Temperature adjusting device and testing device of integrated chip

Abstract

The invention discloses a temperature adjusting device and an integrated chip testing device, the temperature adjusting device is applied to an integrated chip testing scene, the temperature adjusting device comprises a first semiconductor chilling plate, the first end face of the first semiconductor chilling plate is configured to be attached to one side of a to-be-tested integrated chip, and the second end face of the first semiconductor chilling plate is configured to be attached to the other side of the to-be-tested integrated chip; the heat exchanger is used for absorbing heat of the to-be-tested integrated chip or transferring heat to the to-be-tested integrated chip; the heat exchange assembly is attached to the second end face of the first semiconductor chilling plate and used for conducting heat exchange with the first semiconductor chilling plate. According to the scheme, the speed of refrigerating or heating the to-be-tested integrated chip by the semiconductor refrigerating sheet can be increased, so that the to-be-tested integrated chip is cooled or heated more quickly.

Description

Technical Field

[0001] The present application relates to the technical field of integrated chip testing, and in particular to a temperature regulating device and an integrated chip testing device. Background Art

[0002] In the current technical field, after the integrated chip (such as processing unit chip, memory chip) is manufactured and processed, a series of tests need to be performed on the integrated chip to determine whether the integrated chip meets the requirements. Some integrated chips need to work normally in high temperature environment and low temperature environment, so they need to be subjected to high and low temperature aging tests.

[0003] At present, the conventional method of high and low temperature testing of integrated chips is to place the integrated chips in a high and low temperature aging test chamber. The common high and low temperature aging test chambers currently have defects such as poor temperature balance, inability to be miniaturized, and easy wear of internal mechanical components. Summary of the invention

[0004] The present application provides a temperature regulating device and a testing device for an integrated chip.

[0005] A technical solution adopted by the present application is to provide a temperature regulating device, which is applied to the integrated chip testing scenario, and the temperature regulating device includes:

[0006] A first semiconductor cooling sheet, wherein a first end surface of the first semiconductor cooling sheet is configured to be attached to one side of the integrated chip to be tested, and is used to absorb heat from the integrated chip to be tested or transfer heat to the integrated chip to be tested;

[0007] The heat exchange component is attached to the second end surface of the first semiconductor refrigeration plate and is used for exchanging heat with the first semiconductor refrigeration plate.

[0008] The heat exchange component includes:

[0009] A first heat-conducting member, the first heat-conducting member is attached to the second end surface of the first semiconductor cooling sheet;

[0010] A liquid cooling component, wherein part of the liquid cooling circuit of the liquid cooling component is arranged on the first heat conducting member, and is used to circulate the coolant in the liquid cooling circuit and perform heat exchange with the first heat conducting member according to the test requirements of the integrated chip.

[0011] The liquid cooling component includes a second semiconductor refrigeration plate, which is in contact with another part of the liquid cooling circuit of the liquid cooling component. The second semiconductor refrigeration plate is used for exchanging heat with the liquid cooling circuit.

[0012] The liquid cooling assembly further includes a radiator, which is used to further dissipate the heat absorbed by the cooling liquid when the cooling liquid absorbs the heat in the first heat-conducting member.

[0013] The temperature regulating device further comprises:

[0014] The second heat conducting member, the first end surface of the second heat conducting member is configured to be attached to one side of the integrated chip to be tested, for exchanging heat with the integrated chip to be tested, and the second end surface of the second heat conducting member is attached to the first end surface of the first semiconductor cooling plate.

[0015] A heat conducting material is coated between the second end surface of the second heat conducting member and the second end surface of the first semiconductor cooling plate, and / or a heat conducting material is coated between the first end surface of the second heat conducting member and one side of the integrated chip to be tested.

[0016] Wherein, the first semiconductor refrigeration piece is a single-stage Peltier element;

[0017] When dissipating the heat absorbed from the integrated chip to be tested, the first end surface of the first semiconductor cooling sheet is a cold surface, and the second end surface of the first semiconductor cooling sheet is a hot surface;

[0018] When heat is conducted to the integrated chip to be tested through the first semiconductor cooling plate, the first end surface of the first semiconductor cooling plate is a hot surface, and the second end surface of the first semiconductor cooling plate is a cold surface.

[0019] The temperature regulating device further comprises:

[0020] The temperature control unit is configured to perform voltage inversion on the first end surface and the second end surface of the first semiconductor refrigeration plate to achieve switching between the cold surface and the hot surface.

[0021] Another technical solution adopted by the present application is to provide a testing device for an integrated chip, the testing device comprising:

[0022] Test socket, used to place the integrated chip to be tested;

[0023] A test board is coupled to a test socket to test the integrated chip to be tested;

[0024] The temperature regulating device is used to regulate the temperature when testing the integrated chip to be tested, wherein the temperature regulating device is such as the temperature regulating device mentioned above.

[0025] The test device also includes:

[0026] First Space;

[0027] The second space is contained in the first space, and is used to contain the integrated chip to be tested, the test socket and the first semiconductor cooling plate, so that the integrated chip to be tested meets the test requirements at the target temperature.

[0028] The beneficial effects of the present application are as follows: the temperature regulating device comprises a first semiconductor refrigeration plate, the first end face of the first semiconductor refrigeration plate is configured to be attached to one side of the integrated chip to be tested, and is used to absorb the heat of the integrated chip to be tested or transfer heat to the integrated chip to be tested; a heat exchange component is attached to the second end face of the first semiconductor refrigeration plate, and is used to reduce the temperature of the second end face of the first semiconductor refrigeration plate when dissipating the heat absorbed from the integrated chip to be tested, or to increase the temperature of the second end face of the first semiconductor refrigeration plate when conducting heat to the integrated chip to be tested through the first semiconductor refrigeration plate according to the test requirements of the integrated chip to be tested. The temperature regulating device of the present application utilizes the semiconductor refrigeration plate attached to one side of the integrated chip to be tested to independently realize cooling or heating of the integrated chip to be tested, and further utilizes the heat exchange component attached to the first semiconductor refrigeration plate to accelerate the speed at which the first semiconductor refrigeration plate absorbs the heat of the integrated chip to be tested or accelerates the speed at which the first semiconductor refrigeration plate conducts heat to the integrated chip to be tested, so that the integrated chip to be tested is quickly cooled or heated, thereby improving the test efficiency of the integrated chip to be tested. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0030] Figure 1 It is a structural schematic diagram of an embodiment of a temperature regulating device provided by the present application;

[0031] Figure 2 yes Figure 1 A schematic diagram of the structure when the first semiconductor cooling sheet and the first heat conducting member are not in contact;

[0032] Figure 3 yes Figure 1 A schematic diagram of the structure when the first semiconductor refrigeration sheet and the first heat-conducting member are in contact;

[0033] Figure 4 yes Figure 1 A schematic diagram of the structure when the first semiconductor cooling sheet and the second heat conducting member are not in contact;

[0034] Figure 5 yes Figure 1 A schematic diagram of the structure when the first semiconductor cooling sheet contacts the second heat conducting member;

[0035] Figure 6 yes Figure 1 A schematic diagram of the structure when the integrated chip to be tested is not in contact with the second heat conducting member;

[0036] Figure 7 yes Figure 1 A schematic diagram of the structure when the integrated chip to be tested contacts the second heat conducting member;

[0037] Figure 8 It is a structural schematic diagram of an embodiment of an integrated chip testing device provided by the present application;

[0038] Fig. 9 is a structural schematic diagram of another embodiment of the integrated chip testing device provided by the present application;

[0039] Fig.10 is a structural schematic diagram of another embodiment of the integrated chip testing device provided by the present application;

[0040] Fig.11 is a structural schematic diagram of another embodiment of the integrated chip testing device provided by the present application;

[0041] Fig.12 is a structural schematic diagram of another embodiment of the integrated chip testing device provided by the present application;

[0042] Fig.13 It is a flow chart of an embodiment of an integrated chip testing method provided in the present application. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0044] For integrated chips that have high operational reliability in both extremely cold and high temperature environments, R&D verification, system testing, reliability testing or production testing must be carried out in a temperature environment of -45℃ to 150℃.

[0045] Taking the aging test of integrated chips as an example, it is necessary to perform functional testing, performance testing and accelerated aging testing on the integrated chips under high temperature (such as 110℃, 125℃ or 150℃), room temperature (such as 20℃, 25℃ or 30℃) and low temperature (such as -25℃, -40℃, -50℃) environments to screen out defective products that do not meet the requirements.

[0046] Currently, the common devices for high and low temperature testing of integrated chips mainly include: high and low temperature incubators using compressor cooling and electric heating, and high and low temperature incubators using liquid nitrogen cooling and electric heating strips for heating.

[0047] Among them, a high and low temperature thermostat that uses compressor cooling and electric heating can achieve an ambient temperature of -70°C to 150°C, and the ambient temperature in the high and low temperature thermostat can be dynamically adjusted.

[0048] The high and low temperature incubator is cooled by liquid nitrogen and heated by electric heating strips. The ambient temperature in the high and low temperature incubator can reach -150℃~150℃, and the ambient temperature in the high and low temperature incubator can be adjusted dynamically.

[0049] The inventors of the present application have discovered that currently common high and low temperature incubators have the defect of low heating and cooling efficiency. The temperature in the incubator needs to take more than ten minutes to half an hour to adjust to the specified temperature. After reaching the specified temperature, it takes a long time to wait for the temperature of each area in the incubator to be balanced. Common high and low temperature incubators use compressors or liquid nitrogen for refrigeration and electric hot air for heating, which results in loss of mechanical components and loss of refrigerant. Furthermore, when the chip to be tested is subjected to high and low temperature tests in the high and low temperature incubator, since the test board is also placed in the high and low temperature incubator, some of the current test boards are not resistant to high and low temperatures and cannot test the chip to be tested. Although the components of the test board are made of high and low temperature resistant materials, the stability of the test board in long-term high and low temperature environments cannot be guaranteed. After several high and low temperature tests on the integrated chip to be tested, in order to ensure the stability of the integrated chip test, the test board needs to be replaced, thereby greatly increasing the testing cost.

[0050] The present application mainly designs a temperature control device that independently controls the temperature of the integrated chip to be tested. Unlike the traditional method, the temperature control device designed in the present application does not need to install other mechanical components to assist in cooling or heating when the integrated chip to be tested is subjected to high and low temperature tests, thereby further improving the operating reliability of the temperature control device.

[0051] Please refer to Figure 1 , Figure 1 It is a structural schematic diagram of an embodiment of a temperature regulating device provided in the present application.

[0052] like Figure 1 As shown, the temperature regulating device 10 of the embodiment of the present application includes a first semiconductor refrigeration sheet 11 and a heat exchange component 12 .

[0053] The first end surface 111 of the first semiconductor cooling sheet 11 is configured to be attached to one side end surface of the integrated chip 1 to be tested, and is used to absorb heat from the integrated chip 1 to be tested or transfer heat to the integrated chip 1 to be tested. It can be understood that the first semiconductor cooling sheet 11 is used to heat or cool the integrated chip 1 to be tested.

[0054] In some embodiments, the integrated chip 1 to be tested is a processor device. In some application scenarios, the processor device may be a CPU (Central Processing Unit). In some application scenarios, the processor device may be a GPU (Graphic Processing Unit). In some application scenarios, the processor device may be an integrated circuit chip with signal processing capabilities. In some application scenarios, the processor device may also be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components. A general-purpose processor may be a microprocessor or the processor device may also be any conventional processor, etc.

[0055] In some embodiments, the integrated chip 1 to be tested is a storage medium, such as a flash memory particle. In some application scenarios, the storage medium can be a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a flash memory card or a disk.

[0056] Specifically, the test performed on the integrated chip to be tested may include functional testing, performance testing and / or reliability testing of the chip to be tested at different temperatures. Further, the reliability test may include (high temperature / low temperature) temperature cycle test, high temperature aging life test (HTOL), temperature and humidity test (TH / THB) and / or high temperature storage test (HTSL), etc.

[0057] In some application scenarios, the temperature regulating device 10 can also be used in the operation scenario of the integrated chip 1 under test. For example, the normal operating temperature of some integrated chips 1 under test is lower than minus 100 degrees Celsius. The temperature regulating device 10 can maintain the integrated chip 1 under test within its normal operating temperature range.

[0058] In some embodiments, the first semiconductor cooling sheet 11 can use the Peltier effect to perform any one of cooling, heating, and temperature maintenance operations on the integrated chip 1 to be tested.

[0059] The Peltier effect principle is that a thermocouple pair is formed by connecting a plate of an N-type semiconductor (electron semiconductor) material with a plate of a P-type semiconductor (hole semiconductor) material. When current passes through, heat transfer occurs between the outer end faces of the two semiconductors, and the heat is transferred from one end face to the other end face, thereby generating a temperature difference to form a cold end face and a hot end face. It can be understood that the heat of the cold end face is transferred to the hot end face. However, due to the resistance of the semiconductor material itself, heat is generated when current flows through the semiconductor material, thereby affecting heat transfer. Furthermore, the heat between the two plates will also be reversely transferred through the air and / or the semiconductor material itself. When the cold end face and the hot end face reach a certain temperature difference, the heat of the forward heat transfer is equal to the heat of the reverse heat transfer, and the temperature of the cold end face and the hot end face will not continue to change.

[0060] Taking the first semiconductor refrigeration plate 11 cooling the integrated chip 1 to be tested as an example, at this time, the temperature of the first end face 111 in contact with one side of the integrated chip 1 to be tested is lower than the temperature of the second end face 112, that is, the first end face 111 forms a cold surface, and the second end face 112 forms a hot surface; in order to reduce the temperature of the first end face 111, it is necessary to further reduce the temperature of the second end face 112, that is, in order to speed up the speed at which the first semiconductor refrigeration plate 11 absorbs the heat of the integrated chip 1 to be tested, it is necessary to timely conduct the heat of the second end face 112 to other components whose heat is lower than that of the second end face 112.

[0061] Taking the first semiconductor refrigeration plate 11 heating up the integrated chip 1 to be tested as an example, at this time, the temperature of the first end face 111 in contact with one side of the integrated chip 1 to be tested is higher than the temperature of the second end face 112, that is, the first end face 111 forms a hot surface and the second end face 112 forms a cold surface; in order to increase the temperature of the first end face 111, it is necessary to further increase the temperature of the second end face 112, that is, in order to speed up the speed of transferring heat from the first semiconductor refrigeration plate 11 to the integrated chip to be tested, it is necessary to promptly use other components with higher heat than the second end face 112 to transfer heat to the second end face 112.

[0062] The heat exchange component 12 is attached to the second end surface 112 of the first semiconductor cooling plate 11 . The heat exchange component 12 is used for exchanging heat with the first semiconductor cooling plate 11 .

[0063] In some application scenarios, the first semiconductor cooling sheet 11 is used to cool the integrated chip 1 to be tested. When the first semiconductor cooling sheet 11 dissipates the heat absorbed from the integrated chip 1 to be tested, the heat of the first end surface 111 increases, and the temperature of the first end surface 111 rises; further, the temperature of the second end surface 112 also rises. At this time, the heat exchange component 12 attached to the second end surface 112 absorbs the heat of the second end surface 112, thereby reducing the temperature of the second end surface 112, accelerating the heat conduction in the first semiconductor cooling sheet 11, and quickly cooling the integrated chip 1 to be tested.

[0064] In some application scenarios, the first semiconductor cooling sheet 11 is used to heat up the integrated chip 1 to be tested. When the first semiconductor cooling sheet 11 conducts heat to the integrated chip 1 to be tested, the heat of the first end face 111 decreases, and the temperature of the first end face 111 decreases; further, the temperature of the second end face 112 also decreases. At this time, the heat exchange component 12 attached to the second end face 112 conducts heat to the second end face 112, thereby increasing the temperature of the second end face 112, accelerating the heat conduction of the first semiconductor cooling sheet 11, and rapidly heating the integrated chip 1 to be tested.

[0065] In some application scenarios, the first semiconductor cooling plate 11 is also used to maintain the temperature of the integrated chip 1 to be tested, and the heat exchange component 12 is used to maintain the heat of the first semiconductor cooling plate 11 .

[0066] Optionally, the heat exchange component 12 is an air-cooling component. Exemplarily, the air-cooling component can be an air conditioner or an air-cooling radiator, which is not limited here.

[0067] Optionally, the heat exchange component 12 is a liquid cooling component. Exemplarily, the liquid cooling component can be a water cooling radiator or an oil cooling radiator, which is not limited here.

[0068] Optionally, the temperature regulating device 10 further includes a temperature sensor (not shown). In some embodiments, the temperature sensor is attached between the first end surface 111 of the first semiconductor cooling plate 11 and the surface of the integrated chip 1 to be tested. In some embodiments, the temperature sensor is attached to the surface of the integrated chip 1 to be tested.

[0069] Exemplarily, the temperature sensor is used to obtain the current temperature value of the integrated chip 1 to be tested. Further, the difference between the current temperature value and the preset temperature value is used to determine the control parameter of the first semiconductor refrigeration chip 11, thereby controlling the first semiconductor refrigeration chip 11 to perform a temperature increase or decrease operation.

[0070] Optionally, the heat exchange component 12 includes a first heat conductor 121 and a liquid cooling component 13, and the first heat conductor 121 is attached to the second end surface 112, and is used to conduct heat from the liquid cooling component 13 to the second end surface 112, that is, to conduct heat from the liquid cooling component 13 to the first semiconductor cooling sheet 11. Alternatively, the heat is conducted from the second end surface 112 to the liquid cooling component 13, that is, to conduct heat from the first semiconductor cooling sheet 11 to the liquid cooling component 13.

[0071] In some application scenarios, the first thermal conductor 121 can be a metal with good thermal conductivity (such as copper, aluminum, platinum), metal oxide or alloy, or a thermally conductive material represented by graphene, phase change thermal insulating material, thermally conductive pad, thermally conductive filler or thermally conductive pad, etc., which is not limited here.

[0072] Furthermore, part of the liquid cooling circuit of the liquid cooling assembly 13 is disposed in the first heat conducting member 121 , and the coolant circulates in the liquid cooling circuit to exchange heat with the first heat conducting member 121 .

[0073] Optionally, the heat exchange between the liquid cooling component 13 and the first heat conducting member 121 includes any one of absorbing heat in the first heat conducting member 121 , conducting heat to the first heat conducting member 121 , and maintaining heat in the first heat conducting member 121 .

[0074] In some application scenarios, the first semiconductor refrigeration sheet 11 is used to absorb the heat of the integrated chip 1 to be tested. Part or all of the heat absorbed by the first semiconductor refrigeration sheet 11 is transferred to the first heat conductor 121, so that the heat in the first heat conductor 121 increases, that is, the temperature of the first heat conductor 121 rises, and the speed at which the first heat conductor 121 absorbs the heat of the first semiconductor refrigeration sheet 11 gradually decreases; at this time, the temperature of the coolant in the liquid cooling component 13 is lower than the temperature of the first heat conductor 121, then the coolant in the liquid cooling component 13 performs heat exchange with the first heat conductor 121, absorbs the heat of the first heat conductor 121, and the temperature of the first heat conductor 121 decreases. Furthermore, the speed at which the first heat conductor 121, whose temperature has dropped, absorbs the heat of the first semiconductor refrigeration sheet 11 gradually increases.

[0075] In some application scenarios, the first semiconductor refrigeration sheet 11 is used to conduct heat to the integrated chip 1 to be tested. The first heat conductor 121 conducts heat to the first semiconductor refrigeration sheet 11, so that the heat of the first heat conductor 121 is reduced, that is, the temperature of the first heat conductor 121 drops, and the speed at which the first heat conductor 121 conducts heat to the first semiconductor refrigeration sheet 11 gradually decreases; at this time, the temperature of the coolant in the liquid cooling component 13 is higher than the temperature of the first heat conductor 121, then the coolant in the liquid cooling component 13 conducts heat to the first heat conductor 121, and the temperature of the first heat conductor 121 rises. Furthermore, the speed at which the first heat conductor 121, whose temperature has risen, conducts heat to the first semiconductor refrigeration sheet 11 gradually increases.

[0076] In some application scenarios, the first semiconductor cooling sheet 11 is used to maintain the heat of the integrated chip to be tested 1. The first heat-conducting member 121 does not conduct heat to the first semiconductor cooling sheet 11, nor does it absorb heat from the first semiconductor cooling sheet 11. Similarly, the coolant in the liquid cooling assembly 13 does not conduct heat to the first heat-conducting member 121, nor does it absorb heat from the first heat-conducting member 121.

[0077] Optionally, the coolant in the liquid cooling component 13 is a liquid with strong heat absorption capacity such as pure water, ethylene glycol aqueous solution, ethylene glycol water-based antifreeze, glycerol aqueous solution or glycerol water-based antifreeze, which is not limited here.

[0078] After long-term research, the inventor of this application found that the current conventional heat exchange component types include air-cooled components and conventional liquid-cooled components. The radiator of the conventional liquid-cooled component needs to be provided with a cooling fan. Taking the cooling scenario as an example, the air-cooled component has the defect of poor cooling efficiency and the inability to further reduce the temperature of the second end surface (hot surface) of the semiconductor refrigeration plate. The conventional air-cooled component can only maintain the temperature of the first end surface (cold surface) of the semiconductor refrigeration plate at 0°C or above; compared with the air-cooled component, the conventional liquid-cooled component has a higher heat dissipation efficiency, but the conventional liquid-cooled component can only maintain the temperature of the first end surface (cold surface) of the semiconductor refrigeration plate at -20°C or above. At the same time, the above-mentioned air-cooled components and conventional liquid-cooled components cannot heat the second end surface (cold surface) of the semiconductor refrigeration plate in the heating scenario.

[0079] In view of the deficiencies of the above conventional technical means, the inventor of the present application additionally arranges a second semiconductor refrigeration plate 131 on the liquid cooling component 13. The second semiconductor refrigeration plate 131 is in contact with the liquid cooling circuit of another part of the liquid cooling component 13. The second semiconductor refrigeration plate 131 is used for heat exchange with the liquid cooling circuit.

[0080] Optionally, the heat exchange between the second semiconductor refrigeration plate 131 and the liquid cooling circuit includes any one of absorbing heat from the coolant in the liquid cooling circuit, releasing heat to the coolant in the liquid cooling circuit, and maintaining the heat of the coolant in the liquid cooling circuit.

[0081] In some application scenarios, the first end surface 111 is used to absorb the heat of the integrated chip 1 to be tested, and the liquid cooling component 13 absorbs the heat of the second end surface 112 through the second semiconductor cooling sheet 131, thereby reducing the temperature of the second end surface 112. At this time, the heat of the coolant in the liquid cooling component 13 increases, and the second semiconductor cooling sheet 131 is used to absorb the heat of the coolant.

[0082] In some application scenarios, the first end surface 111 is used to dissipate heat to the integrated chip 1 under test, and the liquid cooling component 13 releases heat to the second end surface 112 through the second semiconductor cooling plate 131, thereby increasing the temperature of the second end surface 112. At this time, the heat of the coolant in the liquid cooling component 13 is reduced, and the second semiconductor cooling plate 131 is used to release heat to the coolant.

[0083] In some application scenarios, if the test requirement of the integrated chip 1 to be tested is to neither absorb the heat of the integrated chip 1 to be tested nor transfer heat to the integrated chip 1 to be tested, any one or more of the first semiconductor refrigeration plate 11, the second semiconductor refrigeration plate 131, and the liquid cooling component 13 may not work.

[0084] By setting a second semiconductor cooling plate in contact with another part of the cooling circuit in the liquid cooling assembly, according to the test requirements of the integrated chip to be tested, when the heat of the coolant in the cooling circuit increases, the heat of the coolant is absorbed. Alternatively, when the heat of the coolant in the cooling circuit decreases, the heat is released to the coolant. Furthermore, by reversing the voltage applied to both ends of the second semiconductor cooling plate, the switching between absorbing the heat of the coolant and releasing the heat to the coolant can be achieved.

[0085] In some embodiments, a heat-conducting member (not shown) with strong heat conductivity is partially or completely sheathed on the outer surface of another part of the cooling circuit in the liquid cooling assembly 13, and a second semiconductor cooling sheet 131 is attached to the outer surface of the heat-conducting member. Optionally, the heat-conducting member can be a metal (such as copper, aluminum, platinum), a metal oxide or an alloy with good thermal conductivity, or a heat-conducting material represented by graphene, phase-change thermal insulation material, thermal pad, thermal filler or thermal pad, etc., which is not limited here.

[0086] In some embodiments, the second semiconductor cooling sheet 131 is attached to the outer surface of another portion of the cooling circuit in the liquid cooling component 13 .

[0087] Optionally, the liquid cooling assembly 13 is further provided with a radiator 14. The radiator 14 is used to further dissipate the heat absorbed by the cooling liquid when the cooling liquid absorbs the heat of the first heat conducting member 121.

[0088] Exemplarily, the radiator 14 is an air-cooled radiator.

[0089] In some application scenarios, the first end surface 111 is used to absorb the heat of the integrated chip 1 to be tested, and the liquid cooling component 13 absorbs the heat of the second end surface 112 through the first heat conductor 121, thereby reducing the temperature of the second end surface 112. At this time, the heat of the coolant in the liquid cooling component 13 increases, and the coolant after absorbing the heat first passes through the radiator 14, and the radiator 14 dissipates part of the heat absorbed by the coolant to the surrounding environment, that is, the coolant has been partially cooled; further, the coolant after partial cooling is cooled for the second time through the second semiconductor cooling plate 131, so that the temperature of the coolant is lower, and the ability of the coolant to absorb heat is further improved.

[0090] In some application scenarios, when the coolant releases heat to the first heat conductor 121 , the radiator 14 may not work.

[0091] Optionally, in order to improve the heat transfer efficiency between the integrated chip 1 to be tested and the first semiconductor cooling plate 11, the temperature adjustment device 10 further includes a second heat conducting member 15, such as Figure 4-Figure 7 As shown, the first end surface 151 of the second heat conducting member 15 is configured to be attached to one side of the integrated chip to be tested 1, and the second heat conducting member 15 is used to exchange heat with the integrated chip to be tested 1. Optionally, the heat exchange between the second heat conducting member 15 and the integrated chip to be tested 1 includes any one of absorbing the heat of the integrated chip to be tested 1, transferring heat to the integrated chip to be tested 1, and maintaining the heat of the integrated chip to be tested 1.

[0092] Furthermore, the second end surface 152 of the second heat conducting member 15 is attached to the second end surface 112 of the first semiconductor cooling plate 11 .

[0093] Optionally, the second thermal conductor 15 can be a metal with good thermal conductivity (such as copper, aluminum, platinum), metal oxide or alloy, or a thermally conductive material represented by graphene, phase change thermal insulating material, thermally conductive pad, thermally conductive filler or thermally conductive pad, etc., which is not limited here.

[0094] In some embodiments, the hardness of the second end surface 152 of the second heat conducting member 15 is less than or equal to the hardness of the surface of one side of the integrated chip 1 to be tested, so as to prevent the second heat conducting member 15 from scratching the surface of the integrated chip 1 to be tested.

[0095] By arranging a second heat-conducting member on one side of the integrated chip to be tested and on the second end surface of the first semiconductor cooling plate, the heat transfer efficiency between the integrated chip to be tested and the first semiconductor cooling plate is further improved.

[0096] Optionally, a heat-conducting material is coated between the second end surface 152 of the second heat-conducting member 15 and the first end surface 111 of the first semiconductor refrigeration plate 11 .

[0097] Optionally, a heat-conducting material is coated between the first end surface 151 of the second heat-conducting member 15 and one side of the integrated chip 1 to be tested.

[0098] Optionally, the thermally conductive material may be a metal with good thermal conductivity (such as copper, aluminum, platinum), metal oxide or alloy, or graphene, phase change thermally conductive insulating material, thermally conductive liner, thermally conductive filler or thermally conductive pad, etc., which is not limited here.

[0099] Optionally, the first semiconductor refrigeration sheet 11 is a single-stage Peltier element.

[0100] In some embodiments, when dissipating the heat absorbed from the integrated chip 1 under test, the first end surface 111 is a cold surface, and the second end surface 112 is a hot surface.

[0101] In some embodiments, when heat is conducted to the integrated chip 1 to be tested through the first semiconductor cooling sheet 11 , the first end surface 111 is a hot surface, and the second end surface 112 is a cold surface.

[0102] After a period of research, the inventor of the present application found that the current semiconductor refrigeration equipment uses a multi-stage Peltier cooling plate to further reduce the temperature of the cold surface in contact with the integrated chip to be tested. For example, a three-stage Peltier cooling plate can produce a low temperature of -107°C. However, the above conventional technical means have the disadvantage of low heat dissipation efficiency. Since the heat dissipation efficiency of the hot surface of each stage of the Peltier cooling plate is limited by the heat transfer power of the cascaded Peltier cooling plates on the hot surface, it is impossible to maintain a sufficiently large cooling capacity while lowering the temperature. Taking the three-stage Peltier cooling plate as an example, while producing a low temperature of -107°C, the cooling power is only 17W. Considering that the integrated chip test scenario involves the integrated chip running a stress test in a low temperature environment (such as a range of -50°C to 0°C), the above multi-stage Peltier cooling plate solution cannot continuously maintain the integrated chip to be tested at a low temperature in the scenario of stress testing of an integrated chip with a large thermal design power consumption (such as greater than 50W or greater than 100W).

[0103] It is worth noting that in the scheme of multi-stage Peltier cooling sheets, the first surface of the first-stage Peltier cooling sheet is attached to one side of the chip under test, the second-stage Peltier cooling sheet is attached to the second surface of the first-stage Peltier, and so on. Moreover, as the number of stages increases, the area of ​​the Peltier cooling sheet becomes smaller. If the multi-stage Peltier cooling sheet needs to transfer heat to the integrated chip under test, the heat absorbed by the second surface of the first-stage Peltier is greater than the heat generated by the first surface of the second-stage Peltier whose area is smaller than that of the first-stage Peltier. Furthermore, since the logarithm of the bismuth telluride particles on the cold and hot surfaces of the Peltier is different in the scheme of multi-stage Peltier cooling sheets, the function of heating by reversing the voltage applied to the Peltier cooling sheet cannot be achieved. Therefore, the scheme of multi-stage Peltier cooling sheets cannot achieve the functions of both cooling and heating without adding other heating devices.

[0104] By applying the single-stage Peltier element solution, on the one hand, it is possible to dissipate the heat absorbed from the IC under test, and on the other hand, the cooling power of the single-stage Peltier element can reach 200W, which can also achieve rapid cooling of the IC under test with a heat output of more than 20W.

[0105] Optionally, the temperature adjustment device 10 is further provided with a temperature adjustment unit 16. The temperature adjustment unit 16 is configured to perform voltage inversion on the first end surface 111 and the second end surface 112 of the first semiconductor cooling plate 11 to achieve conversion between the cold surface and the hot surface.

[0106] In some embodiments, the temperature adjustment unit 16 is further configured to perform voltage inversion on two end surfaces of the second semiconductor cooling plate 131 to achieve conversion between the cold surface and the hot surface.

[0107] In some application scenarios, the temperature adjustment unit 16 may also be a part of an MCU microcontroller (not shown).

[0108] The above scheme, on the one hand, utilizes the semiconductor refrigeration chip attached to one side of the integrated chip to be tested to independently realize cooling or heating of the integrated chip to be tested. Furthermore, by utilizing the heat exchange component attached to the first semiconductor refrigeration chip, the speed at which the first semiconductor refrigeration chip absorbs the heat of the integrated chip to be tested or conducts heat to the integrated chip to be tested is accelerated, so that the integrated chip to be tested is quickly cooled down or heated up, thereby improving the test efficiency of the integrated chip to be tested.

[0109] On the other hand, by providing a second semiconductor refrigeration plate in contact with the liquid cooling circuit in the heat exchange component, the heat of the coolant in the liquid cooling circuit is absorbed or the heat is transferred to the coolant, thereby further reducing or increasing the temperature of the second end face of the first semiconductor refrigeration plate, so that its first end face can reach a lower or higher temperature, thereby allowing the integrated chip to be tested to heat up or cool down faster, and its surface temperature can easily reach below -40°C or above 100°C.

[0110] See also Figure 8 , Figure 8 It is a structural schematic diagram of an embodiment of an integrated chip testing device provided by the present application.

[0111] like Figure 8 As shown, the integrated chip testing device 20 includes: a test socket 21 , a temperature adjustment device 22 , a first space 23 and a second space 24 .

[0112] The test socket 21 is used to place the integrated chip 2 to be tested. In some embodiments, the test socket 21 is called a chip test base.

[0113] Furthermore, the integrated chip testing device further comprises a testing board (not shown), which is coupled to the testing socket 21 to implement testing of the integrated chip 2 to be tested.

[0114] In some embodiments, the test socket 21 is a part of the test board. Furthermore, the test socket 21 is used to test the integrated chip 2 to be tested. In some embodiments, the test socket 21 may not be directly mounted on the test board. The test board may be coupled to the test socket 21 by means of leads / wires. The separate arrangement of the test socket 21 and the test board makes it unnecessary for the test board to be tested at high or low temperatures at the same time as the integrated chip 2 to be tested.

[0115] The integrated chip 2 to be tested corresponds to the integrated chip 1 to be tested mentioned above, and will not be described in detail here.

[0116] The temperature adjustment device 22 is used to adjust the temperature when the integrated chip 2 to be tested is tested.

[0117] The temperature regulating device 22 further includes a first semiconductor cooling plate 221 , a heat exchange component 222 , a first heat conducting member 2221 , a liquid cooling component 223 , a second semiconductor cooling plate 2231 , a radiator 224 , and a second heat conducting member 225 .

[0118] Among them, the first semiconductor refrigeration plate 221, the heat exchange component 222, the first heat conductor 2221, the liquid cooling component 223, the second semiconductor refrigeration plate 2231, the radiator 224, and the second heat conductor 225 respectively correspond to the first semiconductor refrigeration plate 11, the heat exchange component 12, the first heat conductor 121, the liquid cooling component 13, the second semiconductor refrigeration plate 131, the radiator 14, and the second heat conductor 15 mentioned above, and they are not repeated here.

[0119] Further, the second space 24 is contained in the first space 23. In some embodiments, the second space 24 is used to contain the integrated chip 2 to be tested, the test socket 21, the first semiconductor cooling sheet 221, and the second heat conducting member 225, so that the integrated chip 2 to be tested meets the test requirements at the target temperature.

[0120] In some embodiments, the test board is disposed in the second space 24 so that the distance between the test board and the test socket 21 is shortened to meet the high-speed transmission requirement between the integrated chip 2 to be tested and the test board.

[0121] In some embodiments, the test board is disposed in the first space 23 .

[0122] In some embodiments, the first space 23 may be a test cabinet. In some embodiments, the first space 23 may be a test room.

[0123] In some embodiments, the second space 24 is a test box.

[0124] It can be understood that the volume of the first space 23 is greater than the volume of the second space 24 .

[0125] In some application scenarios, the target temperature may be any one or more of the temperature ranges of -60°C to -20°C, -20°C to 30°C, 30°C to 105°C, and 105°C to 160°C, which are not limited herein. Exemplarily, the target temperature is -50°C, -40°C, -20°C, 0°C, 10°C, 20°C, 25°C, 30°C, 60°C, 80°C, 90°C, 100°C, 105°C, 110°C, 120°C, or 150°C.

[0126] In this embodiment, the first space 23 is used to accommodate the liquid cooling component 223 .

[0127] In some application scenarios, considering that the heat exchange component 222 may occupy a larger space, some components of the heat exchange component 222 may be partially accommodated in the second space 24, and other components of the heat exchange component 222 may be accommodated in the first space 23. For example, the first heat conductor 2221 is accommodated in the second space 24, and other components of the heat exchange component 222, including the second semiconductor refrigeration plate 2231 and the radiator 224, are accommodated in the first space 23.

[0128] In some application scenarios, when the volume of the first space 23 is too small to completely accommodate the heat exchange component 222 , the second semiconductor cooling plate 2231 and the radiator 224 in the heat exchange component 222 may be disposed outside the first space 23 .

[0129] In some application scenarios, when the heat exchange component 222 is installed in the first space 23 and there may be a problem of insufficient heat dissipation capacity, the second semiconductor refrigeration plate 2231 and the radiator 224 in the heat exchange component 222 can be arranged outside the first space 23 to further enhance the heat dissipation capacity of the heat exchange component 222.

[0130] In some application scenarios, a dehumidifier (not shown) and a humidifier (not shown) are provided in the second space 24. The humidifier is provided to adjust the humidity when the integrated chip 2 to be tested is subjected to a high temperature and high humidity test; the dehumidifier is provided to adjust the humidity when the integrated chip 2 to be tested is subjected to other tests.

[0131] The above scheme, on the one hand, utilizes the semiconductor refrigeration chip attached to one side of the integrated chip to be tested to independently realize cooling or heating of the integrated chip to be tested. Furthermore, by utilizing the heat exchange component attached to the first semiconductor refrigeration chip, the speed at which the first semiconductor refrigeration chip absorbs the heat of the integrated chip to be tested or conducts heat to the integrated chip to be tested is accelerated, so that the integrated chip to be tested is quickly cooled down or heated up, thereby improving the test efficiency of the integrated chip to be tested.

[0132] On the other hand, by providing a second semiconductor refrigeration plate in contact with the liquid cooling circuit in the heat exchange component, the heat of the coolant in the liquid cooling circuit is absorbed or the heat is transferred to the coolant, thereby further reducing or increasing the temperature of the second end face of the first semiconductor refrigeration plate, so that its first end face can reach a lower or higher temperature, thereby allowing the integrated chip to be tested to heat up or cool down faster, and its surface temperature can easily reach below -40°C or above 100°C.

[0133] See also Fig. 9 , Fig. 9 It is a structural schematic diagram of another embodiment of the integrated chip testing device provided by the present application.

[0134] like Fig. 9 As shown, the integrated chip testing device 30 in this embodiment may specifically include:

[0135] A test seat 31 , a temperature adjustment device 32 , a first space 33 , a second space 34 , a first dehumidification device 35 and a second dehumidification device 36 .

[0136] The test socket 31 and the temperature regulating device 32 respectively correspond to the test socket 21 and the temperature regulating device 22 mentioned above, and will not be described in detail here.

[0137] The first space 33 is used to accommodate the second space 34 .

[0138] In some embodiments, the second space 34 is used to accommodate the test socket 31 and the integrated chip 3 to be tested. Further, the second space 34 partially accommodates the temperature adjustment device 32 . More specifically, the first space 33 is used to accommodate the structure of the temperature adjustment device 32 that cannot be accommodated in the second space 34 .

[0139] The first dehumidification device 35 is disposed in the first space 33. The first dehumidification device 35 is used to reduce the humidity in the first space 33 according to the first dehumidification degree, or to reduce the humidity in the first space 33 and the second space 34 according to the first dehumidification degree.

[0140] Optionally, the first dehumidification device 35 can be any one of an air conditioner and a dehumidifier, or a combination of multiple types, which is not limited here.

[0141] In some embodiments, the second dehumidification device 36 is disposed in the first space 33. The second dehumidification device 36 interacts with the second space 34. More specifically, the second dehumidification device 36 interacts with the second space 34 through the first air inlet channel 361 and the first air outlet channel 362. The second dehumidification device 36 is used to reduce the humidity in the second space 34 to a target humidity according to the second dehumidification degree. The humidity of the first air in the first air inlet channel 361 is greater than the humidity of the second air in the first air outlet channel 362.

[0142] The first dehumidification degree is lower than the second dehumidification degree.

[0143] In some embodiments, the first dehumidification degree is characterized by the ability of the first dehumidification device 35 to adjust the humidity of the first space 33 and / or the second space 34, for example, reducing the humidity of the first space 33 and / or the second space 34 to 45%, 40%, 39%, 38%, 37%, 36%, 35%, 34%, 33%, 32%, 31%, 30%, 25% or 20%, etc., which is not limited here.

[0144] In some embodiments, the second dehumidification degree is characterized by the ability of the second dehumidification equipment 36 to adjust the humidity of the second space 34, such as reducing the humidity of the second space 34 to 20%, 15%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% or 0.1%, etc., which is not limited here.

[0145] In some application scenarios, the target humidity is less than 20%. In some application scenarios, the target humidity is less than 10%. In some application scenarios, the target humidity is less than 5%. In some application scenarios, the target humidity is less than 3%.

[0146] Optionally, the second dehumidification device 36 has a solid hygroscopic material therein, and the solid hygroscopic material is used to absorb water molecules in the air. Optionally, the solid hygroscopic material includes any one or more of activated carbon, activated alumina, silica gel, carbon molecular sieve and zeolite molecular sieve.

[0147] The inventor of the present application has found through a period of research that if the surface temperature of a low-temperature object (such as the integrated chip to be tested 3 in the present embodiment) is lower than the dew point temperature in the air and the water molecule saturation in the air reaches 100%, condensation and / or frost will occur on the surface of the low-temperature object. The degree of frost and / or condensation on the surface of the integrated chip to be tested depends on the surface temperature of the integrated chip to be tested, the relative humidity of the environment, or the content of water molecules in the air.

[0148] It is understandable that in some application scenarios, the integrated chip 3 to be tested needs to be installed on the test socket 31 to undergo a low-temperature operation test. If the humidity in the air is high, as the temperature decreases, frost and / or condensation may appear on the surface of the integrated chip 3 to be tested or the test socket 31. Frost and / or condensation on the surface of the integrated chip 3 to be tested or the test socket 31 can easily damage the integrated chip 3 to be tested or the test socket 31 due to a short circuit.

[0149] Methods for those skilled in the art to prevent the integrated chip to be tested from frosting at low temperatures mainly include using a heating element to heat the surface of the integrated chip to be tested, coating the surface of the integrated chip to be tested with an anti-frost coating, using a dehumidifier or air conditioner to control the ambient humidity, or vibrating the integrated chip to be tested to prevent water vapor from adhering.

[0150] The inventors of the present application have discovered that the above-mentioned conventional technical means all have certain shortcomings: the method of using a heating element to heat the surface of the integrated chip to be tested makes it difficult to keep the integrated chip to be tested at a preset temperature, thereby failing to meet the testing requirements of the integrated chip to be tested; the method of coating the surface of the integrated chip to be tested may cause damage to the integrated chip to be tested. If the number of integrated chips to be tested is large, it is also difficult to coat the surface of the integrated chips to be tested in large quantities; the use of a dehumidifier commonly found in the field can only control the ambient humidity to above 10%. If the target temperature is lower than -40 degrees Celsius, frost will still form on the surface of the integrated chip to be tested; mechanically vibrating the integrated chip to be tested is not suitable for integrated chips to be tested that are not vibration-resistant.

[0151] In view of the deficiencies of the above-mentioned means, the inventors of the present application use a first dehumidification device and a second dehumidification device to adjust the humidity in the first space and the second space respectively, and control the humidity in the second space within a very small range (for example, the humidity is controlled below 5%) without the assistance of other auxiliary dehumidification methods, so that frost and / or condensation does not occur on the surface of the target object at the target temperature.

[0152] Furthermore, the first air in the second space 34 is sucked into the second dehumidification device 36 through the first air inlet channel 361, and the second air is obtained after being dehumidified by the second dehumidification device 36. The second air is injected into the second space 34 through the first exhaust channel 362, thereby achieving dehumidification in the second space 34.

[0153] Since the dehumidification capacity of the solid dehumidifier in the second dehumidification device 36 is limited, the water molecules adsorbed exceeding a certain threshold value can no longer dehumidify the first air. That is, the second dehumidification device 36 cannot meet the dehumidification conditions at this time. Therefore, the solid dehumidifier in the second dehumidification device 36 needs to be regenerated.

[0154] In some application scenarios, the second dehumidifier 36 can also selectively interact with the first space 33. More specifically, the second dehumidifier 36 can also selectively interact with the first space 33. In some embodiments, the air in the first space 33 can be heated and then passed into the second dehumidifier 36 through the second air inlet channel 363, so that the water molecules in the second dehumidifier 36 evaporate and then re-enter the first space 33 through the second exhaust channel 364. After the solid dehumidifier in the second dehumidifier 36 completes the regeneration operation, it can re-dehumidify the air in the second space 34.

[0155] It is worth noting that when the second dehumidification device 36 exchanges air with the first space 33, the second dehumidification device 36 does not exchange air with the second space.

[0156] After a period of research, the inventor of the present application found that if only the second dehumidification device is used to dehumidify the first space and the second space, due to the limited dehumidification capacity of the second dehumidification device per unit time, it takes a lot of time and energy to reduce the humidity in the second space to the target humidity. Considering the needs of saving energy and improving efficiency, the first dehumidification device is used to perform the first-level humidity adjustment on the first space and / or the second space, so that the humidity in the first space and / or the second space is lower than a certain range (for example, any one of 10%-15%, 15%-20%, 20%-25%, 20%-30%, 25-30%), and then the second dehumidification device is used to perform the second-level humidity adjustment on the second space, and further adjusts the humidity to the target humidity (any one of below 10%, below 5%, below 3%, and below 1%) on the basis of the above range, so that the integrated chip to be tested does not frost and / or condense in an environment below 0°C.

[0157] Optionally, a humidifying device (not shown) is further provided in the second space 34 to increase the humidity of the second space 34 according to chip testing requirements.

[0158] The above scheme, on the one hand, utilizes the semiconductor refrigeration chip attached to one side of the integrated chip to be tested to independently realize cooling or heating of the integrated chip to be tested. Furthermore, by utilizing the heat exchange component attached to the first semiconductor refrigeration chip, the speed at which the first semiconductor refrigeration chip absorbs the heat of the integrated chip to be tested or conducts heat to the integrated chip to be tested is accelerated, so that the integrated chip to be tested is quickly cooled down or heated up, thereby improving the test efficiency of the integrated chip to be tested.

[0159] On the other hand, by setting a second semiconductor refrigeration plate in contact with the liquid cooling circuit in the heat exchange component, absorbing the heat of the coolant in the liquid cooling circuit or conducting heat to the coolant, the temperature of the second end face of the first semiconductor refrigeration plate is further reduced or increased, so that its first end face can reach a lower or higher temperature, so that the temperature of the integrated chip to be tested is increased or decreased faster, and its surface temperature can easily reach below -40°C or above 100°C. Furthermore, by setting a second dehumidification device interactively in the second space accommodating the integrated chip to be tested, the humidity of the second space is reduced to below 10% before the integrated chip to be tested is tested at a low temperature, thereby alleviating the condensation and frosting problem of the integrated chip to be tested at an ambient temperature below 0°C.

[0160] See also Fig.10 , Fig.10 It is a structural schematic diagram of another embodiment of the integrated chip testing device provided by the present application.

[0161] like Fig.10 As shown, the integrated chip testing device 40 provided in the present application may specifically include:

[0162] Semiconductor refrigeration sheet 41, metal heat exchanger 42, primary liquid cooling module 43, secondary liquid cooling module 44, metal heat conductive block 45, temperature sensor 46, chip test socket 47, chip test board 48, temperature control board 49, first space 401, second space 402.

[0163] Among them, the semiconductor cooling plate 41, the metal heat exchanger 42 and the metal heat conductive block 45 respectively correspond to the first semiconductor cooling plate 11, the second heat conductive member 15 and the first heat conductive member 121 mentioned above, and are not described in detail here.

[0164] In some embodiments, cooling liquid can be circulated between the primary liquid cooling module 43 and the secondary liquid cooling module 44 .

[0165] In this embodiment, the primary liquid cooling module 43 and the secondary liquid cooling module 44 correspond to the above-mentioned radiator 14 and the second semiconductor cooling sheet 131, respectively, which will not be described in detail here.

[0166] Specifically, the integrated chip 4 to be tested, the semiconductor cooling sheet 41 , the metal heat exchanger 42 , the metal heat conductive block 45 , the temperature sensor 46 , and the chip test socket 47 are accommodated in the second space 402 .

[0167] Optionally, the first space 401 may partially or completely accommodate the primary liquid cooling module 43 and / or the secondary liquid cooling module 44. In this embodiment, the first space 401 is used to partially accommodate the primary liquid cooling module 43 and the secondary liquid cooling module 44.

[0168] Furthermore, the first space 401 is also used to accommodate a chip testing board 48 and a temperature control board 49 .

[0169] Among them, the temperature control board 49 is respectively connected to the temperature sensor 46 and the semiconductor refrigeration sheet 41 by communication. Optionally, the communication connection includes a wired connection or a wireless connection. In this embodiment, the temperature control board 49 is respectively connected to the temperature sensor 46 and the semiconductor refrigeration sheet 41 by wire. The temperature control board 49 is used to obtain the current temperature measured by the temperature sensor 46, determine the difference between the current temperature and the target temperature of the integrated chip 4 to be tested in the test requirements, and determine whether to increase the cooling capacity or heating amount of the semiconductor refrigeration sheet 41.

[0170] The chip test board 48 is coupled to the chip test socket 47 . The chip test board 48 is used to perform a test on the integrated chip 4 to be tested coupled to the chip test socket 47 .

[0171] Optionally, the chip test board 48 and the temperature control board 49 are also coupled to a host computer (not shown) disposed outside the first space 401 through a control bus. In some embodiments, the host computer is used to send test instructions to the chip test board 48 and the temperature control board 49.

[0172] The above scheme, on the one hand, utilizes the semiconductor refrigeration chip attached to one side of the integrated chip to be tested to independently realize cooling or heating of the integrated chip to be tested. Furthermore, by utilizing the heat exchange component attached to the first semiconductor refrigeration chip, the speed at which the first semiconductor refrigeration chip absorbs the heat of the integrated chip to be tested or conducts heat to the integrated chip to be tested is accelerated, so that the integrated chip to be tested is quickly cooled down or heated up, thereby improving the test efficiency of the integrated chip to be tested.

[0173] See also Fig.11 , Fig.11 It is a structural schematic diagram of another embodiment of the integrated chip testing device provided by the present application.

[0174] like Fig.11 As shown, the integrated chip testing device 50 specifically includes: a semiconductor refrigeration plate 51, a temperature sensor 52, a multi-stage hybrid low-temperature liquid cooling module 53, a chip test socket 54, a second space 55, a first space 56, a chip testing board 57, an MCU microcontroller 58, a power supply 501 and a voltage conversion module 502.

[0175] In this embodiment, the chip testing board 57 is electrically connected to the chip testing socket 54 and the integrated chip 5 to be tested, respectively.

[0176] Among them, the semiconductor cooling plate 51 corresponds to the first semiconductor cooling plate 11 mentioned above, which will not be described in detail here.

[0177] In some embodiments, the first surface of the semiconductor cooling sheet 51 contacts a part of the surface of the integrated chip 5 to be tested, the first surface of the temperature sensor 52 contacts the first surface of the semiconductor cooling sheet 51, and the second surface of the temperature sensor 52 contacts a part of the surface of the integrated chip 5 to be tested. The temperature sensor is used to obtain the current temperature of the integrated chip 5 to be tested, and adjust the cooling power or heating power of the semiconductor cooling sheet 51 according to the difference between the current temperature and the set temperature. Optionally, the number of the temperature sensors 52 can be one or more, which is used to more accurately obtain the current temperature of the integrated chip 5 to be tested.

[0178] Among them, the multi-stage hybrid low-temperature liquid cooling module 53 and the chip test socket 54 correspond to the temperature adjustment device 10 and the test socket 21 mentioned above, respectively, and will not be described in detail here.

[0179] The power supply 501 is electrically connected to the voltage conversion module 502 , and the voltage conversion module 502 is further electrically connected to the semiconductor cooling sheet 51 . The voltage conversion module 502 is used to provide the converted voltage to the semiconductor cooling sheet 51 .

[0180] In some embodiments, the power supply 501 provides 380V or 240V AC power. In some embodiments, the power supply 501 provides 5V, 12V, 24V, 36V, 48V, 60V, 110V or 220V DC power.

[0181] Optionally, the input voltage of the semiconductor cooling chip 51 is a direct current lower than 100 V, and illustratively, the input voltage of the semiconductor cooling chip is 5 V, 12 V, 24 V, 36 V or 48 V. In some application scenarios, the voltage conversion module 502 can be used to convert the alternating current input by the power supply into direct current, and can be used to reduce the direct current higher than 100 V to a direct current suitable for the semiconductor cooling chip 51, and can be used to adjust the voltage value applied to the semiconductor cooling chip 51, thereby adjusting the cooling / heating power of the semiconductor cooling chip 51.

[0182] Optionally, the MCU microcontroller 58 is respectively connected to the temperature sensor 52, the multi-stage hybrid low-temperature liquid cooling module 53, the chip test board 57, and the voltage conversion module 502. Specifically, the MCU microcontroller 58 can perform functions including current temperature acquisition, adjusting the voltage value applied to the semiconductor refrigeration plate 51 to achieve temperature regulation of the semiconductor refrigeration plate 51, controlling the liquid cooling module, and obtaining the current operating status of the test board. In some application scenarios, the MCU microcontroller 58 can also be connected to the second dehumidification device (not shown) that interacts with the second space 55 to control the humidity in the second space 55, so as to avoid frost and / or condensation of the integrated chip 5 to be tested and / or the chip test seat 54 when the internal temperature of the second space 55 is lower than 0°C due to excessive humidity in the second space 55.

[0183] In some application scenarios, the MCU controller 59 can perform part or all of the functions of the temperature control board 49 described above.

[0184] The above scheme, on the one hand, utilizes the semiconductor refrigeration chip attached to one side of the integrated chip to be tested to independently realize cooling or heating of the integrated chip to be tested. Furthermore, by utilizing the heat exchange component attached to the first semiconductor refrigeration chip, the speed at which the first semiconductor refrigeration chip absorbs the heat of the integrated chip to be tested or conducts heat to the integrated chip to be tested is accelerated, so that the integrated chip to be tested is quickly cooled down or heated up, thereby improving the test efficiency of the integrated chip to be tested.

[0185] On the other hand, by setting a second semiconductor refrigeration plate in contact with the liquid cooling circuit in the heat exchange component, absorbing the heat of the coolant in the liquid cooling circuit or conducting heat to the coolant, the temperature of the second end face of the first semiconductor refrigeration plate is further reduced or increased, so that its first end face can reach a lower or higher temperature, so that the temperature of the integrated chip to be tested is increased or decreased faster, and its surface temperature can easily reach below -40°C or above 100°C. Furthermore, by setting a second dehumidification device interactively in the second space accommodating the integrated chip to be tested, the humidity of the second space is reduced to below 10% before the integrated chip to be tested is tested at a low temperature, thereby alleviating the condensation and frosting problem of the integrated chip to be tested at an ambient temperature below 0°C.

[0186] See also Fig.12 , Fig.12 It is a structural schematic diagram of another embodiment of the integrated chip testing device provided by the present application.

[0187] like Fig.12 As shown, the chip integrated testing device 80 specifically includes a first semiconductor cooling plate 81 , a metal heat exchanger 82 , a cooling liquid channel 83 , a liquid cooling module 84 , a metal heat conductive block 85 , and a chip testing seat 86 .

[0188] Among them, the chip to be tested 8, the first semiconductor cooling plate 81, the metal heat exchanger 82, the metal heat conductive block 85, and the chip test seat 86 respectively correspond to the chip to be tested 4, the first semiconductor 11, the first heat conductive member 15, and the chip test seat 47 mentioned above, and will not be repeated here.

[0189] Specifically, the cooling liquid channel 83 further includes a cooling liquid inlet channel 831 and a cooling liquid outlet channel 832. The cooling liquid inlet channel 831 is used to circulate the cooling liquid from the liquid cooling circuit (not shown) in the metal heat exchanger 82 to the liquid cooling module 85, and the cooling liquid outlet channel 832 is used to circulate the cooling liquid from the liquid cooling module 85 to the liquid cooling circuit of the metal heat exchanger 82.

[0190] In some embodiments, the cooling liquid inlet channel 831 and / or the cooling liquid outlet channel 832 are further provided with a liquid pump (not shown).

[0191] In some embodiments, the outer surface of the pipe of the coolant inlet channel 831 is also partially or completely provided with heat dissipation fins (not shown). In some application scenarios, when the metal heat exchanger 82 is used to absorb the heat of the first semiconductor refrigeration plate 81, that is, the coolant in the coolant inlet channel 831 absorbs the heat, in order to reduce the temperature of the coolant entering the liquid cooling module 85, the heat dissipation fins can be used to absorb part of the heat of the coolant. Furthermore, a heat dissipation fan (not shown) can be used to blow toward the heat dissipation fins to accelerate the cooling rate of the coolant in the coolant inlet channel 831.

[0192] Furthermore, the liquid cooling module 84 is used to absorb the heat of the coolant in the coolant inlet channel 831 , or to release heat to the coolant in the coolant inlet channel 831 .

[0193] Optionally, the liquid cooling module 84 may specifically include a heat exchanger 841 , a second semiconductor cooling plate 842 , a metal base 843 , a heat pipe 844 , heat dissipation fins 845 and a cooling fan 846 .

[0194] In some embodiments, a liquid cooling circuit (not shown) is further provided in the heat exchanger 841, and the second semiconductor cooling plate 842 is used to absorb heat from the coolant in the liquid cooling circuit, or to release heat to the coolant in the liquid cooling circuit.

[0195] Specifically, one end surface of the second semiconductor refrigeration plate 842 is bonded to the heat exchanger 841 , and the other end surface of the second semiconductor refrigeration plate 842 is bonded to the metal base 843 .

[0196] In some application scenarios, the metal base 843 is also provided with a heating wire (not shown). When the second semiconductor cooling plate 842 is used to release heat to the coolant in the liquid cooling circuit, the heating wire is used to provide heat to the second semiconductor cooling plate 842 .

[0197] Optionally, the heat pipe 844 is partially inserted into the metal base 843 to increase the contact area between the heat pipe 844 and the metal base 843, further increasing the heat dissipation capacity of the liquid cooling module 84. In some embodiments, the heat pipe 844 is attached to the outer surface of the metal base 843.

[0198] Optionally, the heat pipe 844 is provided with a heat dissipation fin 845. When the second semiconductor cooling sheet 842 is used to absorb the heat of the coolant in the liquid cooling circuit in the heat exchanger 841, the metal base 843, the heat pipe 844 and the heat dissipation fin 845 cooperate with each other so that the heat absorbed by the second semiconductor cooling sheet 842 is dissipated into the environment.

[0199] Furthermore, a cooling fan 846 is also attached to the heat dissipation fin 845. When the second semiconductor cooling sheet 842 is used to absorb the heat of the coolant in the liquid cooling circuit in the heat exchanger 841, the rate at which the heat absorbed by the second semiconductor cooling sheet 842 is dissipated to the environment is increased. In some application scenarios, when the second semiconductor cooling sheet 842 is used to release heat to the coolant in the liquid cooling circuit in the heat exchanger 841, the cooling fan 846 may not be operated.

[0200] It can be understood that the number of metal base 843, heat pipe 844, heat sink fins 845 and cooling fan 846 can be multiple. When the second semiconductor refrigeration plate 842 is used to absorb the heat of the coolant in the liquid cooling circuit in the heat exchanger 841, the rate at which the heat absorbed by the second semiconductor refrigeration plate is dissipated to the environment is further improved.

[0201] The above scheme, on the one hand, utilizes the semiconductor refrigeration chip attached to one side of the integrated chip to be tested to independently realize cooling or heating of the integrated chip to be tested. Furthermore, by utilizing the heat exchange component attached to the first semiconductor refrigeration chip, the speed at which the first semiconductor refrigeration chip absorbs the heat of the integrated chip to be tested or conducts heat to the integrated chip to be tested is accelerated, so that the integrated chip to be tested is quickly cooled down or heated up, thereby improving the test efficiency of the integrated chip to be tested.

[0202] On the other hand, by providing a second semiconductor refrigeration plate in contact with the liquid cooling circuit in the heat exchange component, the heat of the coolant in the liquid cooling circuit is absorbed or the heat is transferred to the coolant, thereby further reducing or increasing the temperature of the second end face of the first semiconductor refrigeration plate, so that its first end face can reach a lower or higher temperature, thereby allowing the integrated chip to be tested to heat up or cool down faster, and its surface temperature can easily reach below -40°C or above 100°C.

[0203] See also Fig.13 , Fig.13 It is a flow chart of an embodiment of an integrated chip testing method provided in the present application.

[0204] The integrated chip test method provided in the present application is specifically performed by an integrated chip test module. In some application scenarios, the integrated chip test module can be the integrated chip test device itself above. In some application scenarios, the integrated chip test module can be an embedded device connected to the integrated chip test device wired communication or wireless communication above, or it can be a user equipment (User Equipment, UE), a mobile device, a user terminal, a terminal, a cellular phone, a cordless phone, a personal digital processing (Personal Digital Assistant, PDA), a handheld device, a computing device, a vehicle-mounted device, a wearable device or a product such as glasses, helmets, etc. for augmented reality or virtual reality, etc., which are not limited here.

[0205] In some application scenarios, the integrated chip test module may be the MCU microcontroller 58 in the integrated chip test device mentioned above.

[0206] like Fig.12 As shown, an embodiment of the integrated chip testing method provided by the present application may specifically include the following steps:

[0207] S101, issue a temperature control instruction.

[0208] Specifically, the user sends a temperature setting instruction to the temperature control module through the integrated chip test module.

[0209] Among them, the temperature control module can correspond to the temperature adjustment device 10 mentioned above, which will not be described in detail here.

[0210] Optionally, the temperature setting instruction includes a preset temperature value.

[0211] S102, adjusting the ambient humidity to a preset humidity.

[0212] Before adjusting the temperature of the integrated chip to be tested, the integrated chip test module firstly adjusts the ambient humidity in the second space by using the humidity control module.

[0213] It will be appreciated that the adjustment of the ambient humidity may include lowering the humidity or increasing the humidity.

[0214] In some embodiments, when the integrated chip to be tested needs to be tested at a temperature below 0°C, if the humidity of the environment is not controlled below 20%, the surface temperature of the cold surface of the first semiconductor refrigeration plate and / or the integrated chip to be tested may be lower than the temperature in the second space, and frost and / or condensation may occur on the surface of the integrated chip to be tested, which may cause the integrated chip to be tested to be damaged due to a short circuit. In order to avoid the occurrence of the above phenomenon, by using a first dehumidification device disposed in the first space and a second dehumidification device in the second space, the humidity in the second space is further reduced to below 10%, thereby avoiding frost or condensation on the surface of the integrated chip to be tested when the surface temperature is below 0°C.

[0215] In some embodiments, when the integrated chip to be tested needs to be subjected to a high temperature and high humidity test, a humidifying device in the second space can be used to increase the ambient humidity.

[0216] S103, humidity control is successful.

[0217] In some embodiments, a humidity sensor is further provided in the second space. When the humidity sensor obtains that the current humidity is equal to the preset humidity and maintains it for a certain period of time, the humidity control module feeds back a humidity control success signal to the integrated chip test module.

[0218] S104, collecting the current temperature value.

[0219] Specifically, since the cooling and heating power of the first semiconductor refrigeration plate in the temperature regulation device provided in the present application exceeds 100W, that is, the temperature regulation rate of the first semiconductor refrigeration plate is very high, in order to improve the accuracy of temperature regulation, the integrated chip test module first uses the temperature sensors that are in contact with the first semiconductor refrigeration plate and the integrated chip to be tested respectively to collect the current temperature value of the integrated chip to be tested before performing temperature regulation.

[0220] S105, return the current temperature value.

[0221] Specifically, the temperature sensor returns the collected current temperature value to the integrated chip test module.

[0222] In some embodiments, the number of temperature sensors is greater than one, and the integrated chip test module may perform numerical processing such as averaging and median processing on the temperature values ​​currently collected by the multiple temperature sensors to obtain the current temperature value.

[0223] S106, cooling or heating according to the current temperature value.

[0224] Specifically, the integrated chip test module uses the temperature generation module to perform cooling or heating according to the difference between the current temperature value and the preset temperature value.

[0225] Among them, the temperature generation module corresponds to the MCU microcontroller mentioned above, which will not be repeated here.

[0226] S107, temperature maintenance.

[0227] Optionally, in the process of executing S106-S107, in order to improve the efficiency and accuracy of temperature regulation, the integrated chip test module can apply a combination of one or more algorithms including proportional-integral-differential (PID) control, fuzzy control, neural network control, adaptive control, sliding film control, linear quadratic regulator control (LQR) or reinforcement learning-based control algorithms, which are not limited here.

[0228] S108, completing temperature control.

[0229] When the temperature value collected by the temperature sensor on the surface of the chip to be tested is maintained at a preset temperature value for a period of time (for example, 5 minutes, 10 minutes, or 15 minutes), the temperature control is completed.

[0230] S109, start chip testing.

[0231] Specifically, the integrated chip test module sends chip test instructions to the chip test board.

[0232] The chip test board corresponds to the chip test board 48 mentioned above, which will not be described in detail here.

[0233] S110, performing chip testing.

[0234] Specifically, the chip testing board tests the integrated chip to be tested.

[0235] S111, obtain chip information.

[0236] Specifically, the chip testing board obtains the operation information of the chip to be tested during the process of testing the integrated chip to be tested.

[0237] S112, return chip information.

[0238] S113, chip testing is completed.

[0239] The above scheme, on the one hand, utilizes the semiconductor refrigeration chip attached to one side of the integrated chip to be tested to independently realize cooling or heating of the integrated chip to be tested. Furthermore, by utilizing the heat exchange component attached to the first semiconductor refrigeration chip, the speed at which the first semiconductor refrigeration chip absorbs the heat of the integrated chip to be tested or conducts heat to the integrated chip to be tested is accelerated, so that the integrated chip to be tested is quickly cooled down or heated up, thereby improving the test efficiency of the integrated chip to be tested.

[0240] On the other hand, by setting a second semiconductor refrigeration plate in contact with the liquid cooling circuit in the heat exchange component, absorbing the heat of the coolant in the liquid cooling circuit or conducting heat to the coolant, the temperature of the second end face of the first semiconductor refrigeration plate is further reduced or increased, so that its first end face can reach a lower or higher temperature, so that the temperature of the integrated chip to be tested is increased or decreased faster, and its surface temperature can easily reach below -40°C or above 100°C. Furthermore, by setting a second dehumidification device interactively in the second space accommodating the integrated chip to be tested, the humidity of the second space is reduced to below 10% before the integrated chip to be tested is tested at a low temperature, thereby alleviating the condensation and frosting problem of the integrated chip to be tested at an ambient temperature below 0°C.

[0241] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Equivalent structures or equivalent process changes made by utilizing the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A temperature regulating device, characterized in that: The temperature regulating device is applied to the integrated chip testing scenario, and the temperature regulating device comprises: A first semiconductor refrigeration sheet, wherein a first end surface of the first semiconductor refrigeration sheet is configured to be attached to a side of the integrated chip to be tested, and is used to absorb heat from the integrated chip to be tested or transfer heat to the integrated chip to be tested; The heat exchange component is attached to the second end surface of the first semiconductor refrigeration plate and is used for exchanging heat with the first semiconductor refrigeration plate.

2. The temperature adjustment device according to claim 1, characterized in that: The heat exchange component comprises: A first heat-conducting member, wherein the first heat-conducting member is attached to the second end surface of the first semiconductor cooling sheet; A liquid cooling component, wherein part of the liquid cooling circuit of the liquid cooling component is arranged on the first heat conducting member, and is used to circulate the coolant in the liquid cooling circuit to exchange heat with the first heat conducting member according to the test requirements of the integrated chip.

3. The temperature adjustment device according to claim 2, characterized in that: The liquid cooling component includes a second semiconductor refrigeration plate, which is in contact with another part of the liquid cooling circuit of the liquid cooling component. The second semiconductor refrigeration plate is used for exchanging heat with the liquid cooling circuit.

4. The temperature adjustment device according to claim 2, characterized in that: The liquid cooling assembly further includes a radiator, which is used to further dissipate the heat absorbed by the cooling liquid when the cooling liquid absorbs the heat in the first heat conductor.

5. The temperature adjustment device according to claim 1, characterized in that: The temperature regulating device also includes: A second heat-conducting member, wherein the first end surface of the second heat-conducting member is configured to be attached to one side of the integrated chip to be tested, for exchanging heat with the integrated chip to be tested, and the second end surface of the second heat-conducting member is attached to the first end surface of the first semiconductor cooling plate.

6. The temperature adjustment device according to claim 5, characterized in that: A heat-conducting material is coated between the second end surface of the second heat-conducting member and the first end surface of the first semiconductor cooling plate, and / or a heat-conducting material is coated between the first end surface of the second heat-conducting member and one side of the integrated chip to be tested.

7. The temperature adjustment device according to claim 1, characterized in that: The first semiconductor refrigeration sheet is a single-stage Peltier element; When dissipating the heat absorbed from the integrated chip to be tested, the first end surface of the first semiconductor cooling sheet is a cold surface, and the second end surface of the first semiconductor cooling sheet is a hot surface; When heat is conducted to the integrated chip to be tested through the first semiconductor cooling sheet, the first end surface of the first semiconductor cooling sheet is a hot surface, and the second end surface of the first semiconductor cooling sheet is a cold surface.

8. The temperature adjustment device according to claim 1, characterized in that: The temperature regulating device also includes: The temperature control unit is configured to perform voltage inversion on the first end surface and the second end surface of the first semiconductor refrigeration plate to achieve switching between the cold surface and the hot surface.

9. A testing device for an integrated chip, characterized in that: The testing device comprises: A test socket, used for placing the integrated chip to be tested; A test board, coupled to the test socket, to test the integrated chip to be tested; A temperature regulating device, used for regulating the temperature when testing an integrated chip to be tested, wherein the temperature regulating device is the temperature regulating device as described in any one of claims 1-8.

10. The testing device according to claim 9, characterized in that: The testing device also includes: First Space; The second space is contained in the first space, and the second space is used to contain the integrated chip to be tested, the test socket and the first semiconductor cooling plate, so that the integrated chip to be tested meets the test requirements at a target temperature.

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