Wafer cleaning device and wafer thinning equipment including the same

Abstract

The present invention proposes a wafer cleaning device and a wafer thinning device including the same. The wafer cleaning device includes: a plurality of clamping wheels, which are used to clamp and limit the wafer to be cleaned; and a back cleaning roller brush assembly, which includes a back cleaning roller brush and a back cleaning roller brush bracket, wherein the back cleaning roller brush is installed on the back cleaning roller brush bracket, and the back cleaning roller brush bracket is used to support the back cleaning roller brush and fit the back cleaning roller brush to the back of the wafer, wherein the back cleaning roller brush is a segmented roller brush passing through the center of the wafer and is composed of an independent first roller brush half and a second roller brush half. When cleaning the back of the wafer, the first roller brush half and the second roller brush half rotate in opposite directions. The present invention is suitable for cleaning the back of the wafer after the dicing process, and can achieve cleaning of the back of the wafer and the cleaning device itself, reducing damage to the wafer caused by the cleaning device itself.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing; more specifically, the present invention relates to a wafer cleaning device and a wafer thinning equipment comprising the same. Background Art

[0002] After the dicing process is complete and the wafer undergoes edge thinning, the backside of the wafer requires cleaning. The primary contaminant on the wafer's backside after dicing (silicon slurry) is primarily distributed around the wafer's edges and bottom. Because contaminants cannot be removed during handling, they remain as the wafer is clamped by the gripping wheels. During the backside cleaning process, any remaining contaminants trapped between the wafer and gripping wheels grind against each other as the gripping wheels and wafer rotate, causing scratches on the wafer and wear on the gripping wheels. Summary of the Invention

[0003] In view of this, the present invention provides a wafer cleaning device and a wafer thinning device including the same, thereby solving or at least alleviating one or more of the above-mentioned problems and other problems existing in the prior art.

[0004] In order to achieve the aforementioned object, a first aspect of the present invention provides a wafer cleaning device, wherein the wafer cleaning device comprises:

[0005] A plurality of clamping wheels, wherein the clamping wheels are used to clamp and limit the wafers to be cleaned; and

[0006] The back cleaning roller brush assembly includes a back cleaning roller brush and a back cleaning roller brush bracket. The back cleaning roller brush is installed on the back cleaning roller brush bracket. The back cleaning roller brush bracket is used to support the back cleaning roller brush and fit the back cleaning roller brush to the back of the wafer.

[0007] Among them, the back cleaning roller brush is a segmented roller brush passing through the center of the wafer and is composed of an independent first roller brush half and a second roller brush half. When cleaning the back of the wafer, the first roller brush half and the second roller brush half rotate in opposite directions.

[0008] In the wafer cleaning device as described above, optionally, the back cleaning roller brush extends over the entire length of the back cleaning roller brush bracket, the first roller brush half and the second roller brush half move in opposite directions to the wafer parts they contact, and the length of the first roller brush half is greater than the length of the second roller brush half.

[0009] In the wafer cleaning device as described above, optionally, the wafer cleaning device also includes an edge cleaning roller brush assembly, the edge cleaning roller brush assembly includes an edge cleaning roller brush and an edge cleaning roller brush bracket, the edge cleaning roller brush is installed on the edge cleaning roller brush bracket, and the edge cleaning roller brush bracket is used to support the edge cleaning roller brush and fit the edge cleaning roller brush to the edge of the wafer.

[0010] In the wafer cleaning device as described above, optionally, the back cleaning roller brush bracket and the edge cleaning roller brush bracket are integrally formed into a cross shape, and the edge cleaning roller brush includes a first edge cleaning roller brush and a second edge cleaning roller brush, and the first edge cleaning roller brush and the second edge cleaning roller brush are respectively arranged at both ends of the edge cleaning roller brush bracket.

[0011] In the wafer cleaning device as described above, optionally, the edge cleaning roller brush is movably mounted on the end of the edge cleaning roller brush bracket, the rotation direction of the edge cleaning roller brush is opposite to the rotation direction of the wafer, and: when the wafer edge is cleaned, the edge cleaning roller brush adheres to the edge of the wafer; when the wafer edge cleaning is completed, the edge cleaning roller brush detaches from the edge of the wafer.

[0012] In the wafer cleaning device as described above, optionally, the edge cleaning roller brush includes a first edge cleaning roller brush and a second edge cleaning roller brush, the first edge cleaning roller brush and the second edge cleaning roller brush are respectively pivoted at both ends of the edge cleaning roller brush bracket, the clamping cleaning contact points of the first edge cleaning roller brush and the second edge cleaning roller brush are connected through the center of the wafer, and the first edge cleaning roller brush and the second edge cleaning roller brush are also respectively connected to the wafer edge cleaning roller brush sleeve rod and the wafer edge cleaning roller brush guide rod, the wafer edge cleaning roller brush sleeve rod is sleeved on the wafer edge cleaning roller brush guide rod and the two can move relative to each other under the drive of the wafer edge cleaning roller brush cylinder, thereby driving the first edge cleaning roller brush and the second edge cleaning roller brush to switch between adhering to the edge of the wafer and detaching from the edge of the wafer.

[0013] In the wafer cleaning apparatus as described above, optionally:

[0014] The first end of the edge cleaning roller brush bracket is provided with a first lever, the upper end of the first lever is fixed with the first edge cleaning roller brush, the lower end of the first lever is pivotally connected to the outer end of the wafer edge cleaning roller brush sleeve rod, the second end of the edge cleaning roller brush bracket is provided with a second lever, the upper end of the second lever is fixed with the second edge cleaning roller brush, and the lower end of the second lever is pivotally connected to the outer end of the wafer edge cleaning roller brush guide rod.

[0015] In the wafer cleaning device as described above, optionally, the wafer cleaning device has a mounting base, and the back cleaning roller brush assembly and the edge cleaning roller brush assembly are mounted on the mounting base via a cleaning mechanism support seat.

[0016] 14. The repairing kit for automotive dents, according to claim 13, wherein a bottom of the foot stand comprises a through-hole, and the two foot pieces comprise two bosses, wherein the bosses comprise a first boss, a second boss, a third boss, and a fourth boss. The bosses comprise a first arm, a second arm, and a second helm. The bosses comprise a first arm, a second arm, and a second helm. The bosses comprise a first arm, a second arm, and a second helm. The bosses comprise a first arm, a second arm, and a second helm.

[0017] In the wafer cleaning device as described above, optionally, the first clamping wheel and the second clamping wheel are respectively mounted on the first support cross arm in a slidable manner through a first wheel bracket, and the third clamping wheel and the fourth clamping wheel are respectively mounted on the second support cross arm in a slidable manner through a second wheel bracket.

[0018] In the wafer cleaning device as described above, optionally, the clamping guide rails are respectively covered with rail protective covers between the cleaning mechanism support seat and the first wafer clamping mechanism carrying slider and between the cleaning mechanism support seat and the second wafer clamping mechanism carrying slider.

[0019] In the wafer cleaning device as described above, optionally, the cleaning mechanism support seat is in an inverted U shape, and the clamping guide rail passes through the cleaning mechanism support seat between two legs of the inverted U shape.

[0020] In the wafer cleaning device as described above, optionally, the wafer cleaning device further includes a wheel edge cleaning mechanism, which is provided at each of the clamping wheels for cleaning the clamping wheels.

[0021] In the wafer cleaning device as described above, optionally, the wheel edge cleaning mechanism includes a wheel edge nozzle, the wheel edge nozzle has a curved portion toward the clamping wheel, and nozzles are distributed on one side of the curved portion close to the clamping wheel, and the spraying direction of the nozzles converges to the clamping portion of the clamping wheel.

[0022] In the wafer cleaning device as described above, optionally, the wafer cleaning device is equipped with two wheel-side nozzles for each clamping wheel, so as to clean the clamping wheel at different angles.

[0023] In order to achieve the aforementioned objectives, a second aspect of the present invention provides a wafer thinning device, wherein the wafer thinning device has a wafer cleaning device as described in any one of the aforementioned first aspects.

[0024] The present invention is suitable for cleaning the back of a wafer after a dicing process, and can clean the back of the wafer and the cleaning device itself, thereby reducing damage to the wafer caused by the cleaning device itself.

[0025] In some technical solutions of the present invention, a segmented bottom roller brush is used to clean the back of the wafer, and the rotation direction of the wafer is adapted by the axially relatively forward and reverse roller brush combination, so that the bottom of the wafer can be cleaned efficiently.

[0026] In a further technical solution of the present invention, the wafer contour can be optionally cleaned by an edge cleaning roller brush.

[0027] In a further technical solution of the present invention, the clamping wheel can be self-cleaned by a side wheel cleaning mechanism of the clamping wheel to prevent the clamping wheel from being contaminated and the contaminated particles from scratching the outer contour of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The disclosure of the present invention will become more apparent with reference to the accompanying drawings. It should be understood that these drawings are for illustrative purposes only and are not intended to limit the scope of protection of the present invention. In the drawings:

[0029] Figure 1 A schematic perspective view of an embodiment of a wafer cleaning device according to the present invention is shown;

[0030] Figure 2 yes Figure 1 A schematic perspective view of a wafer cleaning apparatus, showing wafers in position to be cleaned;

[0031] Figure 3 yes Figure 1 A schematic side view of a wafer cleaning apparatus;

[0032] Figure 4 yes Figure 3 A partial side cross-sectional view of the back cleaning brush and edge cleaning brush of the wafer cleaning device;

[0033] Figure 5 yes Figure 1 A schematic diagram of the wheel edge cleaning mechanism of the wafer cleaning device, which also shows a partial enlarged view of the wheel edge nozzle;

[0034] Figures 6 to 8 Schematically shows Figure 1 The state change process of the edge cleaning roller brush assembly of the wafer cleaning device; and

[0035] Figure 9 and Figure 10 A schematic diagram showing the influence of the relative movement direction of the wafer and the cleaning roller brush on the cleaning effect.

[0036] Figure 1: 1-wafer cleaning device; 2-clamping wheel; 3-wafer; 4-back cleaning roller brush assembly; 5-back cleaning roller brush; 51-first roller brush half; 52-second roller brush half; 6-back cleaning roller brush bracket; 7-edge cleaning roller brush assembly; 8-edge cleaning roller brush; 81-first edge cleaning roller brush; 82-second edge cleaning roller brush; 9-edge cleaning roller brush bracket; 10-wafer edge cleaning roller brush sleeve rod; 11-wafer edge cleaning roller brush guide rod; 12-wafer edge cleaning roller brush cylinder; 13-mounting base plate; 14-cleaning mechanism support seat; 15-first support cross arm; 16-second support cross arm; 17-first wafer Circular clamping mechanism carrying slider; 18-second wafer clamping mechanism carrying slider; 19-clamping guide rail; 20-clamping cylinder; 21-first clamping wheel; 22-second clamping wheel; 23-third clamping wheel; 24-fourth clamping wheel; 27-guide rail protective cover; 28-wheel edge cleaning mechanism; 29-bending part; 30-nozzle; 31-wheel edge nozzle fixing seat; 32-wheel bracket; 33-clamping wheel motor assembly; 34-clamping cylinder bracket; 35-adaptive torsion adjustment disk; 36-first roller brush half motor assembly; 37-second roller brush half motor assembly; 38-back cleaning roller brush assembly cylinder; 39-first lever. DETAILED DESCRIPTION

[0037] With reference to the accompanying drawings and specific embodiments, the structure, composition, characteristics and advantages of the wafer cleaning device of the present invention and the wafer thinning equipment including the same will be explained below in an exemplary manner. However, all descriptions should not be used to form any limitations on the present invention.

[0038] For any single technical feature described or implied in the embodiments mentioned in this document, or any single technical feature shown or implied in the accompanying drawings, the present invention still allows for continued arbitrary combination or deletion between these technical features (or their equivalents) without any technical obstacles, and thus it should be considered that these more embodiments according to the present invention are also within the scope of the description in this document.

[0039] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the quantity of the technical features indicated. Thus, features defined as "first" or "second" may explicitly or implicitly include at least one of these features.

[0040] The present invention relates to cleaning the back of a wafer after a dicing process. After the dicing process, the back of the wafer is contaminated by silicon slurry. The present invention cleans the back of the wafer using a segmented bottom roller brush mechanism. The axially relatively forward and reverse roller brush combination adapts to the wafer's rotational direction, enabling efficient bottom cleaning. Optionally, a wafer edge cleaning mechanism can be used to clean the wafer's contour. Simultaneously, a side wheel cleaning mechanism on the clamping wheel performs self-cleaning on the clamping wheel, preventing contaminated particles from scratching the outer contour of the wafer after the clamping wheel is contaminated. This allows the back of the wafer and the cleaning device itself to be cleaned, minimizing damage to the wafer caused by the cleaning device itself.

[0041] Figure 1 A schematic perspective view of an embodiment of a wafer cleaning apparatus according to the present invention is shown. Figure 2 yes Figure 1 A schematic three-dimensional diagram of a wafer cleaning apparatus showing wafers in position to be cleaned.

[0042] As shown in the figure, the wafer cleaning device 1 includes multiple clamping wheels 2, a back cleaning roller brush assembly 4, an edge cleaning roller brush assembly 7, and a wheel edge cleaning mechanism 28. These clamping wheels 2, the back cleaning roller brush assembly 4, the edge cleaning roller brush assembly 7, and the wheel edge cleaning mechanism 28 are all installed on the mounting base 13.

[0043] When the wafer cleaning device is used to clean the back of the wafer, multiple clamping wheels 2 hold the wafer 3 in place and drive the wafer 3 to rotate. The back cleaning roller brush assembly 4 cleans the back of the wafer, the edge cleaning roller brush assembly cleans the edge of the wafer, and the wheel edge cleaning mechanism cleans the clamping wheels. Multiple clamping wheels 2 are in the same plane. During cleaning, the relative rotation direction of each rotating cleaning mechanism and the wafer is set so that at the contact point between each rotating cleaning mechanism and the back of the wafer, the contact part of each rotating cleaning mechanism and the contact part of the back of the wafer move in opposite directions. In the illustrated example, the rotary cleaning mechanism includes a back cleaning roller brush, an edge cleaning roller brush, etc. The wafer cleaning device can effectively and quickly remove contaminants at the dead angle between the clamping wheel and the wafer, can effectively prevent and avoid scratches on the edge of the wafer and scratches and wear of the clamping wheel group, reduce the number of replacement times of the clamping wheel group and improve the yield rate of the wafer.

[0044] As can be seen from the figure, the clamping wheel 2 is used to clamp and limit the wafer 3 on the back side to be cleaned. Figure 3Specifically, a clamping portion is formed on the top of each clamping wheel 2, and the outer circumference of the clamping portion is in the shape of an inverted truncated cone. The inclined outer peripheral edge of each clamping wheel is used to clamp the wafer and hold the wafer in place to prevent the wafer from falling off during cleaning.

[0045] exist Figure 1 Two groups of clamping wheels 2 are shown in the figure. The first group of clamping wheels includes two clamping wheels located on the first side of the back cleaning roller brush assembly 4, and the second group of clamping wheels includes two clamping wheels located on the second side of the back cleaning roller brush assembly 4. The first group of clamping wheels and the second group of clamping wheels are capable of moving relative to each other. When the wafer 3 is to be clamped, the two groups of clamping wheels 2 move to both sides to increase the distance between them, so that the wafer can be placed between the clamping wheels at various locations. After the wafer is placed between the clamping wheels, the two groups of clamping wheels can move toward the middle to reduce the distance between them, thereby clamping the wafer between the four clamping wheels. In an optional embodiment, the two groups of clamping wheels 2 can independently control the moving position. By controlling both at the same time, efficiency and flexibility can be improved.

[0046] Among the four clamping wheels 2 shown in the figure, at least one clamping wheel 2 can be a driving wheel, and the other clamping wheels 2 can be driven wheels. When a wafer 3 is placed between the clamping wheels 2 and clamped in place by the clamping wheels 2, the driving wheel can be started, and the four clamping wheels 2 rotate in the same direction, driving the clamped wafer to rotate. The wafer back cleaning brush and edge cleaning brush at the bottom of the wafer, as well as the wheel edge cleaning mechanism, start to operate, cleaning the back of the wafer.

[0047] More specifically, if Figure 1 As shown in , the first group of clamping wheels and the second group of clamping wheels may include a first clamping wheel 21, a second clamping wheel 22, a third clamping wheel 23, and a fourth clamping wheel 24. It should be noted that in an optional embodiment, the first clamping wheel 21, the second clamping wheel 22, the third clamping wheel 23, and the fourth clamping wheel 24 may be independently provided, and each can be independently controlled to adjust its position to clamp the wafer, which also falls within the scope of the present invention.

[0048] according to Figure 1 In the embodiment, the first clamping wheel 21 and the second clamping wheel 22 are respectively mounted on the first support cross arm 15, and the third clamping wheel 23 and the fourth clamping wheel 24 are respectively mounted on the second support cross arm 16. In this case, the first support cross arm 15 and the second support cross arm 16 are each capable of movable adjustment and / or rotational adjustment.

[0049] Specifically, the first support arm 15 and the second support arm 16 are mounted to the first wafer clamping mechanism support slider 17 and the second wafer clamping mechanism support slider 18, respectively, in a manner that allows for adaptive torsion adjustment. The figure shows an adaptive torsion adjustment disk, which provides adaptive rotational freedom for the first support arm 15 and the second support arm 16. When the first support arm 15 and the second support arm 16 move toward the wafer, once each clamping wheel 2 reaches the wafer, it will adaptively rotate and adjust so that all four clamping wheels 2 engage the outer periphery of the wafer. The adaptive torsion adjustment disk is composed of two disk components that are connected to each other and can rotate relative to each other.

[0050] At the same time, the first wafer clamping mechanism carrying slider 17 and the second wafer clamping mechanism carrying slider 18 are slidably engaged with the clamping guide rail 19. The clamping guide rail 19 is fixed to the mounting base 13. The first wafer clamping mechanism carrying slider 17 and the second wafer clamping mechanism carrying slider 18 are respectively located on both sides of the cleaning mechanism support seat 14, and move toward each other along the clamping guide rail 19 under the action of the clamping cylinder 20 to clamp and limit the wafer 3. The clamping cylinder 20 can be fixed to the mounting base 13 respectively through the clamping cylinder bracket 34, and the clamping cylinder 20 is mounted on the clamping cylinder bracket 34. As shown in the figure, on both sides of the wafer cleaning device 1, a support cross arm, an adaptive torsion adjustment disk, and a carrying slider are provided for the first group of clamping wheels and the second group of clamping wheels, respectively, and are located on the mounting base 13 at both ends.

[0051] Optionally, the first clamping wheel 21 and the second clamping wheel 22 are each slidably mounted on the first support arm 15 via a first wheel bracket, and the third clamping wheel 23 and the fourth clamping wheel 24 are each slidably mounted on the second support arm 16 via a second wheel bracket. To clarify the positions of the first and second wheel brackets, a wheel bracket 32 is shown in the figure. This arrangement allows the clamping wheels to be adjusted as needed to accommodate wafers of different sizes.

[0052] As can be seen from the figure, the back cleaning roller brush assembly 4 includes a back cleaning roller brush 5 and a back cleaning roller brush bracket 6. The back cleaning roller brush 5 is installed on the back cleaning roller brush bracket 6. The back cleaning roller brush bracket 6 is used to support the back cleaning roller brush 5 and fit the back cleaning roller brush 5 to the back of the wafer 3. After the back cleaning roller brush 5 is fitted to the back of the wafer 3, when cleaning begins, the back cleaning roller brush 5 and the wafer 3 start to rotate, and reverse relative movement occurs between the two, so that the back cleaning roller brush brushes and removes the contaminants on the back of the wafer. The motor assembly of the back cleaning roller brush is arranged at its end and is coaxial with the back cleaning roller brush. Its diameter is smaller than the back cleaning roller brush, so that it does not interfere with the wafer during cleaning.

[0053] The back-cleaning roller brush 5 is a segmented roller brush that passes through the center of the wafer, i.e., is aligned with the wafer diameter, and is composed of an independent first roller brush half 51 and a second roller brush half 52. In an optional embodiment, the central rotating shaft of the first roller brush half 51 and the central rotating shaft of the second roller brush half 52 can be connected to each other, or can be the same central rotating shaft. When cleaning the back of the wafer, the first roller brush half 51 and the second roller brush half 52 rotate in opposite directions. The first roller brush half 51 and the second roller brush half 52 are respectively driven by the first roller brush half motor assembly 36 and the second roller brush half motor assembly 37 located at the end. As shown in the figure, the first roller brush half motor assembly 36 and the second roller brush half motor assembly 37 extend axially outward from the ends of the first roller brush half 51 and the second roller brush half 52, respectively, and have diameters smaller than the diameters of the first roller brush half 51 and the second roller brush half 52, respectively, to avoid interference with the wafer during the cleaning process.

[0054] In an optional embodiment, the first roller brush half 51 and the second roller brush half 52 can be configured to move in opposite directions relative to the wafer portions they contact, and: the first roller brush half 51 and the second roller brush half 52 are of equal length and are located on either side of the rotation center of the back-cleaning roller brush bracket 6, or the length of the first roller brush half 51 is greater than the length of the second roller brush half 52. It can also be seen from the figure that the first roller brush half 51 and the second roller brush half 52 are separated from each other, and the first roller brush half 51 and the second roller brush half 52 have the same diameter and are aligned in center, so that the back of the wafer can be cleaned simultaneously. By setting it this way, it is possible to avoid leaving uncleaned contaminants at the center of the circle. Even if part of the wafer is not cleaned by the second roller brush half 52, the first roller brush half 51 will still perform effective cleaning, which is beneficial to ensuring the quality of the wafer back cleaning.

[0055] This wafer cleaning system uses a segmented back-of-wafer cleaning roller brush to clean the wafer's back in sections. Its counter-rotating motion, which is opposite to the wafer's rotation, ensures effective cleaning and eliminates blind spots, ensuring the effective cleaning area and effectiveness of the wafer's backside. Furthermore, an edge cleaning mechanism cleans the wafer's edge in a direction opposite to the wafer's rotation, improving cleaning efficiency within the same operating space.

[0056] In an optional embodiment, the shorter second roller brush half 52 may be omitted as needed, and only the longer first roller brush half 51 may be retained, so that the overall structure of the wafer cleaning device 1 is simpler.

[0057] As can be seen from the figure, the edge cleaning roller brush assembly 7 includes an edge cleaning roller brush 8 and an edge cleaning roller brush bracket 9. The edge cleaning roller brush 8 is installed on the edge cleaning roller brush bracket 9. The edge cleaning roller brush bracket 9 is used to support the edge cleaning roller brush 8 and fit the edge cleaning roller brush 8 to the edge of the wafer 3 to facilitate cleaning the outer edge of the wafer.

[0058] The edge cleaning roller brush 8 is movably mounted on the end of the edge cleaning roller brush bracket 9. The rotation direction of the edge cleaning roller brush 8 is opposite to the rotation direction of the wafer 3. In addition, when cleaning the wafer edge, the edge cleaning roller brush 8 is in contact with the edge of the wafer 3; when cleaning the wafer edge, the edge cleaning roller brush 8 is separated from the edge of the wafer 3. In this way, when placing or removing the wafer, the edge cleaning roller brush 8 can be removed first; when cleaning, the edge cleaning roller brush 8 is returned to the cleaning position, which can effectively prevent accidents such as wafer drop, wafer pinching, and wafer breakage during placement or removal.

[0059] The edge cleaning roller brush 8 may include a first edge cleaning roller brush 81 and a second edge cleaning roller brush 82. The first edge cleaning roller brush 81 and the second edge cleaning roller brush 82 are respectively pivotally connected to the two ends of the edge cleaning roller brush bracket 9. The clamping cleaning contact point of the first edge cleaning roller brush 81 and the second edge cleaning roller brush 82 passes through the center of the wafer. It should be noted that in different embodiments, other numbers of edge cleaning roller brushes may be provided, such as but not limited to one, three, four, or even more.

[0060] In the illustrated example, the first edge cleaning roller brush 81 and the second edge cleaning roller brush 82 can be connected to the wafer edge cleaning roller brush sleeve rod 10 and the wafer edge cleaning roller brush guide rod 11, respectively. The wafer edge cleaning roller brush sleeve rod 10 is sleeved on the wafer edge cleaning roller brush guide rod 11, and the two can move relative to each other under the drive of the wafer edge cleaning roller brush cylinder 12, thereby driving the first edge cleaning roller brush 81 and the second edge cleaning roller brush 82 to switch between contacting the edge of the wafer 3 and separating from the edge of the wafer 3. It will be understood that in an optional embodiment, the position switching of each edge cleaning roller brush can also be controlled individually; in the illustrated example, the use of sleeve rods and guide rods to associate different edge cleaning roller brushes can enable the edge cleaning roller brushes to switch positions synchronously, avoiding operational accidents caused by asynchronous switching of different edge cleaning roller brushes, which may affect normal production.

[0061] As shown in the figure, the back cleaning roller brush holder 6 and the edge cleaning roller brush holder 9 are integrally formed into a cross shape. The wafer edge cleaning roller brush cover rod 10 and the wafer edge cleaning roller brush guide rod 11 are parallel to the edge cleaning roller brush holder 9 and spatially located below the plane of the aforementioned intersection. It can also be seen that the back cleaning roller brush 5 extends the entire length of the back cleaning roller brush holder 6, while the edge cleaning roller brush 8 includes a first edge cleaning roller brush 81 and a second edge cleaning roller brush 82, respectively disposed at opposite ends of the edge cleaning roller brush holder 9.

[0062] Furthermore, it can be seen from the figure that the first end of the edge cleaning roller brush bracket 9 is provided with a first lever 39, the upper end of the first lever 39 is fixed with the first edge cleaning roller brush 81, the lower end of the first lever 39 is pivotally connected to the outer end of the wafer edge cleaning roller brush sleeve rod 10, and the second end of the edge cleaning roller brush bracket 9 is provided with a second lever (not marked), the upper end of the second lever is fixed with the second edge cleaning roller brush 82, and the lower end of the second lever is pivotally connected to the outer end of the wafer edge cleaning roller brush guide rod 11.

[0063] In an optional embodiment, according to specific needs, an independent back cleaning roller brush bracket and an independent edge cleaning roller brush bracket can be configured. At this time, the back cleaning roller brush bracket and the edge cleaning roller brush bracket can be in different horizontal planes, separated up and down to avoid interference with each other.

[0064] Combine Figure 2 and Figure 5As shown, the main function of the clamping wheel 2 is to clamp and limit the wafer, and in this example, they work in pairs of even numbers. Among them, the clamping wheel motor assembly 33 provides the self-rotation power for the clamping wheel 2, and the unit has been waterproofed. During the self-rotation of the clamping wheel 2, the back and edge roller brushes of the wafer cannot clean the clamping wheel 2, causing the wafer to clamp the contaminants in the dead angle of contact with it in the initial uncleaned state, and scratch the edge and body of the wafer during the self-rotation of the wafer. The clamping wheel 2 is cleaned by adding a wheel edge cleaning mechanism 28, such as a wheel edge nozzle. As shown in FIG. Figure 5 As shown, the wheel side spraying position is located outside the diagonal, and the clamping wheel 2 is sprayed without affecting the handling action of the wafer by the handling system. The spray angle is shown in FIG. Figure 5 The partially enlarged view of middle II shows that the main easily contaminated areas of the clamping wheel 2 are fully covered by spraying, which effectively prevents and removes pollutants remaining in dead corners and avoids scratches on the wafer edge and the clamping wheel.

[0065] As can be seen from the figure, the wheel cleaning mechanism 28 is provided at each of the clamping wheels 2 for cleaning the clamping wheels 2. In the illustrated example, four wheel cleaning mechanisms 28 are shown, which clean each of the clamping wheels 2. The wheel cleaning mechanism 28 can be in different forms, such as but not limited to cleaning liquid cleaning, cleaning gas purging, roller brush contact cleaning, etc. In the illustrated embodiment, each wheel cleaning mechanism 28 includes two wheel nozzles, such as Figure 1 As shown in the figure, they are respectively arranged at the wheel bracket 32 through the wheel side nozzle fixing seat 31, and each wheel side nozzle can spray cleaning liquid to the clamping wheel 2 to clean the clamping wheel.

[0066] The wafer cleaning device prevents scratches on the wafer edge. It can effectively and quickly remove contaminants at the dead corners between the clamping wheel and the wafer through the wheel edge cleaning mechanism, effectively preventing and avoiding scratches on the wafer edge and scratches and wear of the clamping wheel group, reducing the number of replacement times of the clamping wheel group and improving the yield rate of the wafer.

[0067] The wafer cleaning device 1 has a mounting base 13 .

[0068] The back cleaning roller brush assembly 4 and the edge cleaning roller brush assembly 7 are mounted on the mounting base 13 via a cleaning mechanism support seat 14. As shown in the figure, the cleaning mechanism support seat 14 is in an inverted U-shape, and the clamping guide rail 19 passes through the cleaning mechanism support seat 14 between the two legs of the inverted U-shape. Through the mounting base 13, the wafer cleaning device 1 can be mounted to a wafer thinning device (not shown). The cleaning mechanism support seat 14 can be fixed to the mounting base 13; in an optional embodiment, it can also be configured to be able to move and adjust its position along the clamping guide rail 19. The back cleaning roller brush assembly 4 and the edge cleaning roller brush assembly 7 are both mounted on the cleaning mechanism support seat 14.

[0069] The clamping wheels 2 are mounted on the mounting base 13 via a support cross arm, an adaptive torsion adjustment disk 35, a first wafer clamping mechanism support slider 17, and a second wafer clamping mechanism support slider 18. These wheels are located on either side of the back cleaning roller brush assembly 4 and the edge cleaning roller brush assembly 7. The clamping cylinders 20 located on the clamping guide rails 19 adjust the position of the clamping wheels 2 along the clamping guide rails 19. The adaptive torsion adjustment disk 35 enables the clamping wheels 2 to adaptively hold the wafer in place.

[0070] Combine Figure 1 and Figure 2 According to this embodiment, when the backside cleaning process is performed on the wafer 3, the four clamping wheels 2 on both sides move toward each other along the clamping guide rail 19 through the action of the clamping cylinder 20 to clamp and limit the wafer 3 ( Figure 2 The middle arrow indicates the clamping action. The back cleaning brush assembly cylinder 38 lifts the back cleaning brush bracket 6, attaching the first brush half 51 and the second brush half 52 to the back of the wafer to clean the back of the wafer. The wheel edge cleaning mechanism 28 continuously sprays the clamping wheel 2 to prevent contaminants on the back of the wafer from remaining in the edge seam of the clamping wheel 2, thereby forming a cleaning dead zone at the edge of the wafer. The edge cleaning brush 8 is lifted by the wafer edge cleaning brush cylinder 12, causing the wafer edge cleaning brush cover rod 10 and the wafer edge cleaning brush guide rod 11 to move relative to each other, driving the edge cleaning brush 8 to attach to the edge of the wafer to clean the edge contour of the wafer. The two ends of the guide rail protective cover 27 below the cleaning mechanism support seat 14 are respectively fixed to the first wafer clamping mechanism support slider 17 and the second wafer clamping mechanism support slider 18, and fully cover the clamping guide rail 19 below it to prevent contaminants from splashing onto the guide rail during the cleaning process and causing the guide rail to jam. The four clamping wheels 2 rotate in the same direction, driving the clamped wafer to rotate, and the bottom cleaning brush and the contour cleaning brush start working to clean the back of the wafer.

[0071] According to this embodiment, during wafer cleaning, the wafer rotates and the back cleaning roller brush 5 rolls against the back of the wafer, creating relative motion between the two to remove contaminants. The two halves of the roller brush work together to fully cover the wafer, eliminating any unreachable blind spots. Furthermore, the roller brushes rotate in different directions relative to the wafer's center of rotation, ensuring thorough cleaning on both sides.

[0072] Figure 3 yes Figure 1 Schematic side view of the wafer cleaning apparatus.

[0073] Figure 3 It is more clearly shown in the figure that the clamping guide rails 19 are covered with rail protective covers 27 between the cleaning mechanism support seat 14 and the first wafer clamping mechanism carrying slider 17 and between the cleaning mechanism support seat 14 and the second wafer clamping mechanism carrying slider 18.

[0074] The rail shield 27 can be an accordion-style shield made of a folding flexible material. Its ends can be fixed to the first wafer clamping mechanism support slider 17 and the second wafer clamping mechanism support slider 18, respectively. It can be extended and retracted as needed to fully cover the clamping guide rail 19 below the cleaning mechanism support seat 14, preventing liquid and contaminants from splashing onto the clamping guide rail during the cleaning process and causing the rail to become stuck. The rail waterproof shield 27 can be a single piece, passing under the cleaning mechanism support seat 14 and fixed to the first wafer clamping mechanism support slider 17 and the second wafer clamping mechanism support slider 18 at its ends.

[0075] In an optional embodiment, the guide rail protective cover 27 can also be divided into two sections, one section is connected between the cleaning mechanism support seat 14 and the first wafer clamping mechanism supporting slider 17, and the other section is connected between the cleaning mechanism support seat 14 and the second wafer clamping mechanism supporting slider 18.

[0076] It can also be seen from the figure that a distance is maintained between the guide rail protective cover 27 and the clamping guide rail 19 to prevent the guide rail protective cover 27 from being stuck on the clamping guide rail 19 and causing jamming when the first wafer clamping mechanism carrying slider 17 and the second wafer clamping mechanism carrying slider 18 move toward the cleaning mechanism support seat 14.

[0077] in addition, Figure 3 The figure also more clearly illustrates the components of the wafer cleaning apparatus 1. For example, the figure clearly shows two clamping cylinders 20 fixed to the ends of the mounting base 13 via clamping cylinder brackets 34. These cylinders respectively control the sliding movement of the first wafer clamping mechanism carrying slider 17 and the second wafer clamping mechanism carrying slider 18 on the clamping guide rail 19. The figure also shows the clamping wheel, the clamping wheel motor assembly, and the wheel edge cleaning mechanism.

[0078] Figure 4 yes Figure 1 A partial side cross-sectional view of the back cleaning brush and edge cleaning brush of the wafer cleaning device.

[0079] The figure shows the direction of rotation of the first roller brush half 51 and the second roller brush half 52 of the back cleaning roller brush 5 along their longitudinal axis, the direction of rotation of the wafer 3 along an axis perpendicular to its center, and the direction of rotation of the first edge cleaning roller brush 81 and the second edge cleaning roller brush 82 along their longitudinal axis.

[0080] from Figure 4 As can be seen in the figure, in this example, the first brush half 51 and the second brush half 52 of the back-cleaning roller brush 5 are of unequal length, with the first brush half 51 being longer than the second brush half 52. The contact area between the back-cleaning roller brush 5 and the wafer 3 coincides with a diameter of the wafer and passes through the center of the wafer 3. Furthermore, the first brush half 51 and the second brush half 52 rotate in opposite directions along their axis. However, because the first and second brush halves 51, 52 are primarily located on either side of the center of the wafer 3, the rotation direction of the wafer 3 causes the first and second brush halves 51, 52 to move in directions substantially opposite to those of the corresponding locations on the wafer 3 at the points of contact. Although a portion of the first brush half 51 extends beyond the center of the wafer and aligns with the direction of movement of the wafer, the corresponding location on the wafer is cleaned by the portion of the first brush half 51 that does not extend past the center of the wafer, thus preventing the formation of undesirable contaminants on the back of the wafer.

[0081] The figure also shows the rotation direction of the edge cleaning brushes. As can be seen from the figure, the first edge cleaning brush 81, the second edge cleaning brush 82, and the wafer 3 all rotate clockwise. This allows the first and second edge cleaning brushes 81, 82 to contact the wafer 3 at different locations from the direction of movement of the wafer 3, which is more conducive to cleaning the outer circumferential edge of the wafer 3.

[0082] like Figure 4As shown, by adjusting the rotational direction of the first and second brush halves 51, 52 relative to the wafer 3, a cleaning effect is achieved on the primary backside area of the wafer 3. As shown in the figure, when the wafer 3 rotates clockwise, the first brush half 51 rotates counterclockwise, and the second brush half 52 rotates clockwise at the same visual angle. When the wafer 3 rotates counterclockwise, the first brush half 51 rotates clockwise, and the second brush half 52 rotates counterclockwise at the same visual angle. Simultaneously, the effective axial cleaning distance of the first brush half 51 at the bottom is slightly longer than that of the second brush half 52, passing through the center of the wafer 3. The structure and action of the bottom brushes achieves a comprehensive cleaning of the primary cleaning area. A pair of edge cleaning brushes, the first and second edge cleaning brushes 81, 82, are located along the wafer edge. The line connecting their clamping and cleaning contact points passes through the center of the wafer, balancing the stress effects on the wafer 3. The first edge cleaning roller brush 81 and the second edge cleaning roller brush 82 on both sides rotate in the opposite direction to the direction of rotation of the wafer 3 , thereby achieving a cleaning operation for edge contaminants.

[0083] Figure 5 yes Figure 1 Schematic diagram of the wheel cleaning mechanism of the wafer cleaning device, which also shows a partial enlarged view of the wheel nozzle. Figure 5 A detail I of the center wheel nozzle is shown in an enlarged left-side view II.

[0084] In various embodiments, the wheel edge cleaning mechanism 28 may be a spray cleaning fluid, a cleaning brush, etc. In the illustrated example, it includes a wheel edge nozzle that continuously sprays cleaning fluid onto the clamping portion of the clamping wheel to prevent contaminants on the back of the wafer from remaining in the edge of the clamping wheel, thereby preventing the formation of a cleaning dead zone at the edge of the wafer.

[0085] The wafer cleaning device can prevent scratches on the wafer edge. The wheel edge cleaning mechanism can effectively and quickly prevent and remove contaminants in the dead corners between the clamping wheel and the wafer, avoiding scratches on the wafer contour edge and wear on the contact position of the clamping wheel during the relative rotation of the wafer and the clamping wheel.

[0086] The wheel-side nozzle has a curved portion 29 facing the clamping wheel 2. Nozzles 30 are distributed on the side of the curved portion 29 near the clamping wheel 2, with the nozzles 30 spraying directly toward the clamping wheel 2. As shown in the figure, the nozzles 30 are arranged in a row. Due to the curvature of the curved portion 29, all nozzles converge to spray the clamping portion of the clamping wheel. In an optional embodiment, multiple wheel-side nozzles can be provided for a single clamping wheel, allowing for continuous cleaning at different circumferential locations on different clamping wheels.

[0087] In the example shown, combined with Figure 1It can be seen that the wafer cleaning device 1 is equipped with two wheel-side nozzles for each clamping wheel 2, which clean the clamping wheel 2 at different angles.

[0088] Figures 6 to 8 Schematically shows Figure 1 The state change process of the edge cleaning roller brush assembly of the wafer cleaning device.

[0089] As shown in the figure, the wafer edge cleaning roller brush cylinder 12 is fixed on the cleaning mechanism support seat 14. Figure 6 As shown in FIG, the wafer edge cleaning roller brush cover rod 10 and the wafer edge cleaning roller brush guide rod 11 are retracted, so that the lever structure at both ends drives the first edge cleaning roller brush 81 and the second edge cleaning roller brush 82 to open, and the wafer to be cleaned can be received at this time. Figure 7 In the process, the wafer edge cleaning roller brush cover rod 10 and the wafer edge cleaning roller brush guide rod 11 are driven to extend, so that the first edge cleaning roller brush 81 and the second edge cleaning roller brush 82 are retracted through the lever structure at both ends, so that the wafer can be kept in place. Figure 8 In the middle are the first edge cleaning roller brush 81 and the second edge cleaning roller brush 82 which are completely retracted. When a wafer is placed on the back cleaning roller brush assembly, the first edge cleaning roller brush 81 and the second edge cleaning roller brush 82 will be close to or attached to the outer peripheral edge of the wafer respectively. When the wafer and the edge cleaning roller brushes rotate at the same time, the edge of the wafer can be cleaned.

[0090] In this example, the operation process of the edge cleaning roller brush is as follows: when the transport mechanism transports the wafer to the cleaning area of the wafer cleaning device of the present invention, the wafer edge cleaning mechanism is in Figure 6 In the state shown in FIG, the edge cleaning roller brush 8 moves relative to the wafer edge cleaning roller brush cover rod 10 and the wafer edge cleaning roller brush guide rod 11 under the action of the wafer edge cleaning roller brush cylinder 12, so that the edge cleaning roller brush 8 makes an avoidance action to prevent interference when the upper transport mechanism transports the wafer down. When the clamping wheel group completes the clamping action on the wafer, Figure 7 As shown in FIG, the edge cleaning roller brush 8 moves toward each other through the wafer edge cleaning roller brush cover rod 10 and the wafer edge cleaning roller brush guide rod 11 under the action of the wafer edge cleaning roller brush cylinder 12, so that the edge cleaning roller brush 8 performs a clamping action. Figure 8 In the state of the edge cleaning roller brush 8, after being clamped stably, it rotates in the opposite direction of the wafer rotation to clean the edge of the wafer.

[0091] Figure 9 and Figure 10 A schematic diagram showing the influence of the relative movement direction of the wafer and the cleaning roller brush on the cleaning effect.

[0092] The figure shows the wafer 3, the clamping wheel 2 and the back cleaning roller brush 5. The wafer 3 rotates in the horizontal plane, and the rotation direction is shown by the arrow on it. The back cleaning roller brush 5 rotates along an axis perpendicular to the paper, and its rotation direction is shown by the arrow on the back cleaning roller brush 5. As can be seen from the figure, the operating state of the back cleaning roller brush 5 relative to the wafer 3 can be Figure 9 The two rotate in the same direction and Figure 10 According to the figure, relatively speaking, when the two relative running directions are opposite, the back side of the wafer 3 after the back cleaning roller brush 5 is cleaned. Figure 9 and Figure 10 The contaminants on the back of the wafer to the right of the middle back cleaning roller brush 5 will be cleaned more thoroughly, which can more effectively avoid the occurrence of some residual contaminants on the back of the wafer after brushing.

[0093] The present invention also provides a wafer thinning device, which may include a wafer cleaning device as described in any one of the aforementioned embodiments.

[0094] The technical solution of the present invention is suitable for cleaning the back of the wafer after the dicing process, and can prevent the back of the wafer from being contaminated by silicon slurry after the dicing process. Some technical solutions of the present invention clean the back of the wafer by a segmented back cleaning roller brush, and adapt to the self-rotation direction of the wafer by an axially relatively forward and reverse roller brush combination, so that it can efficiently clean the bottom. In a further technical solution of the present invention, the wafer contour is cleaned by a wafer edge cleaning mechanism; at the same time, the clamping wheel is self-cleaned by a side wheel cleaning mechanism of the clamping wheel to prevent the contaminated particles from scratching the outer contour of the wafer after the clamping wheel is contaminated, thereby achieving cleaning of the back of the wafer and the cleaning device itself, reducing the damage to the wafer caused by the cleaning device itself.

[0095] The technical scope of the present invention is not limited to the contents of the above description. Those skilled in the art can make various deformations and modifications to the above embodiments without departing from the technical concept of the present invention, and these deformations and modifications should all fall within the scope of the present invention.

Claims

1. A wafer cleaning device, characterized in that: include: Multiple clamping wheels are used to clamp and limit the wafers to be cleaned; A back cleaning roller brush assembly includes a back cleaning roller brush bracket and a back cleaning roller brush mounted thereon; the back cleaning roller brush bracket is used to support the back cleaning roller brush and to attach the back cleaning roller brush to the back of the wafer; the back cleaning roller brush is a segmented roller brush that passes through the center of the wafer and is composed of an independent first roller brush half and a second roller brush half. When cleaning the back of the wafer, the first roller brush half and the second roller brush half rotate in opposite directions; The edge cleaning roller brush assembly comprises an edge cleaning roller brush bracket and a first edge cleaning roller brush and a second edge cleaning roller brush pivotally connected at both ends thereof, the back cleaning roller brush bracket and the edge cleaning roller brush bracket being integrally formed in a cross shape, the clamping cleaning contact points of the first edge cleaning roller brush and the second edge cleaning roller brush being connected passing through the center of the wafer; a first lever and a second lever are respectively provided at both ends of the edge cleaning roller brush bracket, the upper end of the first lever is fixed to the first edge cleaning roller brush, and the lower end is pivotally connected to the outer end of the wafer edge cleaning roller brush sleeve rod, the upper end of the second lever is fixed to the second edge cleaning roller brush, and the lower end is pivotally connected to the outer end of the wafer edge cleaning roller brush guide rod, the wafer edge cleaning roller brush sleeve rod is sleeved on the wafer edge cleaning roller brush guide rod and the two can move relative to each other, thereby respectively driving the first edge cleaning roller brush and the second edge cleaning roller brush to switch between contacting with the wafer edge and separating from the wafer edge; Multiple clamping wheels include a first clamping wheel and a second clamping wheel installed on the first supporting cross arm, a third clamping wheel and a fourth clamping wheel installed on the second supporting cross arm, the first supporting cross arm and the second supporting cross arm are respectively installed on the first wafer clamping mechanism supporting slider and the second wafer clamping mechanism supporting slider through adaptive torsion adjustment disks in a manner that can adaptively adjust torsion; when the first supporting cross arm and the second supporting cross arm move toward the wafer, once each clamping wheel reaches the wafer, the first supporting cross arm and the second supporting cross arm adaptively rotate and adjust so that the four clamping wheels all engage the outer periphery of the wafer.

2. The wafer cleaning device according to claim 1, wherein: The back cleaning roller brush extends over the entire length of the back cleaning roller brush bracket, the first roller brush half and the second roller brush half move in opposite directions to the wafer parts they contact, and the length of the first roller brush half is greater than the length of the second roller brush half.

3. The wafer cleaning device according to claim 1, wherein: The edge cleaning roller brush assembly includes an edge cleaning roller brush, and the edge cleaning roller brush includes the first edge cleaning roller brush and the second edge cleaning roller brush. The edge cleaning roller brush is movably mounted on the end of the edge cleaning roller brush bracket, and the edge cleaning roller brush bracket is used to support the edge cleaning roller brush and fit the edge cleaning roller brush to the edge of the wafer; the rotation direction of the edge cleaning roller brush is opposite to the rotation direction of the wafer, and: when cleaning the edge of the wafer, the edge cleaning roller brush fits the edge of the wafer; when finishing cleaning the edge of the wafer, the edge cleaning roller brush is detached from the edge of the wafer.

4. The wafer cleaning device according to claim 1, wherein: The wafer cleaning device has a mounting base, and the back cleaning roller brush assembly and the edge cleaning roller brush assembly are mounted on the mounting base via a cleaning mechanism support seat.

5. The wafer cleaning device according to claim 4, wherein: The first wafer clamping mechanism carrying slider and the second wafer clamping mechanism carrying slider are slidably engaged with the clamping guide rail, the clamping guide rail is fixed to the mounting base, and the first wafer clamping mechanism carrying slider and the second wafer clamping mechanism carrying slider are respectively located on both sides of the cleaning mechanism support seat, and the wafer is clamped and limited by moving toward each other along the clamping guide rail under the action of the clamping cylinder.

6. The wafer cleaning device according to claim 5, wherein: The first clamping wheel and the second clamping wheel are respectively slidably mounted on the first supporting cross arm via a first wheel bracket, and the third clamping wheel and the fourth clamping wheel are respectively slidably mounted on the second supporting cross arm via a second wheel bracket.

7. The wafer cleaning device according to claim 5, wherein: The clamping guide rails are respectively covered with rail protective covers between the cleaning mechanism support seat and the first wafer clamping mechanism carrying slider and between the cleaning mechanism support seat and the second wafer clamping mechanism carrying slider.

8. The wafer cleaning device according to claim 5, wherein: The cleaning mechanism support seat is in an inverted U shape, and the clamping guide rail passes through the cleaning mechanism support seat between two legs of the inverted U shape.

9. The wafer cleaning device according to claim 1, wherein: The wafer cleaning device further includes a wheel edge cleaning mechanism, which is disposed at each of the clamping wheels and is used to clean the clamping wheels.

10. The wafer cleaning device according to claim 9, wherein: The wheel edge cleaning mechanism includes a wheel edge nozzle, which has a curved portion facing the clamping wheel. Nozzles are distributed on one side of the curved portion close to the clamping wheel, and the spraying direction of the nozzles converges to the clamping portion of the clamping wheel.

11. The wafer cleaning device according to claim 10, wherein: The wafer cleaning device is equipped with two wheel-side nozzles for each clamping wheel, and cleans the clamping wheel at different angles.

12. A wafer thinning device, characterized in that: The wafer thinning equipment comprises the wafer cleaning device according to any one of claims 1 to 11.

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