LED device with built-in driving chip and preparation method thereof

Abstract

The invention relates to an LED device with a built-in driving chip, a preparation method of the LED device and an LED display module, and the LED device with the built-in driving chip comprises a first substrate (11) and a second substrate (12) which are stacked in the thickness direction, a light-emitting unit (20) arranged on the second substrate (12), and the driving chip (30) arranged on the first substrate (11). The driving chip (30) is electrically connected with the light-emitting unit (20) so as to control the brightness of the light-emitting unit (20); the second substrate (12) is provided with a containing opening (120) penetrating through the second substrate (12), the containing opening (120) and the first substrate (11) form a containing cavity of an open structure, and the driving chip (30) is contained in the containing cavity. According to the LED device with the built-in driving chip, the light emitting efficiency of the light emitting unit can be improved, and then the performance of the LED device is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of LED devices, and in particular to an LED device with a built-in driver chip and a preparation method thereof. Background Art

[0002] Full-color LED devices with built-in driver chips (i.e. IC chips) are now widely used in various LED display products, such as advertising transparent screens, ultra-thin all-in-one computers, and other built-in driver display products, due to their good display effects, low power consumption, and light weight.

[0003] Existing full-color LED devices with built-in IC are packaged with a bracket structure, the driver chip and LED light-emitting chip are fixed on the same bracket, and the positive and negative poles, input and output ends of the driver chip and the light-emitting chip are electrically connected through the wire bonding process. This process requires wire bonding, which increases the risk of defects and process time, and increases production costs. The introduction of the flip-chip process has reduced the process cost of the full-color LED device packaging with built-in driver chips. The tin brushing process is used in combination with the PCB circuit board. The driver chip and the LED light-emitting chip are melted by tin through mounting and bonding, and the wire bonding process is eliminated, effectively reducing material loss.

[0004] However, whether it is the wire bonding process or the flip-chip process, since the volume of the existing driver chip is relatively larger than the commonly used LED light-emitting chip, the height of the driver chip is often higher than the light-emitting surface of the LED light-emitting chip (the height difference between the two often reaches 100-150μm), so after packaging, the light of the LED light-emitting chip will be blocked, affecting its light-emitting efficiency and thus affecting the performance of the LED device. Summary of the invention

[0005] Based on this, the purpose of the present invention is to overcome the defects or shortcomings of the prior art. On the one hand, an LED device with a built-in driver chip is provided to improve the luminous efficiency of the light-emitting unit, thereby improving the performance of the LED device.

[0006] An LED device with a built-in driver chip comprises a first substrate and a second substrate stacked in a thickness direction, a light-emitting unit arranged on the second substrate, and a driver chip arranged on the first substrate; the driver chip is electrically connected to the light-emitting unit to control the brightness of the light-emitting unit; the second substrate is provided with a receiving opening penetrating the second substrate, the receiving opening and the first substrate form a receiving cavity with an open structure, and the driver chip is accommodated in the receiving cavity.

[0007] Compared with the prior art, the LED device with a built-in driver chip of the present invention lowers the setting height of the driver chip by respectively setting the driver chip and the light-emitting unit on a first substrate and a second substrate with a height difference, so as to reduce the larger driver chip from blocking the light emitted from the light-emitting surface of the light-emitting unit, thereby improving the luminous efficiency of the light-emitting unit and further improving the performance of the LED device.

[0008] In one embodiment, the highest point of the driving chip is located at a position not higher than the lowest point of the light emitting surface of the light emitting unit.

[0009] In one embodiment, a driving pad assembly is provided on the top of the first substrate, and the driving chip is electrically connected to the driving pad assembly; a light-emitting pad assembly is provided on the top of the second substrate, the light-emitting unit is electrically connected to the light-emitting pad assembly, and the light-emitting pad assembly is electrically connected to the driving pad assembly.

[0010] In one embodiment, a connection structure is provided between the first substrate and the second substrate, the connection structure partially penetrates the second substrate, and the driving pad assembly is electrically connected to the light emitting pad assembly through the connection structure.

[0011] In one embodiment, the driving chip has a power supply end, a grounding end and a driving end; the driving pad assembly includes a power supply pad electrically connected to the power supply end, a grounding pad electrically connected to the grounding end, and a driving pad electrically connected to the driving end, and the power supply pad, the grounding pad and the driving pad do not contact each other; the light-emitting unit has an A pole and a B pole with opposite polarities; the light-emitting pad assembly includes an A pole pad electrically connected to the A pole of the light-emitting unit, and a B pole pad electrically connected to the B pole of the light-emitting unit, and the A pole pad and the B pole pad do not contact each other; the driving pad is electrically connected to the A pole pad through the connecting structure; the grounding pad is electrically connected to the B pole pad through the connecting structure.

[0012] In one embodiment, the driving chip has three driving ends; the driving pad assembly includes three driving pads corresponding to the driving ends one by one; the number of the light-emitting units is three, and the second substrate is provided with a light-emitting pad assembly corresponding to the light-emitting units one by one, and the A pole of each light-emitting unit is electrically connected to the A pole pad in a group of light-emitting pad assemblies, and the B pole is electrically connected to the B pole pad in the same group of light-emitting pad assemblies; each driving pad is electrically connected to one of the A pole pads through the connecting structure, and each of the B pole pads is electrically connected to the ground pad through the connecting structure.

[0013] In one embodiment, the driver chip also has a signal input terminal and a signal output terminal; the driver pad assembly includes a signal input pad electrically connected to the signal input terminal of the driver chip, and a signal input pad electrically connected to the signal output terminal of the driver chip.

[0014] In one embodiment, the connection structure includes a conductive component, which includes a conductive part corresponding to the A-pole pad one by one, and the conductive part penetrates the second substrate along the thickness direction. Each driving pad is electrically connected to an A-pole pad through one of the conductive parts.

[0015] In one embodiment, the connection structure also includes a connection component connected to the conductive component, and the connection component is arranged at a position outside the accommodating opening of the second substrate. The connection component and the driving pad component are mirror-symmetrical, so that when the second substrate is superimposed on the first substrate, the connection component overlaps with the driving pad component.

[0016] On the other hand, the present invention also provides a method for preparing an LED device with a built-in driver chip, comprising the following steps:

[0017] Forming a driving pad assembly on the top of the first substrate, and opening a receiving opening on the second substrate that penetrates the second substrate;

[0018] forming a connection structure at the bottom of the second substrate;

[0019] Covering the second substrate on the top of the first substrate, so that the connection structure contacts and corresponds to the driving pad assembly;

[0020] forming a light emitting pad assembly on the top of the second substrate;

[0021] A driving chip is mounted on the driving pad assembly located at the bottom of the accommodating opening, and a light-emitting unit is mounted on the light-emitting pad assembly.

[0022] For better understanding and implementation, the present invention is described in detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a cross-sectional view of an exemplary LED device with a built-in driver chip according to the present invention;

[0024] Figure 2 This is a front plan view of a first substrate in an exemplary LED device with a built-in driver chip according to the present invention;

[0025] Figure 3 This is a front plan view of a second substrate in an exemplary LED device with a built-in driver chip according to the present invention;

[0026] Figure 4 A back top view of a second substrate in an exemplary LED device with a built-in driver chip according to the present invention;

[0027] Figure 5 This is a front plan view of an exemplary LED device with a built-in driver chip according to the present invention;

[0028] Figure 6 This is a front plan view of an exemplary LED device with a built-in driver chip of the present invention without the driver chip and the light-emitting unit installed;

[0029] Figure 7 This is a front plan view of an exemplary LED device with a built-in driver chip according to the present invention, in which a driver chip and a light-emitting unit are installed;

[0030] Figure 8 A cross-sectional view (not cut) of a first substrate in an exemplary LED device with a built-in driver chip according to the present invention;

[0031] Fig. 9 A cross-sectional view (not cut) of a first substrate and a second substrate after being overlapped in an exemplary LED device with a built-in driver chip of the present invention;

[0032] Fig.10 This is a cross-sectional view (not cut) of an exemplary LED device with a built-in driver chip of the present invention after the first substrate and the second substrate are overlapped and a through hole is formed.

[0033] Reference numerals:

[0034] 11. first substrate; 110. driving pad assembly; 1100. power supply pad; 1102. ground pad; 1104. driving pad; 1104a. first driving pad; 1104b. second driving pad; 1104c. third driving pad; 1106. signal input pad; 1108. signal output pad;

[0035] 12, second substrate; 120, receiving opening; 122, light-emitting pad assembly; 122a, A-pole pad; 122b, B-pole pad; 124, connection structure; 1240, connection assembly; 1242, conductive assembly;

[0036] 20. Light-emitting unit;

[0037] 30. Driver chip;

[0038] 40. Through hole;

[0039] 50. Pin assembly. DETAILED DESCRIPTION

[0040] Existing LED devices with built-in driver chips usually have the driver chip and the LED device bonded to the same side of the substrate. However, since the existing driver chip is relatively large, while the light-emitting unit is relatively small and thin, the driver chip is often higher than the light-emitting surface of the light-emitting unit, resulting in the driver chip blocking the light emitted by the light-emitting unit after packaging, affecting the light-emitting efficiency of the light-emitting unit. To solve this problem, the present invention reduces the height of the driver chip to avoid the driver chip blocking the light emitted by the light-emitting unit, thereby improving the light-emitting efficiency of the light-emitting unit.

[0041] Based on the above technical concept, the present invention provides an open accommodation cavity on a substrate structure formed by stacking two layers of substrates, and then accommodates the driver chip in the accommodation cavity to reduce the height of the driver chip so that the driver chip does not block the light-emitting unit. Furthermore, the driver chip is electrically connected to the light-emitting unit through wiring on the two layers of substrates.

[0042] The scheme of the present invention is described in detail below with reference to the accompanying drawings.

[0043] Figure 1-7 FIG. 2 shows a specific structure of an exemplary LED device with a built-in driver chip according to the present invention. Figure 1 As shown, it includes a first substrate 11 and a second substrate 12 stacked in sequence from bottom to top along the thickness direction, a light-emitting unit 20 arranged on the second substrate 12, and a driving chip 30 arranged on the first substrate 11, wherein the driving chip 30 is electrically connected to the light-emitting unit 20 to control the brightness of the light-emitting unit 20. The light-emitting unit 20 may be an LED light-emitting chip or an LED lamp bead, and the specific structure of the LED device of this embodiment is specifically described below by taking the LED light-emitting chip as an example.

[0044] Specifically, the first substrate 11 and the second substrate 12 are in the shape of a square or rectangle of the same shape, and the second substrate 12 is provided with a receiving opening 120 that penetrates the second substrate 12 in the thickness direction, and the receiving opening 120 is in the shape of a rectangle or square. The receiving opening 120 and the first substrate 11 located therebelow are enclosed to form an open receiving cavity, and the driving chip 30 is received in the receiving cavity. A driving pad assembly 110 is arranged on the top of the first substrate 11, and the driving pad assembly 110 includes a power supply pad 1100, a grounding pad 1102, and three driving pads 1104, wherein the power supply pad 1100, the grounding pad 1102, and the driving pad 1104 are all exposed at the bottom of the receiving cavity. The three driving pads 1104 are respectively a first driving pad 1104a, a second driving pad 1104b, and a third driving pad 1104c. The driving chip 30 has a power supply terminal, a ground terminal and three driving terminals. When the driving chip 30 is solid-state on the driving pad assembly 110 in the accommodating cavity, the power supply terminal of the driving chip 30 is in contact with and connected to the power supply pad 1100, the ground terminal is in contact with and connected to the ground pad 1102, and the three driving terminals are respectively in contact with and connected to the first driving pad 1104a, the second driving pad 1104b and the third driving pad 1104c. The top of the second substrate 12 is provided with three groups of light-emitting pad assemblies 122 corresponding to the driving pads 1104 one by one, and each group of light-emitting pad assemblies 122 includes an A-pole pad 122a and a B-pole pad 122b. The three groups of light-emitting pad assemblies 122 are respectively used to solid-state three light-emitting chips. The light-emitting chip has an A pole and a B pole with opposite polarities. When the light-emitting chip is die-bonded to the second substrate 12, the A pole and the B pole of each light-emitting chip are electrically connected to the A pole pad 122a and the B pole pad 122b of a group of light-emitting pad components 122, respectively. The three light-emitting chips are a red light-emitting chip, a green light-emitting chip, and a blue light-emitting chip. Here, the light-emitting chip can be at least one of a top-mounted chip, a flip chip, and a vertical structure chip, but preferably a flip chip. The flip chip can be directly mounted on the pad to achieve electrical connection without forming a wire bond, so that the packaged LED device is more reliable and the outer surface of the device is more regular and beautiful.

[0045] In this way, by forming a receiving cavity by stacking two layers of substrates in the thickness direction and accommodating the driver chip 30 in the receiving cavity, the overall height of the driver chip 30 can be reduced, and the shielding of the driver chip 30 on the light emitted by the light-emitting chip can be reduced, thereby improving the luminous efficiency of the light-emitting chip, and further improving the performance of the LED device. Preferably, the height of the highest point of the driver chip 30 is not higher than the height of the lowest point of the light-emitting surface of the light-emitting chip, so that the larger driver chip 30 can be more effectively prevented from shielding the light emitted by the light-emitting surface of the light-emitting chip.

[0046] Furthermore, in order to realize the electrical connection between the driving chip 30 and the light-emitting chip located on different substrates, a connecting structure 124 is also provided between the first substrate 11 and the second substrate 12. The connecting structure 124 is composed of a connecting component 1240 and a conductive component 1242 connected to the connecting component 1240. The connecting component 1240 is arranged at a position outside the accommodating opening 120 at the bottom of the second substrate 12. The connecting component 1240 arranged at the bottom of the second substrate 12 is mirror-symmetrical to the driving pad component 110 arranged at the top of the first substrate 11. In other words, the connecting component 1240 includes a plurality of connecting members that correspond to each pad in the driving pad component 110 one by one and do not contact each other. In this way, when the second substrate 12 is superimposed on the first substrate 11, the connecting component 1240 overlaps with the driving pad component 110, and each connecting member contacts the corresponding pad in the driving pad component 110 to realize electrical connection. The conductive component 1242 includes a plurality of conductive members corresponding to the connecting members, and the conductive members are specifically conductive through holes that penetrate the second substrate 12 along the thickness direction. Figure 1-7 In the illustrated embodiment, the conductive component 1242 includes six conductive members, and each two conductive members correspond to a group of light-emitting pad components 122, one of the two conductive members is electrically connected to an A-pole pad 122a, and the other is electrically connected to a B-pole pad 122b. In this way, the three driving pads 1104 arranged on the first substrate 11 are electrically connected to the three A-pole pads arranged on the second substrate 12 through the connecting structure 124, and the grounding pad 1102 arranged on the first substrate 11 is also electrically connected to the B-pole pad through the connecting structure 124. The three driving ends 304 of the driving chip 30 are electrically connected to the three light-emitting units 20 through the driving pad component 110, the connecting structure 124 and the light-emitting pad component 122, respectively, and the brightness of the light-emitting unit 20 can be controlled by whether the three light-emitting units 20 are powered or not.

[0047] In this way, by setting a connecting structure 124 between the first substrate 11 and the second substrate 12, not only the driving chip 30 and the light-emitting unit 20 located on different substrates are electrically connected, but most of the wiring of the LED device is hidden between the first substrate 11 and the second substrate 12, so that the packaged LED device is more reliable and the appearance of the device is more beautiful.

[0048] Of course, as an optional method, the connection structure 124 may not include the connection component 1240, as long as it is ensured that each conductive member in the conductive component 1242 can be electrically connected to the corresponding pad in the driving pad component 110 after the first substrate 11 and the second substrate 12 are superimposed.

[0049] In order to connect the LED device with built-in driver chip to the external circuit, a pin assembly 50 is provided at the bottom of the first substrate 11 of the LED device with built-in driver chip. The pin assembly 50 includes a power supply pin (not shown) and a ground pin (not shown), and the power supply pin (not shown) and the ground pin (not shown) are distributed at the corners of the first substrate 11. Through holes 40 are provided at the positions corresponding to the power supply pin (not shown) and the ground pin (not shown) of the first substrate 11, and the through holes 40 are filled with conductive materials. The power supply pad 1100 and the ground pad 1102 on the top of the first substrate 11 are electrically connected to the corresponding power supply pin (not shown) and the ground pin (not shown) through a through hole 40, respectively, so that the LED device with built-in driver chip can be powered by the external circuit.

[0050] In one embodiment, in order to install the LED devices with multiple built-in driver chips on a circuit board to assemble and form an LED display module or LED display panel, and to control the LED devices with each built-in driver chip to be controlled by the same control signal to adjust the brightness of the corresponding light-emitting unit 20, the driver chip 30 also has a signal input terminal and a signal output terminal, and the driver pad assembly 110 also includes a signal input pad 1106 electrically connected to the signal input terminal of the driver chip 30, and a signal output pad 1108 electrically connected to the driver chip 30. The signal input pad 1106 and the signal output pad 1108 are also located at the bottom of the accommodating cavity. Corresponding to the signal input pad 1106 and the signal output pad 1108, a signal input pin (not shown) and a signal output pin (not shown) are also provided at the corner position of the bottom of the first substrate 11. The positions of the corresponding signal input pins (not shown) and signal output pins (not shown) of the first substrate 11 are also provided with through holes 40 filled with conductive materials, and the signal input pads 1106 and the signal output pads 1108 are electrically connected to the signal input pins (not shown) and the signal output pins (not shown) through a through hole 40, respectively. In this way, a plurality of LED devices with built-in driver chips can be installed on the circuit board through the pin assembly to form an LED display module. The LED devices in the LED display module control the brightness of the corresponding three light-emitting units 20 according to the control signal received by the signal input terminal, and at the same time output the control signal to the LED devices connected in series or in parallel with it through the signal output terminal to adjust the display effect of the LED display module.

[0051] In addition, the present invention also provides a method for preparing the LED device with the built-in driver chip, such as Figure 8-10 As shown, the following steps are included:

[0052] S1: forming a driving pad assembly 110 on the top of the first substrate 11;

[0053] Specifically, Figure 8As shown, a BT resin board with a thickness of 0.1-0.2 mm and a copper layer plated on the top is etched to form a driving pad assembly 110. The driving pad assembly 110 includes a power supply pad 1100, a ground pad 1102, a signal input pad 1106, a signal output pad 1108 and three driving pads 1104 (a first driving pad 1104a, a second driving pad 1104b and a third driving pad 1104c) to form a first substrate 11, wherein the thickness of the copper layer is 10-15 μm.

[0054] Furthermore, a receiving opening 120 is formed on the second substrate 12 and penetrates the second substrate 12 along the thickness direction;

[0055] Specifically, another BT resin board with a thickness of 0.2-0.4 mm and copper-plated top and bottom is used to open an accommodating opening 120, and the size of the accommodating opening 120 is (a+30μm)*(b+30μm), wherein a and b are the length and width of the driving chip 30 respectively. By setting the accommodating opening 120120 with a cross-sectional area larger than the cross-sectional area of ​​the driving chip 30, a certain gap is made between the driving chip 30 in the accommodating cavity and the side wall of the accommodating cavity for solid crystal. In this way, the problem that the driving chip 30 is easily twisted or misaligned during the solid crystal process can be improved, thereby effectively improving the process efficiency and yield of the sample.

[0056] Then, a connecting component 1240 is etched on the copper layer at the bottom of the BT resin board to form a second substrate 12. The connecting component 1240 includes a plurality of connecting parts, and the distribution of each connecting part is mirror-symmetrical with the distribution of each pad in the driving pad assembly 110, so that when the second substrate 12 is superimposed on the top of the first substrate 11, the connecting component 1240 overlaps with the driving pad assembly 110.

[0057] S2: Overlaying the second substrate 12 on the top of the first substrate 11, making the driving pad assembly 110 contact the connecting assembly 1240, and then laminating and bonding the first substrate 11 and the second substrate 12;

[0058] Specifically, the lamination pressure range is 250-5000PSI, and the temperature is controlled at 150-190°C. The driving pad assembly 110 on the top of the first substrate 11 and the connecting assembly 1240 on the bottom of the second substrate 12 are softened and fused by high temperature and high pressure to achieve bonding.

[0059] During lamination, prepreg may be added between the first substrate 11 and the second substrate 12. The prepreg may be glass fiber or polyimide. These materials may be well bonded with the BT resin board. Thus, by adding the prepreg, the bonding force between the first substrate 11 and the second substrate 12 is enhanced, thereby improving the reliability of the device.

[0060] S3: forming a light-emitting pad assembly 122 on the top of the second substrate 12;

[0061] Specifically, three groups of light-emitting pad components 122 are formed by etching the copper layer on the top of the second substrate 12, and each group of pad light-emitting components 122 includes an A-pole pad 122a and a B-pole pad 122b that are not in contact with each other;

[0062] Holes are drilled and filled with conductive material at positions corresponding to each A-pole pad 122a and each B-pole pad 122b of the second substrate 12 to form conductive components 1242, so that each conductive component 1242 is electrically connected to an A-pole pad 122a or a B-pole pad 122b and the connecting component 1240 respectively.

[0063] S4: The driving chip 30 is die-bonded on the driving pad assembly 110 located at the bottom of the accommodating opening 120 , and the light-emitting unit 20 is die-bonded on the light-emitting pad assembly 122 , so as to form an LED device with a built-in driving chip.

[0064] In this way, the height difference between the highest point of the driver chip 30 and the light-emitting surface of the light-emitting unit 20 can be reduced to less than 50 μm. By reducing the height of the driver chip 30, the shielding of the light emitted by the light-emitting unit 20 by the driver chip 30 can be reduced. Among them, it is most preferred to reduce the height of the driver chip 30 to the height of the highest point of the driver chip 30 to not higher than the light-emitting surface of the light-emitting unit 20, which can more effectively avoid the light emitted by the light-emitting surface of the light-emitting unit 20.

[0065] In order to enable the LED device with built-in driver chip to be connected to an external circuit, after forming the driving pad assembly 110 in step S1, a pin assembly 50 is set at the four corners of the bottom of the first substrate 11, and the pin assembly includes a power supply pin (not shown), a ground pin (not shown), a signal input pin (not shown) and a signal output pin (not shown), and then holes are drilled at the positions corresponding to the four pins of the first substrate 11 to form a through hole 40, and a conductive material is filled in the through hole 40, so that the power supply pad 1100, the ground pad 1102, the signal input pad 1106, and the signal output pad 1108 are respectively electrically connected to the power supply pin (not shown), the ground pin (not shown), the signal input pin (not shown) and the signal output pin (not shown) through a through hole. In this way, the LED device with built-in driver chip can be connected to an external circuit to receive power and control signals.

[0066] Alternatively, after forming the light-emitting pad assembly 122 in step S3, holes are drilled at four corners of the second substrate 12 to form through holes 40 penetrating the first substrate 11 and the second substrate 12 and filled with conductive material, and connected to the pin assembly 50 at the bottom 11 of the first substrate through the through holes 40.

[0067] Compared with the prior art, the LED device with built-in driver chip and its preparation method and LED display module of the present invention respectively set the driver chip and the light-emitting unit on the first substrate and the second substrate with height difference to reduce the setting height of the driver chip, so as to reduce the large driver chip from blocking the light emitted from the light-emitting surface of the light-emitting unit, thereby improving the luminous efficiency of the light-emitting unit and further improving the performance of the LED device; further, by setting a conductive connection structure between the first substrate and the second substrate, the electrical connection between the driver chip located on the first substrate and the light-emitting unit located on the second substrate is realized, so that the brightness of the light-emitting unit can be controlled by the driver chip, and at the same time, the wiring on the two substrates is hidden between the two substrates, which can avoid the wiring from being damaged, thereby improving the reliability of the device and making the appearance of the LED device more neat and beautiful. The present invention is ingenious in conception, simple in structure and highly practical.

[0068] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the embodiments of the present application. The singular forms of "a", "said" and "the" used in the embodiments of the present application and the claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that, unless otherwise specified, "multiple" refers to two or more; the terms "first", "second", "third", etc. are only used to distinguish, rather than to describe a specific order or sequence, and cannot be understood as indicating or implying relative importance. The term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items. When the above description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. In the description of the present application, for those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0069] The above-mentioned embodiments only express several implementation methods of the present invention, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. An LED device with a built-in driver chip, characterized in that: It comprises a first substrate (11) and a second substrate (12) stacked in a thickness direction, a light-emitting unit (20) arranged on the second substrate (12), and a driving chip (30) arranged on the first substrate (11); The driving chip (30) is electrically connected to the light-emitting unit (20) to control the brightness of the light-emitting unit (20); The second substrate (12) is provided with a receiving opening (120) penetrating the second substrate (12); the receiving opening (120) and the first substrate (11) form a receiving cavity with an open structure; the driving chip (30) is received in the receiving cavity.

2. The LED device with a built-in driver chip according to claim 1, characterized in that: The position of the highest point of the driving chip (30) is not higher than the position of the lowest point of the light emitting surface of the light emitting unit (20).

3. The LED device with built-in driver chip according to claim 1, characterized in that: A driving pad assembly (110) is provided on the top of the first substrate (11), and the driving chip (30) is electrically connected to the driving pad assembly (110); A light-emitting pad assembly (122) is provided on the top of the second substrate (12); the light-emitting unit (20) is electrically connected to the light-emitting pad assembly (122); and the light-emitting pad assembly (122) is electrically connected to the driving pad assembly (110).

4. The LED device with a built-in driver chip according to claim 1, characterized in that: A connection structure (124) is provided between the first substrate (11) and the second substrate (12); the connection structure (124) partially penetrates the second substrate (12); and the driving pad assembly (110) is electrically connected to the light-emitting pad assembly (122) via the connection structure (124).

5. The LED device with built-in driver chip according to claim 1, characterized in that: The driving chip (30) has a power supply terminal, a ground terminal and a driving terminal; The driving pad assembly (110) comprises a power supply pad (1100) electrically connected to the power supply end, a ground pad (1102) electrically connected to the ground end, and a driving pad (1104) electrically connected to the driving end, wherein the power supply pad (1100), the ground pad (1102) and the driving pad (1104) are not in contact with each other; The light emitting unit (20) has an A pole and a B pole with opposite polarities; The light-emitting pad assembly (122) comprises an A-pole pad (122a) electrically connected to the A-pole of the light-emitting unit (20), and a B-pole pad electrically connected to the B-pole of the light-emitting unit (20), wherein the A-pole pad (122a) and the B-pole pad (122b) are not in contact with each other; The driving pad (1104) is electrically connected to the A-pole pad (122a) via the connection structure (124); and the grounding pad (1102) is electrically connected to the B-pole pad (122b) via the connection structure (124).

6. The LED device with a built-in driver chip according to claim 5, characterized in that: The driving chip (30) has three driving ends; The driving pad assembly (110) comprises three driving pads (1104) corresponding one to one with the driving ends; The number of the light-emitting units (20) is three, the second substrate (12) is provided with light-emitting pad components (122) corresponding to the light-emitting units (20) one by one, the A pole of each light-emitting unit (20) is electrically connected to an A pole pad (122a) in a group of light-emitting pad components, and the B pole is electrically connected to a B pole pad (122b) in the same group of light-emitting pad components (122); Each driving pad (1104) is electrically connected to one of the A-pole pads (122a) via the connection structure (124), and each of the B-pole pads (122b) is electrically connected to the ground pad (1102) via the connection structure (124).

7. The LED device with a built-in driver chip according to claim 5, characterized in that: The driving chip (30) also has a signal input terminal and a signal output terminal; The driving pad assembly (110) comprises a signal input pad (1106) electrically connected to a signal input end of the driving chip (30), and a signal output pad (1108) electrically connected to a signal output end of the driving chip (30).

8. The LED device with a built-in driver chip according to claim 5, characterized in that: The connection structure includes a conductive component (1242), the conductive component (1242) includes conductive parts corresponding to the A-pole pads (122a) one by one, the conductive parts penetrate the second substrate (12) along the thickness direction, and each driving pad (1104) is electrically connected to one of the A-pole pads (122a) through one of the conductive parts.

9. The LED device with a built-in driver chip according to claim 8, characterized in that: The connection structure (124) also includes a connection component (1240) connected to the conductive component (1242), and the connection component (1240) is arranged at a position of the second substrate (12) outside the accommodating opening (120). The connection component (1240) and the driving pad component (110) are mirror-symmetrical, so that when the second substrate (12) is superimposed on the first substrate (11), the connection component (1240) and the driving pad component (110) overlap.

10. A method for preparing an LED device with a built-in driver chip, characterized in that: The following steps are involved: A driving pad assembly (110) is formed on the top of the first substrate (11), and a receiving opening (120) is opened on the second substrate (12) and penetrates the second substrate (12); forming a connection structure (124) at the bottom of the second substrate (12); Covering the second substrate (12) on the top of the first substrate (11) so that the connection structure (124) and the driving pad assembly (110) are in corresponding contact; forming a light-emitting pad assembly (122) on the top of the second substrate (12); A driving chip (30) is mounted on the driving pad assembly (110) located at the bottom of the accommodating opening (120), and a light-emitting unit (20) is mounted on the light-emitting pad assembly (122).

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