveying rail 6. As the conveying rail 6, aluminum, iron, stainless steel, etc. can be used. The conveying claw 510 has a recess 511 for holding the substrate 200 (see Figure 2 ).

[0037] like Figure 1 As shown, the main body 1 may be provided with: a flux applicator 10 for applying flux to the substrate 200; a preheater 15 for preheating the substrate 200 coated with flux; a jet soldering device 100 for jetting molten solder to contact the substrate 200; and a cooler 20 for cooling the soldered substrate 200. The substrate 200 transported along the transport track 6 of the transport unit 5 passes through the flux applicator 10, the preheater 15, the jet soldering device 100, and the cooler 20 in sequence. Figure 1 In FIG. 1 , the welding device is shown in a top plan view except for the control unit 50 , the storage unit 60 , and the operation unit 70 described later.

[0038] The flux coater 10 is used to coat flux on the conveyed substrate 200. The flux may contain a solvent, an activator, etc. The flux coater 10 may be provided with a plurality of coating devices. The type of flux may be used according to the type of solder and the type of substrate 200.

[0039] The preheater unit 15 heats the substrate 200 so that the substrate 200 is uniformly heated to a predetermined temperature. If the substrate 200 is heated in this way, the solder is easily attached to a predetermined portion of the substrate 200. The preheater unit 15 uses, for example, a halogen heater. The halogen heater can rapidly heat the substrate 200 to a set temperature. Alternatively, the gas (hot air) heated by the heater can be blown to the substrate 200 through a fan to heat the substrate 200. Alternatively, as the preheater unit 15, a far-infrared plate heater or the like can be used.

[0040] The cooling machine 20 has a cooling fan (not shown) to cool the substrate 200 welded by the jet welding device 100. The cooling fan may be controlled by simply turning it on and off, but the wind speed may also be adjusted. In addition, a cooler or the like may be used as the cooling machine 20 to cool the substrate 200 to a predetermined temperature.

[0041] Figure 1 The control unit 50 shown can be connected to the conveying unit 5, the flux coater 10, the preheater unit 15, the jet soldering device 100, the cooling machine 20, the operation unit 70 and the memory unit 60 in a communicative manner. The communicative connection includes both a connection realized by wire and a connection realized by wireless. The operation unit 70 can have a liquid crystal display panel or a numeric keypad, and is typically a personal computer, a smart phone, a tablet, a touch panel, etc. The operator operates the operation unit 70, and the control unit 50 can control the conveying speed of the conveying unit 5 and the timing of conveying the substrate 200, the temperature of the flux in the flux coater 10, the coating amount of the flux, the temperature of the preheater unit 15, the temperature of the molten solder S of the jet soldering device 100, and the jet flow rate, the jet flow speed, the conduction and shutoff of the cooling fan of the cooling machine 20, etc. The memory unit 60 can store information input by the operation unit 70, instructions of the control unit 50, the actuation time of the jet soldering device 100, etc. In addition, the conveyance speed of the substrate 200 is, for example, about 1 to 3 cm per second.

[0042] Next, an example of a method for processing the substrate 200 will be described.

[0043] The substrate 200 is provided with a plurality of conveying claws 510 (see Figure 2 ) is clamped by the substrate 200 by moving the conveying claw 510 along the conveying rail 6. The substrate 200 is carried into the main body 1 from the carrying inlet 2. When the substrate 200 reaches the flux coater 10, the flux coater 10 applies flux to a predetermined portion of the substrate 200.

[0044] The transport claw 510 transports the substrate 200 coated with flux by the fluxer 10 to the preheater unit 15. The preheater unit 15 heats the substrate 200 to a predetermined temperature.

[0045] Next, the conveying claw 510 conveys the substrate 200 heated to a predetermined temperature by the preheater unit 15 to the jet soldering device 100. The jet soldering device 100 performs soldering at a predetermined position of the substrate 200. Before the jet soldering device 100 supplies the molten solder S, the molten solder S supplied from the first supply port 125 and the molten solder S supplied from the second supply port 135 are mixed, and the molten solder S is supplied to a position above the conveying rail 6. Moreover, the molten solder S is configured to not leave the substrate 200 conveyed by the conveying claw 510 between the first supply port 125 and the second supply port 135. In addition, in a state where there is no substrate 200, the molten solder S supplied from the first supply port 125 pushes up the molten solder S supplied from the second supply port 135, and a plurality of convex shapes corresponding to the first opening 126 are formed by the molten solder S.

[0046] Next, the conveying claw 510 conveys the soldered substrate 200 to the cooling machine 20. For example, the cooling fan of the cooling machine 20 cools the soldered substrate 200 for a predetermined time. After the substrate 200 is cooled, when the conveying claw 510 discharges the substrate 200 from the discharge port 3, the soldering process on the substrate 200 is completed.

[0047] Then, the transport claw 510 is folded back toward the outer periphery along the transport rail 6 and returns to the transport entrance 2. Therefore, the substrate transport direction A and the transport direction B of the transport claw 510 are in opposite directions (see Figure 1 ). In the process of the conveying claw 510 moving toward the carrying port 2, the conveying claw 510 passes through the solder removing mechanism 520. When the conveying claw 510 passes through the solder removing mechanism 520, the solder attached to the conveying claw 510 is removed by the solder removing mechanism 520. A pair of solder removing mechanisms 520 are provided, and can remove the solder attached to each of the conveying claws 510 holding the substrate 200.

[0048] When the transport claws 510 of the solder removing mechanism 520 return to the carry-in port 2 , the transport claws 510 transport another substrate 200 .

[0049] Typically, a plurality of the plurality of transport claws 510 are arranged along the transport rail 6 , and the substrate 200 is sequentially transported by the plurality of transport claws 510 on a part of the plurality of transport rails 6 .

[0050] Next, the jet welding device 100 will be briefly described.

[0051] like Figure 7 and Figure 8As shown, the jet soldering device 100 may include: a storage tank 110 for storing molten solder S, and a supply port for supplying the molten solder S to the substrate 200. The supply port may include two types of first supply port 125 and second supply port 135. Moreover, the molten solder S may be ejected from the first supply port 125 by receiving a driving force from a first driving unit, i.e., a first pump 141, and the molten solder S may be ejected from the second supply port 135 by receiving a driving force from a second driving unit, i.e., a second pump 146.

[0052] The molten solder S ejected from the first supply port 125 and the second supply port 135 is ejected from the bottom to the top. The molten solder S receiving the driving force from the first pump 141 is pressure-fed in the pipe and ejected toward the substrate 200, so that the solder is attached to a predetermined portion of the substrate 200. Similarly, the molten solder S receiving the driving force from the second pump 146 is pressure-fed in the pipe and ejected toward the substrate 200, so that the solder is attached to a predetermined portion of the substrate 200.

[0053] The first supply port 125 of the jet soldering device 100 has a plurality of first openings 126, and the first openings 126 constitute a primary jet nozzle. The plurality of first openings 126 are used to strongly supply a large amount of molten solder S to the substrate 200. The second opening 136 of the second supply port 135 is a secondary jet nozzle, and is used to supply the molten solder S to the substrate 200 with a force weaker than that of the first supply port 125. The jet solder supplied from the first supply port 125 is a dynamic supply that strongly causes the molten solder S to collide with the substrate 200, and is used to spread the molten solder S to every corner of the substrate 200. On the other hand, the jet solder supplied from the second supply port 135 is a static supply, and is used to cleanly attach the solder to the electrode or the like of the substrate 200 by passing through the molten solder S composed of a calm flow. In addition, the configuration of the jet soldering device and the conditions such as the force of the jet of the molten solder are examples, and the present application is not limited to the configuration described above.

[0054] The first supply unit 120 includes: a first shell 121; and a first supply port 125, which is provided on the upper surface of the first shell 121 and has one or more first openings 126 for supplying molten solder S. The first opening 126 can be provided to protrude upward from the upper surface of the first shell 121. The second supply unit 130 includes: a second shell 131; and a second supply port 135, which is provided on the upper surface of the second shell 131 and has one or more second openings 136 for supplying molten solder S. The first shell 121 and the second shell 131 can be provided separately (see Figure 7 ), but they can be integrated and set up (refer to Figure 8 ). When the first shell 121 and the second shell 131 are integrated, they may share a portion of the wall surface.

[0055] A configuration may be adopted in which no opening or gap is provided between the first supply port 125 and the second supply port 135 along the substrate conveying direction A on the upper surface of the first shell 121 and the second shell 131 through which the molten solder S falls downward. In the case where an opening or gap is provided through which the molten solder S falls downward, the surface area of ​​the molten solder S in contact with oxygen increases, and oxides are generated. On the other hand, in the case where no opening or gap is provided between the first supply port 125 and the second supply port 135 along the substrate conveying direction A as in this configuration, since the molten solder S does not fall between the first supply port 125 and the second supply port 135 along the substrate conveying direction A, the generation of oxides of the molten solder S can be prevented.

[0056] Next, the solder removing mechanism 520 will be described.

[0057] like Figure 2 As shown, the solder removal mechanism 520 of this embodiment has an abutment body 530 which can relatively pass through the concave portion 511 of the moving conveying claw 510 or under the moving conveying claw 510 after the substrate 200 is removed from the conveying claw 510 and conveyed. Figure 2 The conveying claw 510 holding the substrate 200 moves toward the front side of the paper, and the conveying claw 510 not holding the substrate 200 moves toward the front side of the paper. Figure 2 The conveying claw 510 shown on the left and right sides of the drawing moves to the back side of the drawing. In the present application, "can pass" means can pass relatively. Typically, when the conveying claw 510 moves and the abutment body 530 stops, the conveying claw 510 passes through the abutment body 530, and the abutment body 530 relatively passes through the recess 511 of the moving conveying claw 510 or under the moving conveying claw 510.

[0058] The abutment body 530 is used to abut against and remove the solder that has solidified and adhered to the conveying claw 510. By adopting such an abutment body 530, the solder that has solidified and adhered to the conveying claw 510 can be scraped off more reliably. In the case of using only a brush as in the previous case, it is sometimes impossible to scrape off the solder that is firmly attached to the conveying claw 510. In this regard, by adopting the abutment body 530 of the present embodiment, such a situation can be prevented from occurring. In particular, in the case of a specific solder such as Sn-58Bi (Bi: 58 mass%, the rest is Sn), there is a tendency for the solder to firmly adhere to the conveying claw 510, so it is indeed beneficial to provide the abutment body 530 of the present embodiment. More specifically, the adhesion of Sn-Bi such as Sn-58Bi is a solder that is much stronger than that of the SAC (Sn-Ag-Cu) composition, and the previous brush 590 is sometimes unable to remove the attached solder. In this regard, by adopting the form of this embodiment, the Sn-Bi solder with strong adhesion can also be cut off more reliably. In addition, since the amount of Sn-Bi solder attached to the conveying claw 510 is greater than that of the SAC composition, the amount of solder cut off becomes greater. Therefore, in the case of adopting the brush 590 as in the previous embodiment, there is also a concern of clogging. In view of this, according to the form of this embodiment, since the solder cut off is not entangled with the elements of the removal mechanism as in the case of adopting the brush 590, such concerns can also be reduced. In addition, the solder with strong adhesion is not limited to the Sn-Bi solder, and the present embodiment can also exert its effect in other solder compositions with strong adhesion such as Sn-Sb solder.

[0059] Since a pair of the transport claws 510 for holding the substrate 200 is provided, a pair of the abutting bodies 530 may also be provided. Figure 5 and Figure 6 As shown, at least a portion is located above the storage tank 110 of the jet soldering device. By arranging the solder removal mechanism 520 above the storage tank 110 of the jet soldering device, the solder cut off from the conveying claw 510 directly falls into the storage tank 110, thereby being reused for soldering, and the accumulation of the cut solder in the jet soldering device 100 can be suppressed. The conveying claw 510 can be made of resin or metal. In the case of being made of metal, it can be made of stainless steel such as SUS.

[0060] like Figure 2 , Figure 5 and Figure 6As shown, the abutment body 530 may include: a first abutment body 540, which can relatively pass through the recess 511 of the moving conveying claw 510 and can abut against the solder attached to the recess 511 of the conveying claw 510 and solidified; and a second abutment body 550, which relatively passes under the moving conveying claw 510 and can abut against the solder attached to the lower part of the conveying claw 510 and solidified. The first abutment body 540 may be a shape that is slightly smaller than the recess 511 and matches the shape of the recess 511. The first abutment body 540 may be a shape similar to the shape of the recess 511. By setting the first abutment body 540 to be a shape that is smaller than the recess 511 and matches the shape of the recess 511, the solder attached to the recess 511 can be removed more reliably.

[0061] like Figure 3 and Figure 4 As shown, the first abutting body 540 may include an abutting plate. The first abutting body 540 may include: a first base end 545, a first front end 543, and a first curved portion 541 disposed between the first base end 545 and the first front end 543. The first front end 543 may be directed to the downstream side (in the moving direction B) of the conveying claw 510 with the first curved portion 541 as a reference. Figure 3 In the case where the first abutting body 540 is in a straight line and the first curved portion 541 is not provided, it is possible that the first abutting body 540 may hook onto the conveying claw 510 for some reason, thereby stopping the movement of the conveying claw 510. In view of this, by configuring the first front end portion 543 to extend toward the downstream side of the moving direction B of the conveying claw 510 as in the present embodiment, even if the first front end portion 543 of the first abutting body 540 abuts against the conveying claw 510 for some reason, the possibility of hooking onto the conveying claw 510 and stopping the movement of the conveying claw 510 can be reduced. If the movement of the conveying claw 510 stops, the processing of the substrate 200 itself stops, but by adopting the present embodiment, such a situation can be prevented. In addition, the first front end portion 543 is configured to extend toward the inner side of the welding device, Figure 2 Specifically, the first front end portion 543 of the first abutting body 540 on the right side extends toward the left side, and the first front end portion 543 of the first abutting body 540 on the left side extends toward the right side.

[0062] Similar to the first abutting body 540, the second abutting body 550 may also include an abutting plate. Figure 3 and Figure 4 As shown, the second abutting body 550 may include: a second base end portion 555, a second front end portion 553, and a second curved portion 551 disposed between the second base end portion 555 and the second front end portion 553. The second front end portion 553 may be directed to the downstream side (in the moving direction B) of the conveying claw 510 with the second curved portion 551 as a reference. Figure 3The second front end portion 553 is configured to extend downstream in the moving direction B of the conveying claw 510 for the same reason as the first abutting body 540, so that the second abutting body 550 can be prevented from being hooked on the conveying claw 510. That is, the second abutting body 550 is also basically configured not to abut against the conveying claw 510, but even if the second abutting body 550 abuts against the conveying claw 510 for some reason, the second abutting body 550 can be prevented from hindering the movement of the conveying claw 510. In addition, the second front end portion 553 is also configured to extend toward the inner side of the welding device in the same manner as the first front end portion 543.

[0063] The contact body 530 may be made of metal, stainless steel such as SUS, or iron. However, stainless steel is preferred from the viewpoint of being less prone to rust. The first contact body 540 and the second contact body 550 may be provided in a pair in the welding device, or may be provided in a plurality of pairs.

[0064] like Figure 5 and Figure 6 As shown, a guide portion 580 may be provided, which is located below the abutment body 530 and is used to guide the solid solder falling from the conveying claw 510 to the storage tank 110 of the jet soldering device. By providing such a guide portion 580, the solder that is cut off by abutting the abutment body 530 can be more reliably guided to the storage tank 110, and the solder can be melted and reused. In addition, the accumulation of the cut solder in the jet soldering device 100 can be more reliably suppressed. In particular, since the amount of a specific solder such as Sn-Bi that is a solder attached to the conveying claw 510 increases, adopting such a form is very beneficial from the perspective of repeated use and the perspective of suppressing the accumulation of the cut solder in the jet soldering device 100.

[0065] A cover 585 may be provided, which is located on the downstream side of the moving direction B of the conveying claw 510 ( Figure 5 and Figure 6 The inventors of the present invention have found that the solder cut off from the conveying claw 510 has a tendency to move to the upstream side of the moving direction B ( Figure 5 and Figure 6 However, by providing such a cover 585, the solder that is cut off by contacting the abutment body 530 can be prevented from being scattered to the upstream side (in the moving direction B) of the conveying claw 510. Figure 5 and Figure 6In this embodiment, the cover 585 and the guide portion 580 are integrated and connected via the connecting portion 589, but the cover 585 and the guide portion 580 are not limited to this form. The cover 585 and the guide portion 580 can be separate structures. However, when the cover 585 and the guide portion 580 are integrated as in this embodiment, it is beneficial in that the solid solder that collides with the cover 585 can be directly guided to the storage tank 110 through the guide portion 580.

[0066] The contact body 530 may be positioned at the downstream side of the conveying direction B of the conveying claw 510 ( Figure 5 and Figure 6 By providing such a brush 590, the solder attached to the conveying claw 510 can be removed more reliably. That is, even if the solder attached to the conveying claw 510 can be scraped off by the abutment body 530 composed of a metal plate or the like, the scraped off solder may be in a state of being carried on the conveying claw 510. In this regard, by pre-providing the brush 590 as in the present embodiment, the solder carried on the conveying claw 510 can be removed. Here, in the case where the material of the brush 590 is composed of metal, it is indeed beneficial in that its effect is also increased. However, the material of the brush 590 is not particularly limited, and the brush 590 may be composed of, for example, horse hair. In the case where the brush 590 is composed of metal, it may be stainless steel such as SUS or iron. However, from the viewpoint of being less prone to rust, stainless steel is preferred. As Figure 3 As shown, the abutment body 530 and the brush 590 are integrally formed.

[0067] The contact body 530 may include a third contact body 560 (see FIG. 5 ) above the conveying claw 510 to contact the attached solder. Figure 6 ). Usually, solder does not adhere to the upper side of the conveying claw 510, but sometimes solder adheres for some reason, so such a third abutment body 560 can be provided. The third abutment body 560 can also be similar to the first abutment body 540 and the second abutment body 550, and the front end side of the third abutment body 560 is toward the downstream side of the conveying direction B of the conveying claw 510 ( Figure 6 right side) extension.

[0068] The above-mentioned description of each embodiment and the disclosure of the drawings are only examples for explaining the invention described in the scope of the patent application, and the invention described in the scope of the patent application is not limited by the above-mentioned description of each embodiment or the disclosure of the drawings. In addition, the description of the scope of the patent application at the beginning of the application is only an example, and the description of the scope of the patent application can also be appropriately changed based on the description of the specification, drawings, etc.

[0069] Explanation of symbols

[0070] 110: Storage tank

[0071] 200: Substrate

[0072] 510: Transport Claw

[0073] 511: concave part

[0074] 520: Solder removal mechanism

[0075] 530: Contact body

[0076] 540: first contact body

[0077] 541: First bend

[0078] 543: First front end

[0079] 550: Second abutment body

[0080] 551: Second bend

[0081] 553: Second front end

[0082] 580: Guidance Department

[0083] 585: Hood

[0084] 590: Brush.

Claims

1. A solder removing mechanism for removing solder from a transport claw for transporting a substrate to which solder is supplied, characterized in that: include: The abutment body can relatively pass through the concave portion of the conveying claw or under the conveying claw.

2. The solder removal mechanism according to claim 1, characterized in that: in, The contact body includes a first contact body that can relatively pass through the concave portion of the transport claw, and a second contact body that can relatively pass through the bottom of the transport claw.

3. The solder removal mechanism according to claim 1 or 2, characterized in that: include: The brush is located on the downstream side of the moving direction of the transport claw relative to the abutment body.

4. The solder removal mechanism according to claim 1 or 2, characterized in that: in, The abutment body is composed of an abutment plate.

5. The solder removal mechanism according to claim 1 or 2, characterized in that: in, The contact body has a bent portion and a front end portion extending from the bent portion toward the downstream side in the moving direction of the transport claw.

6. The solder removing mechanism according to claim 1 or 2, characterized in that: include: The guide portion is provided to extend downward from the abutment body and is used to guide the solder dropped from the conveying claw to the storage tank.

7. The solder removing mechanism according to claim 1 or 2, characterized in that: include: The cover is provided on the upstream side of the conveying claw in the moving direction relative to the contact body and extends in the up-down direction.

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