Micropore treatment process for high-precision ceramic circuit board

Abstract

The invention relates to the technical field of ceramic substrate processing, in particular to a high-precision ceramic circuit board micropore treatment process, which comprises the following steps: S1, raw material preparation: checking the integrity and flatness parameters of a high-precision ceramic circuit board raw material to ensure that the high-precision ceramic circuit board raw material meets the processing requirements, and placing the qualified raw material in a material waiting area at the starting end of a conveying mechanism; s3, positioning and feeding: when the ceramic circuit board arrives at a specific position, close to the laser drilling workbench, of the conveying mechanism, conveying the ceramic circuit board to the laser drilling workbench; the first main plate butt joint groove, the second main plate butt joint groove and the third toothed plate butt joint groove cooperate with the connecting bolt, the connecting bolt is acted by the ejector block along the first butt joint groove, the clamping block and the butt joint teeth are precisely driven to unlock, the toothed plate is meshed with the first gear and is driven by the second gear to enable the butt joint ring to rotate by 180 degrees, the direction of the chuck is precisely adjusted, manual errors are avoided, and the micropore machining precision is improved.

Description

Technical Field

[0001] The invention relates to the technical field of ceramic substrate processing, and in particular to a high-precision ceramic circuit board micro-hole processing process. Background Art

[0002] With the rapid development of modern electronic technology, high-precision ceramic circuit boards are increasingly used in high-performance electronic devices. Such ceramic circuit boards have excellent electrical properties, high thermal stability and mechanical strength, and can meet the needs of complex electronic systems. However, the hardness and brittleness of ceramic materials pose many challenges during the processing, especially in the micropore processing stage.

[0003] Traditional micro-hole processing technology for ceramic circuit boards usually relies on mechanical drilling or punching methods, but these methods have many limitations when processing high-precision, small apertures. In recent years, laser drilling technology has gradually emerged in the micro-hole processing of ceramic circuit boards due to its high precision, high efficiency and non-contact processing characteristics. Laser drilling focuses a high-energy laser beam on the material, causing the material to melt and vaporize rapidly, thereby forming micro-holes. However, laser drilling technology also faces some problems in the application process, especially in automated production lines. How to realize automatic loading and unloading of ceramic circuit boards before and after laser drilling has become a key factor restricting production efficiency and quality.

[0004] Traditional loading and unloading methods mostly rely on manual operation, which is not only inefficient, but also prone to human errors, affecting the accuracy and consistency of microholes. In addition, manual operation also has safety hazards, especially during laser drilling. Strict safety protection measures are required to avoid laser damage to operators. Summary of the invention

[0005] The present invention discloses a high-precision ceramic circuit board micro-hole processing process to solve the problem that the traditional loading and unloading methods proposed in the above background technology mostly adopt manual operation, which is not only inefficient, but also easy to introduce human errors, affecting the accuracy and consistency of the micro-holes. In addition, manual operation also has safety hazards, especially in the laser drilling process, strict safety protection measures are required to avoid laser damage to the operator.

[0006] In order to solve the above technical problems, a technical solution adopted by the present invention is: to provide a high-precision ceramic circuit board micro-hole processing process, including S1, raw material preparation: check the integrity and flatness parameters of the high-precision ceramic circuit board raw materials to ensure that they meet the processing requirements, and place qualified raw materials in the waiting area at the starting end of the conveying mechanism;

[0007] S2, loading start: the conveying mechanism starts to convey the unprocessed ceramic circuit board along the set track toward the laser drilling workbench;

[0008] S3, Positioning and loading: When the ceramic circuit board reaches a specific position of the conveying mechanism close to the laser drilling workbench, the laser drilling workbench will accurately grab the ceramic circuit board and lift it, and then translate it to the processing position of the laser drilling workbench for precise positioning and installation, ready for laser drilling;

[0009] S4, laser drilling: according to the preset micro-hole processing parameters, the ceramic circuit board is drilled. During the drilling process, the equipment monitors the drilling status in real time and fine-tunes the parameters to ensure the quality of the micro-holes;

[0010] S5, material transfer: After the laser drilling is completed, the laser drilling workbench will clamp the processed ceramic circuit board and move it to the top of the output mechanism, and then release the clamping to make the ceramic circuit board fall to the output mechanism;

[0011] S6, output transmission: the output mechanism transports the processed ceramic circuit board to the subsequent quality inspection area or semi-finished product storage area;

[0012] S7, cyclic loading: while the output mechanism is conveying the processed ceramic circuit board, the conveying mechanism is started again to convey the next unprocessed ceramic circuit board to the clamping position, and the above positioning, loading and laser drilling steps are repeated to realize a continuous automated processing cycle;

[0013] Wherein, the laser drilling workbench described in S3 includes a main body mechanism and a material taking mechanism;

[0014] The main body mechanism comprises a base, and a punching platform and a feeding mechanism are respectively arranged at two ends of the top of the base, and the material taking mechanism is arranged at the top of the base between the punching platform and the feeding mechanism;

[0015] The material picking mechanism includes a docking rod, and the docking rod includes a limiting column fixedly connected to the top of the base, and a rack assembly is symmetrically arranged on the top and bottom of the inner side of the limiting column, and the rack assembly includes a main board fixedly connected to the limiting column, and a tooth plate is slidably connected to the inside of the main board close to the feeding mechanism, and docking grooves three are symmetrically provided on both sides of the tooth plate, and a docking groove one and a docking groove two are penetrated through the outer wall of the main board near the docking groove three, and a material picking head is arranged outside the docking rod, and the material picking head includes a lifting seat slidably installed on the outer wall of the limiting column, and a docking interface three is penetrated through the position of the top of the lifting seat corresponding to the rack assembly, and a docking ring is rotatably connected to the circumferential outer surface of the lifting seat, and docking teeth are arranged on the circumferential inner wall of the docking ring, and a switching assembly is arranged inside the lifting seat near the docking interface three and the docking teeth.

[0016] The present invention is further configured as follows: the switching assembly includes a fixed shell fixedly connected to the inner wall of the lifting seat, a docking interface 1 is provided at the top and bottom of the fixed shell corresponding to the docking interface 3, a gear 1 is rotatably connected inside the docking interface 1, a docking interface 2 is provided at a position on the outer wall of the fixed shell close to the docking teeth, a gear 2 is rotatably connected inside the docking interface 2, the gear 2 is respectively meshed with the gear 1 and the docking teeth, a limiting shell is provided at another position outside the fixed shell close to the docking teeth, a card block is slidably connected inside the limiting shell, and the card block is meshed with the docking teeth.

[0017] The present invention is further configured such that a spring 1 is disposed on the outer wall of the clamping block located inside the limiting shell, and one end of the spring 1 is connected to the inner wall of the limiting shell.

[0018] The present invention is further configured such that spring 2 is arranged between the tooth plate and the main board, the docking groove 1 is connected to the docking groove 2, the top end of the docking groove 1 is curved, and a top block is arranged inside the docking groove 2 near the top end.

[0019] The present invention is further configured such that one end of the clamping block extends into the interior of the fixed shell and is fixedly connected with a connecting block, a connecting bolt is slidably installed inside the connecting block at a position flush with the axis of the gear, and one end of the connecting bolt extends into the interior of the docking port.

[0020] The present invention is further configured such that one end of the connecting bolt located inside the connecting block is provided with a spring three connected to the inside of the connecting block.

[0021] The present invention is further configured such that a screw is rotatably connected inside the limit column, a driving motor with an output end fixedly connected to the screw is provided at the top of the limit column, a screw hole is provided at a position corresponding to the screw at the top of the lifting seat, the screw is threadedly connected to the inner wall of the screw hole, and a chuck is provided on the circumferential outer surface of the docking ring.

[0022] Beneficial effects of a high-precision ceramic circuit board micropore processing process of the present invention:

[0023] 1. Through the unique design of the docking rod in the material picking mechanism, the limit column cooperates with the screw rod, and under the drive of the drive motor, the lifting and lowering of the material picking head can be accurately controlled. When the material picking head rises and interacts with the rack assembly on the inner top of the limit column, the docking groove 1 and docking groove 2 on the main board of the rack assembly and the docking groove 3 of the tooth plate work together with the connecting bolt. Under the action of spring 2, the tooth plate is initially aligned with docking groove 1. When the connecting bolt moves along docking groove 1 and is affected by the top block, it can accurately drive the block to release the meshing lock with the docking teeth in the docking ring, and at the same time make the tooth plate mesh with gear 1, and then drive the docking to rotate 180 degrees through the transmission of gears 1 and 2, so as to achieve precise adjustment of the chuck direction, ensure that the ceramic circuit board can be accurately grasped and placed during the material picking and placing process, effectively avoid the problem of inaccurate positioning caused by human errors in traditional manual operations, and greatly improve the accuracy of micro-hole processing.

[0024] 2. The block in the switching assembly is engaged and locked with the docking teeth under the action of spring 1. This connection method can effectively prevent the docking ring from driving the chuck to shake during the non-rotating operation of the material picking head, such as when moving to the punching table or feeding mechanism after picking up the material. Even if there is a slight external force interference during the operation of the equipment, the chuck can still maintain a stable posture due to the stable engagement of the block and the docking teeth, thereby ensuring the stability of the ceramic circuit board during the transfer process, reducing the damage to the circuit board or processing deviation caused by shaking, and further improving the processing quality.

[0025] 3. The feeding mechanism and the retrieving mechanism in the main mechanism cooperate with each other to realize the automatic loading and unloading of ceramic circuit boards before and after drilling. The feeding assembly and the discharging assembly of the feeding mechanism respectively provide the circuit boards to be processed and transport the processed circuit boards in an orderly manner, and the retrieving mechanism automatically completes the transfer of circuit boards between different workstations based on the precise connection and action coordination of its internal components. Compared with the traditional manual loading and unloading method, it not only greatly improves the production efficiency, but also avoids the safety hazards of manual operation in the laser drilling environment, ensures the personal safety of the operator, is conducive to stable and efficient operation in the automated production line, and meets the needs of large-scale production of high-precision ceramic circuit board micro-hole processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, a detailed description is given below in conjunction with the accompanying drawings.

[0027] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the present invention should be understood by people with ordinary skills in the field to which the present invention belongs. The words "first", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0028] Figure 1 This is a flow chart of a high-precision ceramic circuit board micro-hole processing process according to an embodiment of the present invention;

[0029] Figure 2 It is a three-dimensional structural schematic diagram of an embodiment of the present invention;

[0030] Figure 3 This is a schematic diagram of the form switching of an embodiment of the present invention;

[0031] Figure 4 It is a schematic diagram of the structure of the separation of an embodiment of the present invention;

[0032] Figure 5 This is a separation diagram of the material taking mechanism of an embodiment of the present invention;

[0033] Figure 6 An exploded view of a material taking head according to an embodiment of the present invention;

[0034] Figure 7 is an enlarged view of a switching component according to an embodiment of the present invention;

[0035] Figure 8 An exploded diagram of a switching component according to an embodiment of the present invention;

[0036] Fig. 9 An exploded view of a docking rod according to an embodiment of the present invention;

[0037] Fig.10 is an enlarged view of a rack assembly according to an embodiment of the present invention;

[0038] Fig.11 1 is an exploded view of a rack assembly according to an embodiment of the present invention.

[0039] The markings in the figure are:

[0040] 1. Main body; 11. Base; 12. Punching table; 13. Feeding mechanism;

[0041] 2. Material taking mechanism; 21. Docking rod; 211. Limiting column; 212. Driving motor; 213. Screw rod; 214. Rack assembly; 2141. Main board; 2142. Docking slot 1; 2143. Docking slot 2; 2144. Top block; 2145. Tooth plate; 2146. Docking slot 3; 2147. Spring 2;

[0042] 22, material taking head; 221, lifting seat; 222, docking ring; 2221, docking teeth; 223, chuck; 224, switching assembly; 2241, fixed shell; 22411, limit shell; 2242, docking interface 1; 2243, gear 1; 2244, docking interface 2; 2245, gear 2; 2246, block; 22461, spring 1; 2247, connecting block; 2248, connecting bolt;

[0043] 225. Screw hole; 226. Docking port three. DETAILED DESCRIPTION

[0044] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other; the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left" and "right" etc. indicate directions or positional relationships based on directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the positions or elements referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limitations of the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance. In addition, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense, for example, "connection" can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or a transmission connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements.

[0046] See also Figure 1-Figure 11 , a high-precision ceramic circuit board micro-hole processing process, comprising:

[0047] S1. Raw material preparation: Check the integrity and flatness parameters of the high-precision ceramic circuit board raw materials to ensure that they meet the processing requirements, and place qualified raw materials in the waiting area at the starting end of the conveying mechanism;

[0048] S2, loading start: the conveying mechanism starts to convey the unprocessed ceramic circuit board along the set track toward the laser drilling workbench;

[0049] S3, Positioning and loading: When the ceramic circuit board reaches a specific position of the conveying mechanism close to the laser drilling workbench, the laser drilling workbench will accurately grab the ceramic circuit board and lift it, and then translate it to the processing position of the laser drilling workbench for precise positioning and installation, ready for laser drilling;

[0050] S4, laser drilling: according to the preset micro-hole processing parameters, the ceramic circuit board is drilled. During the drilling process, the equipment monitors the drilling status in real time and fine-tunes the parameters to ensure the quality of the micro-holes;

[0051] S5, material transfer: After the laser drilling is completed, the laser drilling workbench will clamp the processed ceramic circuit board and move it to the top of the output mechanism, and then release the clamping to make the ceramic circuit board fall to the output mechanism;

[0052] S6, output transmission: the output mechanism transports the processed ceramic circuit board to the subsequent quality inspection area or semi-finished product storage area;

[0053] S7, cyclic loading: while the output mechanism is conveying the processed ceramic circuit board, the conveying mechanism is started again to convey the next unprocessed ceramic circuit board to the clamping position, and the above positioning, loading and laser drilling steps are repeated to realize a continuous automated processing cycle;

[0054] Among them, the laser drilling workbench in S3 includes a main body mechanism 1 and a material taking mechanism 2;

[0055] The main body mechanism 1 includes a base 11, and a punching platform 12 and a feeding mechanism 13 are respectively arranged at two ends of the top of the base 11, and the material taking mechanism 2 is arranged at the top of the base 11 between the punching platform 12 and the feeding mechanism 13;

[0056] The material taking mechanism 2 includes a docking rod 21, and the docking rod 21 includes a limit column 211 fixedly connected to the top of the base 11. The inner top and bottom of the limit column 211 are symmetrically provided with a rack assembly 214. The rack assembly 214 includes a main board 2141 fixedly connected to the limit column 211. A tooth plate 2145 is slidably connected to the inside of the main board 2141 near the feeding mechanism 13. The tooth plate 2145 has docking grooves 2146 symmetrically opened on both sides. The outer wall of the main board 2141 near the docking groove 2146 is penetrated by a docking groove One 2142, a docking groove two 2143, a material picking head 22 is arranged on the outside of the docking rod 21, and the material picking head 22 includes a lifting seat 221 slidably installed on the outer wall of the limiting column 211, and a docking port three 226 is penetrated through the position of the top of the lifting seat 221 corresponding to the rack assembly 214, and a docking ring 222 is rotatably connected to the outer surface of the lifting seat 221, and a docking tooth 2221 is arranged on the inner wall of the docking ring 222, and a switching component 224 is arranged inside the lifting seat 221 near the docking port three 226 and the docking tooth 2221.

[0057] By adopting the above technical solution, the limiting column 211 of the material taking mechanism 2 is fixedly connected to the base 11, playing a supporting and guiding role. In the inner symmetrical rack assembly 214, the main board 2141 is fixed to the limiting column 211, and the tooth plate 2145 that is slidably connected inside has docking grooves 3 2146 on both sides. The docking grooves 1 2142 and 2143 on the outer wall of the main board 2141 are interconnected and have a special shape design, which is used to coordinate with other components to control the movement of the material taking head 22. The material taking head 22 on the docking rod 21, its lifting seat 221 is slidably matched with the limiting column 211 and driven to rise and fall by the screw 213 and the driving motor 212, and the top docking port 3 226 is used to dock with the rack assembly 214. The docking ring 222 outside the lifting seat 221 is rotatable, and the docking teeth 2221 on the inner wall of the circumference are associated with the internal switching assembly 224. The switching assembly 224 uses the cooperation of various components to accurately control the rotation and locking of the docking ring 222 to ensure accurate and stable material taking and discharging.

[0058] The switching assembly 224 includes a fixed shell 2241 fixedly connected to the inner wall of the lifting seat 221, a docking interface 1 2242 is provided at the top and bottom of the fixed shell 2241 at positions corresponding to the docking interface 3 226, and a gear 1 2243 is rotatably connected inside the docking interface 1 2242, a docking interface 2244 is provided at a position near the docking tooth 2221 on the outer wall of the fixed shell 2241, and a gear 2245 is rotatably connected inside the docking interface 2244, and the gear 2245 is respectively meshed with the gear 1 2243 and the docking tooth 2221, and a limit shell 22411 is provided at another position near the docking tooth 2221 on the outside of the fixed shell 2241, and the limit shell 22411 slides inside It is connected with a clamping block 2246, which is meshed with the docking tooth 2221. One end of the clamping block 2246 extends to the interior of the fixed shell 2241 and is fixedly connected with a connecting block 2247. A connecting bolt 2248 is slidably installed in the interior of the connecting block 2247 at a position flush with the axis of the gear 1 2243. One end of the connecting bolt 2248 extends to the interior of the docking interface 1 2242. One end of the connecting bolt 2248 located in the interior of the connecting block 2247 is provided with a spring 3 connected to the interior of the connecting block 2247. The outer wall of the clamping block 2246 located in the interior of the limiting shell 22411 is provided with a spring 1 22461, and one end of the spring 1 22461 is connected to the inner wall of the limiting shell 22411.

[0059] By adopting the above technical solution, the fixed shell 2241 is connected to the lifting seat 221, and its docking interface 1 2242 is used to place the gear 1 2243 and guide the connecting bolt 2248. The tooth plate 2145 is engaged with the gear 1 2243 to drive it to rotate and transmit force to the gear 2 2245. The docking interface 2244 positions the gear 2 2245 so that it is stably engaged with the docking teeth 2221 and the gear 1 2243 to control the rotation of the docking ring 222. The limiting shell 22411 guides the limiting block 2246, and the block 2246 is engaged with the docking teeth 2221 to lock the docking ring 222, and its connecting block 2247 and connecting bolt 2248 can be unlocked under the action of a specific structure. The spring three assists the connecting bolt 2248 to reset, and the spring one 22461 makes the block 2246 initially locked and participates in the reset, so as to ensure the stability of the switching component 224 and ensure accurate and efficient material collection.

[0060] The tooth plate 2145 is located between the main plate 2141 and the spring 2147 is arranged. The docking groove 1 2142 is connected with the docking groove 2143. The top of the docking groove 1 2142 is curved. A top block 2144 is arranged near the top of the docking groove 2143.

[0061] By adopting the above technical solution, spring 2147 provides initial position holding force for tooth plate 2145, so that docking groove 3 2146 of tooth plate 2145 can be aligned with docking groove 1 2142 under normal conditions. Docking groove 1 2142 is connected to docking groove 2 2143 and the top of docking groove 1 2142 is curved. This special shape cooperates with connecting bolt 2248. When connecting bolt 2248 moves along it, it is affected by the curved section and subsequent structures and produces displacement. The top block 2144 in docking groove 2143 is close to the top, which plays a blocking role when connecting bolt 2248 moves in the curved section of docking groove 1 2142, forcing it to move along a specific path of docking groove 1 2142, thereby triggering a series of actions such as the release of the engagement and locking of the block 2246 and the docking tooth 2221, so as to realize the functions such as the rotation control of docking ring 222.

[0062] A screw rod 213 is rotatably connected inside the limiting column 211, a driving motor 212 whose output end is fixedly connected to the screw rod 213 is arranged on the top of the limiting column 211, a screw hole 225 is opened at the position corresponding to the screw rod 213 on the top of the lifting seat 221, the screw rod 213 is threadedly connected to the inner wall of the screw hole 225, and a chuck 223 is arranged on the circumferential outer surface of the docking ring 222.

[0063] By adopting the above technical solution, the limit column 211 serves as a key supporting structure, and the internally rotatably connected screw 213 is connected to the top drive motor 212. The drive motor 212 provides a power source for the rotation of the screw 213. When the motor is running, the screw 213 rotates accordingly. The screw hole 225 at the top of the lifting seat 221 forms a threaded connection with the screw 213. During the rotation of the screw 213, according to the principle of thread transmission, the lifting seat 221 is driven to move linearly up and down along the outer wall of the limit column 211, thereby realizing the precise position adjustment of the material taking head 22 in the vertical direction. The chuck 223 arranged on the outer surface of the circumference of the docking ring 222 is used to grab the ceramic circuit board. The chuck 223 has a retractable function and can flexibly adjust the opening and closing state when taking and releasing materials, so as to accurately grab and release the circuit board and ensure the smooth loading and unloading operations.

[0064] The working principle and use process of the embodiment of the present invention are as follows:

[0065] The feeding mechanism 13 includes a feeding assembly for conveying the ceramic circuit board to be processed, and also includes a discharging assembly arranged above the feeding mechanism 13 for conveying the processed ceramic circuit board away. In a normal state, the material taking head 22 is located in the middle of the limiting column 211, and the chuck 223 arranged outside the docking ring 222 is on the side close to the punching table 12. The chuck 223 is of a retractable design. The block 2246 in the switching assembly 224 is pushed by the spring 1 22461 to engage with the docking tooth 2221 inside the docking ring 222. The butt teeth 2221 are meshed with each other, thereby locking the butt teeth 2221 to prevent the butt ring 222 from rotating. The top block 2144 in the butt groove 2143 is arranged at a position close to the top of the butt groove 1 2142, and the thickness of the top block 2144 is greater than the bottom. When the tooth plate 2145 is in a normal state, the butt groove 3 2146 is aligned with the butt groove 1 2142 due to the push of the spring 2147. The butt groove 2143 and the opening of the curved top of the butt groove 1 2142 are on a vertical line.

[0066] When clamping the ceramic circuit board to be processed, the driving motor 212 controls the material picking head 22 to move up and down along the limiting column 211 through the screw 213. When the material picking head 22 moves up to meet the rack assembly 214 above the inside of the limiting column 211, the rack assembly 214 will be inserted into the inside of the lifting seat 221 through the docking interface 3 226, and then inserted into the docking interface 1 2242 of the switching assembly 224. After the rack assembly 214 is inserted, the connecting bolt 2248 will just be stuck in the opening of the curved top end of the docking groove 1 2142. When it moves along the curved section of the docking groove 1 2142, it will encounter the top block 2144 in the docking groove 2 2143. Because of the obstruction of the top block 2144, it can only continue to move along the docking groove 1 2142 moves, and at the same time, because the opening position of the curved top of the docking groove 1 2142 corresponds to the connecting bolt 2248, and the other positions are deviated, the connecting bolt 2248 will be displaced due to the restriction of the docking groove 1 2142 and the pulling of the connecting bolt 2248. When the connecting bolt 2248 moves, it will pull the block 2246 through the connecting block 2247, and the block 2246 moves and slowly releases the meshing lock with the docking tooth 2221. When the lock is completely released, the connecting bolt 2248 moves to the normal vertical section of the docking groove 1 2142, and the connecting bolt 2248 will also be synchronously docked with the docking groove 3 2146 of the tooth plate 2145 due to the docking groove 1 2142, and the tooth plate 2145 will mesh with the gear 1 2243

[0067] As the material taking head 22 continues to move upward, gear 1 2243 rotates due to the docking with the tooth plate 2145, and gear 1 2243 drives gear 2 2245 to rotate. The rotation of gear 2 2245 drives the docking ring 222 to rotate through the docking tooth 2221. When the docking ring 222 drives the chuck 223 to rotate 180 degrees, gear 1 2243 disengages from the tooth plate 2145, and the connecting bolt 2248 also moves to the connection between the tail end of the docking groove 1 2142 and the docking groove 2 2143. At this time, after losing the restriction of the docking groove 1 2142, the spring 1 22461 will push the clamp 223 to rotate 180 degrees. Block 2246, connecting block 2247, and connecting bolt 2248 are reset, and the block 2246 will mesh and lock with the docking tooth 2221 again, and the connecting bolt 2248 will also move to the inside of the docking groove 2143. Because the strength of spring 1 22461 is greater than that of spring 2147, the connecting bolt 2248 will pull the tooth plate 2145 to displace while resetting. Because the connecting bolt 2248 and the center of gear 1 2243 are on the same horizontal line, the tooth plate 2145 here will be pulled to disengage from gear 1 2243. The meshing lock is used to prevent the docking ring 222 from driving the chuck 223 to shake.

[0068] When the docking ring 222 drives the chuck 223 to rotate 180 degrees, it will reach the discharging assembly of the feeding mechanism 13. Because there is no processed ceramic circuit board, the material taking head 22 will fall along the docking groove 2143. Because the tooth plate 2145 and the gear 1 2243 are disengaged, and the block 2246 is engaged and locked with the docking tooth 2221, the docking ring 222 will no longer rotate during the falling process of the feeding mechanism 13. When the material taking head 22 moves down to the feeding mechanism 13 to clamp the raw material and then continues to fall, the faller meets the rack assembly 214 at the bottom of the limiting column 211. Then, consistent with the above steps, only after the docking ring 222 drives the chuck 223 to rotate 180 degrees, the ceramic circuit board will be placed on the punching table 12 for punching, and then the ceramic circuit board will be clamped after the punching is completed and the above steps will be continued.

[0069] In summary, compared with the prior art, the embodiments of the present invention have the following advantages:

[0070] Advantage 1: Through the unique structural design of the material picking mechanism 2, such as the coordinated cooperation between the limit column 211, the screw 213, the rack assembly 214 of the docking rod 21 and the switching assembly 224 of the material picking head 22, precise rotation control of the docking ring 222 and its chuck 223 is achieved. When the material picking head 22 rises and meets the rack assembly 214 above the inside of the limiting column 211, the rack assembly 214 is inserted into the inside of the lifting seat 221 and the docking interface 1 2242 of the switching assembly 224. With the help of the linkage of the docking groove 1 2142, the top block 2144 in the docking groove 2143 and the connecting bolt 2248, the connecting block 2247 and the clamping block 2246, the engagement locking and release of the clamping block 2246 and the docking tooth 2221 can be accurately controlled, so that the docking ring 222 drives the chuck 223 to rotate one hundred and eighty degrees, thereby realizing the accurate adjustment of the posture of the chuck 223 when taking and placing materials between different workstations, effectively avoiding the position error caused by manual operation, and improving the accuracy and consistency of micro-hole machining.

[0071] Advantage 2: The meshing and locking design of the block 2246 and the docking teeth 2221 in the switching assembly 224 can effectively prevent the docking ring 222 from shaking due to external forces when the docking ring 222 does not need to rotate. For example, during the movement of the material taking head 22, such as moving to the punching table 12 after taking the material from the feeding mechanism 13 or in other non-rotating operation stages, the meshing and locking of the block 2246 and the docking teeth 2221 ensures the stability of the chuck 223, so that the ceramic circuit board can remain stable during the transfer process, avoiding processing deviation or damage caused by shaking, and further ensuring the processing quality.

[0072] Advantage 3: The entire device realizes automatic loading and unloading of ceramic circuit boards before and after drilling through the close cooperation between the feeding mechanism 13 of the main mechanism 1 and the material taking mechanism 2. The feeding assembly and the material discharging assembly of the feeding mechanism 13 are responsible for conveying the ceramic circuit boards to be processed and sending away the processed ones respectively. The material taking mechanism 2, driven by the driving motor 212, the screw 213 and other components, accurately transfers the ceramic circuit boards between different workstations according to the preset program and the interaction of the mechanical structure without manual intervention, which greatly improves the production efficiency. At the same time, it avoids the safety hazards faced by manual operation during laser drilling, ensures the safety of the operator, and provides strong support for the stable operation of the automated production line.

[0073] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A high-precision ceramic circuit board micro-hole processing process, characterized in that: include: S1. Raw material preparation: Check the integrity and flatness parameters of the high-precision ceramic circuit board raw materials to ensure that they meet the processing requirements, and place qualified raw materials in the waiting area at the starting end of the conveying mechanism; S2, loading start: the conveying mechanism starts to convey the unprocessed ceramic circuit board along the set track toward the laser drilling workbench; S3, Positioning and loading: When the ceramic circuit board reaches a specific position of the conveying mechanism close to the laser drilling workbench, the laser drilling workbench will accurately grab the ceramic circuit board and lift it, and then translate it to the processing position of the laser drilling workbench for precise positioning and installation, ready for laser drilling; S4, laser drilling: according to the preset micro-hole processing parameters, the ceramic circuit board is drilled. During the drilling process, the equipment monitors the drilling status in real time and fine-tunes the parameters to ensure the quality of the micro-holes; S5, material transfer: After the laser drilling is completed, the laser drilling workbench will clamp the processed ceramic circuit board and move it to the top of the output mechanism, and then release the clamping to make the ceramic circuit board fall to the output mechanism; S6, output transmission: the output mechanism transports the processed ceramic circuit board to the subsequent quality inspection area or semi-finished product storage area; S7, cyclic loading: while the output mechanism is conveying the processed ceramic circuit board, the conveying mechanism is started again to convey the next unprocessed ceramic circuit board to the clamping position, and the above positioning, loading and laser drilling steps are repeated to realize a continuous automated processing cycle; Wherein, the laser drilling workbench described in S3 includes a main body mechanism and a material taking mechanism; The main body mechanism comprises a base, and a punching platform and a feeding mechanism are respectively arranged at two ends of the top of the base, and the material taking mechanism is arranged at the top of the base between the punching platform and the feeding mechanism; The material picking mechanism includes a docking rod, and the docking rod includes a limiting column fixedly connected to the top of the base, and a rack assembly is symmetrically arranged on the top and bottom of the inner side of the limiting column, and the rack assembly includes a main board fixedly connected to the limiting column, and a tooth plate is slidably connected to the inside of the main board close to the feeding mechanism, and docking grooves three are symmetrically provided on both sides of the tooth plate, and a docking groove one and a docking groove two are penetrated through the outer wall of the main board near the docking groove three, and a material picking head is arranged outside the docking rod, and the material picking head includes a lifting seat slidably installed on the outer wall of the limiting column, and a docking interface three is penetrated through the position of the top of the lifting seat corresponding to the rack assembly, and a docking ring is rotatably connected to the circumferential outer surface of the lifting seat, and docking teeth are arranged on the circumferential inner wall of the docking ring, and a switching assembly is arranged inside the lifting seat near the docking interface three and the docking teeth.

2. A high-precision ceramic circuit board micro-hole processing process according to claim 1, characterized in that: The switching assembly includes a fixed shell fixedly connected to the inner wall of the lifting seat, a docking interface 1 is provided at the top and bottom of the fixed shell corresponding to the docking interface 3, a gear 1 is rotatably connected inside the docking interface 1, a docking interface 2 is provided at a position on the outer wall of the fixed shell close to the docking teeth, a gear 2 is rotatably connected inside the docking interface 2, the gear 2 is respectively meshed with the gear 1 and the docking teeth, a limiting shell is provided at another position outside the fixed shell close to the docking teeth, a card block is slidably connected inside the limiting shell, and the card block is meshed with the docking teeth.

3. A high-precision ceramic circuit board micro-hole processing process according to claim 2, characterized in that: The outer wall of the clamping block located inside the limiting shell is provided with a spring 1, and one end of the spring 1 is connected to the inner wall of the limiting shell.

4. A high-precision ceramic circuit board micro-hole processing process according to claim 1, characterized in that: The tooth plate is located between the main board and a second spring is arranged. The first docking slot is connected to the second docking slot. The top end of the first docking slot is curved. A top block is arranged inside the second docking slot near the top end.

5. A high-precision ceramic circuit board micro-hole processing process according to claim 2, characterized in that: One end of the clamping block extends into the interior of the fixed shell and is fixedly connected with a connecting block, a connecting bolt is slidably installed in the interior of the connecting block at a position flush with the axis of the gear, and one end of the connecting bolt extends into the interior of the docking port.

6. A high-precision ceramic circuit board micro-hole processing process according to claim 5, characterized in that: One end of the connecting bolt located inside the connecting block is provided with a spring three connected to the inside of the connecting block.

7. A high-precision ceramic circuit board micro-hole processing process according to claim 1, characterized in that: A screw is rotatably connected inside the limiting column, a driving motor with an output end fixedly connected to the screw is arranged on the top of the limiting column, a screw hole is opened at the position corresponding to the screw on the top of the lifting seat, the screw is threadedly connected to the inner wall of the screw hole, and a chuck is arranged on the circumferential outer surface of the docking ring.

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