SAC lens lamination defect detection method and device, electronic equipment and storage medium

Abstract

The embodiment of the invention discloses an SAC lens lamination defect detection method and device, electronic equipment and a storage medium, and the method comprises the steps: obtaining a device image of a to-be-detected device after a lamination process, carrying out the preprocessing of the device image, obtaining the position information of each SAC lens in the device image, and carrying out the detection of the lamination defect of each SAC lens based on the position information, and performing anomaly analysis on the target SAC lens to obtain an analysis result, the target SAC lens being any one of the plurality of SAC lenses, and determining defect information of the target SAC lens based on the analysis result. By adopting the embodiment of the invention, not only can the comprehensive defect detection be performed on the to-be-detected device after the laminating process be performed, but also the detection efficiency of the laminating defect of the SAC lens can be effectively improved.

Description

Technical Field

[0001] The present application relates to the field of fiber laser technology, and in particular to a SAC lens bonding defect detection method, device, electronic device and storage medium. Background Art

[0002] During the production process of fiber laser, SAC lens (slow axis collimation lens) needs to be pasted into the laser. The pasting process of SAC lens directly affects the output power of fiber laser. Therefore, it is necessary to perform defect detection on the device after SAC lens pasting to ensure that the fiber laser finally produced can meet the production requirements.

[0003] In the related art, defect detection of devices after SAC lens bonding is usually carried out by manual visual inspection. However, manual visual inspection requires operators to inspect the devices through a microscope, which not only affects the inspection efficiency, but also causes damage to the human eye if the microscope is operated for a long time. At the same time, the SAC lens bonding capacity is large. If operators only use manual visual inspection to detect defects, they can only do so by random inspection, which makes it impossible to prevent defective devices from flowing into the next process, ultimately affecting the qualified rate of the produced fiber lasers.

[0004] Therefore, how to perform comprehensive defect detection on devices after SAC lens bonding while improving detection efficiency has become a technical problem that needs to be solved urgently. Summary of the invention

[0005] The embodiments of the present application provide a method, device, electronic device and storage medium for detecting defects in SAC lens bonding, so as to solve the technical problems that it is impossible to fully detect the device after SAC lens bonding and the detection efficiency is low.

[0006] In the first aspect, in order to solve the above technical problems, the embodiment of the present application provides a SAC lens lamination defect detection method, comprising the following steps:

[0007] Acquire a device image of the device to be inspected after the bonding process, wherein the device to be inspected includes a plurality of SAC lenses;

[0008] Preprocessing the device image to obtain position information of each SAC lens in the device image;

[0009] Based on the position information, an abnormality analysis is performed on a target SAC lens to obtain an analysis result, wherein the target SAC lens is any one of the multiple SAC lenses;

[0010] Based on the analysis result, defect information of the target SAC lens is determined.

[0011] In an embodiment of the present invention, the step of preprocessing the device image to obtain the position information of each SAC lens in the device image includes:

[0012] constructing a rectangular coordinate system in the device image;

[0013] The coordinate point information of each SAC lens in the rectangular coordinate system is determined, and the coordinate point information is used as the position information of each SAC lens.

[0014] In an embodiment of the present invention, the step of performing abnormality analysis on the target SAC lens based on the position information to obtain an analysis result includes:

[0015] Determine, according to the first position information of the target SAC lens, a difference between two endpoints of a first side of the target SAC lens, where the first side is any side constituting the target SAC lens;

[0016] In a case where the difference does not satisfy a standard difference threshold corresponding to the first side, a first analysis result of abnormal analysis of the target SAC lens is determined.

[0017] In an embodiment of the present invention, the step of performing abnormality analysis on the target SAC lens based on the position information to obtain an analysis result further includes:

[0018] According to the position information, determine a standard line on which each SAC lens is arranged on the device to be detected, wherein the standard line is a straight line on which at least half of the second sides of the SAC lenses are located, and the second sides are any sides constituting the SAC lenses;

[0019] In a case where the second side of the target SAC lens is not on the standard line, a second analysis result of abnormal analysis of the target SAC lens is determined.

[0020] In an embodiment of the present invention, after the step of determining the coordinate point information of each SAC lens in the rectangular coordinate system and using the coordinate point information as the position information of each SAC lens, the method further includes:

[0021] Performing grayscale processing on the device image to obtain a grayscale image corresponding to the device image;

[0022] The second position information of the glue is determined in the grayscale image.

[0023] In an embodiment of the present invention, the step of performing abnormality analysis on the target SAC lens based on the position information to obtain an analysis result includes:

[0024] Based on the first position information of the target SAC lens and the second position information of the glue, determine a first vertical distance between the farthest point in the glue from the second side of the target SAC lens and the SAC lens, and a second vertical distance between the closest point in the glue from the second side of the target SAC lens and the SAC lens;

[0025] In a case where the first vertical distance is greater than a preset glue coating vertical threshold, determining a third analysis result of abnormal analysis of the target SAC lens;

[0026] In a case where the second vertical distance is less than the glue coating vertical threshold, a fourth analysis result of abnormal analysis of the target SAC lens is determined.

[0027] In an embodiment of the present invention, the step of determining defect information of the target SAC lens based on the analysis result includes:

[0028] When the analysis result is the first analysis result, it is determined that the target SAC lens has a warping defect;

[0029] When the analysis result is the second analysis result, it is determined that the target SAC lens has a skew or offset defect;

[0030] When the analysis result is the third analysis result, it is determined that the target SAC lens has a defect of excessive glue coating;

[0031] When the analysis result is the fourth analysis result, it is determined that the target SAC lens has a defect of too little glue coating.

[0032] In the second aspect, in order to solve the same technical problem, the embodiment of the present application also provides a SAC lens lamination defect detection device, comprising:

[0033] An acquisition module, used for acquiring a device image of the device to be inspected after the bonding process, wherein the device to be inspected includes a plurality of SAC lenses;

[0034] A preprocessing module, used for preprocessing the device image to obtain position information of each SAC lens in the device image;

[0035] An analysis module, configured to perform an abnormality analysis on a target SAC lens based on the position information to obtain an analysis result, wherein the target SAC lens is any one of the plurality of SAC lenses;

[0036] A defect determination module is used to determine defect information of the target SAC lens based on the analysis result.

[0037] In a third aspect, an embodiment of the present invention provides an electronic device, comprising a processor, a memory, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of any one of the above-mentioned SAC lens fitting defect detection methods when executing the computer program.

[0038] In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in any one of the above-mentioned SAC lens fitting defect detection methods are implemented.

[0039] The embodiments of the present application provide a SAC lens bonding defect detection method, apparatus, electronic device and storage medium. By preprocessing the device image of the device to be detected after the bonding process, the position information of each SAC lens in the device image is obtained, so that each SAC lens can be directly analyzed for abnormalities according to the position information in the device image. Finally, the bonding defect detection of each SAC lens is determined based on the abnormal analysis results, avoiding the use of manual visual inspection to perform defect detection. This can not only improve the bonding defect detection efficiency of the SAC lens, but also achieve the purpose of comprehensive defect detection of the device after the SAC lens is bonded. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0041] Figure 1 It is a flow chart of a SAC lens lamination defect detection method provided by an embodiment of the present invention;

[0042] Figure 2 This is a flow chart of an abnormality analysis method provided by an embodiment of the present invention;

[0043] Figure 3a is a schematic diagram of a device image provided by an embodiment of the present invention;

[0044] Figure 3b is a second flow chart of the abnormality analysis method provided by an embodiment of the present invention;

[0045] Figure 4a is a schematic diagram of a device image provided by an embodiment of the present invention;

[0046] Figure 4bis a second flow chart of the abnormality analysis method provided by an embodiment of the present invention;

[0047] Figure 5 It is a structural schematic diagram of a SAC lens lamination defect detection device provided by an embodiment of the present invention;

[0048] Figure 6 is a structural schematic diagram of an electronic device provided by an embodiment of the present invention;

[0049] Figure 7 This is another structural schematic diagram of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0050] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0051] In the description of the present application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined. In the present application, " / " means "or".

[0052] The present application may repeat reference numerals and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0053] In the embodiment of the present invention, during the production process of the fiber laser, it is necessary to paste the SAC lens (slow axis collimation lens) in the laser. The pasting process of the SAC lens directly affects the output power of the fiber laser. Therefore, it is necessary to perform defect detection on the device after the SAC lens is pasted to ensure that the fiber laser finally produced can meet the production requirements.

[0054] In the related art, defect detection of devices after SAC lens bonding is usually carried out by manual visual inspection. However, manual visual inspection requires operators to inspect the devices through a microscope, which not only affects the inspection efficiency, but also causes damage to the human eye if the microscope is operated for a long time. At the same time, the SAC lens bonding capacity is large. If operators only use manual visual inspection to detect defects, they can only do so by random inspection, which makes it impossible to prevent defective devices from flowing into the next process, ultimately affecting the qualified rate of the produced fiber lasers.

[0055] Therefore, how to perform comprehensive defect detection on devices after SAC lens bonding while improving detection efficiency has become a technical problem that needs to be solved urgently.

[0056] In order to solve the above technical problems, the present application embodiment provides a SAC lens bonding defect detection method. For details, see Figure 1 , Figure 1 FIG. 1 is a flow chart of a method for detecting SAC lens lamination defects provided by an embodiment of the present invention. Figure 1 As shown, the SAC lens lamination defect detection method provided in this embodiment includes steps 101 to 104;

[0057] Step 101: Acquire a device image of a device to be inspected after a bonding process, wherein the device to be inspected includes a plurality of SAC lenses.

[0058] In this embodiment, in order to avoid the problems of low detection efficiency and harm to human eyes caused by manual visual inspection when detecting SAC lens fitting defects, this embodiment can use machine vision to detect SAC lens fitting defects instead of manual visual inspection, which not only avoids harm to human eyes but also improves detection efficiency.

[0059] Among them, this embodiment can use a camera to shoot the device to be tested after the bonding process in a direction perpendicular to the surface of the device to be tested, so as to obtain a device image of the device to be tested. It should be noted that this embodiment needs to shoot a device image including multiple SAC lenses to be tested, which can specifically include one SAC lens to be tested, or multiple SAC lenses to be tested. The number of SAC lenses included in the device image can be customized according to actual testing requirements, and is not specifically limited here.

[0060] Step 102: pre-process the device image to obtain position information of each SAC lens in the device image.

[0061] In this embodiment, in order to improve the detection efficiency of fitting defect detection of SAC lenses, after obtaining the device image of the device to be detected, this embodiment pre-processes the device image in advance to obtain the position information of each SAC lens in the device image, so as to facilitate the subsequent fitting defect detection of the SAC lens based on the position information obtained by preprocessing.

[0062] As an optional embodiment, this embodiment can construct a coordinate system in the device image to determine the position information of each SAC lens in the device image by means of a coordinate system. Specifically, the step of preprocessing the device image to obtain the position information of each SAC lens in the device image provided in this embodiment can include: constructing a rectangular coordinate system in the device image; determining the coordinate point information of each SAC lens in the rectangular coordinate system, and using the coordinate point information as the position information of each SAC lens.

[0063] In this embodiment, any position in the device image can be used as the origin to construct a rectangular coordinate system, so that the coordinate point information of each SAC lens can be determined through the constructed rectangular coordinate system.

[0064] As another optional embodiment, this embodiment can also identify the SAC lenses in the device image by image recognition, and then calculate the relative position information of the SAC lenses in the device image, and use this as the position information of each SAC lens.

[0065] Step 103: Based on the position information, perform an abnormality analysis on the target SAC lens to obtain an analysis result, wherein the target SAC lens is any one of the multiple SAC lenses.

[0066] Among them, the abnormal analysis provided in this embodiment is mainly to analyze the SAC lens after the bonding process to see whether there are abnormal problems in the position information. The position information where these abnormal problems occur can correspond to one of the bonding defects of the SAC lens, so that the specific bonding defects of the SAC lens can be determined based on the analysis results obtained by the abnormal analysis of the position information.

[0067] In some embodiments, see Figure 2 , Figure 2 is a flow chart of an abnormality analysis method provided by an embodiment of the present invention, such as Figure 2 As shown, the abnormality analysis method provided in this embodiment may include steps 201 to 202;

[0068] Step 201: determine the difference between two endpoints of a first side of the target SAC lens according to first position information of the target SAC lens, where the first side is any side constituting the target SAC lens.

[0069] After determining the position information of the SAC lens, this embodiment can select one of the SAC lenses as the target SAC lens, and obtain the first position information of the target SAC lens, such as its coordinate point information or relative position information, and then determine the difference between the two endpoints of the first side of the target SAC lens in the first position information, that is, calculate the length of the first side of the target SAC lens.

[0070] Step 202: When the difference does not satisfy the standard difference threshold corresponding to the first side, determine a first analysis result of abnormal analysis on the target SAC lens.

[0071] In this embodiment, in order to determine the specific bonding defects of the SAC lens, this embodiment can use the normal length range of the side length of the SAC lens after normal bonding specified in the bonding process standard corresponding to the SAC lens as the difference standard threshold corresponding to the first side to perform abnormal analysis on the first side of the target SAC lens. When it is determined that the difference, that is, the side length of the first side, does not meet the difference standard threshold corresponding to the first side, the analysis result of the abnormal analysis on the target SAC lens is determined to be the first analysis result with abnormality.

[0072] Optionally, when the difference, that is, the length of the first side, meets a standard difference threshold corresponding to the first side, it can be determined that there is no abnormality in the target SAC lens.

[0073] Among them, the first side provided in this embodiment is any side of the target SAC lens, but in order to improve the detection accuracy, this embodiment can determine the lengths of all sides of the target SAC lens to determine whether each side length meets the corresponding difference standard threshold, thereby judging whether there is any abnormality in the target SAC lens.

[0074] It should be noted that the bonding process of the SAC lens is mainly to bond the SAC lens with glue. If too much glue is applied under the SAC lens, the bonded SAC lens will have a warped edge defect, thereby affecting the final qualified rate of the finished product. Therefore, this embodiment can determine whether the target SAC lens is abnormal by determining whether the length of the first side of the target SAC lens does not meet the difference standard threshold corresponding to the first side; when the length of the first side of the target SAC lens is less than the difference standard threshold, it can be determined that the target SAC lens is warped due to excessive glue applied under the target SAC lens, so that the length of the first side does not meet the difference standard threshold corresponding to the first side, and then it can be determined that the target SAC lens is abnormal.

[0075] In other embodiments, see Figure 3a and Figure 3b , Figure 3a is a schematic diagram of a device image provided by an embodiment of the present invention, Figure 3b is a second flow chart of the abnormality analysis method provided by an embodiment of the present invention, such as Figure 3a and Figure 3b As shown, the abnormality analysis method provided in this embodiment may include steps 301 to 302;

[0076] Step 301, determining a standard line for arranging each SAC lens on the device to be detected according to the position information, wherein the standard line is a straight line where at least half of the second sides of the SAC lenses are located, and the second side is any side constituting the SAC lenses.

[0077] It should be noted that when there are multiple SAC lenses on the device to be detected provided in this embodiment, the multiple SAC lenses are arranged and adjacent to each other in sequence (that is, two adjacent SAC lenses share a common edge, and the edge is a side adjacent to the second side). Figure 3a The standard line provided in this embodiment is a straight line formed by connecting the second sides of most of the SAC lenses after a plurality of SAC lenses are arranged.

[0078] Among them, there is a situation where most (more than half) of the SAC lenses in the devices to be tested have bonding defects, that is, the second sides of most of the SAC lenses are not on the same straight line, then the second sides of the SAC lenses without bonding defects can be extended, and the second sides and their extension lines can be used as standard lines. Specifically, the SAC lenses without defects can be judged according to the corresponding bonding process standards, or by manual visual inspection.

[0079] Step 302: When the second side of the target SAC lens is not on the standard line, determine a second analysis result of abnormal analysis of the target SAC lens.

[0080] In this embodiment, in order to detect whether the target SAC lens has a skew or offset fitting defect, this embodiment can directly detect whether the second side of the target SAC lens is on the standard line. If the second side of the target SAC lens does not coincide with the standard line, it can be determined that the analysis result of the abnormal analysis of the target SAC lens is the second analysis result of the skew or offset fitting defect, such as Figure 3a Otherwise, it can be determined that the target SAC lens does not have any skew or offset fitting defects, such as Figure 3a The SAC lens is shown on the right.

[0081] Step 104: Determine defect information of the target SAC lens based on the analysis result.

[0082] In this embodiment, after obtaining different analysis results (the first analysis result and the second analysis result), this embodiment can determine the specific defect information of the target SAC lens based on the obtained analysis results. Specifically, the step of determining the defect information of the target SAC lens based on the analysis result provided in this embodiment may include: when the analysis result is the first analysis result, determining that the target SAC lens has a warping defect; when the analysis result is the second analysis result, determining that the target SAC lens has a skew or offset defect.

[0083] In this way, by performing an abnormal analysis on the position information of each SAC lens in the device image, it is possible to determine whether the target SAC lens in the device image has a fitting defect and determine the specific defect information. Compared with the manual visual inspection method, the embodiment of the present invention can not only realize comprehensive fitting defect detection, but also effectively improve the detection efficiency of fitting defect detection, while avoiding eye damage caused by long-term microscope operation, effectively ensuring the safety of the method provided by this embodiment.

[0084] In some embodiments, the situation that affects the output power of the fiber laser produced in the end is not only caused by the SAC lens being warped, skewed or offset, but also caused by the glue coating around the SAC lens overflowing to a range that does not meet the regulations during the SAC lens bonding process. Therefore, this embodiment also needs to detect whether the glue coating around the SAC lens in the device to be tested meets the regulations.

[0085] In order to detect whether the glue coated around the SAC lens in the device to be detected meets the requirements, this embodiment can, after the step of determining the coordinate point information of each SAC lens in the rectangular coordinate system and using the coordinate point information as the position information of each SAC lens, perform the following: grayscale processing on the device image to obtain a grayscale image corresponding to the device image; and determine the second position information of the glue in the grayscale image.

[0086] In this way, the grayscale image can effectively improve the accuracy of identifying the glue coating range, thereby ensuring the accuracy of SAC lens bonding defect detection. The grayscale processing method for the device image can be any grayscale processing method in the prior art, as long as it can highlight the specific coating range of the glue in the device image, and is not specifically limited here.

[0087] After obtaining a grayscale image that can highlight the specific coating range of the glue in the device image, the second position information of the glue in the grayscale image can be determined. The second position information of the glue can be determined by determining the coordinate point information in the above embodiment, or by image recognition and determining the relative position information of the recognized glue in the grayscale image. As long as the position information of the glue in the grayscale image can be determined, no specific limitation is made here.

[0088] For details, see Figure 4a and Figure 4b , Figure 4a is a schematic diagram of a device image provided by an embodiment of the present invention, Figure 4b is a second flow chart of the abnormality analysis method provided by an embodiment of the present invention, such as Figure 4a and Figure 4b As shown, the abnormality analysis method provided in this embodiment may include steps 401 to 402;

[0089] Step 401, based on the first position information of the target SAC lens and the second position information of the glue, determine the first vertical distance between the farthest point in the glue from the second side of the target SAC lens and the SAC lens, and the second vertical distance between the closest point in the glue from the second side of the target SAC lens and the SAC lens.

[0090] In this embodiment, in order to detect whether the overflow range of glue coated around the target SAC lens meets the requirements of the corresponding bonding process standards, this embodiment needs to first determine the farthest point in the glue coating range at a vertical distance from the second side of the target SAC lens, and the first vertical distance from the second side of the target SAC lens, as well as determine the nearest point in the glue coating range at a vertical distance from the second side of the target SAC lens, and the second vertical distance from the second side of the target SAC lens, that is, determine the farthest point and the nearest point in the glue coating range, and the distance from the edge of the target SAC lens.

[0091] Step 402: When the first vertical distance is greater than a preset glue coating vertical threshold, determine a third analysis result of abnormal analysis on the target SAC lens.

[0092] Step 403: When the second vertical distance is less than the glue coating vertical threshold, determine a fourth analysis result of abnormal analysis on the target SAC lens.

[0093] After determining the glue coating vertical threshold value specified in the bonding process standard corresponding to the target SAC lens, by judging whether the first vertical distance is greater than the glue coating vertical threshold value, if it is greater than the glue coating vertical threshold value, it can be determined that the analysis result of the abnormal analysis on the target SAC lens is a third analysis result indicating that the glue has a bonding defect of excessive glue coating, such as Figure 4a By judging whether the second vertical distance is less than the vertical threshold of glue coating, if it is less than the vertical threshold of glue coating, it can be determined that the analysis result of abnormal analysis on the target SAC lens is a fourth analysis result that the glue has a bonding defect of too little glue coating, such as Figure 4a The SAC lens marked in the lower middle is shown.

[0094] In this way, after determining the third analysis result and the fourth analysis result, the step of determining the defect information of the target SAC lens based on the analysis result provided in this embodiment may also include: when the analysis result is the third analysis result, determining that the target SAC lens has the defect of too much glue coating; when the analysis result is the fourth analysis result, determining that the target SAC lens has the defect of too little glue coating.

[0095] In summary, the embodiment of the present invention provides a method for detecting SAC lens bonding defects, including obtaining a device image of a device to be detected after a bonding process, wherein the device to be detected includes multiple SAC lenses, preprocessing the device image to obtain position information of each SAC lens in the device image, performing abnormal analysis on the target SAC lens based on the position information to obtain an analysis result, wherein the target SAC lens is any one of the multiple SAC lenses, and determining defect information of the target SAC lens based on the analysis result. By adopting the embodiment of the present invention, not only can a comprehensive defect detection be performed on the device to be detected after the bonding process, but also the detection efficiency of SAC lens bonding defects can be effectively improved.

[0096] In order to solve the same technical problem, this embodiment also provides a SAC lens bonding defect detection device. For details, see Figure 5 , Figure 5 is a structural schematic diagram of a SAC lens lamination defect detection device provided by an embodiment of the present invention, such as Figure 5 As shown, the SAC lens bonding defect detection device 500 provided in the embodiment of the present invention includes: an acquisition module 501, a pre-processing module 502, an analysis module 503, and a defect determination module 504;

[0097] The acquisition module 501 is used to acquire a device image of the device to be inspected after the bonding process, wherein the device to be inspected includes a plurality of SAC lenses.

[0098] The preprocessing module 502 is used to preprocess the device image to obtain the position information of each SAC lens in the device image.

[0099] In this embodiment, the preprocessing module 502 provided in this embodiment is specifically used to: construct a rectangular coordinate system in the device image; determine the coordinate point information of each SAC lens in the rectangular coordinate system, and use the coordinate point information as the position information of each SAC lens.

[0100] The analysis module 503 is used to perform an abnormality analysis on a target SAC lens based on the position information to obtain an analysis result, wherein the target SAC lens is any one of the multiple SAC lenses.

[0101] In some embodiments, the analysis module 503 provided in this embodiment is specifically used to: determine the difference between two endpoints of a first side of the target SAC lens according to the first position information of the target SAC lens, where the first side is any side constituting the target SAC lens; and determine a first analysis result of abnormal analysis of the target SAC lens when the difference does not meet the difference standard threshold corresponding to the first side.

[0102] In some other embodiments, the analysis module 503 provided in this embodiment is also specifically used to: determine, based on the position information, a standard line on which each SAC lens is arranged on the device to be inspected, wherein the standard line is a straight line on which at least half of the second sides of the SAC lenses are located, and the second side is any side constituting the SAC lenses; and determine a second analysis result of abnormal analysis of the target SAC lens when the second side of the target SAC lens is not on the standard line.

[0103] The defect determination module 504 is used to determine the defect information of the target SAC lens based on the analysis result.

[0104] As an optional embodiment, the preprocessing module 502 provided in this embodiment is further used for: performing grayscale processing on the device image to obtain a grayscale image corresponding to the device image; and determining the second position information of the glue in the grayscale image.

[0105] The analysis module 503 provided in this embodiment is also specifically used to: determine the first vertical distance between the farthest point in the glue from the second side of the target SAC lens and the SAC lens, and the second vertical distance between the closest point in the glue from the second side of the target SAC lens and the SAC lens based on the first position information of the target SAC lens and the second position information of the glue; when the first vertical distance is greater than a preset vertical threshold of the glue coating, determine a third analysis result of abnormal analysis on the target SAC lens; when the second vertical distance is less than the vertical threshold of the glue coating, determine a fourth analysis result of abnormal analysis on the target SAC lens.

[0106] In this embodiment, the defect determination module 504 provided in this embodiment is specifically used to: when the analysis result is the first analysis result, determine that the target SAC lens has a warping defect; when the analysis result is the second analysis result, determine that the target SAC lens has a skew or offset defect; when the analysis result is the third analysis result, determine that the target SAC lens has an excessive glue coating defect; when the analysis result is the fourth analysis result, determine that the target SAC lens has an insufficient glue coating defect.

[0107] During specific implementation, the above modules and / or units can be implemented as independent entities, or can be arbitrarily combined to be implemented as the same or several entities. The specific implementation of the above modules and / or units can refer to the previous method embodiments. The specific beneficial effects that can be achieved can also refer to the beneficial effects in the previous method embodiments, which will not be repeated here.

[0108] Also, see Figure 6 , Figure 6 1 is a schematic diagram of a structure of an electronic device provided by an embodiment of the present invention, and the electronic device may be a mobile terminal such as a smart phone, a tablet computer, or the like. Figure 6 As shown, the electronic device 600 includes a processor 601 and a memory 602. The processor 601 is electrically connected to the memory 602.

[0109] The processor 601 is the control center of the electronic device 600. It uses various interfaces and lines to connect various parts of the entire electronic device. It executes various functions of the electronic device 600 and processes data by running or loading applications stored in the memory 602 and calling data stored in the memory 602, thereby monitoring the electronic device 600 as a whole.

[0110] In this embodiment, the processor 601 in the electronic device 600 will load the instructions corresponding to the processes of one or more applications into the memory 602 according to the following steps, and the processor 601 will run the application stored in the memory 602, thereby implementing any step in the SAC lens fitting defect detection method provided in the above embodiment.

[0111] The electronic device 600 can implement the steps in any embodiment of the SAC lens fitting defect detection method provided in the embodiments of the present invention. Therefore, it can achieve the beneficial effects that can be achieved by any SAC lens fitting defect detection method provided in the embodiments of the present invention. Please refer to the previous embodiments for details and will not be repeated here.

[0112] See also Figure 7 , Figure 7 is another structural schematic diagram of an electronic device provided by an embodiment of the present invention, such as Figure 7 As shown, Figure 7 The specific structural block diagram of the electronic device provided by the embodiment of the present invention is shown, and the electronic device can be used to implement the SAC lens bonding defect detection method provided in the above embodiment. The electronic device 700 can be a mobile terminal such as a smart phone or a laptop computer.

[0113] The RF circuit 710 is used to receive and send electromagnetic waves, realize the mutual conversion between electromagnetic waves and electrical signals, and thus communicate with a communication network or other devices. The RF circuit 710 may include various existing circuit elements for performing these functions, such as antennas, radio frequency transceivers, digital signal processors, encryption / decryption chips, user identity module (SIM) cards, memories, etc. The RF circuit 710 can communicate with various networks such as the Internet, corporate intranets, wireless networks, or communicate with other devices through wireless networks. The above-mentioned wireless networks may include cellular telephone networks, wireless local area networks, or metropolitan area networks. The above-mentioned wireless networks can use various communication standards, protocols and technologies, including but not limited to Global System for Mobile Communication (GSM), Enhanced Data GSM Environment (EDGE), Wideband Code Division Multiple Access (WCDMA), Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Wireless Fidelity (Wi-Fi) (such as Institute of Electrical and Electronics Engineers standards IEEE 802.11a, IEEE 802.11b, IEEE802.11g and / or IEEE802.11n), Voice over Internet Protocol (VoIP), Worldwide Interoperability for Microwave Access (Wi-Max), other protocols for email, instant messaging and short messages, and any other suitable communication protocols, even those that have not yet been developed.

[0114] The memory 720 can be used to store software programs and modules, such as the program instructions / modules corresponding to the SAC lens fitting defect detection method in the above-mentioned embodiment. The processor 780 executes various functional applications and performs SAC lens fitting defect detection by running the software programs and modules stored in the memory 720.

[0115] The memory 720 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory 720 may further include a memory remotely arranged relative to the processor 780, and these remote memories may be connected to the electronic device 700 via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0116] The input unit 730 can be used to receive input digital or character information, and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control. Specifically, the input unit 730 may include a touch-sensitive surface 731 and other input devices 732. The touch-sensitive surface 731, also known as a touch display screen or touch pad, can collect user touch operations on or near it (such as operations performed by users using fingers, styluses, or any other suitable objects or accessories on or near the touch-sensitive surface 731), and drive corresponding connection devices according to a pre-set program. Optionally, the touch-sensitive surface 731 may include a touch detection device and a touch controller. Among them, the touch detection device detects the user's touch orientation, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into touch point coordinates, and then sends it to the processor 780, and can receive and execute commands sent by the processor 780. In addition, the touch-sensitive surface 731 can be implemented in various types such as resistive, capacitive, infrared, and surface acoustic wave. In addition to the touch-sensitive surface 731, the input unit 730 may further include other input devices 732. Specifically, the other input devices 732 may include, but are not limited to, one or more of a physical keyboard, function keys (such as volume control keys, switch keys, etc.), a trackball, a mouse, a joystick, and the like.

[0117] The display unit 740 can be used to display information input by the user or information provided to the user and various graphical user interfaces of the electronic device 700, which can be composed of graphics, text, icons, videos and any combination thereof. The display unit 740 may include a display panel 741, and optionally, the display panel 741 may be configured in the form of LCD (Liquid Crystal Display), OLED (Organic Light-Emitting Diode), etc. Further, the touch-sensitive surface 731 may cover the display panel 741, and when the touch-sensitive surface 731 detects a touch operation on or near it, it is transmitted to the processor 780 to determine the type of the touch event, and then the processor 780 provides corresponding visual output on the display panel 741 according to the type of the touch event. Although in the figure, the touch-sensitive surface 731 and the display panel 741 are implemented as two independent components to implement input and output functions, in some embodiments, the touch-sensitive surface 731 and the display panel 741 can be integrated to implement input and output functions.

[0118] The electronic device 700 may also include at least one sensor 750, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor, wherein the ambient light sensor may adjust the brightness of the display panel 741 according to the brightness of the ambient light, and the proximity sensor may generate an interrupt when the flip cover is closed or closed. As a type of motion sensor, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally three axes), and can detect the magnitude and direction of gravity when stationary, which can be used for applications that identify the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc.; as for other sensors such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc. that can also be configured in the electronic device 700, they will not be repeated here.

[0119] The audio circuit 760, the speaker 761, and the microphone 762 can provide an audio interface between the user and the electronic device 700. The audio circuit 760 can transmit the electrical signal converted from the received audio data to the speaker 761, which is converted into a sound signal for output; on the other hand, the microphone 762 converts the collected sound signal into an electrical signal, which is received by the audio circuit 760 and converted into audio data, and then the audio data is output to the processor 780 for processing, and then sent to another terminal through the RF circuit 710, or the audio data is output to the memory 720 for further processing. The audio circuit 760 may also include an earplug jack to provide communication between an external headset and the electronic device 700.

[0120] The electronic device 700 can help the user receive requests, send information, etc. through the transmission module 770 (such as a Wi-Fi module), which provides the user with wireless broadband Internet access. Although the transmission module 770 is shown in the figure, it is understandable that it is not a necessary component of the electronic device 700 and can be omitted as needed without changing the essence of the invention.

[0121] The processor 780 is the control center of the electronic device 700. It uses various interfaces and lines to connect various parts of the entire mobile phone. By running or executing software programs and / or modules stored in the memory 720, and calling data stored in the memory 720, it executes various functions of the electronic device 700 and processes data, thereby monitoring the electronic device as a whole. Optionally, the processor 780 may include one or more processing cores; in some embodiments, the processor 780 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface, and application programs, etc., and the modem processor mainly processes wireless communications. It can be understood that the above-mentioned modem processor may not be integrated into the processor 780.

[0122] The electronic device 700 also includes a power supply 790 (such as a battery) for supplying power to various components. In some embodiments, the power supply can be logically connected to the processor 780 through a power management system, so that the power management system can manage charging, discharging, and power consumption management. The power supply 790 can also include any components such as one or more DC or AC power supplies, recharging systems, power failure detection circuits, power converters or inverters, and power status indicators.

[0123] Although not shown, the electronic device 700 also includes a camera (such as a front camera, a rear camera), a Bluetooth module, etc., which will not be described in detail here. Specifically in this embodiment, the display unit of the electronic device is a touch screen display, and the mobile terminal also includes a memory, and one or more programs, wherein one or more programs are stored in the memory, and are configured to be executed by one or more processors to implement any step of the SAC lens bonding defect detection method provided in the above embodiment.

[0124] In specific implementation, the above modules can be implemented as independent entities, or can be arbitrarily combined and implemented as the same or several entities. The specific implementation of the above modules can be found in the previous method embodiments, which will not be repeated here.

[0125] Those skilled in the art can understand that all or part of the steps in the various methods of the above embodiments can be completed by instructions, or by controlling related hardware through instructions, and the instructions can be stored in a computer-readable storage medium and loaded and executed by a processor. To this end, an embodiment of the present invention provides a storage medium, which stores multiple instructions, and when the instructions are executed by the processor, any step in the SAC lens bonding defect detection method provided in the above embodiments can be implemented.

[0126] The storage medium may include: a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, etc.

[0127] Since the instructions stored in the storage medium can execute the steps in any embodiment of the SAC lens fitting defect detection method provided in the embodiments of the present invention, the beneficial effects that can be achieved by any SAC lens fitting defect detection method provided in the embodiments of the present invention can be achieved. Please refer to the previous embodiments for details and will not be repeated here.

[0128] The above is a detailed introduction to a SAC lens bonding defect detection method, device, electronic device and storage medium provided in the embodiments of the present application. The principles and implementation methods of the present application are described in detail using specific examples. The description of the above embodiments is only used to help understand the method and its core idea of ​​the present application. At the same time, for those skilled in the art, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as limiting the present application. Moreover, for those of ordinary skill in the art, without departing from the principles of the present invention, several improvements and modifications can be made, and these improvements and modifications are also regarded as the protection scope of the present invention.

Claims

1. A method for detecting SAC lens lamination defects, characterized in that: The following steps are involved: Acquire a device image of the device to be inspected after the bonding process, wherein the device to be inspected includes a plurality of SAC lenses; Preprocessing the device image to obtain position information of each SAC lens in the device image; Based on the position information, an abnormality analysis is performed on a target SAC lens to obtain an analysis result, wherein the target SAC lens is any one of the multiple SAC lenses; Based on the analysis result, defect information of the target SAC lens is determined.

2. The SAC lens lamination defect detection method according to claim 1, characterized in that: The step of preprocessing the device image to obtain the position information of each SAC lens in the device image includes: constructing a rectangular coordinate system in the device image; The coordinate point information of each SAC lens in the rectangular coordinate system is determined, and the coordinate point information is used as the position information of each SAC lens.

3. The SAC lens lamination defect detection method according to claim 2, characterized in that: The step of performing abnormal analysis on the target SAC lens based on the position information to obtain the analysis result comprises: Determine, according to the first position information of the target SAC lens, a difference between two endpoints of a first side of the target SAC lens, where the first side is any side constituting the target SAC lens; In a case where the difference does not satisfy a standard difference threshold corresponding to the first side, a first analysis result of abnormal analysis of the target SAC lens is determined.

4. The SAC lens lamination defect detection method according to claim 3, characterized in that: The step of performing abnormal analysis on the target SAC lens based on the position information to obtain the analysis result also includes: According to the position information, determine a standard line on which each SAC lens is arranged on the device to be detected, wherein the standard line is a straight line on which at least half of the second sides of the SAC lenses are located, and the second sides are any sides constituting the SAC lenses; In a case where the second side of the target SAC lens is not on the standard line, a second analysis result of abnormal analysis of the target SAC lens is determined.

5. The SAC lens lamination defect detection method according to claim 4, characterized in that: After the step of determining the coordinate point information of each SAC lens in the rectangular coordinate system and using the coordinate point information as the position information of each SAC lens, the method further includes: Performing grayscale processing on the device image to obtain a grayscale image corresponding to the device image; The second position information of the glue is determined in the grayscale image.

6. The SAC lens lamination defect detection method according to claim 5, characterized in that: The step of performing abnormal analysis on the target SAC lens based on the position information to obtain the analysis result comprises: Based on the first position information of the target SAC lens and the second position information of the glue, determine a first vertical distance between the farthest point in the glue from the second side of the target SAC lens and the SAC lens, and a second vertical distance between the closest point in the glue from the second side of the target SAC lens and the SAC lens; In a case where the first vertical distance is greater than a preset glue coating vertical threshold, determining a third analysis result of abnormal analysis of the target SAC lens; When the second vertical distance is less than the glue coating vertical threshold, a fourth analysis result of abnormal analysis of the target SAC lens is determined.

7. The SAC lens lamination defect detection method according to claim 6, characterized in that: The step of determining defect information of the target SAC lens based on the analysis result comprises: When the analysis result is the first analysis result, it is determined that the target SAC lens has a warping defect; When the analysis result is the second analysis result, it is determined that the target SAC lens has a skew or offset defect; When the analysis result is the third analysis result, it is determined that the target SAC lens has a defect of excessive glue coating; When the analysis result is the fourth analysis result, it is determined that the target SAC lens has a defect of too little glue coating.

8. A SAC lens bonding defect detection device, characterized in that: include: An acquisition module, used for acquiring a device image of the device to be inspected after the bonding process, wherein the device to be inspected includes a plurality of SAC lenses; A preprocessing module, used for preprocessing the device image to obtain position information of each SAC lens in the device image; An analysis module, configured to perform an abnormality analysis on a target SAC lens based on the position information to obtain an analysis result, wherein the target SAC lens is any one of the plurality of SAC lenses; A defect determination module is used to determine defect information of the target SAC lens based on the analysis result.

9. An electronic device, characterized in that: The electronic device comprises a processor, a memory, and a computer program stored in the memory and executable on the processor, and the processor implements the steps in the method according to any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in the method according to any one of claims 1 to 7 are implemented.

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