Chip transfer method, drive substrate and display panel

Abstract

The present disclosure belongs to the field of display technology and specifically relates to a chip transfer method, a driver substrate, and a display panel. The chip transfer method includes: providing a transfer substrate and a driver substrate, the transfer substrate including a first substrate and a light-emitting chip; the driver substrate including a second substrate and a drive electrode, an expansion layer, and a hot-melt adhesive layer located on the same side of the second substrate; the expansion layer being disposed on at least one side of the drive electrode, the expansion layer being capable of expanding in volume under specific lighting; the hot-melt adhesive layer being in contact with the expansion layer and capable of melting under specific lighting; the hot-melt adhesive layer covering at least the drive electrode, with the orthographic projection of the hot-melt adhesive layer on the second substrate covering the orthographic projection of the expansion layer on the second substrate. By disposing the expansion layer on at least one side of the drive electrode, the present disclosure utilizes the property of the expansion layer expanding in volume under specific lighting, thereby reducing or avoiding the problem of positional displacement of the light-emitting chip during transfer caused by melting of the hot-melt adhesive layer on the driver substrate.

Description

Technical Field

[0001] The present disclosure belongs to the field of display technology, and particularly relates to a chip transfer method, a driving substrate, and a display panel. Background Art

[0002] Laser transfer is a common mass transfer technology in existing display panel technology. Laser transfer uses a laser to release light-emitting chips from a transfer substrate and then transfer them in batches to the driver substrate. Laser transfer offers high transfer efficiency and flexibility in the area of ​​a single transfer. However, due to the distance between the transfer substrate and the driver substrate during the transfer process, the placement of the micro-light-emitting devices can easily shift, affecting the accuracy of the laser transfer and, in turn, the manufacturing yield of the display panel. Summary of the Invention

[0003] The purpose of the present application is to provide a chip transfer method, a driving substrate and a display panel, which can reduce or avoid the possibility of positional deviation during the transfer of the light-emitting chip by setting an expansion layer, thereby improving the accuracy and success rate of the light-emitting chip transfer.

[0004] The present disclosure provides a chip transfer method, the chip transfer method comprising:

[0005] Providing a transfer substrate, the transfer substrate comprising a first substrate and a light-emitting chip on the first substrate;

[0006] A driving substrate is provided, comprising a second substrate and a driving electrode, an expansion layer, and a hot melt adhesive layer located on the same side of the second substrate; the expansion layer is disposed on at least one side of the driving electrode and is capable of expanding in volume under specific light; the hot melt adhesive layer is in contact with the expansion layer and is capable of melting under the specific light; the hot melt adhesive layer covers at least the driving electrode, and an orthographic projection of the hot melt adhesive layer on the second substrate covers an orthographic projection of the expansion layer on the second substrate;

[0007] Aligning the transfer substrate and the driving substrate so that the light-emitting chip is correspondingly bound to the driving electrode through the hot-melt adhesive layer;

[0008] A specific light irradiation technique is used to irradiate a side of the first substrate facing away from the light emitting chip, so as to separate the first substrate from the light emitting chip.

[0009] In an exemplary embodiment of the present disclosure, the method for forming the driving substrate includes:

[0010] providing a second substrate;

[0011] forming the driving electrodes on the second substrate;

[0012] forming the expansion layer on the second substrate;

[0013] forming the hot melt adhesive layer on the second substrate, wherein the hot melt adhesive layer covers the driving electrode and the expansion layer;

[0014] Wherein, if the hot melt adhesive layer melts under the specific light and forms a gap, the expansion layer corresponding to the gap can expand in volume under the specific light to fill the gap.

[0015] In an exemplary embodiment of the present disclosure, after forming the driving electrode and before forming the expansion layer, the chip transfer method further includes: forming a padding layer on the second substrate, wherein the padding layer is located on a side of the expansion layer close to the second substrate, so that a side of the expansion layer facing away from the second substrate is not lower than a side of the driving electrode facing away from the second substrate.

[0016] In an exemplary embodiment of the present disclosure, the expansion layer is made of an electrodeformable material, and the cushioning layer is made of a photoelectric material.

[0017] The cushioning layer can convert light energy into electrical energy, and the expansion layer can expand in volume under the action of the electrical energy generated by the cushioning layer.

[0018] In an exemplary embodiment of the present disclosure, the hot melt adhesive layer includes a first adhesive layer and a second adhesive layer; and the method for forming the driving substrate includes:

[0019] providing a second substrate;

[0020] forming the driving electrodes on the second substrate;

[0021] forming the first adhesive layer on the second substrate;

[0022] forming the expansion layer on a side of the first adhesive layer facing away from the second substrate;

[0023] forming a second adhesive layer on a side of the expansion layer away from the first adhesive layer, wherein the second adhesive layer at least covers the expansion layer;

[0024] Wherein, if the hot melt adhesive layer melts under the specific light and forms a gap, the expansion layer corresponding to the gap can expand in volume under the specific light to fill the gap.

[0025] In an exemplary embodiment of the present disclosure, the method for forming the driving substrate includes:

[0026] providing a second substrate;

[0027] forming the driving electrodes on the second substrate;

[0028] forming the hot melt adhesive layer on the second substrate, wherein the hot melt adhesive layer covers the driving electrode and the second substrate;

[0029] The expansion layer is formed on a side of the hot melt adhesive layer facing away from the second substrate.

[0030] In an exemplary embodiment of the present disclosure, the expansion layer includes a plurality of expansion structures, the expansion structures are arranged at intervals, and the plurality of expansion structures are arranged around the outer periphery of the driving electrode.

[0031] The present disclosure provides a driving substrate, comprising:

[0032] a second substrate;

[0033] a driving electrode, located on the second substrate;

[0034] The expansion layer is located on the same side of the second substrate as the driving electrode, and is provided on at least one side of the driving electrode; the expansion layer can expand in volume under specific light.

[0035] In an exemplary embodiment of the present disclosure, the driving substrate includes a hot melt adhesive layer that can melt under the specific light, the hot melt adhesive layer is in contact with the expansion layer, the hot melt adhesive layer at least covers the driving electrode, and the orthographic projection of the hot melt adhesive layer on the second substrate covers the orthographic projection of the expansion layer on the second substrate.

[0036] The present disclosure provides a display panel, comprising a plurality of light-emitting chips arranged in an array at intervals and any one of the driving substrates described above, wherein the light-emitting chips are correspondingly bound to a side of the driving electrode facing away from the second substrate.

[0037] In an exemplary embodiment of the present disclosure, the expansion layer has a light-shielding property, and the side of the expansion layer facing away from the second substrate is not lower than the side of the driving electrode facing away from the second substrate; when the light-emitting chip emits light, the expansion layer can expand in volume to block the light from one light-emitting chip to another adjacent light-emitting chip.

[0038] This application has the following beneficial effects:

[0039] The present disclosure provides an expansion layer on at least one side of the driving electrode and makes the expansion layer contact with the hot melt adhesive layer. By utilizing the characteristic that the expansion layer can expand in volume under specific light, the problem of positional displacement of the light-emitting chip during transfer caused by the melting of the hot melt adhesive layer on the driving substrate is reduced or avoided.

[0040] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by practice of the present application.

[0041] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification, serve to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and it is clear that those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0043] Figure 1 Schematic diagram of the chip transfer method in the embodiment of the present disclosure.

[0044] Figure 2 Schematic diagram of the cross-sectional structure of the driving substrate when the expansion layer contacts the second substrate in the embodiment of the present disclosure.

[0045] Figure 3 Schematic diagram of a cross-sectional structure of a driving substrate when the expansion layer is connected to the cushioning layer in an embodiment of the present disclosure.

[0046] Figure 4 Schematic diagram of another cross-sectional structure of the driving substrate when the expansion layer is connected to the cushioning layer in the embodiment of the present disclosure.

[0047] Figure 5 Schematic diagram of the cross-sectional structure of laser precision offset in related technology.

[0048] Figure 6 for Figure 5 Schematic diagram of the cross-sectional structure of the hot melt adhesive layer as the adhesive solvent evaporates under laser irradiation.

[0049] Figure 7 To remove Figure 6 Schematic diagram of the cross-sectional structure of the light-emitting chip and the driving electrode behind the hot melt adhesive layer.

[0050] Figure 8 Schematic diagram of the cross-sectional structure of the expansion layer disposed between the first adhesive layer and the second adhesive layer in the embodiment of the present disclosure.

[0051] Figure 9 for Figure 8 Schematic diagram of the cross-sectional structure of the hot melt adhesive layer as the adhesive solvent evaporates under laser irradiation.

[0052] Figure 10 for Figure 9 Schematic diagram of the cross-sectional structure of the volume expansion of the expansion layer.

[0053] Figure 11 for Figure 8 A schematic cross-sectional structural diagram of a structure in which the expansion layer is arranged as a plurality of expansion structures arranged at intervals.

[0054] Figure 12 Schematic diagram of the cross-sectional structure of an embodiment of the present disclosure in which the expansion layer is arranged on the side of the hot melt adhesive layer facing away from the second substrate.

[0055] Figure 13 for Figure 12 A schematic cross-sectional structural diagram of a structure in which the expansion layer is arranged as a plurality of expansion structures arranged at intervals.

[0056] Figure 14 for Figure 13 Schematic diagram of the cross-sectional structure of the expansion structure when the volume expands.

[0057] Figure 15 For Figure 2 Schematic diagram of the cross-sectional structure of the driving substrate when the expansion layer is covered with a hot melt adhesive layer.

[0058] Figure 16 For Figure 3 Schematic diagram of the cross-sectional structure of the driving substrate when the expansion layer is covered with a hot melt adhesive layer.

[0059] Figure 17 For Figure 4 Schematic diagram of the cross-sectional structure of the driving substrate when the expansion layer is covered with a hot melt adhesive layer.

[0060] Description of reference numerals:

[0061] 1. Transfer substrate; 11. First substrate; 12. Light-emitting chip; 121. Main body; 122. Connecting electrodes; 13. Adhesive layer;

[0062] 2. Driving substrate; 21. Second substrate; 22. Driving electrode; 23. Expansion layer; 24. Hot melt adhesive layer; 241. First adhesive layer; 242. Second adhesive layer; 25. Padding layer. DETAILED DESCRIPTION

[0063] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art.

[0064] In addition, the described features, structures or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure can be practiced without one or more of the specific details, or other methods, components, devices, steps, etc. can be adopted. In other cases, well-known methods, devices, implementations or operations are not shown or described in detail to avoid blurring various aspects of the present disclosure.

[0065] The present disclosure is further described below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments of the present disclosure described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present disclosure, and should not be construed as limiting the present disclosure.

[0066] refer to Figures 1 to 4 as well as Figures 8 to 17 As shown, the present disclosure provides a chip transfer method, which includes:

[0067] S1. Provide a transfer substrate, wherein the transfer substrate includes a first substrate and a light-emitting chip on the first substrate.

[0068] S2. Provide a driving substrate, the driving substrate including a second substrate and a driving electrode, an expansion layer and a hot melt adhesive layer located on the same side of the second substrate; the expansion layer is arranged on at least one side of the driving electrode, and the expansion layer can expand in volume under specific light; the hot melt adhesive layer is in contact with the expansion layer, and the hot melt adhesive layer can melt under specific light; the hot melt adhesive layer at least covers the driving electrode, and the orthographic projection of the hot melt adhesive layer on the second substrate covers the orthographic projection of the expansion layer on the second substrate.

[0069] S3. Align the transfer substrate and the driving substrate so that the light-emitting chip is correspondingly bound to the driving electrode through the hot-melt adhesive layer.

[0070] S4. Using a specific lighting technique to illuminate the side of the first substrate facing away from the light-emitting chip, so as to separate the first substrate from the light-emitting chip.

[0071] In the embodiment of the present disclosure, the materials of the first substrate 11 and the second substrate 21 can be silicon (Si), sapphire (Al2O3), silicon carbide (SiC) and the like, but are not limited thereto. The first substrate 11 and the second substrate 21 can be formed of materials other than silicon, sapphire and silicon carbide, which can also be included in the embodiment of the present disclosure.

[0072] It should be noted that the first substrate 11 in the present disclosure may be a growth substrate for forming the light-emitting chip 12. However, it is not limited thereto, and the first substrate 11 may also be a temporary substrate for carrying the light-emitting chip 12 during the chip transfer process.

[0073] The light emitting chip 12 may include a main body 121 and a connection electrode 122 connected to the upper surface of the main body 121 . The connection electrode 122 is used to connect to the driving electrode 22 on the driving substrate 2 to emit light after obtaining a voltage.

[0074] It should be noted that the transfer substrate 1 may include one light-emitting chip 12, but is not limited thereto. The transfer substrate 1 may also include multiple light-emitting chips 12, and the multiple light-emitting chips 12 may be arranged in an array and spaced apart on the first substrate 11. The number and arrangement of the light-emitting chips 12 on the first substrate 11 may be set according to specific circumstances.

[0075] In addition, an adhesive layer 13 may be further provided on the first substrate 11 . The adhesive layer 13 may cover the entire first substrate 11 , and the light-emitting chip 12 is adhered to the first substrate 11 via the adhesive layer 13 .

[0076] In the embodiment of the present disclosure, one driving electrode 22 may be provided on the second substrate 21 , but the present invention is not limited thereto. A plurality of driving electrodes 22 may be provided on the second substrate 21 , and the specific number may be determined according to actual conditions.

[0077] For example: when multiple light-emitting chips 12 need to be transferred from a transfer substrate 1 to a driving substrate 2, or when multiple transfer substrates 1 need to transfer the light-emitting chips 12 to the same driving substrate 2, multiple driving electrodes 22 can be set on the driving substrate 2 to correspond to the light-emitting chips 12 on the transfer substrate 1.

[0078] The hot melt adhesive layer 24 in the present disclosure may be light-transmissive. The expansion layer 23 disposed on at least one side of the drive electrode 22 in the present disclosure may mean that the expansion layer 23 is disposed around the outer periphery of the drive electrode 22, but is not limited thereto. The expansion layer 23 may also be disposed on a portion of the outer periphery of the drive electrode 22.

[0079] Specifically, the expansion layer 23 may be made of epoxy resin, acrylic resin, polyurethane-based, mixed-ion perovskite film, or other expansion materials. Under specific light, the expansion material undergoes lattice expansion, increasing the interatomic distances within the expansion material and thereby increasing the overall volume of the expansion layer 23.

[0080] The present disclosure utilizes the volume expansion property of the expansion layer 23 under specific light to reduce or avoid the problem of positional displacement of the light-emitting chip 12 during transfer caused by the melting of the hot melt adhesive layer 24 on the driving substrate 2, thereby improving the transfer accuracy and transfer yield of the light-emitting chip 12.

[0081] It should be noted that the specific light irradiation mentioned above can refer to the laser used to separate the light-emitting chip 12 from the first substrate 11, but is not limited to this. The specific light irradiation can also refer to the laser used to separate the light-emitting chip 12 from the corresponding bonded driving electrode 22 when repairing a faulty light-emitting chip 12 transferred to the driving substrate 2. In this case, the specific light irradiation can cause the expansion layer 23 to expand in volume and melt the hot-melt adhesive layer 24.

[0082] In addition, when the expansion layer 23 is disposed in the display panel, the expansion layer 23 may also expand in volume under the action of the light emitted by the light emitting chip 12 in the display panel.

[0083] In the disclosed embodiment, the expansion layer 23 may also be made of a light-shielding material. When illuminated by the light-emitting chip 12, the expansion layer 23 expands in volume, thereby increasing the light-shielding area of ​​the expansion layer 23. This reduces or prevents the possibility of light from one light-emitting chip 12 irradiating another adjacent light-emitting chip 12, thereby reducing or preventing color cross-talk between the light-emitting chips 12 in the display panel.

[0084] In the embodiment of the present disclosure, the orthographic projection of the light-emitting chip 12 on the second substrate 21 may coincide with the orthographic projection of the driving electrode 22 to which it is bound on the second substrate 21, but is not limited thereto. The orthographic projection of the driving electrode 22 on the second substrate 21 may also be located within the orthographic projection of the light-emitting chip 12 to which it is bound on the second substrate 21.

[0085] like Figures 2 to 4 As shown, the method for forming the drive substrate 2 in the embodiment of the present disclosure may include: providing a second substrate 21, and forming a drive electrode 22 on the second substrate 21. After forming the drive electrode 22, first forming an expansion layer 23 on the second substrate 21, and then forming a hot melt adhesive layer 24 on the second substrate 21. The formed hot melt adhesive layer 24 contacts the expansion layer 23 and covers the drive electrode 22 and the expansion layer 23.

[0086] When the hot melt adhesive layer 24 melts under specific light and forms a gap, the expansion layer 23 corresponding to the gap can expand in volume under specific light to fill the gap in the hot melt adhesive layer 24 .

[0087] For example, if Figures 5 to 7As shown, after the transfer substrate 1 and the driving substrate 2 are aligned, the light-emitting chip 12 on the transfer substrate 1 is adhered to the hot melt adhesive layer 24 of the driving substrate 2. Laser is used to irradiate the side of the first substrate 11 away from the light-emitting chip 12 to peel off the light-emitting chip 12 from the first substrate 11. When the laser precision deviates, part of the laser is irradiated onto the hot melt adhesive layer 24 outside the light-emitting chip 12. Since the hot melt adhesive layer 24 has a certain wettability, the hot melt adhesive layer 24 will be heated during laser irradiation, and the irradiated area of ​​the hot melt adhesive layer 24 will melt, and the adhesive solvent in the hot melt adhesive layer 24 will evaporate and form vacancies, which will cause the adhesive around the vacant area of ​​the hot melt adhesive layer 24 to flow, thereby causing the light-emitting chip 12 to be transferred to the driving substrate 2 and bound to the driving electrode 22 on the driving substrate 2. Position deviation occurs, which in turn affects the transfer accuracy and transfer yield of the light-emitting chip 12.

[0088] To avoid the above situation, the embodiment of the present disclosure provides an expansion layer 23 on the driving substrate 2. The expansion layer 23 is located on at least one side of the driving electrode 22, and the expansion layer 23 is capable of expanding in volume under laser irradiation. When the laser used to peel the light-emitting chip 12 from the first substrate 11 deviates in precision and irradiates the hot-melt adhesive layer 24, the adhesive in the irradiated area of ​​the hot-melt adhesive layer 24 melts. At the same time, the laser penetrates the hot-melt adhesive layer 24 and irradiates the expansion layer 23. The expansion layer 23 expands in volume under the irradiation of the laser to fill the vacant areas of the hot-melt adhesive layer 24, reducing or preventing the adhesive around the vacant areas of the hot-melt adhesive layer 24 from flowing toward the area where the solvent evaporates. This reduces or prevents the risk of the light-emitting chip 12 being displaced due to the flow of the adhesive in the hot-melt adhesive layer 24, thereby improving the transfer accuracy and transfer yield of the light-emitting chip 12.

[0089] It should be noted that when the expansion layer 23 in the embodiment of the present disclosure expands, the side of the expanded portion of the expansion layer 23 facing away from the second substrate 21 can be flush with the side of the hot melt adhesive layer 24 facing away from the second substrate 21, or the side of the expanded portion of the expansion layer 23 facing away from the second substrate 21 can be higher than the side of the hot melt adhesive layer 24 facing away from the second substrate 21, so that the expanded portion of the expansion layer 23 can be used to completely fill the vacant area of ​​the hot melt adhesive layer 24 to reduce or avoid the flow of the adhesive material in the hot melt adhesive layer 24.

[0090] However, the present invention is not limited thereto. In the embodiment of the present invention, the expanded portion of the expansion layer 23 may be slightly lower than the side of the hot melt adhesive layer 24 facing away from the second substrate 21. The expanded portion of the expansion layer 23 is used to fill most of the volume of the vacant area of ​​the hot melt adhesive layer 24 to reduce the flow of the adhesive in the hot melt adhesive layer 24 and ensure that the light-emitting chip 12 can be bound to the corresponding driving electrode 22 on the driving substrate 2.

[0091] Furthermore, when the expansion layer 23 has light-shielding properties, the volume expansion of the expansion layer 23 can increase the light-shielding area of ​​the expansion layer 23, thereby reducing or preventing laser irradiation onto the drive electrode 22, the second substrate 21, and the light-emitting chip 12. This can reduce damage to the components on the drive substrate 2 and the light-emitting chip 12 caused by the laser. When the drive substrate 2 has multiple light-emitting chips 12, the volume expansion of the expansion layer 23 can also enhance the shielding of light from one light-emitting chip 12 to another adjacent light-emitting chip 12, thereby reducing or preventing color cross-talk between adjacent light-emitting chips 12.

[0092] like Figure 2 As shown, in the embodiment of the present disclosure, after the driving electrode 22 is provided on the second substrate 21 , the expansion layer 23 is provided on the second substrate 21 , and the expansion layer 23 is in contact with the second substrate 21 .

[0093] The side of the expansion layer 23 facing away from the second substrate 21 can be no lower than the side of the drive electrode 22 facing away from the second substrate 21. This ensures that, after the display panel is formed, the light-shielding expansion layer 23 can effectively block light from one light-emitting chip 12 from reaching another adjacent light-emitting chip 12, reducing or preventing the possibility of color cross-talk between adjacent light-emitting chips 12, thereby improving the display quality of the display panel. However, this is not limiting. In the present disclosure, the side of the expansion layer 23 facing away from the second substrate 21 can also be lower than the side of the drive electrode 22 facing away from the second substrate 21, but the volume of the expansion layer 23 must ensure that, after expansion, it can at least block some of the light from one light-emitting chip 12 from reaching another adjacent light-emitting chip 12.

[0094] The side of the expansion layer 23 facing away from the second substrate 21 can be lower than the side of the hot melt adhesive facing away from the second substrate 21. This prevents the expansion layer 23 from expanding excessively after the display panel is formed, potentially interfering with other structures within the display panel and causing damage to the display panel. However, this is not limiting. In the present disclosure, the side of the expansion layer 23 facing away from the second substrate 21 can be higher than the side of the hot melt adhesive facing away from the second substrate 21, or it can be flush with the side of the hot melt adhesive facing away from the second substrate 21. However, the volume expansion of the expansion layer 23 must be such that it does not interfere with other structures within the display panel.

[0095] It should be noted that the expansion layer 23 in contact with the second substrate 21 in the embodiment of the present disclosure may remain in the driving substrate 2 in the formed display panel.

[0096] In addition, if Figures 3 and 4 As shown, in the embodiment of the present disclosure, the driving substrate 2 may further include a raising layer 25 , and the raising layer 25 is located on a side of the expansion layer 23 close to the second substrate 21 .

[0097] Specifically, after forming the driving electrode 22 , a padding layer 25 may be formed on the second substrate 21 , and then an expansion layer 23 may be formed on a side of the padding layer 25 facing away from the second substrate 21 , with the expansion layer 23 connected to the padding layer 25 .

[0098] It should be noted that the raising layer 25 in the present disclosure may be made of insulating materials such as resin. The expansion layer 23 and the raising layer 25 on the second substrate 21 may remain in the driving substrate 2 in the display panel.

[0099] After providing the raised layer 25, the side of the expansion layer 23 facing away from the second substrate 21 may be no lower than the side of the driving electrode 22 facing away from the second substrate 21, so as to ensure that after the display panel is formed, the light-shielding expansion layer 23 can effectively block the light from one light-emitting chip 12 to another adjacent light-emitting chip 12, thereby reducing or avoiding the possibility of cross-color between adjacent light-emitting chips 12, thereby improving the display effect of the display panel.

[0100] The present embodiment of the present disclosure, by providing the spacer layer 25, can reduce the amount of expansion of the expansion layer 23 in the direction away from the second substrate 21. That is, by providing the spacer layer 25, the deformation of the expansion layer 23 within the hot melt adhesive layer 24 can be reduced, thereby reducing the possibility that the adhesive material in the hot melt adhesive layer 24 will flow violently due to excessive deformation of the expansion layer 23 within the hot melt adhesive layer 24, thereby causing positional displacement of the light-emitting chip 12 during transfer. The side of the spacer layer 25 facing away from the second substrate 21 can be higher than the side of the driving electrode 22 facing away from the second substrate 21, or the side of the spacer layer 25 facing away from the second substrate 21 can be flush with the side of the driving electrode 22 facing away from the second substrate 21, but the present invention is not limited thereto. The height of the spacer layer 25 can be determined according to actual conditions.

[0101] At the same time, by setting the cushioning layer 25, the distance between the expansion layer 23 and the side of the hot melt adhesive layer 24 facing away from the second substrate 21 can also be reduced, so as to reduce or avoid the problem that the expanded part of the expansion layer 23 cannot completely fill the vacant area of ​​the hot melt adhesive layer 24 due to the small volume expansion of the expansion layer 23, thereby causing the light-emitting chip 12 to shift in position along with the adhesive material of the hot melt adhesive layer 24.

[0102] However, the present invention is not limited thereto. When the expansion layer 23 has a light-shielding property, the side of the expansion layer 23 facing away from the second substrate 21 may also be lower than the side of the driving electrode 22 facing away from the second substrate 21. However, it is necessary to ensure that the volume of the expansion layer 23 can at least block part of the light from one light-emitting chip 12 to another adjacent light-emitting chip 12 after the volume is expanded, so as to reduce the problem of cross-color between adjacent light-emitting chips 12.

[0103] After providing the spacer layer 25, the side of the expansion layer 23 facing away from the second substrate 21 can be lower than the side of the hot melt adhesive facing away from the second substrate 21. This prevents the expansion layer 23 from expanding excessively after the display panel is formed, potentially interfering with other structures within the display panel and causing damage to the display panel. However, this is not limiting. In the present disclosure, the side of the expansion layer 23 facing away from the second substrate 21 can be higher than the side of the hot melt adhesive facing away from the second substrate 21, or it can be flush with the side of the hot melt adhesive facing away from the second substrate 21. However, the volume expansion of the expansion layer 23 must be such that it does not interfere with other structures within the display panel.

[0104] Furthermore, the expansion layer 23 in the embodiment of the present disclosure may be made of an electrodeformable material, and the raising layer 25 may be made of a photoelectric material.

[0105] Specifically, the photoelectric material may include one or more of lead tin telluride, mercury cadmium telluride, triglycyl sulfate, and lithium tantalate, and the electrodeformer may include transparent materials such as elastomers containing azobenzene molecules, but is not limited thereto. The photoelectric material and the electrodeformer material may also be materials other than the aforementioned materials, and the specific setting can be based on actual conditions.

[0106] Under light, the cushioning layer 25 can convert light energy into electrical energy and transmit electrical signals to the expansion layer 23 . The expansion layer 23 expands in volume under the action of the electrical energy generated by the cushioning layer 25 .

[0107] For example, after the light-emitting chip 12 is transferred to the driver substrate 2 and a display panel is formed, the elevated layer 25 in the display panel can convert the light energy generated by the light-emitting chip 12 into electrical energy when the light-emitting chip 12 is in operation. The expansion layer 23 expands in volume due to the electrical energy generated by the elevated layer 25. In other words, the expansion layer 23 in the display panel of the present disclosure can expand in volume when the light-emitting chip 12 emits light. If the expansion layer 23 has light-shielding properties, it can block light from one light-emitting chip 12 from irradiating another adjacent light-emitting chip 12, thereby reducing or avoiding the risk of color cross-talk between adjacent light-emitting chips 12.

[0108] like Figures 8 to 11 As shown, in some embodiments of the present disclosure, the hot melt adhesive layer may include a first adhesive layer 241 and a second adhesive layer 242. In this case, the method for forming the drive substrate 2 may include: providing a second substrate 21, and forming the drive electrodes 22 on the second substrate 21. After forming the drive electrodes 22, first forming the first adhesive layer 241 on the second substrate 21, then forming the expansion layer 23 on the side of the first adhesive layer 241 facing away from the second substrate 21, and then forming the second adhesive layer 242 on the side of the expansion layer 23 facing away from the first adhesive layer 241.

[0109] It should be noted that when the hot melt adhesive layer 24 includes a first adhesive layer 241 and a second adhesive layer 242, the expanded part of the expansion layer 23 is flush with the side of the second adhesive layer 242 facing away from the second substrate 21, or the expanded part of the expansion layer 23 is higher than the side of the second adhesive layer 242 facing away from the second substrate 21, so as to ensure that the expansion layer 23 can completely fill the vacant area of ​​the hot melt adhesive layer 24 after the volume expands, so as to avoid positional displacement during the transfer of the light-emitting chip 12, thereby affecting the transfer accuracy and transfer yield of the light-emitting chip 12.

[0110] In the embodiment of the present disclosure, the first adhesive layer 241 can cover the area of ​​the second substrate 21 except for the driving electrode 22. The side of the first adhesive layer 241 facing away from the second substrate 21 can be flush with the side of the driving electrode 22 facing away from the second substrate 21. After the expansion layer 23 is formed, the side of the expansion layer 23 facing away from the second substrate 21 is no lower than the side of the driving electrode 22 facing away from the second substrate 21. When the expansion layer 23 has light-shielding properties, the height of the expansion layer 23 increases after volume expansion, thereby reducing or avoiding the risk of damage to the light-emitting chip 12, the driving electrode 22, and other components on the driving substrate 2 caused by refraction and scattered light generated by the laser.

[0111] At the same time, the second adhesive layer 242 in the embodiment of the present disclosure can cover the driving electrode 22 and the expansion layer 23. The expansion layer 23 is located between the first adhesive layer 241 and the second adhesive layer 242, and the expansion layer 23 is in contact with the second adhesive layer 242. Therefore, when the hot melt adhesive layer 24 melts under specific light and forms a vacancy, the expansion layer 23 corresponding to the vacancy expands in volume under specific light to fill the vacancy, thereby reducing or avoiding the risk of positional displacement of the light-emitting chip 12 caused by the flow of the adhesive material in the hot melt adhesive layer 24.

[0112] For example, in the embodiment of the present disclosure, the vertical distance between the side of the second adhesive layer 242 facing away from the second substrate 21 and the side of the expansion layer 23 facing away from the second substrate 21 may be greater than 1 um, so that the second adhesive layer 242 completely covers the expansion layer 23 .

[0113] However, the present invention is not limited thereto. The side of the first adhesive layer 241 facing away from the second substrate 21 may be higher than the side of the driving electrode 22 facing away from the second substrate 21, or the side of the first adhesive layer 241 facing away from the second substrate 21 may be slightly lower than the side of the driving electrode 22 facing away from the second substrate 21. However, it should be ensured that when the expansion layer 23 expands in volume, the side of the expanded portion facing away from the second substrate 21 is higher than the side of the second adhesive layer 242 facing away from the second substrate 21, or is flush with the side of the second adhesive layer 242 facing away from the second substrate 21.

[0114] In order to reduce the manufacturing materials of the second adhesive layer 242, the present disclosure can preset the size of the volume expansion of the expansion layer 23, and set the second adhesive layer 242 of corresponding thickness according to the preset volume expansion size of the expansion layer 23, so that the expanded part of the expansion layer 23 is flush with the side of the second adhesive layer 242 facing away from the second substrate 21, thereby reducing the manufacturing cost of the second adhesive layer 242.

[0115] like Figures 12 to 14 As shown, in some other embodiments of the present disclosure, the method for forming the drive substrate 2 may further include: providing a second substrate 21, and forming a drive electrode 22 on the second substrate 21. Forming a hot melt adhesive layer 24 on the second substrate 21, the hot melt adhesive layer 24 covering the drive electrode 22 and the second substrate 21. After forming the hot melt adhesive layer 24, forming an expansion layer 23 on a side of the hot melt adhesive layer 24 facing away from the second substrate 21.

[0116] Among them, when the hot melt adhesive layer 24 melts under specific light and forms a void, the area of ​​the expansion layer 23 corresponding to the void can also expand in volume under specific light, thereby filling the void, so as to reduce or avoid the flow of the adhesive material of the hot melt adhesive layer 24, reduce or avoid the risk of positional displacement when the light-emitting chip 12 is transferred, thereby improving the transfer accuracy and transfer yield of the light-emitting chip 12.

[0117] When the expansion layer 23 has light-shielding properties, it can also shield the laser beam directed toward the side of the first substrate 11 facing away from the light-emitting chip 12 during the transfer process of the light-emitting chip 12. This reduces or prevents the laser beam from reaching the hot-melt adhesive layer 24 and causing the hot-melt adhesive layer 24 to melt. This, in turn, reduces or prevents the light-emitting chip 12 from shifting due to the flow of the hot-melt adhesive layer 24. Furthermore, the volume expansion of the expansion layer 23 can also increase the light-shielding area, reducing or preventing specific light from reaching the drive electrode 22, the light-emitting chip 12, or the second substrate 21. This, in turn, reduces or prevents the risk of damage to the drive electrode 22, the light-emitting chip 12, and other components on the second substrate 21.

[0118] like Figures 2 to 3 、 Figure 11 as well as Figures 13 and 14As shown, in the embodiment of the present disclosure, the expansion layer 23 may include a plurality of expansion structures, each expansion structure is spaced apart, and each expansion structure can expand in volume independently. A plurality of expansion structures can be arranged around the outer peripheral side of the driving electrode. When a plurality of light-emitting chips 12 are provided on the second substrate 21, at least two expansion structures are provided between two adjacent light-emitting chips 12. In the embodiment of the present disclosure, the expansion structure can be formed by a spraying (ink-jet) process. By spacing apart a plurality of expansion structures, the present disclosure can avoid the problem that the area corresponding to the vacancy of the hot melt adhesive layer 24 in the expansion layer 23 caused by the connection of the expansion structures will stretch and expand the adhesive material in the surrounding area when the area expands, thereby causing the hot melt adhesive layer 24 to have different thicknesses and causing the light-emitting chip 12 to be offset in position.

[0119] During the alignment of the transfer substrate 1 and the drive substrate 2, the light-emitting chip 12 is aligned with the drive electrode 22 on the second substrate 21, and the light-emitting chip 12 is bonded to the hot melt adhesive layer 24 covering the side of the drive electrode 22 facing away from the second substrate 21. The provision of the hot melt adhesive layer 24 secures the position of the light-emitting chip 12 on the drive substrate 2 to prevent displacement during the transfer process. Furthermore, the hot melt adhesive layer 24 provides a buffer during the alignment of the drive substrate 2 and the transfer substrate 1, reducing or preventing the risk of collision between the light-emitting chip 12 and the drive electrode 22 during alignment, which could result in damage to the light-emitting chip 12 and the drive electrode 22.

[0120] After the light emitting chip 12 is peeled off from the first substrate 11 , the hot melt adhesive layer 24 is melted to remove the hot melt adhesive layer 24 from the second substrate 21 , and the light emitting chip 12 is bonded to the driving electrode 22 .

[0121] When a hot melt adhesive layer 24 is provided between the side of the expansion layer 23 close to the second substrate 21 and the second substrate 21 , the expansion layer 23 and the hot melt adhesive layer 24 can be removed from the second substrate 21 together.

[0122] like Figures 2 to 4 as well as Figures 15 to 17 As shown, the present disclosure provides a drive substrate 2, which includes a second substrate 21, a drive electrode 22, and an expansion layer 23. The expansion layer 23 and the drive electrode 22 are located on the same side of the second substrate 21, and the expansion layer 23 is disposed on the outer periphery of the drive electrode 22. The expansion layer 23 is capable of expanding in volume under specific light conditions. The drive substrate 2 may include one drive electrode 22, but is not limited thereto. The drive substrate 2 may also include multiple drive electrodes 22, which may be arranged in an array with intervals between them.

[0123] Furthermore, the driving substrate 2 can also include a hot melt adhesive layer 24, which at least covers the driving electrode 22, so that when the light-emitting chip 12 is transferred to the driving substrate 2, the light-emitting chip 12 can be bonded to the hot melt adhesive layer 24 through the hot melt adhesive layer 24 to achieve position fixation, thereby reducing or avoiding the problem of position displacement when the light-emitting chip 12 is bound to the corresponding driving electrode 22 on the second substrate 21.

[0124] In the disclosed embodiment, the hot melt adhesive layer 24 is capable of melting under specific lighting conditions, contacting the expansion layer 23. Furthermore, the orthographic projection of the hot melt adhesive layer 24 on the second substrate 21 overlaps the orthographic projection of the expansion layer 23 on the second substrate 21. By causing the expansion layer 23 to expand in volume, the problem of positional shifting of the light-emitting chip 12 during transfer caused by melting the hot melt adhesive layer 24 on the drive substrate 2 can be reduced or avoided, thereby improving the transfer accuracy and yield of the light-emitting chip 12.

[0125] It should be noted that the driving substrate 2 provided in the embodiments of the present disclosure can be used in any of the above-mentioned chip transfer methods.

[0126] The present disclosure further provides a display panel, which includes a plurality of light-emitting chips 12 arranged in an array and any one of the driving substrates 2 described above. The light-emitting chips 12 are correspondingly bound to a side of the driving electrode 22 facing away from the second substrate 21 .

[0127] The expansion layer 23 in the display panel can have light-shielding properties, and the side of the expansion layer 23 facing away from the second substrate 21 can be no lower than the side of the drive electrode 22 facing away from the second substrate 21. When the display panel is in operation, the expansion layer 23 can expand in volume under the influence of light emitted by the light-emitting chips 12, thereby blocking light from one adjacent light-emitting chip 12 from irradiating another adjacent light-emitting chip 12. This can reduce or prevent the possibility of color cross-talk between the light-emitting chips 12 and improve the display quality of the display panel.

[0128] When the hot melt adhesive layer 24 is not needed in the display panel, the hot melt adhesive layer 24 on the driving substrate 2 can be removed during the transfer process of the light emitting chip 12 .

[0129] In the description of the present disclosure, “plurality” means two or more, unless otherwise clearly and specifically defined.

[0130] It should be noted that “upper”, “lower”, “left”, “right”, etc. are only used to distinguish for the convenience of description, and do not impose any directional restrictions on the embodiments of the present invention. For example, the “upper” may actually be “lower”, “left”, “right”, etc. In the present disclosure, unless otherwise clearly specified and limited, the terms “assembly”, “connection”, etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure can be understood according to the specific circumstances.

[0131] In the description of this specification, the reference terms "some embodiments", "exemplarily", etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0132] Although the embodiments of the present disclosure have been shown and described above, it is understood that the above embodiments are illustrative and cannot be understood as limitations on the present disclosure. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present disclosure. Therefore, any changes or modifications made in accordance with the claims and description of the present disclosure shall fall within the scope of the patent of the present disclosure.

Claims

1. A chip transfer method, characterized in that: The chip transfer method comprises: Providing a transfer substrate, the transfer substrate comprising a first substrate and a light-emitting chip on the first substrate; A driving substrate is provided, comprising a second substrate and a driving electrode, an expansion layer, and a hot melt adhesive layer located on the same side of the second substrate; the expansion layer is disposed on at least one side of the driving electrode and is capable of expanding in volume under specific light; the hot melt adhesive layer is in contact with the expansion layer and is capable of melting under the specific light; the hot melt adhesive layer covers at least the driving electrode, and an orthographic projection of the hot melt adhesive layer on the second substrate covers an orthographic projection of the expansion layer on the second substrate; Aligning the transfer substrate and the driving substrate so that the light-emitting chip is correspondingly bound to the driving electrode through the hot-melt adhesive layer; A specific light irradiation technique is used to irradiate a side of the first substrate facing away from the light emitting chip, so as to separate the first substrate from the light emitting chip.

2. The chip transfer method according to claim 1, wherein: The method for forming the driving substrate includes: providing a second substrate; forming the driving electrodes on the second substrate; forming the expansion layer on the second substrate; forming the hot melt adhesive layer on the second substrate, wherein the hot melt adhesive layer covers the driving electrode and the expansion layer; Wherein, if the hot melt adhesive layer melts under the specific light and forms a gap, the expansion layer corresponding to the gap can expand in volume under the specific light to fill the gap.

3. The chip transfer method according to claim 2, wherein: After forming the driving electrode and before forming the expansion layer, the chip transfer method further includes: forming a padding layer on the second substrate, wherein the padding layer is located on a side of the expansion layer close to the second substrate, so that a side of the expansion layer facing away from the second substrate is not lower than a side of the driving electrode facing away from the second substrate.

4. The chip transfer method according to claim 3, characterized in that: The expansion layer is made of an electrodeformable material, and the cushioning layer is made of a photoelectric material. The cushioning layer can convert light energy into electrical energy, and the expansion layer can expand in volume under the action of the electrical energy generated by the cushioning layer.

5. The chip transfer method according to claim 1, wherein: The hot melt adhesive layer includes a first adhesive layer and a second adhesive layer; and the method for forming the driving substrate includes: providing a second substrate; forming the driving electrodes on the second substrate; forming the first adhesive layer on the second substrate; forming the expansion layer on a side of the first adhesive layer facing away from the second substrate; forming a second adhesive layer on a side of the expansion layer away from the first adhesive layer, wherein the second adhesive layer at least covers the expansion layer; Wherein, if the hot melt adhesive layer melts under the specific light and forms a gap, the expansion layer corresponding to the gap can expand in volume under the specific light to fill the gap.

6. The chip transfer method according to claim 1, wherein: The method for forming the driving substrate includes: providing a second substrate; forming the driving electrodes on the second substrate; forming the hot melt adhesive layer on the second substrate, wherein the hot melt adhesive layer covers the driving electrode and the second substrate; The expansion layer is formed on a side of the hot melt adhesive layer facing away from the second substrate.

7. The chip transfer method according to claim 1, wherein: The expansion layer includes a plurality of expansion structures, each of the expansion structures is arranged at intervals, and the plurality of expansion structures are arranged around the outer periphery of the driving electrode.

8. A driving substrate, characterized in that: The chip transfer method according to claim 1 , wherein the driving substrate comprises: a second substrate; a driving electrode, located on the second substrate; an expansion layer, located on the same side of the second substrate as the driving electrode, and disposed on at least one side of the driving electrode; the expansion layer can expand in volume under specific light; A hot melt adhesive layer can melt under the specific light and contact the expansion layer, the hot melt adhesive layer at least covers the driving electrode, and the orthographic projection of the hot melt adhesive layer on the second substrate covers the orthographic projection of the expansion layer on the second substrate.

9. A display panel, characterized in that: It comprises a plurality of light-emitting chips arranged in an array at intervals and the driving substrate as claimed in claim 8, wherein the light-emitting chips are correspondingly bound to a side of the driving electrode facing away from the second substrate.

10. The display panel according to claim 9, characterized in that: The expansion layer has a light-shielding property, and the side of the expansion layer facing away from the second substrate is not lower than the side of the driving electrode facing away from the second substrate; when the light-emitting chip emits light, the expansion layer can expand in volume to block the light from one light-emitting chip to another adjacent light-emitting chip.

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