A semiconductor device cutting, testing and packaging integrated machine

Abstract

The present invention belongs to the field of semiconductor processing technology, and specifically relates to a semiconductor device rib cutting, testing and packaging integrated machine. A plurality of auxiliary ribs are connected between the first frame and the second frame to ensure the accurate relative position of the two tapes; the semiconductor device rib cutting, testing and packaging integrated machine comprises a feeding device, a first rib cutting device, a second rib cutting device, a testing mechanism and a packaging mechanism arranged in sequence, a first semiconductor device transfer mechanism is also arranged between the feeding device and the first rib cutting device, a lifting and supporting mechanism is arranged between the first rib cutting device and the second rib cutting device, a second semiconductor device transfer mechanism is arranged at the second rib cutting device, the first rib cutting device is used to cut the auxiliary ribs, the second rib cutting device is used to cut the first frame and the second frame on both sides of the chip, the second semiconductor device transfer mechanism only translates but does not lift, and the lifting function is set on the lifting and supporting mechanism to ensure the accurate position of the semiconductor device on the second rib cutting device.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor processing, and in particular relates to a semiconductor device cutting, testing and packaging integrated machine. Background Art

[0002] Tape is needed in the production process of semiconductor devices. The two tape bodies of the tape are usually independent of each other. The chip is fixed on the frame of one tape body, and then the chip is connected to the frame of the other tape body by a connecting piece. Finally, the connection between the two tape bodies and the frame needs to be cut by a rib cutting device to form a single semiconductor device. However, in actual production, since the two tape bodies are independent of each other, a precise positioning device is required to ensure the relative position of the two tape bodies is accurate, so as to ensure that the chip welding position is accurate and firm. This leads to high semiconductor processing costs and low yields.

[0003] At present, a new frame structure needs to be designed. The best way is to connect the two belts with auxiliary ribs to ensure that the relative positions of the two belts are fixed, so as to improve welding efficiency and reduce manufacturing costs. However, the new frame structure requires a new rib cutting device, and there is currently no suitable device. Summary of the invention

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide a semiconductor device cutting, testing and packaging all-in-one machine that can efficiently complete the cutting, testing and packaging of semiconductor devices.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a semiconductor device rib cutting, testing and packaging integrated machine, comprising a feeding device, a first rib cutting device, a second rib cutting device, a testing mechanism and a packaging mechanism arranged in sequence, the first rib cutting device is used to cut auxiliary ribs, and the second rib cutting device is used to cut the first frame and the second frame on both sides of the chip;

[0006] A first semiconductor device transfer mechanism is also provided between the feeding device and the first rib cutting device, a lifting and supporting mechanism is provided between the first rib cutting device and the second rib cutting device, a second semiconductor device transfer mechanism is provided at the second rib cutting device, the second semiconductor device transfer mechanism moves the semiconductor device on the lifting and supporting mechanism to the second rib cutting device, and a third semiconductor device transfer mechanism is provided between the second rib cutting device and the testing mechanism.

[0007] Preferably, the first semiconductor device transfer mechanism includes a first transfer arm and a towing assembly, a positioning assembly and a pushing assembly arranged on the first transfer arm, the first transfer arm is connected to a translation assembly, the towing assembly, the positioning assembly and the pushing assembly are arranged in sequence along the direction from the feeding device to the lifting support mechanism, and the towing assembly, the positioning assembly and the pushing assembly are all connected to the lifting assembly.

[0008] Preferably, the lifting support mechanism comprises a support seat and a lifting assembly for driving the support seat to lift and lower, and hooking and giving way grooves are respectively provided on both sides of the upper surface of one end of the support seat close to the second tendon cutting device;

[0009] The second semiconductor device transfer mechanism is provided with a semiconductor device hanging column corresponding to the hanging yielding groove.

[0010] Preferably, the second semiconductor device transfer mechanism comprises a second transfer arm, the second transfer arm is connected to a translation assembly driving the second transfer arm to move horizontally, and a punching and making way groove is provided in the middle of one end of the second transfer arm close to the lifting and supporting mechanism.

[0011] Preferably, the first rib cutting device includes a first rib cutting base, a first rib cutting lifting seat, a first rib cutting male mold, a first rib cutting female mold and a first rib cutting floating plate, the first rib cutting lifting seat is lifted and arranged on the upper side of the first rib cutting base, the first rib cutting male mold is arranged on the first rib cutting lifting seat, the first rib cutting female mold is arranged on the first rib cutting base, the first rib cutting floating plate is arranged on the lower side of the first rib cutting lifting seat through a first return spring, and the first rib cutting male mold is arranged through the first rib cutting floating plate.

[0012] Preferably, the second rib cutting device includes a second rib cutting base, a second rib cutting lifting seat, a second rib cutting male mold, a second rib cutting female mold and a second rib cutting floating plate, the second rib cutting lifting seat is lifted and lowered on the upper side of the second rib cutting base, the second rib cutting male mold is arranged on the second rib cutting lifting seat, the second rib cutting female mold is arranged on the second rib cutting base, the second rib cutting floating plate is lifted and lowered in the second rib cutting female mold, and a second reset spring is arranged between the second rib cutting floating plate and the second rib cutting female mold.

[0013] Preferably, a plurality of negative pressure suction holes are provided on the lower side of the second rib cutting male die.

[0014] Preferably, the third semiconductor device transfer mechanism includes a third drag seat, a third upper transfer seat and a third lower transfer seat, the third drag seat is arranged on one side of the second rib cutting device, the third upper transfer seat is arranged between the third drag seat and the third lower transfer seat, a semiconductor device upper suction cup is provided on the lower side of the third upper transfer seat, and the third drag seat, the third upper transfer seat and the third lower transfer seat are all connected with a translation assembly.

[0015] Preferably, the feeding device includes a semiconductor device silo, an upper silo tray, a lower silo tray, a semiconductor device pushing mechanism and a silo lifting mechanism. The upper silo tray is arranged on the upper side of the lower silo tray, an upper silo transfer assembly for pushing the semiconductor device silo to move is arranged on one side of the upper silo tray, a lower silo transfer assembly for pushing the semiconductor device silo to move is arranged at one end of the lower silo tray, the silo lifting mechanism and the semiconductor device pushing mechanism are both arranged at one end of the upper silo tray, and the semiconductor device pushing mechanism is arranged on one side of the silo lifting mechanism, and a semiconductor device tray is arranged on the other side of the silo lifting mechanism.

[0016] Preferably, the silo lifting mechanism includes a lifting base, a silo clamping block and a silo lifting drive mechanism, the silo clamping block is arranged on the upper side of the lifting base, the lifting base and the silo clamping block are both connected to the silo lifting drive mechanism, and the silo clamping block is also connected to a lifting assembly.

[0017] The semiconductor device cutting rib test packaging integrated machine of the present invention is applied to a semiconductor device, comprising a first frame, a second frame and a chip, wherein the chip is arranged on the first frame, the second frame is connected to the chip via a connecting piece, and a plurality of auxiliary ribs are connected between the first frame and the second frame. The auxiliary ribs connect two tapes, which can ensure that the relative positions of the two tapes are accurate, and the chip welding position is accurate and firm.

[0018] The auxiliary rib is arranged between two chips, and the auxiliary rib is spaced apart from the adjacent first frame and the second frame.

[0019] The width of the auxiliary rib is smaller than the width of the first frame.

[0020] Compared with the prior art, the above technical scheme has the following beneficial effects: the semiconductor device rib cutting test packaging integrated machine uses the first semiconductor device transfer mechanism to receive the semiconductor device transmitted by the feeding device, the first rib cutting device is used to cut the auxiliary ribs, and the second rib cutting device is used to cut the first frame and the second frame on both sides of the chip. After the auxiliary ribs of the semiconductor device on the first rib cutting device are cut, the first semiconductor device transfer mechanism drags the new semiconductor device to the first cutting device while transporting the semiconductor device with the auxiliary ribs cut to the lifting and supporting mechanism. When the second semiconductor device transfer mechanism picks up the semiconductor device, the second semiconductor device transfer mechanism only moves horizontally but not vertically, and the lifting function is set on the lifting and supporting mechanism. In this way, the second semiconductor device transfer mechanism is fixed after transferring the semiconductor device to the second rib cutting device, and the second rib cutting device directly cuts the semiconductor device. The second semiconductor device transfer mechanism can ensure the accurate position of the semiconductor device on the second rib cutting device, and avoid the situation where the semiconductor device is displaced after the second semiconductor device transfer mechanism moves. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the structure of a semiconductor device.

[0022] Figure 2 A three-dimensional diagram of the semiconductor device cutting, testing and packaging integrated machine.

[0023] Figure 3 This is a top view of the integrated machine for cutting, testing and packaging semiconductor devices.

[0024] Figure 4 for Figure 3 Cross-sectional view at AA in the middle.

[0025] Figure 5 It is a three-dimensional diagram of the feeding device.

[0026] Figure 6 This is a three-dimensional view of the feeding device with the outer cover of the lifting screw removed.

[0027] Figure 7 A top view of the feeding device.

[0028] Figure 8 for Figure 7 Cross-sectional view at BB in the middle.

[0029] Fig. 9 for Figure 4 A partial enlarged view of point C in the middle.

[0030] Fig.10 It is a three-dimensional diagram of the first tendon cutting device.

[0031] Fig.11 It is a three-dimensional diagram of the first semiconductor device transfer mechanism.

[0032] Fig.12 It is a cross-sectional view of the first tendon cutting device.

[0033] Fig.13 This is a schematic diagram of a semiconductor device after cutting the auxiliary ribs.

[0034] Fig.14 It is a three-dimensional diagram of the lifting and supporting mechanism.

[0035] Fig.15 It is a three-dimensional view of the second rib cutting device and the third semiconductor device transfer mechanism.

[0036] Fig.16 for Fig.15 A partial enlarged view of point D in the middle.

[0037] Fig.17 It is a cross-sectional view of a third semiconductor device transfer mechanism.

[0038] Fig.18 This is a schematic diagram of the semiconductor device that has been finally cut.

[0039] Fig.19 It is a structural schematic diagram of the third semiconductor device transfer mechanism.

[0040] Fig. 20 A three-dimensional diagram of the test structure.

[0041] Wherein: 1, feeding device 2, first rib cutting device 3, second rib cutting device 4, testing mechanism 5, packaging mechanism 6, first semiconductor device transfer mechanism 7, second semiconductor device transfer mechanism 8, third semiconductor device transfer mechanism 9, tape 10, first frame 11, second frame 12, chip 13, connecting piece 14, auxiliary rib 15, lifting and holding mechanism;

[0042] 101, semiconductor device silo 102, silo upper tray 103, silo lower tray 104, upper silo transfer assembly 105, silo lifting mechanism 106, semiconductor device push-out mechanism 107, semiconductor device tray 108, lower silo transfer assembly 1051, silo lifting motor 1052, silo lifting screw 1053, lifting base 1054, silo clamping block 1055, silo clamping cylinder 1056, silo lifting seat 1061, push plate 1062, push-out synchronous belt 1081, lower silo transfer cylinder 1082, lower silo transfer connecting plate 1083, lower silo transfer push rod;

[0043] 201, first rib cutting base 202, first rib cutting lifting seat 203, first rib cutting male die 204, first rib cutting female die 205, first rib cutting floating plate 206, first return spring;

[0044] 301, second rib cutting base 302, second rib cutting lifting seat 303, second rib cutting male mold 304, second rib cutting female mold 305, second rib cutting floating plate 306, second return spring 307, baffle 308, negative pressure suction hole;

[0045] 401, test suction cup 402, test probe seat 403, turntable;

[0046] 601, first transfer arm 602, drag assembly 603, positioning assembly 604, pushing assembly;

[0047] 701, second transfer arm 702, punching and cutting groove 703, semiconductor device hanging column;

[0048] 801, third upper transfer seat 802, third lower transfer seat 803, upper suction cup of semiconductor device 804, lower suction cup of semiconductor device 805, third drag seat 806, and drag seat suction cup;

[0049] 1501. Support seat 1502. Hanging clearance slot. DETAILED DESCRIPTION

[0050] Figure 1 to Figure 20 The best embodiment of the present invention is shown below in conjunction with the attached Figure 1 to Figure 20 The present invention is further described.

[0051] See also Figure 1 The semiconductor device includes a tape 9 and a chip 12. The two tape bodies of the tape 9 are respectively provided with a first frame 10 and a second frame 11. The chip 12 is arranged on the first frame 10. The second frame 11 is connected to the chip 12 through a connecting piece 13. A plurality of auxiliary ribs 14 are connected between the first frame 10 and the second frame 11. The auxiliary ribs 14 connect the two tapes 9 to ensure that the relative positions of the two tapes 9 are accurate and the welding position of the chip 12 is accurate and firm. The chip 12 is placed downward when the ribs are cut.

[0052] See also Figure 2-Figure 4 The semiconductor device rib cutting, testing and packaging integrated machine comprises a feeding device 1, a first rib cutting device 2, a second rib cutting device 3, a testing mechanism 4 and a packaging mechanism 5 which are arranged in sequence. The feeding device 1 sends the semiconductor device to the first rib cutting device 2. The first rib cutting device 2 is used to cut the auxiliary ribs 14. The second rib cutting device 3 is used to cut the first frame 10 and the second frame 11 on both sides of the chip 12. The testing mechanism 4 is used to detect the electrical properties of the semiconductor device, and then remove the unqualified ones and send the qualified ones to the packaging mechanism 5 for packaging. The packaging mechanism 5 is a plastic sealing mechanism.

[0053] A first semiconductor device transfer mechanism 6 is also provided between the feeding device 1 and the first rib cutting device 2, and a second semiconductor device transfer mechanism 7 is provided at the second rib cutting device 3. The second semiconductor device transfer mechanism 7 moves the semiconductor device to the second rib cutting device 3, and a third semiconductor device transfer mechanism 8 is provided between the second rib cutting device 3 and the testing mechanism 4.

[0054] See also Figure 5-Figure 8The feeding device 1 includes a semiconductor device silo 101, an upper silo tray 102, a lower silo tray 103, a semiconductor device pushing mechanism 106 and a silo lifting mechanism 105. The semiconductor device silo 101 is provided with a plurality of slots for placing semiconductor devices. The upper silo tray 102 is arranged on the upper side of the lower silo tray 103. An upper silo transfer component 104 for pushing the semiconductor device silo 101 to move is arranged on one side of the upper silo tray 102. A lower silo transfer component 108 for pushing the semiconductor device silo 101 to move is arranged at one end of the lower silo tray 103. The silo lifting mechanism 105 and the semiconductor device pushing mechanism 106 are both arranged at one end of the upper silo tray 102, and the semiconductor device pushing mechanism 106 is arranged on one side of the silo lifting mechanism 105. A semiconductor device tray 107 is arranged on the other side of the silo lifting mechanism 105.

[0055] The silo lifting mechanism 105 includes a lifting base 1053, a silo clamping block 1054 and a silo lifting drive mechanism. The silo clamping block 1054 is arranged on the upper side of the lifting base 1053. The lifting base 1053 and the silo clamping block 1054 are both connected to the silo lifting drive mechanism. The silo clamping block 1054 is also connected to a lifting component. The lifting component in this embodiment is a silo clamping cylinder 1055.

[0056] The silo lifting drive mechanism includes a silo lifting motor 1051, a silo lifting screw 1052 and a silo lifting seat 1056. The silo lifting motor 1051 is fixed on the lower side of an outer cover. The silo lifting screw 1052 is rotatably arranged in the outer cover. The lower end of the silo lifting screw 1052 is connected to the silo lifting motor 1051. The silo lifting seat 1056 is threadedly connected to the silo lifting screw 1052. The silo lifting seat 1056 is slidably connected to the outer cover. The lifting base 1053 and the silo clamp block 1054 are both fixed on the silo lifting seat 1056.

[0057] The semiconductor device ejection mechanism 106 in this embodiment includes a push plate 1061 and an ejection timing belt 1062. The push plate 1061 is slidably set on a base, and the ejection timing belt 1062 is set on one side of the base and connected to the push plate 1061. The ejection timing belt 1062 is used to drive the push plate 1061 to move horizontally to horizontally eject the semiconductor devices in the semiconductor device silo 101.

[0058] The upper bin transfer assembly 104 is a cylinder or push rod motor or screw structure. The lower bin transfer assembly 108 includes a lower bin transfer cylinder 1081, a lower bin transfer connecting plate 1082 and a lower bin transfer push rod 1083. The lower bin transfer cylinder 1081 is arranged in the outer cover, the lower bin transfer connecting plate 1082 connects the piston rod of the lower bin transfer cylinder 1081 and one end of the lower bin transfer push rod 1083, and the other end of the lower bin transfer push rod 1083 extends out of the outer cover.

[0059] The feeding device 1 of this embodiment realizes the cyclic feeding of multiple silos. First, the semiconductor device silo 101 filled with semiconductor devices is placed on the upper tray 102 of the silo. The upper silo transfer assembly 104 moves the semiconductor device silo 101 on the upper tray 102 of the silo toward the silo lifting mechanism 105. The semiconductor device silo 101 moves from the upper tray 102 of the silo to the lifting base 1053. Then, the silo clamping block 1054 clamps the semiconductor device silo downward under the drive of the silo clamping cylinder 1055. 101, the silo lifting drive mechanism drives the semiconductor device silo 101 to move gradually downward, and utilizes the semiconductor device pushing mechanism 106 to push the semiconductor devices in the semiconductor device silo 101 horizontally onto the semiconductor device tray 107. When all the semiconductor devices in a semiconductor device silo 101 are pushed out, the lower silo transfer assembly 108 pushes the semiconductor device silo 101 onto the silo lower tray 103, and the silo lifting mechanism 105 connects to another semiconductor device silo 101, and so on.

[0060] See also Fig. 9 A lifting and holding mechanism 15 is provided between the first rib cutting device 2 and the second rib cutting device 3. The second semiconductor device transfer mechanism 7 moves the semiconductor device on the lifting and holding mechanism 15 to the second rib cutting device 3. When the second semiconductor device transfer mechanism 7 picks up the semiconductor device, the second semiconductor device transfer mechanism 7 only moves horizontally but does not lift or lower. The lifting function is set on the lifting and holding mechanism 15. In this way, the second semiconductor device transfer mechanism 7 is fixed after transferring the semiconductor device to the second rib cutting device 3. The second rib cutting device 3 directly cuts the semiconductor device. The second semiconductor device transfer mechanism 7 can ensure that the position of the semiconductor device on the second rib cutting device 3 is accurate, and avoids the situation where the semiconductor device is displaced after the second semiconductor device transfer mechanism 7 moves.

[0061] See also Figure 10-11 The first semiconductor device transfer mechanism 6 includes a first transfer arm 601 and a dragging assembly 602, a positioning assembly 603 and a pushing assembly 604 arranged on the first transfer arm 601. The first transfer arm 601 is connected with a translation assembly. The dragging assembly 602, the positioning assembly 603 and the pushing assembly 604 are arranged in sequence along the direction from the feeding device 1 to the lifting and supporting mechanism 15, and the dragging assembly 602, the positioning assembly 603 and the pushing assembly 604 are all connected to the lifting assembly.

[0062] The dragging assembly 602, the positioning assembly 603 and the pushing assembly 604 in this embodiment are two cylinders arranged side by side. During feeding, the first transfer arm 601 is located on the upper side of the semiconductor device tray 107, and the lifting assembly drives the positioning assembly 603 to fall. When the feeding mechanism 1 delivers the semiconductor device to the semiconductor device tray 107, the end of the semiconductor device contacts the positioning assembly 603 and stops, thereby positioning the semiconductor device. Then the lifting assembly drives the dragging assembly 602 to fall, and the pushing assembly 604 also falls under the drive of its lifting assembly. The lifting assembly drives the positioning assembly 603 to rise, and the first transfer arm 601 moves toward the first rib cutting device 2. During the movement, the pushing assembly 604 pushes the semiconductor device cut by the first rib cutting device 2 to the lifting and supporting mechanism 15. At the same time, the dragging assembly 602 drags the semiconductor device on the semiconductor device tray 107 to the first rib cutting device 2. The first transfer arm 601 returns to the upper side of the semiconductor device tray 107, and the first rib cutting device 2 performs rib cutting.

[0063] See also Fig.12 The first rib cutting device 2 includes a first rib cutting base 201, a first rib cutting lifting base 202, a first rib cutting male mold 203, a first rib cutting female mold 204 and a first rib cutting floating plate 205. The first rib cutting lifting base 202 is lifted and arranged on the upper side of the first rib cutting base 201, the first rib cutting male mold 203 is arranged on the first rib cutting lifting base 202, the first rib cutting female mold 204 is arranged on the first rib cutting base 201, the first rib cutting floating plate 205 is arranged on the lower side of the first rib cutting lifting base 202 through a first return spring 206, and the first rib cutting male mold 203 is arranged through the first rib cutting floating plate 205.

[0064] The first rib cutting lifting seat 202 drives the first rib cutting male mold 203 and the first rib cutting floating plate 205 to move downward, the first rib cutting male mold 203 is inserted into the first rib cutting nut and cuts the auxiliary rib 14, the first rib cutting floating plate 205 moves upward relative to the first rib cutting male mold 203 to compress the first return spring 206, when the first rib cutting lifting seat 202 drives the first rib cutting male mold 203 to move upward, the first rib cutting floating plate 205 is fixed relative to the first rib cutting nut under the action of the first return spring 206, so that the cut semiconductor device is firmly fixed on the first rib cutting nut, and the semiconductor device is placed to move upward with the first rib cutting male mold 203.

[0065] See also Fig.13 The auxiliary ribs 14 on the semiconductor device are cut off by using the first rib cutting male die 203 of the first rib cutting device 2 in cooperation with the first rib cutting female die.

[0066] See also Fig.14The lifting support mechanism 15 in this embodiment includes a support seat 1501 and a lifting component that drives the support seat 1501 to rise and fall. Hanging and yielding grooves 1502 are respectively opened on both sides of the upper surface of one end of the support seat 1501 close to the second tendon cutting device 3.

[0067] See also Figure 15-16 The second semiconductor device transfer mechanism 7 includes a second transfer arm 701, which is connected to a translation assembly that drives it to move horizontally. A punching and giving way groove 702 is provided in the middle of one end of the second transfer arm 701 close to the lifting and lowering support mechanism 15. A semiconductor device hanging column 703 corresponding to the hanging giving way groove 1502 is provided on the lower side of one end of the second transfer arm 701 close to the support seat 1501. After the support seat 1501 descends, one end of the second transfer arm 701 moves to the upper side of the support seat 1501, and then the support seat 1501 rises and makes the hole or groove of the semiconductor device hang with the semiconductor device hanging column 703, and then the second transfer arm 701 drags the semiconductor device back, so that the semiconductor device moves to the second rib cutting device 3.

[0068] The purpose of the punching clearance groove 702 is to avoid moving the second transfer arm 701 when the second rib cutting device 3 is punching. Since the second rib cutting device 3 is punching both sides of the semiconductor device, the punching clearance groove 702 only needs to be larger than the width of the part to be cut. After the second transfer arm 701 drags the semiconductor device on the supporting seat 1501 to the second rib cutting device 3, the second rib cutting device 3 directly performs punching. The function of the second transfer arm 701 is not only to transfer the semiconductor device, but more importantly to position the semiconductor device, thereby effectively improving the processing efficiency and processing accuracy.

[0069] See also Fig.17 The second rib cutting device 3 comprises a second rib cutting base 301, a second rib cutting lifting base 302, a second rib cutting male die 303, a second rib cutting female die 304 and a second rib cutting floating plate 305. The second rib cutting lifting base 302 is arranged on the upper side of the second rib cutting base 301, the second rib cutting male die 303 is arranged on the second rib cutting lifting base 302, the second rib cutting female die 304 is arranged on the second rib cutting base 301, the second rib cutting floating plate 305 is arranged in the second rib cutting female die 304, and a second return spring 306 is arranged between the second rib cutting floating plate 305 and the second rib cutting female die 304. The width of the punching clearance groove 702 is greater than the width of the second rib cutting floating plate 305.

[0070] Baffles 307 are provided on both sides of the second rib cutting master mold 304. The baffles 307 are spaced apart from the second rib cutting master mold 304 to form a blanking space. The baffles 307 prevent waste from splashing during the cutting process. The cut coils 9 fall into the waste box through the blanking space.

[0071] A plurality of negative pressure suction holes 308 are provided on the lower side of the second rib cutting male mold 303, and the second rib cutting lifting seat 302 drives the second rib cutting male mold 303 to move downward and contact the second rib cutting floating plate 305. During the downward movement of the second rib cutting male mold 303 and the second rib cutting floating plate 305, the semiconductor device contacts the second rib cutting female mold 304, so that the second rib cutting male mold 303 and the second rib cutting female mold 304 cooperate to cut off the semiconductor device part outside the second rib cutting floating plate 305, and after cutting, the negative pressure suction holes 308 absorb the semiconductor device on the second rib cutting floating plate 305, and after cutting, the second rib cutting male mold 303 moves upward together with the second rib cutting floating plate 305, and the second rib cutting male mold 303 always absorbs the semiconductor device through the negative pressure suction holes 308.

[0072] In this embodiment, the second cutting rib male mold 303 can also start adsorption after it falls and contacts the semiconductor device, so that the semiconductor device is stably fixed on the second cutting rib floating plate 305, preventing the semiconductor device from shifting during the cutting process. There is no need to rearrange the semiconductor device during subsequent testing, thereby improving test efficiency.

[0073] See also Fig.18 After the semiconductor device is cut, only the chip 12, the connecting piece 13, the first frame 10 and the second frame 11 remain.

[0074] See also Fig.19 The third semiconductor device transfer mechanism 8 includes a third drag seat 805, a third upper transfer seat 801 and a third lower transfer seat 802. The third drag seat 805 is arranged at one side of the second rib cutting device 3. The third upper transfer seat 801 is arranged between the third drag seat 805 and the third lower transfer seat 802. A drag seat suction cup 806 is arranged on the upper side of the third drag seat 805. An upper semiconductor device suction cup 803 is arranged on the lower side of the third upper transfer seat 801. A lower semiconductor device suction cup 804 is arranged on the upper side of the third lower transfer seat 802. The third drag seat 805 is perpendicular to the moving direction of the third upper transfer seat 801. The third drag seat 805 is also connected to a lifting assembly. The lifting assembly drives the third drag seat 805 and the drag seat suction cup 806 to move upward to receive the semiconductor device adsorbed by the second rib cutting male mold 303.

[0075] See also Fig. 20 The testing mechanism 4 includes a testing turntable 403 and a plurality of testing suction cups 401 and a testing probe seat 402 arranged on the turntable 403. The turntable 403 drives the testing suction cup 401 to absorb the semiconductor device on the lower suction cup 804 of the semiconductor device and transfer it to the testing probe seat 402. The testing probe seat 402 performs electrical testing on the semiconductor device, divides the semiconductor device into qualified parts, unqualified parts and parts requiring re-inspection, and uses the turntable 403 and the testing suction cup 401 to transport the semiconductor devices to the corresponding workstations respectively.

[0076] The packaging mechanism 5 is arranged at a work station corresponding to the qualified parts, and the semiconductor devices that have passed the test are directly packaged or encapsulated by the packaging mechanism 5 .

[0077] The translation assembly and lifting assembly described in this embodiment are selected from various structural forms such as air cylinder, electric cylinder, oil cylinder, lead screw or synchronous belt according to needs. The first semiconductor device transfer mechanism 6, the second semiconductor device transfer mechanism 7, and the third semiconductor device transfer mechanism 8 in this embodiment all have the function of positioning the semiconductor device, so they need to cooperate with the position detection switch, and the translation assembly of the first semiconductor device transfer mechanism 6, the second semiconductor device transfer mechanism 7, and the third semiconductor device transfer mechanism 8 is preferably a servo motor with a lead screw structure to accurately move the semiconductor device.

[0078] Working process: The push plate 1061 of the feeding device 1 pushes the semiconductor devices in the semiconductor device bin 101 horizontally onto the semiconductor device tray 107, the first transfer arm 601 drives the pushing assembly 604 to push the semiconductor devices cut by the first rib cutting device 2 onto the lifting and supporting mechanism 15, and at the same time the dragging assembly 602 drags the semiconductor devices on the semiconductor device tray 107 to the first rib cutting device 2, the first transfer arm 601 returns to the upper side of the semiconductor device tray 107, and the first rib cutting device 2 performs rib cutting.

[0079] The support seat 1501 is driven by the cylinder to descend, and one end of the second transfer arm 701 moves to the upper side of the support seat 1501, and then the support seat 1501 rises and makes the hole or groove of the semiconductor device and the semiconductor device hanging column 703 mutually hang, and then the second transfer arm 701 drags the semiconductor device back and moves the semiconductor device to the upper side of the second cutting rib floating plate 305. The second transfer arm 701 fixes and positions the semiconductor device, and then the second cutting device 3 performs rib cutting.

[0080] After cutting, the second rib cutting mold 303 absorbs the semiconductor device through the negative pressure suction hole 308 and rises, and the third drag seat 805 drives the drag seat suction cup 806 to move to the lower side of the second rib cutting mold 303. The lifting assembly drives the third drag seat 805 and the drag seat suction cup 806 to move upward and receive the semiconductor device absorbed by the second rib cutting mold 303. Then the third drag seat 805 drives the drag seat suction cup 806 to return to its original position, and the third upper transfer seat 801 drives the upper suction cup 803 of the semiconductor device to move to the upper side of the drag seat suction cup 806. The upper suction cup 803 of the semiconductor device descends and absorbs the semiconductor device on the drag seat suction cup 806, and then transfers the semiconductor device to the lower suction cup 804 of the semiconductor device. During the transfer process, the suction cup ensures that the position of the semiconductor device is fixed, and there is no need to rearrange the semiconductor devices in subsequent testing, thereby improving the test efficiency.

[0081] The turntable 403 drives the test suction cup 401 to absorb the semiconductor device on the semiconductor device lower suction cup 804 and transfer it to the test probe seat 402. The test probe seat 402 performs electrical tests on the semiconductor device, classifies the semiconductor device into qualified parts, unqualified parts and parts that need to be re-tested, and uses the turntable 403 and the test suction cup 401 to transport the semiconductor devices to corresponding stations. The qualified semiconductor devices are directly packaged or encapsulated by the packaging mechanism 5, and the other devices are transported to the corresponding stations for corresponding processing or re-testing.

[0082] The above are only preferred embodiments of the present invention, and are not intended to limit the present invention in other forms. Any person skilled in the art may use the above disclosed technical contents to change or modify them into equivalent embodiments with equivalent changes. However, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A semiconductor device cutting, testing and packaging integrated machine, characterized in that: The semiconductor device comprises a tape (9) and a chip (12); two tape bodies of the tape (9) are respectively provided with a first frame (10) and a second frame (11); the chip (12) is arranged on the first frame (10); the second frame (11) is connected to the chip (12) via a connecting sheet (13); a plurality of auxiliary ribs (14) are connected between the first frame (10) and the second frame (11); the auxiliary ribs (14) connect the two tapes (9); It comprises a feeding device (1), a first rib cutting device (2), a second rib cutting device (3), a testing mechanism (4) and a packaging mechanism (5) which are arranged in sequence, the first rib cutting device (2) being used for cutting auxiliary ribs (14), and the second rib cutting device (3) being used for cutting a first frame (10) and a second frame (11) on both sides of a chip (12); A first semiconductor device transfer mechanism (6) is provided between the feeding device (1) and the first rib cutting device (2); a lifting and supporting mechanism (15) is provided between the first rib cutting device (2) and the second rib cutting device (3); a second semiconductor device transfer mechanism (7) is provided at the second rib cutting device (3); the second semiconductor device transfer mechanism (7) moves the semiconductor device on the lifting and supporting mechanism (15) to the second rib cutting device (3); and a third semiconductor device transfer mechanism (8) is provided between the second rib cutting device (3) and the testing mechanism (4); The second semiconductor device transfer mechanism (7) comprises a second transfer arm (701), the second transfer arm (701) being connected to a translation assembly driving the second transfer arm (701) to move horizontally, and a punching and giving way groove (702) being provided in the middle of one end of the second transfer arm (701) close to the lifting and supporting mechanism (15).

2. The semiconductor device cutting, testing and packaging integrated machine according to claim 1, characterized in that: The first semiconductor device transfer mechanism (6) comprises a first transfer arm (601) and a towing assembly (602), a positioning assembly (603) and a pushing assembly (604) arranged on the first transfer arm (601); the first transfer arm (601) is connected to a translation assembly; the towing assembly (602), the positioning assembly (603) and the pushing assembly (604) are arranged in sequence along a direction from the feeding device (1) to the lifting and supporting mechanism (15); and the towing assembly (602), the positioning assembly (603) and the pushing assembly (604) are all connected to the lifting assembly.

3. The semiconductor device cutting, testing and packaging integrated machine according to claim 1, characterized in that: The lifting support mechanism (15) comprises a support seat (1501) and a lifting assembly for driving the support seat (1501) to lift and lower. Hanging clearance grooves (1502) are respectively provided on both sides of the upper surface of one end of the support seat (1501) close to the second tendon cutting device (3). The second semiconductor device transfer mechanism (7) is provided with a semiconductor device hanging column (703) corresponding to the hanging clearance groove (1502).

4. The semiconductor device cutting, testing and packaging integrated machine according to claim 1, characterized in that: The first rib cutting device (2) comprises a first rib cutting base (201), a first rib cutting lifting base (202), a first rib cutting male mold (203), a first rib cutting female mold (204) and a first rib cutting floating plate (205); the first rib cutting lifting base (202) is arranged to be lifted on the upper side of the first rib cutting base (201); the first rib cutting male mold (203) is arranged on the first rib cutting lifting base (202); the first rib cutting female mold (204) is arranged on the first rib cutting base (201); the first rib cutting floating plate (205) is arranged on the lower side of the first rib cutting lifting base (202) via a first return spring (206); and the first rib cutting male mold (203) is arranged through the first rib cutting floating plate (205).

5. The semiconductor device cutting, testing and packaging integrated machine according to claim 1, characterized in that: The second rib cutting device (3) comprises a second rib cutting base (301), a second rib cutting lifting base (302), a second rib cutting male mold (303), a second rib cutting female mold (304) and a second rib cutting floating plate (305); the second rib cutting lifting base (302) is arranged to be lifted on the upper side of the second rib cutting base (301); the second rib cutting male mold (303) is arranged on the second rib cutting lifting base (302); the second rib cutting female mold (304) is arranged on the second rib cutting base (301); the second rib cutting floating plate (305) is arranged to be lifted in the second rib cutting female mold (304); and a second return spring (306) is arranged between the second rib cutting floating plate (305) and the second rib cutting female mold (304).

6. The semiconductor device cutting, testing and packaging integrated machine according to claim 5, characterized in that: A plurality of negative pressure suction holes (308) are provided on the lower side of the second rib cutting male die (303).

7. The semiconductor device cutting, testing and packaging integrated machine according to claim 1, characterized in that: The third semiconductor device transfer mechanism (8) comprises a third drag seat (805), a third upper transfer seat (801) and a third lower transfer seat (802); the third drag seat (805) is arranged on one side of the second rib cutting device (3); the third upper transfer seat (801) is arranged between the third drag seat (805) and the third lower transfer seat (802); a semiconductor device upper suction cup (803) is arranged on the lower side of the third upper transfer seat (801); and the third drag seat (805), the third upper transfer seat (801) and the third lower transfer seat (802) are all connected to a translation assembly.

8. The semiconductor device cutting, testing and packaging integrated machine according to claim 1, characterized in that: The feeding device (1) comprises a semiconductor device silo (101), an upper silo tray (102), a lower silo tray (103), a semiconductor device ejection mechanism (106) and a silo lifting mechanism (105); the upper silo tray (102) is arranged on the upper side of the lower silo tray (103); an upper silo transfer assembly (104) for pushing the semiconductor device silo (101) to move is arranged on one side of the upper silo tray (102); a lower silo transfer assembly (108) for pushing the semiconductor device silo (101) to move is arranged at one end of the lower silo tray (103); the silo lifting mechanism (105) and the semiconductor device ejection mechanism (106) are both arranged at one end of the upper silo tray (102); the semiconductor device ejection mechanism (106) is arranged on one side of the silo lifting mechanism (105); and a semiconductor device tray (107) is arranged on the other side of the silo lifting mechanism (105).

9. The semiconductor device cutting, testing and packaging integrated machine according to claim 8, characterized in that: The silo lifting mechanism (105) comprises a lifting base (1053), a silo clamping block (1054) and a silo lifting drive mechanism. The silo clamping block (1054) is arranged on the upper side of the lifting base (1053). The lifting base (1053) and the silo clamping block (1054) are both connected to the silo lifting drive mechanism. The silo clamping block (1054) is also connected to a lifting component.

Images