A silicon wafer flip module

Abstract

The present invention discloses a silicon wafer flipping module, belonging to the field of silicon wafer flipping technology. The present invention comprises a first support frame, a servo motor is installed on the middle side of the first support frame, and a reducer is installed on the output end of the servo motor; and further comprises: a capacitive sensor is installed on the conveyor, and the capacitive sensor is used to detect whether the silicon wafer is in place, a connecting groove is opened in the middle of the central rotating shaft, and a flip material dial is installed on the connecting groove, and a guide groove for silicon wafer conveying is opened on the flip material dial. The silicon wafer flipping module, by opening a groove in the middle of the rotating shaft, realizes that whether the flipping function is used or not, it does not affect the transmission of the silicon wafer, improves production efficiency, increases the inclusiveness of the equipment, and saves costs. At the same time, when the silicon wafer is flipped and transmitted to a high place, the silicon wafer can be automatically limited, and when the silicon wafer does not need to be transmitted, the automatic cleaning of the slot body is realized.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer flipping, in particular to a silicon wafer flipping module. Background Art

[0002] Silicon wafers are important components in the photovoltaic industry. When etching or printing on the surface of silicon wafers, a silicon wafer flipping module is usually used to facilitate the processing of both sides of the silicon wafer. The flipping module can automatically flip the silicon wafer to improve the processing efficiency of the silicon wafer.

[0003] For example, the Chinese patent with the announcement date of 2021-01-22, the name of which is: A silicon wafer flipping device, a method of use and a silicon wafer production system, and the announcement number is CN112259483A, which includes: a transmission component; a flipping component, including a driving shaft and a first wheel disc and a second wheel disc symmetrically arranged on both sides of the driving shaft, a first side surface of the first wheel disc close to the driving shaft is evenly provided with a plurality of first grooves extending in the radial direction, and a second side surface of the second wheel disc close to the driving shaft is evenly provided with a plurality of second grooves extending in the radial direction, and the first grooves and the second grooves are symmetrically arranged; a controller, connected to the control ends of the driving shaft, the conveying runway and the output runway, and the controller is used to control the driving shaft to drive the first wheel disc and the second wheel disc to rotate synchronously.

[0004] The above-mentioned prior art has the following technical problems: when the existing flipping module flips the silicon wafer, the silicon wafer is flipped by rotating the turntable. However, when the turntable does not rotate, the flipping module cannot transfer the silicon wafer, thereby reducing the production efficiency and the applicability of the module. At the same time, when the silicon wafer is flipped, it is not convenient to automatically limit the silicon wafer, which causes the silicon wafer to fall due to shaking when flipping. Moreover, after the turntable rotates to transport the silicon wafer, it is not convenient to realize the self-cleaning of the silicon wafer receiving groove. As a result, after the dust and impurities on the receiving groove adhere to the surface of the silicon wafer, it is easy to affect the subsequent etching or printing operations on the silicon wafer surface.

[0005] Therefore, we propose a silicon wafer flip module to solve the above problems. Summary of the invention

[0006] The purpose of the present invention is to provide a silicon wafer flipping module to solve the problem raised in the above background technology that the existing flipping modules on the market flip the silicon wafer by rotating a turntable when flipping the silicon wafer, but when the turntable does not rotate, the flipping module cannot transfer the silicon wafer, thereby reducing the production efficiency and the applicability of the module. At the same time, when the silicon wafer is flipped, it is not convenient to automatically limit the silicon wafer, which causes the silicon wafer to fall due to shaking when flipping, and after the turntable rotates to transport the silicon wafer, it is not convenient to realize the self-cleaning of the silicon wafer receiving groove, and then the dust on the receiving groove adheres to the surface of the silicon wafer, which is easy to affect the subsequent etching or printing operations on the silicon wafer surface.

[0007] To achieve the above object, the present invention provides the following technical solution: a silicon wafer flip module, comprising a first support frame, a servo motor is installed on the middle side of the first support frame, and a reducer is installed on the output end of the servo motor, the output end of the reducer is fixedly connected to a central rotating shaft, and conveyors are installed on both sides of the central rotating shaft;

[0008] Also includes:

[0009] A capacitive sensor is installed on the conveyor, which is used to detect whether the silicon wafer is in place. A connecting groove is provided in the middle of the central rotating shaft, and a flip material dial is installed on the connecting groove. A guide groove for conveying silicon wafers is provided on the flip material dial. An origin detection sheet metal is fixedly connected to the end of the central rotating shaft away from the servo motor. A limited self-cleaning component is installed in the guide groove on the flip material dial, and the limited self-cleaning component is used to limit the conveyed silicon wafer and to clean the guide groove when the silicon wafer does not need to be flipped.

[0010] Preferably, the conveyor comprises a second support frame, a conveyor belt, a guide roller and a drive motor;

[0011] A plurality of guide rollers are installed on the second support frame, and a conveyor belt is sleeved on the outer side of the plurality of guide rollers. The guide rollers located below the second support frame are fixed on the output end of the driving motor, and a capacitive sensor is fixedly connected to the second support frame.

[0012] By adopting the above technical solution, the guide roller can be rotated by turning on the driving motor, and the rotation of the guide roller can be used to drive the conveyor belt to transport the silicon wafer.

[0013] Preferably, the connecting groove is located in the middle of the central shaft, and the connecting groove is set through the central shaft. The connecting groove is used to guide the silicon wafers transmitted on the conveyors on the left and right sides of the central shaft.

[0014] By adopting the above technical solution and arranging the connecting groove on the central rotating shaft, the silicon wafers can still be transported on the conveyor when the central rotating shaft does not rotate.

[0015] Preferably, the longitudinal section of the flip material dial is designed to be semicircular, and the flip material dial is symmetrically arranged about the transverse center axis of the central rotating shaft, and a plurality of guide grooves are evenly distributed at equal angles on the flip material dial.

[0016] By adopting the above technical solution, the multiple guide grooves evenly distributed on the flipping material disc can be turned over to facilitate continuous conveyance and flipping of silicon wafers.

[0017] Preferably, the two flip material discs on the central rotating shaft are combined to form a circle, and the two flip material discs are divided into 18 equal parts by multiple guide grooves at equal angles, and the angle between adjacent guide grooves is 20°, and the flip material discs are set to be made of POM material.

[0018] Preferably, the position-limiting self-cleaning component includes a moving block, an auxiliary spring, a first rubber block, a second rubber block, a connecting pipe, a pressure stopper, a magnetic metal block and an electromagnet;

[0019] The moving block is located at the inner side of the guide groove on the flip material dial, and the moving block is connected to the inside of the guide groove on the flip material dial through an auxiliary spring, a first rubber block and a second rubber block are installed on the moving block, and the second rubber block is located on the side of the moving block away from the auxiliary spring, the first rubber block and the second rubber block are connected to each other through a connecting pipe, a pressure block is fixedly connected to the side of the guide groove, and the pressure block is used to squeeze the first rubber block, a magnetic metal block is fixedly connected to the side of the moving block, and an electromagnet is arranged on the side of the magnetic metal block, and the electromagnet is fixed on the flip material dial.

[0020] By adopting the above technical solution, the auxiliary spring can provide the moving block with a restoring elastic force, so that it can provide an outward thrust to the silicon wafer after the flipping and digging disc is flipped.

[0021] Preferably, the outer wall of the moving block and the inner wall of the guide groove fit each other, and the moving block forms an elastic telescopic structure through the auxiliary spring and the guide groove.

[0022] By adopting the above technical solution, the outer wall of the moving block and the inner wall of the guide groove fit together, so that the stability of the moving block when moving in the guide groove can be ensured.

[0023] Preferably, the first rubber block and the pressure stopper are located on the same straight line, and the interiors of the first rubber block and the second rubber block are both configured as hollow structures, and the airflow inside the first rubber block and the second rubber block communicate with each other through a connecting pipe.

[0024] By adopting the above technical solution, when the moving block drives the first rubber block to move, the first rubber block can be squeezed by the pressure block, so that the airflow inside the first rubber block enters the second rubber block through the connecting pipe.

[0025] Preferably, the longitudinal section of the magnetic metal block is set to a rectangular structure, and the magnetic metal block and the electromagnet on the flip material disc are located on the same straight line, and the electromagnet can generate magnetic attraction on the magnetic metal block after being energized.

[0026] By adopting the above technical solution, when the electromagnet is energized, the magnetic attraction force generated on the magnetically attracted metal block can be utilized to move the movable block toward the opening direction of the guide groove.

[0027] Compared with the prior art, the beneficial effects of the present invention are as follows: the silicon wafer flip module, by opening a groove in the middle of the rotating shaft, realizes that whether the flip function is used or not, it does not affect the transmission of the silicon wafer, improves production efficiency, increases the inclusiveness of the equipment, and saves costs. At the same time, when the silicon wafer is flipped and transmitted to a high place, the silicon wafer can be automatically limited, and when the silicon wafer does not need to be transmitted, the automatic cleaning of the trough body is realized;

[0028] 1. A connecting groove is provided. Through the capacitive sensor on the second support frame, it is possible to detect whether the silicon wafer is in place. At the same time, after the central shaft drives the flip material disc to rotate, the silicon wafer can be conveyed through the rotation of the guide groove, so that the silicon wafer can be automatically turned over. The turned silicon wafer is conveyed through the conveyor on the right side of the central shaft. At the same time, a connecting groove is opened in the middle of the central shaft. When the flip material disc does not rotate, after the left conveyor conveys the silicon wafer, the silicon wafer can be conveyed to the conveyor on the right side of the central shaft through the connecting groove, thereby achieving whether the flip function is used or not, it does not affect the transmission of the silicon wafer, improves production efficiency, and increases the tolerance of the equipment;

[0029] 2. A moving block is provided. When the silicon wafer enters the guide groove on the flip material disc and the flip material disc rotates upward, the gravity of the silicon wafer can press the moving block to move downward. After the moving block moves downward, the first rubber block can contact the pressure block. At this time, the pressure block squeezes the first rubber block, so that the airflow inside the first rubber block enters the second rubber block through the connecting pipe. As the second rubber block expands after being inflated, the silicon wafer can be pressed tightly to ensure the stability of the silicon wafer when it rotates upward to a high place.

[0030] 3. An electromagnet is provided. When the flipping disc rotates to the bottom of the conveyor and the silicon wafer does not need to be flipped, the electromagnet is energized. After being energized, the electromagnet can generate magnetic attraction to the magnetic metal block. At this time, the magnetic metal block drives the moving block to move toward the opening direction of the guide groove on the flipping disc. Because the outer wall of the moving block and the inner wall of the guide groove fit each other, the dust and impurities attached to the inner wall of the guide groove can be scraped off after the moving block moves, thereby realizing the self-cleaning of the guide groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a schematic diagram of the front three-dimensional structure of the present invention;

[0032] Figure 2 This is a schematic diagram of the central rotating shaft and the connecting groove structure of the present invention;

[0033] Figure 3 This is a schematic diagram of the central rotating shaft and origin detection sheet metal structure of the present invention;

[0034] Figure 4 It is a schematic diagram of the structure of the second support frame and the conveyor belt of the present invention;

[0035] Figure 5 For the present invention Figure 4 The enlarged structural diagram at A in the middle;

[0036] Figure 6 This is a schematic diagram of the structure of the central rotating shaft and the turning and feeding disc of the present invention;

[0037] Figure 7 This is a schematic diagram of the structure of the flip material dial and the electromagnet of the present invention;

[0038] Figure 8 For the present invention Figure 6 The enlarged structural diagram at B in the middle;

[0039] Fig. 9 It is a schematic diagram of the structure of the first rubber block and the second rubber block of the present invention.

[0040] In the figure: 1. first support frame; 2. servo motor; 3. reducer; 4. central shaft; 5. conveyor; 501. second support frame; 502. transmission belt; 503. guide roller; 504. drive motor; 6. capacitive sensor; 7. connecting groove; 8. flip material plate; 9. guide groove; 10. origin detection sheet metal; 11. limit self-cleaning component; 111. moving block; 112. auxiliary spring; 113. first rubber block; 114. second rubber block; 115. connecting pipe; 116. pressure stop block; 117. magnetic metal block; 118. electromagnet. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] Example 1: Please refer to Figure 1-Figure 9 When the existing flip module flips the silicon wafer, it flips the silicon wafer by rotating the turntable. However, when the turntable does not rotate, the flip module cannot transfer the silicon wafer, thereby reducing the production efficiency and the applicability of the module. In order to solve this technical problem, the present embodiment discloses the following technical contents, including a first support frame 1, a servo motor 2 is installed on the middle side of the first support frame 1, and a reducer 3 is installed on the output end of the servo motor 2, the output end of the reducer 3 is fixedly connected to the central rotating shaft 4, and conveyors 5 are installed on both sides of the central rotating shaft 4; a capacitive sensor 6 is installed on the conveyor 5, and the capacitive sensor 6 is used to detect whether the silicon wafer is in place, A connecting groove 7 is provided in the middle of the central rotating shaft 4, and a flip material dial 8 is installed on the connecting groove 7. A guide groove 9 for conveying silicon wafers is provided on the flip material dial 8. An origin detection sheet metal 10 is fixedly connected to the end of the central rotating shaft 4 away from the servo motor 2. The conveyor 5 includes a second support frame 501, a conveyor belt 502, a guide roller 503 and a drive motor 504; a plurality of guide rollers 503 are installed on the second support frame 501, and a conveyor belt 502 is sleeved on the outer side of the plurality of guide rollers 503, and the guide rollers 503 located below the second support frame 501 are fixed on the output end of the drive motor 504, and a capacitive sensor 6 is fixedly connected to the second support frame 501. The connecting groove 7 is located in the middle of the central rotating shaft 4, and the connecting groove 7 is set through the central rotating shaft 4. The connecting groove 7 is used to guide the silicon wafers transmitted on the conveyor 5 on the left and right sides of the central rotating shaft 4. The longitudinal section of the flip material dial 8 is designed in a semicircular style, and the flip material dial 8 is symmetrically arranged about the transverse central axis of the central rotating shaft 4, and multiple guide grooves 9 are evenly distributed at equal angles on the flip material dial 8. The two flip material dials 8 on the central rotating shaft 4 are combined to form a circle, and the two flip material dials 8 are divided into 18 equal parts by multiple guide grooves 9 at equal angles, and the angle between adjacent guide grooves 9 is 20°, and the flip material dial 8 is set to POM material.

[0043] When it is necessary to flip and convey the silicon wafer, the two conveyors 5 are placed side by side, and the silicon wafer at the previous workstation is transferred to the conveyor 5 on the left side of the central rotating shaft 4. The capacitance sensor 6 on the second support frame 501 detects the presence of the silicon wafer and gives a signal that the silicon wafer is in place. At this time, the silicon wafer enters the guide groove 9 on the flipping material disc 8. After receiving the signal that the silicon wafer is in place, the servo motor 2 starts to drive the central rotating shaft 4 to rotate, and drives the flipping material disc 8 to start flipping through the central rotating shaft 4. After the flipping material disc 8 rotates 20°, the next silicon wafer on the conveyor 5 starts to flip, so as to flip the silicon wafer and place it on the conveyor 5 on the right side of the central rotating shaft 4. Since a connecting groove 7 is provided in the middle of the central rotating shaft 4, the silicon wafer cannot be flipped when the flipping material disc 8 is at the origin. The other end of the flipping material disc 8 is installed It is equipped with a slot-type photoelectric device to detect whether the flip material dial 8 is at the origin position. The slot-type photoelectric device detects the designated origin detection sheet metal 10 and gives a signal to let the flip material dial 8 rotate at twice the speed without affecting the feeding speed of the feeding transmission line, thereby skipping the origin position of the connecting groove 7 on the flip material dial 8, avoiding the risk of silicon wafer falling when the silicon wafer starts to be flipped at the origin position of the connecting groove 7, and causing production accidents. At the same time, a connecting groove 7 is opened in the middle of the central rotating shaft 4, and the flip material dial 8 is semicircular in design, which can form an unobstructed channel in the horizontal direction of silicon wafer transmission, so that the equipment can complete the transmission of silicon wafers when the flip function is not needed, so that the silicon wafers can continue to flow to the next device, increasing the inclusiveness of the equipment, saving costs, realizing one structure and two functions, and making the equipment more efficient.

[0044] Embodiment 2: The technical content disclosed in this embodiment is a further improvement on the above embodiment 1. When the silicon wafer is flipped, it is not convenient to automatically limit the silicon wafer, which causes the silicon wafer to fall due to shaking when flipping, and the turntable rotates after the silicon wafer is transported, which makes it difficult to achieve self-cleaning of the silicon wafer receiving groove. After the dust and impurities on the receiving groove adhere to the surface of the silicon wafer, it is easy to affect the subsequent etching or printing operations on the silicon wafer surface. In order to further solve this technical problem, this embodiment discloses the following technical content, such as Figure 1-Figure 9As shown, a limited self-cleaning component 11 is installed in the guide groove 9 on the flip material dial 8, and the limited self-cleaning component 11 is used to limit the conveyed silicon wafer and to clean the guide groove 9 when the silicon wafer does not need to be flipped. The limited self-cleaning component 11 includes a moving block 111, an auxiliary spring 112, a first rubber block 113, a second rubber block 114, a connecting pipe 115, a pressure stopper 116, a magnetic metal block 117 and an electromagnet 118; the moving block 111 is located inside the guide groove 9 on the flip material dial 8, and the moving block 111 is connected to the inside of the guide groove 9 on the flip material dial 8 through the auxiliary spring 112, and the moving block 111 is installed with the first rubber block 113 and the second rubber block 114, and the first rubber block 113 and the second rubber block 114 are connected to the guide groove 9 on the flip material dial 8 through the auxiliary spring 112. The second rubber block 114 is located on the side of the moving block 111 away from the auxiliary spring 112. The first rubber block 113 and the second rubber block 114 are connected to each other through a connecting pipe 115. A pressure block 116 is fixedly connected to the side of the guide groove 9. The pressure block 116 is used to squeeze the first rubber block 113. A magnetic metal block 117 is fixedly connected to the side of the moving block 111, and an electromagnet 118 is arranged on the side of the magnetic metal block 117. The electromagnet 118 is fixed on the flipping material disc 8. The outer wall of the moving block 111 and the inner wall of the guide groove 9 fit each other, and the moving block 111 forms an elastic telescopic structure through the auxiliary spring 112 and the guide groove 9. The first rubber block 113 and the pressure block 116 are located on the same straight line, and the interiors of the first rubber block 113 and the second rubber block 114 are both set as hollow structures, and the airflow inside the first rubber block 113 and the second rubber block 114 communicates with each other through the connecting pipe 115. The longitudinal section of the magnetic metal block 117 is set to a rectangular structure, and the magnetic metal block 117 and the electromagnet 118 on the flip material plate 8 are located on the same straight line. The electromagnet 118 can generate a magnetic attraction force on the magnetic metal block 117 after being energized.

[0045] When the silicon wafer enters the guide groove 9 on the flip material dial 8, when the flip material dial 8 rotates upward, the silicon wafer will apply pressure to the moving block 111. At this time, the moving block 111 moves in the guide groove 9. After the moving block 111 moves, the first rubber block 113 on it contacts and squeezes with the pressure stopper 116 inside the guide groove 9. The airflow inside the first rubber block 113 enters the inside of the second rubber block 114 through the connecting pipe 115. The expansion of the second rubber block 114 after inflation can compress the silicon wafer between the second rubber block 114 and the guide groove 9, so as to ensure the stability of the silicon wafer that is turned upward. At the same time, when the guide groove 9 on the flip material dial 8 gradually rotates to a horizontal state, the silicon wafer stops when it is placed on the discharge conveyor 5. The stop block 111 is pressed, and the moving block 111 is reset under the action of the auxiliary spring 112. After the moving block 111 is reset, it provides an outward thrust for the silicon wafer, so that the flipped silicon wafer can be better flowed away by the unloading conveyor 5. Then, when the flipping material disc 8 is rotated to the bottom of the conveyor 5, the electromagnet 118 on the flipping material disc 8 is energized. After the electromagnet 118 is energized, a magnetic attraction force is generated on the magnetic metal block 117 on the moving block 111. At this time, under the influence of the magnetic attraction force, the moving block 111 and the magnetic metal block 117 can move toward the opening direction of the guide groove 9. Because the outer wall of the moving block 111 and the inner wall of the guide groove 9 are in contact with each other, after the moving block 111 moves toward the opening direction of the guide groove 9, the dust and impurities attached to the inner wall of the guide groove 9 can be scraped off.

[0046] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0047] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A silicon wafer flip module, comprising a first support frame (1), a servo motor (2) being mounted on a central side of the first support frame (1), a reducer (3) being mounted on an output end of the servo motor (2), a central rotating shaft (4) being fixedly connected to the output end of the reducer (3), and conveyors (5) being mounted on both left and right sides of the central rotating shaft (4); It is characterized in that Also includes: The conveyor (5) is provided with a capacitive sensor (6) for detecting whether the silicon wafer is in place; a connecting groove (7) is provided in the middle of the central rotating shaft (4); a flip material dial (8) is provided on the central rotating shaft (4); a guide groove (9) for conveying the silicon wafer is provided on the flip material dial (8); an origin detection sheet metal (10) is fixedly connected to one end of the central rotating shaft (4) away from the servo motor (2); a limit self-cleaning component (11) is provided in the guide groove (9) on the flip material dial (8); and the limit self-cleaning component (11) is used to limit the conveyed silicon wafer and to clean the guide groove (9) when flipping the silicon wafer is not required; The connecting groove (7) is located in the middle of the central rotating shaft (4), and the connecting groove (7) is arranged to penetrate the central rotating shaft (4), and the connecting groove (7) is used to guide the silicon wafers transported on the conveyors (5) on the left and right sides of the central rotating shaft (4); The longitudinal section of the flip material dial (8) is of semicircular design, and the flip material dial (8) is symmetrically arranged about the transverse center axis of the central rotating shaft (4), and a plurality of guide grooves (9) are evenly distributed at equal angles on the flip material dial (8).

2. A silicon wafer flip module according to claim 1, characterized in that: The conveyor (5) comprises a second support frame (501), a conveyor belt (502), a guide roller (503) and a drive motor (504); A plurality of guide rollers (503) are mounted on the second support frame (501), and a conveyor belt (502) is sleeved on the outer sides of the plurality of guide rollers (503). The guide rollers (503) located below the second support frame (501) are fixed to the output end of the drive motor (504), and a capacitive sensor (6) is fixedly connected to the second support frame (501).

3. The silicon wafer flip module according to claim 1, characterized in that: The two flip material turning discs (8) on the central rotating shaft (4) are combined to form a circle, and the two flip material turning discs (8) are divided into 18 equal parts at equal angles by a plurality of guide grooves (9), and the angle between adjacent guide grooves (9) is 20°. The flip material turning discs (8) are made of POM material.

4. The silicon wafer flip module according to claim 1, characterized in that: The position-limiting self-cleaning component (11) comprises a moving block (111), an auxiliary spring (112), a first rubber block (113), a second rubber block (114), a connecting pipe (115), a pressure stopper (116), a magnetic metal block (117) and an electromagnet (118); The moving block (111) is located inside the guide groove (9) on the flip material disc (8), and the moving block (111) is connected to the inside of the guide groove (9) on the flip material disc (8) via an auxiliary spring (112). A first rubber block (113) and a second rubber block (114) are mounted on the moving block (111), and the second rubber block (114) is located on a side of the moving block (111) away from the auxiliary spring (112). The first rubber block (113) ) and the second rubber block (114) are connected to each other via a connecting pipe (115); a pressure block (116) is fixedly connected to the side of the guide groove (9); the pressure block (116) is used to squeeze the first rubber block (113); a magnetic metal block (117) is fixedly connected to the side of the moving block (111); and an electromagnet (118) is provided on the side of the magnetic metal block (117); the electromagnet (118) is fixed on the flipping material disc (8).

5. A silicon wafer flip module according to claim 4, characterized in that: The outer wall of the moving block (111) and the inner wall of the guide groove (9) fit together, and the moving block (111) forms an elastic telescopic structure through the auxiliary spring (112) and the guide groove (9).

6. The silicon wafer flip module according to claim 4, characterized in that: The first rubber block (113) and the pressure stopper (116) are located on the same straight line, and the interiors of the first rubber block (113) and the second rubber block (114) are both configured as hollow structures, and the airflow inside the first rubber block (113) and the second rubber block (114) communicate with each other through the connecting pipe (115).

7. The silicon wafer flip module according to claim 4, characterized in that: The longitudinal section of the magnetic metal block (117) is arranged to be a rectangular structure, and the magnetic metal block (117) and the electromagnet (118) on the flip material-dispensing plate (8) are located on the same straight line, and the electromagnet (118) can generate a magnetic attraction force on the magnetic metal block (117) after being energized.

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