CPU water-cooling head structure capable of effectively reducing water resistance
By designing auxiliary structures and filters in the CPU water cooling head and optimizing the water flow path and filtration function, the problems of large water flow resistance and impurity accumulation of existing CPU water cooling heads are solved, achieving more efficient heat dissipation and convenient maintenance.
Patent Information
- Application Number
- CN202310943282.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-07-30
- Publication Date
- 2025-02-14
AI Technical Summary
The water flow inlet and outlet of the existing CPU water cooling head is the same end face, and the gap of the deflector is small, which leads to an increase in the water flow resistance, affects the heat dissipation effect, and is prone to accumulation of impurities and microorganisms, making it difficult to use and replace.
A CPU water cooling head structure is designed, adopting an auxiliary structure at the upper cover and the lower end of the upper cover, including a water inlet convergence diversion channel and a water inlet taper diversion channel. Combined with filter plate and seal ring, optimize the water flow path and filtration function, reduce water resistance and Improve heat dissipation efficiency.
It effectively reduces the resistance to water flow entering, improves the heat dissipation effect, and effectively filters impurities and microorganisms in the water flow through filters, simplifying the cleaning and replacement process and reducing replacement costs.
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Figure CN119440192A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field related to CPU water cooling heads, and in particular to a CPU water cooling head structure which can effectively reduce water resistance. Background Art
[0002] Computer components often generate a lot of heat when working, which will not only cause the computer to work unstably and shorten its service life, but may even damage some components. Therefore, a radiator is usually installed in the computer to absorb this heat. Among them, the CPU, as the core component of the computer, is usually equipped with an independent radiator. There are many types of radiators. At present, CPU radiators mainly adopt air cooling, water cooling and other forms. In addition, a cooling fan is installed in the water-cooled radiator to assist in heat dissipation, which can improve the heat dissipation effect. For the existing water-cooled CPU radiator, the most important thing is the CPU water cooling head that is in direct contact with the CPU.
[0003] A Chinese patent discloses a new type of CPU water cooling head (publication number: CN206757519U), comprising an upper cover, an upper surface of the upper cover is provided with a water inlet and a water outlet, a lower surface of the upper cover is provided with a water inlet and a water outlet, an inner thread groove is provided on the lower surface of the upper cover, a mounting groove is provided on the lower surface of the upper cover, a guide plate is slidably connected inside the mounting groove, the lower surface of the upper cover is slidably connected to the inside of the bracket through an opening, a mounting hole is provided on the upper surface of the bracket, a bottom plate is slidably connected to the lower surface of the bracket, a sealing ring groove is provided on the upper surface of the bottom plate, a sealing ring groove is slidably connected inside the sealing ring groove, a heat dissipation groove is provided on the upper surface of the bottom plate, the CPU water cooling head adopts a two-layer design, uses the upper cover to introduce and outflow water, a water flow channel is arranged inside to facilitate water flow therein, and the bottom plate is used to contact with the CPU and is provided with a heat dissipation groove to facilitate water flow into the heat dissipation groove and take away the heat of the CPU.
[0004] There are several problems with the CPU water cooling head during use:
[0005] The water inlet and outlet of the existing water cooling head are on the same end face, and a guide plate is usually arranged on the heat conducting plate. However, the gap opened by the guide plate is small, so when the water flows through the gap, not only the water flow rate is reduced, but also the water resistance of the water flow is increased. The water flow cannot fully utilize the area of the heat conducting plate, which in turn affects the heat dissipation effect. Moreover, after long-term use, because the water inlet is usually flat and the gaps between the microchannel heat conducting plates are very dense, some impurities and microorganisms in the water flow are easily accumulated on the heat conducting plate, which is cumbersome for users to clean and the cost of replacement is high. Summary of the invention
[0006] Therefore, in order to solve the above-mentioned shortcomings, the present invention provides a CPU water cooling head structure that effectively reduces water resistance.
[0007] The present invention is implemented in this way: a CPU water cooling head structure that effectively reduces water resistance is constructed, the device includes an upper cover, a water inlet, a water outlet, a first sealing ring, an auxiliary structure, a filter, a second sealing ring, a heat conducting plate and a microchannel heat conducting plate, the water inlet and the water outlet are respectively opened at the front and rear ends of the inner side of the upper cover, the outer side of the first sealing ring is embedded in the top of the auxiliary structure, and the top of the auxiliary structure is connected to the upper cover, the top of the auxiliary structure is movably embedded with a filter, the bottom of the auxiliary structure is embedded with a second sealing ring, the bottom of the auxiliary structure is connected to the heat conducting plate, and the middle part of the top of the heat conducting plate is provided with a microchannel heat conducting plate; the auxiliary structure is characterized in that: It also includes a middle cover, a sealing ring groove, a water inlet converging guide groove, a water inlet taper guide groove, a water outlet groove, a water outlet converging guide groove and a slot hole. A sealing ring groove is provided on the inner side of the top of the middle cover. A submerged water inlet converging guide groove and a water outlet converging guide groove are provided at the front and rear ends of the inner side of the top of the middle cover respectively. A water inlet taper guide groove is provided at the interval between the middle sections of the water inlet converging guide groove and the water outlet converging guide groove. A water outlet groove is provided on the inner side of the water inlet taper guide groove. A slot hole is provided on the top of the middle cover. The inner side of the sealing ring groove is movably engaged with a first sealing ring. The inner side of the bottom of the middle cover is movably engaged with a second sealing ring. The upper and lower ends of the middle cover are respectively connected to the upper cover and the heat conduction plate.
[0008] Preferably, the water inlet cone guide grooves are equidistantly distributed in the middle of the inner top of the middle cover, and two adjacent water inlet cone guide grooves are a structure that is wide at the top and narrow at the bottom, and the left and right end surfaces of each water inlet cone guide groove are slope structures.
[0009] Preferably, the water inlet tapered guide groove is triangular in shape as a whole, a rectangular water outlet groove is provided in the middle of the inner side of the water inlet tapered guide groove, and the tail end of the water outlet groove extends to the water outlet converging guide groove.
[0010] Preferably, sealing ring grooves are provided at both upper and lower ends of the middle cover, but the shapes of the sealing ring grooves provided at the upper and lower ends are respectively the same as those of the first sealing ring and the second sealing ring.
[0011] Preferably, the shape of the filter plate is movably fitted with the water inlet converging guide groove and the water inlet tapered guide groove.
[0012] Preferably, four slots are equidistantly provided at the front and rear ends of the bottom of the middle cover, and the slots provided at the bottom of the middle cover are aligned with the slots provided on the heat conducting plate.
[0013] Preferably, the water inlet converging guide groove and the water outlet converging guide groove are both submerged structures, and after the filter plate is installed at the top of the water inlet converging guide groove, the plane height of the top of the filter plate is smaller than the plane height of the top of the middle cover.
[0014] The present invention has the following advantages: The present invention provides a CPU water cooling head structure that effectively reduces water resistance through improvement. Compared with the same type of equipment, the present invention has the following improvements:
[0015] Advantages: The CPU water cooling head structure for effectively reducing water resistance described in the present invention has an auxiliary structure at the lower end of the upper cover, and the water inlet convergence guide groove and the water inlet taper guide groove are arranged on the inner side of the auxiliary structure. It can better and fully utilize the heat dissipation area of the microchannel heat conductive plate, which not only improves the heat dissipation effect, but also effectively reduces the resistance of water flow entering. The filter plate arranged on the top of the middle cover can effectively filter impurities and microorganisms in the water flow, and is convenient for users to clean and replace, while also reducing the replacement work cost. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of the blasting structure of the present invention;
[0017] Figure 2 It is a schematic diagram of the auxiliary structure of the present invention;
[0018] Figure 3 It is a partial cross-sectional schematic diagram of the auxiliary structure of the present invention.
[0019] The markings in the figure are: upper cover -1, water inlet -2, water outlet -3, first sealing ring -4, auxiliary structure -5, filter plate -6, second sealing ring -7, heat conduction plate -8, microchannel heat conduction plate -9, middle cover -51, sealing ring groove -52, water inlet convergence guide groove -53, water inlet taper guide groove -54, water outlet groove -55, water outlet convergence guide groove -56, slot hole -57. DETAILED DESCRIPTION
[0020] The following will be combined with the attached Figure 1-3 The present invention is described in detail, and the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0021] See also Figure 1The present invention provides a CPU water cooling head structure which can effectively reduce water resistance through improvement, including an upper cover 1, a water inlet 2, a water outlet 3, a first sealing ring 4, an auxiliary structure 5, a filter 6, a second sealing ring 7, a heat conducting plate 8 and a microchannel heat conducting plate 9. The upper cover 1 is provided with a water inlet 2 and a water outlet 3 at the front and rear ends of the inner side thereof, respectively. The outer side of the first sealing ring 4 is embedded in the top of the auxiliary structure 5, and the top of the auxiliary structure 5 is connected to the upper cover 1. A filter 6 is movably fitted on the top of the auxiliary structure 5. The shape of the filter 6 is movably fitted with the water inlet converging guide groove 53 and the water inlet taper guide groove 54. A second sealing ring 7 is embedded in the bottom of the auxiliary structure 5, and the bottom of the auxiliary structure 5 is connected to the heat conducting plate 8. A microchannel heat conducting plate 9 is provided at the middle of the top of the heat conducting plate 8. The arrangement of the first sealing ring 4 and the second sealing ring 7 can effectively enhance the sealing performance.
[0022] See also Figure 2 and Figure 3 The present invention provides a CPU water cooling head structure which can effectively reduce water resistance through improvement. The auxiliary structure 5 also includes a middle cover 51, a sealing ring groove 52, a water inlet convergence guide groove 53, a water inlet taper guide groove 54, a water outlet groove 55, a water outlet convergence guide groove 56 and a slot hole 57. A sealing ring groove 52 is provided on the inner side of the top of the middle cover 51. The upper and lower ends of the middle cover 51 are both provided with sealing ring grooves 52. However, the shapes of the sealing ring grooves 52 provided on the upper and lower ends are respectively the same as the first sealing ring 4 and the second sealing ring 7. A submerged water inlet convergence guide groove 53 and a water outlet convergence guide groove 56 are respectively provided on the front and rear ends of the inner side of the top of the middle cover 51. A water inlet taper guide groove 54 is provided at the interval between the middle sections of the water inlet convergence guide groove 53 and the water outlet convergence guide groove 56. Both the water inlet convergence guide groove 53 and the water outlet convergence guide groove 56 are submerged structures. After the filter plate 6 is installed on the top of the water inlet convergence guide groove 53, the plane height of the top of the filter plate 6 is less than the top of the middle cover 51. The water inlet conical guide grooves 54 are evenly spaced in the middle of the top inner side of the middle cover 51, and two adjacent water inlet conical guide grooves 54 are wide at the top and narrow at the bottom, and the left and right end surfaces of each water inlet conical guide groove 54 are slope structures. The water inlet conical guide groove 54 is triangular in shape as a whole, and a rectangular water outlet groove 55 is opened in the middle of the inner side of the water inlet conical guide groove 54, and the tail end of the water outlet groove 55 extends to the water outlet converging guide groove 56. A water outlet groove 55 is opened on the side, a slot hole 57 is opened on the top of the middle cover 51, and four slot holes 57 are opened at equal distances at the front and rear ends of the bottom of the middle cover 51, and the position of the slot hole 57 opened on the bottom of the middle cover 51 is aligned with the groove opened on the heat conducting plate 8, the inner side of the sealing ring groove 52 is movably engaged with the first sealing ring 4, and the second sealing ring 7 is movably engaged with the inner side of the bottom of the middle cover 51, and the upper and lower ends of the middle cover 51 are respectively connected to the upper cover 1 and the heat conducting plate 8. The setting of the water outlet groove 55 is conducive to better circulation of water.
[0023] The present invention provides a CPU water cooling head structure that effectively reduces water resistance through improvement, and its working principle is as follows;
[0024] First, when using the water cooling head, it is necessary to first embed the first sealing ring 4 and the second sealing ring 7 into the inner side of the sealing ring groove 52 opened at the top and bottom of the middle cover 51 respectively, and then buckle the filter 6 on the top surface of the water inlet converging guide groove 53 and the water inlet conical guide groove 54, and then place the upper cover 1 and the heat conducting plate 8 on the top and bottom of the middle cover 51 respectively, and then insert the external bolts into the slots 57 to connect and fix the upper cover 1 and the heat conducting plate 8 to the middle cover 51;
[0025] Second, when cooling is required, water will enter through the water inlet 2, and then the water will be filtered by the filter plate 6, and will flow along the slope of the water inlet tapered guide groove 54 to the microchannel heat conducting plate 9 for heat conduction, and a part of the water passing through the filter plate 6 will converge at the water inlet convergence guide groove 53, thereby achieving the effect of multi-channel heat dissipation, and making full use of the area where the microchannel heat conducting plate 9 is set, and the water flow that has completed heat conduction will flow out from the water outlet groove 55, and converge in the water outlet convergence guide groove 56, and finally the water will be discharged from the water outlet 3.
[0026] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0027] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0028] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0029] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0030] The above shows and describes the basic principle, main features and advantages of the present invention, and the standard parts used in the present invention can be purchased from the market, and special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part adopt the conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here.
[0031] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A CPU water cooling head structure for effectively reducing water resistance, comprising an upper cover (1), a water inlet (2), a water outlet (3), a first sealing ring (4), an auxiliary structure (5), a filter (6), a second sealing ring (7), a heat conducting plate (8) and a microchannel heat conducting plate (9), wherein the upper cover (1) is provided with a water inlet (2) and a water outlet (3) at the front and rear ends of the inner side thereof, respectively, the first sealing ring (4) is embedded in the top of the auxiliary structure (5) at the outer side, and the top of the auxiliary structure (5) is connected to the upper cover (1), the top of the auxiliary structure (5) is movably embedded with a filter (6), the bottom of the auxiliary structure (5) is embedded with a second sealing ring (7), the bottom of the auxiliary structure (5) is connected to the heat conducting plate (8), and a microchannel heat conducting plate (9) is provided at the middle of the top of the heat conducting plate (8); Features: The auxiliary structure (5) further comprises a middle cover (51), a sealing ring groove (52), a water inlet convergence guide groove (53), a water inlet taper guide groove (54), a water outlet groove (55), a water outlet convergence guide groove (56) and a slot hole (57), wherein a sealing ring groove (52) is provided on the inner side of the top of the middle cover (51), and submerged water inlet convergence guide groove (53) and water outlet convergence guide groove (56) are provided on the front and rear ends of the inner side of the top of the middle cover (51), and the water inlet convergence guide groove (53) and the water outlet convergence guide groove (56) are provided respectively, and the water inlet convergence guide groove (53) ) and the middle section of the water outlet converging guide groove (56) are provided with a water inlet taper guide groove (54), a water outlet groove (55) is provided inside the water inlet taper guide groove (54), a slot hole (57) is provided on the top of the middle cover (51), the inner side of the sealing ring groove (52) is movably engaged with the first sealing ring (4), the inner side of the bottom of the middle cover (51) is movably engaged with the second sealing ring (7), and the upper and lower ends of the middle cover (51) are respectively connected to the upper cover (1) and the heat conducting plate (8).
2. A CPU water cooling head structure for effectively reducing water resistance according to claim 1, characterized in that: The water inlet taper guide grooves (54) are evenly spaced and distributed in the middle of the top inner side of the middle cover (51), and two adjacent water inlet taper guide grooves (54) are of a structure that is wide at the top and narrow at the bottom, and the left and right end surfaces of each water inlet taper guide groove (54) are of a slope structure.
3. A CPU water cooling head structure for effectively reducing water resistance according to claim 1, characterized in that: The water inlet taper guide groove (54) is triangular in shape as a whole, a rectangular water outlet groove (55) is provided in the middle of the inner side of the water inlet taper guide groove (54), and the tail end of the water outlet groove (55) extends to the water outlet converging guide groove (56).
4. A CPU water cooling head structure for effectively reducing water resistance according to claim 1, characterized in that: The middle cover (51) is provided with sealing ring grooves (52) at both upper and lower ends, and the shapes of the sealing ring grooves (52) provided at the upper and lower ends are respectively the same as those of the first sealing ring (4) and the second sealing ring (7).
5. A CPU water cooling head structure for effectively reducing water resistance according to claim 1, characterized in that: The shape of the filter sheet (6) is movably fitted with the water inlet convergence guide groove (53) and the water inlet taper guide groove (54).
6. A CPU water cooling head structure for effectively reducing water resistance according to claim 1, characterized in that: Four slots (57) are equidistantly provided at the front and rear ends of the bottom of the middle cover (51), and the slots (57) provided at the bottom of the middle cover (51) are aligned with the slots provided on the heat conducting plate (8).
7. A CPU water cooling head structure for effectively reducing water resistance according to claim 1, characterized in that: The water inlet converging guide groove (53) and the water outlet converging guide groove (56) are both submerged structures, and after the filter plate (6) is installed at the top of the water inlet converging guide groove (53), the top plane height of the filter plate (6) is less than the top plane height of the middle cover (51).
Citation Information
Patent Citations
Novel CPU water cooling head
CN206757519U