Analyzer and method for canonical testing of solar devices

Abstract

A test device for testing a circuit includes input terminals connectable to different test points of the circuit by test leads; at least a first measurement circuit and a second measurement circuit; a switch; a processor; and a storage medium storing instructions that, when executed by the processor, cause the test device to perform a first test of the circuit when one or more of the switches electrically couple at least a first and a second of the input terminals to the first measurement circuit, and performing a second test of the circuit when one or more of the switches electrically couple at least a third and a fourth of the input terminals to a second measurement circuit, wherein the first test and the second test are performed without changing the connection of the input terminals of the test device to different test points of the circuit.

Description

Background Art Technical Field

[0001] The present disclosure relates to testing of solar energy devices and, more particularly, to simplifying the connection of a testing device to a solar energy device.

[0002] Related technical description

[0003] After a photovoltaic (PV) system is installed, tests may be performed to verify that the system has been properly installed and is operating safely. For example, the International Electrotechnical Commission (IEC) IEC62446-1 specification defines the information and documentation that needs to be handed over to the customer after a grid-connected PV system is installed. In addition, the IEC62446-1 specification describes commissioning tests, inspection standards, and documentation that are expected to verify the safe installation and correct operation of the system.

[0004] Multiple electrical measurements need to be performed to test the system and issue a compliance report according to the IEC62446-1 specification. Some measurements are performed in dangerous and hard-to-reach places, such as steep rooftops. Traditionally, technicians need to reconnect the test leads using different terminals of the test fixture or analyzer and connect to different parts of the fixture to complete all the required measurements. These tasks take time and may be performed in hazardous environments.

[0005] For example, in the United States, customers often skip safety testing (category 1 testing according to the IEC62446-1 specification) and typically only perform performance measurements (category 2 testing according to the IEC62446-1 specification) to verify system efficiency and return on investment for solar installations. Safety tests are often bypassed because they take extra time and may require entry into dangerous exposed locations (steep and high rooftops), which is not required by local regulations. If a solar installation has not been safety tested, then the solar installation may not be able to operate safely. For example, an unsafe solar installation could cause a fire, which could result in loss of life and property. In Europe, the situation is the opposite, where category 1 testing is performed according to mandatory specifications, but category 2 tests are bypassed because they are optional. Summary of the invention

[0006] According to the present invention, a test device is provided that enables a technician to use a limited number of test leads (e.g., four test leads) electrically connected between respective input terminals of the test device and respective test points of a solar device to perform complete Class 1 and Class 2 tests in accordance with the IEC 62446-1 specification. The test device includes firmware that controls internal switches (e.g., relays) that dynamically electrically connect respective input terminals to respective internal measurement circuits to automatically perform a full set of tests without the need to reconnect the test leads to the input terminals. Thus, after the test leads are connected to the input terminals of the test device and the respective test points of the solar device, the test leads remain in the input terminals when multiple tests or measurements are performed.

[0007] Thus, the test device according to the present disclosure can improve productivity by saving the time required to reconnect the test leads and perform the test using conventional techniques. In addition, the test device according to the present disclosure can increase safety because a technician can enter dangerous places (e.g., a rooftop) just to connect and disconnect the test leads, without having to enter these places to move and reconnect the test leads during testing. In addition, the test device according to the present disclosure can enable technicians in the United States and Europe, for example, to perform Class 1 and Class 2 tests that fully evaluate a PV system using a set of actions to connect the test device to the PV system. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Non-limiting and non-exhaustive embodiments are described with reference to the following figures.In the drawings, like reference numerals refer to like parts throughout the various figures unless otherwise specified.

[0009] For a better understanding of the present disclosure, reference should be made to the following detailed description, which should be read in conjunction with the accompanying drawings.

[0010] Figure 1 is a block diagram of a testing device according to one or more embodiments of the present disclosure.

[0011] Figure 2 According to one or more embodiments of the present disclosure Figure 1 A block diagram of a portion of the test apparatus is shown.

[0012] Figure 3A , Figure 3B , Figure 3C , Figure 3D , Figure 3E , Figure 3F , Figure 3G , Figure 3H , Fig. 3I , Figure 3J , Figure 3K , Figure 3L , Figure 3M , Figure 3N and Fig.3O is a diagram for explaining a test configuration according to one or more embodiments of the present disclosure.

[0013] Figure 4 A flow chart illustrating a method of testing a circuit according to one or more embodiments of the present disclosure is shown.

[0014] Figure 5 A flow chart illustrating a method of testing a circuit according to one or more embodiments of the present disclosure is shown.

[0015] Figure 6 A flow chart illustrating a method of testing a circuit according to one or more embodiments of the present disclosure is shown.

[0016] Figure 7 A flow chart illustrating a method of testing a circuit according to one or more embodiments of the present disclosure is shown. DETAILED DESCRIPTION

[0017] A test device for testing a circuit includes input terminals that can be connected to different test points of the circuit via test leads; at least a first measurement circuit and a second measurement circuit; switches; a processor; and a storage medium storing instructions that, when executed by the processor, cause the test device to perform a first test of the circuit when one or more of the switches electrically connect at least a first input terminal and a second input terminal of the input terminals to the first measurement circuit, and to perform a second test of the circuit when one or more of the switches electrically connect at least a third input terminal and a fourth input terminal of the input terminals to the second measurement circuit, wherein the first test and the second test are performed without changing the connection of the input terminals of the test device to the different test points of the circuit.

[0018] Figure 1 1 is a block diagram of a test device 100 according to one or more embodiments of the present disclosure. The test device 100 includes a microprocessor 102 having a memory 104 and a processor 106. The test device 100 also includes a memory 108 electrically coupled to the microprocessor 102. The memory 104 may be any type of digital information storage and retrieval device, such as a random access memory (RAM), a read-only memory (ROM), an electrically erasable programmable read-only memory (EEPROM), an optical or magnetic media device. The memory 108 stores instructions that, when executed by the processor 106, cause the test device 100 to perform the functions described herein. In one or more embodiments, when the processor 106 executes the instructions stored by the memory 108, the processor 106 uses the memory 104 as a working memory. In one or more embodiments, the processor 106 stores the test results in the memory 108.

[0019] The test device 100 also includes input / output (I / O) circuitry 110, for example, input devices such as touch input devices, buttons, knobs, and / or dials, which an operator can use to control the operation of the test device 100. Additionally, in one or more embodiments, the I / O circuitry 110 includes, for example, one or more output devices such as a light emitting device, a speaker, a buzzer, and / or a data interface (e.g., a universal serial bus (USB) interface).

[0020] The test device 100 also includes a plurality of switches 112 that are operatively controlled by the microprocessor 102. In one or more implementations, the microprocessor 102 provides a control signal to each of the switches 112, such that each of the switches 112 is in a conducting or closed state when the control signal has a first predetermined state (e.g., a voltage level), and such that each of the switches 112 is in a non-conducting or open state when the control signal has a second predetermined state (e.g., a voltage level) that is different from the first predetermined state. In one or more implementations, each of the switches 112 may include an actuator that is configured to manually place the switch 112 in a conducting state or a non-conducting state based on whether the actuator is in the first position or the second position.

[0021] In addition, the test device 100 includes a plurality of input terminals 114 and a plurality of measurement circuits 116. Figure 2 Explained in more detail, microprocessor 102 controls switches 112 to electrically couple each of input terminals 114 to one of measurement circuits 116 appropriate for the particular test to be performed.

[0022] In addition, the test device 100 includes a display device 118. The display device 118 displays information to the operator in a graphical manner. The microprocessor 102 controls the display device 118 to display information related to the tests performed by the test device 100, such as test results and instructions for the user of the test device 100. In one or more embodiments, the display device 118 is a liquid crystal display (LCD) device. In one or more embodiments, the display device 118 includes a touch screen device.

[0023] Figure 2 According to one or more embodiments of the present disclosure Figure 1 FIG. 1 is a block diagram of a portion 100′ of a test apparatus 100 shown in FIG. Figure 2As shown, switch 112 includes switches 112a, 112b, 112c, 112d, 112e, 112f, 112g, 112h, 112i, 112j, 112k, 112l, 112m, 112n, 112o, 112p, 112q, 112r, 112s, 112t, 112u, 112v, 112w, 112x and 112y. Figure 2 The arrangement of switches 112 shown is one example. A test device according to the present disclosure may include a different arrangement of switches 112 without departing from the scope of the present disclosure.

[0024] In addition, the input terminal 114 includes input terminals 114a, 114b, 114c, and 114d. Figure 2 Four input terminals 114 are shown, but a test device according to the present disclosure may include a different number of input terminals 114 without departing from the scope of the present disclosure.

[0025] The measurement circuit 116 includes an alternating current (AC) voltage measurement circuit 116a, a direct current (DC) voltage measurement circuit 116b, an AC current measurement circuit 116c, a DC current measurement circuit 116d, a resistance measurement circuit 116e, a capacitance measurement circuit 116f, and a diode measurement circuit 116g. Figure 2 The measurement circuit 116 shown is an example. Without departing from the scope of the present disclosure, the test device according to the present disclosure may include different measurement circuits. In addition, without departing from the scope of the present disclosure, Figure 2 Each of the measurement circuits 116 shown in FIG. 1 may include more than one measurement circuit. For example, the resistance measurement circuit 116 e may include a first resistance measurement circuit ( Figure 2 ) and a second resistance measurement circuit (not shown) that measures the resistance using a relatively high test voltage Figure 2 ), wherein the terminals 116e-1 and 116e-2 of the resistance measuring circuit 116e are connected to the switch 112 ( Figure 2 The first resistance measurement circuit 116e is electrically coupled to one of the first resistance measurement circuit and the second resistance measurement circuit in the resistance measurement circuit 116e.

[0026] More specifically, the switch 112a selectively and electrically couples the input terminal 114a to a first terminal 116a-1 of the AC voltage measurement circuit 116a. The switch 112b selectively and electrically couples the input terminal 114b to a second terminal 116a-2 of the AC voltage measurement circuit 116a. When the switches 112a and 112b are in an on state, the AC voltage measurement circuit 116a measures the AC potential difference between the input terminal 114a and the input terminal 114b, and outputs a signal or value corresponding to the AC potential difference to the microprocessor 102.

[0027] The switch 112c selectively and electrically couples the input terminal 114a to the first terminal 116b-1 of the DC voltage measurement circuit 116b. The switch 112d selectively and electrically couples the input terminal 114b to the second terminal 116b-2 of the DC voltage measurement circuit 116b. When the switches 112c and 112d are in an on state, the DC voltage measurement circuit 116b measures the DC potential difference between the input terminal 114a and the input terminal 114b, and outputs a signal or value corresponding to the DC potential difference to the microprocessor 102.

[0028] The switch 112e selectively and electrically couples the input terminal 114c to the second terminal 116b-2 of the DC voltage measurement circuit 116b. The switch 112f selectively and electrically couples the input terminal 114c to the first terminal 116b-1 of the DC voltage measurement circuit 116b. For example, when the switch 112e and the switch 112c are in an on state, the DC voltage measurement circuit 116b measures the DC potential difference between the input terminal 114a and the input terminal 114c, and outputs a signal or value corresponding to the DC potential difference to the microprocessor 102. For example, when the switch 112f and the switch 112d are in an on state, the DC voltage measurement circuit 116b measures the DC potential difference between the input terminal 114b and the input terminal 114d, and outputs a signal or value corresponding to the DC potential difference to the microprocessor 102.

[0029] The switch 112g selectively and electrically couples the input terminal 114c to the first terminal 116c-1 of the AC current measurement circuit 116c. The switch 112p selectively and electrically couples the input terminal 114d to the second terminal 116c-2 of the AC current measurement circuit 116c. When the switch 112g and the switch 112p are in an on state, the AC current measurement circuit 116c measures the AC current flowing between the input terminal 114c and the input terminal 114d, and outputs a signal or value corresponding to the AC current to the microprocessor 102.

[0030] The switch 112h selectively and electrically couples the input terminal 114c to the first terminal 116d-1 of the DC current measurement circuit 116d. The switch 112o selectively and electrically couples the input terminal 114d to the second terminal 116d-2 of the DC current measurement circuit 116d. When the switches 112h and 112o are in an on state, the DC current measurement circuit 116d measures the DC current flowing between the input terminal 114c and the input terminal 114d, and outputs a signal or value corresponding to the DC current to the microprocessor 102.

[0031] The switch 112i selectively and electrically couples the input terminal 114c to the first terminal 116e-1 of the resistance measurement circuit 116e. The switch 112q selectively and electrically couples the input terminal 114d to the second terminal 116d-2 of the DC current measurement circuit 116d. When the switches 112i and 112q are in an on state, the DC current measurement circuit 116d measures the DC current flowing between the input terminal 114c and the input terminal 114d, and outputs a signal or value corresponding to the DC current to the microprocessor 102.

[0032] The switch 112k selectively and electrically connects the input terminal 114c to the second terminal 116e-2 of the resistance measurement circuit 116e. The switch 112l selectively and electrically connects the input terminal 114a to the first terminal 116e-1 of the resistance measurement circuit 116e. When the switches 112k and 112l are in an on state, the resistance measurement circuit 116e measures the resistance between the input terminal 114a and the input terminal 114c, and outputs a signal or value corresponding to the resistance to the microprocessor 102.

[0033] Switch 112m selectively electrically couples input terminal 114b to second terminal 116e-2 of resistance measurement circuit 116e. When switches 112l and 112m are in an on state, resistance measurement circuit 116e measures the resistance between input terminal 114a and input terminal 114b and outputs a signal or value corresponding to the resistance to microprocessor 102.

[0034] The switch 112j selectively and electrically couples the input terminal 114c to the first terminal 116f-1 of the capacitance measurement circuit 116f. The switch 112y selectively and electrically couples the input terminal 114b to the second terminal 116f-2 of the capacitance measurement circuit 116f. When the switches 112j and 112y are in an on state, the capacitance measurement circuit 116f measures the capacitance between the input terminal 114b and the input terminal 114c, and outputs a signal or value corresponding to the capacitance to the microprocessor 102.

[0035] The switch 112r selectively and electrically couples the input terminal 114a to the first terminal 116f-1 of the capacitance measurement circuit 116f. The switch 112z selectively and electrically couples the input terminal 114c to the second terminal 116f-2 of the capacitance measurement circuit 116f. When the switches 112r and 112z are in an on state, the capacitance measurement circuit 116f measures the capacitance between the input terminal 114a and the input terminal 114c, and outputs a signal or value corresponding to the capacitance to the microprocessor 102.

[0036] The switch 112t selectively and electrically couples the input terminal 114a to the first terminal 116g-1 of the diode measurement circuit 116g. The switch 112s selectively and electrically couples the input terminal 114d to the second terminal 116g-2 of the diode measurement circuit 116g. When the switches 112t and 112s are in an on state, the diode measurement circuit 116g measures a forward voltage of a diode placed between the input terminal 114a and the input terminal 114d, and outputs a signal or value corresponding to the forward voltage to the microprocessor 102.

[0037] The switch 112u selectively and electrically couples the input terminal 114b to the second terminal 116g-2 of the diode measurement circuit 116g. When the switches 112t and 112u are turned on, the diode measurement circuit 116g measures the forward voltage of the diode placed between the input terminal 114a and the input terminal 114b, and outputs a signal or value corresponding to the forward voltage to the microprocessor 102.

[0038] The switch 112v selectively electrically couples the input terminal 114a to the input terminal 114b. When the switch 112v is in a conducting state, the input terminal 114a and the input terminal 114b are electrically coupled together. When the switch 112v is in a non-conducting state, the input terminal 114a and the input terminal 114b are electrically disconnected from each other.

[0039] The switch 112w selectively and electrically couples the input terminal 114a to the first terminal 116e-1 of the resistance measurement circuit 116e. The switch 112x selectively and electrically couples the input terminal 114b to the second terminal 116e-2 of the resistance measurement circuit 116e. When the switches 112w and 112x are in an on state, the resistance measurement circuit 116e measures the resistance between the input terminal 114a and the input terminal 114b, and outputs a signal or value corresponding to the resistance to the microprocessor 102.

[0040] Figure 3A , Figure 3B , Figure 3C , Figure 3D , Figure 3E , Figure 3F , Figure 3G, Figure 3H , Fig. 3I , Figure 3J , Figure 3K , Figure 3L , Figure 3M , Figure 3N and Fig.3O is a diagram for explaining a test configuration according to one or more embodiments of the present disclosure. Figure 3A , Figure 3B , Figure 3C , Figure 3D , Figure 3E , Figure 3F , Figure 3G , Figure 3H , Fig. 3I , Figure 3J , Figure 3K , Figure 3L , Figure 3M , Figure 3N and Fig.3O The test configuration shown in is an example. The test device according to the present disclosure can be used in other test configurations without departing from the scope of the present disclosure.

[0041] Figure 3A A portion of a solar device 300 is shown, which includes a solar panel 302 having a positive voltage output terminal 304a, a negative voltage output terminal 304b, a ground connector 304c, and a frame 304d. A ground cable 306 electrically couples the ground connector 304c of the solar panel 302 to a ground or reference potential 308 (e.g., via a busbar or ground spike disposed partially in the ground near the solar device 300).

[0042] The solar device 300 is electrically coupled to the test device 100. More specifically, the test lead 310a electrically couples the input terminal 114a of the test device 100 to a test point that is a positive voltage output terminal 304a of the solar panel 302, the test lead 310b electrically couples the input terminal 114b of the test device 100 to a test point that is a negative voltage output terminal 304b of the solar panel 300, the test lead 310c electrically couples the input terminal 114c of the test device 100 to a test point that is a ground or reference potential 308, and the test lead 310d electrically couples the input terminal 114d of the test device 100 to a test point that is a frame 304d of the solar device 300.

[0043] Figure 3B Similar in many relevant respects to Figure 3A , except that the test lead 310d electrically couples the input terminal 114d of the test device 100 to a test point which is a ground connector 304c of the solar device 300.

[0044] Figure 3C 1 shows a test configuration in which a test lead 310b electrically couples an input terminal 114b of the test device 100 to a test point ( Figure 3C ), and the test lead 310c electrically connects the input terminal 114c of the test device 100 to the second arbitrary part ( Figure 3C not shown).

[0045] Figure 3D A test configuration is shown in which a blocking diode 312 is electrically coupled between the solar device 300 and the test device 100. More specifically, the anode of the blocking diode 312 is electrically coupled to the positive voltage output terminal 304a of the solar panel 302, and the cathode of the blocking diode 312 is electrically coupled to the test lead 310a. The test lead 310a electrically couples the input terminal 114a of the test device 100 to a test point that is the cathode of the blocking diode 312, and the test lead 310d electrically couples the input terminal 114d of the test device 100 to a test point that is the anode of the blocking diode 312.

[0046] Figure 3E A test configuration is shown in which the cathode of bypass diode 314 is electrically coupled to positive voltage output terminal 304a of solar panel 302, and the anode of bypass diode 314 is electrically coupled to negative voltage output terminal 304b of solar panel 300. Test lead 310a electrically couples input terminal 114a of test device 100 to a test point that is the cathode of bypass diode 314, and test lead 310b electrically couples input terminal 114b of test device 100 to a test point that is the anode of bypass diode 314.

[0047] Figure 3F A test configuration is shown in which the cathode of diode 316 has been removed from solar device 300. Test lead 310a electrically couples the cathode of diode 316 to input terminal 114a of test device 100, and test lead 310b electrically couples the anode of diode 316 to input terminal 114b of test device 100.

[0048] Figure 3GA test configuration is shown in which the test device 100 is electrically coupled to an overvoltage protection device array 318. For example, the overvoltage protection device array 318 is a type 2 multi-pole surge arrester from DEHN. More specifically, the test lead 310a electrically couples the input terminal 114a of the test device 100 to a test point that is a first terminal 320a of the overvoltage protection device array 318, and the test lead 310c electrically couples the input terminal 114c of the test device 100 to a test point that is a second terminal 320b of the overvoltage protection device array 318.

[0049] Figure 3H Another test configuration is shown in which the test device 100 is electrically coupled to the overvoltage protection device array 318. More specifically, the test lead 310c electrically couples the input terminal 114c of the test device 100 to a test point that is a second terminal 320b of the overvoltage protection device array 318, and the test lead 310b electrically couples the input terminal 114b of the test device 100 to a test point that is a third terminal 320c of the overvoltage protection device array 318.

[0050] Fig. 3I A test configuration is shown in which the test device 100 is electrically coupled to an overvoltage protection device 322. For example, the overvoltage protection device 322 is a varistor or a pressure-sensitive resistor. More specifically, the test lead 310b electrically couples the input terminal 114b of the test device 100 to a test point that is a first terminal 324a of the overvoltage protection device 322, and the test lead 310c electrically couples the input terminal 114c of the test device 100 to a test point that is a second terminal 324b of the overvoltage protection device 322.

[0051] Figure 3J A test configuration is shown in which the test device 100 is electrically coupled between the last solar panel 302' of the solar device 300 and the inverter 326. For example, the solar device 300 is formed by electrically coupling the solar panel 302, the solar panel 302', and the inverter 326 in parallel. Figure 3JThe test configuration shown in uses two test leads 310a' and 310b', each of which includes a Y-type connector at one end. More specifically, a first connector of the Y-type connector of the test lead 310a' is electrically connected to a test point that is a positive voltage output terminal 304a' of the solar panel 302', a second connector of the Y-type connector of the test lead 310a' is electrically connected to an input terminal 114a of the test device 100, and a connector at the other end of the test lead 310a' is electrically connected to a test point that is a positive DC voltage input terminal 328a of the inverter 326. In addition, a first connector of the Y-type connector of the test lead 310b' is electrically connected to a test point which is a negative voltage output terminal 304b' of the solar panel 302', a second connector of the Y-type connector of the test lead 310b' is electrically connected to the input terminal 114b of the test device 100, and a connector at the other end of the test lead 310b' is electrically connected to a test point which is a negative DC voltage input terminal 328b of the inverter 326.

[0052] Figure 3K Another test configuration is shown, in which the test device 100 is electrically coupled between the last solar panel 302' of the solar device 300 and the inverter 326. The first connector of the Y-type connector of the test lead 310a' is electrically coupled to a test point that is a positive voltage output terminal 304a' of the solar panel 302', the second connector of the Y-type connector of the test lead 310a' is electrically coupled to the input terminal 114a of the test device 100, and the connector at the other end of the test lead 310a' is electrically coupled to a test point that is a positive DC voltage input terminal 328a of the inverter 326. In addition, the first connector of the Y-type connector of the test lead 310b' is electrically coupled to the negative voltage output terminal 304b' of the solar panel 302', the second connector of the Y-type connector of the test lead 310b' is electrically coupled to the input terminal 114b of the test device 100, and the connector at the other end of the test lead 310b' is electrically coupled to the negative DC voltage input terminal 328b of the inverter 326. In addition, test leads 310c' and 310d' are electrically coupled to respective terminals of a clamp meter 330 placed around test lead 310b'. Additionally or alternatively, clamp meter 330 may be placed around test lead 310a' and may measure the current flowing in test lead 310a'. The current measurement by clamp meter 330 is merely an example. The current may also be measured directly, for example, through a shunt resistor.

[0053] Figure 3L Another test configuration is shown in which the test apparatus 100 is electrically coupled between the last solar panel 302 ′ of the solar panel assembly and the inverter 326 . Figure 3LThe test configuration shown in uses two test leads 310c' and 310d'. Test lead 310c' electrically connects input terminal 114c of test device 100 to a first terminal of clamp meter 330, and test lead 310d' electrically connects input terminal 114d of test device 100 to a second terminal of clamp meter 330. For example, clamp meter 330 is similar to a Fluke i400AC current clamp meter in many relevant respects. More specifically, cable 332a electrically connects positive voltage output terminal 304a' of solar panel 302' to positive DC voltage input terminal 328a of inverter 326, and cable 332b electrically connects negative voltage output terminal 304b' of solar panel 302' to negative DC voltage input terminal 328b of inverter 326. In addition, clamp meter 330 is placed around cable 332b. Additionally or alternatively, the clamp meter 330 may be placed around the cable 332a and may measure the current in the cable 332a. The current measurement performed by the clamp meter 330 is just one example. The current may also be measured directly, for example, through a shunt resistor.

[0054] Figure 3M A test configuration is shown in which the test device 100 is electrically coupled to the output of the inverter 326. The cable 334 electrically couples the first AC voltage output terminal 328c of the inverter 326 to a load (not shown), such as a utility grid. In addition, the cable 336 electrically couples the second AC voltage output terminal 328d of the inverter 326 to a load (e.g., a utility grid). The test leads 310a' and 310b' electrically couple the input terminals 114a and 114b to the output terminals 328c and 328d of the inverter 326 in parallel, respectively.

[0055] Figure 3N Another test configuration is shown in which the test apparatus 100 is electrically coupled to the output of the inverter 326 . Figure 3N The test configuration shown in is similar in many relevant respects to Figure 3M , except that test lead 310c' electrically couples input terminal 114c of test device 100 to a first terminal of clamp meter 330, and test lead 310d' electrically couples input terminal 114d of test device 100 to a second terminal of clamp meter 330, which is placed around cable 334. Additionally or alternatively, clamp meter 330 may be placed around cable 336 and may measure the current flowing in cable 336. The current measurement performed by clamp meter 330 is merely an example. The current may also be measured directly, for example, through a shunt resistor.

[0056] Fig.3O Another test configuration is shown in which the test apparatus 100 is electrically coupled to the output of the inverter 326 . Fig.3OThe test configuration shown in is similar in many relevant respects to Figure 3N The test configuration shown in , except that Fig.3O , test leads 310a' and 310b' are not used to electrically couple input terminals 114a and 114b in parallel with output terminals 328c and 328d of inverter 326, respectively.

[0057] Figure 4 A flow chart of a method 400 of testing a circuit is shown in accordance with one or more embodiments of the present disclosure. The method 400 begins at 402 .

[0058] At 402, a technician electrically connects a plurality of test leads between a corresponding plurality of input terminals of a test device and a corresponding plurality of test points of a circuit. Figure 3A As shown, the technician electrically connects the test lead 310a between the input terminal 114a of the test device 100 and a test point that is the positive voltage output terminal 304a of the solar panel 302, electrically connects the test lead 310b between the input terminal 114b of the test device 100 and a test point that is the negative voltage output terminal 304b of the solar panel 300, electrically connects the test lead 310c between the input terminal 114c of the test device 100 and a test point that is the ground or reference potential 308, and electrically connects the test lead 310d between the input terminal 114d of the test device 100 and a test point that is the frame 304d of the solar device 300. The method 400 then proceeds to 404.

[0059] At 404, the test device measures the continuity of the ground connection. For example, at 404, switches 112i and 112p electrically couple resistance measurement circuit 116e to input terminals 114c and 114d. Resistance measurement circuit 116e then measures the resistance between input terminals 114c and 114d and outputs a signal or value corresponding to the result to microprocessor 102. In one or more implementations, microprocessor 102 provides control signals that cause switches 112 other than switches 112i and 112p to be in a non-conductive state. In one or more implementations, microprocessor 102 causes display device 118 to display the result of performing the measurement or test. Method 400 then proceeds to 406.

[0060] In one or more implementations, the microprocessor 102 automatically selectively couples the resistance measurement circuit 116e to the input terminals 114c and 114d at 404 by providing control signals to the switches 112 based on a program or other processor-executable instructions that cause the microprocessor 102 to perform a predetermined sequence of tests or measurements, wherein for each test or measurement, the program or processor-executable instructions specify at least one of the measurement circuits 116 to be electrically coupled to two or more of the input terminals 114, and / or one or more of the switches 112 to be in a conducting state, and / or one or more of the switches 112 to be in a non-conducting state. In one or more implementations, the microprocessor 102 selectively couples the resistance measurement circuit 116e to the input terminals 114c and 114d in response to one or more user inputs, such as a user selecting an icon displayed by the display device 118 that lists the name of a particular test or measurement (e.g., a ground bond continuity measurement). In one or more embodiments, in response to user input corresponding to a user rotating a dial of the I / O circuit 110 to a position corresponding to a particular test or measurement, the resistance measurement circuit 116e is electrically coupled to the input terminals 114c and 114d, thereby manually placing switches 112i and 112p in a conductive state and placing switches 112 other than switches 112i and 112p in a non-conductive state.

[0061] At 406, the technician moves the remote probe from the frame of the solar panel to the ground connector. For example, at 406, if Figure 3B As shown, the technician moves the remote probe coupled to the test lead 310d to the ground connector 304c of the solar device 300. In one or more implementations, the microprocessor 102 causes the display device 118 to display a message with instructions to connect the test lead 310d to the input terminal 114d and to the ground connector 304c of the solar device 300. The method 400 then proceeds to 408.

[0062] At 408, the test device measures the resistance between the two points of the ground cable. For example, at 408, switches 112i and 112p electrically connect resistance measurement circuit 116e to input terminals 114c and 114d, automatically or in response to one or more user inputs, as described above. Resistance measurement circuit 116e then measures the resistance between input terminals 114c and 114d to measure the resistance between the two points of ground cable 306, and outputs a signal or value corresponding to the result to microprocessor 102. In one or more specific implementations, microprocessor 102 provides control signals that cause switches 112 other than switches 112i and 112p to be in a non-conductive state. In one or more specific implementations, microprocessor 102 causes display device 118 to display the result of performing the measurement or test. Method 400 then proceeds to 410.

[0063] At 410, the test device measures the open circuit voltage. For example, at 410, switches 112c and 112d electrically couple the DC voltage measurement circuit 116b to the input terminals 114a and 114b, automatically or in response to one or more user inputs, as described above. The DC voltage measurement circuit 116b then measures the voltage between the input terminals 114a and 114b and outputs a signal or value corresponding to the result to the microprocessor 102. In one or more specific implementations, the microprocessor 102 provides a control signal that causes the switches 112 other than the switches 112c and 112d to be in a non-conducting state. In one or more specific implementations, the microprocessor 102 causes the display device 118 to display the result of performing the measurement or test. The method 400 then proceeds to 412.

[0064] At 412, the test device measures the short circuit current. For example, at 412, switches 112w and 112x electrically couple the DC current measurement circuit 116d to the input terminals 114a and 114b, automatically or in response to one or more user inputs, as described above. The DC current measurement circuit 116d then measures the current flowing between the input terminals 114a and 114b and outputs a signal or value corresponding to the result to the microprocessor 102. In one or more specific implementations, the microprocessor 102 provides a control signal that causes the switches 112 other than the switches 112w and 112x to be in a non-conductive state. In one or more specific implementations, the microprocessor 102 causes the display device 118 to display the result of performing the measurement or test. The method 400 then proceeds to 414.

[0065] At 414, the test device divides the open circuit voltage measured at 410 by the short circuit current measured at 412. For example, at 414, the microprocessor 102 of the test device 100 performs a curve trace by dividing the open circuit voltage measured at 410 by the short circuit current measured at 412 and causes the resulting value to be displayed by the display device 118. The method 400 then proceeds to 416.

[0066] At 416, the test device measures the first insulation resistance using the first method. For example, at 416, switches 112i and 112m electrically connect resistance measurement circuit 116e to input terminals 114b and 114c, automatically or in response to one or more user inputs, as described above. Resistance measurement circuit 116e then measures the resistance between input terminals 114b and 114c and outputs a signal or value corresponding to the result to microprocessor 102. In one or more specific implementations, microprocessor 102 provides control signals that cause switches 112 other than switches 112i and 112m to be in a non-conductive state. In one or more specific implementations, microprocessor 102 causes display device 118 to display the result of performing the measurement or test. Method 400 then proceeds to 418.

[0067] At 418, the test device measures the second insulation resistance using the first method. For example, at 418, switches 1121 and 112k electrically connect resistance measurement circuit 116e to input terminals 114a and 114c, automatically or in response to one or more user inputs, as described above. Resistance measurement circuit 116e then measures the resistance between input terminals 114a and 114c and outputs a signal or value corresponding to the result to microprocessor 102. In one or more specific implementations, microprocessor 102 provides a control signal that causes switches 112 other than switches 1121 and 112k to be in a non-conductive state. In one or more specific implementations, microprocessor 102 causes display device 118 to display the result of performing the measurement or test. Method 400 then proceeds to 420.

[0068] At 420, the test device measures the insulation resistance using a second method. For example, at 420, switches 112v, 112m, and 112i electrically connect the resistance measurement circuit 116e to the input terminals 114a, 114b, and 114c, automatically or in response to one or more user inputs, as described above. Then, the resistance measurement circuit 116e measures the resistance between the input terminals 114a and 114b, short-circuited by the switch 112v, and the input terminal 114c, and outputs a signal or value corresponding to the result to the microprocessor 102. In one or more specific implementations, the microprocessor 102 provides a control signal that causes the switches 112 other than the switches 112v, 112m, and 112i to be in a non-conductive state. In one or more specific implementations, the microprocessor 102 causes the display device 118 to display the result of performing the measurement or test. The method 400 then proceeds to 422.

[0069] At 422, the technician moves the remote probe to any test point on the solar panel. For example, at 422, if Figure 3C As shown, the technician moves the remote probes connected to the test leads 310b and 310c, respectively, to two arbitrary test points ( Figure 3C ). Method 400 then proceeds to 424 .

[0070] At 424, the test device measures the resistance between the two test points. For example, at 424, switches 112i and 112m electrically couple resistance measurement circuit 116e to input terminals 114b and 114c, automatically or in response to one or more user inputs, as described above. Resistance measurement circuit 116e then measures the resistance between input terminals 114b and 114c and outputs a signal or value corresponding to the result to microprocessor 102. In one or more implementations, microprocessor 102 provides control signals that cause switches 112 other than switches 112i and 112m to be in a non-conducting state. In one or more implementations, microprocessor 102 causes display device 118 to display the result of performing the measurement or test. Method 400 then proceeds to 426.

[0071] At 426, the technician moves the remote probe back to the original test point. For example, at 426, if Figure 3A As shown, the technician moves the remote probe coupled to test lead 310b back to positive voltage output terminal 304a and moves the remote probe coupled to test lead 310c back to ground or reference potential 308. Method 400 then proceeds to 428.

[0072] At 428, the test device measures the voltage between the positive voltage output terminal of the solar cell and the ground or reference potential. For example, at 428, switches 112c and 112e electrically couple the DC voltage measurement circuit 116b to the input terminals 114a and 114c, automatically or in response to one or more user inputs, as described above. In one or more implementations, the microprocessor 102 provides control signals that cause switches 112 other than switches 112c and 112e to be in a non-conductive state. In one or more implementations, the microprocessor 102 causes the display device 118 to display the results of the measurement or test performed. The method 400 then proceeds to 430.

[0073] At 430, the test device measures the voltage between the negative voltage output terminal of the solar panel and the ground or reference potential. For example, at 430, switches 112d and 112f electrically couple the DC voltage measurement circuit 116b to the input terminals 114b and 114c, automatically or in response to one or more user inputs, as described above. In one or more implementations, the microprocessor 102 provides control signals that cause switches 112 other than switches 112d and 112f to be in a non-conductive state. In one or more implementations, the microprocessor 102 causes the display device 118 to display the results of the measurement or test performed. The method 400 then proceeds to 432.

[0074] At 432, the test device measures the capacitance between the positive voltage output terminal and the negative voltage output terminal of the solar panel. For example, at 432, switches 112r and 112y electrically couple capacitance measurement circuit 116f to input terminals 114a and 114b automatically or in response to one or more user inputs as described above. In one or more implementations, microprocessor 102 provides control signals that cause switches 112 other than switches 112r and 112y to be in a non-conductive state. In one or more implementations, microprocessor 102 causes display device 118 to display the results of performing the measurement or test. Method 400 then proceeds to 434.

[0075] At 434, the test device measures the capacitance between the negative voltage output terminal of the solar cell and ground or a reference potential. For example, at 434, switches 112j and 112y electrically couple capacitance measurement circuit 116f to input terminals 114b and 114c, automatically or in response to one or more user inputs, as described above. In one or more implementations, microprocessor 102 provides control signals that cause switches 112 other than switches 112j and 112y to be in a non-conductive state. In one or more implementations, microprocessor 102 causes display device 118 to display the results of performing the measurement or test. Method 400 then ends.

[0076] Figure 5A flow chart of a method 500 of testing a circuit is shown in accordance with one or more embodiments of the present disclosure. The method 500 begins at 502 .

[0077] At 502, a technician electrically connects a plurality of test leads between a corresponding plurality of input terminals of a test device and a corresponding plurality of test points of a circuit. Figure 3D As shown, the technician electrically couples the anode of blocking diode 312 to positive voltage output terminal 304a of solar panel 302, electrically couples test lead 310a to the cathode of blocking diode 312, and electrically couples test lead 310d to the anode of blocking diode 312. Method 500 then proceeds to 504.

[0078] At 504, the test device measures the voltage across the blocking diode. For example, at 504, switches 112s and 112t electrically couple diode measurement circuit 116g to input terminals 114a and 114d, automatically or in response to one or more user inputs, as described above. Diode measurement circuit 116g then measures the voltage across input terminals 114a and 114d and outputs a signal or value corresponding to the result to microprocessor 102. In one or more implementations, microprocessor 102 provides control signals that cause switches 112 other than switches 112s and 112t to be in a non-conducting state. In one or more implementations, microprocessor 102 causes display device 118 to display the result of performing the measurement or test. Method 500 then proceeds to 506.

[0079] At 506, the technician moves the remote probe to test the bypass diode. For example, at 506, if Figure 3E As shown, the technician electrically couples the cathode of bypass diode 314 to the positive voltage output terminal 304a of solar panel 302, electrically couples the anode of bypass diode 314 to the negative voltage output terminal 304b of solar panel 300, electrically couples test lead 310a to the cathode of bypass diode 314, and electrically couples test lead 310b to the anode of bypass diode 314. Method 500 then proceeds to 508.

[0080] At 508, the test device measures the voltage across the bypass diode. For example, at 508, switches 112t and 112u electrically couple diode measurement circuit 116g to input terminals 114a and 114b, automatically or in response to one or more user inputs, as described above. Diode measurement circuit 116g then measures the voltage across input terminals 114a and 114b and outputs a signal or value corresponding to the result to microprocessor 102. In one or more implementations, microprocessor 102 provides control signals that cause switches 112 other than switches 112t and 112u to be in a non-conducting state. In one or more implementations, microprocessor 102 causes display device 118 to display the result of performing the measurement or test. Method 500 then ends.

[0081] Figure 6 A flow chart of a method 600 of testing a circuit is shown in accordance with one or more embodiments of the present disclosure. The method 600 begins at 602 .

[0082] At 602, a technician electrically connects a plurality of test leads between a corresponding plurality of input terminals of a test device and a corresponding plurality of test points of a circuit. Figure 3G and Figure 3H As shown, the technician electrically couples test lead 310a to first terminal 320a of overvoltage protection device array 318, electrically couples test lead 310b to third terminal 320c of overvoltage protection device array 318, and electrically couples test lead 310c to second terminal 320b of overvoltage protection device array 318. Method 600 then proceeds to 604.

[0083] At 604, the test device measures the first resistance of the first overvoltage protection device array 318. For example, at 604, the switches 1121 and 112k electrically couple the resistance measurement circuit 116e to the input terminals 114a and 114c, automatically or in response to one or more user inputs, as described above. The resistance measurement circuit 116e then measures the resistance between the input terminals 114a and 114c and outputs a signal or value corresponding to the result to the microprocessor 102. In one or more specific implementations, the microprocessor 102 provides a control signal that causes the switches 112 other than the switches 1121 and 112k to be in a non-conductive state. In one or more specific implementations, the microprocessor 102 causes the display device 118 to display the result of performing the measurement or test. The method 600 then proceeds to 606.

[0084] At 606, the test device measures the second resistance of the first overvoltage protection device array 318. For example, at 606, the switches 112i and 112m electrically connect the resistance measurement circuit 116e to the input terminals 114b and 114c automatically or in response to one or more user inputs as described above. The resistance measurement circuit 116e then measures the resistance between the input terminals 114b and 114c and outputs a signal or value corresponding to the result to the microprocessor 102. In one or more specific implementations, the microprocessor 102 provides a control signal that causes the switches 112 other than the switches 112i and 112m to be in a non-conductive state. In one or more specific implementations, the microprocessor 102 causes the display device 118 to display the result of performing the measurement or test. The method 600 then proceeds to 608.

[0085] In one or more specific implementations, the method 600 further includes measuring a third resistance of the first overvoltage protection device array 318. For example, the switches 1121 and 112m electrically connect the resistance measurement circuit 116e to the input terminals 114a and 114b automatically or in response to one or more user inputs as described above. The resistance measurement circuit 116e then measures the resistance between the input terminals 114a and 114b and outputs a signal or value corresponding to the result to the microprocessor 102.

[0086] At 608, the technician moves the remote probe to test the second overvoltage device. For example, at 608, if Fig. 3I As shown, the technician electrically couples the test lead 310b to the first terminal 324a of the overvoltage protection device 322 and electrically couples the test lead 310c to the second terminal 324b of the overvoltage protection device 322. The method 600 then proceeds to 610.

[0087] At 610, the test device measures the voltage of the second overvoltage protection device. For example, at 610, switches 112i and 112m electrically connect resistance measurement circuit 116e to input terminals 114b and 114c automatically or in response to one or more user inputs as described above. Then, resistance measurement circuit 116e measures the resistance between input terminals 114b and 114c and outputs a signal or value corresponding to the result to microprocessor 102. In one or more specific implementations, microprocessor 102 provides a control signal that causes switches 112 other than switches 112i and 112m to be in a non-conductive state. In one or more specific implementations, microprocessor 102 causes display device 118 to display the result of performing the measurement or test. Method 600 then ends.

[0088] Figure 7 A flow chart of a method 700 of testing a circuit is shown in accordance with one or more embodiments of the present disclosure. The method 700 begins at 702 .

[0089] At 702, a technician electrically connects a plurality of test leads between a corresponding plurality of input terminals of a test device and a corresponding plurality of test points of a circuit. Figure 3J and Figure 3K As shown, the technician electrically connects the first connector of the Y-type connector of the test lead 310a' to the positive voltage output terminal 304a' of the solar panel 302', electrically connects the second connector of the Y-type connector of the test lead 310a' to the input terminal 114a of the test device 100, and electrically connects the connector at the other end of the test lead 310a' to the positive DC voltage input terminal 328a of the inverter 326. In addition, the technician electrically connects the first connector of the Y-type connector of the test lead 310b' to the negative voltage output terminal 304b' of the solar panel 302', electrically connects the second connector of the Y-type connector of the test lead 310b' to the input terminal 114b of the test device 100, and electrically connects the connector at the other end of the test lead 310b' to the negative DC voltage input terminal 328b of the inverter 326. Additionally, the technician places a clamp meter 330 electrically coupled to test leads 310c' and 310d' around test lead 310b'.

[0090] At 704, the test device measures the voltage output from the solar panel 302' to the inverter 326. For example, at 704, the switches 112c and 112d electrically couple the DC voltage measurement circuit 116b to the input terminals 114a and 114b, automatically or in response to one or more user inputs, as described above. The DC voltage measurement circuit 116b then measures the voltage across the input terminals 114a and 114b and outputs a signal or value corresponding to the result to the microprocessor 102. In one or more specific implementations, the microprocessor 102 provides a control signal that causes the switches 112 other than the switches 112c and 112d to be in a non-conductive state. In one or more specific implementations, the microprocessor 102 causes the display device 118 to display the result of performing the measurement or test. The method 700 then proceeds to 706.

[0091] At 706, the test device measures the current output from the solar panel 302' to the inverter 326. For example, at 706, the switches 112h and 112o electrically couple the DC current measurement circuit 116d to the input terminals 114c and 114d, automatically or in response to one or more user inputs, as described above. The DC current measurement circuit 116d then measures the current flowing between the input terminals 114c and 114d and outputs a signal or value corresponding to the result to the microprocessor 102. In one or more specific implementations, the microprocessor 102 provides a control signal that causes the switches 112 other than the switches 112h and 112o to be in a non-conductive state. In one or more specific implementations, the microprocessor 102 causes the display device 118 to display the result of performing the measurement or test. The method 700 then proceeds to 708.

[0092] At 708, the test device calculates a power value using the voltage measured at 704 and the current measured at 706. For example, at 708, the microprocessor 102 multiplies the voltage measured at 704 by the current measured at 706. The method 700 then proceeds to 710.

[0093] At 710, a technician electrically connects a plurality of test leads between a corresponding plurality of input terminals of a test device and a corresponding plurality of test points of a circuit. Figure 3L As shown, the technician electrically connects cable 332a between the positive voltage output terminal 304a' of solar panel 302' and the positive DC voltage input terminal 328a of inverter 326, and electrically connects cable 332b between the negative voltage output terminal 304b' of solar panel 302' and the negative DC voltage input terminal 328b of inverter 326. In addition, the technician electrically places clamp meter 330 around cable 332b. Method 700 then proceeds to 712.

[0094] At 712, the test device measures the current output from the solar panel 302' to the inverter 326. For example, at 712, the switches 112h and 112o electrically couple the DC current measurement circuit 116d as described above, automatically or in response to one or more user inputs. The DC current measurement circuit 116d then measures the current flowing between the input terminals 114c and 114d and outputs a signal or value corresponding to the result to the microprocessor 102. In one or more specific implementations, the microprocessor 102 provides a control signal that causes the switches 112 other than the switches 112h and 112o to be in a non-conductive state. In one or more specific implementations, the microprocessor 102 causes the display device 118 to display the result of performing the measurement or test. The method 700 then proceeds to 714.

[0095] At 714, the technician electrically connects a plurality of test leads between a corresponding plurality of input terminals of the test device and a corresponding plurality of test points of the circuit. Figure 3M and Figure 3N As shown, the technician electrically connects the first connector of the Y-type connector of the test lead 310a' to the second AC voltage output terminal 328d of the inverter 326, electrically connects the second connector of the Y-type connector of the test lead 310a' to the input terminal 114a of the test device 100, and electrically connects the connector at the other end of the test lead 310a' to the load (not shown). In addition, the technician electrically connects the first connector of the Y-type connector of the test lead to the first AC voltage output terminal 328c of the inverter 326, electrically connects the second connector of the Y-type connector of the test lead 310b' to the input terminal 114b of the test device 100, and electrically connects the connector at the other end of the test lead 310b' to the load. In addition, the technician places the clamp meter 330 around the test lead 310b. The method 700 then proceeds to 716.

[0096] At 716, the test device measures the voltage output from the inverter 326. For example, at 716, the switches 112a and 112b electrically couple the AC voltage measurement circuit 116a to the input terminals 114a and 114b automatically or in response to one or more user inputs as described above. The AC voltage measurement circuit 116a then measures the voltage across the input terminals 114a and 114b and outputs a signal or value corresponding to the result to the microprocessor 102. In one or more specific implementations, the microprocessor 102 provides a control signal that causes the switches 112 other than the switches 112a and 112b to be in a non-conductive state. In one or more specific implementations, the microprocessor 102 causes the display device 118 to display the result of performing the measurement or test. The method 700 then proceeds to 718.

[0097] At 718, the test device measures the current output from the inverter 326. For example, at 718, the switches 112g and 112p electrically couple the AC current measurement circuit 116c to the input terminals 114c and 114d, automatically or in response to one or more user inputs, as described above. The AC current measurement circuit 116c then measures the current flowing between the input terminals 114c and 114d and outputs a signal or value corresponding to the result to the microprocessor 102. In one or more specific implementations, the microprocessor 102 provides a control signal that causes the switches 112 other than the switches 112g and 112p to be in a non-conductive state. In one or more specific implementations, the microprocessor 102 causes the display device 118 to display the result of performing the measurement or test. The method 700 then proceeds to 720.

[0098] At 720, the test device calculates a power value using the voltage measured at 716 and the current measured at 718. For example, at 720, the microprocessor 102 multiplies the voltage measured at 716 by the current measured at 718. The method 700 then proceeds to 722.

[0099] At 722, the technician electrically connects a plurality of test leads between a corresponding plurality of input terminals of the test device and a corresponding plurality of test points of the circuit. Fig.3O As shown, the technician electrically connects the cable 332a between the first AC voltage output terminal 328c of the inverter 326 and the load, and electrically connects the cable 332b between the second AC voltage output terminal 328d of the inverter 326 and the load. In addition, the technician electrically connects the test lead 310c' between the input terminal 114c of the test device 100 and the first terminal of the clamp meter 330, and electrically connects the test lead 310d' between the input terminal 114d of the test device 100 and the second terminal of the clamp meter 330. In addition, the technician places the clamp meter 330 around the cable 332c. The method 700 then proceeds to 724.

[0100] At 724, the test device measures the current output from the inverter 326. For example, at 724, the switches 112g and 112p electrically couple the AC current measurement circuit 116c to the input terminals 114c and 114d, automatically or in response to one or more user inputs, as described above. The AC current measurement circuit 116c then measures the current flowing between the input terminals 114c and 114d and outputs a signal or value corresponding to the result to the microprocessor 102. In one or more specific implementations, the microprocessor 102 provides a control signal that causes the switches 112 other than the switches 112g and 112p to be in a non-conductive state. In one or more specific implementations, the microprocessor 102 causes the display device 118 to display the result of performing the measurement or test. The method 700 then ends.

[0101] As mentioned above, Figure 1 The test setup shown can be used to FIG. 3A to FIG. 3O In the test configuration shown, Figures 4 to 7Compared to conventional testing of solar energy devices, the connection of the test device 100 to the solar energy device 300 is simplified by providing the test device 100 with a set of input terminals 114 that can be electrically connected to various test points of the solar energy device 300 using test leads and remain connected to the test points of the solar energy device 300 when multiple test measurements are performed. In order to achieve the simplified connection of the test device 100 to the solar energy device 300, the microprocessor 102 of the test device 100 can control the switch 112 to electrically connect corresponding input terminals of the input terminals 114 to different measurement circuits in the measurement circuit 116 and electrically disconnect them from different measurement circuits in the measurement circuit as needed during the test.

[0102] A test device for testing a circuit according to the present disclosure may be characterized in that it includes: a plurality of input terminals, which can be connected to different test points of the circuit through test leads; a plurality of measurement circuits, which include at least a first measurement circuit and a second measurement circuit; a plurality of switches; at least one processor; and at least one processor-readable storage medium storing instructions, which, when executed by at least one processor, causes the test device to perform a first test of the circuit when one or more of the plurality of switches electrically connects at least the first input terminal and the second input terminal of the plurality of input terminals to the first measurement circuit, and to perform a second test of the circuit when one or more of the plurality of switches electrically connects at least the third input terminal and the fourth input terminal of the plurality of input terminals to the second measurement circuit, wherein the second test is different from the first test, and wherein the first test and the second test are performed without changing the connection of the plurality of input terminals of the test device to the different test points of the circuit.

[0103] The instructions may cause the testing device to control one or more switches among a plurality of switches that electrically connect at least a first input terminal and a second input terminal among a plurality of input terminals to a first measurement circuit to automatically electrically connect at least a first input terminal and a second input terminal among a plurality of input terminals to the first measurement circuit, and to control one or more switches among a plurality of switches that electrically connect at least a third input terminal and a fourth input terminal among a plurality of input terminals to a second measurement circuit to automatically electrically connect at least a third input terminal and a fourth input terminal among a plurality of input terminals to the second measurement circuit.

[0104] The test device may include a display device, and the instructions may cause the display device to display a message with instructions to connect one of the test leads to one of the input terminals and to one of the test points.

[0105] The instructions may cause the testing device to cause one or more switches among a plurality of switches that selectively electrically connect at least a first input terminal and a second input terminal among a plurality of input terminals to a first measurement circuit to electrically disconnect at least a first input terminal and a second input terminal among a plurality of input terminals from the first measurement circuit after performing a first test and before performing a second test.

[0106] The instructions may cause the test device to perform a third test of the circuit when one or more of the plurality of switches electrically couples the first input terminal and the third input terminal to the third measurement circuit, to perform a fourth test of the circuit when one or more of the plurality of switches electrically couples the second input terminal and the third input terminal to the third measurement circuit, and to perform a fifth test of the circuit when one or more of the plurality of switches electrically couples the first input terminal to the second input terminal and to the third measurement circuit and the third input terminal to the third measurement circuit. The third test and the fourth test may be method 1 tests according to the International Electrotechnical Commission (IEC) 62446-1 standard, and the fifth test may be a method 2 test according to the IEC 62446-1 standard.

[0107] The instructions may cause the testing device to perform a third test of the circuit when one or more of the plurality of switches electrically couples the first and second input terminals of the plurality of input terminals to a third measurement circuit of the plurality of measurement circuits.

[0108] The circuit may include a solar panel, a first one of the input terminals may be configured to connect to a first output terminal of the solar panel, a second one of the input terminals may be configured to connect to a second output terminal of the solar panel, a third one of the input terminals may be configured to connect to a ground or reference potential, and a fourth one of the input terminals may be configured to connect to a conductive frame of the solar panel.

[0109] The method for testing a circuit according to the present disclosure may be characterized in that it includes: before testing the circuit, electrically connecting a plurality of test leads between a corresponding plurality of input terminals of a test device and a corresponding plurality of test points of the circuit; and performing a plurality of tests of the circuit, including: selectively connecting a first measurement circuit of the test device to the circuit via a first set of input terminals and test leads and performing a first test of the circuit; and selectively connecting a second measurement circuit of the test device to the circuit via a second set of input terminals and test leads and performing a second test of the circuit, wherein the second test is different from the first test, the second set of input terminals and test leads are different from the first set of input terminals and test leads, and the first test and the second test are performed without changing the connection of the plurality of test leads between the test device and the circuit.

[0110] Selectively connecting a first measurement circuit of a test device to a circuit via a first set of input terminals and test leads may include automatically connecting the first measurement circuit of the test device to the circuit via the first set of input terminals and test leads, and selectively connecting a second measurement circuit of the test device to the circuit via a second set of input terminals and test leads may include automatically connecting the second measurement circuit of the test device to the circuit via the second set of input terminals and test leads.

[0111] The method may further include electrically disconnecting a first measurement circuit of the test device from the circuit via the first set of input terminals and test leads; and selectively connecting a third measurement circuit of the test device to the circuit via the first set of input terminals and test leads and performing a third test of the circuit.

[0112] The first group of input terminals may include a first input terminal and a second input terminal, the second group of input terminals may include a third input terminal and a fourth input terminal, and the method may further include: selectively connecting a third measurement circuit of the test device to the circuit, the first input terminal, and the third input terminal and performing a third test of the circuit, selectively connecting the third measurement circuit of the test device to the circuit, the second input terminal, and the third input terminal and performing a fourth test of the circuit, and selectively connecting the first input terminal to the second input terminal and to the third measurement circuit, and selectively connecting the third input terminal to the third measurement circuit and performing a fifth test of the circuit. The third test and the fourth test may be method 1 tests according to the International Electrotechnical Commission (IEC) 62446-1 standard, and the fifth test may be method 2 tests according to the IEC 62446-1 standard.

[0113] The method may further include electrically coupling a first one of the input terminals to a second one of the input terminals.

[0114] The circuit may include a solar panel, the test points may include a first test point, a second test point, a third test point, and a fourth test point, the first test point may be a positive output terminal of the solar panel, the second test point may be a negative output terminal of the solar panel, the third test point may be electrically coupled to a ground or reference potential of the solar panel, and the fourth test point of the circuit may be a conductive frame of the solar panel.

[0115] A system for testing a circuit according to the present disclosure may be characterized in that it includes a plurality of test leads, the plurality of test leads including at least a first test lead, a second test lead, a third test lead, and a fourth test lead, each of the plurality of test leads being connectable to a different test point of the circuit; and a test device, the test device including: a plurality of input terminals, the plurality of input terminals including at least a first input terminal configured to receive a first test lead, a second input terminal configured to receive a second test lead, a third input terminal configured to receive a third test lead, and a fourth input terminal configured to receive a fourth test lead; a plurality of measurement circuits, the plurality of measurement circuits including at least a first measurement circuit and a second measurement circuit; a plurality of switches; and at least one processor, the at least one processor being configured to: perform a first test of the circuit when one or more of the plurality of switches electrically connects the first input terminal and the second input terminal to the first measurement circuit, and perform a second test of the circuit when one or more of the plurality of switches electrically connects the third input terminal and the fourth input terminal to the second measurement circuit, wherein the second test is different from the first test, and the first test and the second test are performed without changing the connections of the plurality of test leads to the plurality of input terminals of the test device and the different test points of the circuit.

[0116] At least one processor may be further configured to: control one or more of the plurality of switches to automatically electrically connect the first input terminal and the second input terminal to the first measurement circuit, and control one or more of the plurality of switches to automatically electrically connect the third input terminal and the fourth input terminal to the second measurement circuit.

[0117] The at least one processor may be further configured to, after performing the first test and before performing the second test, control one or more of the plurality of switches to electrically disconnect at least first and second input terminals of the plurality of input terminals from the first measurement circuit.

[0118] The plurality of measurement circuits may include a third measurement circuit, and the instructions stored by the storage medium, when executed by at least one processor, may cause the test device to: perform a third test of the circuit when one or more of the plurality of switches electrically couple the first input terminal and the third input terminal to the third measurement circuit, perform a fourth test of the circuit when one or more of the plurality of switches electrically couple the second input terminal and the third input terminal to the third measurement circuit, and perform a fifth test of the circuit when one or more of the plurality of switches electrically couples the first input terminal to the second input terminal and to the third measurement circuit and the third input terminal to the third measurement circuit. The third test and the fourth test may be method 1 tests according to the International Electrotechnical Commission (IEC) 62446-1 standard, and the fifth test may be method 2 tests according to the IEC 62446-1 standard.

[0119] The various embodiments described above can be combined to provide additional embodiments. If necessary, various aspects of the embodiments can be modified to employ the concepts of the various patents, applications and publications to provide further embodiments.

[0120] In light of the above detailed description, these and other changes can be made to the embodiments. In general, in the following claims, the terms used should not be interpreted as limiting the claims to the specific embodiments disclosed in the specification and claims, but should be interpreted to include all possible embodiments and the full range of equivalents to which such claims are entitled. Therefore, the claims are not limited by the present disclosure.

Claims

1. A testing device (100) for testing a circuit (300), the testing device comprising: a plurality of input terminals (114) connectable to different test points (304a, 304b, 304c, 304d, 320a, 320b, 320c, 328a, 328b, 328c and 328d) of the circuit via test leads; A plurality of measurement circuits (116), the plurality of measurement circuits comprising at least a first measurement circuit (116b) and a second measurement circuit (116f); a plurality of switches (112); at least one processor (106); and at least one processor-readable storage medium (108), the at least one processor-readable storage medium storing instructions that, when executed by the at least one processor, cause the test device to: performing a first test of the circuit when one or more switches (112c, 112e) of the plurality of switches electrically couple a first set of the plurality of input terminals (114a, 114c) to the first measurement circuit, and A second test of the circuit is performed when one or more switches (112r, 112y) of the plurality of switches electrically couple a second set of the plurality of input terminals (114a, 114b) to the second measurement circuit, wherein the second test is different from the first test, and wherein the first test and the second test are performed without changing the connections of the plurality of input terminals of the test device to the different test points of the circuit.

2. The test device according to claim 1, wherein the instructions stored by the storage medium, when executed by the at least one processor, cause the test device to: controlling the one or more switches of the plurality of switches that electrically couple the first group of the plurality of input terminals to the first measurement circuit to automatically electrically couple the first group of the plurality of input terminals to the first measurement circuit, and Controlling the one or more switches of the plurality of switches that electrically couple the second set of the plurality of input terminals to the second measurement circuit automatically electrically couples the second set of the plurality of input terminals to the second measurement circuit.

3. The testing device according to claim 1 or claim 2, further comprising: a display device (118), The instructions stored by the storage medium, when executed by the at least one processor, cause the display device to display a message having instructions to connect one of the test leads to one of the input terminals and one of the test points.

4. The test device according to any one of claims 1 to 3, wherein the instructions stored by the storage medium, when executed by the at least one processor, cause the test device to: After performing the first test and before performing the second test, the one or more switches of the plurality of switches that selectively electrically couple the first group of the plurality of input terminals to the first measurement circuit electrically disconnect the first group of the plurality of input terminals from the first measurement circuit.

5. The test device according to any one of claims 1 to 4, wherein the instructions stored by the storage medium, when executed by the at least one processor, cause the test device to: performing a third test of the circuit when one or more switches (1121, 112k) of the plurality of switches electrically couple a first input terminal (114a) of the input terminals and a third input terminal (114c) of the input terminals to a third measurement circuit (116e), performing a fourth test of the circuit when one or more switches (112i, 112m) of the plurality of switches electrically couple a second input terminal (114b) of the input terminals and a third input terminal of the input terminals to the third measurement circuit, and A fifth test of the circuit is performed when one or more switches (112v, 112m, 112i) among the plurality of switches electrically connects the first of the input terminals to the second of the input terminals and to the third measurement circuit and electrically connects the third of the input terminals to the third measurement circuit.

6. The testing device according to claim 5, wherein: The third test and the fourth test are method 1 tests according to the International Electrotechnical Commission (IEC) 62446-1 standard, and The fifth test is a method 2 test according to the IEC 62446-1 standard.

7. The testing device according to any one of claims 1 to 6, further comprising: A third test of the circuit is performed when one or more switches of the plurality of switches electrically couple the first set of the plurality of input terminals to a third measurement circuit (116e) of the plurality of measurement circuits.

8. The testing device according to any one of claims 1 to 7, wherein: The circuit includes a solar panel, A first input terminal of the input terminals is configured to be connected to a first output terminal of the solar panel, A second input terminal of the input terminals is configured to be connected to a second output terminal of the solar panel, A third of the input terminals is configured to be connected to ground or a reference potential, and A fourth of the input terminals is configured to be connected to a conductive frame of the solar panel.

9. A method for testing a circuit, the method comprising: Prior to testing the circuit, electrically coupling a plurality of test leads between a corresponding plurality of input terminals of a test device and a corresponding plurality of test points of the circuit; as well as Perform a number of tests on the circuit including: selectively coupling a first measurement circuit of the test apparatus to the circuit via a first set of input terminals and test leads and performing a first test of the circuit, and selectively coupling a second measurement circuit of the test apparatus to the circuit via a second set of input terminals and test leads and performing a second test of the circuit, wherein: the second test is different from the first test; the second set of input terminals and test leads being different from the first set of input terminals and test leads; and The first test and the second test are performed without changing the coupling of the plurality of test leads between the test device and the circuit.

10. The testing method according to claim 9, wherein: selectively coupling the first measurement circuit of the test device to the circuit via the first set of input terminals and test leads comprises automatically coupling the first measurement circuit of the test device to the circuit via the first set of input terminals and test leads, and Selectively coupling the second measurement circuit of the test device to the circuit via the second set of input terminals and test leads includes automatically coupling the second measurement circuit of the test device to the circuit via the second set of input terminals and test leads.

11. The test method according to claim 9 or claim 10, further comprising: electrically disconnecting the first measurement circuit of the test device from the circuit via the first set of input terminals and test leads; as well as A third measurement circuit of the test device is selectively coupled to the circuit via the first set of input terminals and test leads and a third test of the circuit is performed.

12. The test method according to any one of claims 9 to 11, wherein: The first group of input terminals includes a first input terminal and a second input terminal, The second group of input terminals includes a third input terminal and a fourth input terminal, and The method further comprises: selectively coupling a third measurement circuit of the test apparatus to the circuit, the first input terminal, and the third input terminal, and performing a third test of the circuit, selectively coupling the third measurement circuit of the test apparatus to the circuit, the second input terminal, and the third input terminal, and performing a fourth test of the circuit, and selectively coupling the first input terminal to the second input terminal and to the third measurement circuit, and selectively coupling the third input terminal to the third measurement circuit and performing a fifth test of the circuit, Wherein optionally: The third test and the fourth test are method 1 tests according to the International Electrotechnical Commission (IEC) 62446-1 standard, and The fifth test is a method 2 test according to the IEC 62446-1 standard.

13. The test method according to any one of claims 9 to 12, further comprising: A first one of the input terminals is electrically coupled to a second one of the input terminals.

14. The test method according to any one of claims 9 to 13, wherein: The circuit includes a solar panel, The test points include a first test point, a second test point, a third test point and a fourth test point, The first test point is the positive output terminal of the solar panel, The second test point is the negative output terminal of the solar panel, The third test point is electrically coupled to the ground or reference potential of the solar panel, and The fourth test point of the circuit is the conductive frame of the solar panel.

15. A system for testing a circuit, the system comprising: A plurality of test leads, the plurality of test leads comprising at least a first test lead (310a), a second test lead (310b), a third test lead (310c) and a fourth test lead (310d), each of the plurality of test leads being connectable to a different test point of the circuit; and A test device according to any one of claims 1 to 8, wherein the plurality of input terminals include at least a first input terminal (114a) configured to receive the first test lead, a second input terminal (114b) configured to receive the second test lead, a third input terminal (114c) configured to receive the third test lead, and a fourth input terminal (114d) configured to receive the fourth test lead.

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