Sensing system for department of hepatobiliary surgery

Abstract

The hepatobiliary surgery sensing system comprises a temperature detection module, a vibration detection module, an image detection module and a central control unit, main components of the temperature detection module are composed of four temperature sensors, the sensors are separated by materials with different heat conductivities, each temperature sensor uses four PCB wires with the same size, and the temperature detection module is connected with the vibration detection module. The temperature detection unit uses two temperature sensors to measure heat flow perpendicular to the surface of human tissue, the other two temperature sensors are used for calculating transverse heat loss, data of the temperature sensors are combined with thermal models of conductive materials and thermal insulation materials, and the precision enhancement unit can effectively improve vibration signal precision and reduce signal noise. The image enhancement unit effectively improves the definition of the image acquired by the image sensor, and can play an effective auxiliary role in the hepatobiliary surgery.

Description

Technical Field

[0001] The present invention relates to the field of medical health, and in particular to a hepatobiliary surgery sensor system. Background Art

[0002] There are many types of hepatobiliary diseases with complex conditions. There are many general classification methods, which can be roughly divided into congenital diseases, infectious diseases, medical and surgical diseases, benign diseases and malignant diseases. The most common diseases include cholecystitis with gallstones, adenomyosis, gallbladder cancer, various viral hepatitis, drug-induced liver injury, intrahepatic and extrahepatic bile duct stones, obstructive jaundice, cholestatic hepatitis, autoimmune hepatitis, cirrhosis, hemangioma, liver cysts, primary and secondary liver cancer, sclerosing cholangitis, etc.

[0003] In the prior art, during hepatobiliary surgical treatment, patients are not effectively monitored, which increases the risk of treatment. Or simple sensing equipment is used, which cannot achieve high-precision monitoring and early warning, or the sensor equipment is not designed reasonably and cannot effectively perform online and real-time monitoring. Summary of the invention

[0004] Therefore, in order to overcome the above problems, the present invention provides a hepatobiliary surgical sensing system, which can effectively assist hepatobiliary surgical treatment. Through the patch-type temperature sensing device, the temperature detection path is optimized to make temperature monitoring more accurate; the vibration signal enhancement unit is used to improve vibration monitoring; through the image enhancement unit, the image acquisition contrast is effectively improved, thereby improving image accuracy, thereby accurately assisting the treatment process from multiple aspects.

[0005] The hepatobiliary surgery sensing system includes a temperature detection module, a vibration detection module, an image detection module and a central control unit.

[0006] Preferably, the temperature detection module is a temperature detection unit, the vibration detection module includes a vibration sensor and a precision enhancement unit, and the image detection module includes an image sensor and an image enhancement unit. The output end of the temperature detection unit is connected to the input end of the central control unit, the output end of the vibration sensor is connected to the input end of the precision enhancement unit, the output end of the precision enhancement unit is connected to the input end of the central control unit, the output end of the image sensor is connected to the input end of the image enhancement unit, and the output end of the image enhancement unit is connected to the input end of the central control unit.

[0007] Preferably, the temperature detection unit is a wearable thermal detection device, which consists of four temperature sensors separated by materials with different thermal conductivities, wherein one temperature sensor is located at the center of the PCB board, two temperature sensors are located in the middle and edge of the PCB board, and the fourth sensor is located at the tip of the flexible contact patch, the edge of which is folded toward the center of the PCB board.

[0008] Preferably, the temperature detection unit uses two temperature sensors to measure the heat flow perpendicular to the surface of the human tissue, and the other two temperature sensors are used to calculate the lateral heat loss.

[0009] Preferably, the temperature detection circuit arranged on the PCB board is as follows: one end of the resistor R1 is grounded, the other end of the resistor R1 is connected to one end of the resistor R2, the other end of the resistor R1 is also connected to one end of the resistor R3, one end of the resistor R5 is grounded, the other end of the resistor R5 is connected to one end of the resistor R6, the other end of the resistor R6 is connected to a first end of a temperature sensor (TS), the other end of the resistor R2 is connected to a second end of the temperature sensor (TS), the third end of the temperature sensor (TS) is connected to one end of the resistor R4, the other end of the resistor R4 is connected to a first end of another temperature sensor (TS), the other end of the resistor R3 is connected to a second end of another temperature sensor (TS), the third end of another temperature sensor (TS) is connected to one end of the resistor R7, the other end of the resistor R7 is connected to the input end of the central control unit, and the central control unit removes the lateral heat loss signals calculated by the other two temperature sensors from the temperature signal collected by the temperature detection circuit to obtain an accurate patient body temperature.

[0010] Preferably, four equally sized PCB traces are used for each temperature sensor.

[0011] Preferably, the temperature detection unit is a flat rigid-flexible assembly that is statically bent twice, and during assembly, the circuit contact extending from the circular circuit area to the TS4 temperature sensor is bent twice by 90 degrees.

[0012] Preferably, the vibration sensor is arranged on the patient's head, the output end of the vibration sensor is connected to the in-phase end of the operational amplifier A1, one end of the resistor R8 is grounded, the other end of the resistor R8 is connected to the inverting input end of the operational amplifier A1, the other end of the resistor R8 is connected to one end of the resistor R9, the output end of the operational amplifier A1 is connected to the in-phase input end of the operational amplifier A2, one end of the resistor R10 is grounded, the other end of the resistor R10 is connected to the inverting input end of the operational amplifier A2, one end of the resistor R11 is connected to the other end of the resistor R10, the other end of the resistor R11 is connected to the output end of the operational amplifier A2, the other end of the resistor R9 is connected to the output end of the operational amplifier A2, and the output end of the operational amplifier A2 is connected to the input end of the central control unit.

[0013] Preferably, the image sensor is used to collect facial image information of the patient, and the image enhancement unit is used to enhance the clarity of the image collected by the image sensor; Step 1: Perform color / spatial domain adjustment on the image to complete the chromatic aberration correction of the image and obtain the reconstructed image: ; In the above formula, Rc is the intermediate result, Ic(p)-Ic(j) is two different brightness differences, d(p,j) represents the distance metric function, r(·) is the brightness performance function, which must be an odd function. This step can adapt to the local image contrast. r(·) can amplify smaller differences and enrich larger differences, expanding or compressing the dynamic range according to the local content. ; In the above formula, T is the period parameter; Step 2: Dynamically expand the corrected image, where ; In the above formula, w represents the line segment [(0,m c ),(255,M c )], and has a slope of min[R c (p)],M c =max[R c (p)]; Step 3: Expand R(x) to [0,1] using the following formula to obtain the enhanced channel: .

[0014] Compared with the prior art, the present invention has the following beneficial effects: The hepatobiliary surgery sensing system provided by the present invention comprises a temperature detection unit whose main components are composed of four temperature sensors (1 / TS), which are separated by materials with different thermal conductivities, and each temperature sensor uses four PCB traces of equal size. The temperature detection unit uses two temperature sensors to measure the heat flow perpendicular to the surface of human tissue, and the other two temperature sensors are used to calculate the lateral heat loss. The data of the temperature sensors are combined with the thermal models of the conductive material and the thermal insulation material. The central control unit removes the lateral heat loss signals calculated by the other two temperature sensors from the temperature signal collected by the temperature detection circuit to obtain the accurate patient body temperature. The precision enhancement unit can effectively improve the accuracy of the vibration signal and reduce the signal noise. The image enhancement unit effectively improves the clarity of the image collected by the image sensor, and therefore, it can play an effective auxiliary role in hepatobiliary surgery. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a principle block diagram of the hepatobiliary surgery sensor system of the present invention; Figure 2 The temperature detection unit of the present invention is provided with a position and an appearance diagram; Figure 3 A detection path for the temperature detection unit of the present invention; Figure 4 It is a detection principle diagram of the temperature detection unit of the present invention; Figure 5 It is the PCB board wiring diagram of the present invention; Figure 6 A wiring diagram of the conductive material of the present invention; Figure 7 The internal structure diagram of the temperature detection unit of the present invention; Figure 8 It is a functional diagram of the temperature detection unit of the present invention; Fig. 9 It is the principle diagram of the temperature detection unit of the present invention; Fig.10 This is a schematic diagram of the precision enhancement unit of the present invention.

[0016] Reference numerals: 1 - temperature sensor; 2 - controller; 3 - display; 4 - connector; TS - temperature sensor. DETAILED DESCRIPTION

[0017] The hepatobiliary surgery sensor system provided by the present invention is described in detail below with reference to the accompanying drawings and embodiments.

[0018] like Figure 1 As shown, the sensing system for hepatobiliary surgery includes a temperature detection module, a vibration detection module, an image detection module and a central control unit.

[0019] Specifically, the temperature detection module is a temperature detection unit, the vibration detection module includes a vibration sensor and an accuracy enhancement unit, and the image detection module includes an image sensor and an image enhancement unit.

[0020] Specifically, the output end of the temperature detection unit is connected to the input end of the central control unit, the output end of the vibration sensor is connected to the input end of the precision enhancement unit, the output end of the precision enhancement unit is connected to the input end of the central control unit, the output end of the image sensor is connected to the input end of the image enhancement unit, and the output end of the image enhancement unit is connected to the input end of the central control unit.

[0021] Specifically, the connection method adopts either line connection or wireless connection.

[0022] like Figure 2 As shown, the temperature detection unit is arranged on the patient's forehead to detect the patient's body temperature information during treatment. In actual use, the temperature detection unit can also be arranged on the patient's arms, abdomen, legs and other parts that do not affect the treatment. The specific situation can be set according to the actual treatment situation.

[0023] Specifically, the temperature detection unit is a wearable thermal detection device, and the patch can accurately estimate human body temperature.

[0024] Specifically, the temperature detection unit is in the shape of a disk, and a material that is easily attached to human skin is disposed on one side of the disk.

[0025] like Figure 3 , 7 As shown, the main components of the temperature detection unit are composed of four temperature sensors (1 / TS), which are separated by materials with different thermal conductivities to accurately quantify human body temperature. The temperature sensor has an accuracy of 0.1°C and a supply voltage of 1.8V, supporting low-power operation. Among them, one temperature sensor is located in the center of the PCB board, two temperature sensors are located in the middle and edge of the PCB board, and the fourth sensor is located at the tip of the flexible contact patch, and the edge of the contact patch is folded toward the center of the PCB board.

[0026] Specifically, the model of the temperature sensor is MAX30208.

[0027] Specifically, the temperature detection unit is used to monitor the patient's body temperature in preoperative, intraoperative and postoperative environments. The typical ambient temperature range of such environments is 20°C to 24°C, the maximum air thermal conductivity is 5 W / m2 / K, and the normal range of forehead core body temperature is 36°C to 38°C. A temperature below 36°C is called hypothermia, and a temperature above 38°C is called hyperthermia. Both conditions are serious, so the core body temperature needs to be monitored at various stages of the operation.

[0028] Specifically, regarding the layout design considerations of the heat flow of the temperature detection unit, the temperature detection unit uses two temperature sensors to measure the heat flow perpendicular to the surface of human tissue. Figure 3 As shown, TS is the temperature sensor, and the other two temperature sensors are used to calculate the lateral heat loss. The temperature of the human forehead can be accurately estimated by combining the data of the temperature sensors with the thermal models of the conductive material and the insulation material.

[0029] Specifically, a temperature sensor is integrated on the PCB board. The temperature sensor has low power consumption and will not have adverse effects on the relevant thermal system. Use thicker PCB traces for signal transmission. The size of the signal trace can sufficiently reduce the heat flow from (or to) the temperature sensor to avoid adverse effects on the thermal system. The size of the signal trace reduces the heat radiation from the PCB trace to the conductive material area (i.e., I 2 R loss).

[0030] like Figure 3 , 4As shown, the temperature detection circuit arranged on the PCB board is as follows: one end of the resistor R1 is grounded, the other end of the resistor R1 is connected to one end of the resistor R2, the other end of the resistor R1 is also connected to one end of the resistor R3, one end of the resistor R5 is grounded, the other end of the resistor R5 is connected to one end of the resistor R6, the other end of the resistor R6 is connected to a first end of a temperature sensor (TS), the other end of the resistor R2 is connected to a second end of the temperature sensor (TS), the third end of the temperature sensor (TS) is connected to one end of the resistor R4, the other end of the resistor R4 is connected to a first end of another temperature sensor (TS), the other end of the resistor R3 is connected to a second end of another temperature sensor (TS), the third end of another temperature sensor (TS) is connected to one end of the resistor R7, and the other end of the resistor R7 is connected to the input end of the central control unit.

[0031] Specifically, the central control unit removes the lateral heat loss signals calculated by the other two temperature sensors from the temperature signal collected by the temperature detection circuit to obtain the accurate patient body temperature.

[0032] Specifically, during design, the thermal resistance of the PCB traces must be greater than the thermal resistance of the conductive material to ensure that the error caused by additional heat loss (or gain) can be ignored.

[0033] Specifically, since both heat and electricity are transmitted through the movement of electrons, the two are closely related. According to the Wiedemann-Franz law, the ratio of thermal conductivity to electrical conductivity of different metals at the same temperature is approximately a constant, that is, the greater the thermal resistance, the worse the electrical conductivity, and vice versa. In practical applications, since the temperature range is quite limited, common metals can be used.

[0034] like Figure 5 As shown in the figure, although common metal is used for the traces, it is still necessary to make a trade-off in the thermoelectric design when interconnecting them with the PCB. According to the formula of resistance and thermal resistance, the thinner and longer the PCB traces are, the greater the thermal resistance is. Therefore, the traces are made thinner and longer so that their thermal resistance is greater than that of the conductive material, in order to fully reduce the heat leakage (i.e., error) of the temperature detection unit.

[0035] Specifically, before considering the thermal resistance of PCB traces, first evaluate the thermal behavior of conductive materials to establish a design baseline. The heat conduction path of conductive materials is cylindrical, such as Figure 6 shown.

[0036] Specifically, based on the conductivity and size of its material, the thermal resistance of the conductive material is calculated as follows:

[0037] Among them, A is Figure 6 The upper / lower surface area of ​​the cylinder, L is Figure 6 The thickness of the cylinder, k is a constant, and R of the conductive material TH=49.9K / W.

[0038] Specifically, each PCB trace is a long plate of 76.2 microns x 17.3 microns, so it is concluded that:

[0039] Where A is the upper / lower surface area of ​​each PCB trace, k is a constant, and R of the conductive material TH / L=1878 (K / W) mm.

[0040] Specifically, if Figure 7 As shown in the figure, since each temperature sensor requires four PCB traces of equal size, that is, four thermal paths in parallel, the thermal resistance of the overall PCB trace is reduced by four times, that is, 470 (K / W) mm.

[0041] like Figure 8 As shown in the figure, to reduce the thermal error of the electrical system, the electrical system of the temperature detection unit is powered by a 1.8 V regulated DC power supply on the MCU interface board. 2 The C pull-up resistor is a significant source of heat and is located on the MCU board, not on the PCB.

[0042] Most of the power consumption comes from I 2 C signal line and power supply, the power consumption in continuous working state is about 810μW. Since the temperature signal does not change very quickly, periodic sampling can be used, which not only helps data management, but also reduces the overall power consumption, which in turn helps reduce the heat dissipation of the temperature sensor itself and the signal and power lines.

[0043] When the integration period is 15 milliseconds and the sampling rate is 1 Hz, the average power consumption of the temperature sensor is about 10 μW.

[0044] In the prior art, the temperature detection module usually provides the package thermal resistance. Since the junction-to-ambient thermal resistance and the junction-to-casing thermal resistance are both evaluated based on the solid-state environment, this is prone to errors in practical applications. Therefore, the ambient temperature is not used to infer the junction temperature in the present invention. In the present invention, the temperature sensor is arranged between the thermal insulation material and the conductive material.

[0045] Specifically, since the temperature measurement circuit of the temperature sensor relies on the integrated circuit, the temperature detection unit especially considers the self-heating of the chip. The chip is used to measure the external temperature of the top (or bottom) of the package. Therefore, assuming that the case temperature is the same as the chip temperature, the temperature error caused by the self-heating of the chip can be estimated as follows:

[0046] This error is more than 100 times lower than the accuracy of a temperature sensor (eg, ±0.1°C).

[0047] Based on the above, the temperature detection unit will still be the I of the conductive core area PCB routing 2 R loss is taken into account, such as Figure 7 As shown, the distance from TS1 or TS4 to the outer edge of the conductive core is 7.5 mm. Using the resistance formula of a single PCB trace and the conductivity of copper, the following results can be calculated:

[0048] Since the maximum current of the SCL and SDA signal lines of the MCU is 383μApk, the error caused by the thermal radiation of a single PCB trace is calculated to be about 0.7μ℃, which is negligible for the temperature detection unit. Therefore, the thermal error caused by the self-heating of the temperature sensor and the thermal radiation of the PCB trace is effectively reduced.

[0049] At the same time, the maximum length of the line is 88 mm (TS4 to CN1), plus the 200 mm of 28 AWG wire (0.32 mm diameter) connecting to the temperature sensor interface board, and the maximum current of VDD is 67 μA, so the voltage drop of the line is as follows:

[0050] It can be seen that the voltage drop is small enough and there will be no power supply suppression problem, which is better than the existing technology.

[0051] Fig. 9 The schematic diagram of the temperature sensing unit is shown, showing the routing that makes electrical interconnections and slows down heat flow in a double-layer polyimide PCB board.

[0052] Specifically, the mechanical structure reliability of the temperature detection unit is further improved. The PCB board of the temperature detection unit adopts a hybrid structure of rigid PCB and flexible PCB, and adopts a circuit design in which electronic components are usually connected using reflow soldering. Therefore, these components are mounted on rigid PCB materials to maintain the integrity of the solder joints. The flexible area of ​​the temperature detection unit uses 4 milliinch thick polyimide, and the reinforced area uses 12 milliinch thick polyimide. In order to enhance rigidity, metal sheets are used to reinforce the flexible contact circuit.

[0053] The temperature detection unit is a flat rigid-flexible component that is statically bent twice. During assembly, the circuit contacts extending from the circular circuit area to the TS4 temperature sensor are bent twice by 90 degrees.

[0054] Specifically, the TS4 flexible circuit contact design uses a brick-shaped metal sheet to reduce metal fatigue caused by one-time static bending.

[0055] like Fig.10As shown, the vibration sensor is arranged on the patient's head, the output end of the vibration sensor is connected to the in-phase end of the operational amplifier A1, one end of the resistor R8 is grounded, the other end of the resistor R8 is connected to the inverting input end of the operational amplifier A1, the other end of the resistor R8 is connected to one end of the resistor R9, the output end of the operational amplifier A1 is connected to the in-phase input end of the operational amplifier A2, one end of the resistor R10 is grounded, the other end of the resistor R10 is connected to the inverting input end of the operational amplifier A2, one end of the resistor R11 is connected to the other end of the resistor R10, the other end of the resistor R11 is connected to the output end of the operational amplifier A2, the other end of the resistor R9 is connected to the output end of the operational amplifier A2, and the output end of the operational amplifier A2 is connected to the input end of the central control unit.

[0056] Specifically, the model of the operational amplifier A1 is ADA4091-2, the model of the operational amplifier A2 is AD8397, the resistor R8=100Ω, the resistor R9=900Ω, the resistor R10=483Ω, and the resistor R11=1kΩ.

[0057] Fig.10 The circuit configuration shown is characterized by a higher bandwidth. If two identical amplifiers with a gain bandwidth product of 100 MHz and a gain of G = 1 are used, the -3 dB bandwidth can be improved by about 27%. The effect is more pronounced with higher gains, but only up to a certain limit. Once this limit is exceeded, instability may occur. This instability can also occur when the two gains are not evenly distributed. Generally speaking, the maximum bandwidth is achieved when the gains of the two amplifiers are evenly distributed. Using the above values ​​(GBWP = 100 MHz, G2 = 3.16, G = 10), the -3dB bandwidth of the combination of the two amplifiers is 3 times that of a single amplifier at a total gain of 10. When the gain is evenly distributed, G2 also achieves the same effective gain as amplifier 1, but the open-loop gain of each individual amplifier is higher. At lower gains, for example, from 40 dB to 20 db, both amplifiers will operate in the low region of the open-loop curve. This results in a higher gain than a single amplifier with the same gain. Fig.10 The circuit configuration shown can achieve higher bandwidth.

[0058] Trans-amplifier A2 provides a separate feedback path, and although it is also in the feedback path of trans-amplifier A1, the overall configuration output will have a larger error due to op amp A2, but this error will be corrected when fed back to trans-amplifier A1. Therefore, the accuracy of trans-amplifier 1 can be maintained, and the output offset is only proportional to the input offset error of the first op amp and has nothing to do with the offset voltage of the second amplifier.

[0059] The same is true for the noise component, which is also corrected by feedback, where the AC signal is related to the bandwidth reserve of the two op amp stages and corrects the noise component of op amp A2 as long as the first op amp stage has sufficient bandwidth.

[0060] Fig.10 The example circuit shown uses the rail-to-rail AD8397 op amp (-3dB bandwidth = 69 MHz) and the precision ADA4091-2 op amp (-3dB bandwidth = 1.2 MHz). The combined bandwidth is more than twice that of a single amplifier (op amp A1) (G = 10). Combining the AD8397 with various precision amplifiers can also reduce noise and improve THD characteristics.

[0061] Specifically, the image sensor is used to collect facial image information of the patient, and the image enhancement unit is used to enhance the clarity of the image collected by the image sensor, introduce the spatial position relationship of color and brightness in the image, perform adaptive filtering of local characteristics, and realize image brightness and color adjustment and contrast adjustment with local and nonlinear characteristics.

[0062] Step 1: Perform color / spatial domain adjustment on the image to complete the chromatic aberration correction of the image and obtain the reconstructed image:

[0063] In the above formula, Rc is the intermediate result, Ic(p)-Ic(j) is two different brightness differences, d(p,j) represents the distance metric function, r(·) is the brightness performance function, which must be an odd function. This step can adapt to the local image contrast. r(·) can amplify smaller differences and enrich larger differences, expanding or compressing the dynamic range according to the local content.

[0064] In the above formula, T is the period parameter.

[0065] Step 2: Dynamically expand the corrected image, where

[0066] In the above formula, w represents the line segment [(0,m c ),(255,M c )], and has a slope of min[R c (p)],M c =max[R c (p)].

[0067] Step 3: Expand R(x) to [0,1] using the following formula to obtain the enhanced channel: .

[0068] In the above embodiment, when the patient undergoes hepatobiliary surgery, his body temperature, vibration and image information can be accurately obtained, wherein the central control unit includes a display, a comparator and an alarm, the display is used to display the measured body temperature, vibration and image information, the comparator stores the body temperature range and vibration range, if the measured body temperature data or vibration data exceeds the range, the alarm will sound an alarm.

[0069] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention is described in detail with reference to the embodiments, it should be understood by those skilled in the art that any modification or equivalent replacement of the technical solutions of the present invention does not depart from the spirit and scope of the technical solutions of the present invention and should be included in the scope of the claims of the present invention.

Claims

1. A hepatobiliary surgical sensor system, characterized in that: The hepatobiliary surgery sensor system includes a temperature detection module, a vibration detection module, an image detection module and a central control unit; The temperature detection module is a temperature detection unit, the vibration detection module includes a vibration sensor and an accuracy enhancement unit, and the image detection module includes an image sensor and an image enhancement unit; The output end of the temperature detection unit is connected to the input end of the central control unit, the output end of the vibration sensor is connected to the input end of the precision enhancement unit, the output end of the precision enhancement unit is connected to the input end of the central control unit, the output end of the image sensor is connected to the input end of the image enhancement unit, and the output end of the image enhancement unit is connected to the input end of the central control unit.

2. The hepatobiliary surgery sensor system according to claim 1, characterized in that: The temperature detection unit is a wearable thermal detection device, which consists of four temperature sensors separated by materials with different thermal conductivities, wherein one temperature sensor is located at the center of the PCB board, two temperature sensors are located in the middle and edge of the PCB board, and the fourth sensor is located at the tip of the flexible contact patch, the edge of which is folded toward the center of the PCB board.

3. The hepatobiliary surgery sensor system according to claim 2, characterized in that: The temperature detection unit uses two temperature sensors to measure the heat flow perpendicular to the surface of human tissue, and the other two temperature sensors are used to calculate the lateral heat loss.

4. The hepatobiliary surgery sensor system according to claim 3, characterized in that: The temperature detection circuit arranged on the PCB board is as follows: one end of the resistor R1 is grounded, the other end of the resistor R1 is connected to one end of the resistor R2, the other end of the resistor R1 is also connected to one end of the resistor R3, one end of the resistor R5 is grounded, the other end of the resistor R5 is connected to one end of the resistor R6, the other end of the resistor R6 is connected to a first end of a temperature sensor (TS), the other end of the resistor R2 is connected to a second end of the temperature sensor (TS), the third end of the temperature sensor (TS) is connected to one end of the resistor R4, the other end of the resistor R4 is connected to a first end of another temperature sensor (TS), the other end of the resistor R3 is connected to a second end of another temperature sensor (TS), the third end of another temperature sensor (TS) is connected to one end of the resistor R7, and the other end of the resistor R7 is connected to an input end of a central control unit. The central control unit removes the lateral heat loss signals calculated by the other two temperature sensors from the temperature signal collected by the temperature detection circuit to obtain an accurate patient body temperature.

5. The hepatobiliary surgery sensor system according to claim 4, characterized in that: Each temperature sensor uses four equally sized PCB traces.

6. The hepatobiliary surgery sensor system according to claim 5, characterized in that: The temperature detection unit is a flat rigid-flexible assembly that is statically bent twice. During assembly, the circuit contact extending from the circular circuit area to the TS4 temperature sensor is bent twice by 90 degrees.

7. The hepatobiliary surgery sensor system according to claim 1, characterized in that: The vibration sensor is arranged on the patient's head, the output end of the vibration sensor is connected to the in-phase end of the operational amplifier A1, one end of the resistor R8 is grounded, the other end of the resistor R8 is connected to the inverting input end of the operational amplifier A1, the other end of the resistor R8 is connected to one end of the resistor R9, the output end of the operational amplifier A1 is connected to the in-phase input end of the operational amplifier A2, one end of the resistor R10 is grounded, the other end of the resistor R10 is connected to the inverting input end of the operational amplifier A2, one end of the resistor R11 is connected to the other end of the resistor R10, the other end of the resistor R11 is connected to the output end of the operational amplifier A2, the other end of the resistor R9 is connected to the output end of the operational amplifier A2, and the output end of the operational amplifier A2 is connected to the input end of the central control unit.

8. The hepatobiliary surgery sensor system according to claim 1, characterized in that: The image sensor is used to collect facial image information of the patient, and the image enhancement unit is used to enhance the clarity of the image collected by the image sensor; Step 1: Perform color / spatial domain adjustment on the image to complete the chromatic aberration correction of the image and obtain the reconstructed image: ； In the above formula, Rc is the intermediate result, Ic(p)-Ic(j) is two different brightness differences, d(p,j) represents the distance metric function, r(·) is the brightness performance function, which must be an odd function. This step can adapt to the local image contrast. r(·) can amplify smaller differences and enrich larger differences, expanding or compressing the dynamic range according to the local content. ； In the above formula, T is the period parameter; Step 2: Dynamically expand the corrected image, where ； In the above formula, w represents the line segment [(0,m c ),(255,M c )], and has a slope of min[R c (p)],M c =max[R c (p)]; Step 3: Expand R(x) to [0,1] using the following formula to obtain the enhanced channel: .

Images