Auxiliary temperature and humidity control device and control method thereof

Abstract

The invention provides an auxiliary temperature and humidity control device and a control method thereof. The auxiliary temperature and humidity control device comprises a vapor compression type heat pump system, a box body, a semiconductor assembly, a humidifier device and a control element. A compressor outlet of the vapor compression type heat pump system is connected with a four-way reversing valve inlet, a four-way reversing valve outlet is connected with a second heat exchanger inlet, a second heat exchanger outlet is connected with a second electromagnetic valve inlet, a second electromagnetic valve outlet is connected with a first heat exchanger inlet, and a first heat exchanger outlet is connected with a compressor inlet. The heat end radiator and the cold end radiator of the semiconductor assembly heat or cool air in the box body. The humidifier device comprises a water collecting tank, a water tank, a first electromagnetic valve and a humidifying spray head. The water collecting tank collects condensate water formed by dehumidification at the cold end of the semiconductor, the water tank is connected with the water collecting tank and arranged under the semiconductor assembly, and the two sides of the first electromagnetic valve are connected with the water tank and the humidifying spray head respectively. The temperature and humidity in the cabinet can be accurately controlled, the working temperature area is widened, and the storage effect of the box body is optimized.

Description

Technical Field

[0001] The present invention belongs to the technical field of constant temperature and humidity control, and in particular relates to an auxiliary temperature and humidity control device and a control method thereof. Background Art

[0002] In recent years, with the continuous improvement of people's living standards, the constant temperature and humidity cabinet industry has developed rapidly to meet the diverse needs of customers for storing items. The traditional vapor compression refrigeration system is widely used in this industry due to its simple structure and high reliability. However, the existing cabinets based on the vapor compression refrigeration system have certain limitations in accurately controlling the temperature range and humidity range. Factors such as the start and stop of the compressor, changes in environmental factors, and load fluctuations can cause large changes in the temperature and humidity inside the cabinet, which is not a good storage effect for some items that are sensitive to temperature and humidity changes.

[0003] The most commonly used constant temperature and humidity cabinet technology currently uses electric heating technology to balance the extra cooling capacity generated by the refrigeration system, and combines steam humidification and dry dehumidification methods to achieve a constant temperature and humidity environment in the cabinet. This mode has the risk of overheating, a single working temperature zone, and requires additional steam to compensate for the air dryness caused by electric heating. The system is relatively complex and has high energy consumption. Summary of the invention

[0004] In view of the problems existing in the above-mentioned prior art, the purpose of the present invention is to provide an auxiliary temperature and humidity control device and a control method thereof, which can widen the working temperature range and accurately control the temperature and humidity in the cabinet.

[0005] In order to achieve the above object, the present invention adopts the following technical solution:

[0006] An auxiliary temperature and humidity control device includes a vapor compression heat pump system, a box, a semiconductor component, a humidifier device and a control element;

[0007] The steam compression heat pump system includes a first heat exchanger 110, a compressor 120, a four-way reversing valve 121, a second solenoid valve 122 and a second heat exchanger 123; the outlet of the compressor 120 is connected to the inlet of the four-way reversing valve 121, the outlet of the four-way reversing valve 121 is connected to the inlet of the second heat exchanger 123, the outlet of the second heat exchanger 123 is connected to the inlet of the second solenoid valve 122, the outlet of the second solenoid valve 122 is connected to the inlet of the first heat exchanger 110, and the outlet of the first heat exchanger 110 is connected to the inlet of the compressor 120 through the four-way reversing valve 121;

[0008] The box body includes a accommodating chamber 102, an air duct assembly and a detection device; the air duct assembly consists of a first air duct 103, a second air duct 105, a third air duct 118, an in-box fan 101, a heat dissipation fan 117, a first wind shield 104, a second wind shield 111, a third wind shield 112, and a fourth wind shield 116; the first air duct 103 is located above the accommodating chamber 102, the second air duct 105 is located on the right side of the accommodating chamber 102, the third air duct 118 is located on the right side of the second air duct 105, and the second air duct 105 and the third air duct 118 are located below the first air duct 103 The fan 101 in the box is installed in the accommodating chamber 102 and the first air duct 103, and the heat dissipation fan 117 is installed below the third air duct 118; the first wind shield 104 is located between the first air duct 103 and the second air duct 105, the second wind shield 111 is located between the first air duct 103 and the third air duct 118, the third wind shield 112 is located at the air inlet end of the third air duct 118, and the fourth wind shield 116 is located at the air outlet end of the third air duct 118; the detection device includes a temperature sensor 124 and a humidity sensor 125 arranged in the accommodating chamber 102;

[0009] The semiconductor assembly includes a semiconductor refrigeration chip 106, a hot end radiator 107 and a cold end radiator 113; the semiconductor 106 is arranged at the junction of the second air duct 105 and the third air duct 118, and the hot end radiator 107 and the cold end radiator 113 are respectively located at the hot end and the cold end of the semiconductor refrigeration chip 106;

[0010] The humidifier device includes a water collecting tank 114, a water tank 115, a humidifying nozzle 109 and a first solenoid valve 108; the water collecting tank 114 is connected to the upper part of the water tank 115, arranged directly below the semiconductor component, and collects condensed water formed by dehumidification of the semiconductor cold end; the two sides of the first solenoid valve 108 are respectively connected to the water tank 115 and the humidifying nozzle 109, which are used to increase the humidity of the air;

[0011] The air duct assembly, the semiconductor refrigeration chip 106, the first solenoid valve 108, the compressor 120, the four-way reversing valve 121, the second solenoid valve 122, the temperature sensor 124, and the humidity sensor 125 are all connected to the control element; the control element controls the switch of the air duct assembly, the magnitude and direction of the current entering the semiconductor refrigeration chip 106, the opening of the first solenoid valve 108, the start and stop and speed of the compressor (120), the direction of the four-way reversing valve (121), and the opening of the second solenoid valve 122 through feedback signals from the temperature sensor 124 and the humidity sensor 125.

[0012] Preferably, the first heat exchanger 110 is disposed inside the box to absorb and release heat to the air inside the box; the second heat exchanger 123 is disposed outside the box to release and absorb heat to the air outside the box.

[0013] In the steam compression heat pump system, in the cooling mode, the refrigerant flows out from the outlet of the compressor 120, flows to the second heat exchanger 123 through the four-way reversing valve 121, releases heat to the outdoor air, enters the first heat exchanger 110 after throttling through the second solenoid valve 122, absorbs the heat of the air in the box, and reduces the temperature; the evaporated refrigerant returns to the four-way reversing valve 121 in a gaseous state, flows to the compressor 120, and completes the cycle; in the heating mode, the four-way reversing valve 121 is used to change the flow direction of the refrigerant, the refrigerant flows out from the outlet of the compressor 120, flows to the first heat exchanger 110 through the four-way reversing valve 121, releases heat to the air in the box, enters the second heat exchanger 123 after throttling through the second solenoid valve 122, absorbs the heat of the air outside the box, and the evaporated refrigerant returns to the four-way reversing valve 121 in a gaseous state, flows to the compressor 120, and completes the cycle.

[0014] Preferably, the semiconductor refrigeration chip 106 is a single-stage semiconductor refrigeration chip, a double-stage semiconductor refrigeration chip or a multi-stage semiconductor refrigeration chip.

[0015] Preferably, the hot end radiator 107 includes a flexible thermally conductive material, a heat pipe and a metal fin; the heat pipe is connected to the hot end of the semiconductor refrigeration chip 106 through the flexible thermally conductive material, and the metal fins are arranged on the outside of the heat pipe; the cold end radiator 113 includes a flexible thermally conductive material, a heat pipe and a metal fin; the heat pipe is connected to the cold end of the semiconductor refrigeration chip 106 through the flexible thermally conductive material, and the metal fins are arranged on the outside of the heat pipe; the switching of the hot and cold ends is achieved by changing the direction of the current passed into the semiconductor refrigeration chip 106.

[0016] Preferably, the flexible thermally conductive material is made of any one of thermally conductive films, thermally conductive silicone, graphite sheets, and thermally conductive sheets. It has good thermal conductivity and can effectively transfer heat to the thermally conductive metal block for heat dissipation, thereby improving the overall heat dissipation performance of the radiator. At the same time, it can easily fit components of various shapes, increase the thermal contact area, and enhance the heat exchange effect.

[0017] Preferably, the orifice plate material above the containing chamber 102 is made of large-pore foam metal, and the chamber wall material is made of nanoporous foam metal, which can significantly reduce the overall weight of the containing chamber 102. At the same time, the material has a large specific surface area and good thermal conductivity, and a strong heat exchange capacity; the phase change material 119 is adsorbed on the surface of the orifice plate and the chamber wall to achieve energy storage.

[0018] The control method of the auxiliary temperature and humidity control device is to measure the temperature value T1 in the box through the temperature sensor 124, and measure the humidity value H1 in the box through the humidity sensor 125. The rated set temperature in the box is T s , when the rated set temperature inside the box is T in cooling mode s1, when the rated set temperature in the box is T in heating mode s2 , the rated humidity in the box is H s； When T s -1≤T1≤T s +1,0.95H s ≤H1≤1.05H s When the compressor 120 is powered off, the semiconductor refrigeration chip 106 works by default current, and the humidifier device works by default;

[0019] In the case of heating in the cooling mode in the box, the first wind shield 104 is opened, the second wind shield 111 is closed, the third wind shield 112 is opened, the fourth wind shield 116 is opened, the box fan 101 is turned on, and the heat dissipation fan 117 is turned on. When T s1 -3≤T1<T s1 -1, the current passing through the semiconductor cooling chip 106 increases continuously until it reaches the rated current, and the hot end radiator 107 heats the air in the box; on the one hand, the heated air is sent into the containing chamber 102 through the orifice plate through the guiding effect of the fan 101 in the box, and on the other hand, the heat dissipation fan 117 uses the air outside the box to dissipate the heat of the cold end radiator 113; when T s1 -5≤T1<T s1 -3, the compressor 120 gradually reduces the speed and the opening of the second solenoid valve 122, and the semiconductor refrigeration chip 106 works at the rated current; when T1<T s1 -5, the speed of the compressor 120 and the opening of the second solenoid valve 122 are adjusted to the minimum, the semiconductor refrigeration chip 106 works at the rated current, the second wind shield 111 is opened, and the high-temperature outdoor air is introduced into the box, thereby heating the air in the box; in the cooling mode of the box, the first wind shield 104 is opened, the second wind shield 111 is closed, the third wind shield 112 is opened, the fourth wind shield 116 is opened, the box fan 101 is turned on, and the heat dissipation fan 117 is turned on. When T s1 +1<T1≤T s1 +3, the direction of the rated current passed into the semiconductor cooling chip 106 is changed, and the current is continuously increased until the rated current is reached, and the cold end radiator 113 cools the air in the box; on the one hand, the cooling air is sent into the containing chamber 102 through the orifice plate through the guiding effect of the fan 101 in the box, and on the other hand, the heat dissipation fan 117 uses the air outside the box to dissipate the heat of the hot end radiator 107; when T s1 +3<T1≤T s1 +5, the compressor 120 gradually increases the speed and the opening of the second solenoid valve 122, and the semiconductor refrigeration chip 106 works at the rated current; when T s1+5<T1, the speed of the compressor 120 and the opening of the second solenoid valve 122 are both adjusted to the maximum, and the semiconductor refrigeration chip 106 works at the rated current; in terms of humidity control, the humidity value H1 in the box is measured by the humidity sensor 125, and the second wind shield 111 is closed; in the cooling and humidification mode in the box, when 0.90H s ≤H1<0.95H s When the current of the semiconductor refrigeration chip 106 is continuously reduced until the minimum working current is reached, the water stored in the water tank 115 is humidified through the humidifying nozzle 109 to humidify the air in the box; when 0.85H s ≤H1<0.90H s When H1<0.85H, the opening of the first solenoid valve 108 increases continuously, and the semiconductor refrigeration chip 106 is at the minimum working current; s When the first solenoid valve 108 is opened to the maximum, the semiconductor refrigeration chip 106 is at the minimum working current; in the refrigeration and dehumidification mode in the box, when 1.05H s s When the current of semiconductor refrigeration chip 106 increases continuously until the rated current, the dehumidification capacity is increased; when 1.10H s s When the opening of the first solenoid valve 108 is continuously reduced, the semiconductor refrigeration chip 106 works at the rated current; when 1.15H s When

[0020] In the case of heating in the box heating mode, the first wind shield 104 is opened, the second wind shield 111 is closed, the third wind shield 112 is opened, the fourth wind shield 116 is opened, the box fan 101 is turned on, and the heat dissipation fan 117 is turned on. When T s2 -3<T1≤T s2 -1, the current passing through the semiconductor cooling chip 106 increases continuously until it reaches the rated current, and the hot end radiator 107 heats the air in the box; on the one hand, the heated air is sent into the containing chamber 102 through the orifice plate through the guiding effect of the fan 101 in the box, and on the other hand, the heat dissipation fan 117 uses the air outside the box to dissipate the heat of the cold end radiator 113; when T s2 -5<T1≤T s2 -3, the compressor 120 gradually increases the speed and the opening of the second solenoid valve 122, and the semiconductor refrigeration chip 106 works at the rated current; when T1<T s2 ​​​-5, the speed of the compressor 120 and the opening of the second solenoid valve 122 are both adjusted to the maximum, and the semiconductor refrigeration chip 106 works at the rated current; in the case of cooling in the heating mode in the box, the first wind shield 104 is opened, the second wind shield 111 is closed, the third wind shield 112 is opened, the fourth wind shield 116 is opened, the fan 101 in the box is turned on, and the heat dissipation fan 117 is turned on. When T s2 +1<T1≤T s2 +3, the direction of the rated current passed into the semiconductor cooling chip 106 is changed and continuously increased until the rated current is reached, and the cold end radiator 113 cools the air in the box. On the one hand, the cooling air is sent into the containing chamber 102 through the orifice plate through the guiding effect of the fan 101 in the box, and on the other hand, the heat dissipation fan 117 uses the air outside the box to dissipate heat to the hot end radiator 107; when T s2 +3<T1≤T s2 +5, the compressor 120 gradually reduces the speed and the opening of the second solenoid valve 122, and the semiconductor refrigeration chip 106 works at the rated current; when T1<T s1 +5, the speed of the compressor 120 and the opening of the second solenoid valve 122 are adjusted to the minimum, the semiconductor refrigeration chip 106 works at the rated current, the second windshield 111 is opened, and the low-temperature air outside the box is introduced into the box, thereby cooling the air inside the box; in terms of humidity control, the humidity value H1 in the box is measured by the humidity sensor 125, the second windshield 111 is opened, and the third windshield 112 and the fourth windshield 116 are closed. In the heating and humidification mode in the box, when 0.90H s ≤H1<0.95H s When the current of the semiconductor refrigeration chip 106 is continuously reduced until the minimum working current is reached, the water stored in the water tank 115 is humidified through the humidifying nozzle 109 to humidify the air in the box; when 0.85H s ≤H1<0.90H s When H1<0.85H, the opening of the first solenoid valve 108 increases continuously, and the semiconductor refrigeration chip 106 is at the minimum working current; s When the first solenoid valve 108 is opened to the maximum, the semiconductor refrigeration chip 106 is at the minimum working current; in the heating and dehumidification mode in the box, when 1.05H s s When the current of semiconductor refrigeration chip 106 increases continuously until the rated current, the dehumidification capacity is increased; when 1.10H s s When the opening of the first solenoid valve 108 is continuously reduced, the semiconductor refrigeration chip 106 works at the rated current; when 1.15H s When <H1, the opening degree of the first solenoid valve 108 is at the minimum, and the semiconductor refrigeration chip 106 operates at the rated current.​​

[0021] The initial opening of the first solenoid valve 108 and the second solenoid valve (122) is 1 / 4 of the full opening of the valve, which is convenient for subsequent adjustment.

[0022] The compressor (120) is a variable frequency compressor, which controls the temperature of the refrigerant pipeline by automatically adjusting the speed, thereby matching various requirements. Compared with the prior art, the auxiliary temperature and humidity control device of the present invention has the following advantages:

[0023] By coupling the steam compression heat pump system with the semiconductor refrigeration system and adding a humidifier device, the air inside the receiving chamber is controlled at a constant temperature and humidity, which solves the problem of low precision in controlling the temperature and humidity inside the box by the steam compression heat pump system, and optimizes the storage effect of the box. The present invention can heat and cool the receiving chamber through the steam compression heat pump system, expand its working temperature range, and improve practicality. The introduction of semiconductor refrigeration technology makes the present invention flexible and environmentally friendly.

[0024] Compared with the prior art, an auxiliary temperature and humidity control device and a control method thereof of the present invention can achieve temperature and humidity regulation by comparing the values ​​output by the temperature sensor and the humidity sensor with the set value range. In terms of temperature control, in the cooling mode or heating mode in the box, when the temperature value in the box is low, the hot end of the semiconductor component is used to heat the air in the box; when the temperature value in the box is high, the direction of the current passed into the semiconductor component is changed, and the air in the box is cooled by the cold end of the semiconductor component; when the temperature value in the box is too low or too high, the excess cold and heat are matched by controlling the start and stop of the compressor and the speed and the opening of the second solenoid valve. In terms of humidity control, when the humidity value in the box is low, the humidifier device humidifies the air in the box through the humidifying nozzle with the water stored in the water tank. When the humidity value in the box is high, the air is cooled by the semiconductor component to reduce the humidity. When the humidity value in the box is too low or too high, the humidification amount of the humidifying nozzle is adjusted by controlling the opening of the first solenoid valve. When the temperature inside the box is within the rated set temperature range, the humidity inside the box is within the rated set humidity range, the compressor is powered off, the semiconductor components work at the default current, and the humidifier components work at the default current. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the structure of an auxiliary temperature and humidity control device according to an embodiment of the present invention;

[0026] Figure 2 This is a schematic diagram of feedback control of a control element according to an embodiment of the present invention;

[0027] Figure 3 This is a control logic diagram of the auxiliary temperature and humidity control device in the cabinet cooling mode according to an embodiment of the present invention;

[0028] Figure 4 This is a control logic diagram of the auxiliary temperature and humidity control device in the embodiment of the present invention in the heating mode inside the box;

[0029] In the attached drawings: 101-in-box fan; 102-accommodating chamber; 103-first air duct; 104-first wind shield; 105-second air duct; 106-semiconductor component; 107-hot end radiator; 108-first solenoid valve; 109-humidifying nozzle; 110-first heat exchanger; 111-second wind shield; 112-third wind shield; 113-cold end radiator; 114-water collecting tank; 115-water tank; 116-fourth wind shield; 117-cooling fan; 118-third air duct; 119-phase change material; 120-compressor; 121-four-way reversing valve; 122-second solenoid valve; 123-second heat exchanger 124-temperature sensor; 125-humidity sensor. DETAILED DESCRIPTION

[0030] In order to more clearly illustrate the implementation modes of the present invention or the technical solutions in the prior art, the relevant drawings will be further described in detail below.

[0031] The embodiment of the present invention proposes an auxiliary temperature and humidity control device and a control method thereof, which utilizes a four-way reversing valve to flexibly switch the steam compression heat pump system to cool or heat the air in the box, thereby improving the functionality of the system and meeting various requirements; introducing a semiconductor component and arranging it in the center of the adjacent wall of the second air duct and the third air duct, and switching the cold and hot ends by changing the current direction of the power supply, actively adjusting the temperature of the air in the box, and realizing precise temperature control; introducing a humidifier device and arranging it directly below the radiator of the semiconductor component, and the water collection tank and the water tank collect the condensed water of the cold end radiator, and when the air humidity in the box is low, the humidification nozzle is used to increase the air humidity in the box, and the humidification function of the device is realized. The traditional steam compression heat pump system is coupled with the semiconductor refrigeration technology, and the humidifier device assists in cooperation, so as to realize precise temperature and humidity control and optimize the storage effect of the box.

[0032] See also Figure 1The auxiliary temperature and humidity control device of the embodiment of the present invention includes an in-box fan 101, a accommodating chamber 102, a first air duct 103, a first wind shield 104, a second air duct 105, a semiconductor component 106, a hot-end radiator 107, a first solenoid valve 108, a humidifying nozzle 109, a first heat exchanger 110, a second wind shield 111, a third wind shield 112, a cold-end radiator 113, a water collecting tank 114, a water tank 115, a fourth wind shield 116, a heat dissipation fan 117, a third air duct 118, a phase change material 119, a compressor 120, a four-way reversing valve 121, a second solenoid valve 122, a second heat exchanger 123, a temperature sensor 124, and a humidity sensor 125. In the embodiment of the present invention, the outlet of the compressor 120 is connected to the inlet of the four-way reversing valve 121, the outlet of the four-way reversing valve 121 is connected to the inlet of the second heat exchanger 123, the outlet of the second heat exchanger 123 is connected to the inlet of the second solenoid valve 122, the outlet of the second solenoid valve 122 is connected to the inlet of the first heat exchanger 110, and the outlet of the first heat exchanger 110 is connected to the inlet of the compressor 120 through the four-way reversing valve 121; in the cooling mode, the refrigerant flows out from the outlet of the compressor 120, flows to the second heat exchanger 123 through the four-way reversing valve 121, releases heat to the outdoor air, and enters the first heat exchanger after being throttled by the second solenoid valve 122. The refrigerant is then throttled by the second solenoid valve 122 and enters the second heat exchanger 123, absorbing heat from the air outside the box. The evaporated refrigerant returns to the four-way reversing valve 121 in a gaseous state and flows to the compressor 120, completing the cycle. In the heating mode, the four-way reversing valve 121 is used to change the flow direction of the refrigerant. The refrigerant flows out from the outlet of the compressor 120, flows to the first heat exchanger 110 through the four-way reversing valve 121, releases heat to the air inside the box, and enters the second heat exchanger 123 after being throttled by the second solenoid valve 122, absorbing heat from the air outside the box. The evaporated refrigerant returns to the four-way reversing valve 121 in a gaseous state and flows to the compressor 120, completing the cycle.The semiconductor assembly is arranged in the center of the adjacent wall of the second air duct 105 and the third air duct 118, and the hot end radiator 107 and the cold end radiator 113 are respectively connected by flexible thermal conductive materials; the water collecting tank 114 is connected to the upper part of the water tank 115, and is arranged directly below the semiconductor assembly to collect the condensed water formed by the dehumidification of the semiconductor cold end. The two sides of the first solenoid valve 108 are respectively connected to the water tank 115 and the humidification nozzle 109 to increase the humidity of the air; the orifice plate above the accommodating chamber 102 and the surface of the chamber wall are tightly fitted with the phase change material 119; the first air duct is located above the accommodating chamber 102 The second air duct 105 is located on the right side of the accommodating chamber 102, and the third air duct 118 is located on the right side of the second air duct 105; the fan 101 in the box is installed in the accommodating chamber 102 and the first air duct 103, and the heat dissipation fan 117 is installed below the third air duct 118; the first wind shield 104 is located between the first air duct 103 and the second air duct 105, the second wind shield 111 is located between the first air duct 103 and the third air duct 118, the third wind shield 112 is located at the air inlet end of the third air duct 118, and the fourth wind shield 116 is located at the air outlet end of the third air duct 118.

[0033] The semiconductor refrigeration chip 106 of the embodiment of the present invention is a multi-stage semiconductor refrigeration chip, which increases the temperature control range to match various working conditions. The heat pipe with metal fins connects the hot end and the cold end of the semiconductor refrigeration chip 106 through flexible heat conductive materials; the switching of the hot and cold ends is achieved by changing the direction of the current passed into the semiconductor refrigeration chip 106.

[0034] The flexible thermally conductive material used in the embodiment of the present invention can be any one of a thermally conductive film, a thermally conductive silica gel, a graphite sheet, and a thermally conductive sheet. Because of its good thermal conductivity, it can effectively transfer heat to the thermally conductive metal block for heat dissipation, thereby improving the overall heat dissipation performance of the radiator, and can easily fit components of various shapes, thereby increasing the thermal contact area and enhancing the heat exchange effect.

[0035] In the embodiment of the present invention, the orifice plate material on the containment chamber 102 is made of large-pore foam metal, and the chamber wall material is made of nanoporous foam metal, which can significantly reduce the overall weight of the containment chamber 102. At the same time, the material has a large specific surface area and good thermal conductivity, and has a strong heat exchange capacity.

[0036] The phase change material 119 in the embodiment of the present invention is a solid-liquid phase change material of a hydrated salt, which has the advantages of high latent heat of phase change and simple preparation. It adjusts the air temperature in the box by absorbing or releasing heat, thereby improving the stability of the system. The phase change material is encapsulated into microcapsules and adsorbed in porous particles to prepare a composite phase change material, which effectively improves the migration and leakage problems of liquid phase change materials and is conducive to multiple recycling. The phase change material can also be any one of straight-chain alkanes, paraffins, fatty acids, and polyethylene glycols.

[0037] See also Figure 2 The air duct assembly, semiconductor refrigeration chip 106, first solenoid valve 108, compressor 120, four-way reversing valve 121, second solenoid valve 122, temperature sensor 124, and humidity sensor 125 in the embodiment of the present invention are all connected to the control element; the control element controls the switch of the air duct assembly, the magnitude and direction of the current entering the semiconductor refrigeration chip 106, the opening of the first solenoid valve 108, the start and stop and speed of the compressor 120, the direction of the four-way reversing valve 121, and the opening of the second solenoid valve 122 through feedback signals from the temperature sensor 124 and the humidity sensor 125.

[0038] See also Figure 3 and Figure 4 The auxiliary temperature and humidity control device and control method of the embodiment of the present invention specifically include:

[0039] Set the corresponding working parameters, T s Indicates the rated set temperature inside the box, T s1 Indicates the rated set temperature inside the cabinet in cooling mode, T s2 Indicates the rated set temperature inside the cabinet in heating mode, H s The temperature sensor 124 measures the temperature value T1 in the box, and the humidity sensor 125 measures the humidity value H1 in the box.

[0040] The air in the box is cooled or heated by changing the direction of the four-way reversing valve 121 in the steam compression heat pump system. When in the box cooling mode, the first heat exchanger 110 in the system absorbs heat and cools the air in the box. When in the box heating mode, the first heat exchanger 110 in the system releases heat to heat the air in the box.

[0041] When T s -1≤T1≤T s +1,0.95H s ≤H1≤1.05H s When the air temperature in the box is within the range of the rated set temperature ±1°C, and the air humidity in the box is within the range of 5% of the rated set humidity, the compressor 120 is powered off, and the temperature and humidity environment in the box are maintained by the semiconductor refrigeration chip 106 and the humidifier device.

[0042] In the case of heating in the cooling mode in the box, the first wind shield 104 is opened, the second wind shield 111 is closed, the third wind shield 112 is opened, the fourth wind shield 116 is opened, the box fan 101 is turned on, and the heat dissipation fan 117 is turned on. When T s1 -3≤T1<T s1-1, at this time, the temperature inside the box is slightly lower than the rated set temperature inside the box, the current passed through the semiconductor refrigeration chip 106 increases continuously until it reaches the rated current, and the hot end radiator 107 heats the air inside the box; on the one hand, the heated air is sent into the containing chamber 102 through the orifice plate through the guiding effect of the fan 101 inside the box, and on the other hand, the heat dissipation fan 117 uses the air outside the box to dissipate heat to the cold end radiator 113;

[0043] When T s1 -5≤T1<T s1 -3, the temperature inside the box is significantly lower than the rated set temperature range inside the box, the compressor 120 gradually reduces the speed and the opening of the second solenoid valve 122, and the semiconductor refrigeration chip 106 works at the rated current;

[0044] When T1<T s1 -5, at which time the temperature inside the box is much lower than the rated set temperature range inside the box, the speed of the compressor 120 and the opening of the second solenoid valve 122 are adjusted to the minimum, the semiconductor refrigeration chip 106 works at the rated current, the second wind shield 111 is opened, and the high-temperature outdoor air is introduced into the box, thereby heating the air inside the box;

[0045] In the cooling mode of the box, the first wind shield 104 is opened, the second wind shield 111 is closed, the third wind shield 112 is opened, the fourth wind shield 116 is opened, the box fan 101 is turned on, and the heat dissipation fan 117 is turned on. When T s1 +1<T1≤T s1 +3, at this time, the temperature inside the box is slightly higher than the rated set temperature range inside the box, the direction of the rated current passed into the semiconductor refrigeration chip 106 is changed, and the current is continuously increased until the rated current is reached, and the cold end radiator 113 cools the air inside the box; on the one hand, the cooling air is sent into the containing chamber 102 through the orifice plate through the guiding effect of the fan 101 inside the box, and on the other hand, the heat dissipation fan 117 uses the air outside the box to dissipate heat to the hot end radiator 107;

[0046] When T s1 +3<T1≤T s1 +5, at this time, the temperature inside the box is significantly higher than the rated set temperature range inside the box, the compressor 120 gradually increases the speed and the opening of the second solenoid valve 122, and the semiconductor refrigeration chip 106 works at the rated current;

[0047] When T s1 +5<T1, the temperature inside the box is much higher than the rated set temperature range inside the box, the speed of the compressor 120 and the opening of the second solenoid valve 122 are adjusted to the maximum, and the semiconductor refrigeration chip 106 works at the rated current;

[0048] In terms of humidity control, the humidity value H1 in the box is measured by the humidity sensor 125, and the second wind shield 111 is closed. s ≤H1<0.95H s When the humidity in the box is low, the current of the semiconductor refrigeration chip 106 is continuously reduced until the minimum working current is reached, and the water stored in the water tank 115 is used to humidify the air in the box through the humidifying nozzle 109, and the opening of the first solenoid valve 108 is adjusted to control the humidification amount;

[0049] When 0.85H s ≤H1<0.90H s When the humidity in the box is significantly lower than the rated value, the opening of the first solenoid valve 108 increases continuously, and the semiconductor refrigeration chip 106 is at the minimum working current;

[0050] When H1<0.85H s When the humidity in the box is far lower than the rated value, the first solenoid valve 108 is at its maximum opening, and the semiconductor refrigeration chip 106 is at its minimum operating current.

[0051] In the cooling and dehumidification mode, when 1.05H s s When the humidity in the box is high, the current of the semiconductor refrigeration chip 106 increases continuously until it reaches the rated current, thereby increasing the dehumidification capacity;

[0052] When 1.10H s s When the humidity in the box is significantly higher than the rated value, the opening of the first solenoid valve 108 is continuously reduced, and the semiconductor refrigeration chip 106 works at the rated current;

[0053] When 1.15H s When

[0054] In the case of heating in the box heating mode, the first wind shield 104 is opened, the second wind shield 111 is closed, the third wind shield 112 is opened, the fourth wind shield 116 is opened, the box fan 101 is turned on, and the heat dissipation fan 117 is turned on. When T s2 -3<T1≤T s2 ​​​-1, at this time, the temperature inside the box is slightly lower than the rated set temperature range inside the box, and it is necessary to open the first wind shield 104, close the second wind shield 111, open the third wind shield 112, turn on the fan 101 inside the box, and turn on the heat dissipation fan 117 to heat it. The current passed into the semiconductor refrigeration chip 106 increases continuously until it reaches the rated current, and the hot end heat sink 107 heats the air inside the box; on the one hand, the heated air is sent into the containing chamber 102 through the orifice plate through the guiding effect of the fan 101 inside the box, and on the other hand, the heat dissipation fan 117 uses the air outside the box to dissipate the heat from the cold end heat sink 113;

[0055] When T s2 -5≤T1<T s2 -3, at which time the temperature inside the box is significantly lower than the rated set temperature range inside the box, the compressor 120 gradually increases the speed and the opening of the second solenoid valve 122, and the semiconductor refrigeration chip 106 works at the rated current;

[0056] When T1<T s2 -5, at which time the temperature inside the box is much lower than the rated set temperature range inside the box, the speed of the compressor 120 and the opening of the second solenoid valve 122 are both adjusted to the maximum, and the semiconductor refrigeration chip 106 works at the rated current;

[0057] In the case of cooling in the heating mode in the box, the first wind shield 104 is opened, the second wind shield 111 is closed, the third wind shield 112 is opened, the fourth wind shield 116 is opened, the box fan 101 is turned on, and the heat dissipation fan 117 is turned on. When T s2 +1<T1≤T s2 +3, the temperature inside the box is slightly higher than the rated set temperature range inside the box. Change the direction of the rated current passed into the semiconductor refrigeration chip 106, and increase it continuously until the rated current is reached. The cold end radiator 113 cools the air inside the box. On the one hand, the cooling air is sent into the accommodation chamber 102 through the orifice plate through the guiding effect of the fan 101 inside the box. On the other hand, the heat dissipation fan 117 uses outdoor air to dissipate heat from the hot end radiator 107;

[0058] When T s1 +3<T1≤T s1 +5, at this time, the temperature inside the box is significantly higher than the rated set temperature range inside the box, the compressor 120 gradually reduces the speed and the opening of the second solenoid valve 122, and the semiconductor refrigeration chip 106 works at the rated current;

[0059] When T s1When +5<T1, the temperature inside the box is much higher than the rated set temperature range inside the box, the speed of the compressor 120 and the opening of the second solenoid valve 122 are adjusted to the minimum, the semiconductor refrigeration chip 106 works at the rated current, and the second wind shield 111 is opened to introduce the outdoor air with lower temperature into the box, thereby cooling the air inside the box.

[0060] In terms of humidity control, the humidity value H1 in the box is measured by the humidity sensor 125, the second wind shield 111 is opened, the third wind shield 112 and the fourth wind shield 116 are closed, the fan 101 in the box is turned on, and the heat dissipation fan 117 is turned on. In the heating and humidification mode in the box, when 0.90H s ≤H1<0.95H s When the humidity in the box is low, the current of the semiconductor refrigeration chip 106 is continuously reduced until the minimum working current is reached, and the water stored in the water tank 115 humidifies the air in the box through the humidifying nozzle 109, and the opening of the first solenoid valve 108 is adjusted to control the humidification amount;

[0061] When 0.85H s ≤H1<0.90H s When the humidity in the box is significantly lower than the rated value, the opening of the first solenoid valve 108 increases continuously, and the semiconductor refrigeration chip 106 is at the minimum working current;

[0062] When H1<0.85H s When , the humidity in the box is far lower than the rated value, the first solenoid valve 108 is at its maximum opening, and the semiconductor refrigeration chip 106 is at its minimum operating current.

[0063] In the heating and dehumidification mode, when 1.05H s s When the humidity in the box is high, the current 106 of the semiconductor refrigeration chip increases continuously until it reaches the rated current, thereby increasing the dehumidification capacity;

[0064] When 1.10H s s When the humidity in the box is significantly higher than the rated value, the opening of the first solenoid valve 108 is continuously reduced, and the semiconductor refrigeration chip 106 works at the rated current;

[0065] When 1.15H s When

[0066] ​​​In terms of constant temperature and humidity, in the cooling mode inside the box, the first wind shield 104 is opened, the second wind shield 111 is closed, the third wind shield 112 is opened, the fourth wind shield 116 is opened, the fan 101 inside the box is opened, the heat dissipation fan 117 is opened, the current of the semiconductor component 106 is reversed and adjusted to the default current, the first solenoid valve 108 is adjusted to the initial opening, and the humidification nozzle 109 stably humidifies the box. The cold end radiator 113 cools and dehumidifies the air inside the box to consume the heat penetration of the outside into the box, so that the environment inside the box maintains a constant temperature and humidity; in the heating mode inside the box, the first wind shield 104 is opened, the second wind shield 111 is opened, the third wind shield 112 is closed, the fourth wind shield 116 is closed, the fan 101 inside the box is opened, the heat dissipation fan 117 is opened, the semiconductor refrigeration chip 106 is adjusted to the default current, the first solenoid valve 108 is adjusted to the initial opening, and the humidification nozzle 109 stably humidifies the box. The cold end radiator 113 cools and dehumidifies the air in the box to consume the heat penetrating into the box from the outside, so as to maintain the environment in the box at a constant temperature and humidity.

[0067] The above description is only a preferred embodiment of the present invention and is not intended to limit the technical solution of the present invention. Those skilled in the art should understand that, without departing from the spirit and principles of the present invention, the present technical solution can also be subjected to a number of simple modifications and substitutions, and these modifications and substitutions also fall within the scope of protection covered by the claims.

Claims

1. An auxiliary temperature and humidity control device, characterized in that: Includes vapor compression heat pump system, cabinet, semiconductor components, humidifier device and control element; The steam compression heat pump system comprises a first heat exchanger (110), a compressor (120), a four-way reversing valve (121), a second solenoid valve (122) and a second heat exchanger (123); the outlet of the compressor (120) is connected to the inlet of the four-way reversing valve (121), the outlet of the four-way reversing valve (121) is connected to the inlet of the second heat exchanger (123), the outlet of the second heat exchanger (123) is connected to the inlet of the second solenoid valve (122), the outlet of the second solenoid valve (122) is connected to the inlet of the first heat exchanger (110), and the outlet of the first heat exchanger (110) is connected to the inlet of the compressor (120) via the four-way reversing valve (121); The box body comprises a accommodating chamber (102), an air duct assembly and a detection device; the air duct assembly consists of a first air duct (103), a second air duct (105), a third air duct (118), an in-box fan (101), a heat dissipation fan (117), a first wind shield (104), a second wind shield (111), a third wind shield (112) and a fourth wind shield (116); the first air duct (103) is located above the accommodating chamber (102), the second air duct (105) is located on the right side of the accommodating chamber (102), the third air duct (118) is located on the right side of the second air duct (105), and the second air duct (105) and the third air duct (118) are located below the first air duct (103) The box fan (101) is installed in the accommodating chamber (102) and in the first air duct (103), and the heat dissipation fan (117) is installed below the third air duct (118); the first wind shield (104) is located between the first air duct (103) and the second air duct (105), the second wind shield (111) is located between the first air duct (103) and the third air duct (118), the third wind shield (112) is located at the air inlet end of the third air duct (118), and the fourth wind shield (116) is located at the air outlet end of the third air duct (118); the detection device includes a temperature sensor (124) and a humidity sensor (125) arranged in the accommodating chamber (102); The semiconductor component comprises a semiconductor refrigeration chip (106), a hot end radiator (107) and a cold end radiator (113); the semiconductor (106) is arranged at the junction of the second air duct (105) and the third air duct (118), and the hot end radiator (107) and the cold end radiator (113) are respectively located at the hot end and the cold end of the semiconductor refrigeration chip (106); The humidifier device comprises a water collecting tank (114), a water tank (115), a humidifying nozzle (109) and a first solenoid valve (108); the water collecting tank (114) is connected to the upper part of the water tank (115), arranged directly below the semiconductor component, and collects condensed water formed by dehumidification of the semiconductor cold end; the two sides of the first solenoid valve (108) are respectively connected to the water tank (115) and the humidifying nozzle (109), and are used to increase the humidity of the air; The air duct assembly, the semiconductor refrigeration chip (106), the first solenoid valve (108), the compressor (120), the four-way reversing valve (121), the second solenoid valve (122), the temperature sensor (124), and the humidity sensor (125) are all connected to the control element; the control element controls the switch of the air duct assembly, the magnitude and direction of the current entering the semiconductor refrigeration chip (106), the opening of the first solenoid valve (108), the start and stop and the speed of the compressor (120), the direction of the four-way reversing valve (121), and the opening of the second solenoid valve (122) through feedback signals from the temperature sensor (124) and the humidity sensor (125).

2. The auxiliary temperature and humidity control device according to claim 1, characterized in that: The first heat exchanger (110) is arranged inside the box and is used to absorb and release heat from the air inside the box; the second heat exchanger (123) is arranged outside the box and is used to release and absorb heat from the air outside the box.

3. The auxiliary temperature and humidity control device according to claim 1, characterized in that: The steam compression heat pump system, in cooling mode, the refrigerant flows out from the outlet of the compressor (120), flows through the four-way reversing valve (121) to the second heat exchanger (123), releases heat to the outdoor air, enters the first heat exchanger (110) after being throttled by the second solenoid valve (122), absorbs heat from the air in the box, and reduces the temperature; the evaporated refrigerant returns to the four-way reversing valve (121) in a gaseous state, flows to the compressor (120), and completes the cycle; in heating mode, the four-way reversing valve (121) is used to change the flow direction of the refrigerant, the refrigerant flows out from the outlet of the compressor (120), flows through the four-way reversing valve (121) to the first heat exchanger (110), releases heat to the air in the box, enters the second heat exchanger (123) after being throttled by the second solenoid valve (122), absorbs heat from the air outside the box, and the evaporated refrigerant returns to the four-way reversing valve (121) in a gaseous state, flows to the compressor (120), and completes the cycle.

4. The auxiliary temperature and humidity control device according to claim 1, characterized in that: The semiconductor refrigeration chip (106) is a single-stage semiconductor refrigeration chip, a double-stage semiconductor refrigeration chip or a multi-stage semiconductor refrigeration chip.

5. The auxiliary temperature and humidity control device according to claim 1, characterized in that: The hot end radiator (107) comprises a flexible heat conductive material, a heat conductive pipe and a metal fin; the heat conductive pipe is connected to the hot end of the semiconductor refrigeration chip (106) via the flexible heat conductive material, and the metal fin is arranged outside the heat conductive pipe; the cold end radiator (113) comprises a flexible heat conductive material, a heat conductive pipe and a metal fin; the heat conductive pipe is connected to the cold end of the semiconductor refrigeration chip (106) via the flexible heat conductive material, and the metal fin is arranged outside the heat conductive pipe; the switching of the hot and cold ends is achieved by changing the direction of the current passed into the semiconductor refrigeration chip (106).

6. The auxiliary temperature and humidity control device according to claim 5, characterized in that: The flexible heat-conducting material is made of any one of a heat-conducting film, a heat-conducting silica gel, a graphite sheet, and a heat-conducting sheet.

7. The auxiliary temperature and humidity control device according to claim 1, characterized in that: The material of the orifice plate above the containing chamber (102) is macroporous foam metal, and the material of the chamber wall is nanoporous foam metal; the phase change material (119) is adsorbed on the surface of the orifice plate and the chamber wall to achieve energy storage.

8. The control method of the auxiliary temperature and humidity control device according to any one of claims 1 to 7, characterized in that: The temperature value T1 in the box is measured by the temperature sensor (124), and the humidity value H1 in the box is measured by the humidity sensor (125). The rated set temperature in the box is T s , when the rated set temperature inside the box is T in cooling mode s1 , when the rated set temperature in the box is T in heating mode s2 , the rated humidity in the box is H s； When T s -1≤T1≤T s +1,0.95H s ≤H1≤1.05H s When the compressor (120) is powered off, the semiconductor refrigeration chip (106) works at the default current, and the humidifier device works at the default current; In the case of heating in the cooling mode in the box, the first wind shield (104) is opened, the second wind shield (111) is closed, the third wind shield (112) is opened, the fourth wind shield (116) is opened, the fan (101) in the box is turned on, and the heat dissipation fan (117) is turned on. When T s1 -3≤T1<T s1 -1, the current passed through the semiconductor refrigeration chip (106) increases continuously until it reaches the rated current, and the hot end radiator (107) heats the air in the box; on the one hand, the heated air is sent into the containing chamber (102) through the orifice plate through the guiding effect of the fan (101) in the box, and on the other hand, the heat dissipation fan (117) uses the air outside the box to dissipate heat to the cold end radiator (113); when T s1 -5≤T1<T s1 -3, the compressor (120) gradually reduces its rotation speed and the opening of the second solenoid valve (122), and the semiconductor refrigeration chip (106) operates at the rated current; when T1<T s1 -5, the speed of the compressor (120) and the opening of the second solenoid valve (122) are adjusted to the minimum, the semiconductor refrigeration chip (106) operates at the rated current, the second wind shield (111) is opened, and the outdoor air with high temperature is introduced into the box body, thereby heating the air in the box body; In the cooling mode of the box, the first wind shield (104) is opened, the second wind shield (111) is closed, the third wind shield (112) is opened, the fourth wind shield (116) is opened, the box fan (101) is turned on, and the heat dissipation fan (117) is turned on. When T s1 +1<T1≤T s1 +3, the direction of the rated current passed into the semiconductor refrigeration chip (106) is changed, and the current is continuously increased until the rated current is reached, and the cold end radiator (113) cools the air in the box; on the one hand, the cooling air is sent into the accommodation chamber (102) through the orifice plate through the guiding effect of the fan (101) in the box, and on the other hand, the heat dissipation fan (117) uses the air outside the box to dissipate heat to the hot end radiator (107); when T s1 +3<T1≤T s1 +5, the compressor (120) gradually increases its rotation speed and the opening of the second solenoid valve (122), and the semiconductor refrigeration chip (106) operates at the rated current; when T s1 +5<T1, the speed of the compressor (120) and the opening of the second solenoid valve (122) are both adjusted to the maximum, and the semiconductor refrigeration chip (106) works at the rated current; in terms of humidity control, the humidity value H1 in the box is measured by the humidity sensor (125), and the second wind shield (111) is closed; in the cooling and humidification mode in the box, when 0.90H s ≤H1<0.95H s When 0.85H, the current of the semiconductor refrigeration chip (106) is continuously reduced until the minimum working current is reached, and the water stored in the water tank (115) is used to humidify the air in the tank through the humidifying nozzle (109); when 0.85H s ≤H1<0.90H s When H1 is less than 0.85H, the opening of the first solenoid valve (108) increases continuously, and the semiconductor refrigeration chip (106) is at the minimum working current; s When the first solenoid valve (108) is at its maximum opening, the semiconductor refrigeration chip (106) is at its minimum operating current; in the refrigeration and dehumidification mode in the cabinet, when 1.05H s s When 1.10H s s When 1.15H s When <H1, the opening degree of the first solenoid valve (108) is at the minimum, and the semiconductor refrigeration chip (106) operates at the rated current;​​ In the case of heating in the box in the heating mode, the first wind shield (104) is opened, the second wind shield (111) is closed, the third wind shield (112) is opened, the fourth wind shield (116) is opened, the box fan (101) is turned on, and the heat dissipation fan (117) is turned on. When T s2 -3<T1≤T s2 -1, the current passed through the semiconductor refrigeration chip (106) increases continuously until it reaches the rated current, and the hot end radiator (107) heats the air in the box; on the one hand, the heated air is sent into the containing chamber (102) through the orifice plate through the guiding effect of the fan (101) in the box, and on the other hand, the heat dissipation fan (117) uses the air outside the box to dissipate heat to the cold end radiator (113); when T s2 -5<T1≤T s2 -3, the compressor (120) gradually increases its rotation speed and increases the opening of the second solenoid valve (122), and the semiconductor refrigeration chip (106) operates at the rated current; when T1<T s2 -5, the speed of the compressor (120) and the opening of the second solenoid valve (122) are both adjusted to the maximum, and the semiconductor refrigeration chip (106) operates at the rated current; In the cooling state of the heating mode in the box, the first wind shield (104) is opened, the second wind shield (111) is closed, the third wind shield (112) is opened, the fourth wind shield (116) is opened, the fan (101) in the box is turned on, and the heat dissipation fan (117) is turned on. When T s2 +1<T1≤T s2 +3, the direction of the rated current passed into the semiconductor refrigeration chip (106) is changed and continuously increased until the rated current is reached, and the cold end heat sink (113) cools the air in the box. On the one hand, the cooling air is sent into the containing chamber (102) through the perforated plate by the flow-guiding effect of the fan (101) inside the box, and on the other hand, the heat dissipation fan (117) uses the air outside the box to dissipate heat to the hot end radiator (107); when T s2 +3<T1≤T s2 +5, the compressor (120) gradually reduces its rotation speed and the opening of the second solenoid valve (122), and the semiconductor refrigeration chip (106) operates at the rated current; when T1<T s1 +5, the speed of the compressor (120) and the opening of the second solenoid valve (122) are adjusted to the minimum, the semiconductor refrigeration chip (106) works at the rated current, the second wind shield (111) is opened, and the low-temperature air outside the box is introduced into the box, thereby cooling the air inside the box; in terms of humidity control, the humidity value H1 in the box is measured by the humidity sensor (125), the second wind shield (111) is opened, and the third wind shield (112) and the fourth wind shield (116) are closed. In the heating and humidification mode in the box, when 0.90H s ≤H1<0.95H s When 0.85H, the current of the semiconductor refrigeration chip (106) is continuously reduced until the minimum working current is reached, and the water stored in the water tank (115) is used to humidify the air in the tank through the humidifying nozzle (109); when 0.85H s ≤H1<0.90H s When H1 is less than 0.85H, the opening of the first solenoid valve (108) increases continuously, and the semiconductor refrigeration chip (106) is at the minimum working current; s When the first solenoid valve (108) is at its maximum opening, the semiconductor refrigeration chip (106) is at its minimum operating current; in the heating and dehumidification mode in the cabinet, when 1.05H s s When 1.10H s s When 1.15H s When <H1, the opening degree of the first solenoid valve (108) is at the minimum, and the semiconductor refrigeration chip (106) operates at the rated current.​​ 9. The control method of the auxiliary temperature and humidity control device according to claim 8, characterized in that: The initial opening of the first solenoid valve (108) and the second solenoid valve (122) is 1 / 4 of the full opening of the valve, which is convenient for subsequent adjustment.

10. The control method of the auxiliary temperature and humidity control device according to claim 8, characterized in that: The compressor (120) is a variable frequency compressor, which controls the temperature of the refrigerant pipeline by automatically adjusting the rotation speed, thereby matching various needs.

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