Multifunctional integrated circuit sensor

Abstract

The invention discloses a multifunctional integrated circuit sensor, and relates to the technical field of sensors. The circuit board comprises a circuit board body and a sensor chip body arranged on one side of the circuit board body in parallel. The opposite side surfaces of the sensor chip body are connected with a plurality of pins side by side; the plurality of pins are connected to the circuit board body; the periphery of the sensor chip body is wrapped with a shielding assembly; the shielding assembly comprises two groups of bearing strips; one group of bearing strips are arranged between the circuit board body and the sensor chip body side by side, and the other group of bearing strips are arranged on one side, far away from the circuit board body, of the sensor chip body side by side; the two groups of bearing strips are respectively provided with a first cavity, and a plurality of shielding sheets are stacked in each first cavity. The integrated circuit sensor is reasonable in structural design, and the use effect of the integrated circuit sensor is effectively improved.

Description

Technical Field

[0001] The invention belongs to the technical field of sensors, and in particular relates to a multifunctional integrated circuit sensor. Background Art

[0002] The function of integrated circuit sensors is to detect and measure physical quantities or environmental parameters and convert them into electrical signal outputs. They are widely used in various fields, such as temperature measurement, pressure measurement, humidity measurement, and illuminance measurement.

[0003] A Chinese patent with authorization announcement number CN116723688B discloses a multifunctional integrated circuit sensor, which includes a sensor chip body and pins. The sensor chip body has pins embedded inside, the pins extend from the inside to the outside, and the pins are embedded and connected to the circuit board. The bottom end of the circuit board is connected to a support frame. The outer surface of the sensor chip body is wrapped with a shielding component, and the shielding component includes a limit frame, a shielding rod is embedded inside the limit frame, and a stabilizing component is embedded inside the shielding rod. The above device has the following disadvantages: Since there is a gap between two adjacent shielding rods of the above device, a small amount of electromagnetic signals will pass through the gap to interfere with the sensor chip body. Therefore, it is urgent to study a multifunctional integrated circuit sensor to solve the above problems. Summary of the invention

[0004] The present invention provides a multifunctional integrated circuit sensor, the purpose of which is to solve the technical problems raised in the above background technology.

[0005] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0006] The present invention is a multifunctional integrated circuit sensor, comprising a circuit board body and a sensor chip body arranged in parallel on one side of the circuit board body; the opposite sides of the sensor chip body are connected with a plurality of pins in parallel; the plurality of pins are connected to the circuit board body; the periphery of the sensor chip body is wrapped with a shielding component; the shielding component comprises two groups of supporting bars; one group of the supporting bars is arranged side by side between the circuit board body and the sensor chip body, and the other group of the supporting bars is arranged side by side on the side of the sensor chip body away from the circuit board body; the two groups of supporting bars each have a first cavity, and a plurality of shielding sheets are stacked in each of the first cavities; an accommodating gap is formed between two adjacent supporting bars; a plurality of first blocking sheets are fixed side by side in the accommodating gap along the length direction of the supporting bars; a second blocking sheet is fixed between two adjacent first blocking sheets; a heat dissipation channel is formed between the second blocking sheet and the adjacent first blocking sheets.

[0007] As a preferred technical solution of the present invention, one group of the supporting bars are attached side by side on a surface of the sensor chip body close to the circuit board body, and another group of the supporting bars are attached side by side on a surface of the sensor chip body away from the circuit board body; both groups of the supporting bars have a second chamber; the second chamber is independent of the first chamber; the second chamber is arranged between the first chamber and the sensor chip body; and the second chamber is filled with cooling liquid.

[0008] As a preferred technical solution of the present invention, the first baffle includes a pair of first fins; an adjacent edge of the two first fins is connected together; the two first fins are distributed in a "﹀" shape; the second baffle includes a pair of second fins; an adjacent edge of the two second fins is connected together; the two second fins are distributed in a "︿" shape; one first fin is arranged in parallel with one second fin, and another first fin is arranged in parallel with another second fin; the first fin and the adjacent second fin are staggered, and the heat dissipation channel is formed between the first fin and the second fin.

[0009] As a preferred technical solution of the present invention, the opposite side walls of each of the first chambers are provided with a plurality of heat dissipation holes arranged side by side along the length direction; the heat dissipation holes are connected to the accommodating gap.

[0010] As a preferred technical solution of the present invention, a heat dissipation component is connected to the shielding component; the heat dissipation component includes a pair of support boxes respectively arranged on the other opposite sides of the sensor chip body; the two ends of the two groups of the supporting strips are respectively fixed on the opposite inner sides of the two support boxes, and the first chamber is connected to the interior of the support boxes; the opposite outer sides of the two support boxes are connected to air outlet boxes; the two air outlet boxes are provided with air outlets on a surface away from the circuit board body; and cooling fans are installed in the two air outlet boxes.

[0011] As a preferred technical solution of the present invention, a blocking component is connected to the heat dissipation component; the blocking component includes two pairs of blocking bars respectively arranged on opposite sides of the sensor chip body; the two pairs of blocking bars are arranged parallel to the supporting bars, and the two pairs of blocking bars are respectively connected to two supporting boxes.

[0012] As a preferred technical solution of the present invention, two pairs of positioning notches are arranged side by side on the relative outer sides of the two support boxes; both ends of the two pairs of blocking strips have hooks; the two pairs of hooks are respectively engaged in the two pairs of positioning notches.

[0013] As a preferred technical solution of the present invention, the relative inner edges of the two blocking bars on the same side of the sensor chip body are arranged side by side with a plurality of accommodating notches corresponding to the pins; the pins are gap-fitted into the accommodating notches.

[0014] As a preferred technical solution of the present invention, the opposite sides of the two pairs of blocking strips are provided with a plurality of ventilation holes arranged side by side along the length direction.

[0015] The present invention has the following beneficial effects:

[0016] The present invention wraps a shielding component on the periphery of the sensor chip body, and sets a group of supporting bars side by side between the circuit board body and the sensor chip body and another group of supporting bars side by side on the side of the sensor chip body away from the circuit board body, and then designs the supporting bars to have a first cavity, and stacks a plurality of shielding sheets in the first cavity, and then sets a first baffle sheet and a second baffle sheet between two adjacent supporting bars, and designs a heat dissipation channel to be formed between the second baffle sheet and the adjacent first baffle sheet, which can not only effectively improve the electromagnetic shielding effect of the integrated circuit sensor, but also ensure the heat dissipation effect of the integrated circuit sensor, and at the same time avoid the problem of a small amount of electromagnetic signal interfering with the sensor chip body existing in the prior art.

[0017] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0019] Figure 1 The figure is a schematic diagram of the structure of a multifunctional integrated circuit sensor of the present invention.

[0020] Figure 2 for Figure 1 The main view of the structure.

[0021] Figure 3 It is a schematic structural diagram of the connection between the shielding component and the heat dissipation component of the present invention.

[0022] Figure 4 It is a schematic structural diagram of the shielding assembly of the present invention.

[0023] Figure 5 It is a schematic structural diagram of the first baffle and the second baffle connected to the bearing bar of the present invention.

[0024] Figure 6 It is a schematic diagram of the relative position between the first baffle and the second baffle of the present invention.

[0025] Figure 7 It is a schematic structural diagram of the heat dissipation assembly of the present invention.

[0026] Figure 8 It is a schematic structural diagram of the blocking component of the present invention.

[0027] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0028] 1-circuit board body, 2-sensor chip body, 3-pin, 4-shielding component, 5-heat dissipation component, 6-blocking component, 401-bearing bar, 402-first chamber, 403-shielding plate, 404-accommodating gap, 405-first baffle, 406-second baffle, 407-heat dissipation channel, 408-second chamber, 409-heat dissipation hole, 501-support box, 502-air outlet box, 503-air outlet, 504-cooling fan, 505-positioning notch, 601-blocking bar, 602-hook, 603-accommodating notch, 604-ventilation hole, 4051-first fin, 4061-second fin. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] Embodiment 1:

[0031] See also Figure 1-6As shown, the present invention is a multifunctional integrated circuit sensor, comprising a circuit board body 1 and a sensor chip body 2 arranged in parallel on one side of the circuit board body 1; the opposite sides of the sensor chip body 2 are connected with a plurality of pins 3 in parallel; the plurality of pins 3 are connected to the circuit board body 1; the circuit board body 1, the sensor chip body 2 and the pins 3 are all conventional components in the art; the outer periphery of the sensor chip body 2 is wrapped with a shielding component 4; the shielding component 4 includes two groups of bearing bars 401; one group of bearing bars 401 is arranged side by side between the circuit board body 1 and the sensor chip body 2, and the other group of bearing bars 401 is arranged side by side on the sensor chip body 2. The device chip body 2 is on one side away from the circuit board body 1; both groups of supporting bars 401 have a first cavity 402, and each first cavity 402 is stacked with multiple shielding sheets 403; the shielding sheets 403 are copper foil or aluminum foil; a containing gap 404 is formed between two adjacent supporting bars 401; a plurality of first blocking sheets 405 are fixed side by side in the containing gap 404 along the length direction of the supporting bars 401; a second blocking sheet 406 is fixed between two adjacent first blocking sheets 405; the first blocking sheet 405 and the second blocking sheet 406 are both made of copper material; a heat dissipation channel 407 is formed between the second blocking sheet 406 and the adjacent first blocking sheet 405. When in use, by wrapping the shielding component 4 around the periphery of the sensor chip body 2, and arranging a group of supporting bars 401 side by side between the circuit board body 1 and the sensor chip body 2, and another group of supporting bars 401 side by side on the side of the sensor chip body 2 away from the circuit board body 1, and then designing the supporting bars 401 to have a first cavity 402, and stacking a plurality of shielding sheets 403 in the first cavity 402, and then arranging a first baffle 405 and a second baffle 406 between two adjacent supporting bars 401, and designing a heat dissipation channel 407 to be formed between the second baffle 406 and the adjacent first baffle 405, not only can the electromagnetic shielding effect of the integrated circuit sensor be effectively improved, but also the heat dissipation effect of the integrated circuit sensor is ensured, and at the same time, the problem of a small amount of electromagnetic signal interfering with the sensor chip body existing in the prior art is avoided.

[0032] Among them Figure 4 As shown, a group of support bars 401 are attached side by side on a surface of the sensor chip body 2 close to the circuit board body 1, and another group of support bars 401 are attached side by side on a surface of the sensor chip body 2 away from the circuit board body 1; both groups of support bars 401 have a second chamber 408; the second chamber 408 is independent of the first chamber 402; the second chamber 408 is arranged between the first chamber 402 and the sensor chip body 2; the second chamber 408 is filled with conventional coolant in the art. When in use, by designing the second chamber 408 in the support bar 401, the second chamber 408 is independent of the first chamber 402, and the second chamber 408 is filled with coolant, so that the coolant absorbs the heat generated by the sensor chip body 2 when it is working, thereby ensuring the heat dissipation performance of the sensor chip body 2.

[0033] Among them Figure 3 and Figure 5-6 As shown, the first baffle 405 includes a pair of first fins 4051; the adjacent edges of the two first fins 4051 are connected together; the two first fins 4051 are distributed in a "﹀" shape; the second baffle 406 includes a pair of second fins 4061; the adjacent edges of the two second fins 4061 are connected together; the two second fins 4061 are distributed in a "︿" shape; a first fin 4051 is arranged in parallel with a second fin 4061, and another first fin 4051 is arranged in parallel with another second fin 4061; the first fin 4051 and the adjacent second fin 4061 are staggered, and a heat dissipation channel 407 is formed between the first fin 4051 and the second fin 4061. When in use, by designing the first fin 4051 and the adjacent second fin 4061 to be staggered and forming a heat dissipation channel 407 between the first fin 4051 and the second fin 4061, not only the electromagnetic shielding performance of the integrated circuit sensor is guaranteed, but also the heat dissipation effect of the integrated circuit sensor is guaranteed.

[0034] Embodiment 2:

[0035] Based on Example 1, Figure 2-3 and Figure 6-7 As shown, the opposite side walls of each first chamber 402 are provided with a plurality of heat dissipation holes 409 arranged side by side along the length direction; the heat dissipation holes 409 are communicated with the accommodating gap 404; the shielding component 4 is connected with the heat dissipation component 5; the heat dissipation component 5 includes a pair of support boxes 501 respectively arranged on the other opposite sides of the sensor chip body 2; the two ends of the two groups of supporting bars 401 are respectively fixed on the opposite inner sides of the two support boxes 501, and the first chamber 402 is communicated with the interior of the support boxes 501; the opposite outer sides of the two support boxes 501 are connected with air outlet boxes 502; the two air outlet boxes 502 are provided with air outlets 503 on a surface away from the circuit board body 1; the two air outlet boxes 502 are equipped with conventional heat dissipation fans 504 in this field. When in use, the heat dissipation fan 504 generates airflow, prompting the heat dissipation holes 409 to introduce external air into the first chamber 402. The air entering the first chamber 402 takes away the heat in the first chamber 402. The hot air in the first chamber 402 is discharged to the air outlet 503 through the support box 501 and the air outlet box 502, thereby effectively improving the heat dissipation effect of the integrated circuit sensor.

[0036] Embodiment three:

[0037] Based on Example 2, Figure 2-4 and Figure 8As shown, a blocking component 6 is connected to the heat dissipation component 5; the blocking component 6 includes two pairs of blocking bars 601 respectively arranged on opposite sides of the sensor chip body 2; the two pairs of blocking bars 601 are made of copper material; the two pairs of blocking bars 601 are arranged in parallel with the supporting bars 401, and the two pairs of blocking bars 601 are respectively connected to the two supporting boxes 501; two pairs of positioning notches 505 are arranged side by side on the opposite outer sides of the two supporting boxes 501; hooks 602 are integrally formed at both ends of the two pairs of blocking bars 601; the two pairs of hooks 602 are respectively engaged in the two pairs of positioning notches 505; the relative inner edges of the two blocking bars 601 located on the same side of the sensor chip body 2 are arranged side by side with a plurality of accommodating notches 603 corresponding to the pins 3; the pins 3 are gap-fitted in the accommodating notches 603. When in use, a pair of blocking bars 601 are designed on opposite sides of the sensor chip body 2, and the blocking bars 601 are snapped onto the support box 501, and the pins 3 are gap-fitted into the accommodating notches 603, thereby further improving the heat dissipation and shielding effects of the integrated circuit sensor.

[0038] Among them Figure 8 As shown, the opposite sides of the two pairs of blocking bars 601 are provided with a plurality of ventilation holes 604 arranged side by side along the length direction; the ventilation holes 604 are waist-shaped holes or round holes. When in use, the heat dissipation effect of the integrated circuit sensor is further ensured by providing a plurality of ventilation holes 604 arranged side by side along the length direction on the opposite sides of the two pairs of blocking bars 601.

[0039] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A multifunctional integrated circuit sensor, characterized in that: The invention comprises a circuit board body (1) and a sensor chip body (2) arranged in parallel on one side of the circuit board body (1); the opposite sides of the sensor chip body (2) are connected in parallel with a plurality of pins (3); the plurality of pins (3) are connected to the circuit board body (1); the outer periphery of the sensor chip body (2) is wrapped with a shielding component (4); The shielding assembly (4) comprises two groups of bearing bars (401); one group of the bearing bars (401) is arranged side by side between the circuit board body (1) and the sensor chip body (2), and the other group of the bearing bars (401) is arranged side by side on a side of the sensor chip body (2) away from the circuit board body (1); both groups of the bearing bars (401) have a first cavity (402), and each of the first cavities (402) has a plurality of shielding sheets (403) stacked therein; an accommodation gap (404) is formed between two adjacent bearing bars (401); a plurality of first baffles (405) are fixed side by side in the accommodation gap (404) along the length direction of the bearing bars (401); a second baffle (406) is fixed between two adjacent first baffles (405); and a heat dissipation channel (407) is formed between the second baffle (406) and the adjacent first baffle (405).

2. A multifunctional integrated circuit sensor according to claim 1, characterized in that: A group of the supporting bars (401) are attached side by side on a surface of the sensor chip body (2) close to the circuit board body (1), and another group of the supporting bars (401) are attached side by side on a surface of the sensor chip body (2) away from the circuit board body (1); both groups of the supporting bars (401) have a second chamber (408); the second chamber (408) and the first chamber (402) are independent of each other; the second chamber (408) is arranged between the first chamber (402) and the sensor chip body (2); and the second chamber (408) is filled with a cooling liquid.

3. A multifunctional integrated circuit sensor according to claim 1 or 2, characterized in that: The first baffle (405) comprises a pair of first fins (4051); the adjacent edges of the two first fins (4051) are connected together; the two first fins (4051) are arranged in a "﹀" shape; the second baffle (406) comprises a pair of second fins (4061); the adjacent edges of the two second fins (4061) are connected together; the two second fins (4061) are arranged in a "︿" shape; one first fin (4051) is arranged in parallel with one second fin (4061), and another first fin (4051) is arranged in parallel with another second fin (4061); the first fins (4051) and the adjacent second fins (4061) are arranged in an alternating manner, and the heat dissipation channel (407) is formed between the first fins (4051) and the second fins (4061).

4. A multifunctional integrated circuit sensor according to claim 3, characterized in that: The opposite side walls of each of the first chambers (402) are provided with a plurality of heat dissipation holes (409) arranged side by side along the length direction; the heat dissipation holes (409) are communicated with the accommodating gap (404).

5. A multifunctional integrated circuit sensor according to claim 4, characterized in that: The shielding component (4) is connected to a heat dissipation component (5); the heat dissipation component (5) comprises a pair of support boxes (501) respectively arranged on the other opposite sides of the sensor chip body (2); the two ends of the two groups of the support strips (401) are respectively fixed on the opposite inner side surfaces of the two support boxes (501), and the first chamber (402) is connected to the interior of the support boxes (501); the opposite outer side surfaces of the two support boxes (501) are connected to air outlet boxes (502); the two air outlet boxes (502) are provided with air outlets (503) on a surface away from the circuit board body (1); and the two air outlet boxes (502) are provided with heat dissipation fans (504).

6. A multifunctional integrated circuit sensor according to claim 5, characterized in that: The heat dissipation component (5) is connected to a blocking component (6); the blocking component (6) comprises two pairs of blocking bars (601) respectively arranged on opposite sides of the sensor chip body (2); the two pairs of blocking bars (601) are arranged parallel to the supporting bars (401), and the two pairs of blocking bars (601) are respectively connected to two supporting boxes (501).

7. A multifunctional integrated circuit sensor according to claim 6, characterized in that: Two pairs of positioning notches (505) are arranged side by side on opposite outer sides of the two support boxes (501); both ends of the two pairs of blocking bars (601) are provided with hooks (602); the two pairs of hooks (602) are respectively engaged in the two pairs of positioning notches (505).

8. A multifunctional integrated circuit sensor according to claim 6 or 7, characterized in that: The opposite inner edges of the two blocking bars (601) located on the same side of the sensor chip body (2) are provided with a plurality of accommodating notches (603) corresponding to the pins (3) arranged side by side; the pins (3) are loosely fitted in the accommodating notches (603).

9. A multifunctional integrated circuit sensor according to claim 8, characterized in that: The opposite sides of the two pairs of blocking strips (601) are both provided with a plurality of ventilation holes (604) arranged side by side along the length direction.

Images