Light emitting diode packaging equipment

Abstract

The present invention belongs to the technical field of light emitting diode packaging, and specifically is a light emitting diode packaging device, comprising a baking mechanism, which is placed on a desktop and is used to bake and solidify a colloid. A clamping component is installed at the front end of the baking mechanism, and a lamp holder mold mechanism is clamped inside the clamping component. Pressing and adjusting mechanisms are installed at the left and right ends of the clamping component. The present invention can reduce the tools and equipment in the traditional light emitting diode packaging steps, and at the same time, can make crystal expansion, crystal bonding, wire welding, glue dispensing and curing unified operations on one device, which not only reduces the existing operation steps and simplifies the light emitting diode packaging, but also improves the working efficiency of the light emitting diode packaging.

Description

Technical Field

[0001] The invention relates to the technical field of light emitting diode packaging, in particular to a light emitting diode packaging device. Background Art

[0002] The specific operation steps of existing light-emitting diode packaging are as follows:

[0003] Crystal expansion: Fix the LED chip with a crystal expansion ring and expand it to a suitable size to facilitate subsequent crystal bonding operations.

[0004] Die bonding: Use a die bonding machine to fix the LED chip on the bracket or substrate. The chip is usually glued to the bracket with silver glue or insulating glue to ensure the stability and electrical connection of the chip.

[0005] Wire bonding: Use metal wires (such as gold wire or aluminum wire) to connect the chip's electrodes to the pads on the bracket or substrate to achieve electrical conduction. This step is usually completed using an automatic wire bonding machine to ensure the accuracy and consistency of welding.

[0006] Glue dispensing: Apply a layer of encapsulation glue around the chip and the bonding wire to protect the chip and the bonding wire from the external environment. The encapsulation glue usually has good insulation, heat resistance and moisture resistance. The dispensing method can be manual dispensing or automatic dispensing.

[0007] Curing: Put the dispensed LED into the oven for curing, so that the encapsulation glue solidifies and forms a strong bond with the chip and the bracket. The curing temperature and time depend on the type and requirements of the encapsulation glue.

[0008] Testing: Conduct electrical and optical tests on the cured LED to ensure that its performance meets the requirements. Electrical testing includes testing parameters such as the forward voltage, reverse current and luminous intensity of the LED; optical testing includes testing parameters such as the luminous wavelength, color and brightness of the LED.

[0009] Cutting: Cut the qualified LEDs from the substrate to form individual LED devices. The cutting method can be manual cutting or automatic cutting.

[0010] Packaging: The cut LED devices are packaged to protect them from the external environment and facilitate transportation and storage. The packaging can be in bags, tubes or trays.

[0011] When operating according to the existing light-emitting diode packaging, the required steps are extremely cumbersome, and a wide variety of equipment and tools are used. In addition, in the dispensing and curing steps, the lamp holder needs to be placed in a mold for dispensing, and finally transferred to an oven for curing. However, during this transfer process, it is easy to cause problems with the dispensing accuracy, causing the glue to overflow, so that the dispensing part does not have enough glue, resulting in insufficient glue, thereby causing abnormalities such as insufficient chip thrust, affecting the packaging quality.

[0012] To this end, we propose a light emitting diode packaging device. Summary of the invention

[0013] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0014] A light emitting diode packaging device, comprising: a baking mechanism;

[0015] The baking mechanism is placed on the desktop, and is used to bake and solidify the colloid. A clamping assembly is installed at the front end of the baking mechanism, and the lamp holder mold mechanism is clamped inside the clamping assembly. Pressing and adjusting mechanisms are installed on the left and right ends of the clamping assembly, and the inner end of the pressing and adjusting mechanism contacts the outer end of the lamp holder mold mechanism. The inside of the lamp holder mold mechanism clamps the lamp holder assembly, and the pressing and adjusting mechanism cooperates with the lamp holder mold mechanism to perform lifting and lowering operations on the lamp holder assembly.

[0016] As a preferred solution of the light emitting diode packaging equipment described in the present invention, wherein: the baking mechanism comprises: a baking component;

[0017] The baking component is placed on the desktop, and the surface of the baking component is connected to the transfer component.

[0018] As a preferred solution of the light emitting diode packaging equipment described in the present invention, the baking assembly comprises: a bottom plate;

[0019] The bottom plate is placed on the table, the surface of the bottom plate is rotatably connected to the first screw rod, a first motor is installed in the middle of the front end of the bottom plate, the output end of the first motor is connected to a plurality of groups of first screw rods through a sprocket and a chain transmission, and an oven is installed at the rear end of the bottom plate;

[0020] The transfer assembly includes: a lifting platform;

[0021] Threaded blocks are installed at the front and rear ends of the bottom of the lifting platform, the threaded blocks are slidably connected to the surface of the bottom plate, the inside of the threaded blocks is threadedly connected to the first screw, the top of the lifting platform is connected to the installation box, the inside of the installation box is rotatably connected to the first bidirectional screw, the rear side port of the first bidirectional screw is connected to the motor, the motor is installed at the rear end of the installation box, the two ends of the first bidirectional screw are threadedly connected to the two sets of clamping blocks, and the clamping blocks are slidably connected to the inside of the installation box.

[0022] As a preferred solution of the light emitting diode packaging device described in the present invention, wherein: the clamping assembly comprises: a bracket;

[0023] The bracket is installed on the front end surface of the base plate, and vertical boxes are provided at both ends of the interior of the bracket. A second motor is installed at the front end of the vertical box. The interior of the vertical box is rotatably connected to the second bidirectional screw, and one end of the second bidirectional screw is connected to the output end of the second motor. The front and rear ends of the second bidirectional screw are threadedly connected to two sets of clamping rods, and the lamp holder mold mechanism can be clamped and fixed by the two sets of clamping rods.

[0024] As a preferred solution of the light emitting diode packaging device described in the present invention, wherein: the pressing and adjusting mechanism comprises: a pressing component;

[0025] The pressing components are installed at the left and right ends of the bracket, and the bottom of the pressing components is installed with an adjusting component.

[0026] As a preferred solution of the light emitting diode packaging equipment described in the present invention, wherein: the pressing component comprises: a hydraulic cylinder;

[0027] The hydraulic cylinder is installed on the top of the vertical box, the output end of the hydraulic cylinder is connected to the movable rod, the two ends of the movable rod are rotatably connected to the upper end of the swing rod, the lower end of the swing rod is connected to the outer end of the first shaft rod, and the first shaft rod is rotatably connected to the bottom of the bracket.

[0028] As a preferred solution of the light emitting diode packaging device described in the present invention, wherein: the adjustment component comprises: an adjustment plate;

[0029] The adjusting plate is installed at the bottom of the first shaft rod, and hollow boxes are installed at both ends of the adjusting plate. An L-shaped plate is installed on the outer wall of the hollow box. The inside of the hollow box is rotatably connected to the first gear, and the outer wall of the hollow box is rotatably connected to the second shaft rod. The two ends of the outer wall of the second shaft rod are connected to the second gear, and the second gear is meshed with the first gear. A third motor is installed on the outer wall of the L-shaped plate, and the output end of the third motor is connected to the second shaft rod.

[0030] As a preferred solution of the light emitting diode packaging equipment described in the present invention, wherein: the lamp holder mold mechanism comprises: a lamp holder mold assembly;

[0031] The upper end of the outer wall of the lamp holder mold assembly is clamped by the clamping rod, the interior of the lamp holder mold assembly clamps the lamp holder assembly, and the two ends of the interior of the lamp holder mold assembly are slidably connected to the ejection assembly, and the ejection assembly contacts the first gear.

[0032] As a preferred solution of the light emitting diode packaging equipment described in the present invention, wherein: the lamp holder mold assembly comprises: a lamp holder mold;

[0033] The upper end of the outer wall of the lamp holder mold is clamped by a clamping rod, and U-shaped plates are arranged at both ends of the lamp holder mold, the outer ends of the U-shaped plates are in contact with the L-shaped plates, and sliding grooves are arranged at both ends of the U-shaped plates;

[0034] The ejection assembly comprises: a gear rod;

[0035] The middle two ends of the gear rod are provided with protrusions, which are slidably connected to the inside of the slide groove. The outer wall of the gear rod is meshed with the first gear. The bottom of the gear rod is provided with a top plate, and the top of the top plate contacts the bottom of the lamp frame assembly.

[0036] As a preferred solution of the light emitting diode packaging device described in the present invention, wherein: the lamp holder assembly comprises: a lamp holder;

[0037] The lamp holder is clamped by a lamp holder mold, a first step surface is provided on the outer side of the top of the lamp holder, a second step surface is provided on the inner side of the first step surface, a first welding point is provided on the surface of the second step surface, a third step surface is provided on the inner side of the second step surface, a baffle is provided on the outer end of the third step surface, and a second welding point is provided on the surface of the third step surface.

[0038] Compared with existing technologies:

[0039] Through the cooperation of the baking mechanism, the clamping assembly, the pressing and adjusting mechanism and the lamp holder mold mechanism, the tools and equipment in the traditional light-emitting diode packaging steps can be reduced. At the same time, the crystal expansion, crystal bonding, wire bonding, glue dispensing and curing can be uniformly operated on one device, which not only reduces the existing operation steps and simplifies the light-emitting diode packaging, but also improves the working efficiency of the light-emitting diode packaging.

[0040] Through the cooperation between the lamp holder mold mechanism and the lamp holder assembly, the placement position of the chip can be limited. At the same time, the dispensing of the chip can be limited and blocked to prevent the colloid from overflowing, increase the viscosity of the chip, and increase the bottom friction of the colloid to prevent the colloid from overflowing or shifting during transfer. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 A schematic diagram of the overall main structure provided by the present invention;

[0042] Figure 2 A schematic diagram of the baking mechanism structure provided by the present invention;

[0043] Figure 3 A schematic diagram of the opening and closing structure of the baking mechanism provided by the present invention;

[0044] Figure 4 A schematic diagram of the transfer assembly structure provided by the present invention;

[0045] Figure 5A schematic diagram of the disassembled structure of the clamping assembly, the pressing and adjusting mechanism and the lamp holder mold mechanism provided by the present invention;

[0046] Figure 6 A schematic diagram of the structure of the clamping assembly provided by the present invention;

[0047] Figure 7 A right side structural schematic diagram of the pressing and adjusting mechanism provided by the present invention;

[0048] Figure 8 A schematic diagram of the structure of the pressing assembly provided by the present invention;

[0049] Fig. 9 A schematic diagram of the structure of the regulating component provided by the present invention;

[0050] Fig.10 A rear view structural schematic diagram of the adjustment assembly provided by the present invention;

[0051] Fig.11 A schematic diagram of the structure of the lamp stand mold mechanism and the lamp stand assembly provided by the present invention;

[0052] Fig.12 A schematic diagram of the disassembled structure of the lamp holder mold mechanism provided by the present invention;

[0053] Fig.13 This is a schematic structural diagram of a lamp holder assembly provided by the present invention.

[0054] In the figure:

[0055] Baking mechanism 1, baking component 11, bottom plate 111, first screw 112, first motor 113, oven 114, transfer component 12, lifting platform 121, threaded block 122, installation box 123, first bidirectional screw 124, clamping block 125, clamping component 2, bracket 21, vertical box 22, second motor 23, second bidirectional screw 24, clamping rod 25, pressing and adjusting mechanism 3, pressing component 31, hydraulic cylinder 311, movable rod 312, swing rod 313, first shaft rod 314, adjusting component 32, adjustment plate 321, hollow box 322, L-shaped plate 323, first gear 324, second shaft 325, second gear 326, third motor 327, lamp holder mold mechanism 4, lamp holder mold assembly 41, lamp holder mold 411, U-shaped plate 412, slide groove 413, ejection assembly 42, gear rod 421, protrusion 422, top plate 423, lamp holder assembly 5, lamp holder 51, first step surface 52, second step surface 53, first welding point 54, third step surface 55, baffle 56, second welding point 57. DETAILED DESCRIPTION

[0056] In order to make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0057] The present invention provides a light emitting diode packaging device, please refer to Figure 1-Figure 13 , including a baking mechanism 1, a clamping assembly 2, a pressing and adjusting mechanism 3, a lamp holder mold mechanism 4 and a lamp holder assembly 5;

[0058] The baking mechanism 1 is placed on the desktop, and is used to bake and solidify the colloid. The baking mechanism 1 includes: a baking component 11, a bottom plate 111, a first screw 112, a first motor 113, an oven 114, a transfer component 12, a lifting platform 121, a threaded block 122, an installation box 123, a first bidirectional screw 124 and a clamping block 125. The baking component 11 is placed on the desktop, and the baking component 11 can bake and solidify the colloid. The bottom plate 111 is placed on the desktop, and the surface of the bottom plate 111 is rotatably connected to the bottom plate 111. The first screw 112 and the first motor 113 are installed in the middle of the front end of the bottom plate 111. The output end of the first motor 113 is connected to a plurality of groups of first screws 112 through a sprocket and a chain transmission. The first motor 113 can drive the plurality of groups of first screws 112 to rotate. The rear end of the bottom plate 111 is installed with an oven 114. The oven 114 can bake and solidify the colloid. The surface of the baking component 11 is connected to the transfer component 12. The transfer component 12 can clamp the lamp holder mold mechanism 4 after the dispensing. , and move to the interior of the baking component 11 for baking operation, the front and rear ends of the bottom of the lifting platform 121 are installed with threaded blocks 122, the threaded blocks 122 are slidably connected to the surface of the bottom plate 111, the interior of the threaded blocks 122 is threadedly connected to the first screw 112, the rotation of the first screw 112 can drive the lifting platform 121 to move back and forth, thereby driving the lamp holder mold mechanism 4 to transfer, the top of the lifting platform 121 is connected to the installation box 123, the lifting platform 121 can drive the installation box 123 to perform lifting activities, the interior of the installation box 123 is rotatably connected to the first bidirectional screw 124, the rear side port of the first bidirectional screw 124 is connected to the motor, the motor is installed at the rear end of the installation box 123, and the first bidirectional screw 124 can be driven to rotate by the drive of the motor, the two ends of the first bidirectional screw 124 are threadedly connected to two groups of clamping blocks 125, the clamping blocks 125 are slidably connected to the interior of the installation box 123, and the rotation of the first bidirectional screw 124 can enable the two groups of clamping blocks 125 to clamp the lamp holder mold mechanism 4.

[0059] A clamping assembly 2 is installed at the front end of the baking mechanism 1, and the lamp holder mold mechanism 4 is clamped inside the clamping assembly 2. The clamping assembly 2 includes: a bracket 21, a vertical box 22, a second motor 23, a second bidirectional screw 24 and a clamping rod 25. The bracket 21 is installed on the front end surface of the bottom plate 111, and vertical boxes 22 are provided at both ends of the inside of the bracket 21. The front end of the vertical box 22 is installed with a second motor 23, one end of the vertical box 22 is provided with the second motor 23, and the other end of the vertical box 22 is provided with an empty box. The vertical box 22 is connected to the bracket 21 through the second motor 23 and the empty box. The inside of the vertical box 22 is rotatably connected to the second bidirectional screw 24, and one end of the second bidirectional screw 24 is connected to the output end of the second motor 23. The second motor 23 can drive the second bidirectional screw 24 to rotate. The front and rear ends of the second bidirectional screw 24 are threadedly connected to two groups of clamping rods 25, and the lamp holder mold mechanism 4 can be clamped and fixed by the two groups of clamping rods 25.

[0060] The pressing and adjusting mechanism 3 is installed at the left and right ends of the clamping component 2. The pressing and adjusting mechanism 3 includes: a pressing component 31, a hydraulic cylinder 311, a movable rod 312, a swing rod 313, a first shaft rod 314, an adjusting component 32, an adjusting plate 321, a hollow box 322, an L-shaped plate 323, a first gear 324, a second shaft rod 325, a second gear 326 and a third motor 327. The pressing component 31 is installed at the left and right ends of the bracket 21. The pressing component 31 can drive the adjusting component 32 to adjust the lamp holder mold machine. The middle part of the structure 4 is clamped and squeezed, the hydraulic cylinder 311 is installed on the top of the vertical box 22, the output end of the hydraulic cylinder 311 is connected to the movable rod 312, the two ends of the movable rod 312 are rotatably connected to the upper end of the swing rod 313, the lower end of the swing rod 313 is connected to the outer end of the first shaft rod 314, the first shaft rod 314 is rotatably connected to the bottom of the bracket 21, and the swing rod 313 can be driven to move by the drive of the hydraulic cylinder 311, so that the swing rod 313 drives the first shaft rod 314 to rotate, pressing the assembly 31 An adjusting component 32 is installed at the bottom, and the adjusting component 32 contacts the outer end of the lamp holder mold mechanism 4, so that the adjusting component 32 drives the outer end component of the lamp holder mold mechanism 4 to move, so that the outer end component of the lamp holder mold mechanism 4 can adjust the position of the lamp holder component 5. The adjusting plate 321 is installed at the bottom of the first shaft rod 314, and hollow boxes 322 are installed at both ends of the adjusting plate 321. The outer wall of the hollow box 322 is installed with an L-shaped plate 323. The interior of the hollow box 322 is rotatably connected to the first gear 324, and the outer wall of the hollow box 322 is rotatably connected to the second shaft rod 325. The two ends of the outer wall of the second shaft rod 325 are connected to the second gear 326, and the second gear 326 is meshed with the first gear 324. The outer wall of the L-shaped plate 323 is installed with a third motor 327, and the output end of the third motor 327 is connected to the second shaft rod 325. Through the drive of the third motor 327, the second shaft rod 325 and the second gear 326 can be driven to rotate, so that the second gear 326 can drive the first gear 324 to rotate.

[0061] The outer end of the lamp holder mold mechanism 4 contacts the inner end of the pressing and adjusting mechanism 3, and the lamp holder mold mechanism 4 is clamped by the pressing and adjusting mechanism 3. The lamp holder mold mechanism 4 includes: a lamp holder mold assembly 41, a lamp holder mold 411, a U-shaped plate 412, a slide groove 413, an ejection assembly 42, a gear rod 421, a protrusion 422 and a top plate 423. The upper end of the outer wall of the lamp holder mold assembly 41 is clamped by the clamping rod 25. The interior of the lamp holder mold assembly 41 clamps the lamp holder assembly 5. The upper end of the outer wall of the lamp holder mold 411 is clamped by the clamping rod 25. At the same time, the lower end of the outer wall of the lamp holder mold 411 can be clamped by the clamping block 125, so that the clamping block 125 drives the lamp holder mold 411 to move to the interior of the oven 114 for baking. U-shaped plates 412 are provided at both ends of the lamp holder mold 411. The U-shaped plate 41 The outer end of the gear rod 421 contacts with the L-shaped plate 323, so that the L-shaped plate 323 squeezes and fixes the U-shaped plate 412 and the lamp holder mold 411. The two ends of the U-shaped plate 412 are provided with slide grooves 413. The two ends inside the lamp holder mold assembly 41 are slidably connected to the ejection assembly 42. The ejection assembly 42 contacts with the first gear 324. The middle two ends of the gear rod 421 are provided with protrusions 422. The protrusions 422 are slidably connected inside the slide grooves 413. The outer wall of the gear rod 421 is meshed and connected with the first gear 324. The rotation of the first gear 324 can drive the gear rod 421 to move up and down. The bottom of the gear rod 421 is provided with a top plate 423. The top of the top plate 423 contacts with the bottom of the lamp holder assembly 5. Through the movement of the gear rod 421, the top plate 423 can drive the lamp holder assembly 5 to move up and down inside the lamp holder mold 411.

[0062] The lamp holder assembly 5 is arranged inside the lamp holder mold mechanism 4, and is used to perform lifting and lowering adjustment operations on the lamp holder assembly 5 through the cooperation of the pressing and adjusting mechanism 3 and the lamp holder mold mechanism 4. The lamp holder assembly 5 includes: a lamp holder 51, a first step surface 52, a second step surface 53, a first welding point 54, a third step surface 55, a stop bar 56, and a second welding point 57. The lamp holder 51 is clamped by the lamp holder mold 411, and the lamp holder 51 achieves the effect of clamping and limiting through the lamp holder mold 411. The top outer side of the lamp holder 51 is provided with a first step surface 52, and the inner side of the first step surface 52 is provided with a second step surface 53. The first step surface 52 and the second step surface 55 are connected to each other. 3 are all glue dispensing areas. The surface of the second step surface 53 is provided with a first welding point 54. The first welding point 54 can increase the viscosity during glue dispensing and increase the bottom friction of the colloid to prevent the colloid from overflowing or shifting during transfer. The inner side of the second step surface 53 is provided with a third step surface 55. The third step surface 55 is used to place the chip. The outer end of the third step surface 55 is provided with a blocking bar 56. The surface of the third step surface 55 is provided with a second welding point 57. The blocking bar 56 can limit the placement position of the chip. At the same time, the glue dispensing of the chip can be limited and blocked to prevent the colloid from overflowing and increase the viscosity of the chip.

[0063] During specific use, technicians in this field place two sets of lamp holder molds 411 between the clamping rods 25, and clamp and fix the two sets of lamp holder molds 411 by starting the second motor 23. At this time, the lamp holder 51 is placed between the two sets of lamp holder molds 411 through the loose and tight fit of the clamping rods 25. By starting the hydraulic cylinder 311, the hydraulic cylinder 311 drives the adjustment component 32 to squeeze and contact the ejection component 42, and at the same time, the lamp holder 51 is limited and fixed. When expanding the crystal, fixing the crystal and welding the wire, the microscope is installed on the top of the bracket 21, and the top plate 423 is driven to rise by starting the third motor 327, so that the lamp holder 51 The height is flush with the height of the lamp holder mold 411. At this time, crystal expansion, crystal solidification and wire welding are carried out. When the crystal expansion, crystal solidification and wire welding operations are completed, the tightness of the pressing component 31 and the clamping rod 25 are coordinated again to make the bottom of the lamp holder 51 contact with the top of the top plate 423, so that the top plate 423 limits the position of the lamp holder 51. At this time, the glue dispensing operation is carried out. When the glue dispensing is completed, the clamping rod 25 is first loosened to allow the transfer component 12 to clamp the lamp holder mold 411. After the clamping is completed, the pressing and adjusting mechanism 3 is released again, so that the lamp holder mold 411 and the lamp holder 51 are moved by the transfer component 12 to the inside of the oven 114 for baking.

[0064] Although the present invention has been described above with reference to the embodiments, various modifications may be made thereto and parts thereof may be replaced by equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the various features in the embodiments disclosed in the present invention may be used in combination with each other in any manner, and the fact that these combinations are not exhaustively described in this specification is only for the sake of omitting space and saving resources. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A light emitting diode packaging device, characterized in that: include: Baking mechanism (1); The baking mechanism (1) is placed on a table. The baking mechanism (1) is used to bake and solidify the colloid. A clamping assembly (2) is installed at the front end of the baking mechanism (1). The inside of the clamping assembly (2) clamps the lamp stand mold mechanism (4). Pressing and adjusting mechanisms (3) are installed at the left and right ends of the clamping assembly (2). The inner end of the pressing and adjusting mechanism (3) contacts the outer end of the lamp stand mold mechanism (4). The inside of the lamp stand mold mechanism (4) clamps the lamp stand assembly (5). The pressing and adjusting mechanism (3) and the lamp stand mold mechanism (4) cooperate to perform lifting and lowering adjustment operations on the lamp stand assembly (5). The baking mechanism (1) comprises: a baking component (11), the baking component (11) being placed on a table; The baking component (11) comprises a bottom plate (111), and the bottom plate (111) is placed on a tabletop; The clamping assembly (2) comprises: a bracket (21); The bracket (21) is mounted on the front end surface of the bottom plate (111), and vertical boxes (22) are provided at both ends of the inside of the bracket (21); The pressing and adjusting mechanism (3) comprises: a pressing component (31); The pressing assembly (31) is mounted on the left and right ends of the bracket (21), and the bottom of the pressing assembly (31) is mounted with an adjusting assembly (32); The pressing assembly (31) comprises: a hydraulic cylinder (311); The hydraulic cylinder (311) is installed on the top of the vertical box (22), the output end of the hydraulic cylinder (311) is connected to the movable rod (312), the two ends of the movable rod (312) are rotatably connected to the upper end of the swing rod (313), the lower end of the swing rod (313) is connected to the outer end of the first shaft rod (314), and the first shaft rod (314) is rotatably connected to the bottom of the bracket (21); The adjustment component (32) comprises: an adjustment plate (321); The adjustment plate (321) is mounted at the bottom of the first shaft (314); hollow boxes (322) are mounted at both ends of the adjustment plate (321); an L-shaped plate (323) is mounted on the outer wall of the hollow box (322); the interior of the hollow box (322) is rotatably connected to a first gear (324); the outer wall of the hollow box (322) is rotatably connected to a second shaft (325); both ends of the outer wall of the second shaft (325) are connected to a second gear (326); the second gear (326) is meshedly connected to the first gear (324); a third motor (327) is mounted on the outer wall of the L-shaped plate (323); and an output end of the third motor (327) is connected to the second shaft (325).

2. The light emitting diode packaging device according to claim 1, characterized in that: The baking mechanism (1) comprises: a baking component (11); The surface of the baking component (11) is connected to the transfer component (12).

3. The light emitting diode packaging device according to claim 2, characterized in that: The baking component (11) comprises: a bottom plate (111); The surface of the bottom plate (111) is rotatably connected to the first screw rod (112); a first motor (113) is installed in the middle of the front end of the bottom plate (111); the output end of the first motor (113) is connected to a plurality of groups of first screw rods (112) via a sprocket and a chain transmission; and an oven (114) is installed at the rear end of the bottom plate (111); The transfer assembly (12) comprises: a lifting platform (121); The front and rear ends of the bottom of the lifting platform (121) are installed with threaded blocks (122), the threaded blocks (122) are slidably connected to the surface of the bottom plate (111), the interior of the threaded blocks (122) is threadedly connected to the first screw rod (112), the top of the lifting platform (121) is connected to the installation box (123), the interior of the installation box (123) is rotatably connected to the first bidirectional screw rod (124), the rear side port of the first bidirectional screw rod (124) is connected to the motor, and the motor is installed at the rear end of the installation box (123), the two ends of the first bidirectional screw rod (124) are threadedly connected to two groups of clamping blocks (125), and the clamping blocks (125) are slidably connected to the interior of the installation box (123).

4. The light emitting diode packaging device according to claim 3, characterized in that: The clamping assembly (2) comprises: a vertical box (22); A second motor (23) is installed at the front end of the vertical box (22); the interior of the vertical box (22) is rotatably connected to a second bidirectional screw rod (24); one end of the second bidirectional screw rod (24) is connected to an output end of the second motor (23); the front and rear ends of the second bidirectional screw rod (24) are threadedly connected to two groups of clamping rods (25); and the lamp holder mold mechanism (4) can be clamped and fixed by the two groups of clamping rods (25).

5. The light emitting diode packaging device according to claim 4, characterized in that: The lamp stand mold mechanism (4) comprises: a lamp stand mold assembly (41); The upper end of the outer wall of the lamp holder mold assembly (41) is clamped by the clamping rod (25), the interior of the lamp holder mold assembly (41) clamps the lamp holder assembly (5), and the two ends of the interior of the lamp holder mold assembly (41) are slidably connected to the ejection assembly (42), and the ejection assembly (42) is in contact with the first gear (324).

6. The light emitting diode packaging device according to claim 5, characterized in that: The lamp holder mould assembly (41) comprises: a lamp holder mould (411); The upper end of the outer wall of the lamp holder mold (411) is clamped by the clamping rod (25), and U-shaped plates (412) are provided at both ends of the lamp holder mold (411). The outer ends of the U-shaped plates (412) are in contact with the L-shaped plates (323), and sliding grooves (413) are provided at both ends of the U-shaped plates (412); The ejection assembly (42) comprises: a gear rod (421); The gear rod (421) has protrusions (422) at both ends in the middle, the protrusions (422) are slidably connected to the inside of the slide groove (413), the outer wall of the gear rod (421) is meshedly connected to the first gear (324), and the bottom of the gear rod (421) is provided with a top plate (423), and the top of the top plate (423) contacts the bottom of the lamp holder assembly (5).

7. The light emitting diode packaging device according to claim 6, characterized in that: The lamp stand assembly (5) comprises: a lamp stand (51); The lamp holder (51) is clamped by the lamp holder mold (411); a first step surface (52) is provided on the outer side of the top of the lamp holder (51); a second step surface (53) is provided on the inner side of the first step surface (52); a first welding point (54) is provided on the surface of the second step surface (53); a third step surface (55) is provided on the inner side of the second step surface (53); a stop bar (56) is provided on the outer end of the third step surface (55); and a second welding point (57) is provided on the surface of the third step surface (55).

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