Optical module test board and test method

Abstract

The invention discloses an optical module test board and a test method. The test board comprises a test board body, and the test board body is provided with a power supply unit, a light source unit, a test unit and a control unit. The test method comprises the following steps: S1, performing state detection on the light source module and the test module by using the control unit; s2, the control unit executes a code sending instruction on the light source module, sends HTX end code patterns and LTX end code patterns, and tests the transmitting performance and the receiving performance of the test module at the same time; s3, converting the received electric signal into an optical signal by a digital processing chip in the test module, performing signal detection by external test equipment, and reading and recording a test result of the external test equipment by a control unit; and S4, the optical fiber end of the test module receives the optical signal, the optical signal is converted into an electric signal by an internal digital signal processing chip, the electric signal is transmitted back to the light source module by a high-speed signal line, the control unit executes a code detection instruction on the light source module, and the control unit reads and records an error rate test result of the light source module.

Description

Technical Field

[0001] The present invention relates to the technical field of optical modules, and in particular to an optical module testing board and a testing method. Background Art

[0002] With the rapid development of the optical communication field, optical modules are also moving towards higher speeds. In the optical module test, the corresponding test equipment is required to have the test capability of high-speed optical modules. In the prior art, universal test stations require matching bit error meter test equipment. As the rate increases, the cost of such test equipment will also increase significantly. Therefore, the optical module manufacturer needs to bear more production costs. At the same time, the traditional optical module test board has a high-frequency line design. The quality of this component will greatly affect the test results of the optical module bit error rate. Once the test board fails, there will be problems such as difficulty in repair or a long repair cycle, which invisibly increases the operating costs of the optical module manufacturer. Summary of the invention

[0003] The present invention provides an optical module testing board and testing method that are helpful to simplify testing equipment, save testing costs, and improve the test application scope, and can solve at least one of the above-mentioned technical problems.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0005] An optical module test board comprises a test board body, on which a power supply unit, a light source unit, a test unit and a control unit are arranged;

[0006] The power supply unit includes a power chip and a DC power supply component. The power chip is accessed by the control unit to adjust the output capacity. The DC power supply component includes a combined light source unit and test unit power supply demand module and an independent light source unit and test unit power supply demand module. The DC power supply component is independent of the power chip and can be used simultaneously or not simultaneously with the power chip.

[0007] The light source unit and the test unit both include an independent I2C control component and a register access component, the register access component is connected to the control unit, and the independent I2C control component and the register access component are not used at the same time;

[0008] The light source unit further includes a first RF connector, which is used to connect the light source module and the test board body. The test unit further includes a second RF connector, which is used to connect the test module and the test board body.

[0009] Furthermore, the light source module is a 1.6T OSFP packaging type optical module, and the first RF connector is an OSFP RF connector.

[0010] Furthermore, the light source module is a 1.6T QSFP-DD packaging type optical module, and the first RF connector is a QSFP-DD RF connector.

[0011] Furthermore, the light source module is used to generate and transmit an error test optical signal, the data transmission rate of the optical signal is configured to be adjustable and the maximum transmission rate is 1.6T.

[0012] Furthermore, the test module is a 1.6T / 800G / 400G OSFP packaging type optical module, and the second RF connector is an OSFP RF connector.

[0013] Furthermore, the test module is a 1.6T / 800G / 400G QSFP-DD packaging type optical module, and the second RF connector is a QSFP-DD RF connector.

[0014] Furthermore, the first RF connector and the second RF connector are connected via a high-speed signal line for transmitting electrical signals between the light source module and the test module.

[0015] Furthermore, the control unit includes an MCU main control chip and a peripheral design circuit, the peripheral design circuit is connected to the MCU main control chip, the MCU main control chip uses serial port communication to connect and control the light source unit and the test unit, and is used to monitor the status of the light source module or the test module respectively by accessing the register.

[0016] Furthermore, the control unit is connected to a host computer to implement automatic testing of the test board body. When the control unit fails, manual testing of the test board body is implemented through the light source unit and the independent I2C control component of the test unit.

[0017] A method for testing an optical module is implemented using the optical module testing board, comprising the following steps:

[0018] S1, using the control unit to detect the status of the light source module and the test module;

[0019] S2, the control unit executes a code sending instruction on the light source module, sends HTX end and LTX end code types, and tests the transmission performance and receiving performance of the test module at the same time, wherein the HTX end transmits an electrical signal and the LTX end transmits an optical signal;

[0020] S3, the digital processing chip inside the test module converts the received electrical signal into an optical signal, the external test equipment performs signal detection, and the control unit reads and records the test result of the external test equipment;

[0021] S4. The optical fiber end of the test module receives the optical signal, and converts it into an electrical signal by the internal digital signal processing chip, and then transmits it back to the light source module via the high-speed signal line. The control unit executes the code detection instruction on the light source module, and the control unit reads and records the bit error rate test result of the light source module.

[0022] The beneficial effects of the present invention are embodied in:

[0023] 1. In the present invention, the test module and the light source module are connected by high-speed signals through two RF connectors. The data transmission rate is adjustable and the maximum transmission rate is 1.6T. The main control chip can realize the software control of the light source module and the test module, and realize the code sending and code checking functions of the light source module, thereby meeting the needs of automated testing. At the same time, independent I2C control circuits of the test module and the light source module are also designed to meet the manual testing needs in the research and development stage.

[0024] 2. In terms of structural design, the present invention optimizes the optimal size of the high-speed signal between the two RF connectors through simulation experiments, and takes into account the temperature cycle test of the module and designs the module insulation box clamping function. The optical module test board simplifies the test equipment of the optical module and saves production costs. At the same time, it meets the two test requirements of research and development and production, and has a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The drawings described herein are used to provide further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute improper limitations on the present application.

[0026] Figure 1 This is a principle block diagram of an optical module test board provided in an embodiment of the present invention.

[0027] Figure 2 This is the front side of the test board body provided in the embodiment of the present invention.

[0028] Figure 3 This is the back side of the test board body provided in the embodiment of the present invention.

[0029] Figure 4 A partial circuit diagram of a power supply unit provided in an embodiment of the present invention.

[0030] Figure 5 A schematic diagram of a peripheral pin circuit of an OSFP radio frequency connector provided by an embodiment of the present invention.

[0031] Figure 6 A partial circuit diagram of a software test provided in an embodiment of the present invention.

[0032] Figure 7 A schematic diagram of a partial peripheral pin circuit of a control unit provided in an embodiment of the present invention.

[0033] Figure 8 A schematic diagram of a flow chart of an optical module testing method provided in an embodiment of the present invention.

[0034] Fig. 9 A structural block diagram of a computer device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. In the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0036] It should be noted that the meaning of "and / or" in the full text includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present invention.

[0037] See also Figure 1-Figure 3 An embodiment of the present invention provides an optical module test board, including a test board body, on which a power supply unit, a light source unit, a test unit and a control unit are arranged.

[0038] See also Figure 1-Figure 3 In this embodiment, the test board body is also called a module compliance test board (MCB), which generally includes an insulating board and a conductive circuit pre-set on the insulating board as needed.

[0039] It should be noted that in this application, the filling area on the test board body is the fixture contact area, such as Figure 3 shown.

[0040] In addition, in this application, in the front filling area of ​​the test board body, except for the module connector, no other patch components can be arranged, such as Figure 2 shown.

[0041] See also Figure 1 and Figure 4In this embodiment, the power supply unit includes a power chip and its peripheral circuits, and the maximum output current capacity exceeds 30A. The control unit can control and access the power chip through I2C communication, and record the output voltage and current of the power chip. At the same time, in the optical module test, since the optical module often needs to be tested for voltage deviation, the output voltage value of the power chip can be adjusted by MCU in this application, and the voltage range is adjusted to 3.13V~3.47V, so as to achieve the purpose of voltage deviation test.

[0042] In another embodiment, the power supply unit is powered by a DC-DC direct current circuit, one is to power the light source unit and the test unit simultaneously, and the other is to power the light source unit and the test unit separately.

[0043] See also Figure 1 and Figure 5 In this embodiment, the light source unit and the test unit each include an independent I2C control component and a register access component, the register access component is connected to the control unit, and the independent I2C control component and the register access component are not used at the same time;

[0044] The light source unit further includes a first RF connector, which is used to connect the light source module and the test board body. The test unit further includes a second RF connector, which is used to connect the test module and the test board body.

[0045] The light source module is used to generate and transmit an error test optical signal, the data transmission rate of the optical signal is configured to be adjustable and the maximum transmission rate is 1.6T;

[0046] The first RF connector and the second RF connector are connected via eight groups of high-speed signal lines for transmitting electrical signals between the light source module and the test module.

[0047] In one embodiment, the light source module is a 1.6T OSFP packaging type optical module, and the first RF connector is an OSFP RF connector.

[0048] In another embodiment, the light source module is a 1.6T QSFP-DD packaging type optical module, and the first RF connector is a QSFP-DD RF connector.

[0049] In one embodiment, the test module is a 1.6T / 800G / 400G OSFP packaging type optical module, and the second RF connector is an OSFP RF connector.

[0050] In another embodiment, the test module is a 1.6T / 800G / 400G QSFP-DD packaging type optical module, and the second RF connector is a QSFP-DD RF connector.

[0051] See also Figure 1 and Figure 7 In this embodiment, the control unit includes a main control chip and its peripheral design circuits, which are connected to the light source unit and the test unit through I2C communication to realize the code sending and checking functions of the light source unit and the monitoring function of the test unit;

[0052] The control unit establishes a connection with the host computer software via the RS232 communication interface, and is used to control the test board body to complete relevant tests and receive the test results uploaded by the test board body.

[0053] In this application, the main control chip can be selected as MCU.

[0054] See also Figure 1 , Figure 6 and Figure 7 In one embodiment, the control unit is operated by the host computer software to achieve simultaneous register access of the light source module and the test module, respectively performing monitoring purposes of temperature, voltage, current, etc.

[0055] In another embodiment, the light source module and the test module are not operated through the control unit, and independent I2C communication pins of the light source unit and the test unit are designed, that is, independent I2C control components.

[0056] Based on the above two embodiments, further, when selecting the control unit control or the independent I2C control component control, a dip switch is designed for switching selection.

[0057] See also Figure 1 , Figure 6 and Figure 7 In one embodiment, the control unit is connected to the low-speed signal pins of the light source module and the test module respectively through the corresponding pins of the RF connector, and is used to detect or control the low-speed signal pins of the light source module and the test module, so as to implement the test of the function of the low-speed signal pin of the test module. Specifically, the function of the low-speed pin can be tested through automated software by connecting the IO port of the MCU to the low-speed signal pin of the test module;

[0058] The low-speed signal pins of the light source module and the test module include RSTn, LPWn, INTn, and PRSn pins;

[0059] On the one hand, the first IO port of the MCU is connected to the RSTn pin of the test module, so as to detect the level of the INTL pin of the test module and implement the test of the INTL pin function of the test module; the second IO port of the MCU is connected to the LPWn of the test module, so as to control the level of the LPMode pin of the test module and implement the test of the LPMode pin function of the test module; the third IO port of the MCU is connected to the INTn of the test module, so as to control the level of the INTn pin of the test module and implement the test of the INTn pin function of the test module; the fourth IO port of the MCU is connected to the PRSn pin of the test module, so as to control the level of the PRSn pin of the test module and implement the test of the PRSn pin function of the test module;

[0060] On the other hand, the fifth IO port of the MCU is connected to the RSTn pin of the light source module, so as to detect the level of the INTL pin of the light source module and implement the test of the INTL pin function of the light source module; the sixth IO port of the MCU is connected to the LPWn of the light source module, so as to control the level of the LPMode pin of the light source module and implement the test of the LPMode pin function of the light source module; the seventh IO port of the MCU is connected to the INTn of the light source module, so as to control the level of the INTn pin of the light source module and implement the test of the INTn pin function of the light source module; the eighth IO port of the MCU is connected to the PRSn pin of the light source module, so as to control the level of the PRSn pin of the light source module and implement the test of the PRSn pin function of the light source module.

[0061] In another embodiment, the software performance test is not performed through the control unit, and independent low-speed test pins are designed for the light source module and the test module.

[0062] In this embodiment, when testing the emission performance of the test module, the control unit executes a coding instruction on the light source module, and the light source module transmits an electrical signal to the test module through a high-speed signal line. The test module converts the received electrical signal into an optical signal, and the optical fiber transmitting end is connected to an external test device, such as an oscilloscope, etc. The oscilloscope samples and processes the optical signal to achieve the purpose of testing the emission performance of the test module;

[0063] Alternatively, the light source module is not controlled by the MCU, but executes the coding instruction through independent I2C communication and the host computer;

[0064] Alternatively, the signal pattern corresponding to the output test electrical signal may be PRBS15 or PRBS15Q or SSPRQ. For example, when testing a 1.6T OSFP 2DR4 or 800G OSFP 2DR4 optical module, the SSPRQ pattern is used to verify the module transmission performance.

[0065] In this embodiment, when testing the receiving performance of the test module, the optical fiber transmitting end of the light source module is connected to the optical fiber receiving end of the test module, the control unit executes a code sending instruction on the light source module, the light source module transmits an optical signal to the test module through the optical fiber, the optical fiber receiving end of the test module receives the optical signal, and the digital processing unit inside the module processes the signal into an electrical signal, which is then transmitted back to the light source module via the high-speed signal line of the test board body, and the control unit executes a code detection instruction on the light source module, thereby achieving the purpose of testing the receiving performance of the test module;

[0066] Alternatively, the light source module is not controlled by the MCU, and executes code sending and code checking instructions through independent I2C communication with the host computer;

[0067] Alternatively, the code pattern of the light source module is a test signal pattern corresponding to the current bit error test, generally PRBS31 or PRBS31Q, and the test signal pattern is used to check the module receiving performance.

[0068] Based on the above two embodiments, further, an optical attenuator is added between the optical fiber transmitting end of the light source module and the optical fiber receiving end of the test module, so that the light sensitivity point of the test module can be tested;

[0069] Furthermore, the test board body is provided with a module test box clamping dimension to facilitate the three-temperature performance test of the test module.

[0070] See also Figure 8 The present invention also provides an optical module testing method, which is implemented using the optical module testing board and includes the following steps:

[0071] S1, using the control unit to detect the status of the light source module and the test module;

[0072] S2, the control unit executes a code sending instruction on the light source module, sends HTX end and LTX end code types, and tests the transmission performance and receiving performance of the test module at the same time, wherein the HTX end transmits an electrical signal and the LTX end transmits an optical signal;

[0073] S3, the digital processing chip inside the test module converts the received electrical signal into an optical signal, the external test equipment performs signal detection, and the control unit reads and records the test result of the external test equipment;

[0074] S4. The optical fiber end of the test module receives the optical signal, and converts it into an electrical signal by the internal digital signal processing chip, and then transmits it back to the light source module via the high-speed signal line. The control unit executes the code detection instruction on the light source module, and the control unit reads and records the bit error rate test result of the light source module.

[0075] In this embodiment, S3 and S4 can be performed simultaneously.

[0076] An embodiment of the present invention further provides a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, the processor executes the steps of the above method.

[0077] See also Fig. 9 An embodiment of the present invention further provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor executes the steps of the above method.

[0078] The embodiment of the present invention further provides a computer program product comprising instructions, which, when executed on a computer, enables the computer to execute the steps of the above method.

[0079] It is understandable that the device and storage medium provided in the embodiments of the present invention correspond to the method provided in the embodiments of the present invention, and the explanation, examples and beneficial effects of the relevant contents can refer to the corresponding parts in the above methods.

[0080] It should be noted that those skilled in the art can understand that all or part of the steps implemented in the embodiments of the present invention can be implemented in whole or in part by software, hardware, firmware or any combination thereof. When implemented using hardware, it can be implemented in whole or in part in the form of purchasing standard parts or modified parts. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the process or function described in the embodiment of the present application is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from a website site, computer, server or data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, server or data center. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that includes one or more available media integrated. The available medium may be a magnetic medium (eg, a floppy disk, a hard disk, a magnetic tape), an optical medium (eg, a DVD), or a semiconductor medium (eg, a solid state disk (SSD)).

[0081] It should be understood that the examples and implementation modes described herein are for illustrative purposes only and are not intended to limit the present invention. Those skilled in the art may make various modifications or changes based on the examples and implementation modes. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An optical module test board, characterized in that: It comprises a test board body, on which a power supply unit, a light source unit, a test unit and a control unit are arranged; The power supply unit includes a power chip and a DC power supply component. The power chip is accessed by the control unit to adjust the output capacity. The DC power supply component includes a combined light source unit and test unit power supply demand module and an independent light source unit and test unit power supply demand module. The DC power supply component is independent of the power chip and can be used simultaneously or not simultaneously with the power chip. The light source unit and the test unit both include an independent I2C control component and a register access component, the register access component is connected to the control unit, and the independent I2C control component and the register access component are not used at the same time; The light source unit further includes a first RF connector, which is used to connect the light source module and the test board body. The test unit further includes a second RF connector, which is used to connect the test module and the test board body.

2. The optical module test board according to claim 1, characterized in that: The light source module is a 1.6T OSFP package type optical module, and the first RF connector is an OSFP RF connector.

3. The optical module test board according to claim 1, characterized in that: The light source module is a 1.6TQSFP-DD package type optical module, and the first RF connector is a QSFP-DD RF connector.

4. The optical module test board according to claim 2 or 3, characterized in that: The light source module is used to generate and transmit an error code test optical signal, the data transmission rate of the optical signal is configured to be adjustable and the maximum transmission rate is 1.6T.

5. The optical module test board according to claim 1, characterized in that: The test module is a 1.6T / 800G / 400GOSFP packaging type optical module, and the second RF connector is an OSFP RF connector.

6. The optical module test board according to claim 1, characterized in that: The test module is a 1.6T / 800G / 400GQSFP-DD packaging type optical module, and the second RF connector is a QSFP-DD RF connector.

7. The optical module test board according to claim 5 or 6, characterized in that: The first RF connector and the second RF connector are connected via a high-speed signal line for transmitting electrical signals between the light source module and the test module.

8. The optical module test board according to claim 1, characterized in that: The control unit includes an MCU main control chip and a peripheral design circuit, wherein the peripheral design circuit is connected to the MCU main control chip, and the MCU main control chip uses serial port communication to connect and control the light source unit and the test unit, and is used to monitor the status of the light source module or the test module respectively by accessing the register.

9. The optical module test board according to claim 1, characterized in that: The control unit is connected to a host computer to implement automatic testing of the test board body. When the control unit fails, manual testing of the test board body is implemented through the light source unit and the independent I2C control component of the test unit.

10. An optical module testing method, implemented by using the optical module testing board according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1, using the control unit to detect the status of the light source module and the test module; S2, the control unit executes a code sending instruction on the light source module, sends HTX end and LTX end code types, and tests the transmission performance and receiving performance of the test module at the same time, wherein the HTX end transmits an electrical signal and the LTX end transmits an optical signal; S3, the digital processing chip inside the test module converts the received electrical signal into an optical signal, the external test equipment performs signal detection, and the control unit reads and records the test result of the external test equipment; S4. The optical fiber end of the test module receives the optical signal, and converts it into an electrical signal by the internal digital signal processing chip, and then transmits it back to the light source module via the high-speed signal line. The control unit executes the code detection instruction on the light source module, and the control unit reads and records the bit error rate test result of the light source module.

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