Switching device

Abstract

The switching device is provided with a ten-way valve. The ten-way valve includes a lower body (first spool), an upper body (second spool), and a drive plate (third spool). The switching device switches the overlapping state of the openings (first openings) of the plurality of groove parts (first groove parts) of the lower main body, the groove parts (second groove parts) of the upper main body, and the through holes of the drive plate in the Z direction (axial direction) by rotating the upper main body and the drive plate relative to the lower main body.

Description

Technical Field

[0001] The present disclosure relates to a switching device. Background Art

[0002] Japanese Patent Application Laid-Open No. 2021-154767 discloses a thermal management system provided with a switching valve for switching a flow path of a heat medium. Summary of the invention

[0003] In the above-mentioned Japanese Patent Application Laid-Open No. 2021-154767, as described above, the flow path of the heat medium is switched by the switching valve. A switching device capable of efficiently switching the flow path of the heat medium (heat medium) is desired.

[0004] The present disclosure has been made to solve the above-mentioned problems, and an object of the present disclosure is to provide a switching device capable of efficiently switching a flow path of a heat medium.

[0005] A switching device according to a first aspect of the present disclosure is a switching device provided in a heat management circuit in which a heating medium flows, and includes a valve unit and a plurality of flow pipes connected to the valve unit.

[0006] The valve core unit includes: a first valve core in the form of a circular plate; a second valve core in the form of a circular plate, which is configured to be able to rotate relative to the first valve core around a rotation center line and is arranged on one side of the first valve core in the axial direction along which the rotation center line extends; and a third valve core in the form of a circular plate, which is configured to be clamped by the first valve core and the second valve core in the axial direction and is configured to be able to rotate relative to the first valve core around the rotation center line.

[0007] The first valve core includes: an outer peripheral wall, which extends in a ring shape with the rotation center line as the center; an inner peripheral wall, which extends in a ring shape with the rotation center line as the center and is formed at a position closer to the rotation center line than the outer peripheral wall; and 10 partition walls, which are arranged to separate the space between the inner peripheral wall and the outer peripheral wall in the circumferential direction with the rotation center line as the center.

[0008] The first valve body is provided with ten first grooves formed by ten partition walls between the outer peripheral wall and the inner peripheral wall.

[0009] The ten first grooves each have a first opening opened on the second valve body side and a second opening formed in the outer peripheral wall.

[0010] The second openings of some of the ten first grooves allow the heat medium to flow into the first valve element through the plurality of flow tubes, and the second openings of the remaining portion of the ten first grooves allow the heat medium to flow out of the first valve element through the plurality of flow tubes.

[0011] The second valve body is provided with a plurality of fan-shaped second grooves, which are formed to extend circumferentially around the rotation center line and open toward the first valve body.

[0012] The third valve body is provided with a plurality of through holes which penetrate the third valve body in the axial direction and are arranged in a circumferential shape around the rotation center line.

[0013] The second valve body and the third valve body rotate relative to the first valve body, respectively, so that the overlapping states of the first openings of the ten first grooves, the plurality of second grooves, and the plurality of through holes in the axial direction are switched.

[0014] In the switching device of the first aspect of the present disclosure, as described above, the overlapping state of the first openings of the ten first grooves, the plurality of second grooves, and the plurality of through holes in the axial direction is switched. Thus, the flow path of the heat medium can be easily switched simply by switching the overlapping state. As a result, the flow path of the heat medium can be efficiently switched.

[0015] A switching device according to a second aspect of the present disclosure is a switching device provided in a heat management circuit in which a heating medium flows, and includes a valve unit and a plurality of flow pipes connected to the valve unit.

[0016] The valve core unit includes: a cylindrical inner side unit, which is formed integrally by stacking a circular plate-shaped first part and a circular plate-shaped second part; and an annular outer side unit, which is arranged in a manner capable of relative rotation relative to the inner side unit around a rotation center line, and is configured in a manner of surrounding the inner side unit from the outer side.

[0017] The inner peripheral unit includes a first outer peripheral wall extending in an annular shape around the rotation center line.

[0018] When the direction in which the rotation centerline extends is set to the axial direction, two first inner circumferential side groove portions and two second inner circumferential side groove portions are respectively formed in the inner circumferential side units. The first inner circumferential side groove portions connect two first inner circumferential side openings formed in the first outer circumferential wall at an axial position corresponding to the first part, and the second inner circumferential side groove portions connect two second inner circumferential side openings formed in the first outer circumferential wall at an axial position corresponding to the second part.

[0019] The two first inner peripheral side openings are separated from each other in the circumferential direction around the rotation center line, and the two second inner peripheral side openings are separated from each other in the circumferential direction.

[0020] The peripheral side unit includes: a second peripheral wall, which extends in a ring shape with the rotation center line as the center; an inner peripheral wall, which extends in a ring shape with the rotation center line as the center and is arranged at a position closer to the rotation center line than the second peripheral wall; and multiple partition walls, which divide the space between the second peripheral wall and the inner peripheral wall along the circumferential direction.

[0021] Eight outer peripheral grooves formed by a plurality of partition walls are provided between the second outer peripheral wall and the inner peripheral wall.

[0022] The inner peripheral wall is formed with ten first outer peripheral side openings arranged in a row in the circumferential direction.

[0023] The eight outer peripheral grooves are respectively communicated with the second outer peripheral openings formed in the second outer peripheral wall.

[0024] Some of the eight outer circumferential grooves allow the heat medium to flow into the outer circumferential unit through the plurality of flow tubes, and the remaining part of the eight outer circumferential grooves allow the heat medium to flow out of the outer circumferential unit through the plurality of flow tubes.

[0025] The outer circumference unit rotates relative to the inner circumference unit, thereby switching the overlapping state of each of the ten first outer circumference openings of the outer circumference unit and each of the two first inner circumference openings and the two second inner circumference openings in the radial direction.

[0026] In the switching device of the second aspect of the present disclosure, as described above, the overlapping state of each of the ten first outer peripheral openings of the outer peripheral unit and each of the two first inner peripheral openings and the two second inner peripheral openings in the radial direction is switched. Thus, the flow path of the heat medium can be easily switched only by switching the overlapping state. As a result, the flow path of the heat medium can be efficiently switched.

[0027] According to the present disclosure, the flow path of the heat medium can be efficiently switched using the switching device. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Features, advantages and technical and industrial significance of exemplary embodiments of the present invention will be described below with reference to the accompanying drawings, in which like numerals represent like elements, and in which:

[0029] Figure 1 is a diagram showing the structure of a thermal management system according to a first embodiment;

[0030] Figure 2 is an exploded perspective view showing the structure of a ten-way valve according to a first embodiment;

[0031] Figure 3 is a diagram showing a circuit mode A of the heat management circuit of the first embodiment;

[0032] Figure 4 is a diagram showing a circuit mode B of the thermal management circuit of the first embodiment;

[0033] Figure 5 is a diagram showing a circuit mode C of the heat management circuit of the first embodiment;

[0034] Figure 6 is a diagram showing a circuit mode D of the heat management circuit of the first embodiment;

[0035] Figure 7 is a diagram showing a circuit model E of the heat management circuit of the first embodiment;

[0036] Figure 8 is a diagram showing a circuit model F of the heat management circuit of the first embodiment;

[0037] Fig. 9 is a diagram showing a circuit model G of the heat management circuit of the first embodiment;

[0038] Fig.10 is a diagram showing a circuit mode H of the heat management circuit of the first embodiment;

[0039] Fig.11 is a diagram showing the structure of a heat management circuit according to a second embodiment;

[0040] Fig.12 is a perspective view showing the structure of an inner peripheral side unit of a ten-way valve according to a second embodiment;

[0041] Fig.13 is a perspective view showing a cross section at a position in the Z direction corresponding to the upper layer portion of the ten-way valve according to the second embodiment;

[0042] Fig.14 is a perspective view showing a cross section at a position in the Z direction between an upper layer portion and a lower layer portion of a ten-way valve according to a second embodiment;

[0043] Fig.15 It is a perspective view showing a cross section at a position in the Z direction corresponding to the lower layer portion of the ten-way valve according to the second embodiment. DETAILED DESCRIPTION

[0044] The thermal management system of the present invention is described below. The thermal management system is, for example, mounted on an electric vehicle (not shown). The electric vehicle equipped with the thermal management system is preferably a vehicle equipped with a battery for driving, such as a Battery Electric Vehicle (BEV), a Hybrid Electric Vehicle (HEV), a Plug-in Hybrid Electric Vehicle (PHEV), and a Fuel Cell Electric Vehicle (FCEV). However, the use of the thermal management system of the present invention is not limited to vehicles.

[0045] First embodiment

[0046] Overall structure

[0047] Figure 1 1 is a diagram showing an example of the overall configuration of a thermal management system 1 according to the first embodiment of the present disclosure. The thermal management system 1 includes a thermal management circuit 100 , an Electronic Control Unit (ECU) 500 , and a Human Machine Interface (HMI) 600 .

[0048] The heat management circuit 100 is configured to allow a heat medium to flow. The heat management circuit 100 includes, for example, a high temperature circuit 110, a radiator 120, a unit circuit 130, a condenser 140, a refrigeration cycle 150, a cooler 160, a battery circuit 170, and a switching device 250. The switching device 250 includes a ten-way valve 200. The ten-way valve 200 is an example of a "valve core unit" of the present disclosure.

[0049] The high temperature circuit 110 includes, for example, a water pump (W / P) 111 , an electric heater 112 , a three-way valve 113 , a heater core 114 , and a reservoir tank (R / T) 115 .

[0050] The radiator 120 includes a high temperature (HT) radiator 121 and a low temperature (LT) radiator 122. In the low temperature radiator 122, a heat medium exchanges heat with external air.

[0051] The unit circuit 130 includes, for example, a water pump 131 , a Smart Power Unit (SPU) 132 , a Power Control Unit (PCU) 133 , an oil cooler (O / C) 134 , a buck-boost converter 135 , and a fluid storage tank 136 .

[0052] The condenser 140 is connected to both the high temperature circuit 110 and the refrigeration cycle 150 . The refrigeration cycle 150 includes, for example, a compressor 151 , an expansion valve 152 , an evaporator 153 , an evaporative pressure regulator (EPR) 154 , and an expansion valve 155 .

[0053] The cooler 160 is connected to both the refrigeration cycle 150 and the flow path 161a. In the cooler 160, the heat medium flowing in the flow path 161a exchanges heat with the medium circulating in the refrigeration cycle 150. In addition, the flow path 161a is a flow path connecting the orifice P1 described later of the ten-way valve 200 and the orifice P2 described later of the ten-way valve 200. A water pump (W / P) 161 is provided in the flow path 161a.

[0054] The battery circuit 170 includes, for example, an electric heater 171 and a battery 172. The electric heater 171 raises the temperature of the heat medium in the battery circuit 170.

[0055] The ECU 500 controls the thermal management loop 100 . The ECU 500 includes a processor 501 , a memory 502 , a storage device 503 , and an interface 504 .

[0056] ECU 500 generates control commands based on sensor values ​​obtained from various sensors included in thermal management circuit 100 and user operations received from HMI 600, and outputs the generated control commands to thermal management circuit 100. Thus, for example, the states of three-way valve 113 and ten-way valve 200 are switched.

[0057] The HMI 600 is a display with a touch panel, an operation panel, a console, etc. The HMI 600 receives a user operation for controlling the thermal management system 1. The HMI 600 outputs a signal indicating the user operation to the ECU 500.

[0058] Ten orifices P1 to P10 are provided in the ten-way valve 200. Orifice P1 is an inlet orifice for the heat medium to flow in from the cooler 160 (flow path 161a). Orifice P2 is an outlet orifice for the heat medium to flow out toward the cooler 160 (flow path 161a). Orifice P3 is an inlet orifice for the heat medium to flow in from the unit circuit 130 (PCU133, etc.). Orifice P4 is an outlet orifice for the heat medium to flow out toward the unit circuit 130 (PCU133, etc.). Orifice P5 is an inlet orifice for the heat medium to flow in from the battery circuit 170. Orifice P6 is an outlet orifice for the heat medium to flow out toward the battery circuit 170. Orifice P7 is an inlet orifice for the heat medium flowing out from orifice P6 to flow in through the bypass path 251. Orifice P8 is an inlet orifice for the heat medium to flow in from the low-temperature radiator 122. The port P9 is an outlet port for allowing the heat medium to flow out toward the low-temperature radiator 122. The port P10 is an outlet port for allowing the heat medium to flow out toward the bypass path 252 through which the heat supply medium flows toward the port P8.

[0059] The flow pipes connected to the ports P1 to P10 are examples of the “flow pipes” of the present disclosure. The flow pipes include the flow path of the battery circuit 170, the flow path of the unit circuit 130, the flow path connecting the ten-way valve 200 and the radiator 120, the flow path 161a, the bypass path 251, and the bypass path 252.

[0060] The ECU 500 controls the state of the ten-way valve 200. As a result, the flow path of the heat medium in the ten-way valve 200 is switched. As a result, the flow path of the heat medium in the heat management circuit 100 is switched.

[0061] Figure 2It is an exploded stereoscopic diagram showing the structure of the ten-way valve 200. The ten-way valve 200 includes a circular upper body 210, a circular drive plate 220, and a circular lower body 230. The upper body 210, the drive plate 220, and the lower body 230 are sequentially arranged (stacked) from the Z1 side. That is, the drive plate 220 is clamped by the upper body 210 and the lower body 230 in the Z direction. In addition, the Z direction is the direction in which the rotation center line α extends. The Z direction is an example of the “axial direction” of the present disclosure. In addition, the upper body 210 and the drive plate 220 are examples of the “second valve core” and the “third valve core” of the present disclosure, respectively. In addition, the lower body 230 is an example of the “first valve core” of the present disclosure.

[0062] The lower body 230 is fixed without rotating. The upper body 210 and the drive plate 220 rotate integrally on the Z1 side of the lower body 230 with the rotation center line α as the center. As a result, the relative positions (rotation angles in the circumferential direction) of the lower body 230, the upper body 210 and the drive plate 220 change. Alternatively, the upper body 210 and the drive plate 220 may be fixed to rotate the lower body 230.

[0063] The upper body 210 has a circular ring shape. The upper body 210 is provided with grooves 211 to 214. The grooves 211 to 214 are respectively formed in a fan shape in a manner of extending circumferentially with the rotation center line α as the center. The grooves 211 to 214 are each open on the lower body 230 side (Z2 side). In addition, the grooves 211 to 214 are each an example of the "second groove" of the present disclosure.

[0064] The grooves 211 and 212 are arranged side by side in the circumferential direction in the outer peripheral region of the upper body 210. Specifically, the grooves 211 and 212 each have a fan-shaped shape with a central angle of about 112.5 degrees.

[0065] The groove 213 and the groove 214 are disposed to face each other in a region on the inner peripheral side of the groove 211 and the groove 212 in the upper body 210. The groove 213 and the groove 214 each have a fan-shaped shape with a central angle of approximately 112.5 degrees.

[0066] The drive plate 220 is provided with through holes 221 to 228. The through holes 221 to 228 are formed so as to penetrate the drive plate 220 in the Z direction. The through holes 221 to 228 are formed in a fan shape so as to extend circumferentially with the rotation center line α as the center. The through holes 221 to 228 are arranged so as to be staggered in the circumferential direction so as not to overlap each other in the radial direction.

[0067] The through holes 221 to 224 are arranged in the circumferential direction in the outer peripheral area of ​​the driving plate 220. The through holes 221 and 222 are respectively provided at positions overlapping with the groove 211 of the upper body 210. The through holes 223 and 224 are respectively provided at positions overlapping with the groove 212 of the upper body 210 when viewed in the Z direction.

[0068] The through holes 225 to 228 are arranged in the circumferential direction in the region of the drive plate 220 that is closer to the inner circumference than the through holes 221 to 224. The through holes 225 and 226 are respectively provided at positions overlapping with the groove 213 of the upper body 210 when viewed in the Z direction. The through holes 227 and 228 are respectively provided at positions overlapping with the groove 214 of the upper body 210 when viewed in the Z direction.

[0069] The lower body 230 includes an outer peripheral wall 231, an inner peripheral wall 232, and ten partition walls 233. The outer peripheral wall 231 is arranged to extend in a ring shape with the rotation center line α as the center. The inner peripheral wall 232 extends in a ring shape with the rotation center line α as the center, and is formed at a position closer to the rotation center line α than the outer peripheral wall 231.

[0070] The ten partition walls 233 include eight partition walls 233a and two partition walls 233b. The eight partition walls 233a are formed to extend in the radial direction and are provided to connect the inner peripheral wall 232 and the outer peripheral wall 231. The eight partition walls 233a are arranged at equal intervals in the circumferential direction around the rotation center line α.

[0071] The two partition walls 233b are provided so as to connect the partition wall 233a and the outer peripheral wall 231. The two partition walls 233b are each formed in an L shape when viewed from the Z1 side.

[0072] In the lower body 230, 10 grooves 234 formed by 10 partition walls 233 are provided between the outer peripheral wall 231 and the inner peripheral wall 232. The 10 grooves 234 include 6 grooves 234a, 2 grooves 234b, and 2 grooves 234c. The grooves 234 (234a to 234c) are examples of the "first grooves" of the present disclosure.

[0073] The groove portion 234a is a fan-shaped space formed by the outer peripheral wall 231, the inner peripheral wall 232, and the two partition walls 233a. The groove portion 234b is a space formed by the outer peripheral wall 231, the inner peripheral wall 232, the two partition walls 233a, and the partition wall 233b. The groove portion 234c is a fan-shaped space formed by the outer peripheral wall 231, one partition wall 233a, and the partition wall 233b.

[0074] The groove portion 234a has an opening 234d opened on the upper body 210 side (Z1 side) and an opening 234e formed in the outer peripheral wall 231. The groove portion 234b has an opening 234f opened on the upper body 210 side and an opening 234g formed in the outer peripheral wall 231. The groove portion 234c has an opening 234h opened on the upper body 210 side and an opening 234i formed in the outer peripheral wall 231. In addition, the opening 234d, the opening 234f, and the opening 234h are each an example of the "first opening" of the present disclosure. In addition, the opening 234e, the opening 234g, and the opening 234i are each an example of the "second opening" of the present disclosure.

[0075] The opening 234 e , the opening 234 g , and the opening 234 i are arranged side by side in the circumferential direction on the outer peripheral wall 231 .

[0076] The openings 234e of the six grooves 234a correspond to (communicate with) the ports P1 to P4, P6, and P8, respectively. The openings 234g of the two grooves 234b correspond to (communicate with) the ports P5 and P9, respectively. The openings 234i of the two grooves 234c correspond to (communicate with) the ports P7 and P10, respectively.

[0077] Figures 3 to 10 1 and 2 represent the circuit modes A to H that can be formed by the thermal management circuit 100 through the ten-way valve 200. Figures 3 to 10 In FIG. 1 , the white circles overlapping the grooves 211 to 214 indicate the positions of the through holes 221 to 228 of the driving plate 220 . Figures 3 to 10 In the figure, for simplicity, the reference numerals of the through holes 221 to 228 are omitted.

[0078] In the first embodiment, the ten-way valve 200 switches the ten grooves 234 (see FIG. 2 ) of the lower body 230 by rotating the driving plate 220 and the upper body 210 . Figure 2 ) of their respective openings (234d, 234f, 234h), the grooves 211 to 214 of the upper body 210, and the through holes 221 to 228 of the drive plate 220 in the Z direction (the overlapping state when viewed along the Z direction).

[0079] like Figure 3 As shown, in mode A, the groove 211 of the upper body 210, the through holes 221 and 222 of the drive plate 220, and the grooves 234a (P1) and 234b (P9) of the lower body 230 overlap in the Z direction. Thus, the port P1 communicates with the port P9.

[0080] In mode A, the groove 212 of the upper body 210 , the through holes 223 and 224 of the drive plate 220 , and the grooves 234 a ( P4 ) and 234 a ( P8 ) of the lower body 230 overlap in the Z direction. Thus, the port P4 communicates with the port P8 .

[0081] In mode A, the groove 213 of the upper body 210 , the through holes 225 and 226 of the drive plate 220 , and the groove 234 b ( P5 ) and the groove 234 a ( P2 ) of the lower body 230 overlap in the Z direction. Thus, the port P2 communicates with the port P5 .

[0082] In mode A, the groove 214 of the upper body 210 , the through holes 227 and 228 of the drive plate 220 , the groove 234 a ( P6 ) and the groove 234 a ( P3 ) of the lower body 230 overlap in the Z direction. Thus, the port P3 communicates with the port P6 .

[0083] In circuit mode A, a closed circuit is formed in which the heat medium flows in the order of PCU 133, battery 172, cooler 160, and low-temperature radiator 122. In circuit mode A, PCU 133 and battery 172 can be cooled by low-temperature radiator 122 and cooler 160. In addition, heat from PCU 133 and battery 172 can be used for heat pump heating.

[0084] like Figure 4 As shown, in mode B, the groove 211 of the upper body 210, the through holes 221 and 222 of the drive plate 220, and the groove 234a (P1) and the groove 234c (P10) of the lower body 230 overlap in the Z direction. Thus, the port P1 communicates with the port P10.

[0085] In mode B, the groove 212 of the upper body 210 , the through holes 223 and 224 of the drive plate 220 , and the grooves 234 a ( P4 ) and 234 a ( P8 ) of the lower body 230 overlap in the Z direction. Thus, the port P4 communicates with the port P8 .

[0086] In mode B, the groove 213 of the upper body 210 , the through holes 225 and 226 of the drive plate 220 , and the groove 234 b ( P5 ) and the groove 234 a ( P2 ) of the lower body 230 overlap in the Z direction. Thus, the port P2 communicates with the port P5 .

[0087] In mode B, the groove 214 of the upper body 210 , the through holes 227 and 228 of the drive plate 220 , and the grooves 234 a ( P6 ) and 234 a ( P3 ) of the lower body 230 overlap in the Z direction. Thus, the port P3 communicates with the port P6 .

[0088] In the circuit mode B, a first closed circuit is formed in which the heat medium flows in the order of PCU 133, battery 172, and cooler 160, and a second closed circuit is formed in which the low-temperature radiator 122 is independent (disconnected). In the circuit mode B, the temperature of the battery 172 can be increased and heated by the heat of the PCU 133, and heat pump heating can be performed by the heat of the PCU 133 and the battery 172. In addition, heat dissipation in the low-temperature radiator 122 is suppressed.

[0089] like Figure 5 As shown, in mode C, the groove 211 of the upper body 210, the through holes 221 and 222 of the drive plate 220, and the grooves 234a (P2) and 234a (P8) of the lower body 230 overlap in the Z direction. Thus, the port P2 communicates with the port P8.

[0090] In mode C, the groove 212 of the upper body 210 , the through holes 223 and 224 of the drive plate 220 , and the grooves 234 a ( P6 ) and 234 a ( P3 ) of the lower body 230 overlap in the Z direction. Thus, the port P3 communicates with the port P6 .

[0091] In mode C, the groove 213 of the upper body 210 , the through holes 225 and 226 of the drive plate 220 , and the groove 234 a ( P1 ) and the groove 234 b ( P9 ) of the lower body 230 overlap in the Z direction. Thus, the port P1 communicates with the port P9 .

[0092] In mode C, the groove 214 of the upper body 210 , the through holes 227 and 228 of the drive plate 220 , and the groove 234 b ( P5 ) and the groove 234 a ( P4 ) of the lower body 230 overlap in the Z direction. Thus, the port P4 communicates with the port P5 .

[0093] In circuit mode C, a first closed circuit is formed in which heat medium flows through PCU 133 and battery 172, and a second closed circuit is formed in which heat medium flows through low-temperature radiator 122 and cooler 160. In circuit mode C, the temperature of battery 172 can be increased by heat from PCU 133, and heat pump heating using outside air can be performed.

[0094] like Figure 6 As shown, in mode D, the groove 211 of the upper body 210, the through holes 221 and 222 of the drive plate 220, and the groove 234a (P3) and the groove 234b (P9) of the lower body 230 overlap in the Z direction. Thus, the port P3 communicates with the port P9.

[0095] In mode D, the groove 212 of the upper body 210 , the through holes 223 and 224 of the drive plate 220 , and the groove 234 a ( P4 ) and the groove 234 b ( P5 ) of the lower body 230 overlap in the Z direction. Thus, the port P4 communicates with the port P5 .

[0096] In mode D, the groove 213 of the upper body 210 , the through holes 225 and 226 of the drive plate 220 , and the grooves 234 a ( P8 ) and 234 a ( P2 ) of the lower body 230 overlap in the Z direction. Thus, the port P2 communicates with the port P8 .

[0097] In mode D, the groove 214 of the upper body 210 , the through holes 227 and 228 of the drive plate 220 , and the grooves 234 a ( P6 ) and 234 a ( P1 ) of the lower body 230 overlap in the Z direction. Thus, the port P1 communicates with the port P6 .

[0098] In circuit mode D, a closed circuit is formed in which heat medium flows in the order of PCU 133, low-temperature radiator 122, cooler 160, and battery 172. Circuit mode D is a circuit in which the order of heat medium flow is different from that in circuit mode A.

[0099] like Figure 7 As shown, in mode E, the groove 211 of the upper body 210, the through holes 221 and 222 of the drive plate 220, and the groove 234a (P3) and the groove 234c (P10) of the lower body 230 overlap in the Z direction. Thus, the port P3 communicates with the port P10.

[0100] In mode E, the groove 212 of the upper body 210 , the through holes 223 and 224 of the drive plate 220 , and the groove 234 a ( P4 ) and the groove 234 c ( P7 ) of the lower body 230 overlap in the Z direction. Thus, the port P4 communicates with the port P7 .

[0101] In mode E, the groove 213 of the upper body 210 , the through holes 225 and 226 of the drive plate 220 , and the grooves 234 a ( P2 ) and 234 a ( P8 ) of the lower body 230 overlap in the Z direction. Thus, the port P2 communicates with the port P8 .

[0102] In mode E, the groove 214 of the upper body 210 , the through holes 227 and 228 of the drive plate 220 , and the grooves 234 a ( P6 ) and 234 a ( P1 ) of the lower body 230 overlap in the Z direction. Thus, the port P1 communicates with the port P6 .

[0103] In circuit mode E, a first closed circuit is formed in which the heat medium flows in the order of PCU 133, bypass path 252, cooler 160, and bypass path 251, and low-temperature radiator 122 and battery 172 are each independent (disconnected). In circuit mode E, PCU 133 can be cooled, and heat pump heating using waste heat of PCU 133 can be performed.

[0104] like Figure 8 As shown, in mode F, the groove 211 of the upper body 210, the through holes 221 and 222 of the drive plate 220, and the grooves 234a (P4) and 234a (P8) of the lower body 230 overlap in the Z direction. Thus, the port P4 communicates with the port P8.

[0105] In mode F, the groove 212 of the upper body 210 , the through holes 223 and 224 of the drive plate 220 , and the grooves 234 a ( P6 ) and 234 a ( P1 ) of the lower body 230 overlap in the Z direction. Thus, the port P1 communicates with the port P6 .

[0106] In mode F, the groove 213 of the upper body 210 , the through holes 225 and 226 of the drive plate 220 , and the groove 234 a ( P3 ) and the groove 234 b ( P9 ) of the lower body 230 overlap in the Z direction. Thus, the port P3 communicates with the port P9 .

[0107] In mode F, the groove 214 of the upper body 210 , the through holes 227 and 228 of the drive plate 220 , and the groove 234 b ( P5 ) and the groove 234 a ( P2 ) of the lower body 230 overlap in the Z direction. Thus, the port P2 communicates with the port P5 .

[0108] In circuit mode F, a first closed circuit is formed in which the heat medium flows through PCU 133 and low-temperature radiator 122, and a second closed circuit is formed in which the heat medium flows through battery 172 and cooler 160. In circuit mode F, PCU 133 can be cooled by low-temperature radiator 122, and battery 172 can be cooled by cooler 160.

[0109] like Fig. 9 As shown, in mode G, the groove 211 of the upper body 210, the through holes 221 and 222 of the drive plate 220, and the groove 234a (P6) and the groove 234a (P3) of the lower body 230 overlap in the Z direction. Thus, the port P3 communicates with the port P6.

[0110] In mode G, the groove 212 of the upper body 210 , the through holes 223 and 224 of the drive plate 220 , and the groove 234 c ( P7 ) and the groove 234 a ( P2 ) of the lower body 230 overlap in the Z direction. Thus, the port P2 communicates with the port P7 .

[0111] In mode G, the groove 213 of the upper body 210 , the through holes 225 and 226 of the drive plate 220 , and the grooves 234 a ( P4 ) and 234 a ( P8 ) of the lower body 230 overlap in the Z direction. Thus, the port P4 communicates with the port P8 .

[0112] In mode G, the groove 214 of the upper body 210 , the through holes 227 and 228 of the drive plate 220 , and the groove 234 a ( P1 ) and the groove 234 b ( P9 ) of the lower body 230 overlap in the Z direction. Thus, the port P1 communicates with the port P9 .

[0113] In the circuit mode G, a first closed circuit is formed in which the heat medium flows in the order of PCU 133, bypass path 251, cooler 160, and low-temperature radiator 122, and battery 172 is independent (disconnected). In the circuit mode G, heating can be performed by the heat of PCU 133, and excess heat can be dissipated from low-temperature radiator 122. In addition, the temperature drop of battery 172 is suppressed.

[0114] like Fig.10 As shown, in mode H, the groove 211 of the upper body 210, the through holes 221 and 222 of the drive plate 220, and the groove 234c (P7) and the groove 234a (P4) of the lower body 230 overlap in the Z direction. Thus, the port P4 communicates with the port P7.

[0115] In mode H, the groove 212 of the upper body 210 , the through holes 223 and 224 of the drive plate 220 , and the grooves 234 a ( P1 ) and 234 c ( P10 ) of the lower body 230 overlap in the Z direction. Thus, the port P1 communicates with the port P10 .

[0116] In mode H, the groove 213 of the upper body 210 , the through holes 225 and 226 of the drive plate 220 , and the grooves 234 a ( P6 ) and 234 a ( P3 ) of the lower body 230 overlap in the Z direction. Thus, the port P3 communicates with the port P6 .

[0117] In mode H, the groove 214 of the upper body 210 , the through holes 227 and 228 of the drive plate 220 , and the grooves 234 a ( P2 ) and 234 a ( P8 ) of the lower body 230 overlap in the Z direction. Thus, the port P2 communicates with the port P8 .

[0118] In the circuit mode H, a first closed circuit in which the heat medium flows through the PCU 133 and the bypass path 251 and a second closed circuit in which the heat medium flows through the cooler 160 and the bypass path 252 are formed, and the low-temperature radiator 122 and the battery 172 are each independent (disconnected). In the circuit mode H, the heat of the PCU 133 can be stored. In addition, heat pump heating using the waste heat of the PCU 133 can be performed.

[0119] As described above, in the first embodiment, the state of the heat management circuit 100 can be switched to any one of the circuit modes A to H using the ten-way valve 200 .

[0120] Second embodiment

[0121] In the second embodiment, unlike the first embodiment which uses the ten-way valve 200, a ten-way valve 400 is used. The same components as those in the first embodiment are denoted by the same reference numerals as those in the first embodiment, and repeated description will not be given.

[0122] Fig.11 1 is a schematic diagram showing a thermal management circuit 300 in a second embodiment. The thermal management circuit 300 is different from the thermal management circuit 100 in the first embodiment in that a switching device 450 (10-way valve 400) is provided instead of the switching device 250 (10-way valve 200) in the first embodiment. In addition, the 10-way valve 400 is an example of a "valve core unit" in the present disclosure.

[0123] The ten-way valve 400 is connected to a flow path 161 a connected to the battery circuit 170 , the unit circuit 130 , and the cooler 160 , and a flow path connected to the low-temperature radiator 122 .

[0124] The ten-way valve 400 includes an inner circumference unit 410 and an outer circumference unit 420. The outer circumference unit 420 is disposed so as to surround the inner circumference unit 410 from the outer circumference side. That is, the outer circumference unit 420 is formed in an annular shape.

[0125] The inner peripheral unit 410 is rotated about the center line β (refer to Fig.12 ) as the center. The outer peripheral unit 420 does not rotate but is fixed. That is, the inner peripheral unit 410 rotates relative to the outer peripheral unit 420.

[0126] The inner circumference side unit 410 includes a rotation center line β (refer to Fig.12) is the outer peripheral wall 411 extending in a ring shape with the inner peripheral unit 410 as the center. In addition, the inner peripheral unit 410 includes a groove portion 412, a groove portion 413, a groove portion 414 and a groove portion 415. The groove portions 412 to 415 are respectively formed in a manner of penetrating the inner peripheral unit 410. In the Z direction, the groove portions 412 and 413 are arranged at different positions from the groove portions 414 and 415, which will be described in detail later. In addition, the outer peripheral wall 411 is an example of the "first outer peripheral wall" of the present disclosure. In addition, the groove portions 412 and 413 are respectively examples of the "first inner peripheral side groove portion" of the present disclosure. In addition, the groove portions 414 and 415 are respectively examples of the "second inner peripheral side groove portion" of the present disclosure.

[0127] When viewed from the Z1 side, the grooves 412 to 415 are formed to extend in an arc shape. The grooves 412 and 413 are arranged opposite to each other in a V-shaped manner. The grooves 414 and 415 are arranged opposite to each other in a V-shaped manner. The V-shaped formed by the grooves 412 and 413 is formed at a position where the V-shaped formed by the grooves 414 and 415 is reversed by 180 degrees.

[0128] The grooves 412 and 414 are provided so as to intersect each other when viewed from the Z1 side. The grooves 413 and 415 are provided so as to intersect each other when viewed from the Z1 side.

[0129] Fig.12 4 is a perspective view of the inner circumference unit 410. The inner circumference unit 410 is formed integrally by stacking a disc-shaped upper portion 416 and a disc-shaped lower portion 417. The inner circumference unit 410 has a cylindrical shape. The upper portion 416 is arranged on the Z1 side of the lower portion 417. In addition, the upper portion 416 and the lower portion 417 are examples of the "first portion" and the "second portion" of the present disclosure, respectively.

[0130] In the outer peripheral wall 411, an opening 412a and an opening 412b are formed at a Z-direction position (hereinafter referred to as position PU) corresponding to the upper layer portion 416. The groove portion 412 connects the opening 412a and the opening 412b. An opening 413a and an opening 413b are formed at position PU of the outer peripheral wall 411. The groove portion 413 connects the opening 413a and the opening 413b. In addition, the opening 412a, the opening 412b, the opening 413a, and the opening 413b are each an example of the "first inner peripheral side opening" of the present disclosure.

[0131] In the outer peripheral wall 411, an opening 414a and an opening 414b are formed at a Z-direction position (hereinafter referred to as position PL) corresponding to the lower layer portion 417. The groove portion 414 connects the opening 414a and the opening 414b. An opening 415a and an opening 415b are formed at position PL of the outer peripheral wall 411. The groove portion 415 connects the opening 415a and the opening 415b. In addition, the opening 414a, the opening 414b, the opening 415a, and the opening 415b are each an example of the "second inner peripheral side opening" of the present disclosure.

[0132] The openings of the grooves 412 to 415 are separated from each other in the circumferential direction of the inner circumference side unit 410 .

[0133] Fig.13 4 is a cross-sectional view of the ten-way valve 400 at position PU of the inner peripheral unit 410. The outer peripheral unit 420 includes an outer peripheral wall 421, an inner peripheral wall 422, and a plurality of partition walls 423. The outer peripheral wall 421 is an example of the "second outer peripheral wall" of the present disclosure.

[0134] The outer peripheral wall 421 and the inner peripheral wall 422 extend in an annular shape around the rotation center line β. The inner peripheral wall 422 is provided on the rotation center line β side relative to the outer peripheral wall 421 .

[0135] The plurality of partition walls 423 partition the space between the outer peripheral wall 421 and the inner peripheral wall 422 in the circumferential direction. Thus, the space is partitioned into eight grooves S1 to S8. The grooves S1 to S8 are examples of "outer peripheral grooves" in the present disclosure.

[0136] The partition wall 423 includes a partition wall 423a formed in a radially extending manner and connecting the outer peripheral wall 421 and the inner peripheral wall 422. In addition, it includes a partition wall 423b that connects the parts of the inner peripheral wall 422 that are arranged at different positions in the circumferential direction. At the position PU, the groove portion S1 and the groove portion S2 are separated in the circumferential direction by the partition wall 423b. The other adjacent groove portions are separated in the circumferential direction by the partition wall 423a. In addition, when viewed from the Z1 side, the partition wall 423b has a U-shape.

[0137] The grooves S1 to S8 are respectively formed with openings 424a to 424h (see Figures 13 to 15 ). The openings 424a to 424h are respectively communicated with the orifices P11 to P18 of the ten-way valve 400. In addition, the openings 424a to 424h are examples of the "second outer peripheral side openings" of the present disclosure.

[0138] Orifice P11 is an outlet orifice for the heat medium to flow out toward the battery circuit 170. Orifice P12 is an inlet orifice for the heat medium to flow in from the battery circuit 170. Orifice P13 is an outlet orifice for the heat medium to flow out toward the unit circuit 130 (PCU 133, etc.). Orifice P14 is an inlet orifice for the heat medium to flow in from the unit circuit 130 (PCU 133, etc.). Orifice P15 is an inlet orifice for the heat medium to flow in from the low-temperature radiator 122. Orifice P16 is an outlet orifice for the heat medium to flow out toward the low-temperature radiator 122. Orifice P17 is an outlet orifice for the heat medium to flow out toward the cooler 160 (flow path 161a). Orifice P18 is an inlet orifice for the heat medium to flow in from the cooler 160 (flow path 161a).

[0139] Ten openings arranged in a circumferential direction are formed on the inner peripheral wall 422 of the outer peripheral unit 420. Specifically, openings 425a, 425b, 425c, 425d, 425e, 425f, 425g, 425h, 425i, and 425j are formed on the inner peripheral wall 422. In addition, the openings 425a to 425j are examples of the "first outer peripheral opening" of the present disclosure.

[0140] At position PU, the circumferential width (not marked with reference numerals) of each of openings 425a, 425d, 425e, 425h, 425i and 425j is approximately twice the circumferential width (not marked with reference numerals) of each of openings 425b, 425c, 425f and 425g.

[0141] First, refer to Fig.13 , the openings 425a to 425j are described at position PU. The openings 425a to 425j are connected to the groove S1, groove S2, groove S1, groove S8, groove S7, groove S6, groove S5, groove S5, groove S4, and groove S3, respectively. That is, the groove S1 and the groove S5 are connected to two openings, respectively.

[0142] Fig.14 4 is a cross-sectional view of the ten-way valve 400 at a position (position PM) in the Z direction between the upper portion 416 and the lower portion 417. Fig.14 As shown in FIG. 1 , the outer peripheral unit 420 includes a partition 426a and a partition 426b. The partition 426a extends perpendicularly to the Z direction so as to partition the groove S1 and the groove S2 in the Z direction. The partition 426a is arranged at Fig.13 The circumferential position of the opening 425c is provided in the Z direction. The partition portion 426b extends orthogonally to the Z direction in a manner that separates the groove portion S5 and the groove portion S6 in the Z direction. The partition portion 426b is arranged at Fig.13A circumferential position in which an opening 425g is provided.

[0143] Fig.15 4 is a cross-sectional view of the ten-way valve 400 at position PL. At position PL, eight openings arranged in a circumferential direction are formed on the inner peripheral wall 422 of the outer peripheral side unit 420. Specifically, openings 425a, 425b, 425d, 425e, 425g, 425h, 425i, and 425j are formed on the inner peripheral wall 422.

[0144] At the position PL, the widths (not indicated by reference numerals) in the circumferential direction of the openings 425 a , 425 b , 425 d , 425 e , 425 g , 425 h , 425 i , and 425 j are substantially equal to each other.

[0145] like Fig.13 As shown, the opening 425a and the opening 425c are respectively connected to the groove portion S1, thereby, for example, at the position PL (refer to Fig.15 ) The heat medium that flows into the groove portion S1 from the opening 425a flows out of the groove portion S1 through the opening 425c at the position PU. Therefore, the heat medium flows through the groove portion S1 and moves from the opening 425a to the opening 425c, thereby bypassing the storage battery 172.

[0146] In addition, if Fig.13 As shown, the opening 425g and the opening 425h are respectively connected to the groove portion S5, so that, for example, the heat medium that flows into the groove portion S5 from the opening 425g at the position PU flows out of the groove portion S5 through the opening 425h at the position PU. Therefore, the heat medium flows in the groove portion S5 and moves from the opening 425g to the opening 425h, thereby bypassing the low-temperature radiator 122.

[0147] In the second embodiment, the inner circumference unit 410 rotates to switch the radial overlap state of the ten openings (425a to 425j) of the outer circumference unit 420 and the openings (412a, 412b, 413a, 413b, 414a, 414b, 415a, 415b) of the inner circumference unit 410. Thus, similar to the first embodiment, circuit patterns A to H are formed in the heat management circuit 300.

[0148] In addition, since other structures are the same as those of the above-mentioned first embodiment, the description will not be repeated.

[0149] In the above embodiment, an example in which the high temperature circuit 110 is provided in the heat management circuit is shown, but the present disclosure is not limited thereto. The high temperature circuit 110 may not be provided in the heat management circuit.

[0150] The embodiments disclosed this time should be considered in all respects as illustrative and non-restrictive. The scope of the present disclosure is indicated by the claims rather than the description of the embodiments described above, and is intended to include all modifications within the meaning and scope equivalent to the claims.

Claims

1. A switching device, arranged in a heat management circuit in which a heating medium circulates, comprising: Valve core unit; as well as A plurality of flow pipes are connected to the valve core unit, The valve core unit comprises: A first valve core in the shape of a circular plate; a second disc-shaped valve body, which is arranged to be relatively rotatable with respect to the first valve body about a rotation center line, and is arranged on one side of the first valve body in the axial direction along which the rotation center line extends; and The disc-shaped third valve core is arranged to be sandwiched by the first valve core and the second valve core in the axial direction and is arranged to be relatively rotatable with respect to the first valve core around the rotation center line. The first valve core comprises: An outer peripheral wall extending in a ring shape with the rotation center line as the center; an inner peripheral wall extending in an annular shape with the rotation center line as a center and formed at a position closer to the rotation center line than the outer peripheral wall; and 10 partition walls are provided so as to partition the space between the inner peripheral wall and the outer peripheral wall in a circumferential direction centered on the rotation center line, The first valve core is provided with 10 first grooves formed by the 10 partition walls between the outer peripheral wall and the inner peripheral wall. The ten first grooves respectively have a first opening opening on the second valve core side and a second opening formed on the outer peripheral wall. The second openings of a part of the ten first grooves allow the heat medium to flow into the first valve core through the plurality of flow tubes, and the second openings of the remaining part of the ten first grooves allow the heat medium to flow out of the first valve core through the plurality of flow tubes. The second valve body is provided with a plurality of second grooves in a fan shape, the plurality of second grooves are formed to extend circumferentially around the rotation center line and open toward the first valve body. The third valve core is provided with a plurality of through holes, the plurality of through holes penetrate the third valve core in the axial direction, and are arranged in a circumferential shape with the rotation center line as the center. The second valve body and the third valve body rotate relative to the first valve body, respectively, so that the overlapping states of the first openings of the ten first grooves, the plurality of second grooves, and the plurality of through holes in the axial direction are switched.

2. A switching device, arranged in a heat management circuit in which a heating medium circulates, comprising: Valve core unit; as well as A plurality of flow pipes are connected to the valve core unit, The valve core unit comprises: A cylindrical inner peripheral side unit is integrally formed by laminating a disc-shaped first portion and a disc-shaped second portion; and The annular outer peripheral unit is provided to be rotatable relative to the inner peripheral unit about the rotation center line and is arranged to surround the inner peripheral unit from the outer peripheral side. The inner peripheral unit includes a first outer peripheral wall extending in an annular shape with the rotation center line as the center. If the direction in which the rotation center line extends is set to the axial direction, in the inner circumferential side unit, two first inner circumferential side grooves connecting two first inner circumferential side openings formed in the first outer circumferential wall at axial positions corresponding to the first portion, and two second inner circumferential side grooves connecting two second inner circumferential side openings formed in the first circumferential wall at axial positions corresponding to the second portion are respectively formed. The two first inner peripheral side openings are separated from each other in the circumferential direction centered on the rotation center line, The two second inner peripheral side openings are separated from each other in the circumferential direction, The peripheral side unit comprises: A second outer peripheral wall extending in a ring shape with the rotation center line as the center; an inner peripheral wall extending in an annular shape with the rotation center line as a center and disposed at a position closer to the rotation center line than the second outer peripheral wall; and a plurality of partition walls, which partition the space between the second outer peripheral wall and the inner peripheral wall in the circumferential direction; Eight outer peripheral side grooves formed by the plurality of partition walls are provided between the second outer peripheral wall and the inner peripheral wall. The inner peripheral wall is formed with 10 first outer peripheral side openings arranged in a manner aligned along the circumferential direction, The eight outer peripheral grooves are respectively connected to the second outer peripheral openings formed in the second outer peripheral wall. The outer circumferential grooves of a part of the eight outer circumferential grooves allow the heat medium to flow into the outer circumferential unit through the plurality of flow tubes, and the outer circumferential grooves of a remaining part of the eight outer circumferential grooves allow the heat medium to flow out of the outer circumferential unit through the plurality of flow tubes. The outer circumference side unit rotates relative to the inner circumference side unit to switch the overlapping state of each of the ten first outer circumference side openings of the outer circumference side unit with each of the two first inner circumference side openings and the two second inner circumference side openings in the radial direction.

Images