Counting machine for semiconductor chips

Abstract

The invention provides a counter for semiconductor chips, and belongs to the technical field of counters. Comprising a workbench assembly, a semiconductor chip discharging assembly is arranged at the position, close to the rear end, in the workbench assembly, a conveying belt assembly is arranged at the position, close to the front end, in the workbench assembly, an illumination support assembly is arranged at the position, close to the front end, of the top surface of the workbench assembly, and a counting assembly is arranged at the center of the top surface of the illumination support assembly. The high-performance industrial camera has the characteristics of high precision, high definition, good color rendition, low noise and the like, parameters such as exposure time, brightness, gain and the like can be programmed and controlled through a computer, and in addition, an image window is subjected to stepless zooming and has the functions of external trigger input and the like, so that the image quality is improved. The situation that missing detection or wrong counting is prone to occurring when counting is conducted through manual vision beside is solved, and even discharging can be conducted in cooperation with a material distribution box, a digital frequency modulation vibration feeding controller and a linear feeder in the semiconductor chip discharging assembly.

Description

Technical Field

[0001] The present invention relates to the technical field of counting machines, and in particular to a counting machine related to semiconductor chips. Background Art

[0002] Semiconductors are usually composed of wafers and several chips. Semiconductors of different specifications need to have different numbers of chips on their surfaces. Before the semiconductors leave the factory, the number of chips in the semiconductors needs to be checked. Due to the large number of chips, the error rate of naked eye observation is high. Industrial cameras can be used to directly take pictures of the chips after sorting, record the data in real time, and transmit it to the host to improve efficiency.

[0003] In addition, some chip inspection systems will use manual visual inspection of each chip to determine whether it is qualified, and then mark and store it. Such manual inspection is inefficient and time-consuming. If an industrial camera is used to utilize existing infrared positioning inkjet marking technology, the chip qualification can be quickly detected and marked while counting, which is efficient and time-saving. Summary of the invention

[0004] 1. Technical issues to be resolved In view of the shortcomings of the prior art, the present invention provides a counting machine for semiconductor chips. The overall semiconductor chip counting machine has low structural efficiency and mostly uses artificial vision to divide and count materials.

[0005] (II) Technical solution In order to solve the above technical problems, the present invention provides the following technical solutions: A counting machine for semiconductor chips, comprising a workbench assembly, a semiconductor chip unloading assembly is provided at the rear end of the workbench assembly, a conveyor belt assembly is provided at the front end of the workbench assembly, a lighting bracket assembly is provided at the front end of the top surface of the workbench assembly, a counting assembly is provided at the center of the top surface of the lighting bracket assembly, a splicing shaft assembly is connected to the left and right sides of the inner surface of the lighting bracket assembly, one end of each of the splicing shaft assemblies is connected to an inkjet marking robot arm assembly, the counting assembly comprises an industrial camera, one end of the industrial camera is connected to a connecting wire, the other end of the connecting wire is connected to a One end is connected to a host and a display, the inkjet marking robot arm assembly includes a telescopic motor, one side surface of the telescopic motor is connected to a fixed ring, the output end of the telescopic motor is connected to a first support module, one side of the first support module is connected to a second support module, a universal telescopic rod is connected to the center of one side surface of the second support module, one side surface of the universal telescopic rod is connected to several inkjet tubes in a ring form, one side of the universal telescopic rod is connected to a first rotating shaft, one side of the first rotating shaft is connected to an infrared positioning inkjet head, and the second rotating shaft runs through the connection between the two first support modules and the second support modules.

[0006] Preferably, the workbench assembly includes a workbench, a mounting slot is opened inside the workbench, a placement table is provided at the front end of the workbench, a storage box is provided on the top surface of the placement table, and a fixing rod is provided at the top surface of the workbench near the rear end edge.

[0007] Preferably, hinges are provided on the left and right sides of the bottom of the fixing rod, a first splicing plate and a second splicing plate are provided at the center of the front end surface of the fixing rod near the top edge, rectangular connecting plates are provided at the connections between the two second splicing plates and the left and right sides of the fixing rod, and an ion fan is connected to the bottom of the second splicing plate.

[0008] Preferably, the semiconductor chip unloading assembly includes a feeding bowl and a digital frequency modulation vibration feeding controller, a linear feeder is provided on the top of the digital frequency modulation vibration feeding controller, a feed box is provided on the top of the linear feeder, a fixed plate is provided at the center of the top surface of the feed box, and a distribution box is connected to one side of the fixed plate.

[0009] Preferably, two circular holes are arranged on the left and right sides of the center of the top surface of the feed box near the front end, for a total of four holes, wherein a component rod passes through the circular holes at the left and right ends near the front end, and several columns are arranged in a matrix form on the top surface of the feed box near the front end.

[0010] Preferably, the conveyor belt assembly includes a conveyor belt, baffles are respectively provided on the top surface of the conveyor belt near the left and right edges, a rotating shaft is provided on the right side of the rear end of the conveyor belt, and L-shaped support plates are respectively provided on the bottom of the conveyor belt near the left and right edges, a motor is provided on one side surface of one of the L-shaped support plates, belts are wrapped between the two motors and the rotating shaft, and a motor speed regulator is provided at the bottom of the conveyor belt.

[0011] Preferably, the lighting bracket assembly includes two supporting columns, wherein the outer surface center of one of the supporting columns is wrapped with a first rectangular slider, one end of the first rectangular slider is connected to an elliptical splicing plate, one side surface of the elliptical splicing plate is respectively connected to V-shaped mounting plates at the left and right end edges, the bottom of each V-shaped mounting plate is connected to a highly uniform strip light source, the outer surfaces of the two supporting columns are respectively wrapped with a second rectangular slider at the top edges, a connecting rod is connected between the two second rectangular sliders, and a power supply is provided at the center of the outer surface of the connecting rod.

[0012] Preferably, the splicing shaft assembly includes a first connecting shaft and a second connecting shaft, the top surface of the first connecting shaft is respectively provided with convex left and right rotating shafts at the left and right edges, a rectangular connecting block is provided at the center of the top surface of the first connecting shaft, and the outer side of the rectangular connecting block is respectively provided with connecting holes near the surrounding surfaces.

[0013] Preferably, a fixing bolt passes through the interior of each of the connecting holes, a convex front and rear rotating shaft is provided at the front and rear end edges of the bottom surface of the second connecting shaft, and an equipment installation port is provided at the center of the top surface of the second connecting shaft.

[0014] A method for using a counting machine for semiconductor chips, comprising the following steps: Step 1: First, pour the semiconductor chips into the dividing box at the bottom through the feeding bowl in the semiconductor chip unloading assembly structure, and use the digital frequency modulation vibration feeding controller and the linear feeder to evenly feed the chips to the component rod and column at the front end. The component rod will block the chips and make the chips stacked on top fall off, so that the chips will not be stacked and transported, and the second component blocking will be performed after passing through multiple columns to ensure that the chips can be evenly transported; Step 2: Then enter the bottom of the lighting bracket assembly at the rear end of the conveyor belt assembly, aim the two high-uniform strip light sources in the structure at the center of the bottom for lighting, and use the industrial camera on the top to take photos of the chips passing by to record the number, and transmit the data to the host and display in real time for the staff to view; Step 3. Finally, while passing the bottom of the industrial camera, the infrared positioning inkjet head in the inkjet marking robot arm assembly structure will be used to perform appearance inspection on the chip at the bottom, quickly detect the chip with damaged appearance, and quickly start the telescopic motor, the second rotating shaft, the universal telescopic rod, the first rotating shaft and the infrared positioning inkjet head to locate the unqualified chip for inkjet marking. The ink can be a special marking ink that can be easily removed and will not cause damage to the chip.

[0015] Compared with the prior art, the present invention has at least the following beneficial effects: In the above scheme, the high-performance industrial camera set up should have the characteristics of high precision, high definition, good color reproduction, low noise, etc., and the exposure time, brightness, gain and other parameters can be programmed and controlled by the computer. In addition, the image window has stepless zooming and external trigger input and other functions, which solves the problem that the manual vision counting is prone to missed detection or wrong number. In addition, the material distribution box, digital frequency modulation vibration feeding controller and linear feeder in the semiconductor chip unloading component can be used for uniform unloading. In combination with the industrial camera, the quantity can be recorded in real time and the data can be transmitted to the host, thereby improving the overall efficiency.

[0016] The power of the conveyor belt in the conveyor belt assembly structure comes from the rotating shaft and the motor, wherein the speed driven by the motor can be adjusted by the motor speed regulator installed at the bottom. The lighting bracket assembly is installed on the left and right sides of the workbench assembly using two supporting columns, and the elliptical splicing plate and the V-shaped mounting plate are fixed to one of the supporting columns. Two highly uniform strip light sources are installed on the V-shaped mounting plate to illuminate the conveyor belt assembly below, assisting the industrial camera in taking pictures and counting. At the same time, connecting columns and power supplies are installed on the top of the two supporting columns, so that the industrial camera can be installed on the surface of the power supply, and the power supply supplies power to the industrial camera.

[0017] The convex left-right rotating shaft arranged on the top of the first connecting shaft and the convex front-back rotating shaft arranged on the bottom of the second connecting shaft in the splicing shaft assembly structure are connected together by fitting them into the rectangular connecting block in the middle, and then two of the fixing bolts are used to penetrate the convex left-right rotating shaft from the outside to the rectangular connecting block in the middle, and the other two fixing bolts are penetrated from the outside of the convex front-back rotating shaft to the rectangular connecting block in the middle. After the fixation is completed, the first connecting shaft and the second connecting shaft can be swung to complete a simple action. In addition, the telescopic motor and the universal telescopic rod in the inkjet marking robot arm assembly structure will extend the length and adjust the angle to inkjet mark the chip. The inkjet tube penetrates the robot arm to connect the infrared positioning inkjet head to transfer ink to the surface of the infrared positioning inkjet head for marking.

[0018] In summary, the present invention has the advantages of using an industrial camera to directly take pictures of the chips after sorting, record the data in real time and transmit it to the host, thereby improving efficiency. The industrial camera is used to use the existing technology of infrared positioning inkjet marking to quickly detect the chip qualification while counting and marking, which has the advantages of high efficiency and low time consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 The present invention is a schematic diagram of a counting machine structure related to a semiconductor chip; Figure 2 It is a schematic diagram of the planar structure of a counting machine for semiconductor chips; Figure 3 It is a schematic diagram of the planar structure of the workbench assembly; Figure 4 It is a schematic diagram of the three-dimensional structure of the workbench assembly; Figure 5 It is a schematic diagram of the semiconductor chip blanking assembly structure; Figure 6 It is a schematic diagram of the structure of the conveyor belt assembly; Figure 7 It is a schematic diagram of the structure of the lighting bracket assembly and the point assembly; Figure 8 It is a three-dimensional schematic diagram of the structure of the spliced ​​shaft assembly; Fig. 9 It is a schematic diagram of the structural decomposition of the splicing shaft assembly; Fig.10 This is a schematic diagram of the structure of the inkjet marking robot arm assembly; Fig.11 The present invention is a schematic diagram of the steps for using a counting machine for semiconductor chips.

[0020] [Reference Signs] 1. Workbench assembly; 101. Workbench; 102. Installation slot; 103. Placement table; 104. Storage box; 105. Fixing rod; 106. Hinge; 107. First splicing plate; 108. Second splicing plate; 109. Rectangular connecting plate; 110. Ion blower; 2. Semiconductor chip unloading assembly; 201. Feeding bowl; 202. Digital frequency modulation vibration feeding controller; 203. Linear feeder; 204, feeding box; 205, fixing plate; 206, material distribution box; 207, round hole; 208, component rod; 209, column; 3, conveyor belt assembly; 301, conveyor belt; 302, baffle; 303, rotating shaft; 304, L-shaped support plate; 305, motor; 306, belt; 307, motor speed regulator; 4, lighting bracket assembly; 401, support column; 402, first rectangular slider; 403 , elliptical splicing plate; 404, V-shaped mounting plate; 405, high uniform strip light source; 406, second rectangular slider; 407, connecting rod; 408, power supply; 5, point counting component; 501, industrial camera; 502, connecting wires; 6, host; 7, display; 8, inkjet marking robot arm assembly; 801, telescopic motor; 802, fixed ring; 803, first support module; 804, second support module; 805, universal telescopic rod; 806, inkjet tube; 807, first rotating shaft; 808, infrared positioning inkjet head; 809, second rotating shaft; 9, splicing rotating shaft assembly; 901, first connecting shaft; 902, convex left and right rotating shaft; 903, rectangular connecting block; 904, connecting hole; 905, fixing bolt; 906, second connecting shaft; 907, convex front and rear rotating shaft; 908, equipment installation port.

[0021] As shown in the figure, in order to clearly implement the structure of the embodiment of the present invention, specific structures and devices are marked in the figure, but this is only for illustrative purposes and is not intended to limit the present invention to the specific structure, device and environment. According to specific needs, ordinary technicians in this field can adjust or modify these devices and environments. DETAILED DESCRIPTION

[0022] The following is a detailed description of a counting machine for semiconductor chips provided by the present invention in conjunction with the accompanying drawings and specific embodiments. At the same time, it is explained here that in order to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and those skilled in the art may also adopt other alternative methods to implement some known technologies; and the accompanying drawings are only for a more specific description of the embodiments, and are not intended to specifically limit the present invention.

[0023] It should be noted that the references to "one embodiment", "embodiment", "exemplary embodiments", "some embodiments" and the like in the specification indicate that the embodiments described may include specific features, structures or characteristics, but not every embodiment may include the specific features, structures or characteristics. In addition, when a specific feature, structure or characteristic is described in conjunction with an embodiment, it should be within the knowledge of a person skilled in the art to implement such feature, structure or characteristic in conjunction with other embodiments (whether or not explicitly described).

[0024] In general, a term can be understood, at least in part, from its use in context. For example, depending, at least in part, on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in the singular sense, or can be used to describe a combination of features, structures, or characteristics in the plural sense. Additionally, the term "based on" can be understood as not necessarily intended to convey an exclusive set of factors, but can instead, depending, at least in part, on the context, allow for the presence of other factors that are not necessarily explicitly described.

[0025] It will be understood that the meanings of “on,” “over,” and “above” in the present invention should be interpreted in the broadest manner, so that “on” not only means “directly on” something, but also includes the meaning of being “on” something with intervening features or layers therebetween, and “on” or “over” not only means “on” or “above” something, but also includes the meaning of being “on” or “above” something with no intervening features or layers therebetween.

[0026] Additionally, spatially relative terms such as "under," "beneath," "lower," "above," "upper," and the like may be used herein for descriptive convenience to describe the relationship of one element or feature to another element or features, as shown in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the accompanying drawings. The device may be oriented in other ways, and the spatially relative descriptors used herein may be similarly interpreted accordingly.

[0027] like Figures 1 to 5As shown, an embodiment of the present invention provides a counting machine for semiconductor chips, including a workbench assembly 1, a semiconductor chip unloading assembly 2 is provided inside the workbench assembly 1 at the rear end, a conveyor belt assembly 3 is provided inside the workbench assembly 1 at the front end, a lighting bracket assembly 4 is provided on the top surface of the workbench assembly 1 at the front end, a counting assembly 5 is provided at the center of the top surface of the lighting bracket assembly 4, and the inner side surface of the lighting bracket assembly 4 is respectively connected with splicing shaft assemblies 9 on the left and right sides, and one end of each splicing shaft assembly 9 is connected to an inkjet marking robot arm assembly 8, the counting assembly 5 includes an industrial camera 501, one end of the industrial camera 501 is connected to a connecting wire 502, and the other end of the connecting wire 502 is connected to a host 6 and a display 7, the workbench assembly 1 includes a workbench 101, an installation slot 102 is opened inside the workbench 101, a placement table 103 is provided at the front end of the workbench 101, a storage box 104 is provided on the top surface of the placement table 103, and a fixing rod 105 is provided at the edge of the top surface of the workbench 101 near the rear end, The bottom of the rod 105 is provided with hinges 106 on the left and right sides respectively, the front end surface center of the fixed rod 105 is provided with a first splicing plate 107 and a second splicing plate 108 on the top edge respectively, the two second splicing plates 108 and the left and right sides of the fixed rod 105 are connected with rectangular connecting plates 109 respectively, the bottom of the second splicing plate 108 is connected with an ion fan 110, the semiconductor chip unloading assembly 2 includes a feeding bowl 201 and a digital frequency modulation vibration feeding controller 202, the top of the digital frequency modulation vibration feeding controller 202 A linear feeder 203 is provided at the top, a feed box 204 is provided at the top of the linear feeder 203, a fixed plate 205 is provided at the center of the top surface of the feed box 204, a distribution box 206 is connected to one side of the fixed plate 205, two circular holes 207 are arranged on the left and right sides of the center of the top surface of the feed box 204 near the front end, there are four in total, among which a distribution rod 208 passes through the circular holes 207 at the left and right ends near the front end, and a plurality of columns 209 are provided in a matrix form on the top surface of the feed box 204 near the front end.

[0028] The high-performance industrial camera 501 should have the characteristics of high precision, high definition, good color reproduction, low noise, etc., and the exposure time, brightness, gain and other parameters can be programmed and controlled by the computer. In addition, the image window can be zoomed steplessly and has external trigger input and other functions.

[0029] like Figure 6 and Figure 7As shown, in this embodiment, the conveyor belt assembly 3 includes a conveyor belt 301, and baffles 302 are respectively provided on the top surface of the conveyor belt 301 near the left and right edges, and a rotating shaft 303 is provided on the right side of the rear end of the conveyor belt 301. L-shaped support plates 304 are respectively provided on the left and right edges of the bottom of the conveyor belt 301, and a motor 305 is provided on one side surface of one of the L-shaped support plates 304. A belt 306 is wrapped between the two motors 305 and the rotating shaft 303, and a motor speed regulator 307 is provided at the bottom of the conveyor belt 301. The lighting bracket assembly 4 includes two support columns 401, and the center of the outer surface of one of the support columns 401 is wrapped There is a first rectangular slider 402, one end of the first rectangular slider 402 is connected to an elliptical splicing plate 403, one side surface of the elliptical splicing plate 403 is respectively connected to V-shaped mounting plates 404 at the left and right edges, the bottom of each V-shaped mounting plate 404 is connected to a high uniform strip light source 405, the outer surfaces of the two support columns 401 are respectively wrapped with second rectangular sliders 406 at the top edges, a connecting rod 407 is connected between the two second rectangular sliders 406, and a power supply 408 is provided at the center of the outer surface of the connecting rod 407, wherein the baffle 302 is connected to the workbench 101 and does not contact the surface of the conveyor belt 301.

[0030] like Figures 8 to 10As shown, in this embodiment, the inkjet marking robot arm assembly 8 includes a telescopic motor 801, one side surface of the telescopic motor 801 is connected to a fixed ring 802, the output end of the telescopic motor 801 is connected to a first support module 803, one side of the first support module 803 is connected to a second support module 804, a universal telescopic rod 805 is connected at the center of one side surface of the second support module 804, one side surface of the universal telescopic rod 805 is connected to several inkjet tubes 806 in a ring form, one side of the universal telescopic rod 805 is connected to a first rotating shaft 807, one side of the first rotating shaft 807 is connected to an infrared positioning inkjet head 808, the connection between the two first support modules 803 and the second support module 804 is penetrated by a second rotating shaft 809, the splicing rotating shaft assembly 9 includes a first connecting shaft 901 and a second connecting shaft 906, The top surface of a connecting shaft 901 is provided with convex left and right rotating shafts 902 at the left and right edges, a rectangular connecting block 903 is provided at the center of the top surface of the first connecting shaft 901, and connecting holes 904 are respectively opened on the outer sides of the rectangular connecting block 903, and a fixing bolt 905 passes through the inside of each connecting hole 904. The bottom surface of the second connecting shaft 906 is provided with convex front and rear rotating shafts 907 at the front and rear ends, and an equipment installation port 908 is provided at the center of the top surface of the second connecting shaft 906. The industrial camera 501 and the infrared positioning inkjet head 808 are existing structural technologies. After cooperation, they can quickly detect and locate chips with unqualified appearance and mark their surfaces, which is convenient for subsequent screening by staff. The ink used is the existing special marking ink and will not affect the chip.

[0031] The electrical components mentioned in this article are all connected to an external main controller and 220V mains electricity, and the main controller can be a conventional known device for controlling a computer or the like.

[0032] A counting machine for semiconductor chips, when in use, comprises the following steps; Step 1: First, pour the semiconductor chips into the dividing box 206 at the bottom through the feeding bowl 201 in the semiconductor chip unloading assembly 2 structure, and use the digital frequency modulation vibration feeding controller 202 and the linear feeder 203 to evenly feed the chips to the component rod 208 and the column 209 at the front end. The component rod 208 will block the chips and make the chips stacked on top fall off, so that the chips will not be stacked and transported, and a second component blocking will be performed after passing through multiple columns 209 to ensure that the chips can be evenly transported; Step 2: Then enter the conveyor belt assembly 3 and be sent to the bottom of the lighting bracket assembly 4 at the rear end, aim the two high-uniform strip light sources 405 in the structure at the center of the bottom for lighting, cooperate with the industrial camera 501 on the top to take pictures of the chips passing by and record the number, and transmit the data to the host 6 and the display 7 in real time for the staff to view; Step three, while passing the bottom of the industrial camera 501, the infrared positioning inkjet head 808 in the structure of the inkjet marking robot arm assembly 8 will be used to perform appearance inspection on the chip at the bottom, quickly detect the chip with damaged appearance, and quickly start the telescopic motor 801, the second rotating shaft 809, the universal telescopic rod 802, the first rotating shaft 807 and the infrared positioning inkjet head 808 to locate the unqualified chip for inkjet marking. The ink can be a special marking ink that can be easily removed and will not cause damage to the chip.

[0033] The technical solution provided by the present invention is as follows: firstly, the high-performance industrial camera 501 should have the characteristics of high precision, high definition, good color reproduction, low noise, etc., and the exposure time, brightness, gain and other parameters can be controlled by computer programming. In addition, the image window has stepless zooming and has functions such as external trigger input, which solves the problem that the artificial vision next to the counting is prone to missed detection or wrong number, and cooperates with the material distribution box 206, digital frequency modulation vibration feeding controller 202 and linear feeder 203 in the semiconductor chip unloading component 2 to unload the material evenly, and cooperates with the industrial camera 501 , can record the quantity in real time and transmit the data to the host 6, improve the overall efficiency, and then the conveyor belt 301 in the conveyor belt assembly 3 structure is powered by the rotating shaft 303 and the motor 305, wherein the speed driven by the motor 305 can be adjusted by the motor speed regulator 307 installed at the bottom, the lighting bracket assembly 4 is installed on the left and right sides of the workbench assembly 1 using two support columns 401, the elliptical splicing plate 403 and the V-shaped mounting plate 404 are fixed on one of the support columns 401, and then two high uniform strip light sources 405 are installed on the V-shaped mounting plate 404 facing downward The conveyor belt assembly 3 is illuminated to assist the industrial camera 501 in taking photos and counting. At the same time, the connecting rod 407 and the power supply 408 are installed on the top of the two support columns 401. The industrial camera 501 can be installed on the surface of the power supply 408, and the power supply 408 supplies power to the industrial camera 501. Finally, the convex left and right rotating shaft 902 set on the top of the first connecting shaft 901 and the convex front and rear rotating shaft 907 set at the bottom of the second connecting shaft 906 in the splicing shaft assembly 9 structure are connected together with the rectangular connecting block 903 in the middle, and then the fixing bolts 905 are used to penetrate the convex left and right rotating shafts from the outside. The right rotating shaft 902 is connected to the middle rectangular connecting block 903, and the other two fixing bolts 905 pass through the outside of the convex front and rear rotating shaft 907 to the middle rectangular connecting block 903. After the fixation is completed, the first connecting shaft 901 and the second connecting shaft 906 can be swung to complete a simple action. In addition, the telescopic motor 801 and the universal telescopic rod 805 in the structure of the inkjet marking robot arm assembly 8 will extend the length and adjust the angle to inkjet mark the chip. The inkjet tube 806 passes through the robot arm to connect the infrared positioning inkjet head 808 to transfer ink to the surface of the infrared positioning inkjet head 808 for marking.

[0034] The present invention covers any substitution, modification, equivalent method and scheme made on the essence and scope of the present invention. In order to make the public have a thorough understanding of the present invention, specific details are described in detail in the following preferred embodiments of the present invention, but those skilled in the art can fully understand the present invention without the description of these details. In addition, in order to avoid unnecessary confusion about the essence of the present invention, well-known methods, processes, procedures, components and circuits are not described in detail.

[0035] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A counting machine for semiconductor chips, characterized in that: The invention comprises a workbench assembly (1), wherein a semiconductor chip unloading assembly (2) is provided at the rear end of the workbench assembly (1), a conveyor belt assembly (3) is provided at the front end of the workbench assembly (1), a lighting bracket assembly (4) is provided at the front end of the top surface of the workbench assembly (1), a numbering assembly (5) is provided at the center of the top surface of the lighting bracket assembly (4), and the inner side surface of the lighting bracket assembly (4) is connected to splicing shaft assemblies (9) on the left and right sides respectively, and one end of each splicing shaft assembly (9) is connected to an inkjet marking robot arm assembly (8); The counting component (5) comprises an industrial camera (501), one end of the industrial camera (501) is connected to a connecting wire (502), and the other end of the connecting wire (502) is connected to a host (6) and a display (7). The inkjet marking robot arm component (8) comprises a telescopic motor (801), one side surface of the telescopic motor (801) is connected to a fixed ring (802), the output end of the telescopic motor (801) is connected to a first supporting module (803), and one side of the first supporting module (803) is connected to a first Two support modules (804), a universal telescopic rod (805) is connected at the center of one side surface of the second support module (804), a plurality of inkjet tubes (806) are connected in a ring shape to one side surface of the universal telescopic rod (805), a first rotating shaft (807) is connected to one side of the universal telescopic rod (805), an infrared positioning inkjet head (808) is connected to one side of the first rotating shaft (807), and a second rotating shaft (809) runs through the connection between the two first support modules (803) and the second support module (804).

2. The counting machine for semiconductor chips according to claim 1, characterized in that: The workbench assembly (1) comprises a workbench (101), a mounting slot (102) is provided inside the workbench (101), a placement table (103) is provided at the front end of the workbench (101), a storage box (104) is provided on the top surface of the placement table (103), and a fixing rod (105) is provided on the top surface of the workbench (101) near the rear end edge.

3. The counting machine for semiconductor chips according to claim 2, characterized in that: The bottom of the fixing rod (105) is provided with hinges (106) on the left and right sides respectively, the center of the front end surface of the fixing rod (105) is provided with a first splicing plate (107) and a second splicing plate (108) on the top edge respectively, the connection between the two second splicing plates (108) and the left and right sides of the fixing rod (105) is provided with a rectangular connecting plate (109) respectively, and the bottom of the second splicing plate (108) is connected to an ion fan (110).

4. The counting machine for semiconductor chips according to claim 1, characterized in that: The semiconductor chip unloading assembly (2) comprises a feeding bowl (201) and a digital frequency modulation vibration feeding controller (202); a linear feeder (203) is provided on the top of the digital frequency modulation vibration feeding controller (202); a feed box (204) is provided on the top of the linear feeder (203); a fixing plate (205) is provided at the center of the top surface of the feed box (204); and a material distribution box (206) is connected to one side of the fixing plate (205).

5. The counting machine for semiconductor chips according to claim 4, characterized in that: Two circular holes (207) are arranged in an array on the left and right sides of the center of the top surface of the feed box (204), with a total of four holes. A component rod (208) passes through the circular holes (207) on the left and right ends, and a plurality of columns (209) are arranged in a matrix on the top surface of the feed box (204), with a plurality of columns (209) on the front end.

6. The counting machine for semiconductor chips according to claim 1, characterized in that: The conveyor belt assembly (3) comprises a conveyor belt (301), wherein baffles (302) are respectively provided on the top surface of the conveyor belt (301) near the left and right edges, a rotating shaft (303) is respectively provided on the right side of the rear end of the conveyor belt (301), and L-shaped support plates (304) are respectively provided on the bottom of the conveyor belt (301) near the left and right edges, wherein a motor (305) is provided on one side surface of one of the L-shaped support plates (304), a belt (306) is wrapped between the two motors (305) and the rotating shaft (303), and a motor speed regulator (307) is provided on the bottom of the conveyor belt (301).

7. The counting machine for semiconductor chips according to claim 1, characterized in that: The lighting bracket assembly (4) comprises two support columns (401), wherein a first rectangular slider (402) is wrapped at the center of the outer surface of one of the support columns (401), one end of the first rectangular slider (402) is connected to an elliptical splicing plate (403), a V-shaped mounting plate (404) is connected to the left and right edges of one side surface of the elliptical splicing plate (403), and a high-uniform strip light source (405) is connected to the bottom of each V-shaped mounting plate (404), and a second rectangular slider (406) is wrapped at the top edge of the outer surfaces of the two support columns (401), and a connecting rod (407) is connected between the two second rectangular sliders (406), and a power source (408) is provided at the center of the outer surface of the connecting rod (407).

8. The counting machine for semiconductor chips according to claim 1, characterized in that: The splicing shaft assembly (9) comprises a first connecting shaft (901) and a second connecting shaft (906); the top surface of the first connecting shaft (901) is provided with convex left and right rotating shafts (902) at the left and right edges, respectively; a rectangular connecting block (903) is provided at the center of the top surface of the first connecting shaft (901); the outer side of the rectangular connecting block (903) is provided with connecting holes (904) at the surrounding surfaces.

9. The counting machine for semiconductor chips according to claim 8, characterized in that: A fixing bolt (905) passes through the interior of each of the connecting holes (904); convex front and rear rotating axes (907) are respectively provided on the bottom surface of the second connecting shaft (906) near the front and rear ends; and a device installation opening (908) is provided at the center of the top surface of the second connecting shaft (906).

10. The method for using a counting machine for semiconductor chips according to claims 1 to 9, characterized in that: The following steps are involved: Step 1: First, pour the semiconductor chips through the feeding bowl (201) in the semiconductor chip unloading component (2) structure into the dividing box (206) at the bottom, and use the digital frequency modulation vibration feeding controller (202) and the linear feeder (203) to evenly feed the chips to the front end of the weight rod (208) and the column (209). The weight rod (208) will block the chips and make the chips stacked on the top fall off, so that the chips will not be stacked during transportation, and after passing through multiple columns (209), a second weight blocking will be performed to ensure that the chips can be evenly transported; Step 2: Then enter the conveyor belt assembly (3) and be sent to the bottom of the lighting bracket assembly (4) at the rear end, aim the two high-uniform strip light sources (405) in the structure at the center of the bottom for lighting, cooperate with the industrial camera (501) on the top to take pictures of the chips passing by and record the number, and transmit the data to the host (6) and the display (7) in real time for the staff to view; Step 3. Finally, while passing through the bottom of the industrial camera (501), the infrared positioning inkjet head (808) in the structure of the inkjet marking robot arm assembly (8) will be used to perform an appearance inspection on the chip at the bottom, quickly detect the chip with damaged appearance, and quickly start the telescopic motor (801), the second rotating shaft (809), the universal telescopic rod (802), the first rotating shaft (807) and the infrared positioning inkjet head (808) to locate the unqualified chip for inkjet marking. The ink can be a special marking ink that can be easily removed and will not cause damage to the chip.

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