Heat conduction and heat dissipation mechanism, packaging backboard and preparation method thereof, and photovoltaic module

Abstract

The invention relates to a heat conduction and heat dissipation mechanism, a packaging backboard, a preparation method of the packaging backboard and a photovoltaic module. The heat conduction and dissipation mechanism comprises a base body frame and a heat conduction filling body, the base body frame is provided with a heat conduction groove and convection heat dissipation holes, an opening of the heat conduction groove is formed in the first side of the base body frame, the heat conduction filling body is arranged in the heat conduction groove, and the convection heat dissipation holes are close to the heat conduction groove and penetrate through the base body frame. The base body frame is provided with a second side opposite to the first side, and the two ends of the convection heat dissipation holes are formed in the ends, located between the first side and the second side, of the base body frame respectively. The base body frame of the heat conduction and dissipation mechanism is provided with the heat conduction groove, the heat conduction filling body is arranged in the heat conduction groove, and the heat conduction filling body can conduct heat of equipment connected to the first side rapidly. The base body frame is further provided with convection heat dissipation holes, the convection heat dissipation holes rapidly dissipate heat conducted by the heat conduction filling bodies arranged in the heat conduction grooves to the external space in an air convection mode, and efficient heat dissipation and cooling are achieved.

Description

Technical Field

[0001] The present invention relates to the field of photovoltaic technology, and in particular to a heat conduction and heat dissipation mechanism, a packaging back plate and a preparation method thereof, and a photovoltaic module. Background Art

[0002] With the development of photovoltaic technology, the conversion efficiency and power generation of photovoltaic modules are getting higher and higher. At present, the power generation of advanced photovoltaic modules can reach more than 700W. However, this also makes the problem of module heating gradually prominent. High temperature environment and the heating of photovoltaic modules themselves will seriously affect their photoelectric conversion efficiency. For every 1°C increase in temperature, the photoelectric conversion efficiency decreases by about 0.4%.

[0003] As a key component to protect photovoltaic modules, the encapsulation backplane plays a supporting and water-blocking role. As the heating problem of photovoltaic modules becomes more prominent, it is necessary to develop an encapsulation backplane with good conduction heat dissipation function. Summary of the invention

[0004] Based on this, it is necessary to provide a heat-conducting and heat-dissipating mechanism with good conduction and heat-dissipating function, a packaging backplane with the heat-conducting and heat-dissipating mechanism and a preparation method thereof, and a photovoltaic module with the packaging backplane.

[0005] The first aspect of the present invention is to provide a heat conduction and heat dissipation mechanism, the scheme is as follows:

[0006] A heat-conducting and heat-dissipating mechanism comprises a base frame and a heat-conducting filling body, wherein the base frame is provided with a heat-conducting groove and a convection heat-dissipating hole, wherein the heat-conducting groove opens at a first side of the base frame, the heat-conducting filling body is arranged in the heat-conducting groove, the convection heat-dissipating hole is close to the heat-conducting groove and penetrates the base frame, the base frame has a second side arranged opposite to the first side, and both ends of the convection heat-dissipating hole are respectively opened at ends of the base frame located between the first side and the second side.

[0007] In one embodiment, the convection heat dissipation holes are located on the outer side of the side wall and / or the outer side of the bottom wall of the heat conducting groove.

[0008] In one of the embodiments, the aperture of one end opening of the convection heat dissipation hole is larger than the aperture of the other end opening.

[0009] In one embodiment, the diameter of the convection heat dissipation hole gradually narrows from one end opening to the other end opening.

[0010] In one embodiment, the diameter of the opening at the larger end of the convection heat dissipation hole is 35 mm to 40 mm, and the diameter of the opening at the smaller end is 10 mm to 15 mm.

[0011] In one embodiment, there are multiple heat-conducting grooves.

[0012] In one embodiment, there are multiple convection heat dissipation holes.

[0013] In one embodiment, the depth of the heat conduction groove is 4 mm to 6 mm.

[0014] In one embodiment, the base frame is a plate-like structure, and the first side is one side surface of the plate-like structure.

[0015] In one embodiment, the thermally conductive filler contains the following components in parts by weight:

[0016] 60-70 parts of epoxy resin, 5-10 parts of a first silane coupling agent, 1-5 parts of a first dispersant, 1-5 parts of a first antioxidant and 5-23 parts of a first thermally conductive particle.

[0017] In one embodiment, the first silane coupling agent is selected from one or more of vinyl triethoxy silane, vinyl trimethoxy silane, and vinyl tri(β-methoxyethoxy) silane.

[0018] In one embodiment, the thermal conductivity of the first thermally conductive particles is above 1.5 W / (m*k).

[0019] In one embodiment, the material of the first thermally conductive particles is selected from one or more of silicon dioxide, copper powder, aluminum oxide, boron nitride, and the like.

[0020] In one embodiment, the first thermally conductive particles include 2-8 parts of silicon dioxide, 1-5 parts of copper powder, 1-5 parts of aluminum oxide, and 1-5 parts of boron nitride.

[0021] In one embodiment, the thermally conductive filler further contains 1-5 parts of a first ultraviolet absorber.

[0022] The second aspect of the present invention is to provide a packaging backplane for a photovoltaic module, the scheme is as follows:

[0023] A packaging backplane of a photovoltaic module comprises a backplane substrate and a heat-conducting and heat-dissipating mechanism according to any one of claims 1 to 9, wherein a first side of the base frame is connected to the backplane substrate.

[0024] In one of the embodiments, the packaging backplane further includes an adhesive layer, and the adhesive layer is disposed between the backplane substrate and the heat-conducting and heat-dissipating mechanism.

[0025] In one of the embodiments, the packaging backplane further comprises a thermal conductive coating, and the thermal conductive coating is disposed on a side of the backplane substrate away from the thermal conductive heat dissipation mechanism.

[0026] In one embodiment, the thermal conductive coating contains the following components in parts by weight:

[0027] 55-60 parts of acrylic resin, 2-6 parts of curing agent, 5-10 parts of second silane coupling agent, 1-5 parts of second dispersant, 1-5 parts of second antioxidant and 5-23 parts of second thermal conductive particles.

[0028] In one embodiment, the second silane coupling agent is selected from one or more of vinyl triethoxy silane, vinyl trimethoxy silane, and vinyl tri(β-methoxyethoxy) silane.

[0029] In one embodiment, the thermal conductivity of the second thermally conductive particles is greater than 1.5 W / (m*k).

[0030] In one embodiment, the material of the second thermally conductive particles is selected from one or more of silicon dioxide, copper powder, aluminum oxide, boron nitride, and the like.

[0031] In one embodiment, the second thermally conductive particles include 2-8 parts of silicon dioxide, 1-5 parts of copper powder, 1-5 parts of aluminum oxide, and 1-5 parts of boron nitride.

[0032] In one embodiment, the thermally conductive filler further contains 1-5 parts of a second ultraviolet absorber.

[0033] In one of the embodiments, the material of the base frame includes epoxy resin;

[0034] In one of the embodiments, the material of the backplane substrate includes one or more of PET, PA, and PO.

[0035] The third aspect of the present invention is to provide a method for preparing a packaging backplane of a photovoltaic module, the scheme is as follows:

[0036] A method for preparing a packaging backplane of a photovoltaic module comprises the following steps:

[0037] Prepare a base frame, the base frame having a first side, the base frame being provided with a heat conduction groove and a convection heat dissipation hole, the heat conduction groove opening at the first side, the convection heat dissipation hole being close to the heat conduction groove and penetrating the base frame, the base frame having a second side arranged opposite to the first side, and two ends of the convection heat dissipation hole opening at ends of the base frame located between the first side and the second side respectively;

[0038] A heat-conducting filling body is arranged in the heat-conducting groove to obtain a heat-conducting and heat-dissipating mechanism;

[0039] The heat conduction and heat dissipation mechanism is compounded with a backplane substrate, and the first side of the base frame is connected to the backplane substrate to obtain a packaging backplane.

[0040] The fourth aspect of the present invention is to provide a photovoltaic module, the scheme is as follows:

[0041] A photovoltaic module comprises a packaging panel, a solar cell and a packaging backplane as described in any of the above embodiments or a packaging backplane prepared by the above preparation method, wherein the solar cell is arranged between the packaging panel and the packaging backplane, and the heat conduction and heat dissipation mechanism is located on the side of the backplane substrate away from the solar cell.

[0042] Compared with the traditional solution, the above-mentioned heat conduction and heat dissipation mechanism, packaging backplane and preparation method thereof, and photovoltaic module have the following beneficial effects:

[0043] The above-mentioned heat conduction and heat dissipation mechanism is provided with a base frame, the base frame is provided with a heat conduction groove, a heat conduction filling body is provided in the heat conduction groove, the heat conduction groove is opened at the first side of the base frame, and the heat conduction filling body can quickly conduct the heat generated by the device connected to the first side. The base frame is also provided with convection heat dissipation holes, the convection heat dissipation holes are close to the heat conduction groove and penetrate the base frame, and the convection heat dissipation holes quickly dissipate the heat conducted by the heat conduction filling body provided in the heat conduction groove to the external space in the form of air convection, thereby realizing efficient heat dissipation and cooling.

[0044] The above heat conduction and heat dissipation mechanism can be combined with the packaging backboard of the photovoltaic module to effectively conduct heat and dissipate heat for the photovoltaic module, reduce the temperature of the photovoltaic module, and help improve the photoelectric conversion efficiency of the photovoltaic module. The packaging backboard and photovoltaic module combined with the above heat conduction and heat dissipation mechanism can achieve corresponding beneficial effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] FIG1 is a schematic structural diagram of a heat conduction and heat dissipation mechanism according to an embodiment;

[0046] FIG2 is a schematic structural diagram of the heat conduction and heat dissipation mechanism shown in FIG1 from another perspective;

[0047] FIG3 is a schematic diagram of the gas flow direction in the convection heat dissipation holes;

[0048] FIG4 is a schematic structural diagram of a packaging back plate including the heat conduction and heat dissipation mechanism shown in FIG1 according to an embodiment;

[0049] FIG5 is a schematic structural diagram of a conveying roller assembly for preparing a packaging backplane;

[0050] FIG. 6 is a schematic structural diagram of a photovoltaic assembly including the packaging backplane shown in FIG. 4 according to an embodiment.

[0051] Description of reference numerals:

[0052] 100, heat conduction and heat dissipation mechanism; 110, base frame; 111, first side; 112, second side; 113, first end; 114, second end; 115, heat conduction groove; 116, convection heat dissipation hole; 1161, first opening end; 1162, second opening end; 120, heat conductive filling body; 10, packaging backplane; 200, backplane substrate; 300, adhesive layer; 400, thermal conductive coating; 1, photovoltaic module; 20, packaging panel; 30, solar cell; 40, first packaging film; 50, second packaging film; 7, conveyor roller assembly; 71, first station; 72, second station; 73, third station; 74, fourth station; 75, fifth station. DETAILED DESCRIPTION

[0053] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0054] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0055] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0056] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0057] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0058] As shown in FIG. 1 and FIG. 2 , a heat conduction and heat dissipation mechanism 100 of an embodiment includes a base frame 110 and a heat conduction filling body 120. The base frame 110 has a first side 111, and the base frame 110 is provided with a heat conduction groove 115 and a convection heat dissipation hole 116. The heat conduction groove 115 opens at the first side 111 of the base frame 110, and the heat conduction filling body 120 is disposed in the heat conduction groove 115. The convection heat dissipation hole 116 is close to the heat conduction groove 115 and penetrates the base frame 110.

[0059] The base frame 110 further has a second side 112 disposed opposite to the first side 111. Both ends of the convection heat dissipation hole 116 are respectively opened at the end of the base frame 110 located between the first side 111 and the second side 112. In other words, the convection heat dissipation hole 116 has a first opening end 1161 and a second opening end 1162, and the first opening end 1161 and the second opening end 1162 are respectively located at the end between the first side 111 and the second side 112 of the base frame 110.

[0060] For example, the base frame 110 has a first end 113 and a second end 114 located between the first side 111 and the second side 112 of the base frame 110. The first end 113 and the second end 114 are arranged opposite to each other. The first opening end 1161 of the convection heat dissipation hole 116 is located at the first end 113 of the base frame 110, and the second opening end 1162 of the convection heat dissipation hole 116 is located at the second end 114 of the base frame 110.

[0061] The above-mentioned heat conduction and heat dissipation mechanism 100 is provided with a base frame 110, and the base frame 110 is provided with a heat conduction groove 115, and a heat conduction filling body 120 is arranged in the heat conduction groove 115. The heat conduction groove 115 opens at the first side 111 of the base frame 110, and the heat conduction filling body 120 can quickly conduct the heat generated by the device connected to the first side 111. The base frame 110 is also provided with a convection heat dissipation hole 116, and the convection heat dissipation hole 116 is close to the heat conduction groove 115 and penetrates the base frame 110. The convection heat dissipation hole 116 quickly dissipates the heat conducted by the heat conduction filling body 120 arranged in the heat conduction groove 115 to the external space in the form of air convection, thereby realizing efficient heat dissipation and cooling.

[0062] The above-mentioned heat conduction and heat dissipation mechanism 100 can be combined with the packaging back plate 10 of the photovoltaic module to effectively conduct heat and dissipate heat for the photovoltaic module, thereby reducing the temperature of the photovoltaic module and facilitating improving the photoelectric conversion efficiency of the photovoltaic module.

[0063] In one example, the base frame 110 is a plate-like structure. The first side 111 and the second side 112 are two side panels of the plate-like structure respectively. The plate-like base frame 110 can better fit on the back plate of the photovoltaic module. Further, the base frame 110 is a rectangular plate-like structure.

[0064] In one example, the thickness of the base frame 110 is 80 mm to 95 mm. For example, the thickness of the base frame 110 is 80 mm, 82 mm, 84 mm, 86 mm, 88 mm, 90 mm, 92 mm, 94 mm, 95 mm, etc.

[0065] Optionally, the number of the heat conducting grooves 115 is not limited to only one, and there may be multiple heat conducting grooves 115. For example, the base frame 110 is provided with multiple heat conducting grooves 115 distributed in an array.

[0066] In one example, the depth of the heat conducting groove 115 is 4 mm to 6 mm. For example, the depth of the heat conducting groove 115 is 4 mm, 4.5 mm, 5 mm, 5.5 mm, 6 mm, etc.

[0067] In one example, the convection heat dissipation hole 116 is a linear hole. Further, the convection heat dissipation hole 116 is a linear hole.

[0068] Optionally, the number of the convection heat dissipation holes 116 is not limited to only one, and there may be more than one. When there are more than one convection heat dissipation holes 116, preferably, the extension directions of the convection heat dissipation holes 116 are consistent.

[0069] In one example, the convection heat dissipation holes 116 are located outside the bottom wall of the heat-conducting groove 115 , that is, the convection heat dissipation holes 116 are located between the bottom wall of the heat-conducting groove 115 and the second side 112 of the base frame 110 .

[0070] In addition, the convection heat dissipation holes 116 may also be located outside the side wall of the heat conducting groove 115 , that is, the highest height of the convection heat dissipation holes 116 is not lower than the height of the bottom wall of the heat conducting groove 115 .

[0071] The convection heat dissipation holes 116 may also be partially located on the outside of the bottom wall of the heat-conducting groove 115, and partially located on the outside of the side wall of the heat-conducting groove 115. When there are multiple convection heat dissipation holes 116, some of the convection heat dissipation holes 116 may be located on the outside of the bottom wall of the heat-conducting groove 115, and some of the convection heat dissipation holes 116 may be located on the outside of the side wall of the heat-conducting groove 115.

[0072] Further combined with FIG. 3 , in one example, the aperture of one end opening of the convection heat dissipation hole 116 is larger than the aperture of the other end opening. For example, the aperture of the first opening end 1161 of the convection heat dissipation hole 116 is larger than the aperture of the second opening end 1162. According to Bernoulli's principle, the gas flow rate is slow and the air pressure is small at a large aperture, and the gas flow rate is fast and the air pressure is high at a small aperture. By setting the aperture of one end opening of the convection heat dissipation hole 116 to be larger than the aperture of the other end opening, the air pressure difference is used to achieve rapid convection of the airflow, quickly take away the heat, and achieve more efficient heat dissipation.

[0073] Furthermore, in one example, the aperture of the convection heat dissipation hole 116 gradually narrows from one end opening to the other end opening. For example, the aperture of the convection heat dissipation hole 116 gradually narrows from the first opening end 1161 to the second opening end 1162. In this way, the rapid convection of air can be better achieved. Optionally, the aperture of the convection heat dissipation hole 116 gradually narrows, or it can be a continuous gradual narrowing.

[0074] In one example, the larger end opening of the convection heat dissipation hole 116, for example, the aperture of the first opening end 1161 is 35 mm to 40 mm. For example, the aperture of the first opening end 1161 is 35 mm, 36 mm, 37 mm, 38 mm, 39 mm, 40 mm, etc.

[0075] In one example, the diameter of the smaller end opening of the convection heat dissipation hole 116, such as the second opening end 1162, is 10 mm to 15 mm. For example, the diameter of the second opening end 1162 is 10 mm, 11 mm, 12 mm, 13 mm, 14 mm, 15 mm, etc.

[0076] In one example, the length of the convection heat dissipation hole 116 is 1200 mm to 1400 mm. Further, the length of the convection heat dissipation hole 116 is 1270 mm to 1330 mm.

[0077] In one example, the material of the base frame 110 is an organic polymer, such as but not limited to epoxy resin. The type of epoxy resin may be but not limited to one or more of glycidyl ether epoxy resin, glycidyl ester epoxy resin, linear aliphatic epoxy resin, and alicyclic epoxy resin.

[0078] In one example, the thermally conductive filler 120 contains the following components in parts by weight:

[0079] 60-70 parts of epoxy resin, 5-10 parts of a first silane coupling agent, 1-5 parts of a first dispersant, 1-5 parts of a first antioxidant and 5-23 parts of a first thermally conductive particle.

[0080] In the above-mentioned thermally conductive filler 120, epoxy resin is used as the base material, which can make the thermally conductive filler 120 have good weather resistance and excellent reliability, and can stabilize the metal filler and prevent it from precipitation.

[0081] In one example, the thermally conductive filler 120 and the base frame 110 both use epoxy resin as the base material, which has good interface compatibility and can be well integrated. In addition, the thermal conductivity of epoxy resin can reach up to 0.4 W / (m*k), and has excellent thermal conductivity.

[0082] Optionally, the type of epoxy resin may be, but is not limited to, one or more of glycidyl ether epoxy resin, glycidyl ester epoxy resin, linear aliphatic epoxy resin, and alicyclic epoxy resin. In one example, the type of epoxy resin is glycidyl ether epoxy resin. This type of resin has a longer molecular chain, and after cross-linking and curing, the mesh density is higher, which can better lock the thermal conductive filler.

[0083] The epoxy resin is used in an amount of 60-70 parts by weight. Further, the epoxy resin is used in an amount of 62-68 parts by weight. Exemplarily, the epoxy resin may be used in an amount of, but not limited to, 60 parts, 61 parts, 62 parts, 63 parts, 64 parts, 65 parts, 66 parts, 67 parts, 68 parts, 69 parts, 70 parts, etc.

[0084] In the thermally conductive filler 120 , a first silane coupling agent is added to better compound the organic substance and the inorganic substance.

[0085] Optionally, the first silane coupling agent may be, but is not limited to, one or more of vinyl triethoxy silane, vinyl trimethoxy silane, and vinyl tri(β-methoxyethoxy) silane.

[0086] For every 60-70 parts of epoxy resin, 5-10 parts by weight of the first silane coupling agent are used. Further, the amount of the first silane coupling agent is 6-8 parts by weight. Exemplarily, the amount of the first silane coupling agent can be, but is not limited to, 5 parts, 5.5 parts, 6 parts, 6.5 parts, 7 parts, 7.5 parts, 8 parts, 9 parts, 9.5 parts, 10 parts, etc.

[0087] A first dispersant is added into the thermally conductive filler 120 , and the first dispersant is, for example, polyacrylamide.

[0088] For every 60-70 parts of epoxy resin, 1-5 parts by weight of the first dispersant are used. Further, the amount of the first dispersant is 2-4 parts by weight. Exemplarily, the amount of the first dispersant can be, but is not limited to, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, etc.

[0089] A first antioxidant is added to the thermally conductive filler 120 , and the first antioxidant is, for example, catechol.

[0090] For every 60-70 parts of epoxy resin, 1-5 parts by weight of the first antioxidant is used. Further, the amount of the first antioxidant is 2-4 parts by weight. Exemplarily, the amount of the first antioxidant can be, but is not limited to, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, etc.

[0091] In the above-mentioned thermally conductive filler 120, first thermally conductive particles are added, and the first thermally conductive particles are dispersed in the epoxy resin matrix. The first thermally conductive particles are made of a particle material with a relatively high thermal conductivity, for example, the thermal conductivity of the first thermally conductive particles is above 1.5 W / m·K. In one example, the thermal conductivity of the first thermally conductive particles is 1.5-500 W / m·K.

[0092] In one example, the material of the first thermally conductive particles may be, but is not limited to, one or more of silicon dioxide, copper powder, aluminum oxide, boron nitride, and the like.

[0093] For every 60-70 parts of epoxy resin, 5-23 parts by weight of the first thermally conductive particles are used. Further, the amount of the first thermally conductive particles is 10-18 parts by weight. Exemplarily, the amount of the first thermally conductive particles can be, but is not limited to, 5 parts, 7 parts, 9 parts, 11 parts, 13 parts, 15 parts, 17 parts, 19 parts, 21 parts, 23 parts, etc.

[0094] In one example, the particle size of the first thermally conductive particles is 1-50 μm. For example, the particle size of the first thermally conductive particles is 1 μm, 5 μm, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, etc., or a range between any two of the above values.

[0095] In one example, the first thermally conductive particles include: 2-8 parts of silicon dioxide, 1-5 parts of copper powder, 1-5 parts of aluminum oxide, and 1-5 parts of boron nitride. The first thermally conductive particles can achieve good thermal conductivity and low cost.

[0096] Further, the amount of silicon dioxide is 4-6 parts by weight. For example, the amount of silicon dioxide can be, but is not limited to, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, 5.5 parts, 6 parts, 6.5 parts, 7 parts, 7.5 parts, 8 parts, etc.

[0097] Further, the amount of copper powder is 2-4 parts by weight. For example, the amount of copper powder can be, but is not limited to, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, etc.

[0098] Further, the amount of aluminum oxide is 2-4 parts by weight. For example, the amount of aluminum oxide can be, but is not limited to, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, etc.

[0099] Further, the amount of boron nitride is 2-4 parts by weight. For example, the amount of boron nitride can be, but is not limited to, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, etc.

[0100] A first ultraviolet absorber is added to the thermally conductive filler 120 to improve the weather resistance of the thermally conductive filler 120 .

[0101] The type of the first ultraviolet absorber may be, but is not limited to, a triazine ultraviolet absorber.

[0102] For every 60-70 parts of epoxy resin, 1-5 parts by weight of the first ultraviolet absorber is used. Further, the amount of the first ultraviolet absorber is 2-4 parts by weight. Exemplarily, the amount of the first ultraviolet absorber can be, but is not limited to, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, etc.

[0103] In one example, the method for preparing the thermally conductive filler 120 includes the following steps:

[0104] The epoxy resin, the first silane coupling agent, the first dispersant, the first antioxidant and the first thermally conductive particles are mixed uniformly.

[0105] Furthermore, the present invention also provides a packaging back plate 10 of a photovoltaic module.

[0106] As shown in FIG4 , a photovoltaic module encapsulation backplane 10 according to an embodiment includes a backplane substrate 200 and any of the above-mentioned heat conduction and heat dissipation mechanisms 100 , wherein the first side 111 of the base frame 110 is connected to the backplane substrate 200 .

[0107] The packaging back plate 10 of the above-mentioned photovoltaic module is provided with a heat conduction and heat dissipation mechanism 100 on the back plate substrate 200, and the heat conduction and heat dissipation mechanism 100 is provided with a base frame 110, and the base frame 110 is provided with a heat conduction groove 115, and a heat conduction filling body 120 is provided in the heat conduction groove 115. The heat conduction groove 115 opens at the first side 111 of the base frame 110, and the first side 111 of the base frame 110 is connected to the back plate substrate 200. The heat conduction filling body 120 can quickly conduct the heat of the photovoltaic module 1. The base frame 110 is also provided with a convection heat dissipation hole 116, and the convection heat dissipation hole 116 is close to the heat conduction groove 115 and penetrates the base frame 110. The convection heat dissipation hole 116 quickly dissipates the heat conducted by the heat conduction filling body 120 set in the heat conduction groove 115 to the external space in the form of air convection, so as to achieve efficient heat dissipation and cooling. The heat conduction and heat dissipation mechanism 100 can effectively conduct heat and dissipate heat for the photovoltaic module 1 , thereby reducing the temperature of the photovoltaic module 1 , which is beneficial to improving the photoelectric conversion efficiency of the photovoltaic module 1 .

[0108] As shown in FIG. 4 , in one example, the packaging backplane 10 further includes an adhesive layer 300 , and the adhesive layer 300 is disposed between the backplane substrate 200 and the heat-conducting heat dissipation mechanism 100 .

[0109] The material of the adhesive layer 300 may be, but is not limited to, epoxy resin, and the type of epoxy resin may be, but is not limited to, one or more of glycidyl ether epoxy resin, glycidyl ester epoxy resin, linear aliphatic epoxy resin, and alicyclic epoxy resin.

[0110] As shown in Fig. 4, in one example, the packaging backplane 10 further includes a thermal conductive coating 400, which is disposed on a side of the backplane substrate 200 away from the thermal conductive heat dissipation mechanism 100. The thermal conductive coating 400 is disposed on a side of the backplane substrate 200 away from the thermal conductive heat dissipation mechanism 100, which can improve the heat dissipation efficiency of the solar cell.

[0111] In one example, the thermal conductive coating 400 contains the following components in parts by weight:

[0112] 55-60 parts of acrylic resin, 2-6 parts of curing agent, 5-10 parts of second silane coupling agent, 1-5 parts of second dispersant, 1-5 parts of second antioxidant and 5-23 parts of second thermal conductive particles.

[0113] In the above-mentioned thermal conductive coating 400, acrylic resin is used as the base material, which can make the thermal conductive coating 400 have excellent weather resistance, UV resistance and adhesion performance, and the coating has good film-forming performance.

[0114] The amount of acrylic resin used is 55-60 parts by weight. Further, the amount of acrylic resin used is 56-58 parts by weight. Exemplarily, the weight parts of acrylic resin can be but not limited to 55 parts, 55.5 parts, 56 parts, 56.5 parts, 57 parts, 57.5 parts, 58 parts, 58.5 parts, 59 parts, 59.5 parts, 60 parts, etc.

[0115] A curing agent is added to the thermal conductive coating 400 to cross-link and cure the acrylic resin.

[0116] The type of curing agent may be, but is not limited to, isocyanate. The reaction of acrylic acid and isocyanate curing agent can make the thermal conductive coating 400 have excellent weather resistance, UV resistance and adhesion performance, and the coating has good film-forming performance. Isocyanate may be, but is not limited to, one or more of HDI, MDI, and TDI.

[0117] For every 60-70 parts of acrylic resin, 2-6 parts by weight of curing agent are used. Further, the amount of the second dispersant is 3-5 parts by weight. Exemplarily, the amount of the second dispersant can be, but is not limited to, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, 5.5 parts, 6 parts, etc.

[0118] In the thermal conductive coating 400 , a second silane coupling agent is added to better compound the organic substance and the inorganic substance.

[0119] Optionally, the second silane coupling agent may be, but is not limited to, one or more of vinyl triethoxy silane, vinyl trimethoxy silane, and vinyl tri(β-methoxyethoxy) silane.

[0120] For every 60-70 parts of acrylic resin, 5-10 parts by weight of the second silane coupling agent are used. Further, the amount of the second silane coupling agent is 6-8 parts by weight. Exemplarily, the amount of the second silane coupling agent can be, but is not limited to, 5 parts, 5.5 parts, 6 parts, 6.5 parts, 7 parts, 7.5 parts, 8 parts, 9 parts, 9.5 parts, 10 parts, etc.

[0121] A second dispersant is added to the thermal conductive coating 400 , and the second dispersant is, for example, polyacrylamide.

[0122] For every 60-70 parts of epoxy resin, 1-5 parts by weight of the second dispersant is used. Further, the amount of the second dispersant is 2-4 parts by weight. Exemplarily, the amount of the second dispersant can be, but is not limited to, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, etc.

[0123] A second antioxidant is added to the thermal conductive coating 400 , and the second antioxidant is, for example, catechol.

[0124] For every 60-70 parts of epoxy resin, 1-5 parts by weight of the second antioxidant is used. Further, the amount of the second antioxidant is 2-4 parts by weight. Exemplarily, the amount of the second antioxidant can be, but is not limited to, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, etc.

[0125] In the above-mentioned thermal conductive coating 400, second thermal conductive particles are added, and the second thermal conductive particles are dispersed in the epoxy resin matrix. The second thermal conductive particles are made of a particle material with a relatively high thermal conductivity, for example, the thermal conductivity of the second thermal conductive particles is above 1.5 W / (m*k). In one example, the thermal conductivity of the second thermal conductive particles is 1.5 W / m·K~500 W / m·K.

[0126] In one example, the material of the second thermally conductive particles may be, but is not limited to, one or more of silicon dioxide, copper powder, aluminum oxide, boron nitride, and the like.

[0127] For every 60-70 parts of epoxy resin, 5-23 parts by weight of the second thermally conductive particles are used. Further, the amount of the second thermally conductive particles is 10-18 parts by weight. Exemplarily, the amount of the second thermally conductive particles can be, but is not limited to, 5 parts, 7 parts, 9 parts, 11 parts, 13 parts, 15 parts, 17 parts, 19 parts, 21 parts, 23 parts, etc.

[0128] In one example, the particle size of the second thermally conductive particles is 5-50 μm. For example, the particle size of the second thermally conductive particles is 1 μm, 5 μm, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, etc., or a range between any two of the above values.

[0129] In one example, the second thermally conductive particles include: 2-8 parts of silicon dioxide, 1-5 parts of copper powder, 1-5 parts of aluminum oxide, and 1-5 parts of boron nitride. The second thermally conductive particles can achieve good thermal conductivity and low cost.

[0130] Further, the amount of silicon dioxide is 4-6 parts by weight. For example, the amount of silicon dioxide can be, but is not limited to, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, 5.5 parts, 6 parts, 6.5 parts, 7 parts, 7.5 parts, 8 parts, etc.

[0131] Further, the amount of copper powder is 2-4 parts by weight. For example, the amount of copper powder can be, but is not limited to, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, etc.

[0132] Further, the amount of aluminum oxide is 2-4 parts by weight. For example, the amount of aluminum oxide can be, but is not limited to, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, etc.

[0133] Further, the amount of boron nitride is 2-4 parts by weight. For example, the amount of boron nitride can be, but is not limited to, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, etc.

[0134] A second ultraviolet absorber is added to the thermal conductive coating 400 to improve the weather resistance of the thermal conductive coating 400 .

[0135] The second ultraviolet absorber may be, but is not limited to, a triazine ultraviolet absorber, such as one or more of 2-[4,6-bis(2,4-xylyl)-1,3,5-triazine-2-yl]-5-(octyloxy)phenol and 2-(2'-hydroxyphenyl)-1,3,5-triazine.

[0136] For every 60-70 parts of epoxy resin, 1-5 parts by weight of the second ultraviolet absorber is used. Further, the amount of the second ultraviolet absorber is 2-4 parts by weight. Exemplarily, the amount of the second ultraviolet absorber can be, but is not limited to, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, etc.

[0137] In one example, the method for preparing the thermal conductive coating 400 includes the following steps:

[0138] The acrylic resin, the curing agent, the second silane coupling agent, the second dispersant, the second antioxidant and the second thermally conductive particles are mixed evenly.

[0139] Optionally, the material of the backplane substrate 200 is an organic polymer, for example, it may be but is not limited to one or more of PET (polyethylene terephthalate), PA (polyamide), and PO (polyolefin).

[0140] Furthermore, the present invention also provides a method for preparing the packaging backplane 10 of any of the above-mentioned examples of photovoltaic modules.

[0141] The method for preparing the encapsulation back sheet 10 of a photovoltaic module according to an embodiment includes the following steps:

[0142] Step S1, prepare a base frame 110, the base frame 110 has a first side 111, the base frame 110 is provided with a heat conducting groove 115 and a convection heat dissipation hole 116, the heat conducting groove 115 opens at the first side 111 of the base frame 110, and the convection heat dissipation hole 116 is close to the heat conducting groove 115 and passes through the base frame 110.

[0143] Step S2 , disposing a heat-conducting filling body 120 in the heat-conducting groove 115 to obtain a heat-conducting heat dissipation mechanism 100 .

[0144] Step S3 , compounding the heat-conducting and heat-dissipating structure 100 with the backplane substrate 200 , connecting the first side 111 of the base frame 110 with the backplane substrate 200 , and obtaining the packaged backplane 10 .

[0145] In one example, the backplane substrate 200 and the heat-conducting heat dissipation mechanism 100 are connected via an adhesive layer 300 .

[0146] In one example, the method for preparing the encapsulation back sheet 10 of the photovoltaic module further includes the following steps:

[0147] Step S4 , disposing a thermal conductive coating 400 on a side of the backplane substrate 200 away from the thermal conductive heat dissipation mechanism 100 .

[0148] As shown in FIG5 , in one example, the material strip of the backplane substrate 200 is conveyed by a conveying roller assembly 7. At the first station 71, a thermal conductive coating 400 is coated on one side of the material strip of the backplane substrate 200. At the second station 72, the thermal conductive coating 400 is heated, dried and cured. At the third station 73, an adhesive layer 300 is coated on one side of the material strip of the backplane substrate 200. At the fourth station 74, the material strip of the backplane substrate 200 is bonded to the thermal conductive heat dissipation mechanism 100 via the adhesive layer 300. At the fifth station 75, the adhesive layer 300 is heated, dried and cured to obtain the packaging backplane 10 and is rolled up.

[0149] At present, the backsheet structure of conventional photovoltaic modules is basically compounded with fluorine-containing materials. During the backsheet waste treatment process, there is a risk of fluorine pollution. The above-mentioned packaging backsheet 100 preferably uses fluorine-free materials, which can have a good heat dissipation and cooling effect, avoiding the risk of fluorine pollution.

[0150] In addition, the material cost of the above-mentioned packaging backplane 100 is relatively low, which is conducive to large-scale application.

[0151] Furthermore, the present invention also provides a photovoltaic module.

[0152] As shown in FIG. 6 , a photovoltaic assembly 1 according to an embodiment includes a packaging panel 20 , a solar cell 30 , and a packaging backplane 10 according to any one of the above examples.

[0153] The solar cell 30 is disposed between the packaging panel 20 and the packaging backplane 10. The heat conduction and heat dissipation mechanism 100 is located on a side of the backplane substrate 200 away from the solar cell 30.

[0154] Exemplarily, the packaging panel 20 may be made of, but not limited to, glass or the like.

[0155] For example, the solar cell 30 may be, but is not limited to, a HJT cell, a TOPCon cell, a PERC cell, a perovskite cell, etc. There may be a plurality of solar cells 30, and the plurality of solar cells 30 are conductively connected via welding strips.

[0156] In one example, the photovoltaic module 1 further includes a first encapsulation film 40, which is disposed between the encapsulation panel 20 and the solar cell 30. For example, the first encapsulation film 40 may be, but is not limited to, one or more of polyethylene-polyvinyl acetate copolymer (EVA), polyolefin elastomer (POE), TPO, TPU, and PVB. The first encapsulation film 40 may be a single layer or a multi-layer laminate.

[0157] In one example, the photovoltaic module 1 further includes a second encapsulation film 50, which is disposed between the solar cell 30 and the encapsulation backplane 10. For example, the second encapsulation film 50 may be, but is not limited to, one or more of EVA, POE, TPO, TPU, and PVB. The second encapsulation film 50 may be a single layer or a multi-layer laminate.

[0158] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0159] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A heat conduction and heat dissipation mechanism, characterized in that: The invention comprises a base frame and a heat-conducting filling body, wherein the base frame is provided with a heat-conducting groove and a convection heat-dissipating hole, wherein the heat-conducting groove opens at a first side of the base frame, the heat-conducting filling body is arranged in the heat-conducting groove, the convection heat-dissipating hole is close to the heat-conducting groove and penetrates the base frame, the base frame has a second side arranged opposite to the first side, and both ends of the convection heat-dissipating hole are respectively opened at the end of the base frame located between the first side and the second side.

2. The heat conduction and heat dissipation mechanism according to claim 1, characterized in that: The convection heat dissipation holes are located on the outer side of the side wall and / or the outer side of the bottom wall of the heat conduction groove.

3. The heat conduction and heat dissipation mechanism according to claim 1 or 2, characterized in that: The aperture of one end opening of the convection heat dissipation hole is larger than the aperture of the other end opening.

4. The heat conduction and heat dissipation mechanism according to claim 3, characterized in that: The diameter of the convection heat dissipation hole gradually narrows from one end opening to the other end opening.

5. The heat conduction and heat dissipation mechanism according to claim 4, characterized in that: The diameter of the opening at the larger end of the convection heat dissipation hole is 35 mm to 40 mm, and the diameter of the opening at the smaller end is 10 mm to 15 mm.

6. The heat conduction and heat dissipation mechanism according to claim 1, 2, 4 or 5, characterized in that: The base frame has at least one of the following features (1) to (3): (1) There are multiple heat conduction grooves; (2) There are multiple convection heat dissipation holes; (3) The depth of the heat conduction groove is 4 mm to 6 mm.

7. The heat conduction and heat dissipation mechanism according to claim 1, 2, 4 or 5, characterized in that: The base frame is a plate-like structure, and the first side is one side surface of the plate-like structure.

8. The heat conduction and heat dissipation mechanism according to claim 1, 2, 4 or 5, characterized in that: The thermally conductive filler contains the following components in parts by weight: 60-70 parts of epoxy resin, 5-10 parts of a first silane coupling agent, 1-5 parts of a first dispersant, 1-5 parts of a first antioxidant and 5-23 parts of a first thermally conductive particle.

9. The heat conduction and heat dissipation mechanism according to claim 8, characterized in that: The thermally conductive filler has at least one of the following characteristics (1) to (5): (1) The first silane coupling agent is selected from one or more of vinyl triethoxysilane, vinyl trimethoxysilane, and vinyl tri(β-methoxyethoxy)silane; (2) The thermal conductivity of the first thermally conductive particles is greater than 1.5 W / (m*k); (3) The material of the first thermally conductive particles is selected from one or more of silicon dioxide, copper powder, aluminum oxide, boron nitride, etc.; (4) The first thermally conductive particles include 2-8 parts of silicon dioxide, 1-5 parts of copper powder, 1-5 parts of aluminum oxide and 1-5 parts of boron nitride; (5) The thermally conductive filler also contains 1-5 parts of a first ultraviolet absorber.

10. A packaging back sheet of a photovoltaic module, characterized in that: It comprises a backplane substrate and the heat-conducting and heat-dissipating mechanism according to any one of claims 1 to 9, wherein the first side of the base frame is connected to the backplane substrate.

11. The packaging backplane according to claim 10, characterized in that: The packaging backplane has at least one of the following features (1) to (2): (1) The packaging backplane further comprises an adhesive layer, wherein the adhesive layer is disposed between the backplane substrate and the heat conduction and heat dissipation mechanism; (2) The packaging backplane also includes a thermal conductive coating, which is disposed on a side of the backplane substrate away from the thermal conductive heat dissipation mechanism.

12. The packaging backplane according to claim 11, characterized in that: The thermal conductive coating contains the following components in parts by weight: 55-60 parts of acrylic resin, 2-6 parts of curing agent, 5-10 parts of second silane coupling agent, 1-5 parts of second dispersant, 1-5 parts of second antioxidant and 5-23 parts of second thermal conductive particles.

13. The packaging backplane according to claim 12, characterized in that: The thermal conductive coating has at least one of the following characteristics (1) to (5): (1) The second silane coupling agent is selected from one or more of vinyl triethoxy silane, vinyl trimethoxy silane, and vinyl tri(β-methoxyethoxy) silane; (2) The thermal conductivity of the second thermally conductive particles is greater than 1.5 W / (m*k); (3) The material of the second thermally conductive particles is selected from one or more of silicon dioxide, copper powder, aluminum oxide, boron nitride, etc.; (4) The second thermally conductive particles include 2-8 parts of silicon dioxide, 1-5 parts of copper powder, 1-5 parts of aluminum oxide and 1-5 parts of boron nitride; (5) The thermally conductive filler also contains 1-5 parts of a second ultraviolet absorber.

14. The packaging backplane according to any one of claims 10 to 13, characterized in that: The packaging backplane has at least one of the following features (1) to (2): (1) The material of the base frame includes epoxy resin; (2) The material of the backplane substrate includes one or more of PET, PA, and PO.

15. A method for preparing a packaging back sheet of a photovoltaic module, characterized in that: The following steps are involved: Prepare a base frame, the base frame having a first side, the base frame being provided with a heat conduction groove and a convection heat dissipation hole, the heat conduction groove opening at the first side, the convection heat dissipation hole being close to the heat conduction groove and penetrating the base frame, the base frame having a second side arranged opposite to the first side, and two ends of the convection heat dissipation hole opening at ends of the base frame located between the first side and the second side respectively; A heat-conducting filling body is arranged in the heat-conducting groove to obtain a heat-conducting and heat-dissipating mechanism; The heat conduction and heat dissipation mechanism is compounded with a backplane substrate, and the first side of the base frame is connected to the backplane substrate to obtain a packaging backplane.

16. A photovoltaic module, characterized in that: It comprises a packaging panel, a solar cell and a packaging backplane as described in any one of claims 10 to 14 or a packaging backplane prepared by the preparation method described in claim 15, wherein the solar cell is arranged between the packaging panel and the packaging backplane, and the heat conduction and heat dissipation mechanism is located on the side of the backplane substrate away from the solar cell.

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