A film capacitor whole machine thermal image monitoring and heat dissipation system and method

Abstract

The application discloses a kind of thin-film capacitor whole machine thermal image monitoring and heat dissipation system and method, belong to thin-film capacitor monitoring field, this system uses infrared thermal imaging technology to study the thermal state of thin-film capacitor whole machine, can be visualized imaging and real-time monitoring to the surface thermal state of thin-film capacitor whole machine when running, obtain the reliability temperature rise data when whole machine runs, simultaneously for guaranteeing whole machine reliable operation, prevent the harm caused by temperature being too high, using heat dissipation device to effectively heat dissipation to it;In addition, considering that infrared CCD is precision instrument, the temperature of its working environment influences its imaging effect, therefore infrared CCD is set to intelligent heat dissipation system and is cooled in time to reduce dark current noise, improve image quality;In conclusion, the system structure provided by the application is simple, monitoring and heat dissipation method is convenient and effective, and operability is strong.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of thin film capacitor monitoring, and more particularly relates to a thin film capacitor whole machine thermal image monitoring and heat dissipation system and method. BACKGROUND

[0002] The thin film capacitor whole machine plays a key role in filtering, energy storage and voltage stabilization in electronic equipment. During operation, when the current borne by the capacitor exceeds its rated value, heat will be generated due to internal resistance, and there will be certain internal losses during the charging and discharging process of the capacitor. These losses are converted into heat. Over time, the internal materials of the capacitor may age, leading to a decrease in its performance, including heat dissipation performance, etc., which will cause the operating temperature of the whole machine to rise. If the operating temperature of the whole machine is too high, it may accelerate the aging process of the internal materials of the thin film capacitor, reduce its service life, cause the internal chemical reaction of the capacitor to accelerate, form thermal runaway, further increase the temperature, affect the dielectric properties of the thin film capacitor, cause its capacity to decrease or its loss to increase, cause thermal expansion of the internal or external structure of the capacitor, affect its mechanical stability, reduce the insulation resistance of the capacitor, increase the leakage current, and even cause insulation breakdown, reduce its self-healing function, affect the connection stability of the capacitor terminals or solder joints, and cause poor contact or disconnection. In extreme cases, high temperature may cause the capacitor to rupture, catch fire or other forms of failure, posing a safety hazard. SUMMARY

[0003] In view of the above defects or improvement needs of the prior art, the present application provides a thin film capacitor whole machine thermal image monitoring and heat dissipation system and method, which can ensure the stable and reliable operation of the thin film capacitor and the whole machine.

[0004] To achieve the above-mentioned purpose, according to the first aspect of the present application, a thin film capacitor whole machine thermal image monitoring and heat dissipation system is provided, comprising a first intelligent heat dissipation system and a second intelligent heat dissipation system.

[0005] The first intelligent heat dissipation system comprises an infrared lens, an infrared CCD, a thermal imaging device, a thermal imaging monitor, an infrared photographing device, an upper computer, a microprocessor and a first cooling device.

[0006] The infrared lens is used to collect the infrared radiation signal of the target thin film capacitor; the infrared CCD is used to convert the infrared radiation signal into an electrical signal; the thermal imaging device is used to process the electrical signal to obtain a thermal image of the target thin film capacitor; the thermal imaging monitor is used to analyze the thermal image to obtain the operating temperature of the target thin film capacitor; and the upper computer is used to control the first cooling device to cool the target thin film capacitor through the microprocessor when the operating temperature of the target thin film capacitor exceeds a first threshold value.

[0007] The second intelligent heat dissipation system comprises a temperature sensor, a microcontroller and a second cooling device.

[0008] The temperature sensor is configured to detect the working temperature of the infrared CCD, and the microcontroller is configured to control the second cooling device to cool the infrared CCD when the working temperature of the infrared CCD exceeds a second threshold value.

[0009] According to a second aspect of the present application, a thin-film capacitor whole machine thermal image monitoring and heat dissipation method is provided, which is applied to the thin-film capacitor whole machine thermal image monitoring and heat dissipation system as described in the first aspect, and comprises the following steps of:

[0010] The working temperature of the target thin-film capacitor is monitored in real time, and the first cooling device is controlled by the microprocessor to cool the target thin-film capacitor when the working temperature exceeds a first threshold value;

[0011] The working temperature of the infrared CCD is monitored in real time, and the second cooling device is controlled to cool the infrared CCD when the working temperature exceeds a second threshold value.

[0012] Overall, compared with the prior art, the above technical solutions conceived by the present application can achieve the following beneficial effects:

[0013] The system provided by the present application uses infrared thermal imaging technology to study the thermal state of the thin-film capacitor whole machine, designs a non-contact and high-sensitivity temperature measurement method, can monitor the temperature distribution change and thermal state of the thin-film capacitor whole machine in real time, and record thermal image information, provides instant feedback for thermal design and fault diagnosis; through visual imaging and real-time monitoring of the surface thermal state of the thin-film capacitor whole machine during operation, reliable temperature rise data during operation of the whole machine is obtained, at the same time, to ensure reliable operation of the whole machine and prevent harm caused by excessive temperature, the designed heat dissipation device can effectively dissipate heat; in addition, considering that the infrared CCD is a precision instrument, the temperature of its working environment affects its imaging effect, therefore, an intelligent heat dissipation system for the infrared CCD is set to cool it in time, to reduce dark current noise and improve image quality; in summary, the system provided by the present application has simple structure, convenient and effective monitoring and heat dissipation method, and strong operability.

[0014] Further, the method provided by the present application uses a cooling liquid circulating device to cool the thin-film capacitor whole machine, which can effectively absorb and transmit a large amount of heat, and the circulating cooling liquid helps to uniformly distribute heat and avoid the generation of local hot spots. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 A schematic diagram of the thin-film capacitor whole machine thermal image monitoring and heat dissipation system provided by the embodiment of the present application is shown in the figure;

[0016] Figure 2A flowchart of a thin-film capacitor whole machine thermal image monitoring and heat dissipation method is provided. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application and do not limit the present application. In addition, the technical features involved in each embodiment of the present application described below can be combined with each other as long as they do not conflict with each other.

[0018] In order to ensure the stable and reliable operation of the thin-film capacitor and the whole machine, appropriate heat dissipation measures need to be taken, so there is an urgent need for a thin-film capacitor whole machine thermal image monitoring and heat dissipation method, which is of great significance to the reliability of the thin-film capacitor whole machine operation. Based on this, the present application provides a thin-film capacitor whole machine thermal image monitoring and heat dissipation system, as shown in Figure 1 , which comprises a first intelligent heat dissipation system and a second intelligent heat dissipation system.

[0019] The first intelligent heat dissipation system comprises an infrared lens, an infrared CCD, a thermal image device, a thermal image monitor, an infrared photographing device, an upper computer, a microprocessor and a first cooling device.

[0020] The infrared lens is used to collect the infrared radiation signal of the target thin-film capacitor; the infrared CCD is used to convert the infrared radiation signal into an electric signal; the thermal image device is used to process the electric signal to obtain a thermal image of the target thin-film capacitor; the thermal image monitor is used to analyze the thermal image to obtain the working temperature of the target thin-film capacitor; and the upper computer is used to control the first cooling device to cool the target thin-film capacitor through the microprocessor when the working temperature of the target thin-film capacitor exceeds a first threshold value.

[0021] The second intelligent heat dissipation system comprises a temperature sensor, a microcontroller and a second cooling device.

[0022] The temperature sensor is used to detect the working temperature of the infrared CCD, and the microcontroller is used to control the second cooling device to cool the infrared CCD when the working temperature of the infrared CCD exceeds a second threshold value.

[0023] Preferably, the upper computer is further used to display the working temperature of the target thin-film capacitor.

[0024] Preferably, the first intelligent heat dissipation system further comprises an infrared photographing device, which is used to analyze the thermal image to obtain the heat distribution of the target thin-film capacitor and transmit it to the upper computer for user to view.

[0025] Preferably, the working temperature of the target thin-film capacitor is the highest temperature of the surface of the whole machine.

[0026] Preferably, the first cooling device is a cooling liquid circulation device.

[0027] Preferably, the second cooling device is a thermoelectric refrigerator.

[0028] In particular, the thin-film capacitor whole machine thermal image monitoring and heat dissipation system provided by the embodiments of the present application comprises an infrared lens, an infrared CCD, a temperature sensor, a single-chip microcontroller, a thermoelectric refrigerator, a thermal imaging device, an infrared photographing device, a thermal image monitor, an upper computer, a microprocessor, and a cooling liquid circulation device, wherein:

[0029] The infrared lens is used for infrared imaging and can transmit infrared radiation of a specific wavelength, thereby optimizing the light transmission and imaging quality of the infrared waveband.

[0030] The infrared CCD is an imaging sensor for detecting infrared radiation and can convert infrared radiation into an electrical signal.

[0031] The temperature sensor is used for detecting the working temperature of the infrared CCD and outputting a temperature signal to the single-chip microcontroller.

[0032] The single-chip microcontroller receives the signal of the temperature sensor and outputs a control signal to the thermoelectric refrigerator to make it perform cooling treatment on the infrared CCD when the working temperature of the infrared CCD exceeds a set threshold.

[0033] The thermoelectric refrigerator performs cooling treatment on the infrared CCD after receiving the signal of the single-chip microcontroller, thereby reducing dark current noise and improving image quality.

[0034] The thermal imaging device processes the infrared radiation electrical signal to obtain a visual thermal image; and the infrared photographing device monitors the infrared image and records the thermal distribution.

[0035] The thermal image monitor monitors the temperature change and thermal state of the device to be measured in real time.

[0036] The upper computer allows a user to operate the photographing system, such as adjusting settings, viewing images, and the like, and presents the infrared thermal image information of the device in real time and controls the microprocessor to control the cooling liquid circulation device.

[0037] The microprocessor receives the signal of the upper computer and outputs a signal to the cooling liquid circulation device.

[0038] The cooling liquid circulation device receives the signal of the microprocessor and transfers the heat generated by the device to perform cooling and heat dissipation.

[0039] The embodiment of the present application provides a thin-film capacitor whole machine thermal image monitoring and heat dissipation method, which is applied to the thin-film capacitor whole machine thermal image monitoring and heat dissipation system as described in any of the above embodiments, and comprises the following steps.

[0040] The working temperature of the target thin-film capacitor is monitored in real time, and when the working temperature exceeds a first threshold value, the first cooling device is controlled by a microprocessor to cool the target thin-film capacitor.

[0041] The working temperature of the infrared CCD is monitored in real time, and when the working temperature exceeds a second threshold value, the second cooling device is controlled to cool the infrared CCD.

[0042] Specifically, the method provided by the present application comprises the following steps.

[0043] (1) A target thin-film capacitor whole machine device is prepared, and the device is started to run. Loop connection is performed to start various device devices.

[0044] (2) The infrared imaging lens is started, and the appropriate focal length is adjusted to accurately and effectively collect the infrared radiation signal of the target thin-film capacitor.

[0045] (3) The infrared CCD, i.e., the infrared imaging sensor, is started to detect the infrared radiation energy signal emitted by the target thin-film capacitor, and the infrared radiation signal is converted into an electric signal.

[0046] (4) The temperature sensor monitors the working temperature state of the infrared CCD in real time, and transmits the temperature signal to the single-chip microcontroller. The single-chip microcontroller receives the temperature signal, performs temperature setting judgment, and when the set temperature T0 (i.e., the first threshold value) is reached, controls the thermoelectric refrigerator, so that the thermoelectric refrigerator acts on the infrared CCD sensor to perform cooling processing, reduces the dark current noise, and improves the image quality.

[0047] (5) The thermal imaging device receives the infrared radiation electric signal and processes it to obtain a visual thermal image, which is transmitted to the thermal image monitor.

[0048] (6) The thermal image monitor receives the thermal image and collects it, monitors the temperature change and thermal state of the device to be measured in real time, and transmits them to the user upper computer interface.

[0049] (7) The user upper computer interface presents the real-time device working temperature change and thermal state image. The threshold temperature T1 (i.e., the second threshold value) of the device running is set, whether the threshold temperature is exceeded is judged, and the cooling liquid circulating device is controlled by the microprocessor. When the threshold temperature T1 is exceeded, the microprocessor receives the upper computer signal and outputs the signal to the cooling liquid circulating device.

[0050] (8) The cooling liquid circulating device starts the pump or other driving equipment to make the cooling liquid start flowing in the circulating system to absorb the heat generated by the equipment, thereby cooling the thin film capacitor.

[0051] For example, assuming that the initial ambient temperature is 25℃, when the work is running, the host computer can monitor the thermal state image of the target thin film capacitor and the temperature rise in real time. Set T0 to 60℃, when the temperature of the infrared CCD sensor exceeds 60℃, the single-chip microcomputer controls the thermoelectric refrigerator to cool it to 10℃. Set T1 to 70℃, when the host computer detects that the highest temperature on the surface of the whole machine exceeds 70℃, start the microprocessor to control the cooling liquid circulating device to cool the thin film capacitor to 30℃.

[0052] Preferably, when the first cooling device is a cooling liquid circulating device, and the working temperature of the target thin film capacitor exceeds the first threshold value, the flow rate of the cooling liquid in the cooling liquid circulating device is proportional to the percentage of the working temperature of the target thin film capacitor exceeding the first threshold value.

[0053] Specifically, through the control system, the flow rate and temperature of the cooling liquid can be accurately adjusted to adapt to different heat dissipation needs, for example, set a maximum temperature threshold, when the temperature exceeds 60℃, it is considered that the flow rate needs to be adjusted, when the temperature exceeds 10% of 70℃ (i.e. 77℃), start to adjust the flow rate, increase the flow rate of the cooling liquid by 10%; set a minimum temperature threshold, when the temperature drops to 40℃, it is considered that the flow rate needs to be adjusted, when the temperature drops to 90% of 30℃ (i.e. 27℃), start to adjust the flow rate, reduce the flow rate of the cooling liquid by 10%.

[0054] Those skilled in the art will readily understand that the above description is only the preferred embodiment of the present application, and is not intended to limit the present application, any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A thermal imaging monitoring and heat dissipation system for a thin-film capacitor, characterized in that, Including the first intelligent cooling system and the second intelligent cooling system; The first intelligent heat dissipation system includes an infrared lens, an infrared CCD, a thermal imaging device, a thermal imaging monitor, an infrared imaging device, a host computer, a microprocessor, and a first cooling device; The infrared lens is used to acquire infrared radiation signals from the target thin-film capacitor; the infrared CCD is used to convert the infrared radiation signals into electrical signals; the thermal imaging device is used to process the electrical signals to obtain a thermal image of the target thin-film capacitor; the thermal imaging monitor is used to analyze the thermal image to obtain the operating temperature of the target thin-film capacitor; and the host computer is used to control the first cooling device to cool the target thin-film capacitor via a microprocessor when the operating temperature of the target thin-film capacitor exceeds a first threshold. The second intelligent heat dissipation system includes a temperature sensor, a microcontroller, and a second cooling device; The temperature sensor is used to detect the operating temperature of the infrared CCD, and the microcontroller is used to control the second cooling device to cool the infrared CCD when the operating temperature of the infrared CCD exceeds a second threshold.

2. The system as described in claim 1, characterized in that, The host computer is also used to display the operating temperature of the target thin-film capacitor.

3. The system as described in claim 1 or 2, characterized in that, The first intelligent heat dissipation system also includes an infrared imaging device for analyzing the thermal image to obtain the thermal distribution of the target thin-film capacitor and transmitting it to the host computer.

4. The system as described in claim 3, characterized in that, The operating temperature of the target thin-film capacitor is the highest temperature on the surface of its entire device.

5. The system as described in claim 1, characterized in that, The first cooling device is a coolant circulation device.

6. The system as described in claim 1, characterized in that, The second cooling device is a thermoelectric cooler.

7. A method for thermal imaging monitoring and heat dissipation of a thin-film capacitor, applied to the thermal imaging monitoring and heat dissipation system for a thin-film capacitor as described in any one of claims 1-6, characterized in that, include: The operating temperature of the target film capacitor is monitored in real time, and when it exceeds a first threshold, the first cooling device is controlled by the microprocessor to cool the target film capacitor. The operating temperature of the infrared CCD is monitored in real time, and when it exceeds the second threshold, the second cooling device is controlled to cool the infrared CCD.

8. The method as described in claim 7, characterized in that, When the first cooling device is a coolant circulation device, and the operating temperature of the target film capacitor exceeds a first threshold, the coolant flow rate in the coolant circulation device is proportional to the percentage by which the operating temperature of the target film capacitor exceeds the first threshold.

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