BT resin composition and application thereof

Abstract

The invention belongs to the technical field of packaging materials, and provides a BT resin composition and application thereof, the product comprises the following raw materials by mass: 20-50 parts of bismaleimide, 10-30 parts of cyanate ester resin, 20-40 parts of epoxy resin, 5-15 parts of polyphenyl ether resin, and 5-15 parts of a modified component. The resin composition provided by the invention has a special resin formula, ensures low electrical loss, reduces low dielectric constant and dielectric loss, improves electrical performance, and is suitable for high-frequency application. Through optimized component design, the resin has good damp and hot stability, the performance of the resin under damp and hot conditions is enhanced, and the service life of the product is prolonged; the modified component is introduced to improve the flowability of the resin, so that the resin has excellent processability. The resin composition has excellent heat resistance and high heat distortion temperature, improves the heat resistance of the IC packaging substrate, ensures the stability of the IC packaging substrate in a high-temperature environment, and is suitable for the high-temperature environment.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging materials, and in particular to a BT resin composition and application thereof. Background Art

[0002] With the rapid development of the electronics industry, the performance requirements of integrated circuit (IC) packaging substrates are getting higher and higher, especially in terms of heat resistance, moisture and heat resistance, dielectric properties, etc. Traditional resin materials often cannot meet the high performance requirements of modern IC packaging substrates, so a new resin composition is urgently needed to improve the overall performance of packaging substrates. Summary of the invention

[0003] The purpose of the present invention is to overcome the defects in the prior art and provide a BT resin composition and application thereof.

[0004] In order to achieve the above-mentioned object of the invention, the present invention provides the following technical solutions:

[0005] The present invention provides a BT resin composition, comprising the following raw materials in parts by weight:

[0006] 20-50 parts of bismaleimide, 10-30 parts of cyanate resin, 20-40 parts of epoxy resin, 5-15 parts of polyphenylene ether resin, and 5-15 parts of modified component.

[0007] Preferably, the bismaleimide comprises one or more of N,N-4,4-diphenylmethane bismaleimide, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethane bismaleimide, 4-methyl-1,3-phenyl bismaleimide, meta-phenylene bismaleimide, bisphenol A diphenyl ether type bismaleimide, alkyl diphenylmethane type bismaleimide, polymeric polyamine type maleimide, aromatic polymeric polymaleimide, long-chain flexible maleimide, isocyanuric acid bismaleimide and benzoxazine bismaleimide.

[0008] Preferably, the cyanate ester resin comprises one or more of bisphenol A cyanate ester resin, bisphenol E cyanate ester resin, bisphenol F cyanate ester resin, bisphenol M cyanate ester resin, dicyclopentadiene cyanate ester resin, tetramethyl bisphenol F cyanate ester resin and multifunctional cyanate ester resin.

[0009] Preferably, the epoxy resin comprises one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, phenol novolac epoxy resin, o-cresol novolac epoxy resin, bisphenol A novolac epoxy resin, phenol biphenyl epoxy resin, phenol aromatic hydrocarbon epoxy resin, naphthalene type epoxy resin, dicyclopentadiene phenol epoxy resin, crystalline epoxy resin, triphenylmethane type epoxy resin and trisphenol methane type epoxy resin.

[0010] Preferably, the polyphenylene ether resin comprises a dihydroxyl-terminated polyphenylene ether resin and / or an olefin-modified polyphenylene ether resin.

[0011] Preferably, the molecular weight of the double-end hydroxyl-terminated polyphenylene ether resin is 2000-2400, and the hydroxyl equivalent is 1000-1200 g / mol;

[0012] The molecular weight of the alkenyl-modified polyphenylene ether resin is 2400-2600, and the alkenyl equivalent is 1200-1300 g / mol.

[0013] Preferably, the modifying component comprises polyethersulfone and / or an allyl compound.

[0014] The present invention also provides application of the BT resin composition in an IC packaging substrate.

[0015] The present invention provides a BT resin composition, comprising the following raw materials in parts by mass: 20 to 50 parts of bismaleimide, 10 to 30 parts of cyanate resin, 20 to 40 parts of epoxy resin, 5 to 15 parts of polyphenylene ether resin, and 5 to 15 parts of modified components. The resin composition provided by the present invention has a special resin formula, which ensures low electrical loss, reduces the low dielectric constant and dielectric loss, improves electrical performance, and is suitable for high-frequency applications. After optimized component design, it has good wet heat stability, enhances the performance of the resin under wet heat conditions, and extends the service life of the product; the introduction of modified components improves the fluidity of the resin, so that it has excellent processability and is easy to mold and process. The resin composition has excellent heat resistance and a high heat deformation temperature, improves the heat resistance of the IC packaging substrate, ensures its stability in a high temperature environment, and is suitable for a high temperature environment. DETAILED DESCRIPTION

[0016] The present invention provides a BT resin composition, comprising the following raw materials in parts by weight:

[0017] 20-50 parts of bismaleimide, 10-30 parts of cyanate resin, 20-40 parts of epoxy resin, 5-15 parts of polyphenylene ether resin, and 5-15 parts of modified component.

[0018] In the present invention, the weight fraction of the bismaleimide is preferably 25 to 45 parts, more preferably 30 to 40 parts, and even more preferably 34 to 36 parts.

[0019] In the present invention, the mass fraction of the cyanate ester resin is preferably 12 to 28 parts, more preferably 14 to 26 parts, and even more preferably 18 to 22 parts.

[0020] In the present invention, the weight percentage of the epoxy resin is preferably 25 to 35 parts, more preferably 26 to 34 parts, and even more preferably 28 to 32 parts.

[0021] In the present invention, the mass fraction of the polyphenylene ether resin is preferably 6 to 14 parts, more preferably 7 to 13 parts, and even more preferably 9 to 11 parts.

[0022] In the present invention, the mass fraction of the modifying component is preferably 6 to 14 parts, more preferably 7 to 13 parts, and even more preferably 9 to 11 parts.

[0023] In the present invention, the bismaleimide comprises one or more of N,N-4,4-diphenylmethane bismaleimide, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethane bismaleimide, 4-methyl-1,3-phenyl bismaleimide, metaphenylene bismaleimide, bisphenol A diphenyl ether type bismaleimide, alkyl diphenylmethane type bismaleimide, polymerized polyamine type maleimide, aromatic polymerized polymaleimide, long-chain flexible maleimide, isocyanurate-based bismaleimide and benzoxazine-based bismaleimide.

[0024] In the present invention, the cyanate resin comprises one or more of bisphenol A cyanate resin, bisphenol E cyanate resin, bisphenol F cyanate resin, bisphenol M cyanate resin, dicyclopentadiene cyanate resin, tetramethyl bisphenol F cyanate resin and multifunctional cyanate resin.

[0025] In the present invention, the epoxy resin comprises one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, phenol novolac epoxy resin, o-cresol novolac epoxy resin, bisphenol A novolac epoxy resin, phenol biphenyl epoxy resin, phenol aromatic hydrocarbon epoxy resin, naphthalene type epoxy resin, dicyclopentadiene phenol epoxy resin, crystalline epoxy resin, triphenylmethane type epoxy resin and trisphenol methane type epoxy resin.

[0026] In the present invention, the polyphenylene ether resin comprises a dihydroxyl-terminated polyphenylene ether resin and / or an olefin-modified polyphenylene ether resin.

[0027] In the present invention, the molecular weight of the double-end hydroxyl-terminated polyphenylene ether resin is preferably 2000-2400, more preferably 2100-2300, more preferably 2150-2250; the hydroxyl equivalent is preferably 1000-1200 g / mol, more preferably 1050-1150 g / mol, more preferably 1080-1120 g / mol.

[0028] In the present invention, the molecular weight of the alkenyl-modified polyphenylene ether resin is preferably 2400-2600, more preferably 2450-2550, more preferably 2480-2520, and the alkenyl equivalent is preferably 1200-1300 g / mol, more preferably 1220-1280 g / mol, more preferably 1240-1260 g / mol.

[0029] In the present invention, the polyphenylene ether resin is purchased from Shaanxi Shuobo Electronic Materials Co., Ltd. The model of the double-terminal hydroxyl-terminated polyphenylene ether resin is SEM-12, and the model of the olefin-modified polyphenylene ether resin is SEM-13.

[0030] In the present invention, the modifying component comprises polyethersulfone and / or an allyl compound.

[0031] In the present invention, the allyl compound includes one or more of allyl bisphenol A, allyl glycidyl ether and allyl trimethoxysilane.

[0032] In the present invention, the allyl bisphenol A includes one or more of monoallyl bisphenol A, bisallyl bisphenol A, allyl bisphenol A polymer, and modified allyl bisphenol A.

[0033] The present invention also provides application of the BT resin composition in an IC packaging substrate.

[0034] The technical solutions provided by the present invention are described in detail below in conjunction with the embodiments, but they should not be construed as limiting the protection scope of the present invention.

[0035] Example 1

[0036] The raw materials of BT resin composition are as follows:

[0037] 30 parts of N,N-4,4-diphenylmethane bismaleimide, 15 parts of bisphenol A type cyanate resin, 15 parts of bisphenol A epoxy resin, 10 parts of double-terminated hydroxyl-terminated polyphenylene ether resin (molecular weight 2200, hydroxyl equivalent 1100 g / mol, SEM-12), and 15 parts of polyether sulfone.

[0038] The above raw materials are mixed evenly in a solvent (a mixed solvent of dimethylformamide and toluene, with a volume ratio of dimethylformamide to toluene of 60:40) to obtain a BT resin composition solution.

[0039] Example 2

[0040] The raw materials of BT resin composition are as follows:

[0041] 25 parts of bismaleimide (the masses of 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethane bismaleimide and 4-methyl-1,3-phenyl bismaleimide are equal), 20 parts of bisphenol E type cyanate resin, 35 parts of epoxy resin (the masses of bisphenol F epoxy resin and phenol novolac epoxy resin are equal), 10 parts of alkenyl modified polyphenylene ether resin (molecular weight 2500, alkenyl equivalent 1280 g / mol, SEM-13), and 10 parts of allyl compound (the masses of monoallyl bisphenol A and bisallyl bisphenol A are equal).

[0042] The above raw materials are mixed evenly in a solvent (a mixed solvent of dimethylformamide and toluene, with a volume ratio of dimethylformamide to toluene of 60:40) to obtain a BT resin composition solution.

[0043] Example 3

[0044] The raw materials of BT resin composition are as follows:

[0045] 35 parts of bismaleimide (the masses of meta-phenylene bismaleimide and bisphenol A diphenyl ether bismaleimide are equal), 15 parts of bisphenol F type cyanate resin, 25 parts of epoxy resin (the masses of o-cresol epoxy resin, bisphenol A novolac epoxy resin and phenol biphenyl epoxy resin are equal), 15 parts of double-terminated hydroxyl-terminated polyphenylene ether resin (molecular weight 2300, hydroxyl equivalent 1150g / mol, SEM-12), and 10 parts of polyether sulfone.

[0046] The above raw materials are mixed evenly in a solvent (a mixed solvent of dimethylformamide and toluene, with a volume ratio of dimethylformamide to toluene of 60:40) to obtain a BT resin composition solution.

[0047] Example 4

[0048] The raw materials of BT resin composition are as follows:

[0049] 20 parts of bismaleimide (alkyl diphenylmethane type bismaleimide, polymerized polyamine type maleimide and aromatic polymerized polymaleimide are of equal mass), 30 parts of bisphenol M type cyanate resin, 40 parts of epoxy resin (phenol aromatic alkane epoxy resin, naphthalene type epoxy resin and dicyclopentadiene phenol epoxy resin are of equal mass), 5 parts of alkenyl modified polyphenylene ether resin (molecular weight 2470, alkenyl equivalent 1240 g / mol, SEM-13), and 5 parts of polyether sulfone.

[0050] The above raw materials are mixed evenly in a solvent (a mixed solvent of dimethylformamide and toluene, with a volume ratio of dimethylformamide to toluene of 60:40) to obtain a BT resin composition solution.

[0051] Example 5

[0052] The raw materials of BT resin composition are as follows:

[0053] 40 parts of bismaleimide (long-chain flexible maleimide, isocyanurate bismaleimide and benzoxazine bismaleimide are of equal mass), 10 parts of cyanate resin (dicyclopentadiene type cyanate resin and tetramethyl bisphenol F type cyanate resin are of equal mass), 25 parts of epoxy resin (crystalline epoxy resin, triphenylmethane type epoxy resin and trisphenol methane type epoxy resin are of equal mass), 15 parts of double-terminated hydroxyl-terminated polyphenylene ether resin (molecular weight 2200, hydroxyl equivalent 1200 g / mol, SEM-12), and 10 parts of allyl compounds (allyl glycidyl ether and monoallyl bisphenol A are of equal mass).

[0054] The above raw materials are mixed evenly in a solvent (a mixed solvent of dimethylformamide and toluene, with a volume ratio of dimethylformamide to toluene of 60:40) to obtain a BT resin composition solution.

[0055] Performance Testing

[0056] Test objects: BT resin compositions of Examples 1 to 5 and BT resin compositions purchased from the market.

[0057] Test conditions: Glass transition temperature (Tg): thermal analyzer (DSC), heating rate 10℃ / min.

[0058] Heat Deflection Temperature (HDT): ASTM D648, 1.82MPa load.

[0059] Dielectric properties: dielectric constant and loss, tested at 1MHz and 10GHz.

[0060] Water absorption: ASTM D570, immersion for 24 hours.

[0061] Damp heat aging: Performance changes after aging for 500 hours at 85°C and 85% RH.

[0062] Mechanical properties: flexural strength and impact toughness.

[0063] The test results are recorded in Table 1.

[0064] Table 1 Performance test results

[0065]

[0066] From Table 1 we can see that:

[0067] (1) Heat resistance: The Tg and HDT of the examples of the present application are significantly higher than those of the control products on the market, indicating that the BT resin of the present application has better dimensional stability and mechanical properties under high temperature environment. In Example 5, due to the introduction of long-chain flexible maleimide, a certain degree of flexibility is maintained while maintaining a high crosslinking density.

[0068] (2) Electrical performance: The dielectric constant and loss of the embodiment of the present application at 1 MHz and 10 GHz are lower than those of the control product on the market, indicating that it is more suitable for IC packaging substrate applications for high-frequency signal transmission. The low dielectric loss of Example 5 is due to the synergistic effect of polyphenylene ether and trisphenol methane epoxy resin.

[0069] (3) Hygrothermal stability: The water absorption rate of the BT resin of the present application is significantly lower than that of the control product on the market, and the Tg retention rate after hygrothermal aging is as high as 97% to 100%, which is significantly better than the 85% of the control product on the market.

[0070] (4) Mechanical properties: The flexural strength and impact toughness are higher than those of the control products on the market, especially Example 5, which improves the toughness and strength thanks to the introduction of the double-terminal hydroxyl-terminated polyphenylene ether and the allyl compound.

[0071] As can be seen from the above embodiments, the resin composition provided by the present invention has a special resin formula, which ensures low electrical loss, reduces low dielectric constant and dielectric loss, improves electrical performance, and is suitable for high-frequency applications. After optimized component design, it has good wet heat stability, enhances the performance of the resin under wet heat conditions, and extends the service life of the product; the introduction of the modified component improves the fluidity of the resin, so that it has excellent processability and is easy to shape and process. The resin composition has excellent heat resistance, has a high heat deformation temperature, improves the heat resistance of the IC packaging substrate, ensures its stability in a high temperature environment, and is suitable for a high temperature environment.

[0072] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A BT resin composition, characterized in that Contains the following raw materials in parts by weight: 20-50 parts of bismaleimide, 10-30 parts of cyanate resin, 20-40 parts of epoxy resin, 5-15 parts of polyphenylene ether resin, and 5-15 parts of modified component.

2. The BT resin composition according to claim 1, characterized in that The bismaleimide comprises one or more of N,N-4,4-diphenylmethane bismaleimide, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethane bismaleimide, 4-methyl-1,3-phenyl bismaleimide, metaphenylene bismaleimide, bisphenol A diphenyl ether type bismaleimide, alkyl diphenylmethane type bismaleimide, polymerized polyamine type maleimide, aromatic polymerized polymaleimide, long-chain flexible maleimide, isocyanuric acid bismaleimide and benzoxazine bismaleimide.

3. The BT resin composition according to claim 1 or 2, characterized in that: The cyanate resin comprises one or more of bisphenol A cyanate resin, bisphenol E cyanate resin, bisphenol F cyanate resin, bisphenol M cyanate resin, dicyclopentadiene cyanate resin, tetramethyl bisphenol F cyanate resin and multifunctional cyanate resin.

4. The BT resin composition according to claim 3, characterized in that The epoxy resin comprises one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, phenol novolac epoxy resin, o-cresol novolac epoxy resin, bisphenol A novolac epoxy resin, phenol biphenyl epoxy resin, phenol aromatic hydrocarbon epoxy resin, naphthalene type epoxy resin, dicyclopentadiene phenol epoxy resin, crystalline epoxy resin, triphenylmethane type epoxy resin and trisphenol methane type epoxy resin.

5. The BT resin composition according to claim 1 or 4, characterized in that: The polyphenylene ether resin comprises a dihydroxyl-terminated polyphenylene ether resin and / or an olefin-modified polyphenylene ether resin.

6. The BT resin composition according to claim 5, characterized in that The molecular weight of the double-terminal hydroxyl-terminated polyphenylene ether resin is 2000-2400, and the hydroxyl equivalent is 1000-1200 g / mol; The molecular weight of the alkenyl-modified polyphenylene ether resin is 2400-2600, and the alkenyl equivalent is 1200-1300 g / mol.

7. The BT resin composition according to claim 1 or 6, characterized in that: The modifying component comprises polyethersulfone and / or an allyl compound.

8. Use of the BT resin composition according to any one of claims 1 to 7 in an IC packaging substrate.

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