HIL test system and method for simulating relay fault

Abstract

The invention relates to an HIL testing system and method for simulating relay faults, and relates to the field of HIL testing. The HIL test system comprises a configuration module configured to store at least one relay fault parameter under a high-voltage architecture; the analog circuit module is configured to receive the relay fault parameter under the high-voltage architecture sent by the configuration module, simulate a relay fault circuit and output voltage of each sampling point of the relay fault circuit, and control the high-voltage output module to assign a voltage signal to each sampling point; the high-voltage output module is configured to send the voltage signal of each sampling point to the controller; and the controller is configured to judge the fault condition of the relay according to the voltage signal of each sampling point.

Description

Technical Field

[0001] The present disclosure relates to the field of HIL (Hardware-In-the-Loop) testing, and in particular to a HIL testing system and method for simulating relay faults. Background Art

[0002] High-voltage relays are widely used in power systems, automotive electrical systems, and other equipment that need to control high-voltage currents. However, high-voltage relays may cause system failure due to failure. Therefore, simulation tests for high-voltage relay failures, especially relay failure simulation tests under different high-voltage architectures, are essential to ensure system reliability and safety.

[0003] In the related art, when simulating a high-voltage relay failure, a real high-voltage simulation box is usually used for testing. Although this method can provide a real high-voltage environment, its main problem is that it is costly and has low flexibility. High-voltage simulation boxes are usually composed of complex hardware, and are expensive to produce and maintain, especially in the case of large-scale testing or frequent changes in high-voltage test scenarios. The cost issue is particularly prominent. In addition, the traditional high-voltage simulation box has a fixed structure and is difficult to flexibly respond to different high-voltage architecture switching requirements. Whenever the test parameters need to be changed or adapted to different high-voltage systems, it is often necessary to readjust the hardware configuration, and it may even be necessary to replace the entire simulation device, which leads to reduced test efficiency and extended development cycles. Summary of the invention

[0004] A technical problem to be solved by the present disclosure is to provide a HIL test system and method for simulating relay failures, which can realize real-time simulation of high-voltage relay failures and reduce the high cost and potential safety risks of high-voltage box equipment testing.

[0005] According to one aspect of the present disclosure, a hardware-in-the-loop (HIL) test system for simulating relay faults is proposed, including: a configuration module, configured to save at least one relay fault parameter under a high-voltage architecture; a simulation circuit module, configured to receive a relay fault parameter under a high-voltage architecture sent by the configuration module, simulate a relay fault circuit and the output voltage of each sampling point of the relay fault circuit, and control the high-voltage output module to assign a voltage signal to each sampling point; the high-voltage output module is configured to send the voltage signal of each sampling point to a controller; the controller is configured to determine the relay fault condition according to the voltage signal of each sampling point.

[0006] In some embodiments, the high-voltage output module includes a high-voltage output board and a high-voltage relay board, wherein the analog circuit module is configured to control the on and off of each relay of the high-voltage relay board, and output the output voltage of the corresponding sampling point to each channel of the high-voltage output board, so as to control the high-voltage output module to assign a voltage signal to each sampling point.

[0007] In some embodiments, when the relay fault circuit includes a battery, a main positive relay, a main negative relay, a pre-charge relay, a fast-charge first positive relay, a fast-charge first negative relay, a fast-charge second positive relay, a fast-charge second negative relay, and a load capacitor, the locations of the sampling points include a reference sampling point at the negative terminal of the battery, a first sampling point at the positive terminal of the battery, a second sampling point between the main positive relay and the load capacitor, a third sampling point at an end of the fast-charge first positive relay away from the positive terminal of the battery, a fourth sampling point at an end of the fast-charge second positive relay away from the positive terminal of the battery, a fifth sampling point between the main negative relay and the fast-charge second negative relay, a sixth sampling point at an end of the fast-charge first negative relay away from the negative terminal of the battery, and a seventh sampling point at an end of the fast-charge second negative relay away from the negative terminal of the battery.

[0008] In some embodiments, the high-voltage relay board includes a first channel, a second channel, a third channel, a fourth channel and a fifth channel, and the high-voltage relay board includes a first relay, a second relay, a third relay, a fourth relay, a fifth relay, a sixth relay and a seventh relay, wherein the input end of the first channel receives the output voltage of the first sampling point, the positive output end of the first channel is connected to the first sampling point pin of the controller, and the negative output end of the first channel is connected to the reference sampling point pin of the controller; the input end of the second channel receives the output voltage of the second sampling point, the positive output end of the second channel is connected to the second sampling point pin of the controller, and the negative output end of the second channel is connected to the reference sampling point pin of the controller; the input end of the third channel receives the output voltage of the third sampling point, the positive output end of the third channel is connected to the third sampling point pin of the controller, and the negative output end of the third channel is connected to the reference sampling point pin of the controller. The output end of the fourth channel is connected to the reference sampling point pin of the controller; the input end of the fourth channel receives the output voltage of the fourth sampling point, the positive output end of the fourth channel is connected to the fourth sampling point pin of the controller, and the negative output end of the fourth channel is connected to the reference sampling point pin of the controller; the input end of the fifth channel receives the output voltage of the fifth sampling point, the positive output end of the fifth channel is connected to the fifth sampling point pin of the controller through the fifth relay, is connected to the sixth sampling point pin of the controller through the sixth relay, is connected to the seventh sampling point pin of the controller through the seventh relay, is connected to the reference sampling point pin of the controller through the fourth relay, the negative output end of the fifth channel is connected to the fifth sampling point pin of the controller through the third relay, is connected to the reference sampling point pin of the controller through the second relay, and the fifth sampling point pin of the controller is connected to the reference sampling point pin through the first relay.

[0009] In some embodiments, when the analog circuit module controls the first relay to be disconnected and the second relay and the fifth relay to be closed, the fifth sampling point pin of the controller receives a positive voltage; when the analog circuit module controls the first relay to be disconnected and the third relay and the fourth relay to be closed, the fifth sampling point pin of the controller receives a negative voltage.

[0010] In some embodiments, at least one relay fault parameter under a high-voltage architecture includes: multiple high-voltage architectures, relay fault types, and real voltage data of each sampling point when a relay fault occurs under each high-voltage architecture.

[0011] In some embodiments, the real voltage data of each sampling point is classified and stored according to one or more dimensions of high voltage architecture, relay fault type, and relay position.

[0012] In some embodiments, the actual voltage data of each sampling point is a voltage value with a time series.

[0013] According to another aspect of the present disclosure, a hardware-in-the-loop HIL testing method for simulating relay faults is also proposed, including: saving at least one relay fault parameter under a high-voltage architecture through a configuration module; receiving a relay fault parameter under a high-voltage architecture sent by a configuration module through an analog circuit module, simulating a relay fault circuit and the output voltage of each sampling point of the relay fault circuit, and controlling the high-voltage output module to assign a voltage signal to each sampling point; sending the voltage signal of each sampling point to a controller through the high-voltage output module, so that the controller determines the relay fault condition according to the voltage signal of each sampling point.

[0014] In some embodiments, the high-voltage output module includes a high-voltage output board and a high-voltage relay board, wherein the analog circuit module controls the on and off of each relay of the high-voltage relay board, and outputs the output voltage of the corresponding sampling point to each channel of the high-voltage output board, so as to control the high-voltage output module to assign a voltage signal to each sampling point.

[0015] In the disclosed embodiment, the relay fault parameters under different high-voltage architectures are stored by configuring the module, and then the relay fault circuit under a certain high-voltage architecture is simulated by using the analog circuit module, and then the output voltage of each sampling point is simulated, and the high-voltage output module is controlled to assign voltage signals to each sampling point, and finally the relay fault condition is judged by the controller according to the voltage signals of each sampling point. On the one hand, the real-time simulation of high-voltage relay faults is realized, and on the other hand, the high cost and potential safety risks of high-voltage box equipment testing are reduced, the testing cost is effectively reduced, and the safety and efficiency of the test are improved.

[0016] Other features and advantages of the present disclosure will become apparent from the following detailed description of exemplary embodiments of the present disclosure with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings, which constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0018] The present disclosure may be more clearly understood from the following detailed description with reference to the accompanying drawings, in which:

[0019] Figure 1 It is a schematic diagram of the structure of some embodiments of the HIL test system for simulating relay faults disclosed in the present invention;

[0020] Figure 2 It is a structural schematic diagram of some embodiments of the simulated relay fault circuit disclosed in the present invention;

[0021] Figure 3 It is a structural schematic diagram of some other embodiments of the simulated relay fault circuit disclosed in the present invention;

[0022] Figure 4 It is a schematic diagram of the structure of some embodiments of the high-voltage output module disclosed in the present invention;

[0023] Figure 5 Schematic diagram of some embodiments of the HIL test method for simulating relay faults disclosed in the present invention. DETAILED DESCRIPTION

[0024] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present disclosure unless otherwise specifically stated.

[0025] At the same time, it should be understood that for the convenience of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship.

[0026] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present disclosure, its application, or uses.

[0027] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0028] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0029] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0030] In order to make the objectives, technical solutions and advantages of the present disclosure more clearly understood, the present disclosure is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0031] In the related art, the simulation of high-voltage relay failure is simulated by controlling the relay in the real high-voltage box, that is, using complex hardware to build a high-voltage simulation box, simulating the high-voltage relay failure by cutting / closing the circuit through the real relay, and then judging the high-voltage relay failure by judging the voltage change at the sampling point. The production and maintenance costs of the high-voltage simulation box are expensive, and it is difficult to flexibly respond to different high-voltage architecture switching requirements.

[0032] In HIL testing, the high-voltage environment can truly simulate the operating status of the equipment in actual work. Performing HIL testing in a high-voltage environment can detect potential problems in advance during the development and testing stages, avoid failures in actual applications, and thus reduce development cycles and costs. In addition, by simulating different high-voltage fault scenarios, especially high-voltage relay failures, the test can help identify the response behavior of the system under extreme conditions, thereby optimizing the system design and control strategy. Therefore, the introduction of a high-voltage environment in HIL testing can not only improve the credibility of the test, but also has important significance for the safety verification of high-voltage systems.

[0033] The present disclosure provides a HIL test system and method for simulating relay failures, which can accurately simulate relay failures under different high-voltage architectures and generate real sampling point voltage data, thereby improving the coverage and reliability of the test, and thus being able to more economically and effectively support the test requirements of different high-voltage systems. The following will introduce the solution of the present disclosure by taking a specific embodiment as an example.

[0034] Figure 1 Schematic diagram of the structure of some embodiments of the HIL test system for simulating relay faults of the present disclosure. The HIL test system includes a configuration module 110 , a simulation circuit module 120 , a high-voltage output module 130 and a controller 140 .

[0035] The configuration module 110 is configured to save at least one relay fault parameter in a high voltage architecture.

[0036] The configuration module stores and manages relay fault parameters under different high voltage architectures. For example, the configuration module stores relay fault data under different high voltage architectures in the form of a database.

[0037] The relay fault parameters under at least one high-voltage architecture include: multiple high-voltage architectures, relay fault types, and real voltage data of each sampling point when a relay fault occurs under each high-voltage architecture. For example, multiple high-voltage architectures include high-voltage architectures of different voltage levels and high-voltage architectures of different types of relays. High-voltage architectures of different voltage levels include, for example, high-voltage architectures of 400V and 1000V levels, and high-voltage architectures of different types of relays include, for example, high-voltage architectures of charging and discharging relays and overcurrent protection relay types, and high-voltage architectures belong to basic configurations. The basic configuration also includes the voltage of the battery during the subsequent simulation of the relay fault circuit. Relay fault types include adhesion faults, short circuit faults, disconnection faults, overload faults, sampling line break faults and other fault configurations.

[0038] In some embodiments, the real voltage data of each sampling point is classified and stored according to one or more dimensions of high voltage architecture, relay fault type, and relay position, so as to facilitate subsequent search. The real voltage data of each sampling point is obtained through historical faults, laboratory measurements, or simulation data, and stored in a specific format. For example, the data storage format can be a database structure that supports fast retrieval and call.

[0039] The actual voltage data of each sampling point is a voltage value with a time series. For example, each record stored in the database contains voltage values ​​of multiple sampling points in a time series for use by subsequent analog circuit modules.

[0040] In some embodiments, the configuration module imports new fault data through external interfaces such as network connection and USB, thereby supporting the scalability and upgrade maintenance of the system. At the same time, the configuration module has a data update mechanism, which can dynamically update the stored sampling point data when new architectures or new fault data appear, ensuring the long-term effectiveness of the system.

[0041] When the system needs to simulate a relay fault under a certain architecture, the configuration module sends the sampling point data under the corresponding architecture to the simulation circuit module for use. At the same time, the configuration module can also send basic configuration parameters such as battery voltage, high-voltage architecture selection, and fault configuration parameters such as fault type to the simulation circuit module.

[0042] The simulation circuit module 120 is configured to receive a relay fault parameter under a high-voltage architecture sent by the configuration module, simulate the relay fault circuit and the output voltage of each sampling point of the relay fault circuit, and control the high-voltage output module to assign a voltage signal to each sampling point.

[0043] The configuration module combines real fault data and simulation data, so that the simulation circuit module can realize relay fault simulation under various high-voltage architectures. For example, the simulation circuit module flexibly adjusts and expands different fault scenarios based on the received data, such as using Simulink software to build a relay fault circuit model to simulate the output voltage of each sampling point when a relay fault occurs under different high-voltage architectures. The relay fault circuit model corresponds one-to-one to the high-voltage architecture sent by the configuration module.

[0044] In some embodiments, Figure 2 and Figure 3 As shown, the relay fault circuit is, for example, a dual-gun fast charging high voltage circuit, including a battery 21, a main positive relay 22, a main negative relay 23, a pre-charging relay 24, a fast charging first positive relay 25, a fast charging first negative relay 26, a fast charging second positive relay 27, a fast charging second negative relay 28, and a load capacitor 29. Figure 2 and Figure 3The difference lies in whether the charging is affected by the main positive relay.

[0045] Figure 2 In the embodiment, one end of the main positive relay 22 is connected to the positive end of the battery 21, and the other end is connected to one end of the main negative relay 23 through the load capacitor 29, and the other end of the main negative relay 23 is connected to the negative end of the battery 21. The resistor 30 can be connected in parallel at both ends of the load capacitor 29. The pre-charge relay 24 is connected in series with the pre-charge resistor 31 and then connected in parallel at both ends of the main positive relay 22. One end of the fast-charge first positive relay 25 and one end of the fast-charge second positive relay 27 are respectively arranged between the main positive relay 22 and the resistor 30. One end of the fast-charge first negative relay 26 and one end of the fast-charge second negative relay 28 are respectively arranged between the main negative relay 23 and the resistor 30.

[0046] Figure 3 One end of the main positive relay 22 is connected to the positive end of the battery 21, and the other end is connected to one end of the main negative relay 23 through the load capacitor 29, and the other end of the main negative relay 23 is connected to the negative end of the battery 21. The resistor 30 can be connected in parallel at both ends of the load capacitor 29. The pre-charge relay 24 is connected in series with the pre-charge resistor 31 and then connected in parallel at both ends of the main positive relay 22. One end of the fast-charge first positive relay 25 and one end of the fast-charge second positive relay 27 are respectively arranged between the positive end of the battery 21 and the main positive relay 22. One end of the fast-charge first negative relay 26 and one end of the fast-charge second negative relay 28 are respectively arranged between the main negative relay 23 and the resistor 30.

[0047] Those skilled in the art should understand that Figure 2 and Figure 3 This is only used as an example. More relay fault circuits under different high-voltage architectures can be moduled according to actual conditions.

[0048] Although the high voltage architecture is different, the sampling point locations are the same. For example, the sampling point locations include a reference sampling point 0 located at the negative end of the battery, a first sampling point 1 located at the positive end of the battery, a second sampling point 2 located between the main positive relay and the load capacitor, a third sampling point 3 located at the end of the fast charging first positive relay away from the positive end of the battery, a fourth sampling point 4 located at the end of the fast charging second positive relay away from the positive end of the battery, a fifth sampling point 5 located between the main negative relay and the fast charging second negative relay, a sixth sampling point 6 located at the end of the fast charging first negative relay away from the negative end of the battery, and a seventh sampling point 7 located at the end of the fast charging second negative relay away from the negative end of the battery.

[0049] The high voltage output module 130 is configured to send the voltage signal of each sampling point to the controller.

[0050] In some embodiments, the high-voltage output module includes a high-voltage output board and a high-voltage relay board, wherein the analog circuit module is configured to control the on and off of each relay of the high-voltage relay board, and output the output voltage of the corresponding sampling point to each channel of the high-voltage output board, so as to control the high-voltage output module to assign a voltage signal to each sampling point.

[0051] The channel of the high-voltage output card can output a high-voltage and low-current signal of 0~1500V to simulate high-voltage output. The channel in the high-voltage relay card can simulate the on-off of the relay working control circuit.

[0052] The high-voltage output module is combined with the high-voltage relay through the high-voltage output board, and outputs the analog voltage signal to the sampling point pin of the controller in real time under the action of the control signal.

[0053] For example, Figure 4 As shown, Figure 4The schematic diagram of the structure of some embodiments of the high-voltage output module of the present disclosure is shown in FIG. The high-voltage relay board includes a first channel HV1, a second channel HV2, a third channel HV3, a fourth channel HV4 and a fifth channel HV5, and the high-voltage relay board includes a first relay Rly1, a second relay Rly2, a third relay Rly3, a fourth relay Rly4, a fifth relay Rly5, a sixth relay Rly6 and a seventh relay Rly7. The input end of the first channel receives the output voltage of the first sampling point, the positive output end of the first channel is connected to the first sampling point pin 1' of the controller, and the negative output end of the first channel is connected to the reference sampling point pin 0' of the controller; the input end of the second channel receives the output voltage of the second sampling point, the positive output end of the second channel is connected to the second sampling point pin 2' of the controller, and the negative output end of the second channel is connected to the reference sampling point pin 0' of the controller; the input end of the third channel receives the output voltage of the third sampling point, the positive output end of the third channel is connected to the third sampling point pin 3' of the controller, and the negative output end of the third channel is connected to the reference sampling point pin 0' of the controller; the input end of the fourth channel receives the output voltage of the fourth sampling point, the positive output end of the fourth channel is connected to the fourth sampling point pin 4' of the controller, and the negative output end of the third channel is connected to the reference sampling point pin 0' of the controller. The negative output end of the four channels is connected to the reference sampling point pin 0' of the controller; the input end of the fifth channel receives the output voltage of the fifth sampling point, the positive output end of the fifth channel is connected to the fifth sampling point pin 5' of the controller through the fifth relay Rly5, connected to the sixth sampling point pin 6' of the controller through the sixth relay Rly6, connected to the seventh sampling point pin 7' of the controller through the seventh relay Rly7, connected to the reference sampling point pin 0' of the controller through the fourth relay Rly4, the negative output end of the fifth channel is connected to the fifth sampling point pin 5' of the controller through the third relay Rly3, connected to the reference sampling point pin 0' of the controller through the second relay Rly2, and the fifth sampling point pin 5' of the controller is connected to the reference sampling point pin 0' through the first relay Rly1.

[0054] The first channel, the second channel, the third channel and the fourth channel output the analog voltages of the first sampling point, the second sampling point, the third sampling point and the fourth sampling point respectively. Since the fifth channel can receive the output voltage of the fifth sampling point and the control signals of each relay on the high-voltage relay board, it can output the analog voltage of the fifth sampling point, the analog voltage of the sixth sampling point and the analog voltage of the seventh sampling point.

[0055] Since the simulated relay fault circuit has load capacitance, the fifth sampling point pin of the controller needs to be compatible with both positive and negative voltages. Therefore, when the analog circuit module controls the first relay to be disconnected and the second and fifth relays to be closed, the fifth sampling point pin of the controller receives a positive voltage; when the analog circuit module controls the first relay to be disconnected and the third and fourth relays to be closed, the fifth sampling point pin of the controller receives a negative voltage.

[0056] For example, the first relay Rly1 is disconnected, and the second relay Rly2 and the fifth relay Rly5 are closed at the same time, the reference sampling point pin 0' is connected to the negative pole of the fifth channel, and the fifth sampling point pin 5' is connected to the positive pole of the fifth channel. Therefore, the potential difference of the fifth sampling point pin 5' relative to the reference sampling point pin 0' is positive, and the fifth sampling point pin 5' is a positive voltage; the first relay Rly1 is disconnected, and the third relay Rly3 and the fourth relay Rly4 are closed at the same time, the reference sampling point pin 0' is connected to the positive pole of the fifth channel, and the fifth sampling point pin 5' is connected to the negative pole of the fifth channel. Therefore, the potential difference of the fifth sampling point pin 5' relative to the reference sampling point pin 0' is negative, and the fifth sampling point pin 5' is a negative voltage; the first relay Rly1 and the relays Rly2-Rly5 cannot be closed at the same time to prevent the fifth sampling point pin 5' from affecting the output. The sixth sampling point pin 6' determines whether to accept the voltage output by the second channel HV2 through the on-off of the sixth relay Rly6, and the seventh sampling point pin 7' determines whether to accept the voltage output by the second channel HV2 through the on-off of the seventh relay Rly7.

[0057] Figure 4 The high-voltage output module shown in the figure uses a 5-channel high-voltage output board and a 7-channel high-voltage relay board. The board analog signal can be transmitted to the controller through a real-time simulation platform to ensure that the generated voltage signal can match the response of the actual physical system.

[0058] The high-voltage output module combines a high-voltage output card and a high-voltage relay card, and can minimize the use of high-voltage output channels, thereby reducing costs.

[0059] The controller 140 is configured to determine the relay fault condition according to the voltage signal at each sampling point.

[0060] The controller is, for example, a MBMU (Main Battery Management Unit) or a CVS (Cell Voltage Supervision). The disclosure does not limit how the controller determines a relay failure.

[0061] In the above embodiment, the relay fault parameters under different high-voltage architectures are stored by configuring the module, and then the relay fault circuit under a certain high-voltage architecture is simulated by using the analog circuit module, and then the output voltage of each sampling point is simulated, and the high-voltage output module is controlled to assign voltage signals to each sampling point, and finally the relay fault condition is judged by the controller according to the voltage signals of each sampling point. On the one hand, the real-time simulation of high-voltage relay faults is realized, and on the other hand, the high cost and potential safety risks of high-voltage box equipment testing are reduced.

[0062] For different high-voltage system architectures, the voltage changes at the sampling point are different when a high-voltage relay failure occurs. Therefore, it is only necessary to change the output voltage of the high-voltage output board to simulate the relay failure under different high-voltage architectures, thereby facilitating the switching needs of different high-voltage architectures.

[0063] Figure 5 The flowchart of some embodiments of the HIL test method for simulating relay faults disclosed in the present invention includes steps S51-S53.

[0064] In step S51, at least one relay fault parameter under a high voltage architecture is saved by a configuration module.

[0065] In some embodiments, at least one relay fault parameter under a high-voltage architecture includes: multiple high-voltage architectures, relay fault types, and real voltage data of each sampling point when a relay fault occurs under each high-voltage architecture.

[0066] In some embodiments, the real voltage data of each sampling point is classified and stored according to one or more dimensions of high voltage architecture, relay fault type, and relay position.

[0067] In some embodiments, the actual voltage data of each sampling point is a voltage value with a time series.

[0068] In step S52, a relay fault parameter under a high-voltage architecture sent by the configuration module is received through the simulation circuit module, the relay fault circuit and the output voltage of each sampling point of the relay fault circuit are simulated, and the high-voltage output module is controlled to assign a voltage signal to each sampling point.

[0069] In some embodiments, a relay fault circuit model is constructed using Simulink software.

[0070] In the case where the relay fault circuit includes a battery, a main positive relay, a main negative relay, a pre-charging relay, a first positive fast-charging relay, a first negative fast-charging relay, a second positive fast-charging relay, a second negative fast-charging relay, and a load capacitor, the positions of the sampling points include a reference sampling point at the negative end of the battery, a first sampling point at the positive end of the battery, a second sampling point between the main positive relay and the load capacitor, a third sampling point at an end of the first positive fast-charging relay away from the positive end of the battery, a fourth sampling point at an end of the second positive fast-charging relay away from the positive end of the battery, a fifth sampling point between the main negative relay and the second negative fast-charging relay, a sixth sampling point at an end of the first negative fast-charging relay away from the negative end of the battery, and a seventh sampling point at an end of the second negative fast-charging relay away from the negative end of the battery.

[0071] In step S53, the voltage signal of each sampling point is sent to the controller through the high voltage output module, so that the controller determines the relay fault condition according to the voltage signal of each sampling point.

[0072] In some embodiments, the high-voltage output module includes a high-voltage output card and a high-voltage relay card. The analog circuit module controls the on and off of each relay of the high-voltage relay card, and outputs the output voltage of the corresponding sampling point to each channel of the high-voltage output card, so as to control the high-voltage output module to assign a voltage signal to each sampling point.

[0073] For example, the high voltage relay board includes a first channel, a second channel, a third channel, a fourth channel and a fifth channel, and the high voltage relay board includes a first relay, a second relay, a third relay, a fourth relay, a fifth relay, a sixth relay and a seventh relay.

[0074] The input end of the first channel receives the output voltage of the first sampling point, the positive output end of the first channel is connected to the first sampling point pin of the controller, and the negative output end of the first channel is connected to the reference sampling point pin of the controller; the input end of the second channel receives the output voltage of the second sampling point, the positive output end of the second channel is connected to the second sampling point pin of the controller, and the negative output end of the second channel is connected to the reference sampling point pin of the controller; the input end of the third channel receives the output voltage of the third sampling point, the positive output end of the third channel is connected to the third sampling point pin of the controller, and the negative output end of the third channel is connected to the reference sampling point pin of the controller; the input end of the fourth channel receives the output voltage of the fourth sampling point, and the positive output end of the fourth channel is connected to the reference sampling point pin of the controller. The fourth sampling point pin of the controller is connected, and the negative output end of the fourth channel is connected to the reference sampling point pin of the controller; the input end of the fifth channel receives the output voltage of the fifth sampling point, the positive output end of the fifth channel is connected to the fifth sampling point pin of the controller through the fifth relay, is connected to the sixth sampling point pin of the controller through the sixth relay, is connected to the seventh sampling point pin of the controller through the seventh relay, is connected to the reference sampling point pin of the controller through the fourth relay, the negative output end of the fifth channel is connected to the fifth sampling point pin of the controller through the third relay, is connected to the reference sampling point pin of the controller through the second relay, and the fifth sampling point pin of the controller is connected to the reference sampling point pin through the first relay.

[0075] When the analog circuit module controls the first relay to be disconnected and the second relay and the fifth relay to be closed, the fifth sampling point pin of the controller receives a positive voltage; when the analog circuit module controls the first relay to be disconnected and the third relay and the fourth relay to be closed, the fifth sampling point pin of the controller receives a negative voltage.

[0076] In the above embodiment, the relay fault parameters under different high-voltage architectures are stored by configuring the module, and then the relay fault circuit under a certain high-voltage architecture is simulated by using the analog circuit module, and then the output voltage of each sampling point is simulated, and the high-voltage output module is controlled to assign voltage signals to each sampling point, and finally the relay fault condition is judged by the controller according to the voltage signals of each sampling point. On the one hand, the real-time simulation of high-voltage relay faults is realized, and on the other hand, the high cost and potential safety risks of high-voltage box equipment testing are reduced.

[0077] So far, the present disclosure has been described in detail. In order to avoid obscuring the concept of the present disclosure, some details known in the art are not described. Based on the above description, those skilled in the art can fully understand how to implement the technical solution disclosed here.

[0078] The method and apparatus of the present disclosure may be implemented in many ways. For example, the method and apparatus of the present disclosure may be implemented by software, hardware, firmware, or any combination of software, hardware, and firmware. The above order of steps for the method is for illustration only, and the steps of the method of the present disclosure are not limited to the order specifically described above, unless otherwise specifically stated. In addition, in some embodiments, the present disclosure may also be implemented as a program recorded in a recording medium, which includes machine-readable instructions for implementing the method according to the present disclosure. Therefore, the present disclosure also covers a recording medium storing a program for executing the method according to the present disclosure.

[0079] Although some specific embodiments of the present disclosure have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the appended claims.

Claims

1. A hardware-in-the-loop (HIL) test system for simulating relay failure, comprising: A configuration module configured to store at least one relay fault parameter under a high voltage architecture; The simulation circuit module is configured to receive a relay fault parameter under a high-voltage architecture sent by the configuration module, simulate a relay fault circuit and an output voltage of each sampling point of the relay fault circuit, and control the high-voltage output module to assign a voltage signal to each sampling point; A high voltage output module, configured to send the voltage signal of each sampling point to a controller; The controller is configured to determine the relay fault condition according to the voltage signals at the respective sampling points.

2. The HIL test system according to claim 1, wherein: The high-voltage output module includes a high-voltage output card and a high-voltage relay card, wherein: The analog circuit module is configured to control the on and off of each relay of the high-voltage relay board, and output the output voltage of the corresponding sampling point to each channel of the high-voltage output board, so as to control the high-voltage output module to assign a voltage signal to each sampling point.

3. The HIL test system according to claim 2, wherein: In the case where the relay fault circuit includes a battery, a main positive relay, a main negative relay, a pre-charging relay, a first positive fast-charging relay, a first negative fast-charging relay, a second positive fast-charging relay, a second negative fast-charging relay, and a load capacitor, the positions of the sampling points include a reference sampling point located at the negative end of the battery, a first sampling point located at the positive end of the battery, a second sampling point located between the main positive relay and the load capacitor, a third sampling point located at an end of the first positive fast-charging relay away from the positive end of the battery, a fourth sampling point located at an end of the second positive fast-charging relay away from the positive end of the battery, a fifth sampling point located between the main negative relay and the second negative fast-charging relay, a sixth sampling point located at an end of the first negative fast-charging relay away from the negative end of the battery, and a seventh sampling point located at an end of the second negative fast-charging relay away from the negative end of the battery.

4. The HIL test system according to claim 3, wherein: The high-voltage relay board includes a first channel, a second channel, a third channel, a fourth channel and a fifth channel, and the high-voltage relay board includes a first relay, a second relay, a third relay, a fourth relay, a fifth relay, a sixth relay and a seventh relay, wherein: The input end of the first channel receives the output voltage of the first sampling point, the positive output end of the first channel is connected to the first sampling point pin of the controller, and the negative output end of the first channel is connected to the reference sampling point pin of the controller; The input end of the second channel receives the output voltage of the second sampling point, the positive output end of the second channel is connected to the second sampling point pin of the controller, and the negative output end of the second channel is connected to the reference sampling point pin of the controller; The input end of the third channel receives the output voltage of the third sampling point, the positive output end of the third channel is connected to the third sampling point pin of the controller, and the negative output end of the third channel is connected to the reference sampling point pin of the controller; The input end of the fourth channel receives the output voltage of the fourth sampling point, the positive output end of the fourth channel is connected to the fourth sampling point pin of the controller, and the negative output end of the fourth channel is connected to the reference sampling point pin of the controller; The input end of the fifth channel receives the output voltage of the fifth sampling point, the positive output end of the fifth channel is connected to the fifth sampling point pin of the controller through the fifth relay, connected to the sixth sampling point pin of the controller through the sixth relay, connected to the seventh sampling point pin of the controller through the seventh relay, and connected to the reference sampling point pin of the controller through the fourth relay, the negative output end of the fifth channel is connected to the fifth sampling point pin of the controller through the third relay, connected to the reference sampling point pin of the controller through the second relay, and the fifth sampling point pin of the controller is connected to the reference sampling point pin through the first relay.

5. The HIL test system according to claim 4, wherein: When the analog circuit module controls the first relay to be disconnected and the second relay and the fifth relay to be closed, the fifth sampling point pin of the controller receives a positive voltage; When the analog circuit module controls the first relay to be opened and the third relay and the fourth relay to be closed, the fifth sampling point pin of the controller receives a negative voltage.

6. The HIL test system according to any one of claims 1 to 5, wherein: The at least one relay fault parameter under the high voltage architecture includes: Multiple high-voltage architectures, relay fault types, and real voltage data at each sampling point when a relay fault occurs under each high-voltage architecture.

7. The HIL test system according to claim 6, wherein: The real voltage data of each sampling point is classified and stored according to one or more dimensions of high voltage architecture, relay fault type, and relay position.

8. The HIL test system according to claim 6, wherein: The real voltage data of each sampling point is a voltage value with a time series.

9. A hardware-in-the-loop (HIL) test method for simulating relay failure, comprising: Saving at least one relay fault parameter under the high voltage architecture by configuring the module; Receiving a relay fault parameter under a high-voltage architecture sent by the configuration module through an analog circuit module, simulating a relay fault circuit and an output voltage of each sampling point of the relay fault circuit, and controlling a high-voltage output module to assign a voltage signal to each sampling point; The voltage signals of the various sampling points are sent to the controller through the high-voltage output module, so that the controller can determine the fault condition of the relay according to the voltage signals of the various sampling points.

10. The HIL testing method according to claim 9, wherein: The high-voltage output module includes a high-voltage output card and a high-voltage relay card, wherein: The analog circuit module controls the on and off of each relay of the high-voltage relay board, and outputs the output voltage of the corresponding sampling point to each channel of the high-voltage output board, so as to control the high-voltage output module to assign a voltage signal to each sampling point.

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