Control panel, electric control assembly and air conditioner

Abstract

The invention discloses a control panel, an electric control assembly and an air conditioner, and belongs to the related technical field of air conditioning equipment, the control panel comprises a circuit board, a power device and a radiator, the circuit board is provided with a first surface and a second surface which are opposite to each other, and the control panel is fixedly connected to the first surface through the patch type power device. The radiator is fixedly connected to the second surface, a through hole is formed in the circuit board, a heat conductor is arranged in the through hole, the heat conductor is connected with the power device, heat of the power device can be transmitted to the radiator through the heat conductor, and heat dissipation of the power device is achieved; as the power device and the radiator are located on different surfaces of the circuit board, the power device does not need to be connected with the radiator and does not need to be fastened through screws, the production efficiency is improved, meanwhile, the influence of mechanical stress on the power device can be avoided, the risk that the power device is damaged is reduced, the reliability of the control panel is improved, and the electronic control assembly is suitable for the air conditioner.

Description

Technical Field

[0001] The present invention relates to the technical field related to air conditioning equipment, and in particular to a control panel, an electric control component and an air conditioner. Background Art

[0002] At present, the control panel of the air conditioner mainly installs power devices in a plug-in manner. Since the power device needs to be connected to the heat sink for heat dissipation, the power device and the heat sink are fastened by screws so that the power device and the heat sink can fit together, so that the heat of the power device can be transferred to the heat sink. However, there is a high risk of mechanical stress in the fastening process of the heat sink and the power device, which can easily cause damage to the power device. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a control board that can reduce the risk of power devices being damaged by mechanical stress and improve the reliability of the power devices.

[0004] The present invention also provides an electric control component and an air conditioner using the control panel.

[0005] According to the first aspect of the present invention, a control board includes a circuit board, a power device and a heat sink, wherein the circuit board has a first surface and a second surface facing each other; the power device is a surface-mount power device, and the power device is fixedly connected to the first surface; the heat sink is fixedly connected to the second surface; wherein the circuit board is provided with a through hole, and a heat conductor connected to the power device is provided in the through hole, and the heat conductor is used to transfer the heat generated by the power device to the heat sink.

[0006] The control board according to the embodiment of the present invention has at least the following beneficial effects:

[0007] The control board is achieved by fixing the surface-mount power device on the first surface of the circuit board, fixing the heat sink on the second surface of the circuit board, opening a through hole on the circuit board, and arranging a heat conductor in the through hole. The heat conductor is connected to the power device, and the heat of the power device can be transferred to the heat sink through the heat conductor to achieve heat dissipation of the power device. Since the power device and the heat sink are located on different surfaces of the circuit board, the power device does not need to be connected to the heat sink, nor does it need to be fastened by screws, which improves production efficiency while avoiding the influence of mechanical stress on the power device, reduces the risk of damage to the power device, and improves the reliability of the control board. The control board is suitable for electronic control components of air conditioners.

[0008] According to some embodiments of the present invention, the power device includes a substrate and a package body, the substrate is packaged in the package body, a groove is provided on the side of the package body facing the first surface, one side of the substrate is exposed in the groove and is connected to the heat conductor, and the other side of the substrate is used for installing electronic components.

[0009] According to some embodiments of the present invention, the first surface is provided with a first pad and a second pad, the pin of the power device is welded and fixed to the first pad, the substrate is welded and fixed to the second pad, and the second pad is connected to the heat conductor.

[0010] According to some embodiments of the present invention, a plurality of through holes are provided, and along a direction from the substrate toward the circuit board, the groove has a projection surface on the first surface, and the plurality of through holes are distributed at intervals within the projection surface.

[0011] According to some embodiments of the present invention, the through hole is a circular hole, and the diameter of the through hole is greater than or equal to 0.8 mm.

[0012] According to some embodiments of the present invention, a plurality of the power devices and the through holes are provided respectively, the plurality of the power devices are arranged at intervals on the first surface, each of the through holes is provided with the heat conductor, and each of the power devices is arranged opposite to at least one of the through holes.

[0013] According to some embodiments of the present invention, the plurality of power devices include an intelligent power module, a fast recovery diode, an insulated gate bipolar transistor and a rectifier bridge stack.

[0014] According to some embodiments of the present invention, the heat conductor is a copper deposition layer formed in the through hole.

[0015] According to some embodiments of the present invention, the control board further includes a connector, the heat sink is fixedly connected to the circuit board via the connector, a heat conductive medium layer is provided between the heat sink and the second surface, and the heat conductive medium layer abuts against the heat conductor.

[0016] According to some embodiments of the present invention, the thermally conductive medium layer includes a thermally conductive gasket and / or thermally conductive silicone grease.

[0017] The electric control assembly according to the second embodiment of the present invention comprises an electric control box and the control board described in the first embodiment, wherein the control board is installed in the electric control box.

[0018] The electric control assembly according to the embodiment of the present invention has at least the following beneficial effects:

[0019] The electronic control component applies the control board of the above embodiment, and the control board is installed in the electronic control box. The heat of the power device can be transferred to the radiator through the heat conductor to achieve heat dissipation of the power device. Since the power device and the radiator are located on different surfaces of the circuit board, the power device does not need to be connected to the radiator or fastened with screws, which improves production efficiency while avoiding the influence of mechanical stress on the power device, reduces the risk of damage to the power device, and improves the reliability of the electronic control component, which is suitable for air conditioners.

[0020] An air conditioner according to an embodiment of the third aspect of the present invention comprises the electronic control component described in the embodiment of the second aspect.

[0021] The air conditioner according to the embodiment of the present invention has at least the following beneficial effects:

[0022] The air conditioner adopts the electronic control component of the above embodiment. The electronic control component installs the control board in the electronic control box. Since the power device and the heat sink are located on different surfaces of the circuit board, the power device does not need to be connected to the heat sink or fastened with screws. While improving production efficiency, it can avoid the power device from being affected by mechanical stress, reduce the risk of damage to the power device, improve the reliability of the electronic control component, and also improve the operating reliability of the air conditioner.

[0023] Other features and advantages of the present invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic diagram of the three-dimensional structure of a control panel from the front view according to an embodiment of the present invention;

[0025] Figure 2 is a schematic diagram of the three-dimensional structure of a control panel from the back side of an embodiment of the present invention;

[0026] Figure 3 is a schematic diagram of the side structure of a control panel according to an embodiment of the present invention;

[0027] Figure 4 is a schematic structural diagram of the back side of a control panel according to an embodiment of the present invention;

[0028] Figure 5 is a schematic structural diagram of the back side of a circuit board according to an embodiment of the present invention;

[0029] Figure 6 yes Figure 4 Schematic diagram of the cross-section structure in the AA direction;

[0030] Figure 7 yes Figure 6 A schematic diagram of the enlarged structure at B in the middle;

[0031] Figure 8 is a schematic diagram of the three-dimensional structure of an intelligent power module from the front view according to an embodiment of the present invention;

[0032] Fig. 9 is a schematic diagram of the three-dimensional structure of an intelligent power module according to an embodiment of the present invention from a bottom surface perspective;

[0033] Fig.10 is a schematic cross-sectional structural diagram of an intelligent power module according to an embodiment of the present invention;

[0034] Fig.11 It is a schematic diagram of the assembly structure of a circuit board and a heat-conducting medium layer according to an embodiment of the present invention;

[0035] Fig.12 The figure is a schematic diagram of the assembly structure of a circuit board, a heat-conducting medium layer, and a power device according to an embodiment of the present invention.

[0036] Reference numerals:

[0037] Circuit board 100; first surface 110; second surface 120; through hole 130; heat conductor 131; connection hole 140; mounting area 150;

[0038] Power device 200; intelligent power module 210; pin 211; package body 212; slot 2121; substrate 213;

[0039] Radiator 300; base 310; heat dissipation fins 320;

[0040] Insulated gate bipolar transistor 400;

[0041] Fast recovery diode 500;

[0042] Rectifier bridge stack 600;

[0043] Thermal conductive medium layer 700;

[0044] Control board 1000. DETAILED DESCRIPTION

[0045] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0046] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0047] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by the terms "up", "down", "left", "right", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0048] In the description of the present invention, "multiple" means more than two, "greater than", "less than", "exceed" and the like are understood to exclude the number itself, and "above", "below", "within" and the like are understood to include the number itself. If there is a description of "first", "second" and the like, it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0049] In the description of the present invention, it should be noted that the terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution.

[0050] The technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the embodiments described below are only some embodiments of the present invention, not all embodiments.

[0051] At present, the control board of the air conditioner mainly installs power devices in a plug-in manner. Since the power device needs to be connected to a heat sink for heat dissipation, the power device and the heat sink need to be fixedly connected by screws during assembly so that the power device and the heat sink can fit together, and then the power device is soldered to a printed circuit board (PCB). In this way, the heat of the power device can be transferred to the heat sink for heat dissipation. However, there is a high risk of mechanical stress in the fastening process of the heat sink and the power device, which can easily cause damage to the power device, reduce its reliability, and affect product quality.

[0052] Moreover, since plug-in power devices have many pins (PIN feet), they are often plugged in manually during electronic production, which is inefficient and exposes the devices to a high risk of static electricity and mechanical stress. In addition, the pins of plug-in power devices are long, and the power devices are separated from the PCB board by a certain distance, so a bracket is needed to fix the heat sink, and the overall size is large, which cannot meet the requirements of miniaturized design of the electric control box.

[0053] In order to solve the above problems, the embodiment of the present invention provides a control panel 1000, which is suitable for an indoor unit of an air conditioner. Figures 1 to 12The control board 1000 according to the embodiment of the present invention is introduced.

[0054] Reference Figure 1 , Figure 2 and Figure 3 As shown, the control board 1000 provided in the embodiment of the present invention includes a circuit board 100, a power device 200 and a heat sink 300, the circuit board 100 has a first surface 110 and a second surface 120, the first surface 110 and the second surface 120 are arranged opposite to each other, that is, the first surface 110 and the second surface 120 are respectively located on different sides of the circuit board 100, wherein the power device 200 is arranged on the first surface 110, and the heat sink 300 is arranged on the second surface 120.

[0055] by Figure 1 The direction shown in is a reference direction. In the embodiment, the lower surface of the circuit board 100 is the first surface 110, and the upper surface of the circuit board 100 is the second surface 120. The upper surface of the circuit board 100 is used to install various electronic components and the heat sink 300, and the upper surface can be understood as the front side of the control board 1000; the power device 200 is installed on the lower surface of the circuit board 100, and the lower surface can be understood as the back side of the control board 1000. The power device 200 and the heat sink 300 are both arranged close to the left side of the circuit board 100.

[0056] Reference Figure 2 and Figure 8 As shown, the power device 200 in the embodiment is a SMD power device 200 , which is a power semiconductor device in a SMD package form. The power device 200 is fixedly connected to the lower surface of the circuit board 100 by surface mounting technology.

[0057] Specifically, the power device 200 has a plurality of pins 211, and a plurality of first solder pads are provided on the lower surface. The plurality of first solder pads are welded and fixed to the plurality of pins 211 one by one, so that the power device 200 is fixedly connected to the circuit board 100. In this way, the power device 200 can fit tightly to the lower surface. Compared with the installation structure of the plug-in power device 200, the gap between it and the circuit board 100 is smaller, which is conducive to reducing the size of the control board 1000.

[0058] In the related art, plug-in power devices have a large number of PIN pins, and the current production equipment accuracy cannot meet the requirements of automated plug-in. Compared with plug-in power devices, the present invention uses a surface mount power device 200, which can use a surface mount machine to achieve automated surface mount, and the surface mount power device 200 does not need to pre-install the heat sink 300, which can reduce one process and does not need to manually plug the power device 200, effectively improving production efficiency. In addition, the use of surface mount power devices 200 can improve the effect of soldering after passing the wave crest, avoid bridging, and improve the soldering quality.

[0059] Reference Figure 1 and Figure 2 As shown, the electronic components can be installed in the form of plug-ins. Specifically, a plurality of connection holes 140 are provided on the circuit board 100. The plurality of connection holes 140 are distributed on the upper surface of the circuit board 100 and are separated from the installation area of ​​the heat sink 300. During the assembly process, the pins of each electronic component are inserted into the connection holes 140, so that the heat sink 300 can be installed on the upper surface of the circuit board 100 together with the plug-in electronic components, thereby achieving the purpose of soldering the surface-mount power device 200 on the back side of the circuit board 100 and installing the heat sink 300 and the electronic components on the front side.

[0060] Reference Figure 3 As shown, it can be understood that the power device 200 and the heat sink 300 are arranged back to back with each other. Since the power device 200 and the heat sink 300 are located on different surfaces of the circuit board 100, the power device 200 does not need to be connected to the heat sink 300, nor does it need to be fastened by screws, which effectively improves production efficiency; since the connection method of fastening the heat sink 300 and the power device 200 with screws is eliminated, mechanical stress on the power device 200 during the screw fastening process is avoided, and the influence of static electricity on the power device 200 is reduced, thereby reducing the risk of damage to the power device 200 during the assembly process and improving the reliability of the control board 1000.

[0061] Reference Figure 4 and Figure 5 As shown, in the embodiment of the present invention, a through hole 130 is provided on the circuit board 100, and the through hole 130 passes through the first surface 110 and the second surface 120. The through hole 130 is located on the circuit board 100 at a position opposite to the power device 200 and the heat sink 300, that is, the installation area 150 where the power device 200 is located has a through hole 130 passing through the circuit board 100.

[0062] Combination Figure 6 and Figure 7 It can be understood that a heat conductor 131 is provided in the through hole 130. Since the through hole 130 passes through the circuit board 100, one end of the heat conductor 131 can be connected to the power device 200, and the other end extends toward the heat sink 300 and can be connected to or abut the heat sink 300. In this way, the heat generated by the power device 200 can be transferred to the heat sink 300 through the heat conductor 131, thereby achieving rapid heat dissipation of the power device 200.

[0063] It should be noted that the connection structure between the heat conductor 131 and the power device 200 and the heat sink 300 can achieve the purpose of transferring heat and is not limited to direct connection or indirect connection. The height of the heat conductor 131 can be greater than or equal to the thickness of the circuit board 100, satisfying the requirement that the heat conductor 131 can be connected to the power device 200 and the heat sink 300.

[0064] In some embodiments, a thermally conductive material is used to fill the through hole 130 to form a thermal conductor 131. The higher the thermal conductivity of the thermally conductive material, the better the thermal conductivity. Thermal conductivity is an inherent performance parameter of the material itself, which is used to describe the thermal conductivity of the material, also known as thermal conductivity. For example, it can be a material with high thermal conductivity such as copper, aluminum or its alloy.

[0065] In some embodiments, since the power device 200 generates a large amount of heat when working, the heat is dissipated outward through the surface of the packaging body 212, and the heat conductor 131 contacts the power device 200, so that the heat can be transferred to the heat sink 300 through the heat conductor 131. In this way, the power device 200 and the heat sink 300 do not need to be installed on the same side of the circuit board 100, and the heat dissipation purpose can be achieved. It can reduce the impact of mechanical stress and static electricity on the power device 200 and solve the heat dissipation problem.

[0066] Reference Figure 1 , Figure 2 and Figure 3 As shown, it can be understood that the heat sink 300 is made of aluminum alloy, copper alloy or other thermally conductive materials. In some embodiments, the heat sink 300 includes a base 310 and a plurality of heat dissipating fins 320. The plurality of heat dissipating fins 320 are arranged at intervals on a side of the base 310 away from the circuit board 100. The base 310 is fixedly connected to the circuit board 100 through a connecting member. The connecting member can be a structure such as a screw or a latch. For example, opposite screw holes are respectively provided on the base 310 and the circuit board 100. The screws are passed through the two screw holes to lock and fix the base 310 to the circuit board 100. Since the overall size of the heat sink 300 is relatively large, at least two screws can be used to connect the heat sink 300, and the structure is more stable and reliable.

[0067] Of course, this is only an example, and the heat sink 300 is not limited to the structural form shown in the above embodiment. For example, the heat sink fins 320 can also be arranged in a radial shape, which is selected according to the application requirements.

[0068] Reference Figure 4 and Figure 5 As shown, taking the power device 200 as an intelligent power module 210 (Intelligent Power Module, IPM) as an example, the intelligent power module 210 is roughly rectangular, and the through hole 130 is arranged in the installation area 150 where the intelligent power module 210 is located on the circuit board 100, so that the heat conductor 131 in the through hole 130 can be connected to the bottom of the intelligent power module 210, wherein the installation area 150 can be understood as the projection area of ​​the intelligent power module 210 on the circuit board 100.

[0069] Specifically, a plurality of through holes 130 are provided in the installation area 150 of the intelligent power module 210, and the plurality of through holes 130 are arranged at intervals. Each through hole 130 is filled with a heat conductor 131, and each heat conductor 131 is connected to the intelligent power module 210. That is to say, the heat of the intelligent power module 210 is transferred simultaneously through the plurality of heat conductors 131, so that the heat conduction effect is better and the heat dissipation efficiency is improved.

[0070] It can be understood that the greater the number of heat conductors 131, the larger the contact area between the intelligent power module 210 and the heat conductor 131, the higher the thermal conductivity, and the more efficient the heat dissipation. Since different power devices 200 have different sizes and heat generation, the specific number of heat conductors 131 can be selected according to the size and heat generation of the power device 200.

[0071] It should be noted that, since the power device 200 needs to be fixed to the first pad of the circuit board 100 by welding via the pin 211, the distribution of the through hole 130 needs to satisfy the requirement of not affecting the welding structure of the pin 211, that is, the through hole 130 is spaced apart from the first pad.

[0072] Reference Figure 7 As shown, in some embodiments, each through hole 130 is a circular hole, and the aperture of the through hole 130 is greater than or equal to 0.8 mm, that is, r ≥ 0.8 mm. For example, the aperture of the through hole 130 can be 0.8 mm, 1.5 mm, 2 mm, etc. In this way, when the aperture of the through hole 130 meets the above conditions, each heat conductor 131 and the power device 200 have a sufficiently large contact area, ensuring that the heat conductor 131 can transfer heat to the heat sink 300 for heat dissipation, so that the power device 200 can operate stably. It can be understood that when the aperture size of the through hole 130 is less than 0.8 mm, the size of the heat conductor 131 will be too small to affect the thermal conductivity efficiency, which is not conducive to the transfer of heat.

[0073] It should be noted that the circuit board 100 of the embodiment of the present invention adopts a double-sided PCB board, and the through hole 130 is a via hole formed on the PCB board. A copper plating layer is formed in the via hole through a copper plating process to obtain a heat conductor 131, which has high manufacturability. The specific material of the heat conductor 131 is copper, which has excellent thermal conductivity and is conducive to improving heat dissipation efficiency.

[0074] Of course, the shape of the through hole 130 is not limited to a circle, and may also be an ellipse, a square or other polygonal shapes.

[0075] Reference Figure 2 and Figure 4As shown, it can be understood that the control board 1000 can be a variable frequency drive board, the power device 200 is not limited to the intelligent power module 210, and the power device 200 can be provided with two or more, for example, it can also include a power factor correction (Power Factor Correction, PFC) module, a rectifier bridge stack 600, etc., wherein the power factor correction module includes a fast recovery diode 500 (Fast Recovery Diode, FRD) and an insulated gate bipolar transistor 400 (Insulated Gate Bipolar Transistor, IGBT).

[0076] Figure 2 and Figure 4 The figure shows the structure of the intelligent power module 210, the fast recovery diode 500, the insulated gate bipolar transistor 400 and the rectifier bridge stack 600 distributed on the lower surface of the circuit board 100. Of course, the circuit board 100 is the main carrier of the device. Other types of electronic components can also be connected to the circuit board 100. The electronic components can include capacitors, inductors, resistors, etc., to form a variable frequency drive board, which can be specifically used to drive the fan of the air conditioner indoor unit to perform variable frequency operation.

[0077] It can be understood that each power device 200 is arranged opposite to at least one through hole 130, that is, the circuit board 100 is also provided with a fast recovery diode 500, an insulated gate bipolar transistor 400 and a rectifier bridge stack 600 corresponding to each other in an installation area 150, and each installation area 150 is provided with a plurality of through holes 130, so that each power device 200 can transfer heat to the heat sink 300 through the heat conductor 131, and only one heat sink is needed to meet the purpose of simultaneous heat dissipation of multiple power devices 200.

[0078] It should be noted that the number of through holes 130 in each mounting area 150 can be set according to the size of the corresponding power device 200. For example, the size of the intelligent power module 210 is larger than the size of the fast recovery diode 500, and the number of through holes 130 in the mounting area 150 where the intelligent power module 210 is located is larger than the number of through holes 130 in the mounting area 150 where the fast recovery diode 500 is located. The specific number is selected according to actual application requirements.

[0079] Specifically, the control board 1000 provided in the embodiment of the present invention has a boost-type half-bridge topology structure, adopts an active PFC and integrates a surface-mount variable frequency IPM control structure, and arranges the power device 200 and the heat sink 300 on different surfaces of the circuit board 100. The heat generated by the power device 200 can be transferred to the heat sink 300 through the heat conductor 131, thereby achieving rapid heat dissipation of the power device 200 and meeting the heat dissipation requirements of the control board 1000.

[0080] It can be understood that active PFC is a power supply technology that can improve the power factor of the power supply to meet the specified standards. The principle of PFC is to improve the power factor of the power supply by controlling the phase and amplitude of the input current to keep it consistent with the phase and amplitude of the input voltage. The working principle of active PFC is that when the input voltage changes, the active PFC controller will adjust the phase and amplitude of the input current to keep it consistent with the phase and amplitude of the input voltage, thereby improving the power factor of the power supply.

[0081] Since the size of the radiator 300 is relatively large, by installing the above-mentioned power device 200 on the back of the circuit board 100, and the power device 200 and the radiator 300 are located on different surfaces of the circuit board 100, the power device 200 does not need to be connected to the radiator 300; when the control board 1000 is installed on the electric control box, it can be fixed on the cover plate of the electric control box, the back of the control board 1000 can face the bottom surface of the cover plate, and the front of the control board 1000 faces the cavity of the electric control box. The radiator 300 dissipates heat for multiple power devices 200 without affecting the heat dissipation effect of the power device 200. Compared with the method of installing the power device 200 and the radiator 300 on the same surface of the circuit board 100, there is no need to use a bracket to fix the radiator 300, and the height dimension of the front of the control board 1000 can be reduced, which can reduce the overall size of the control board 1000 and is conducive to the miniaturization design of the electric control box.

[0082] Reference Figure 6 and Figure 7 As shown, the intelligent power module 210, the fast recovery diode 500, the insulated gate bipolar transistor 400 and the rectifier bridge stack 600 are fixed on the lower surface of the circuit board 100 by surface mounting, and the power devices 200 are respectively connected to a plurality of heat conductors 131. In some embodiments of the present invention, in order to improve the efficiency of heat transfer, the power devices 200 are fixedly connected to the heat conductors 131 by welding to meet the requirement of rapid heat transfer.

[0083] Reference Figure 8 , Fig. 9 and Fig.10 As shown, the smart power module 210 is taken as an example for specific description. The smart power module 210 includes a substrate 213 and a package body 212. The substrate 213 is packaged in the package body 212. It can be understood that the smart power module 210 also includes electronic components such as power switch tubes. The electronic components are fixedly connected to the substrate 213. The pins 211 of the smart power module 210 are embedded in the package body 212 and are electrically connected to the electronic components.

[0084] The side of the package body 212 facing the circuit board 100 is the bottom surface, and the bottom surface is provided with a groove 2121. The electronic components are mounted on the upper side of the substrate 213, and the lower side of the substrate 213 is exposed through the groove 2121, that is, the bottom surface of the substrate 213 is exposed on the bottom surface of the intelligent power module 210, so that the intelligent power module 210 can be connected to the heat conductor 131 through the substrate 213, so that the heat conductor 131 is in contact with the intelligent power module 210. It can be understood that the heat generated by the electronic components can be transferred to the heat sink 300 through the substrate 213 and the heat conductor 131 in sequence, and the heat dissipation is more efficient.

[0085] Reference Fig. 9 As shown, in some embodiments, the shapes of the substrate 213 and the slot 2121 are roughly rectangular, and the size of the slot 2121 is slightly smaller than the size of the substrate 213, ensuring that the substrate 213 can be stably packaged in the package body 212. It should be noted that the substrate 213 can be made of a thermally conductive material, or a thermally conductive medium in contact with the thermal conductor 131 is added to the bottom surface of the substrate 213, for example, the thermally conductive medium can be a thermally conductive copper sheet, an aluminum sheet, etc.

[0086] Since the heat conductor 131 needs to be connected to the substrate 213 , the groove 2121 has a projection surface on the first surface 110 along the direction of the substrate 213 toward the circuit board 100 , and multiple through holes 130 are distributed at intervals in the projection surface, so as to ensure that the heat conductor 131 in each through hole 130 is connected to the substrate 213 .

[0087] In some embodiments, a second solder pad is preset on the lower surface of the PCB board, and the second solder pad is spaced apart from the first solder pad. The pin 211 of the power device 200 is welded and fixed on the first solder pad, and the substrate 213 is welded and fixed to the second solder pad through a solder paste welding process, and the second solder pad is connected to all the heat conductors 131 in the installation area 150 of the power device 200. In this way, the connection between the heat conductor 131 and the intelligent power module 210 is achieved. On the one hand, it can play a role in fixing the intelligent power module 210. On the other hand, since the substrate 213 is the main heat dissipation component, the heat is transferred toward the PCB board through the substrate 213 to meet the heat dissipation requirements.

[0088] It should be noted that the first pad and the second pad are reserved when manufacturing the PCB board to facilitate mounting the intelligent power module 210. Of course, the substrate 213 and the PCB board are not limited to being fixed by welding, and other methods can also be used for fixed connection. For example, the substrate 213 can be directly bonded to the heat conductor 131 or abutted against it.

[0089] In addition, the package body 212 of the embodiment can be made of plastic, thermally conductive materials, etc. For example, the electronic components, substrate 213 and package body 212 are integrally molded, and a groove 2121 is formed on the bottom surface of the package body 212 after molding. It has high manufacturability and is easy to implement, which is beneficial for the power device 200 to have a better heat dissipation effect.

[0090] It is understandable that the fast recovery diode 500, the insulated gate bipolar transistor 400 and the rectifier bridge stack 600 can adopt a structure with an exposed substrate 213. The specific connection method with the PCB board can refer to the connection structure of the intelligent power module 210 in the above embodiment, which will not be repeated here.

[0091] Reference Fig.11 and Fig.12 As shown, a heat-conducting medium layer 700 is provided between the heat sink 300 and the second surface 120 of the PCB board, that is, the heat of the power device 200 is transferred to the heat sink 300 through the substrate 213, the heat conductor 131, and the heat-conducting medium layer 700 in sequence. The heat-conducting medium layer 700 can be made of a heat-conducting material or a heat-conducting structure. It can be understood that thermal conductivity is used to describe the thermal conductivity of a material, also known as thermal conductivity, and the unit is W / mK. In the embodiment, a material with a thermal conductivity greater than 0.8W / mK can be used to form the heat-conducting medium layer 700, which can meet the requirements of thermal conductivity between the heat conductor 131 and the heat sink 300.

[0092] Fig.11 and Fig.12 The thermal conductive medium layer 700 shown is a thermal conductive gasket, which may have a certain elasticity so that the heat sink 300 and the PCB board can fit closely. Specifically, a thermal conductive silicone material may be used. Of course, this is only an example. The thermal conductive medium layer 700 may also be a thermal conductive tape, a thermal conductive film, etc., which has good thermal conductivity and improves thermal conductivity efficiency.

[0093] In some embodiments, the heat-conducting medium layer 700 may be thermal grease, which is coated on the surface of the heat sink 300 in contact with the PCB board. The gap between the heat sink 300 and the PCB board can be filled with the thermal grease, and the thermal grease has good thermal conductivity, which plays a role in enhancing thermal conductivity. In some optional embodiments, heat conduction can be performed by combining a thermal gasket with the thermal grease. Specifically, the surface of the thermal gasket is coated with thermal grease, so that the thermal gasket and the heat sink 300, as well as the thermal gasket and the heat conductor 131 have higher thermal conductivity, and the heat can be more effectively transferred to the heat sink 300, thereby improving the heat dissipation efficiency.

[0094] The embodiment of the present invention also proposes an electric control assembly, including an electric control box and the control board 1000 of the above embodiment, and the control board 1000 is installed in the electric control box. Specifically, the electric control box includes a box body and a cover plate, the control board 1000 is fixedly connected to the cover plate, and the cover plate is connected to the box body. After assembly, the control board 1000 is located in the box body, the back of the control board 1000 faces the cover plate, and the front of the control board 1000 faces the cavity of the box body. The control board 1000 uses a surface mount power device 200, and the power device 200 is fixedly connected to the lower surface of the PCB board through the surface mounting technology. The intelligent power module 210 is cooled by the heat sink 300, which does not affect the heat dissipation effect of the power device 200. Compared with the way that the power device 200 and the heat sink 300 are installed on the same surface of the circuit board 100, the control board 1000 does not need to use a bracket to fix the heat sink 300, and the height dimension of the front of the control board 1000 will be reduced, which can reduce the overall size, which is conducive to the miniaturization design of the electric control box.

[0095] Since the power device 200 and the heat sink 300 are located on different surfaces of the PCB board, the power device 200 does not need to be connected to the heat sink 300, nor does it need to be fastened with screws, which effectively improves production efficiency; since the method of fastening the connection between the heat sink 300 and the power device 200 with screws is eliminated, mechanical stress on the power device 200 during the screw fastening process is avoided, and the impact of static electricity on the power device 200 is reduced, thereby reducing the risk of damage to the power device 200 during the assembly process, and improving the reliability of the control board 1000 and the electronic control components.

[0096] An embodiment of the present invention further proposes an air conditioner, which may be a split-type air conditioner or an integrated air conditioner. Taking the air conditioner indoor unit as an example, the air conditioner indoor unit adopts the electronic control component of the above embodiment, and the electronic control component is achieved by installing the board in the electronic control box. Since the power device 200 and the radiator 300 are respectively arranged on different surfaces of the PCB board, compared with the method of installing the power device 200 and the radiator 300 on the same side of the circuit board 100, there is no need to use a bracket to fix the radiator 300, so the overall size of the control board 1000 can be reduced, meeting the requirements of miniaturized design, saving more installation space of the air conditioner indoor unit, and solving the problem of the power device 200 being affected by mechanical stress and static electricity, which is conducive to making the air conditioner run more reliably.

[0097] Since the air conditioner adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0098] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A control panel, characterized in that: include: A circuit board having a first surface and a second surface facing each other; A power device is a surface mount power device, and the power device is fixedly connected to the first surface; a heat sink, fixedly connected to the second surface; The circuit board is provided with a through hole, and a heat conductor connected to the power device is provided in the through hole. The heat conductor is used to transfer the heat generated by the power device to the heat sink.

2. The control panel according to claim 1, characterized in that: The power device includes a substrate and a package body, wherein the substrate is packaged in the package body, a groove is provided on the side of the package body facing the first surface, one side of the substrate is exposed in the groove and connected to the heat conductor, and the other side of the substrate is used for installing electronic components.

3. The control panel according to claim 2, characterized in that: The first surface is provided with a first pad and a second pad, the pin of the power device is welded and fixed to the first pad, the substrate is welded and fixed to the second pad, and the second pad is connected to the heat conductor.

4. The control panel according to claim 2, characterized in that: There are a plurality of through holes, and along the direction from the substrate to the circuit board, the slot has a projection surface on the first surface, and the plurality of through holes are distributed at intervals in the projection surface.

5. The control panel according to claim 1 or 4, characterized in that: The through hole is a circular hole, and the hole diameter of the through hole is greater than or equal to 0.8 mm.

6. The control panel according to claim 1, characterized in that: There are a plurality of power devices and a plurality of through holes, respectively. The plurality of power devices are arranged on the first surface at intervals. Each through hole is provided with the heat conductor. Each power device is arranged opposite to at least one through hole.

7. The control panel according to claim 6, characterized in that: The multiple power devices include intelligent power modules, fast recovery diodes, insulated gate bipolar transistors and rectifier bridge stacks.

8. The control panel according to claim 1 or 6, characterized in that: The heat conductor is a copper layer formed in the through hole.

9. The control panel according to claim 1, characterized in that: The control board further comprises a connecting piece, the heat sink is fixedly connected to the circuit board via the connecting piece, a heat conducting medium layer is arranged between the heat sink and the second surface, and the heat conducting medium layer abuts against the heat conductor.

10. The control panel according to claim 9, characterized in that: The heat-conducting medium layer includes a heat-conducting gasket and / or heat-conducting silicone grease.

11. An electric control assembly, characterized in that: It comprises an electric control box and the control board according to any one of claims 1 to 10, wherein the control board is arranged in the electric control box.

12. An air conditioner, characterized in that Includes the electronic control component as claimed in claim 11.

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