Projector heat dissipation and noise reduction method and device, equipment and storage medium

Abstract

The invention relates to a projector heat dissipation and noise reduction method and device, equipment and a storage medium, and the method comprises the steps: obtaining the internal structure data and environment temperature information of a projector, and carrying out the thermal simulation analysis, and obtaining a corresponding thermal distribution diagram; acquiring real-time temperature data of the projector, and performing heat dissipation demand calculation on the real-time temperature data and the heat distribution diagram to obtain a corresponding real-time heat dissipation demand; acquiring light source output data and processor performance data of the projector, and predicting a real-time heat dissipation demand to obtain a corresponding heat dissipation trend; performing heat dissipation planning analysis on the real-time heat dissipation demand and the heat dissipation trend to obtain a corresponding initial heat dissipation control scheme; performing high-temperature identification on the real-time temperature data through a preset nonlinear dynamic model, and performing adjustment in combination with a heat dissipation trend to obtain a corresponding performance adjustment strategy; and analyzing the initial heat dissipation control scheme and the performance adjustment strategy to obtain a corresponding global heat dissipation noise reduction strategy. According to the invention, intelligence and refinement of heat dissipation control of the projector can be realized.

Description

Technical Field

[0001] The present invention relates to the technical field of projectors, and in particular to a method, device, equipment and storage medium for heat dissipation and noise reduction of a projector. Background Art

[0002] With the continuous development of projection technology, users have put forward higher requirements for the performance and user experience of projectors, among which heat dissipation and noise control have become key factors affecting user experience. How to effectively manage heat dissipation and reduce noise levels while ensuring high-performance output of the projector has become one of the current research focuses. Existing projector heat dissipation and noise reduction methods often use simple temperature threshold control or fixed fan speed adjustment. This method fails to fully consider the complexity of the internal structure of the projector, changes in environmental factors, and the impact of different usage scenarios on heat dissipation requirements. This simplified heat dissipation control strategy may lead to poor heat dissipation or excessive heat dissipation when it is not necessary, thereby increasing noise levels and energy consumption. In addition, existing methods usually separate heat dissipation and performance adjustment, lack global considerations, and cannot achieve the best balance between heat dissipation and device performance. Summary of the invention

[0003] The main purpose of the present invention is to provide a projector heat dissipation and noise reduction method, device, equipment and storage medium, which can realize intelligent and refined control of projector heat dissipation.

[0004] To achieve the above object, the present invention provides a method for heat dissipation and noise reduction of a projector, comprising: Obtain the internal structure data and ambient temperature information of the projector, and perform thermal simulation analysis to obtain the corresponding thermal distribution map; Acquire real-time temperature data of the projector, calculate the heat dissipation demand with the heat distribution map, and obtain the corresponding real-time heat dissipation demand; Acquire light source output data and processor performance data of the projector, and predict the real-time heat dissipation demand to obtain a corresponding heat dissipation trend; Performing heat dissipation planning analysis on the real-time heat dissipation demand and the heat dissipation trend to obtain a corresponding initial heat dissipation control solution; High temperature recognition is performed on the real-time temperature data through a preset nonlinear dynamic model, and adjustment analysis is performed in combination with the heat dissipation trend to obtain a corresponding performance adjustment strategy; The initial heat dissipation control scheme and the performance adjustment strategy are comprehensively analyzed to obtain a corresponding global heat dissipation and noise reduction strategy.

[0005] Further, the performing thermal simulation analysis on the internal structure data based on the ambient temperature information to obtain a corresponding thermal distribution map includes: Gridding the internal structure data to obtain a corresponding calculation grid; Acquiring thermophysical parameters of each component of the projector, assigning thermophysical properties to the calculation grid according to the thermophysical parameters, and obtaining thermophysical calculation data; Setting boundary conditions and initial conditions according to the ambient temperature information, and solving the thermal physical calculation data by a finite difference method based on the boundary conditions and the initial conditions to obtain discrete temperature field data; Performing bilinear interpolation processing on the discrete temperature field data to obtain a continuous temperature distribution function; A heat distribution matrix is ​​generated based on the continuous temperature distribution function, and pseudo-color processing is performed on the heat distribution matrix to obtain the heat distribution map.

[0006] Furthermore, the acquiring of real-time temperature data of the projector and associating the real-time temperature data with the heat distribution map to obtain corresponding real-time heat dissipation requirements include: Perform temperature sampling at multiple key points inside the projector to obtain real-time temperature sampling data; Performing time series analysis on the real-time temperature sampling data to obtain a temperature change trend; Dynamically updating the thermal distribution map according to the temperature change trend to obtain a real-time thermal distribution map; Performing heat flow analysis on the real-time heat distribution map to obtain a three-dimensional heat flow model, wherein the heat flow analysis includes: Discretize the internal space of the projector into grid units, and construct a heat balance equation for each of the grid units; Performing conduction calculation on the heat balance equation according to the temperature gradient of adjacent grid cells to obtain a heat conduction term; Performing convection calculation on the heat balance equation in combination with the air flow distribution inside the projector to obtain a heat convection term; Perform radiation calculation on the heat balance equation in combination with the surface characteristics of the projector to obtain corresponding heat radiation terms; The heat balance equation corresponding to each of the grid units is adjusted according to the heat conduction term, the heat convection term and the heat radiation term to obtain an optimized heat balance equation; Integrating the optimized heat balance equations of all the grid cells into an overall heat transfer equation set; Solving the heat transfer equations by finite difference method to obtain the three-dimensional heat flow model; Calculating the heat load of each component according to the three-dimensional heat flow model to obtain the heat load distribution; Performing regional analysis on the heat load distribution to obtain key heat dissipation areas; A heat dissipation analysis is performed based on the heat dissipation key areas and the heat flow three-dimensional model to obtain real-time heat dissipation requirements.

[0007] Furthermore, the acquiring of the light source output data and processor performance data of the projector and the prediction of the real-time heat dissipation demand to obtain the corresponding heat dissipation trend include: Quantitatively calculate the thermal radiation characteristics of the light source output data to obtain the light source thermal radiation index; Calculating the heat generation characteristics of the processor performance data to obtain a heat generation value of the processor; Performing data fusion on the thermal radiation index of the light source and the heat generation value of the processor to obtain a comprehensive heat source feature; Performing heat diffusion analysis on the interior of the projector according to the comprehensive heat source characteristics and the real-time heat dissipation requirements to obtain a heat diffusion prediction result; Based on the heat diffusion prediction result, a temperature change analysis is performed on the temperature changes of the components of the projector to obtain a temperature change curve; Quantitatively calculate the heat dissipation demand according to the temperature change curve to obtain a heat dissipation demand index; Prioritize the heat dissipation demand index and the preset heat dissipation threshold to obtain a heat dissipation priority; Allocate heat dissipation resources based on the heat dissipation priority to obtain a heat dissipation resource allocation plan for the projector; Performing temperature prediction on the projector heat dissipation resource allocation scheme according to the temperature change curve to obtain a temperature balance prediction result; A heat dissipation trend calculation is performed based on the temperature balance prediction result to obtain the heat dissipation trend.

[0008] Furthermore, the heat dissipation planning analysis is performed on the real-time heat dissipation demand and the heat dissipation trend to obtain a corresponding initial heat dissipation control solution, including: Performing structural fluid analysis on the real-time heat dissipation demand to obtain corresponding flow field characteristic data; Performing wavelet transform decomposition on the heat dissipation trend to obtain trend components of different scales; Evaluate the heat transfer efficiency of the structure according to the flow field characteristic data and the trend component to obtain a corresponding heat dissipation efficiency curve; Based on the heat dissipation efficiency curve, the equipment heat dissipation mode is planned to obtain a corresponding equipment operation plan; Perform heat dissipation control parameter analysis according to the equipment operation plan to obtain a corresponding control parameter set; The equipment operation plan is integrated with the control parameter set to obtain the initial heat dissipation control plan.

[0009] Furthermore, the real-time temperature data is subjected to high temperature identification through a preset nonlinear dynamic model, and adjustment analysis is performed in combination with the heat dissipation trend to obtain a corresponding performance adjustment strategy, including: Inputting the real-time temperature data into the nonlinear dynamic model, performing overall heat balance analysis on the real-time temperature data through the macroscopic thermodynamic layer of the nonlinear dynamic model, and obtaining macroscopic heat information; Performing heat conduction path and hot spot area analysis on the real-time temperature data through the microscopic heat conduction layer of the nonlinear dynamic model to obtain heat conduction distribution information; Inputting the heat dissipation trend into the nonlinear dynamic model, performing air flow path simulation analysis on the heat dissipation trend through the convection heat transfer layer of the nonlinear dynamic model, and obtaining air flow change information; Performing radiation characteristic analysis and high temperature radiation area identification on the heat dissipation trend through the radiation heat exchange layer of the nonlinear dynamic model to obtain radiation area information; The macroscopic heat information, the heat conduction distribution information, the airflow change information and the radiation area information are comprehensively analyzed through the processing layer of the nonlinear dynamic model to obtain and output the performance adjustment strategy.

[0010] Furthermore, the initial heat dissipation control scheme and the performance adjustment strategy are comprehensively analyzed to obtain a corresponding global heat dissipation and noise reduction strategy, including: Decomposing the initial heat dissipation control scheme to obtain multiple heat dissipation sub-schemes; Decomposing the performance adjustment strategy to obtain a plurality of performance adjustment sub-strategies; Constructing a corresponding strategy objective function according to the heat dissipation sub-scheme and the performance adjustment sub-strategy, wherein the strategy objective function includes a heat dissipation efficiency parameter and a noise level parameter; Optimizing and calculating the strategy objective function to obtain a corresponding candidate solution; Clustering the heat dissipation sub-schemes and the performance adjustment sub-strategies according to the candidate solutions to obtain multiple heat dissipation and noise reduction strategy combinations; Performing strategy screening on the heat dissipation and noise reduction strategy combination according to a preset heat dissipation and noise reduction threshold to obtain a screening strategy combination; Based on the screening strategy combination, the initial heat dissipation control scheme and the performance adjustment strategy are globally adjusted to obtain the global heat dissipation and noise reduction strategy The present invention further provides a projector heat dissipation and noise reduction device, which is applied to any one of the above projector heat dissipation and noise reduction methods, comprising: An acquisition module, the acquisition module is used to obtain internal structure data and ambient temperature information of the projector, and perform thermal simulation analysis on the internal structure data based on the ambient temperature information to obtain a corresponding thermal distribution map; An analysis module, the analysis module is used to obtain real-time temperature data of the projector, and associate it with the thermal distribution map to obtain corresponding real-time heat dissipation requirements; A correlation module, the correlation module is used to obtain the light source output data and processor performance data of the projector, and predict the real-time heat dissipation demand to obtain a corresponding heat dissipation trend; A processing module, the processing module is used to perform a heat dissipation planning analysis on the real-time heat dissipation demand and the heat dissipation trend to obtain a corresponding initial heat dissipation control solution; A control module, the control module is used to perform high temperature recognition on the real-time temperature data through a preset nonlinear dynamic model, and perform adjustment analysis in combination with the heat dissipation trend to obtain a corresponding performance adjustment strategy; An execution module is used to comprehensively analyze the initial heat dissipation control solution and the performance adjustment strategy to obtain a corresponding global heat dissipation and noise reduction strategy.

[0011] The present invention also provides a projector heat dissipation and noise reduction device, comprising: Memory, used to store programs; The processor is used to execute the program to implement each step of any one of the above-mentioned methods for heat dissipation and noise reduction of a projector.

[0012] The present invention also provides a storage medium storing computer instructions, wherein the computer instructions are used to enable a computer to execute any of the above methods.

[0013] The present invention provides a method, device, equipment and storage medium for projector heat dissipation and noise reduction, which has the following beneficial effects: By performing thermal simulation analysis on the internal structure data and ambient temperature information of the projector, a thermal distribution map is obtained, which provides a more accurate theoretical basis for heat dissipation control and helps to achieve refined heat dissipation management. Combining real-time temperature data and thermal distribution map for correlation processing can timely reflect the actual heat dissipation needs of the projector, avoid the problem of excessive or insufficient heat dissipation, and improve the heat dissipation efficiency. By analyzing the light source output and processor performance data, the heat dissipation demand is predicted, making the heat dissipation control forward-looking and better able to cope with the changes in heat dissipation demand under different usage scenarios. The nonlinear dynamic model is used for high temperature identification, and the performance adjustment strategy is formulated in combination with the heat dissipation trend, realizing the organic combination of heat dissipation control and performance adjustment, optimizing the heat dissipation effect while ensuring the performance of the equipment. By comprehensively analyzing the initial heat dissipation control scheme and the performance adjustment strategy, a global heat dissipation noise reduction strategy is obtained, achieving a balance between heat dissipation effect, noise control and performance output, and improving the overall operation efficiency of the projector. The heat dissipation strategy can be flexibly adjusted according to different usage environments and working conditions to adapt to a variety of application scenarios, improving the adaptability and user experience of the projector. In summary, the present invention overcomes the shortcomings of the existing heat dissipation and noise reduction methods, which are simplistic and one-sided, realizes the intelligent and refined heat dissipation control of the projector, effectively improves the heat dissipation efficiency, reduces the noise level, and at the same time ensures the performance of the equipment, providing users with a better user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a flow chart of a method for heat dissipation and noise reduction of a projector provided by the present invention; Figure 2 This is a structural diagram of a projector heat dissipation and noise reduction device provided by the present invention; Figure 3 This is a structural diagram of a projector heat dissipation and noise reduction device provided by the present invention.

[0015] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0016] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0017] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods.

[0018] Reference Figure 1 As shown, the present invention provides a method for heat dissipation and noise reduction of a projector, comprising: Step S1: obtaining the internal structure data and ambient temperature information of the projector, and performing thermal simulation analysis to obtain a corresponding thermal distribution map; Step S2: obtaining the real-time temperature data of the projector, and calculating the heat dissipation demand with the heat distribution map to obtain the corresponding real-time heat dissipation demand; Step S3: Obtaining the light source output data and processor performance data of the projector, and predicting the real-time heat dissipation demand to obtain the corresponding heat dissipation trend; Step S4: performing heat dissipation planning analysis on the real-time heat dissipation demand and heat dissipation trend to obtain a corresponding initial heat dissipation control plan; Step S5: high temperature recognition is performed on the real-time temperature data through a preset nonlinear dynamic model, and adjustment analysis is performed in combination with the heat dissipation trend to obtain a corresponding performance adjustment strategy; Step S6: Comprehensively analyze the initial heat dissipation control solution and the performance adjustment strategy to obtain a corresponding global heat dissipation and noise reduction strategy.

[0019] Based on the above steps, the detailed process is as follows: Step S1: Obtain the internal structure data of the projector and record the location, size and material properties of key components, such as light source, processor, heat sink, etc.

[0020] Install temperature sensors around the projector to monitor the ambient temperature in real time, record the changes in ambient temperature in different time periods, and form a temperature curve.

[0021] Import the internal structure data into thermal simulation software (such as ANSYS, COMSOL, etc.), set the ambient temperature as the boundary condition, and perform steady-state and transient thermal simulations. Analyze the simulation results, generate a thermal distribution map, and display the temperature distribution of each component.

[0022] Step S2: Install temperature sensors at key locations inside the projector to monitor the temperature in real time, and transmit the temperature data to the control center via a wireless transmission module.

[0023] Compare real-time temperature data with the heat distribution map to identify high-temperature areas. Calculate the real-time cooling requirements of each component based on the temperature difference and the preset threshold. Use the thermal resistance and thermal capacitance formula to calculate the required cooling power.

[0024] Step S3: Obtain the real-time output power and brightness of the light source through a light sensor or built-in software, and record the working status and historical data of the light source.

[0025] The system monitoring software can be used to obtain the real-time workload and frequency of the processor and record the historical performance data and usage of the processor.

[0026] Use time series analysis to predict real-time cooling requirements. Combine light source output data and processor performance data. Analyze the prediction results to obtain cooling trends over a period of time in the future.

[0027] Step S4: Integrate the real-time cooling demand with the cooling trend to obtain a comprehensive data set including current and future cooling demand information.

[0028] The combined data is analyzed using an optimization algorithm (e.g., genetic algorithm), taking into account the capabilities and limitations of the cooling device, such as fan speed, heat sink thermal conductivity, etc. The optimization goal is to minimize the temperature fluctuations of the projector while satisfying all operating conditions.

[0029] According to the analysis results, an initial heat dissipation control plan is formulated, which includes fan speed adjustment, heat sink position optimization, airflow path design, etc. The plan needs to have dynamic adjustment capabilities to adapt to real-time demand changes.

[0030] Step S5: Establish a nonlinear dynamic model to simulate the temperature changes inside the projector, input real-time temperature data, and the model automatically identifies high temperature areas and potential overheating risks.

[0031] Combined with heat dissipation trend data, identify operating conditions that may cause high temperatures. Analyze the causes of high temperatures under different operating conditions and develop targeted adjustment strategies.

[0032] Develop adjustment strategies, such as reducing light source power, adjusting processor frequency, increasing fan speed, etc. Ensure that the adjustment strategy can effectively reduce the risk of high temperature without significantly affecting projector performance.

[0033] Step S6: Integrate the initial heat dissipation control solution and the performance adjustment strategy, evaluate the compatibility and interaction between the two, and ensure the feasibility and efficiency of the overall solution.

[0034] Based on comprehensive analysis, a global heat dissipation and noise reduction strategy is formulated, which includes a dynamic adjustment mechanism that can respond to different working conditions and temperature changes in real time. Considering the noise reduction effect, the fan speed and airflow path are adjusted to reduce operating noise.

[0035] After implementing the global strategy, continuously monitor system performance and optimize through data feedback.

[0036] Use feedback data to adjust parameters in the strategy to achieve better heat dissipation and noise reduction.

[0037] The present invention provides a method for heat dissipation and noise reduction of a projector. By performing thermal simulation analysis on the internal structure data and ambient temperature information of the projector, a thermal distribution map is obtained, which provides a more accurate theoretical basis for heat dissipation control and helps to realize refined heat dissipation management. By combining real-time temperature data and thermal distribution map for correlation processing, the actual heat dissipation demand of the projector can be reflected in time, the problem of excessive heat dissipation or insufficient heat dissipation is avoided, and the heat dissipation efficiency is improved. By analyzing the output of the light source and the performance data of the processor, the heat dissipation demand is predicted, so that the heat dissipation control is forward-looking and can better cope with the changes in heat dissipation demand under different usage scenarios. A nonlinear dynamic model is used for high temperature identification, and a performance adjustment strategy is formulated in combination with the heat dissipation trend, so as to realize the organic combination of heat dissipation control and performance adjustment, and optimize the heat dissipation effect while ensuring the performance of the equipment. By comprehensively analyzing the initial heat dissipation control scheme and the performance adjustment strategy, a global heat dissipation and noise reduction strategy is obtained, which realizes the balance between heat dissipation effect, noise control and performance output, and improves the overall operation efficiency of the projector. The heat dissipation strategy can be flexibly adjusted according to different usage environments and working states to adapt to a variety of application scenarios, thereby improving the adaptability and user experience of the projector. In summary, the present invention overcomes the shortcomings of the existing heat dissipation and noise reduction methods, which are simplistic and one-sided, realizes the intelligent and refined heat dissipation control of the projector, effectively improves the heat dissipation efficiency, reduces the noise level, and at the same time ensures the performance of the equipment, providing users with a better user experience.

[0038] In one embodiment, a thermal simulation analysis is performed on the internal structure data based on the ambient temperature information to obtain a corresponding thermal distribution map, including: The internal structure data of the projector is modeled in detail in 3D to construct the precise geometry and size of each component of the projector. These structural data are meshed to form a computational mesh consisting of a series of hexahedral units. The purpose of meshing is to divide the space inside the projector into sufficiently small areas so that the subsequent thermal simulation analysis can provide accurate results.

[0039] Obtain the thermophysical parameters of each component of the projector, including the thermal conductivity, specific heat capacity, heat capacity, and thermal resistance of the material. The accurate acquisition of these parameters is crucial for the subsequent assignment of thermophysical properties. Based on these thermophysical parameters, assign corresponding attribute values ​​to each unit in the calculation grid. This includes assigning parameters such as thermal conductivity and specific heat capacity of the material to each unit.

[0040] Set boundary conditions and initial conditions, which are determined based on the ambient temperature information. Boundary conditions include the heat exchange between the projector surface and the environment, while initial conditions refer to the temperature distribution state at the beginning of the simulation. Combine these conditions with the thermal physics calculation data and solve using the finite difference method.

[0041] After the solution is completed, the discrete temperature field data is subjected to bilinear interpolation in order to obtain a more continuous temperature distribution function. This interpolation process reduces the discontinuity of the temperature distribution, making the obtained temperature distribution smoother and closer to the actual physical situation.

[0042] Based on the continuous temperature distribution function, a heat distribution matrix is ​​generated. This matrix contains the temperature values ​​of each point inside the projector, and the heat distribution map is drawn based on these values. The heat distribution matrix is ​​pseudo-colored, that is, the temperature values ​​are mapped to a color sequence, so as to intuitively show the temperature distribution of each part inside the projector.

[0043] This embodiment can simulate the internal space more accurately by meshing the internal structure data of the projector, provide a good foundation for subsequent thermal simulation analysis, and improve the accuracy of the analysis. The calculation grid is assigned according to the thermophysical parameters so that the thermal simulation can accurately simulate the thermal behavior of each component, which helps to fully understand the thermal characteristics of the projector. By reasonably setting the boundary conditions and initial conditions and solving them using the finite difference method, more accurate discrete temperature field data can be obtained, providing a reliable basis for subsequent processing. Generating a thermal distribution matrix and performing pseudo-color processing can intuitively display the temperature distribution of various parts inside the projector, making it easier to discover potential thermal problems and optimize them.

[0044] In one embodiment, real-time temperature data of the projector is obtained, and the real-time temperature data is associated with a heat distribution map to obtain corresponding real-time heat dissipation requirements, including: During the operation of the projector, temperature samples are taken at multiple key points inside the projector. For example, temperature sensors are set at key parts such as light bulbs and circuit boards to obtain real-time temperature sampling data.

[0045] Perform time series analysis on these real-time temperature sampling data. By analyzing the data changes over a period of time, find out the temperature change trend. For example, if the data shows that the temperature is gradually rising, then it can be judged that the temperature is on an upward trend.

[0046] The pre-built thermal distribution map is dynamically updated based on the temperature change trend. For example, if the temperature rise trend in some areas is more obvious, the temperature mark of the corresponding area in the thermal distribution map will be increased accordingly, thus obtaining a real-time thermal distribution map.

[0047] The real-time heat distribution map is subjected to heat flow analysis to obtain a three-dimensional heat flow model. The specific operation is as follows: the internal space of the projector is discretized into grid cells. Each grid cell represents a small area inside the projector. Then, a heat balance equation is constructed for each grid cell.

[0048] When constructing the heat balance equation, the conduction calculation is performed based on the temperature gradient of adjacent grid cells to obtain the heat conduction term. The larger the temperature gradient, the larger the value of the heat conduction term, indicating that the heat conduction effect in this area is more obvious.

[0049] Combined with the airflow distribution inside the projector, the convection calculation of the heat balance equation is performed to obtain the heat convection term. If the airflow speed in a certain area is faster, the value of the heat convection term will be correspondingly larger, indicating that the convection heat dissipation effect in this area is more significant.

[0050] The heat balance equation is calculated by combining the surface characteristics of the projector to obtain the thermal radiation term. For example, the value of the thermal radiation term may be relatively large in areas with darker surface color and greater roughness.

[0051] The heat balance equation corresponding to each grid unit is adjusted according to the heat conduction term, heat convection term and heat radiation term to obtain the optimized heat balance equation. The optimized heat balance equations of all grid units are integrated into the overall heat transfer equation group.

[0052] The heat transfer equations are solved by the finite difference method to obtain a three-dimensional heat flow model. The heat load of each component is calculated based on the three-dimensional heat flow model to obtain the heat load distribution.

[0053] Perform regional analysis on the heat load distribution to identify areas with higher heat loads, i.e., key areas for heat dissipation.

[0054] Perform heat dissipation analysis based on the heat dissipation focus area and the three-dimensional heat flow model to determine the real-time heat dissipation requirements of the projector under the current working state. For example, if the temperature of the heat dissipation focus area is too high, then the heat dissipation measures in this area need to be strengthened to meet the real-time heat dissipation requirements.

[0055] This embodiment samples and analyzes the temperature of key points inside the projector, which can accurately grasp its temperature changes and provide an accurate basis for heat dissipation and noise reduction. The temperature change trend obtained by time series analysis is helpful to timely discover potential overheating problems and make heat dissipation adjustments in advance. Dynamically updating the heat distribution map and building a three-dimensional heat flow model can fully understand the heat distribution and flow inside the projector, so as to optimize the heat dissipation in a targeted manner. Regional analysis of the heat load distribution can clarify the key areas of heat dissipation, improve the heat dissipation efficiency, and effectively reduce the risk of projector failure due to overheating. Heat dissipation analysis based on real-time heat dissipation needs can achieve precise heat dissipation, reduce noise generation while ensuring the normal operation of the projector, and improve the user experience.

[0056] In one embodiment, light source output data and processor performance data of the projector are obtained, and real-time heat dissipation requirements are predicted to obtain corresponding heat dissipation trends, including: Obtain the projector's light source output data and processor performance data. Light source output data includes parameters such as light source power and brightness, while processor performance data includes information such as processor operating frequency and load. This data is collected and analyzed in real time through the built-in sensor system.

[0057] The thermal radiation characteristics of the light source output data are quantitatively calculated to obtain the light source thermal radiation index. The light source thermal radiation index is obtained by statistical analysis of the light source output data and calculation of empirical formulas, which indicates the heat output capacity of the light source under the current working state. For example, the heat generated by the light source can be estimated by its power and brightness.

[0058] The heat generation characteristics of the processor performance data are calculated to obtain the processor heat generation value. The processor heat generation value is calculated by analyzing the operating frequency and load of the processor, and reflects the heat generation capacity of the processor under the current working state. For example, the relationship between the power consumption and operating frequency of the processor can help estimate the heat it generates.

[0059] The light source thermal radiation index and the processor heat generation value are fused to obtain the comprehensive heat source characteristics. The comprehensive heat source characteristics take into account the heat characteristics of the light source and the processor through weighted average or other data fusion methods to form a unified indicator for evaluating the overall heat output of the projector.

[0060] Based on the comprehensive heat source characteristics and real-time heat dissipation requirements, the heat diffusion analysis inside the projector is performed to obtain the heat diffusion prediction results. The heat diffusion prediction results predict the heat diffusion between different components by analyzing the heat transfer path and heat dissipation conditions inside the projector. For example, the heat diffusion effect is estimated based on the air duct layout and radiator position inside the projector.

[0061] Based on the thermal diffusion prediction results, the temperature changes of each component of the projector are analyzed to obtain the temperature change curve. The temperature change curve shows the temperature changes of each component over a period of time. These data can be used to evaluate the heat dissipation effect of the projector.

[0062] The heat dissipation demand is quantitatively calculated based on the temperature change curve to obtain the heat dissipation demand index. The heat dissipation demand index quantifies the heat dissipation demand of the current projector by analyzing the temperature change of each component and combining it with the real-time heat dissipation demand. For example, if the temperature of some components rises faster, the heat dissipation demand index will increase accordingly.

[0063] The cooling demand index and the preset cooling threshold are analyzed to obtain the cooling priority. The cooling priority determines the components and areas that need to be cooled first by comparing the cooling demand index and the preset cooling threshold. For example, if the temperature of a component is close to the preset cooling threshold, the cooling priority of the component will be increased.

[0064] Based on the cooling priority, cooling resources are allocated to obtain a cooling resource allocation scheme for the projector. The cooling resource allocation scheme includes measures such as fan speed adjustment and radiator activation to meet the cooling requirements of different components. For example, the fan speed can be increased to improve the cooling effect, or a backup radiator can be activated to disperse the heat.

[0065] The temperature balance prediction result is obtained by performing temperature prediction on the projector cooling resource allocation scheme according to the temperature change curve. The temperature balance prediction result predicts the temperature change of each component under the new cooling conditions by analyzing the effect of the cooling resource allocation scheme. For example, the impact of fan speed adjustment or radiator activation on temperature is evaluated.

[0066] The heat dissipation trend is calculated based on the temperature balance prediction results to obtain the heat dissipation trend. The heat dissipation trend estimates the temperature change trend of the projector under the current heat dissipation management by analyzing the temperature balance prediction results, providing a basis for subsequent heat dissipation optimization. For example, if the temperature balance prediction results show that the temperature continues to rise, the heat dissipation solution needs to be further optimized.

[0067] This embodiment realizes the accurate quantification and distribution prediction of the internal heat of the projector through the real-time collection and analysis of the projector light source output data and processor performance data, thereby improving the scientificity and accuracy of heat dissipation management. By using the data fusion of the thermal radiation index and the heat generation value, the overall heat output of the projector can be comprehensively evaluated to ensure that the heat dissipation management plan is more comprehensive and effective. Through the calculation of the temperature change curve and the heat dissipation demand index, the allocation of heat dissipation resources can be dynamically adjusted so that the heat dissipation needs of different components are met first, thereby improving the reliability and service life of the projector. Resource allocation based on heat dissipation priority ensures the efficient use of heat dissipation resources and avoids excessive or insufficient heat dissipation problems. In addition, through the temperature balance prediction results and the calculation of the heat dissipation trend, the potential overheating risk can be predicted in advance, so that preventive adjustments can be made to further optimize the heat dissipation performance of the projector.

[0068] In one embodiment, a heat dissipation planning analysis is performed on the real-time heat dissipation demand and heat dissipation trend to obtain a corresponding initial heat dissipation control solution, including: Structural fluid analysis is performed on the real-time heat dissipation requirements of electronic equipment. In this process, based on the internal structural layout and air flow of the device, the fluid flow inside the device is simulated to obtain the corresponding flow field characteristic data, such as flow velocity distribution, pressure distribution, etc.

[0069] Perform wavelet transform decomposition on the heat dissipation trend. The heat dissipation trend may be affected by many factors, such as changes in the workload of the equipment, fluctuations in ambient temperature, etc. Through wavelet transform, the heat dissipation trend is decomposed into trend components of different scales, so as to understand the changing characteristics of the heat dissipation trend in more detail.

[0070] The structural heat transfer efficiency is evaluated based on the flow field characteristic data and trend components obtained previously. In this step, the heat dissipation efficiency of the equipment is evaluated based on the changes in fluid flow conditions and heat dissipation trends. The corresponding heat dissipation efficiency curve is calculated, which can reflect the heat dissipation capacity of the equipment under different working conditions.

[0071] Based on the heat dissipation efficiency curve, the equipment heat dissipation mode is planned. According to the heat dissipation capacity shown by the curve, the heat dissipation mode suitable for the equipment is determined, such as adjusting the fan speed, optimizing the layout of the heat sink, etc., so as to obtain the corresponding equipment operation plan.

[0072] The heat dissipation control parameter analysis is performed according to the equipment operation plan. In this process, based on the impact of various factors in the equipment operation plan on the heat dissipation effect, the optimal control parameters, such as fan speed, heat sink temperature, etc., are determined through experiments and simulations, and finally the corresponding control parameter set is obtained.

[0073] Integrate the equipment operation plan with the control parameter set to form a complete initial heat dissipation control plan. This plan will include the specific operation mode of the equipment and the corresponding control parameters This embodiment performs structural fluid analysis on real-time heat dissipation requirements to obtain flow field characteristic data, and combines the trend components obtained by wavelet transform decomposition of the heat dissipation trend to perform structural heat transfer efficiency evaluation, which can more accurately plan the heat dissipation mode and effectively improve the heat dissipation effect of the equipment. The equipment heat dissipation mode is planned according to the heat dissipation efficiency curve, so that the equipment heat dissipation mode can be flexibly adjusted according to different working conditions and heat dissipation requirements, thereby enhancing the adaptability of the equipment to different working environments. The control parameter set is obtained through heat dissipation control parameter analysis and integrated with the equipment operation plan, which can achieve precise control of equipment heat dissipation, optimize the equipment's operating status, and extend the equipment's service life.

[0074] In one embodiment, high temperature recognition is performed on real-time temperature data through a preset nonlinear dynamic model, and adjustment analysis is performed in combination with the heat dissipation trend to obtain a corresponding performance adjustment strategy, including: The real-time temperature data of the projector during operation is obtained and input into the preset nonlinear dynamic model. The macroscopic thermodynamic layer of the nonlinear dynamic model will perform an overall heat balance analysis on these real-time temperature data. In this process, the macroscopic thermodynamic layer will calculate the heat generated by each component inside the projector and the heat exchange with the external environment, thereby obtaining macroscopic heat information.

[0075] Among them, the calculation functions of the macroscopic thermodynamic layer include: in is the input heat, is the change in heat absorbed, is the change in heat emitted.

[0076] The microscopic heat conduction layer of the model will analyze the heat conduction path and hot spot areas of the real-time temperature data. By analyzing the heat conduction method inside the projector and the areas prone to high temperatures, the heat conduction distribution information is obtained. The function describes the conduction of heat inside the material, involving temperature gradient and thermal conductivity.

[0077] The calculation function of the heat conduction layer is: ,in is the temperature, It's the location. is the heat flux, is the thermal conductivity, is the cross-sectional area of ​​the conductor.

[0078] Monitor the heat dissipation trend of the projector and input it into the nonlinear dynamic model. The convection heat transfer layer of the model will simulate the air flow path analysis of the heat dissipation trend. In this link, the convection heat transfer layer will predict the flow path of air inside the projector based on the heat dissipation trend, thereby obtaining air flow change information. This is extremely important for optimizing the design of the heat dissipation duct and improving the heat dissipation efficiency. The convection heat transfer layer is used to calculate the convection process of heat through the fluid medium, which involves the temperature, flow rate and heat transfer coefficient of the fluid.

[0079] The calculation function of the convection heat transfer layer is: ; in, is the heat transfer coefficient, is the heat exchange area, is the fluid temperature, is the surface temperature.

[0080] The radiation heat transfer layer of the nonlinear dynamic model analyzes the radiation characteristics of the heat dissipation trend and identifies the high-temperature radiation area. The radiation heat transfer layer analyzes the characteristics of heat transfer in the form of radiation and the areas where high-temperature radiation may occur, thereby obtaining radiation area information. This helps to take measures to reduce the impact of radiation on projector performance. The radiation heat transfer layer involves emissivity and temperature.

[0081] The calculation function of the radiation heat transfer layer is: in is the Stefan-Boltzmann constant, is the emissivity, B is the radiating area, is the temperature of the object, is the ambient temperature.

[0082] The processing layer of the nonlinear dynamics model will conduct a comprehensive analysis of macroscopic heat information, heat conduction distribution information, airflow change information, and radiation area information. The processing layer will integrate this information to evaluate the overall heat dissipation of the projector and possible problems, and generate performance adjustment strategies accordingly. For example, if it is found that the heat in a certain area is too high, the processing layer may recommend increasing the heat dissipation measures in that area, or adjusting the fan speed to enhance air flow. Through this comprehensive analysis and adjustment, efficient heat dissipation and noise reduction of the projector can be achieved, and its performance and stability can be improved.

[0083] This embodiment uses a nonlinear dynamic model to comprehensively analyze real-time temperature data and heat dissipation trends, and can accurately determine heat distribution, heat conduction path, air flow path, and radiation area, so as to take targeted heat dissipation measures to improve heat dissipation efficiency. The performance adjustment strategy generated based on the analysis results can optimize the heat dissipation system, such as reasonably adjusting the fan speed, etc., while ensuring the heat dissipation effect, reducing operating noise and improving the user experience. Comprehensive consideration of multiple heat dissipation factors helps to promptly discover and solve possible heat dissipation problems, avoid the impact of overheating on the performance of the projector, and improve its overall performance and stability.

[0084] In one embodiment, the initial heat dissipation control scheme and the performance adjustment strategy are comprehensively analyzed to obtain a corresponding global heat dissipation and noise reduction strategy, including: Perform a detailed breakdown of the initial thermal control solution to identify and understand the various components and parameters used to control the projector's thermal system. This step includes analyzing the configuration of the cooling fan, the design of the cooling channel, the type of heat exchange media, and the thermal management strategy.

[0085] Breaking down the performance tuning strategy involves analyzing the projector's performance parameters, including image quality, brightness, contrast, response time, etc., and how these parameters are balanced with cooling requirements.

[0086] After the decomposition is completed, the strategy objective function is constructed based on the heat dissipation sub-scheme and performance adjustment sub-strategy. This objective function aims to maximize the heat dissipation efficiency while minimizing the noise level. The objective function includes the weighted sum of parameters such as heat dissipation, temperature change rate, and noise decibel number.

[0087] The strategy objective function is optimized by calculation, such as genetic algorithm, particle swarm optimization or simulated annealing algorithm, to find the optimal solution, that is, the best heat dissipation and noise reduction combination.

[0088] Based on the candidate solutions, the heat dissipation sub-schemes and performance adjustment sub-strategies are clustered to identify strategy combinations with similar characteristics. This reduces the number of strategy combinations and facilitates subsequent screening.

[0089] According to the preset heat dissipation noise reduction threshold, the strategy combination obtained by clustering is screened to obtain the screening strategy combination that meets the heat dissipation noise reduction threshold, and the heat dissipation noise reduction threshold includes the maximum allowable temperature change range and the upper limit range of the noise level.

[0090] Based on the combination of screening strategies, the initial heat dissipation control scheme and performance adjustment strategy are adjusted globally. This step includes updating the heat dissipation control software, adjusting the fan speed, changing the switching strategy of the heat dissipation module, and adjusting the image processing algorithm. The global heat dissipation and noise reduction strategy is obtained.

[0091] This embodiment improves the heat dissipation efficiency and reduces the noise level by comprehensively analyzing the initial heat dissipation control scheme and performance adjustment strategy, thereby enhancing the user experience. The initial heat dissipation control scheme and performance adjustment strategy are decomposed, the strategy objective function is constructed and optimized, and the heat dissipation and noise reduction strategies can be flexibly adjusted according to actual needs. Clustering and screening are performed based on candidate solutions, and the heat dissipation sub-schemes and performance adjustment sub-strategies are reasonably combined to avoid waste of resources. Screening and global adjustment are performed based on the preset heat dissipation noise reduction threshold to ensure that the final global heat dissipation noise reduction strategy can meet actual needs and improve the performance and reliability of the projector.

[0092] Reference Figure 2 As shown, the present invention also provides a projector heat dissipation and noise reduction device, which is applied to any one of the above projector heat dissipation and noise reduction methods, comprising: An acquisition module is used to obtain the internal structure data and ambient temperature information of the projector, and perform thermal simulation analysis on the internal structure data based on the ambient temperature information to obtain a corresponding thermal distribution map; An analysis module is used to obtain the real-time temperature data of the projector, associate it with the thermal distribution map, and obtain the corresponding real-time heat dissipation requirements; The correlation module is used to obtain the light source output data and processor performance data of the projector, and predict the real-time heat dissipation demand to obtain the corresponding heat dissipation trend; A processing module, which is used to perform heat dissipation planning analysis on real-time heat dissipation requirements and heat dissipation trends, and obtain a corresponding initial heat dissipation control plan; The control module is used to identify high temperatures of real-time temperature data through a preset nonlinear dynamic model, and to adjust and analyze the heat dissipation trend to obtain a corresponding performance adjustment strategy; The execution module is used to comprehensively analyze the initial heat dissipation control plan and the performance adjustment strategy to obtain the corresponding global heat dissipation and noise reduction strategy.

[0093] The present invention provides a projector heat dissipation and noise reduction device. By performing thermal simulation analysis on the internal structure data and ambient temperature information of the projector, a heat distribution map is obtained, which provides a more accurate theoretical basis for heat dissipation control and helps to achieve refined heat dissipation management. By combining real-time temperature data and heat distribution map for correlation processing, the actual heat dissipation demand of the projector can be reflected in time, the problem of excessive heat dissipation or insufficient heat dissipation can be avoided, and the heat dissipation efficiency can be improved. By analyzing the light source output and processor performance data, the heat dissipation demand is predicted, so that the heat dissipation control is forward-looking and can better cope with the changes in heat dissipation demand under different usage scenarios. A nonlinear dynamic model is used for high temperature identification, and a performance adjustment strategy is formulated in combination with the heat dissipation trend, so as to achieve an organic combination of heat dissipation control and performance adjustment, and optimize the heat dissipation effect while ensuring the performance of the equipment. By comprehensively analyzing the initial heat dissipation control scheme and the performance adjustment strategy, a global heat dissipation and noise reduction strategy is obtained, which achieves a balance between heat dissipation effect, noise control and performance output, and improves the overall operation efficiency of the projector. The heat dissipation strategy can be flexibly adjusted according to different usage environments and working conditions to adapt to a variety of application scenarios, thereby improving the adaptability and user experience of the projector. In summary, the present invention overcomes the shortcomings of the existing heat dissipation and noise reduction methods, which are simplistic and one-sided, realizes the intelligent and refined heat dissipation control of the projector, effectively improves the heat dissipation efficiency, reduces the noise level, and at the same time ensures the performance of the equipment, providing users with a better user experience.

[0094] Reference Figure 3 As shown, the present invention also provides a projector heat dissipation and noise reduction device, comprising: Memory, used to store programs; The processor is used to execute the program to implement each step of any one of the above-mentioned methods for heat dissipation and noise reduction of a projector.

[0095] In this embodiment, the processor and the memory may be connected via a bus or other means. The memory may include a volatile memory, such as a random access memory; the memory may also include a non-volatile memory, such as a read-only memory, a flash memory, a hard disk, or a solid-state drive. The processor may be a general-purpose processor, such as a central processing unit, a digital signal processor, an application-specific integrated circuit, or one or more integrated circuits configured to implement the embodiments of the present invention.

[0096] The present invention also provides a storage medium storing computer instructions, wherein the computer instructions are used to enable a computer to execute any of the above methods.

[0097] It should be noted that technicians in the relevant technical field can clearly understand that for the convenience and conciseness of description, the specific working process of the system and each module described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0098] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for heat dissipation and noise reduction of a projector, characterized in that: include: Obtain the internal structure data and ambient temperature information of the projector, and perform thermal simulation analysis to obtain the corresponding thermal distribution map; Acquire real-time temperature data of the projector, calculate the heat dissipation demand with the heat distribution map, and obtain the corresponding real-time heat dissipation demand; Acquire light source output data and processor performance data of the projector, and predict the real-time heat dissipation demand to obtain a corresponding heat dissipation trend; Performing heat dissipation planning analysis on the real-time heat dissipation demand and the heat dissipation trend to obtain a corresponding initial heat dissipation control solution; High temperature recognition is performed on the real-time temperature data through a preset nonlinear dynamic model, and adjustment analysis is performed in combination with the heat dissipation trend to obtain a corresponding performance adjustment strategy; The initial heat dissipation control scheme and the performance adjustment strategy are comprehensively analyzed to obtain a corresponding global heat dissipation and noise reduction strategy.

2. The projector heat dissipation and noise reduction method according to claim 1, characterized in that: The performing thermal simulation analysis on the internal structure data based on the ambient temperature information to obtain a corresponding thermal distribution map includes: Gridding the internal structure data to obtain a corresponding calculation grid; Acquiring thermophysical parameters of each component of the projector, assigning thermophysical properties to the calculation grid according to the thermophysical parameters, and obtaining thermophysical calculation data; Setting boundary conditions and initial conditions according to the ambient temperature information, and solving the thermal physical calculation data by a finite difference method based on the boundary conditions and the initial conditions to obtain discrete temperature field data; Performing bilinear interpolation processing on the discrete temperature field data to obtain a continuous temperature distribution function; A heat distribution matrix is ​​generated based on the continuous temperature distribution function, and pseudo-color processing is performed on the heat distribution matrix to obtain the heat distribution map.

3. The method for heat dissipation and noise reduction of a projector according to claim 1, characterized in that: The acquiring of real-time temperature data of the projector, associating the real-time temperature data with the heat distribution map, and obtaining corresponding real-time heat dissipation requirements includes: Perform temperature sampling at multiple key points inside the projector to obtain real-time temperature sampling data; Performing time series analysis on the real-time temperature sampling data to obtain a temperature change trend; Dynamically updating the thermal distribution map according to the temperature change trend to obtain a real-time thermal distribution map; Performing heat flow analysis on the real-time heat distribution map to obtain a three-dimensional heat flow model, wherein the heat flow analysis includes: Discretize the internal space of the projector into grid units, and construct a heat balance equation for each of the grid units; Performing conduction calculation on the heat balance equation according to the temperature gradient of adjacent grid cells to obtain a heat conduction term; Performing convection calculation on the heat balance equation in combination with the air flow distribution inside the projector to obtain a heat convection term; Perform radiation calculation on the heat balance equation in combination with the surface characteristics of the projector to obtain corresponding heat radiation terms; The heat balance equation corresponding to each of the grid units is adjusted according to the heat conduction term, the heat convection term and the heat radiation term to obtain an optimized heat balance equation; Integrating the optimized heat balance equations of all the grid cells into an overall heat transfer equation set; Solving the heat transfer equations by finite difference method to obtain the three-dimensional heat flow model; Calculating the heat load of each component according to the three-dimensional heat flow model to obtain the heat load distribution; Performing regional analysis on the heat load distribution to obtain key heat dissipation areas; A heat dissipation analysis is performed based on the heat dissipation key areas and the heat flow three-dimensional model to obtain real-time heat dissipation requirements.

4. The method for heat dissipation and noise reduction of a projector according to claim 1, characterized in that: The acquiring of the light source output data and processor performance data of the projector and the prediction of the real-time heat dissipation demand to obtain the corresponding heat dissipation trend include: Quantitatively calculate the thermal radiation characteristics of the light source output data to obtain the light source thermal radiation index; Calculating the heat generation characteristics of the processor performance data to obtain a heat generation value of the processor; Performing data fusion on the thermal radiation index of the light source and the heat generation value of the processor to obtain a comprehensive heat source feature; Performing heat diffusion analysis on the interior of the projector according to the comprehensive heat source characteristics and the real-time heat dissipation requirements to obtain a heat diffusion prediction result; Based on the heat diffusion prediction result, a temperature change analysis is performed on the temperature changes of the components of the projector to obtain a temperature change curve; Quantitatively calculate the heat dissipation demand according to the temperature change curve to obtain a heat dissipation demand index; Prioritize the heat dissipation demand index and the preset heat dissipation threshold to obtain a heat dissipation priority; Allocate heat dissipation resources based on the heat dissipation priority to obtain a heat dissipation resource allocation plan for the projector; Performing temperature prediction on the projector heat dissipation resource allocation scheme according to the temperature change curve to obtain a temperature balance prediction result; A heat dissipation trend calculation is performed based on the temperature balance prediction result to obtain the heat dissipation trend.

5. The method for heat dissipation and noise reduction of a projector according to claim 1, characterized in that: The performing heat dissipation planning analysis on the real-time heat dissipation demand and the heat dissipation trend to obtain a corresponding initial heat dissipation control solution includes: Performing structural fluid analysis on the real-time heat dissipation demand to obtain corresponding flow field characteristic data; Performing wavelet transform decomposition on the heat dissipation trend to obtain trend components of different scales; Evaluate the heat transfer efficiency of the structure according to the flow field characteristic data and the trend component to obtain a corresponding heat dissipation efficiency curve; Based on the heat dissipation efficiency curve, the equipment heat dissipation mode is planned to obtain a corresponding equipment operation plan; Perform heat dissipation control parameter analysis according to the equipment operation plan to obtain a corresponding control parameter set; The equipment operation plan is integrated with the control parameter set to obtain the initial heat dissipation control plan.

6. The method for heat dissipation and noise reduction of a projector according to claim 1, characterized in that: The high temperature identification is performed on the real-time temperature data by using a preset nonlinear dynamic model, and adjustment analysis is performed in combination with the heat dissipation trend to obtain a corresponding performance adjustment strategy, including: Inputting the real-time temperature data into the nonlinear dynamic model, performing overall heat balance analysis on the real-time temperature data through the macroscopic thermodynamic layer of the nonlinear dynamic model, and obtaining macroscopic heat information; Performing heat conduction path and hot spot area analysis on the real-time temperature data through the microscopic heat conduction layer of the nonlinear dynamic model to obtain heat conduction distribution information; Inputting the heat dissipation trend into the nonlinear dynamic model, performing air flow path simulation analysis on the heat dissipation trend through the convection heat transfer layer of the nonlinear dynamic model, and obtaining air flow change information; Performing radiation characteristic analysis and high temperature radiation area identification on the heat dissipation trend through the radiation heat exchange layer of the nonlinear dynamic model to obtain radiation area information; The macroscopic heat information, the heat conduction distribution information, the airflow change information and the radiation area information are comprehensively analyzed through the processing layer of the nonlinear dynamic model to obtain and output the performance adjustment strategy.

7. The method for heat dissipation and noise reduction of a projector according to claim 1, characterized in that: The comprehensive analysis of the initial heat dissipation control scheme and the performance adjustment strategy to obtain a corresponding global heat dissipation and noise reduction strategy includes: Decomposing the initial heat dissipation control scheme to obtain multiple heat dissipation sub-schemes; Decomposing the performance adjustment strategy to obtain a plurality of performance adjustment sub-strategies; Constructing a corresponding strategy objective function according to the heat dissipation sub-scheme and the performance adjustment sub-strategy, wherein the strategy objective function includes a heat dissipation efficiency parameter and a noise level parameter; Optimizing and calculating the strategy objective function to obtain a corresponding candidate solution; Clustering the heat dissipation sub-schemes and the performance adjustment sub-strategies according to the candidate solutions to obtain multiple heat dissipation and noise reduction strategy combinations; Performing strategy screening on the heat dissipation and noise reduction strategy combination according to a preset heat dissipation and noise reduction threshold to obtain a screening strategy combination; The initial heat dissipation control scheme and the performance adjustment strategy are globally adjusted based on the screening strategy combination to obtain the global heat dissipation and noise reduction strategy.

8. A projector heat dissipation and noise reduction device, characterized in that: The projector heat dissipation and noise reduction method applied to any one of claims 1 to 7 above comprises: An acquisition module, the acquisition module is used to obtain internal structure data and ambient temperature information of the projector, and perform thermal simulation analysis on the internal structure data based on the ambient temperature information to obtain a corresponding thermal distribution map; An analysis module, the analysis module is used to obtain real-time temperature data of the projector, and associate it with the thermal distribution map to obtain corresponding real-time heat dissipation requirements; A correlation module, the correlation module is used to obtain the light source output data and processor performance data of the projector, and predict the real-time heat dissipation demand to obtain a corresponding heat dissipation trend; A processing module, the processing module is used to perform a heat dissipation planning analysis on the real-time heat dissipation demand and the heat dissipation trend to obtain a corresponding initial heat dissipation control solution; A control module, the control module is used to perform high temperature recognition on the real-time temperature data through a preset nonlinear dynamic model, and perform adjustment analysis in combination with the heat dissipation trend to obtain a corresponding performance adjustment strategy; An execution module is used to comprehensively analyze the initial heat dissipation control solution and the performance adjustment strategy to obtain a corresponding global heat dissipation and noise reduction strategy.

9. A projector heat dissipation and noise reduction device, characterized in that: include: Memory, used to store programs; The processor is used to execute the program to implement the various steps of the projector heat dissipation and noise reduction method as described in any one of claims 1 to 7.

10. A storage medium, characterized in that: Computer instructions are stored, and the computer instructions are used to make a computer execute the method according to any one of claims 1 to 7.

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